Middle frame assembly, manufacturing method thereof and electronic device

Abstract

The present disclosure provides a middle frame assembly, an electronic device and a method for manufacturing a middle frame assembly. The middle frame assembly comprises a middle frame, a cover plate and a pump body, wherein the middle frame is an integrated structure comprising a middle plate portion and a frame portion, the frame portion at least partially surrounds the middle plate portion, and a channel is formed on one side surface of the middle plate portion; the cover plate is arranged opposite to the middle plate portion and is sealingly fixed, so that the channel of the middle plate portion and the part of the cover plate facing the channel together form a closed liquid flow channel, and a liquid working medium is sealingly arranged inside the liquid flow channel; and the pump body is installed in the liquid flow channel or connects two ends of the liquid flow channel, and is used for driving the liquid working medium to circulate in the liquid flow channel.

Description

Technical Field

[0001] This disclosure relates to, but is not limited to, the field of electronic devices, and particularly to a mid-frame assembly, a method for manufacturing the mid-frame assembly, and an electronic device. Background Technology

[0002] With the development of chip technology and the internet, electronic devices such as smartphones, tablets, and handheld game consoles have become indispensable products in people's work, study, and entertainment. For electronic devices, especially handheld mobile terminals, the desired features are thinness for easy carrying and holding, as well as good heat dissipation to address the increasing heat generated by the ever-improving performance of CPUs and batteries. Summary of the Invention

[0003] In view of this, the present disclosure provides a mid-frame assembly and a method of manufacturing the same, as well as an electronic device.

[0004] In a first aspect, embodiments of this disclosure provide a mid-frame assembly, the mid-frame assembly including a mid-frame, a cover plate, and a pump body, wherein the mid-frame is an integral structure including a mid-plate portion and a side-frame portion, the side-frame portion at least partially surrounds the mid-plate portion, and a channel is formed on one side surface of the mid-plate portion; the cover plate is disposed opposite to and sealed to the mid-plate portion, such that the channel of the mid-plate portion and the portion of the cover plate facing the channel together form a closed liquid flow channel, the liquid flow channel being sealed with a liquid working fluid; and the pump body is installed in the liquid flow channel or connects the two ends of the liquid flow channel for driving the liquid working fluid to circulate in the liquid flow channel.

[0005] In a second aspect, embodiments of this disclosure provide an electronic device comprising: a mid-frame assembly, a front panel, a heat-generating element, and a rear cover as described in the first aspect, wherein the mid-frame assembly is located between the front panel and the rear cover, and the front panel and the rear cover are respectively mounted on the front and rear sides of the mid-frame assembly; the heat-generating element is located between the front panel and the mid-frame assembly; a side surface of the cover plate of the mid-frame assembly away from the mid-frame portion is in thermal contact with the heat-generating element; and the frame portion of the mid-frame assembly is adapted to be held by a user of the electronic device.

[0006] Thirdly, embodiments of this disclosure provide a method for manufacturing a mid-frame assembly, the method comprising: providing a mid-frame, the mid-frame being an integral structure including a mid-plate portion and a side frame portion, the side frame portion at least partially surrounding the mid-plate portion; machining a channel on one side surface of the mid-plate portion; installing a pump body such that the pump body is located in the channel or connecting the two ends of the channel; injecting a liquid working fluid into the channel; and sealing a cover plate on the side surface of the mid-plate portion where the channel is machined, such that the channel of the mid-plate portion and the portion of the cover plate facing the channel together form a closed liquid flow channel, the liquid working fluid being sealed inside the liquid flow channel, and the pump body being capable of driving the liquid working fluid to circulate in the liquid flow channel.

[0007] According to the mid-frame assembly of this disclosure, the mid-plate portion and the frame portion are an integral structure, thus not compromising the structure of the mid-frame, resulting in high strength of the mid-frame and efficient heat transfer from the mid-plate portion to the frame portion. Furthermore, since a channel is formed on one side surface of the mid-plate portion, the channel and the portion of the cover plate facing the channel together form a closed liquid flow channel. A pump drives the liquid working fluid to circulate within the liquid flow channel, thereby reducing the thickness of the mid-frame assembly and ensuring rapid heat dissipation within the electronic device, thus improving heat dissipation efficiency. Attached Figure Description

[0008] Figure 1 This is a schematic front perspective view of a mid-frame assembly (with the cover plate hidden) according to an embodiment of the present disclosure;

[0009] Figure 2 This is a schematic front perspective view of the mid-frame assembly according to an embodiment of the present disclosure;

[0010] Figure 3 A rear perspective view showing the positional relationship between the mid-frame assembly (with the cover plate and mid-plate portions hidden) and the heat-generating element according to an embodiment of the present disclosure;

[0011] Figure 4 A schematic front perspective view of a mid-frame assembly (with cover plate hidden) according to another embodiment of the present disclosure;

[0012] Figure 5 For electronic devices according to embodiments of this disclosure, along Figure 4 The sectional view shown when the centerline AA is removed;

[0013] Figure 6 This is a flowchart of a method for manufacturing a mid-frame assembly according to an embodiment of the present disclosure.

[0014] List of reference numerals in the attached diagram:

[0015] 10-Mid-frame component 11-Mid-frame

[0016] 12-Middle plate section 13-Frame section

[0017] 14-Cover plate 15-Channel

[0018] 151-Heat dissipation tooth structure; 16-Liquid flow channel

[0019] 17-Adhesive layer 18-Pump body

[0020] 20-Front panel 21-Motherboard

[0021] 22-Battery 23-CPU

[0022] 30-back cover Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions of this disclosure, the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0024] The embodiments shown may be embodied in different forms, and this disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of this disclosure.

[0025] The accompanying drawings of the embodiments disclosed herein are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0026] This disclosure can be described with reference to plan views, cross-sectional views, and perspective views using the ideal schematic diagrams of this disclosure. Therefore, the example illustrations can be modified according to manufacturing techniques and / or tolerances.

[0027] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0028] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0029] Unless the context clearly indicates otherwise, the directional terms used in this disclosure, such as "front," "back," "up," "down," "left," "right," "top," and "bottom," generally indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this disclosure.

[0030] Unless the context clearly indicates otherwise, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.

[0031] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas of an element, but are not intended to be limiting.

[0032] In recent years, several solutions have been proposed to utilize the mid-frame of electronic devices for auxiliary heat dissipation. One approach involves using a vapor chamber (VC) for heat dissipation. This involves injecting a small amount of distilled water into a closed cavity or loop and creating a vacuum environment. The distilled water rapidly vaporizes at the heat source end to absorb a large amount of heat and liquefies at the heat dissipation end to release a large amount of heat, forming a highly thermally conductive component. This heat dissipation structure exhibits good thermal conductivity in the hollow area of ​​the plate, but poor conductivity at the edges, making it difficult for heat to transfer from the VC to the mid-frame. The VC also occupies space in the mid-frame, weakening its strength to some extent. Furthermore, the VC may fail under prolonged high-temperature conditions, posing a certain risk to the product. Another approach utilizes a combination of the mid-frame and a liquid cooling plate for heat dissipation. The liquid cooling plate and mid-frame are manufactured separately and then fixed together through injection molding, bonding, or other methods. This heat dissipation structure also significantly impacts the strength of the mid-frame, and heat transfer from the liquid cooling plate to the mid-frame remains difficult.

[0033] In view of this, firstly, this disclosure provides a mid-frame component. This mid-frame component can serve as a structural component for electronic devices such as mobile phones, tablets, laptops, and handheld game consoles. This embodiment uses a mobile phone mid-frame component as an example for description.

[0034] like Figure 1 , Figure 2As shown, the mid-frame assembly 10 provided in this embodiment includes a mid-frame 11, a cover plate 14, and a pump body 18. The mid-frame 11 is an integral structure including a mid-plate portion 12 and a side-edge portion 13; the cover plate 14 is disposed opposite to and sealed to the mid-plate portion 12. The side-edge portion 13 at least partially surrounds the mid-plate portion 12. For clarity, Figure 1 The cover plate 14 was removed. Figure 2 The middle cover plate 14 covers the upper part of the middle plate portion 12.

[0035] A channel 15 is formed on one side surface of the middle plate portion 12 (the surface facing the cover plate 14). Because the cover plate 14 is disposed opposite to and sealed to the middle plate portion 12, the channel 15 of the middle plate portion 12 and the portion of the cover plate 14 facing the channel 15 together form a closed liquid flow channel 16 (see...). Figure 5 The liquid flow channel 16 is sealed with a liquid working medium. The pump body 18 is installed in the liquid flow channel 16 to drive the liquid working medium to circulate in the liquid flow channel 16.

[0036] In the mid-frame assembly provided in this embodiment, the mid-plate portion and the frame portion are an integral structure, thus preserving the structure of the mid-frame and resulting in high strength. Heat can be efficiently transferred from the mid-plate portion to the frame portion. Furthermore, since a channel is formed on one side surface of the mid-plate portion, the channel and the portion of the cover plate facing the channel together form a closed liquid flow channel. A pump drives the liquid working fluid to circulate within the liquid flow channel, thereby reducing the thickness of the mid-frame assembly and ensuring rapid heat dissipation within the electronic device, thus improving heat dissipation efficiency.

[0037] In some embodiments, such as Figure 1 As shown, the pump body 18 is installed in the liquid flow channel 16 that forms a circuit. The pump body 18 can be various forms of liquid pumps such as micro electric pumps and piezoelectric ceramic pumps, and this disclosure does not impose any special limitations on it. In some embodiments, the pump body connects the two ends of the liquid flow channel, that is, the internal space of the pump body can constitute part of the liquid flow channel.

[0038] In some embodiments, the liquid working medium is water, such as distilled water. The liquid working medium may also be antifreeze or an organic liquid.

[0039] In some embodiments, the channel 15 has the following shape: Figure 1 The U-shape shown is shown. It should be noted that the channel 15 can also adopt other orientations and shapes, and the specific shape can be adjusted according to the location of the actual heat source (easily heated element) and heat dissipation requirements.

[0040] In some embodiments, such as Figure 1As shown, the bezel portion 13 completely surrounds the middle plate portion 12. It should be noted that, depending on the design requirements of the electronic device, the bezel portion 13 may also only partially surround the middle plate portion 12 (e.g., through a lower opening). In this case, the perimeter of the bezel portion 13 may be, for example, at least 70% of the perimeter of the middle plate portion 12.

[0041] In some embodiments, reference Figure 3 and Figure 5 The actual heat sources (easily heated components) include the CPU 23 and the battery 22. The surface of the cover plate 14 away from the middle plate portion 12 is used for thermal contact with the CPU 23 and the battery 22 (direct contact or contact through a thermally conductive interface material). Due to the large coverage area of ​​the cover plate 14, multiple heat sources can be cooled simultaneously, resulting in high heat dissipation efficiency. In some embodiments, the area of ​​the cover plate 14 is at least 60% of the area of ​​the middle plate portion 12.

[0042] In some embodiments, the middle frame 11 is made of aluminum, which allows for easy machining of the grooves 15 on the surface of the middle plate portion 12 of the middle frame 11 using machining methods such as CNC (Computer Numerical Control). Furthermore, aluminum has a thermal conductivity of approximately 150-200 W / mK, which is beneficial for heat transfer.

[0043] In some embodiments, the cover plate 14 is made of copper. Copper has a thermal conductivity of approximately 400 W / mk, which allows the cover plate 14 to effectively transfer heat from heat-generating components such as the CPU and battery to the liquid working fluid in the liquid channel 16. The cover plate 14 can be a flat material obtained by stamping, resulting in low manufacturing costs.

[0044] It should be noted that the middle frame 11 and the cover plate 14 may also be made of thermally conductive materials other than those mentioned above.

[0045] In some embodiments, at least the portion of the cover plate 14 facing the channel 15 is formed with a capillary structure. The capillary structure has many microchannels, which have a strong affinity for the liquid working fluid, increasing the heat exchange area between the liquid working fluid and the cover plate, thereby improving the heat exchange rate.

[0046] In some embodiments, capillary structures are formed only in the region of the cover plate 14 facing the channel 15, i.e., the capillary structures are formed as capillary intervals with the same shape as the channel 15, and are not formed in other regions of the cover plate.

[0047] In some embodiments, the capillary structure is fabricated by etching or sintering processes, which offers advantages such as low cost and high mass production capability. For example, when the cover plate 14 is made of copper, the capillary structure can be formed by sintering copper powder onto the area of ​​the cover plate 14 facing the channel 15.

[0048] In some embodiments, reference Figure 5 The middle plate portion 12 and the cover plate 14 are sealed and fixed together by an adhesive layer 17. The adhesive layer 17 is preferably double-sided adhesive, but it can also be a layer of other adhesives such as hot melt adhesive or pressure-sensitive adhesive.

[0049] In some embodiments, a rough surface structure is formed on the surfaces of the middle plate portion 12 and the cover plate 14, which are respectively sealed and fixed by the adhesive layer 17. This rough surface structure enhances the sealing effect and improves the leak-proof capability of the middle frame assembly. In some embodiments, this rough surface structure can be formed by laser engraving.

[0050] In some embodiments, only a portion of the opposing surfaces of the middle plate portion 12 and the cover plate 14 that are not used to form the liquid flow channel 16 are sealed and fixed by an adhesive layer 17, while the other portion of the opposing surfaces is filled with a thermally conductive interface material. In other words, on the opposing surfaces of the middle plate portion 12 and the cover plate 14, except for the area corresponding to the liquid flow channel 16 where no adhesive layer is applied, some portions of the remaining areas may also be without an adhesive layer, and instead be filled with a thermally conductive interface material (e.g., thermally conductive silicone). This can further increase the thermal conductivity between the middle frame and the cover plate, improving the overall heat dissipation effect. It should be noted that the area filled with the thermally conductive interface material needs to be surrounded by the area where the adhesive layer is applied to achieve a sealing effect and prevent leakage. In addition, a shallow groove (not shown) for receiving the thermally conductive interface material may be formed in the area of ​​the middle plate portion 12 corresponding to the area filled with the thermally conductive interface material.

[0051] In some embodiments, such as Figure 4 and Figure 5 As shown, a heat dissipation tooth structure 151, integral with the middle frame 11, is formed in the channel 15. For example... Figure 5 As shown, the heat dissipation tooth structure 151 may include multiple ribs forming a tooth-like structure protruding from the bottom surface of the channel 15. By providing a heat dissipation tooth structure in the channel, the contact area between the liquid working fluid and the middle frame can be effectively increased, accelerating the heat exchange rate; the heat dissipation tooth structure is integrally formed with the middle frame, which can reduce the thermal resistance between the heat dissipation tooth structure and the middle frame; in addition, when the channel is formed by CNC machining, the heat dissipation tooth structure can not only be easily machined, but also the amount of machining cutting can be reduced, effectively reducing the machining cost of the channel.

[0052] In some embodiments, the height of the heat dissipation fin structure 151 may be at least 30% of the depth of the channel 15. In some embodiments, the height of the heat dissipation fin structure 151 may be 30%-90% or 40%-70% of the depth of the channel 15.

[0053] In some embodiments, such as Figure 4 As shown, the length of the heat dissipation tooth structure 151 can be close to the length of the channel 15.

[0054] Secondly, embodiments of this disclosure provide an electronic device. For example... Figure 5 As shown, the electronic device includes a mid-frame assembly 10 according to a first aspect of this disclosure, and further includes: a front panel 20; a heat-generating element; and a rear cover 30. The mid-frame assembly 10 is located between the front panel 20 and the rear cover 30, and the front panel 20 and the rear cover 30 are respectively mounted on the front and rear sides of the mid-frame assembly 10. The heat-generating element is located between the front panel 20 and the mid-frame assembly 10. The heat-generating element includes, for example, a CPU 23 (see...). Figure 3 ) and / or battery 22. The side surface of the cover plate 14 of the middle frame assembly 10 away from the middle plate portion 12 ( Figure 5 The lower side of the middle frame assembly 10 is in thermal contact with the heat-generating element; and the frame portion 13 of the middle frame assembly 10 is suitable for being held by the user of the electronic device.

[0055] Electronic devices can be mobile phones, tablets, laptops, handheld game consoles, etc., especially handheld mobile terminals such as mobile phones. During the use of electronic devices, such as... Figure 5 As shown, the heat generated by heat-generating components such as the battery 22 and the CPU is first transferred to the cover plate 14 in the middle frame assembly 10, and then absorbed by the liquid working medium in the liquid flow channel 16 formed by the channel 15 of the cover plate 14 and the middle plate portion 12. The liquid working medium circulates in the liquid flow channel 16 under the drive of the pump body 18, and evenly transfers the heat to the middle plate portion 12, and then evenly transfers it to the frame portion 13 integrally formed with the middle plate portion 12.

[0056] In the electronic device provided according to this disclosure, the middle plate and the frame are an integral structure, thus not compromising the structure of the middle frame. The middle frame has high strength, which in turn leads to high overall strength of the electronic device, and heat can be smoothly transferred from the middle plate to the frame. Furthermore, since a channel is formed on one side surface of the middle plate, the channel and the portion of the cover plate facing the channel together form a closed liquid flow channel. The liquid working fluid is driven by a pump to circulate in the liquid flow channel, thus not only reducing the thickness of the electronic device but also ensuring rapid and uniform heat dissipation inside the electronic device, improving heat dissipation efficiency.

[0057] In some embodiments, the rear side of the middle plate portion 12 does not contact the rear cover 30, but is spaced apart from it to prevent excessive heat transfer to the rear cover 30. In other embodiments, if the rear cover 30 is allowed to participate in heat dissipation, the middle plate portion 12 may also contact or thermally contact the rear cover 30.

[0058] In some embodiments, the front panel 20 includes the screen of an electronic device.

[0059] In some embodiments, the electronic device further includes a temperature sensor and a pump controller. The temperature sensor is used to monitor the temperature of heat-generating components. The temperature sensor may include a thermistor. The pump controller is used to adjust the opening and closing of the pump 18 and / or its operating power based on the temperature detected by the temperature sensor.

[0060] During use, the temperature sensor can monitor the temperature of heat-generating components (CPU and / or battery) in real time. When the temperature exceeds a certain threshold, the pump body controller activates the pump body 18. The pump body controller can also adjust the operating power of the pump body 18 based on temperature changes.

[0061] In some embodiments, the electronic device is preset with a minimum pump operating power to meet the minimum heat dissipation requirements of the electronic device.

[0062] Thirdly, embodiments of this disclosure provide a method for manufacturing a mid-frame assembly. (See reference...) Figure 6 And refer to them together Figure 1 , Figure 2 , Figure 5 The method includes the following steps S10 to S50:

[0063] S10: Provide a middle frame 11, which is an integral structure including a middle plate portion 12 and a side frame portion 13, wherein the side frame portion 13 at least partially surrounds the middle plate portion 12;

[0064] S20: A groove 15 is machined on one side surface of the middle plate portion 12;

[0065] S30: Install the pump body 18 such that the pump body 18 is located in the channel 15 or the two ends of the channel 15 are connected.

[0066] S40: Inject liquid working fluid into channel 15;

[0067] S50: The cover plate 14 is sealed and fixed on the side surface of the middle plate portion 12 where the groove 15 is machined, so that the groove 15 of the middle plate portion 12 and the portion of the cover plate 14 facing the groove 15 together form a closed liquid flow channel 16, the liquid working medium is sealed inside the liquid flow channel 16, and the pump body 18 can drive the liquid working medium to circulate in the liquid flow channel 16.

[0068] In some embodiments, before sealing the cover plate 14 onto the side surface of the middle plate portion 12 with the machined groove 15 (step S50 above), the method further includes forming a capillary structure on the portion of the cover plate 14 facing the groove 15 by an etching or sintering process. For example, if the cover plate 14 is made of copper, the capillary structure can be formed by sintering copper powder onto the area of ​​the cover plate 14 facing the groove 15.

[0069] In some embodiments, in step S20 above, the channel 15 is manufactured by computer digital control CNC process.

[0070] In some embodiments, step S20 further includes: machining the heat dissipation tooth structure 151 in the channel 15 simultaneously with machining the channel 15 using a CNC process. This not only facilitates the machining of the heat dissipation tooth structure but also reduces the amount of machining cuts, effectively lowering the machining cost of the channel.

[0071] In some embodiments, in step S50 above, the cover plate 14 is sealed and fixed to the middle plate portion 12 by the adhesive layer 17. The adhesive layer 17 is preferably double-sided adhesive, but it can also be a layer of other adhesives such as hot melt adhesive or pressure-sensitive adhesive.

[0072] In some embodiments, before sealing the cover plate 14 onto the side surface of the middle plate portion 12 with the machined groove 15 (step S50 above), the method further includes forming a rough surface structure on the surfaces of the middle plate portion 12 and the cover plate 14 to be fixed by the adhesive layer 17 by laser engraving.

[0073] In some embodiments, before sealing the cover plate 14 onto the side surface of the middle plate portion 12 with the grooved channel 15 (step S50 above), the method further includes applying a thermally conductive interface material to a portion of the side surface of the middle plate portion 12 to be sealed with the cover plate 14 that is not used for processing the grooved channel 15 and for applying the adhesive layer 17.

[0074] It is understood that the method of manufacturing a mid-frame assembly described in the third aspect of this disclosure can manufacture a mid-frame assembly 10 according to the first aspect of this disclosure.

[0075] This disclosure has disclosed exemplary embodiments, and although specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A mid-frame assembly, comprising a mid-frame, a cover plate, and a pump body, wherein, The middle frame is an integral structure including a middle plate portion and a side frame portion. The side frame portion at least partially surrounds the middle plate portion, and a groove is formed on one side surface of the middle plate portion. The cover plate is disposed opposite to and sealed to the middle plate, thereby forming a closed liquid flow channel together with the portion of the cover plate facing the channel, and the liquid flow channel is sealed with a liquid working fluid; and The pump body is installed in the liquid flow channel or the two ends of the liquid flow channel are connected to drive the liquid working fluid to circulate in the liquid flow channel.

2. The mid-frame assembly according to claim 1, wherein, The portion of the cover plate facing the channel has a capillary structure.

3. The mid-frame assembly according to claim 1 or 2, wherein, A heat dissipation tooth structure integral with the middle frame is formed in the channel.

4. The mid-frame assembly according to claim 3, wherein, The height of the heat dissipation tooth structure is at least 30% of the depth of the channel.

5. The mid-frame assembly according to claim 1 or 2, wherein, The middle plate is sealed and fixed to the cover plate by an adhesive layer.

6. The mid-frame assembly according to claim 5, wherein, On the surfaces of the middle plate and the cover plate, which are respectively sealed and fixed by the double-sided adhesive, a rough surface structure is formed by laser engraving.

7. The mid-frame assembly according to claim 5, wherein, Only a portion of the opposing surfaces of the middle plate and the cover plate that are not used to form the liquid flow channel are sealed and fixed by the double-sided adhesive, and the other portion of the opposing surfaces is filled with a thermally conductive interface material.

8. The mid-frame assembly according to claim 1 or 2, wherein, The cover plate is made of copper or copper alloy, and the middle frame is made of aluminum.

9. An electronic device, comprising: Front panel; Components prone to overheating; The mid-frame assembly according to any one of claims 1 to 8; as well as Back cover, among which, The mid-frame assembly is located between the front panel and the rear cover, and the front panel and the rear cover are respectively mounted on the front and rear sides of the mid-frame assembly; The heat-generating element is located between the front panel and the middle frame assembly; The surface of the cover plate of the middle frame assembly, away from the middle plate, is in thermal contact with the heat-generating element; and The border portion of the mid-frame assembly is adapted to be held by the user of the electronic device.

10. A method for manufacturing a mid-frame component, comprising: A mid-frame is provided, the mid-frame being an integral structure comprising a mid-plate portion and a border portion, the border portion at least partially surrounding the mid-plate portion; A groove is machined on one side surface of the middle plate portion; Install the pump body such that the pump body is located in the channel or the two ends of the channel are connected; Liquid working fluid is injected into the channel; and The cover plate is sealed and fixed to the side surface of the middle plate portion where the channel is machined, such that the channel of the middle plate portion and the portion of the cover plate facing the channel together form a closed liquid flow channel, the liquid working fluid is sealed inside the liquid flow channel, and the pump body is able to drive the liquid working fluid to circulate in the liquid flow channel.

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