Liquid cooling system conductivity control method and apparatus

Abstract

The application provides a liquid cooling system conductivity control method and device. The liquid cooling system conductivity control method comprises the following steps: acquiring real-time liquid pressure at the outlet of a circulating pump and real-time liquid cooling conductivity of a liquid cooling loop; when the real-time liquid pressure is less than or equal to a pressure set value and the real-time liquid cooling conductivity is within a first preset range, adjusting the opening degree of an electric regulating valve according to the real-time liquid cooling conductivity to adjust the efficiency of a conductivity regulating loop in regulating the liquid cooling conductivity. The application can optimize water quality, reduce the frequency of coolant replacement, prolong the service life, reduce the risk of liquid cooling system pipeline corrosion, affect heat exchange efficiency and performance decline, and ensure the stability of the liquid cooling system. At the same time, the application can improve the abnormal phenomenon of server temperature rise and ensure the stable operation of the server. Moreover, the efficiency of the conductivity regulating loop in regulating the liquid cooling conductivity matches the real-time liquid cooling conductivity, so that the low-load operation of the liquid cooling system can be realized on the basis of ensuring the stability of the liquid cooling system.

Description

Technical Field

[0001] This invention relates to the field of temperature control technology, and in particular to a method and apparatus for controlling the conductivity of a liquid cooling system. Background Technology

[0002] Current data center servers widely utilize liquid-liquid heat exchange systems or hybrid air-liquid heat exchange systems for cooling. However, prolonged use of liquid-liquid heat exchange systems can lead to increased water conductivity, causing corrosion of system pipes and hindering heat exchange. In such cases, the liquid-liquid heat exchange system needs periodic shutdown for fluid replacement. Shutting down the liquid-liquid heat exchange system may cause a rapid and sudden increase in server chip temperature, affecting normal server operation and posing a risk of performance degradation. Summary of the Invention

[0003] The purpose of this invention is to provide a method and apparatus for controlling the conductivity of a liquid cooling system, which can solve the problem of increased conductivity of the cooling medium and help ensure the normal operation of the server.

[0004] To achieve this objective, the present invention adopts the following technical solution: A method for controlling the conductivity of a liquid cooling system is provided, applied to a liquid cooling system conductivity control device. The liquid cooling system conductivity control device includes a liquid cooling circuit and a conductivity regulating circuit. The liquid cooling circuit includes a circulating pump. One end of the conductivity regulating circuit is connected to the outlet of the circulating pump, and the other end of the conductivity regulating circuit is connected to the outlet of the liquid cooling circuit. The conductivity regulating circuit includes an electrically operated regulating valve. The liquid cooling system conductivity control method includes: Obtain the real-time hydraulic pressure at the outlet of the circulating pump and the real-time liquid cooling conductivity of the liquid cooling circuit; When the real-time hydraulic pressure is less than or equal to the pressure set value, and the real-time liquid cooling conductivity is within a first preset range, the opening of the electric regulating valve is adjusted according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulating circuit in regulating the liquid cooling conductivity.

[0005] Optionally, the conductivity control method for the liquid cooling system also includes: When the real-time hydraulic pressure is greater than the pressure set value but less than or equal to the pressure upper limit value, the opening of the electric regulating valve is adjusted according to the real-time hydraulic pressure to adjust the efficiency of the conductivity regulating circuit in regulating the liquid cooling conductivity.

[0006] Optionally, when the real-time hydraulic pressure is less than or equal to the pressure setpoint, and the real-time liquid cooling conductivity is within a first preset range, adjusting the opening of the electric regulating valve according to the real-time liquid cooling conductivity includes: The first conductivity is determined based on the difference between the real-time liquid cooling conductivity and the minimum value within the first preset range; The first difference is determined based on the difference between the maximum and minimum values ​​within the first preset range; The opening degree of the electric regulating valve is adjusted according to the ratio of the first conductivity to the first difference.

[0007] Optionally, when the real-time hydraulic pressure is greater than the pressure setpoint and less than or equal to the pressure upper limit, adjusting the opening of the electric regulating valve according to the real-time hydraulic pressure includes: The first pressure value is determined based on the difference between the real-time hydraulic pressure and the pressure setpoint. The second difference is determined based on the difference between the pressure setpoint and the pressure upper limit. The opening degree of the electric regulating valve is adjusted according to the ratio of the first pressure value to the second difference.

[0008] Optionally, the conductivity control method for the liquid cooling system further includes: When the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is less than the minimum value within the first preset range, the electric regulating valve is controlled to be fully closed. When the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is greater than the maximum value within the first preset range, the electric regulating valve is controlled to be fully open. When the real-time hydraulic pressure is greater than the upper pressure limit, the electric regulating valve is controlled to be fully opened.

[0009] Optionally, the liquid cooling circuit further includes a first pressure sensor and a conductivity sensor; the first pressure sensor is connected to the outlet of the circulating pump, and the conductivity sensor is connected between the inlet of the circulating pump and the inlet of the liquid cooling circuit; the liquid cooling system conductivity control method further includes: The real-time hydraulic pressure at the outlet of the circulating pump is obtained through the first pressure sensor, and the real-time liquid cooling conductivity of the liquid cooling circuit is obtained through the conductivity sensor.

[0010] Optionally, the conductivity adjustment circuit further includes a deionization tank, a first valve, and a second valve. One end of the electrically controlled regulating valve is connected to the outlet of the circulating pump, and the other end of the electrically controlled regulating valve is connected to the inlet of the deionization tank through the first valve. The second valve is connected between the outlet of the deionization tank and the outlet of the liquid cooling circuit. The conductivity control method of the liquid cooling system further includes: In the event of a malfunction in the deionizer, the first valve and the second valve are closed.

[0011] A conductivity control device for a liquid cooling system is provided, comprising: a liquid cooling circuit and a conductivity regulating circuit, wherein the liquid cooling circuit includes a circulating pump, one end of the conductivity regulating circuit is connected to the outlet of the circulating pump, and the other end of the conductivity regulating circuit is connected to the outlet of the liquid cooling circuit; The conductivity adjustment circuit includes an electrically operated regulating valve; The liquid cooling system conductivity control device further includes a controller connected to the electric regulating valve. The controller is used to acquire the real-time hydraulic pressure at the outlet of the circulating pump and the real-time liquid cooling conductivity of the liquid cooling circuit. When the real-time hydraulic pressure is less than or equal to the pressure set value and the real-time liquid cooling conductivity is within a first preset range, the controller adjusts the opening of the electric regulating valve according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulation circuit in regulating the liquid cooling conductivity.

[0012] Optionally, the electric regulating valve includes an actuator and a regulating valve. The actuator is connected to the controller. One end of the regulating valve is connected to the outlet of the circulating pump, and the other end of the regulating valve is connected to the outlet of the liquid cooling circuit. The controller is used to control the actuator to adjust the opening degree of the regulating valve.

[0013] Optionally, the conductivity adjustment circuit further includes a deionization tank, a first valve, and a second valve. One end of the electric regulating valve is connected to the outlet of the circulating pump, and the other end of the electric regulating valve is connected to the inlet of the deionization tank through the first valve. The second valve is connected between the outlet of the deionization tank and the outlet of the liquid cooling circuit. The controller is connected to the first valve and the second valve respectively, and the controller is also used to control the first valve and the second valve to close when the deionization tank fails.

[0014] The beneficial effects of this invention are: The technical solution of this invention optimizes water quality, reduces the frequency of coolant replacement, extends its service life, and lowers the risk of corrosion in the liquid cooling system's pipes, thus ensuring the stability of the liquid cooling system. This is achieved by adjusting the opening of an electric regulating valve based on the real-time liquid cooling conductivity when the real-time hydraulic pressure is less than or equal to the pressure setpoint and the real-time liquid cooling conductivity is within a first preset range. Simultaneously, it improves phenomena such as abnormal server temperature rise, ensuring stable server operation. Furthermore, the efficiency of the conductivity adjustment loop in regulating the liquid cooling conductivity is matched with the real-time liquid cooling conductivity, enabling low-load operation of the liquid cooling system while maintaining its stability. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a liquid cooling system conductivity control device provided in an embodiment of the present invention; Figure 2 A schematic flowchart of a liquid cooling system conductivity control method provided in an embodiment of the present invention; Figure 3 This is a flowchart illustrating another method for controlling the conductivity of a liquid cooling system provided in an embodiment of the present invention.

[0016] In the picture: 1. Secondary side return port; 2. Secondary side return pressure sensor; 3. Secondary side return temperature sensor; 4. Conductivity sensor; 5. Secondary side regulating valve; 6. Secondary side drain valve; 7. Expansion tank; 8. Circulation pump; 9. Backup pump; 10. Circulation pump check valve; 11. Backup pump check valve; 12. Safety relief valve; 13. First pressure sensor; 14. Plate heat exchanger; 15. Secondary side manual vent valve; 16. Secondary side pre-filter pressure sensor; 17. Secondary side filter; 18. Secondary side supply temperature sensor; 9. Secondary side liquid supply pressure sensor; 20. Secondary side liquid supply port; 21. Primary side drain valve; 22. Primary side liquid supply pressure sensor; 23. Primary side liquid supply temperature sensor; 24. Primary side liquid supply port; 25. Primary side return port; 26. Primary side return temperature sensor; 27. Primary side return pressure sensor; 28. Primary side regulating valve; 29. ​​Primary side manual vent valve; 30. Electric regulating valve; 31. First valve; 32. Deionizer; 33. Second valve; 34. First check valve; 110. Conductivity regulation circuit. Detailed Implementation

[0017] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown in the accompanying drawings, not all of them.

[0018] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0019] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0020] Current data center servers widely utilize liquid-liquid heat exchange systems or hybrid air-liquid heat exchange systems for cooling. However, prolonged use of liquid-liquid heat exchange systems can lead to increased conductivity of the water, causing corrosion of the system pipes and affecting heat exchange. In such cases, the liquid-liquid heat exchange system needs to be shut down periodically for replacement of the working fluid. Shutting down the liquid-liquid heat exchange system may cause a rapid and sudden increase in the temperature of server chips, affecting normal server operation and posing a risk of server performance degradation.

[0021] Therefore, this embodiment provides a liquid cooling system conductivity control method to solve the above-mentioned problems. This liquid cooling system can solve the problem of increased conductivity of the cooling medium and helps to ensure normal server operation. This liquid cooling system conductivity control method is executed by a liquid cooling system conductivity control device. Figure 1 This is a schematic diagram of a liquid cooling system conductivity control device provided in an embodiment of the present invention. Figure 1As shown, the conductivity control device of the liquid cooling system includes a liquid cooling circuit and a conductivity regulating circuit 110. The liquid cooling circuit includes a circulating pump 8. One end of the conductivity regulating circuit 110 is connected to the outlet of the circulating pump 8, and the other end of the conductivity regulating circuit 110 is connected to the outlet 20 of the liquid cooling circuit. The liquid cooling circuit has a primary side circuit and a secondary side circuit. The primary side circuit provides a coolant at a lower temperature. For example, the primary side supply port 24 and the primary side return port 25 of the primary side circuit are connected to heat dissipation equipment such as a dry cooler or a cooling tower to transfer the coolant at a lower temperature to a plate heat exchanger 14. In the plate heat exchanger 14, the coolant exchanges heat with the coolant circulating from the secondary side circuit to the plate heat exchanger 14 to reduce the temperature of the coolant in the secondary side circuit. The secondary side circuit has a secondary side return port 1 and a secondary side supply port 20. The secondary side return port 1 serves as the inlet of the liquid cooling circuit, and the secondary side supply port 20 serves as the outlet of the liquid cooling circuit, forming a cooling circuit with the server's cold plate through a pipe. The primary and secondary coolant circuits exchange heat via a plate heat exchanger 14. A circulating pump 8 is installed on the secondary coolant circuit. Driven by the circulating pump 8, the coolant circulates in the secondary coolant circuit of the liquid cooling system, absorbing heat from the server chips. The coolant in the secondary coolant circuit exchanges heat with the coolant in the primary coolant circuit within the plate heat exchanger 14, thereby achieving heat dissipation for the server chips. Figure 2 This is a flowchart illustrating a method for controlling the conductivity of a liquid cooling system according to an embodiment of the present invention. Figure 2 As shown, the conductivity control method of this liquid cooling system includes: S110: Obtain the real-time hydraulic and liquid-cooling conductivity of the circulating pump outlet.

[0022] Specifically, such as Figure 1 As shown, the real-time hydraulic pressure at the outlet of circulating pump 8 is the pump post-pressure in the liquid cooling circuit. The real-time liquid cooling conductivity of the liquid cooling circuit is the real-time conductivity of the coolant during the operation of the liquid cooling system. In some embodiments, the real-time hydraulic pressure at the outlet of circulating pump 8 can be obtained by a pressure sensor at the outlet of circulating pump 8. The real-time liquid cooling conductivity of the liquid cooling circuit can be obtained by a conductivity sensor at any location on the secondary side circuit of the liquid cooling circuit.

[0023] S120. When the real-time hydraulic pressure is less than or equal to the pressure set value and the real-time liquid cooling conductivity is within the first preset range, the opening of the electric regulating valve is adjusted according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulating circuit in regulating the liquid cooling conductivity.

[0024] Specifically, such as Figure 1As shown, an electrically operated regulating valve 30 is installed on the conductivity regulating circuit 110 to regulate the flow rate of coolant diverted from the liquid cooling circuit to the conductivity regulating circuit 110. The conductivity regulating circuit 110 also has a coolant conductivity regulating function. When the coolant flow rate to the conductivity regulating circuit 110 is relatively large, the circuit can regulate the conductivity of a larger volume of coolant. When the coolant flow rate to the conductivity regulating circuit 110 is relatively small, the circuit can regulate the conductivity of a smaller volume of coolant. After the coolant output from the conductivity regulating circuit 110 flows into the liquid cooling circuit, the conductivity of the coolant in the liquid cooling circuit can be adjusted, and the regulation efficiency of the coolant conductivity in the liquid cooling circuit can be adjusted according to the opening degree of the electrically operated regulating valve 30.

[0025] The pressure setpoint is the threshold value at which the electric regulating valve 30 opens based on the real-time hydraulic pressure. When the real-time hydraulic pressure is greater than the pressure setpoint, the electric regulating valve 30 needs to open to allow the liquid cooling circuit to bypass and release pressure through the conductivity adjustment circuit. The pressure setpoint can be set according to the pressure-bearing capacity of the liquid cooling circuit. When the real-time hydraulic pressure of the liquid cooling circuit is less than or equal to the pressure setpoint, the pressure after the pump in the liquid cooling circuit is relatively low, and bypass pressure release is not required; the opening degree of the electric regulating valve 30 is not affected by the real-time hydraulic pressure. The first preset range can be set according to the degree to which the coolant in the liquid cooling circuit affects the pipeline. When the real-time liquid cooling conductivity is within the first preset range, the corrosion degree of the coolant on the pipeline is relatively high. At this time, it is necessary to adjust the opening degree of the electric regulating valve 30 according to the real-time liquid cooling conductivity to allow the coolant in the liquid cooling circuit to bypass into the conductivity adjustment circuit 110. The conductivity adjustment circuit 110 can reduce the conductivity of the coolant. When the conductivity of the coolant decreases, the coolant flowing into the liquid cooling circuit via the conductivity adjustment circuit 110 further reduces the conductivity of the coolant within the liquid cooling circuit. This optimizes water quality, achieves a controllable reduction in liquid cooling conductivity, decreases the frequency of coolant replacement, extends its service life, reduces the risk of corrosion in the liquid cooling system pipes, and minimizes the impact on heat exchange efficiency and performance degradation, thus ensuring the stability of the liquid cooling system. It also improves phenomena such as abnormal server temperature rise, ensuring stable server operation. Furthermore, the real-time liquid cooling conductivity is positively correlated with the opening degree of the electric regulating valve 30; that is, the higher the real-time liquid cooling conductivity, the larger the opening degree of the electric regulating valve 30. The more coolant bypassed by the conductivity adjustment circuit 110, the more coolant conductivity it can reduce. When more coolant from the conductivity adjustment circuit 110 flows into the liquid cooling circuit, the liquid cooling conductivity can be adjusted more quickly, improving the adjustment efficiency. At this time, the efficiency of the conductivity adjustment circuit 110 in adjusting the liquid cooling conductivity is matched with the real-time liquid cooling conductivity, which can achieve low-load operation of the liquid cooling system while ensuring the stability of the liquid cooling system.

[0026] The technical solution of this embodiment optimizes water quality by adjusting the opening of an electric regulating valve to reduce the conductivity of the coolant in real time when the real-time hydraulic pressure is less than or equal to the pressure setpoint and the real-time liquid cooling conductivity is within a first preset range. This reduces the frequency of coolant replacement, extends its service life, and lowers the risk of corrosion in the liquid cooling system pipes, affecting heat exchange efficiency and performance degradation, thus ensuring the stability of the liquid cooling system. It also improves phenomena such as abnormal server temperature rise, ensuring stable server operation. Furthermore, the efficiency of the conductivity adjustment loop in regulating the liquid cooling conductivity matches the real-time liquid cooling conductivity, enabling low-load operation of the liquid cooling system while ensuring its stability.

[0027] In some embodiments, when the real-time hydraulic pressure is less than or equal to the pressure setpoint and the real-time liquid-cooled conductivity is within a first preset range, adjusting the opening of the electric regulating valve according to the real-time liquid-cooled conductivity includes: The first conductivity is determined based on the difference between the real-time liquid-cooled conductivity and the minimum value within a first preset range.

[0028] Specifically, the minimum value within the first preset range is the threshold value at which the electric regulating valve 30 opens based on the coolant's conductivity. The difference between the real-time liquid cooling conductivity and the minimum value within the first preset range can characterize the degree to which the current coolant quality needs optimization. The first conductivity can be the difference between the real-time liquid cooling conductivity and the minimum value within the first preset range. For example, when the first preset range is 2000 μS / s to 3000 μS, and the real-time liquid cooling conductivity is 2500 μS / s, the first conductivity is 2500 μS / s - 2000 μS / s = 500 μS / s.

[0029] The first difference is determined based on the difference between the maximum and minimum values ​​within the first preset range.

[0030] Specifically, the maximum value within the first preset range is the threshold value at which the electric regulating valve 30 is fully open based on the coolant conductivity. The first difference can be the difference between the maximum and minimum values ​​within the first preset range. In this case, the first difference can characterize the adjustment range of the liquid cooling conductivity corresponding to different opening degrees of the electric regulating valve 30. For example, when the first preset range is 2000µs / s to 3000µs / s, the first difference can be 3000µs / s - 2000µs / s = 1000µs / s.

[0031] The opening degree of the electric regulating valve is adjusted according to the ratio of the first conductivity to the first difference.

[0032] Specifically, after determining the first conductivity and the first difference, the opening of the electric regulating valve 30 can be adjusted according to the ratio of the first conductivity to the first difference. Within the adjustment range of the liquid cooling conductivity, the opening of the electric regulating valve 30 is matched with the real-time liquid cooling conductivity, enabling low-load operation of the liquid cooling system while ensuring its stability. The opening of the electric regulating valve can be characterized by the ratio of its current opening to its full opening. For example, an opening of 50% can represent the valve being half-open. When linearly adjusting the opening of the electric regulating valve 30 according to the real-time liquid cooling conductivity, the ratio of the first conductivity to the first difference can be equal to the opening of the electric regulating valve 30. For example, when the first conductivity is 2500us / s-2000us / s=500us / s and the first difference is 3000us / s-2000us / s=1000us / s, the opening degree of the electric regulating valve 30 is 500us / s÷1000us / s×100%=50%.

[0033] Figure 3 This is a schematic flowchart illustrating another method for controlling the conductivity of a liquid cooling system provided in an embodiment of the present invention. Figure 3 As shown, the conductivity control method of this liquid cooling system includes: S210: Obtain the real-time hydraulic and liquid-cooling conductivity of the circulating pump outlet and the liquid-cooling circuit.

[0034] S220. When the real-time hydraulic pressure is less than or equal to the pressure set value and the real-time liquid cooling conductivity is within the first preset range, the opening of the electric regulating valve is adjusted according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulating circuit in regulating the liquid cooling conductivity.

[0035] S230. When the real-time hydraulic pressure is greater than the pressure set value but less than or equal to the pressure upper limit value, adjust the opening of the electric regulating valve according to the real-time hydraulic pressure to adjust the efficiency of the liquid cooling conductivity adjustment circuit.

[0036] Specifically, the upper pressure limit is the threshold value at which the electric regulating valve 30 is fully open based on the real-time hydraulic pressure. When the real-time hydraulic pressure exceeds the upper pressure limit, the electric regulating valve 30 needs to be fully open to allow the liquid cooling circuit to bypass and release pressure through the conductivity adjustment circuit 110. In the hydraulic circuit, the priority of adjusting the opening of the electric regulating valve 30 to bypass and release pressure through the conductivity adjustment circuit 110 when the pressure exceeds the pressure set value is greater than the priority of adjusting the opening of the electric regulating valve 30 to adjust the liquid cooling conductivity through the conductivity adjustment circuit 110 when the real-time liquid cooling conductivity exceeds the minimum value of the first preset range. In other words, when the real-time hydraulic pressure exceeds the pressure set value, if the real-time liquid cooling conductivity exceeds the minimum value of the first preset range, the opening of the electric regulating valve 30 is also adjusted according to the real-time hydraulic pressure to ensure that the pump post-pump pressure of the liquid cooling circuit is less than or equal to the pressure set value, thereby improving the operational stability of the liquid cooling circuit. When the real-time hydraulic pressure exceeds the set pressure value, the opening of the electric valve 30 can be directly adjusted based on the real-time hydraulic pressure to regulate the pressure relief level of the bypass venting in the conductivity regulation circuit 110. This effectively reduces the post-pump pressure in the liquid cooling circuit, improving its operational stability. Simultaneously, water quality optimization can be achieved through the conductivity regulation circuit 110, reducing the risk of corrosion in the liquid cooling system pipes, which could affect heat exchange efficiency and performance degradation, further enhancing the stability of the liquid cooling system. This also mitigates abnormal server temperature rises, ensuring stable server operation. Furthermore, the real-time hydraulic pressure is positively correlated with the opening of the electric regulating valve 30; the higher the real-time hydraulic pressure, the larger the opening of the electric regulating valve 30. This results in a higher bypass venting pressure value in the conductivity regulation circuit 110, further improving the post-pump pressure stability of the liquid cooling circuit and enhancing its overall operational stability.

[0037] In some embodiments, when the real-time hydraulic pressure is greater than the pressure setpoint and less than or equal to the pressure upper limit, adjusting the opening of the electric regulating valve according to the real-time hydraulic pressure includes: The first pressure value is determined based on the difference between the real-time hydraulic pressure and the pressure setpoint.

[0038] Specifically, the first pressure value characterizes the degree to which the pump pressure in the liquid cooling circuit needs to be relieved. The first pressure value equals the real-time hydraulic pressure minus the pressure setpoint. For example, the pressure setpoint can be 3 bar, and the real-time hydraulic pressure can be 3.5 bar. The first pressure value is 3.5 bar - 3 bar = 0.5 bar.

[0039] The second difference is determined based on the difference between the pressure setpoint and the pressure upper limit.

[0040] Specifically, the pressure setpoint and pressure upper limit define the hydraulic adjustment range corresponding to different opening degrees of the electric regulating valve 30. The second difference can be the difference between the pressure upper limit and the pressure setpoint. For example, the pressure setpoint can be 3 bar, the pressure upper limit can be 4 bar, and the second difference is 4 bar - 3 bar = 1 bar.

[0041] The opening degree of the electric regulating valve is adjusted according to the ratio of the first pressure value to the second difference.

[0042] Specifically, after determining the first pressure value and the second difference, the opening of the electric regulating valve 30 can be adjusted according to the ratio of the first pressure value and the second difference. Within the hydraulic adjustment range, the opening of the electric regulating valve 30 is matched with the real-time hydraulic pressure, which can ensure the stability of the post-pump pressure in the liquid cooling circuit, thereby improving the operational stability of the liquid cooling system. The ratio of the first pressure value and the second difference can be equal to the opening of the electric regulating valve 30. For example, when the first pressure value is 3.5 bar - 3 bar = 0.5 bar and the second difference is 4 bar - 3 bar = 1 bar, the opening of the electric regulating valve 30 can be 0.5 bar ÷ 1 bar × 100% = 50%.

[0043] In some embodiments, the liquid cooling system conductivity control method further includes: When the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is less than the minimum value within the first preset range, the electric regulating valve is fully closed.

[0044] Specifically, when the real-time hydraulic pressure is lower than the pressure set value, the pump post-pressure in the liquid cooling circuit does not need to be bypassed for pressure relief. Simultaneously, when the real-time liquid cooling conductivity is lower than the minimum value within the first preset range, the real-time liquid cooling conductivity is relatively low, and there is no need for the conductivity adjustment circuit 110 to adjust the liquid cooling conductivity. At this time, the electric regulating valve 30 can be fully closed based on the real-time hydraulic pressure and the real-time liquid cooling conductivity.

[0045] When the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is greater than the maximum value within the first preset range, the electric regulating valve is fully opened.

[0046] Specifically, when the real-time hydraulic pressure is lower than the pressure setpoint, the pressure after the pump in the liquid cooling circuit is relatively low, eliminating the need for bypass pressure relief. The opening of the electric regulating valve 30 is unaffected by the real-time hydraulic pressure; simultaneously, when the real-time liquid cooling conductivity exceeds the maximum value within the first preset range, the opening of the electric regulating valve 30 is adjusted according to the real-time liquid cooling conductivity. Since the real-time liquid cooling conductivity exceeds the maximum value within the first preset range, the electric regulating valve 30 is fully open based on the real-time liquid cooling conductivity, adjusting the liquid cooling conductivity with maximum efficiency. This allows the liquid cooling conductivity to drop to the first preset range as quickly as possible, optimizing water quality more rapidly and reducing the risk of corrosion in the liquid cooling system pipes, which could affect heat exchange efficiency and performance degradation, thus ensuring the stability of the liquid cooling system. It also improves phenomena such as abnormal server temperature rise, ensuring stable server operation.

[0047] When the real-time hydraulic pressure exceeds the upper pressure limit, the electric regulating valve is fully opened.

[0048] Specifically, adjusting the opening of the electric regulating valve 30 based on real-time hydraulic pressure has a higher priority than adjusting it based on the liquid cooling conductivity. When the real-time hydraulic pressure exceeds the upper pressure limit, the electric regulating valve 30 is fully opened according to the real-time hydraulic pressure. This allows for the fastest possible pressure relief rate to regulate the post-pump pressure of the liquid cooling circuit, ensuring that the post-pump pressure drops below the set pressure value as quickly as possible. This approach helps maintain the stability of the post-pump pressure in the liquid cooling circuit more efficiently and improves the operational stability of the liquid cooling circuit.

[0049] In some embodiments, continue to refer to Figure 1 The liquid cooling circuit also includes a first pressure sensor 13 and a conductivity sensor 4; the first pressure sensor 13 is connected to the outlet of the circulating pump 8, and the conductivity sensor 4 is connected between the inlet of the circulating pump 8 and the inlet 1 of the liquid cooling circuit; the conductivity control method of the liquid cooling system also includes: The real-time hydraulic pressure at the outlet of the circulating pump is obtained through the first pressure sensor, and the real-time liquid cooling conductivity of the liquid cooling circuit is obtained through the conductivity sensor.

[0050] Specifically, the first pressure sensor 13 is located at the outlet of the circulating pump 8, away from the connection between the conductivity adjustment circuit 110 and the outlet of the circulating pump 8. This ensures that the real-time hydraulic pressure detected by the first pressure sensor 13 is the pressure after the conductivity adjustment circuit 110 has been bypassed and depressurized, improving the accuracy of the pump-after-pressure detection in the liquid cooling circuit. This improves the operational stability of the liquid cooling circuit when adjusting the opening of the electric regulating valve 30 based on the real-time hydraulic pressure. The conductivity sensor 4 is connected between the inlet of the circulating pump 8 and the inlet 1 of the liquid cooling circuit, allowing direct detection of the liquid cooling conductivity of the coolant after it flows out from the server's cold plate, thus improving the accuracy of the liquid cooling conductivity detection.

[0051] Continue to refer to Figure 1The conductivity regulating circuit 110 also includes a deionizer 32, a first valve 31, and a second valve 33. One end of the electric regulating valve 30 is connected to the outlet of the circulating pump 8, and the other end of the electric regulating valve 30 is connected to the inlet of the deionizer 32 through the first valve 31. The second valve 33 is connected between the outlet of the deionizer 32 and the outlet 20 of the liquid cooling circuit. The conductivity control method of the liquid cooling system also includes: In the event of a deionizer malfunction, control valves one and two to close.

[0052] Specifically, the electric regulating valve 30 controls the flow rate of the bypass coolant in the conductivity regulation circuit 110. The deionizer 32 is connected to the conductivity regulation circuit 110. When coolant bypasses to the deionizer 32, the deionizer 32 treats the coolant to reduce its conductivity. The coolant then flows into the liquid cooling circuit, achieving liquid cooling conductivity regulation. The first valve 31 can be a front ball valve of the deionizer 32, and the second valve 33 can be a rear ball valve of the deionizer 32. In case of a malfunction in the deionizer 32, the first valve 31 and the second valve 33 can be closed to isolate the coolant from the deionizer 32 for maintenance, preventing disruption to the normal operation of the liquid cooling system.

[0053] This invention also provides a conductivity control device for a liquid cooling system. (See reference...) Figure 1 The liquid cooling system conductivity control device includes a liquid cooling circuit and a conductivity regulating circuit 110. The liquid cooling circuit includes a circulating pump 8. One end of the conductivity regulating circuit 110 is connected to the outlet of the circulating pump 8, and the other end of the conductivity regulating circuit 110 is connected to the outlet 20 of the liquid cooling circuit. The liquid cooling circuit has a primary side circuit and a secondary side circuit. The primary side circuit provides a coolant at a lower temperature. For example, the primary side supply port 24 and the primary side return port 25 of the primary side circuit are connected to heat dissipation equipment such as a dry cooler or a cooling tower to transfer the coolant at a lower temperature to a plate heat exchanger 14. In the plate heat exchanger 14, the coolant exchanges heat with the coolant circulating from the secondary side circuit to the plate heat exchanger 14 to reduce the temperature of the coolant in the secondary side circuit. The secondary side circuit has a secondary side return port 1 and a secondary side supply port 20. The secondary side return port 1 serves as the inlet of the liquid cooling circuit, and the secondary side supply port 20 serves as the outlet of the liquid cooling circuit, forming a cooling circuit with the server's cold plate through pipes. The primary and secondary coolant circuits exchange heat via a plate heat exchanger 14. A circulating pump 8 is installed on the secondary coolant circuit. Driven by the circulating pump 8, the coolant circulates in the secondary coolant circuit of the liquid cooling system, absorbing heat from the server chips. The coolant in the secondary coolant circuit exchanges heat with the coolant in the primary coolant circuit within the plate heat exchanger 14, thereby achieving heat dissipation for the server chips.

[0054] The conductivity adjustment circuit 110 includes an electrically operated regulating valve 30 for regulating the flow rate of coolant diverted from the liquid cooling circuit to the conductivity adjustment circuit 110. The conductivity adjustment circuit 110 also has a coolant conductivity regulation function. When the coolant flow rate to the conductivity adjustment circuit 110 is relatively large, the circuit can regulate the conductivity of a larger volume of coolant. When the coolant flow rate to the conductivity adjustment circuit 110 is relatively small, the circuit can regulate the conductivity of a smaller volume of coolant. After the coolant output from the conductivity adjustment circuit 110 flows into the liquid cooling circuit, the conductivity of the coolant in the liquid cooling circuit can be adjusted, and the regulation efficiency of the coolant conductivity in the liquid cooling circuit can be adjusted according to the opening degree of the electrically operated regulating valve 30. The liquid cooling system conductivity control device also includes a controller (…). Figure 1 (Not shown in the image) The controller is connected to the electric regulating valve 30. The controller is used to obtain the real-time hydraulic pressure at the outlet of the circulating pump and the real-time liquid cooling conductivity of the liquid cooling circuit. When the real-time hydraulic pressure is less than or equal to the pressure set value and the real-time liquid cooling conductivity is within the first preset range, the controller adjusts the opening of the electric regulating valve 30 according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulating circuit 110 in regulating the liquid cooling conductivity.

[0055] Specifically, the real-time hydraulic pressure at the outlet of circulating pump 8 can be obtained by a pressure sensor at the outlet of circulating pump 8. The real-time liquid cooling conductivity of the liquid cooling circuit can be obtained by a conductivity sensor at any location on the secondary side of the liquid cooling circuit. The pressure sensor and conductivity sensor are connected to the controller, transmitting the obtained real-time hydraulic pressure and real-time liquid cooling conductivity to the controller. When the real-time hydraulic pressure is greater than the pressure setpoint, the controller can control the electric regulating valve 30 to open according to the real-time hydraulic pressure, allowing the liquid cooling circuit to bypass and release pressure through the conductivity regulating circuit. When the real-time hydraulic pressure is less than or equal to the pressure setpoint, and the real-time liquid cooling conductivity is within a first preset range, the controller can adjust the opening of the electric regulating valve 30 according to the real-time liquid cooling conductivity, allowing the coolant in the liquid cooling circuit to bypass into the conductivity regulating circuit 110, which can reduce the conductivity of the coolant. When the conductivity of the coolant decreases, the coolant flowing into the liquid cooling circuit via the conductivity adjustment circuit 110 further reduces the conductivity of the coolant within the liquid cooling circuit. This optimizes water quality, achieves a controllable reduction in liquid cooling conductivity, decreases the frequency of coolant replacement, extends its service life, reduces the risk of corrosion in the liquid cooling system pipes, and minimizes the impact on heat exchange efficiency and performance degradation, thus ensuring the stability of the liquid cooling system. It also improves phenomena such as abnormal server temperature rise, ensuring stable server operation. Furthermore, the real-time liquid cooling conductivity is positively correlated with the opening degree of the electric regulating valve 30; that is, the higher the real-time liquid cooling conductivity, the larger the opening degree of the electric regulating valve 30. The more coolant bypassed by the conductivity adjustment circuit 110, the more coolant conductivity it can reduce. When more coolant from the conductivity adjustment circuit 110 flows into the liquid cooling circuit, the liquid cooling conductivity can be adjusted more quickly, improving the adjustment efficiency. At this time, the efficiency of the conductivity adjustment circuit 110 in adjusting the liquid cooling conductivity is matched with the real-time liquid cooling conductivity, which can achieve low-load operation of the liquid cooling system while ensuring the stability of the liquid cooling system.

[0056] The technical solution of this embodiment, by adjusting the opening of the electric regulating valve according to the real-time liquid cooling conductivity when the real-time hydraulic pressure is less than or equal to the pressure set value and the real-time liquid cooling conductivity is within a first preset range, can optimize water quality, reduce the frequency of coolant replacement, extend its service life, reduce the risk of corrosion in the liquid cooling system pipes, affecting heat exchange efficiency and performance degradation, and ensure the stability of the liquid cooling system. It also improves phenomena such as abnormal server temperature rise, ensuring stable server operation. Furthermore, the efficiency of the conductivity adjustment loop in regulating the liquid cooling conductivity is matched with the real-time liquid cooling conductivity, enabling low-load operation of the liquid cooling system while ensuring its stability.

[0057] In some embodiments, when the real-time hydraulic pressure is less than or equal to the pressure set value and the real-time liquid cooling conductivity is within a first preset range, the controller adjusts the opening of the electric regulating valve according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulating circuit in regulating the liquid cooling conductivity.

[0058] In some embodiments, when the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is less than the minimum value within a first preset range, the controller can control the electric regulating valve to be fully closed.

[0059] In some embodiments, when the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is greater than the maximum value within a first preset range, the controller can control the electric regulating valve to be fully open.

[0060] In some embodiments, when the real-time hydraulic pressure is greater than the upper pressure limit, the controller can control the electric regulating valve to open fully.

[0061] In some embodiments, the electric control valve includes an actuator and a control valve. The actuator is connected to a controller, one end of the control valve is connected to the outlet of the circulating pump, and the other end of the control valve is connected to the outlet of the liquid cooling circuit. The controller is used to control the actuator to adjust the opening degree of the control valve.

[0062] Specifically, after the controller obtains the real-time hydraulic pressure at the outlet of the circulating pump and the real-time liquid-cooled conductivity of the liquid-cooled circuit, the controller can control the actuator to move according to the real-time hydraulic pressure at the outlet of the circulating pump and the real-time liquid-cooled conductivity of the liquid-cooled circuit, so that the actuator controls the opening of the regulating valve, thereby adjusting the opening of the electric regulating valve according to the real-time hydraulic pressure and / or the real-time liquid-cooled conductivity.

[0063] Continue to refer to Figure 1 The conductivity adjustment circuit 110 also includes a deionizer 32, a first valve 31 and a second valve 33. One end of the electric regulating valve 30 is connected to the outlet of the circulating pump 8, and the other end of the electric regulating valve 30 is connected to the inlet of the deionizer 32 through the first valve 31. The second valve 33 is connected between the outlet of the deionizer 32 and the outlet 20 of the liquid cooling circuit. The controller is connected to the first valve 31 and the second valve 33 respectively. The controller is also used to control the first valve 31 and the second valve 33 to close when the deionizer 32 fails.

[0064] Specifically, the electric regulating valve 30 controls the flow rate of the bypass coolant in the conductivity regulation circuit 110. The deionizer 32 is connected to the conductivity regulation circuit 110. When coolant bypasses to the deionizer 32, the deionizer 32 treats the coolant to reduce its conductivity. The coolant then flows into the liquid cooling circuit, achieving liquid cooling conductivity regulation. The first valve 31 can be a front ball valve of the deionizer 32, and the second valve 33 can be a rear ball valve of the deionizer 32. In case of a fault in the deionizer 32, the controller can close the first valve 31 and the second valve 33, isolating the coolant outside the deionizer 32 for maintenance, thus preventing disruption to the normal operation of the liquid cooling system.

[0065] Continue to refer to Figure 1 The liquid cooling system also includes a first one-way valve 34, which serves as one end of the conductivity adjustment circuit 110 and is connected to the secondary side liquid supply port 20. This prevents coolant on one side of the secondary side liquid supply port 20 from flowing into the conductivity adjustment circuit 110 through the first one-way valve 34. This ensures that when the electric regulating valve 30 is closed, coolant in the liquid cooling circuit will not flow into the deionizer 32, and its impact on the resistance of the liquid cooling system circuit is relatively small.

[0066] Continue to refer to Figure 1 The liquid cooling circuit also includes a secondary-side manual vent valve 15, a secondary-side pre-filter pressure sensor 16, a secondary-side filter 17, a secondary-side liquid supply temperature sensor 18, and a secondary-side liquid supply pressure sensor 19. The secondary-side manual vent valve 15 is connected between the secondary-side liquid supply port 20 and the plate heat exchanger 14 to vent air from the liquid cooling circuit, ensuring the normal operation of the liquid cooling system. The secondary-side filter 17 is connected between the secondary-side manual vent valve 15 and the secondary-side liquid supply port 20 to filter the coolant after heat exchange. A secondary-side pre-filter pressure sensor 16 is also installed between the secondary-side manual vent valve 15 and the secondary-side filter 17 to monitor the coolant pressure before the secondary-side filter 17. The secondary-side liquid supply temperature sensor 18 and the secondary-side liquid supply pressure sensor 19 are sequentially installed between the secondary-side filter 17 and the secondary-side liquid supply port 20 to monitor the coolant pressure and temperature at the secondary-side liquid supply port 20, respectively. This allows the system to determine if the coolant meets the server's current heat dissipation requirements; if not, other components can be adjusted accordingly to raise or lower the temperature of the cooling medium.

[0067] Continue to refer to Figure 1 The liquid cooling circuit also includes a secondary-side return pressure sensor 2 and a secondary-side return temperature sensor 3, connected in series between the inlet of the circulating pump 8 and the inlet 1 of the liquid cooling circuit; these are used to detect the pressure and temperature of the coolant after it flows out of the server's cold plate, respectively. When the liquid cooling circuit includes a secondary-side regulating valve 5, the secondary-side regulating valve 5 is connected between the secondary-side return port 1 and the secondary-side supply port 20 (e.g., Figure 1 As shown, the secondary-side regulating valve 5 is connected between the secondary-side supply temperature sensor 18 and the secondary-side supply pressure sensor 19. The secondary-side regulating valve 5 is used to regulate the flow rate, pressure, and temperature of the coolant in the secondary-side circuit. The secondary-side return pressure sensor 2, the secondary-side return temperature sensor 3, and the conductivity sensor 4 are connected between the secondary-side regulating valve 5 and the secondary-side return port 1. The secondary-side return temperature sensor 3 is used to detect the temperature of the coolant before it enters the circulation pump 8 or the backup pump 9. The heat dissipation requirements of the coolant can be understood through the detection results of the secondary-side return temperature sensor 3, and the circulation flow rate of the coolant can be adjusted accordingly to meet the current heat dissipation requirements and ensure that the server operates within the most suitable temperature range.

[0068] Continue to refer to Figure 1 The liquid cooling circuit also includes a secondary-side drain valve 6 and an expansion tank 7. The secondary-side drain valve 6 is connected between the secondary-side regulating valve 5 and the inlet of the circulating pump 8, and the expansion tank 7 is connected between the secondary-side drain valve 6 and the circulating pump 8. The secondary-side drain valve 6 can regulate the flow rate of coolant in the secondary-side circuit of the liquid cooling circuit and can be used for emergency draining to improve the safety of the liquid cooling system. The expansion tank 7 can be used for throttling, pressure reduction, and cooling, and can buffer pressure fluctuations to stabilize the system pressure.

[0069] Continue to refer to Figure 1 The liquid cooling circuit may also include a circulating pump check valve 10, connected to the outlet of the circulating pump 8 and located near the conductivity adjustment circuit 110 connected to the outlet of the circulating pump 8, to control the one-way circulation of the coolant. This prevents the coolant from impacting the output of the circulating pump 8 when it is shut down. The liquid cooling circuit may also include a backup pump 9 and a backup pump check valve 11. The backup pump 9 and backup pump check valve 11 are connected in series and then connected in parallel with the series path of the circulating pump 8 and circulating pump check valve 10, serving as a backup circulation power circuit for the liquid cooling circuit. That is, when the circulating pump 8 fails, it can be shut down and the backup pump 9 can be turned on, ensuring normal coolant circulation without requiring system shutdown, thus helping to ensure continuous heat dissipation for the server. The backup pump check valve 11 prevents the coolant from impacting the output of the backup pump 9 when it is shut down.

[0070] Continue to refer to Figure 1 The liquid cooling circuit also includes a safety relief valve 12, which is connected between the first pressure sensor 13 and the conductivity adjustment circuit 110 and the outlet of the circulating pump 8, to realize pressure protection of the liquid cooling circuit.

[0071] Continue to refer to Figure 1The liquid cooling circuit also includes a primary side circuit, which includes a primary side drain valve 21, a primary side supply pressure sensor 22, a primary side supply temperature sensor 23, a primary side return temperature sensor 26, a primary side return pressure sensor 27, a primary side regulating valve 28, and a primary side manual vent valve 29. The primary side drain valve 21, primary side supply pressure sensor 22, and primary side supply temperature sensor 23 are sequentially connected between one end of the plate heat exchanger 14 and the primary side supply port 24. The primary side supply pressure sensor 22 and the primary side supply temperature sensor 23 are used to monitor the pressure and temperature of the primary side supply port 24, respectively. This allows monitoring of the temperature of the heat exchange medium before heat dissipation, thus understanding the heat dissipation requirements of the heat exchange medium, and adjusting the operation of the dry cooler or cooling tower accordingly. Simultaneously, the hydraulic pressure of the heat exchange medium before heat dissipation is monitored to ensure that the hydraulic pressure meets the operating requirements of the dry cooler or cooling tower. The primary side drain valve 21 is used to regulate the coolant flow rate in the primary side circuit of the liquid cooling circuit and can be used for emergency draining, improving the safety of the liquid cooling system. A primary side return liquid temperature sensor 26, a primary side return liquid pressure sensor 27, and a primary side manual vent valve 29 are sequentially connected to the primary side return liquid port 25 and the other end of the plate heat exchanger 14. The primary side return liquid temperature sensor 26 and the primary side return liquid pressure sensor 27 are used to monitor the pressure and temperature of the primary side return liquid port 25, respectively. This monitors the temperature of the heat exchange medium after heat dissipation to determine if the heat exchange medium meets the current heat exchange requirements of the cooling medium. If not, other components can be adjusted accordingly to raise or lower the temperature of the heat exchange medium. Simultaneously, the hydraulic pressure of the heat exchange medium after heat dissipation is monitored to ensure that the hydraulic pressure entering the heat exchanger meets the requirements of the heat exchanger. The primary side manual vent valve 29 is used to vent air from the liquid cooling circuit to ensure the normal operation of the liquid cooling system. One end of the primary side regulating valve 28 is connected between the primary side drain valve 21 and the primary side supply liquid pressure sensor 22, and the other end of the primary side regulating valve 28 is connected between the primary side return liquid pressure sensor 27 and the primary side manual vent valve 29. The primary side regulating valve 28 is used to regulate the flow rate, pressure, and temperature of the coolant in the primary side circuit.

[0072] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for controlling the conductivity of a liquid cooling system, characterized in that, A conductivity control device for a liquid cooling system is provided, comprising a liquid cooling circuit and a conductivity regulating circuit. The liquid cooling circuit includes a circulating pump, one end of the conductivity regulating circuit is connected to the outlet of the circulating pump, and the other end of the conductivity regulating circuit is connected to the outlet of the liquid cooling circuit. The conductivity regulating circuit includes an electrically operated regulating valve. The conductivity control method for the liquid cooling system includes: Obtain the real-time hydraulic pressure at the outlet of the circulating pump and the real-time liquid cooling conductivity of the liquid cooling circuit; When the real-time hydraulic pressure is less than or equal to the pressure set value, and the real-time liquid cooling conductivity is within a first preset range, the opening of the electric regulating valve is adjusted according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulating circuit in regulating the liquid cooling conductivity.

2. The conductivity control method for a liquid cooling system according to claim 1, characterized in that, Also includes: When the real-time hydraulic pressure is greater than the pressure set value but less than or equal to the pressure upper limit value, the opening of the electric regulating valve is adjusted according to the real-time hydraulic pressure to adjust the efficiency of the conductivity regulating circuit in regulating the liquid cooling conductivity.

3. The conductivity control method for a liquid cooling system according to claim 1, characterized in that, When the real-time hydraulic pressure is less than or equal to the pressure setpoint, and the real-time liquid cooling conductivity is within a first preset range, adjusting the opening of the electric regulating valve according to the real-time liquid cooling conductivity includes: The first conductivity is determined based on the difference between the real-time liquid cooling conductivity and the minimum value within the first preset range; The first difference is determined based on the difference between the maximum and minimum values ​​within the first preset range; The opening degree of the electric regulating valve is adjusted according to the ratio of the first conductivity to the first difference.

4. The conductivity control method for a liquid cooling system according to claim 2, characterized in that, When the real-time hydraulic pressure is greater than the pressure setpoint and less than or equal to the pressure upper limit, adjusting the opening of the electric regulating valve according to the real-time hydraulic pressure includes: The first pressure value is determined based on the difference between the real-time hydraulic pressure and the pressure setpoint. The second difference is determined based on the difference between the pressure setpoint and the pressure upper limit. The opening degree of the electric regulating valve is adjusted according to the ratio of the first pressure value to the second difference.

5. The method for controlling the conductivity of a liquid cooling system according to any one of claims 1-4, characterized in that, Also includes: When the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is less than the minimum value within the first preset range, the electric regulating valve is controlled to be fully closed. When the real-time hydraulic pressure is less than the pressure set value and the real-time liquid cooling conductivity is greater than the maximum value within the first preset range, the electric regulating valve is controlled to be fully open. When the real-time hydraulic pressure is greater than the upper pressure limit, the electric regulating valve is controlled to be fully opened.

6. The conductivity control method for a liquid cooling system according to claim 1, characterized in that, The liquid cooling circuit also includes a first pressure sensor and a conductivity sensor; the first pressure sensor is connected to the outlet of the circulation pump, and the conductivity sensor is connected between the inlet of the circulation pump and the inlet of the liquid cooling circuit. The conductivity control method for the liquid cooling system further includes: The real-time hydraulic pressure at the outlet of the circulating pump is obtained through the first pressure sensor, and the real-time liquid cooling conductivity of the liquid cooling circuit is obtained through the conductivity sensor.

7. The conductivity control method for a liquid cooling system according to claim 1, characterized in that, The conductivity adjustment circuit also includes a deionization tank, a first valve, and a second valve. One end of the electric regulating valve is connected to the outlet of the circulating pump, and the other end of the electric regulating valve is connected to the inlet of the deionization tank through the first valve. The second valve is connected between the outlet of the deionization tank and the outlet of the liquid cooling circuit. The conductivity control method for the liquid cooling system further includes: In the event of a malfunction in the deionizer, the first valve and the second valve are closed.

8. A conductivity control device for a liquid cooling system, characterized in that, include: The liquid cooling circuit includes a circulation pump, one end of the conductivity adjustment circuit is connected to the outlet of the circulation pump, and the other end of the conductivity adjustment circuit is connected to the outlet of the liquid cooling circuit. The conductivity adjustment circuit includes an electrically operated regulating valve; The liquid cooling system conductivity control device further includes a controller connected to the electric regulating valve. The controller is used to acquire the real-time hydraulic pressure at the outlet of the circulating pump and the real-time liquid cooling conductivity of the liquid cooling circuit. When the real-time hydraulic pressure is less than or equal to the pressure set value and the real-time liquid cooling conductivity is within a first preset range, the controller adjusts the opening of the electric regulating valve according to the real-time liquid cooling conductivity to adjust the efficiency of the conductivity regulation circuit in regulating the liquid cooling conductivity.

9. The conductivity control device for a liquid cooling system according to claim 8, characterized in that, The electric regulating valve includes an actuator and a regulating valve. The actuator is connected to the controller. One end of the regulating valve is connected to the outlet of the circulating pump, and the other end of the regulating valve is connected to the outlet of the liquid cooling circuit. The controller is used to control the actuator to adjust the opening degree of the regulating valve.

10. The conductivity control device for a liquid cooling system according to claim 8, characterized in that, The conductivity adjustment circuit also includes a deionizer, a first valve, and a second valve. One end of the electric regulating valve is connected to the outlet of the circulating pump, and the other end of the electric regulating valve is connected to the inlet of the deionizer through the first valve. The second valve is connected between the outlet of the deionizer and the outlet of the liquid cooling circuit. The controller is connected to the first valve and the second valve respectively. The controller is also used to control the first valve and the second valve to close when the deionizer fails.

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