Wafer transfer device and wafer cleaning method

Abstract

The embodiment of the present disclosure provides a wafer conveying device and a wafer cleaning method, and relates to the technical field of semiconductor equipment. The wafer conveying device comprises: a wafer conveying cavity provided with a clean air supply module and a gas collection module; the clean air supply module is arranged at the upper part of the wafer conveying cavity, and clean air provided by the clean air supply module is used for blowing the wafer; the clean air recovery module is arranged at the lower part of the wafer conveying cavity, and the clean air recovery module is used for collecting the gas in the wafer conveying cavity; a front opening wafer transfer box is used for loading the wafer and is located between the clean air supply module and the gas collection module; a loading table is used for bearing the front opening wafer transfer box and is arranged transversely and side by side with the wafer conveying cavity; and a longitudinal air curtain pipeline is located above the front opening of the front opening wafer transfer box and provides clean gas for cleaning the wafer.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor equipment technology, and in particular to a wafer transport device and a wafer cleaning method. Background Technology

[0002] Wafer transport devices are essential equipment for transferring wafers to process chambers or inspection equipment during wafer fabrication and inspection. During wafer transport, the wafer passes through multiple stations for transport, positioning, or calibration, making it highly susceptible to contamination. Therefore, thorough cleaning during wafer transport is necessary. Summary of the Invention

[0003] This disclosure provides a wafer transport device and a wafer cleaning method.

[0004] As one aspect of this disclosure, an embodiment provides a wafer transport device, comprising: a wafer transport cavity, provided with a clean air supply module and a gas collection module; the clean air supply module is disposed at the upper part of the wafer transport cavity, and the clean air provided by the clean air supply module is used to clean the wafer; the clean air recovery module is disposed at the lower part of the wafer transport cavity, and the clean air recovery module is used to collect the gas in the wafer transport cavity; a front-opening wafer transport box for loading wafers, located between the clean air supply module and the gas collection module; a loading stage for supporting the front-opening wafer transport box, arranged horizontally alongside the wafer transport cavity; and a longitudinal air curtain duct located above the front opening of the front-opening wafer transport box, providing clean gas for cleaning the wafer.

[0005] In one embodiment, the longitudinal air curtain duct is positioned adjacent to the upper edge of the front opening of the front-opening wafer transfer box.

[0006] In one embodiment, the longitudinal air curtain duct is detachably mounted to the sidewall of the wafer transfer cavity.

[0007] In one embodiment, the wafer transfer device further includes: a first lateral air curtain duct extending in a vertical direction and located on one side of the front opening of the front-opening wafer transfer box, wherein the clean gas provided is used to clean the wafer.

[0008] In one embodiment, the wafer transfer device further includes: a second lateral air curtain duct extending in a vertical direction and located on the side of the front opening of the front-opening wafer transfer box opposite to the first lateral air curtain duct, wherein the clean gas provided is used to clean the wafer.

[0009] In one embodiment, the first lateral air curtain duct and the second lateral air curtain duct are detachably mounted to the sidewall of the wafer transfer cavity.

[0010] In one embodiment, the clean air supply module includes: a chemical filter, an air supply fan, and a high-efficiency filter.

[0011] As one aspect of this disclosure, this disclosure provides a wafer cleaning method for use with any of the foregoing wafer transport apparatuses; the wafer cleaning method includes: After placing the front-opening wafer transfer box onto the loading stage, the sealing cover at the front opening of the front-opening wafer transfer box is opened using a cover opener. Clean air is delivered through a clean air supply module located at the top of the wafer transfer cavity; Clean gas is supplied into the front-opening wafer transfer box via a longitudinal air curtain duct; the longitudinal air curtain duct is located above the front opening of the front-opening wafer transfer box. The gas inside the wafer transport cavity is collected by a gas collection module located at the bottom of the wafer transport cavity.

[0012] In one embodiment, the wafer cleaning method further includes: Clean gas for cleaning the wafer is provided through a first lateral air curtain duct; the first lateral air curtain duct extends vertically and is located on one side of the front opening of the front-opening wafer transfer box.

[0013] In one embodiment, the wafer cleaning method further includes: Clean gas for cleaning the wafer is provided through a second lateral air curtain duct; the second lateral air curtain duct extends vertically and is located on the side of the front opening of the front-opening wafer transfer box opposite to the first lateral air curtain duct.

[0014] This embodiment of the invention achieves dual cleanliness through clean air provided by the clean air supply module and clean gas provided by the longitudinal air curtain duct. Even when the FOUP is opened, the wafer will not be contaminated by particles, even if the internal space of the FOUP is connected to the outside.

[0015] The above overview is for illustrative purposes only and is not intended to be limiting in any way. Further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description, in addition to the illustrative aspects, embodiments, and features described above. Attached Figure Description

[0016] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this disclosure and should not be construed as limiting the scope of this disclosure.

[0017] Figure 1 A schematic diagram of the structure of a wafer transfer device according to an embodiment of the present disclosure is shown; Figure 2 A schematic diagram illustrating an application scenario of a clean air supply module in a wafer transport apparatus according to an embodiment of the present disclosure is shown. Figure 3 This illustration shows an application scenario of the longitudinal air curtain duct, the first lateral air curtain duct, and the second lateral air curtain duct in a wafer transfer apparatus according to embodiments of the present disclosure. Figure 1 ; Figure 4 A schematic diagram illustrating an application scenario of the first lateral air curtain duct and the second lateral air curtain duct in a wafer transfer apparatus according to an embodiment of the present disclosure is shown. Figure 5 This illustration shows an application scenario of the first lateral air curtain duct and the second lateral air curtain duct in a wafer transfer device according to an embodiment of the present disclosure. Figure 2 ; Figure 6 A schematic flowchart of a wafer cleaning method according to an embodiment of the present disclosure is shown.

[0018] Explanation of reference numerals in the attached drawings: 10-Wafer transfer cavity; 11-Clean air supply module; 20-FOUP; 30-Loading stage; 40-Longitudinal air curtain duct; 50-First lateral air curtain duct; 60-Second lateral air curtain duct; 70-Wafer. Detailed Implementation

[0019] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure. Therefore, the drawings and description are to be considered exemplary in nature and not restrictive.

[0020] In related technologies, when the FOUP (Front Opening Unified Pod) is placed on the loading stage and its sealing cover is opened, particles from the wafer transport device can easily fall into the FOUP and contaminate the wafer.

[0021] To overcome the above problems, this application provides a wafer transport device and a wafer cleaning method, which uses clean air blowing and longitudinal air curtain to provide clean gas to clean the wafer in a dual cleaning process. When the FOUP is opened, even if the internal space of the FOUP is connected to the outside, the wafer will not be contaminated by particles.

[0022] The structure, function, and implementation process of the wafer transmission device provided in this embodiment will be illustrated below with reference to the accompanying drawings.

[0023] Please refer to Figures 1 to 3The wafer transfer device provided in this embodiment includes: a wafer transfer cavity 10, which is provided with a clean air supply module 11 and a gas collection module; the clean air supply module 11 is located at the upper part of the wafer transfer cavity 10, and the clean air provided by the clean air supply module 11 is used to blow the wafer 70; the clean air recovery module is located at the lower part of the wafer transfer cavity 10, and the clean air recovery module is used to collect the gas in the wafer transfer cavity 10; a FOUP 20, which is used to load the wafer 70, is located between the clean air supply module 11 and the gas collection module; a loading stage 30, which is used to support the FOUP 20, is arranged side by side with the wafer transfer cavity 10 in the transverse direction; and a longitudinal air curtain duct 40, which is located above the front opening of the FOUP 20, and provides clean gas for cleaning the wafer 70.

[0024] Among them, the up and down direction is the vertical direction, and the vertical, horizontal, and longitudinal directions are all perpendicular to each other. Figure 1 For example, Figure 1 The vertical direction in this embodiment is the vertical direction. Figure 1 (The area above is the area above in this embodiment). Figure 1 The left and right directions in this embodiment are the horizontal directions. Figure 1 The direction from the center to the right is the forward direction in this embodiment. Figure 1 The direction perpendicular to the paper is the longitudinal direction.

[0025] The wafer transfer cavity 10 is the core clean area of ​​the wafer transfer device. The wafer transfer cavity 10 is generally rectangular in shape, and its interior defines a sealed or semi-sealed space for the operation and transfer of the wafer 70. The wafer transfer cavity 10 integrates clean air delivery and gas recovery functions.

[0026] A clean air supply module 11 is provided on the upper part of the wafer transfer cavity 10. The clean air supply module 11 is configured to provide clean air into the wafer transfer cavity 10. The clean air can form an airflow curtain to sweep the entire operating area, effectively removing contaminants such as particles and maintaining a high level of cleanliness within the wafer transfer cavity 10. After the FOUP 20 is opened, the clean air can also sweep the surface of the wafer 70 inside the FOUP 20 to prevent the wafer 70 from being contaminated by particles.

[0027] A gas collection module is correspondingly provided at the lower part of the wafer transfer cavity 10. The gas collection module typically includes one or more air intakes or grilles, connected to an external exhaust or gas purification module. The gas collection module is used to efficiently collect gases within the wafer transfer cavity 10, such as contaminated clean air. This effectively prevents particles from suspending or diffusing within the wafer transfer cavity 10 and quickly discharges the particles to the outside. The gas collected by the gas collection module can also be purified and returned to the clean air supply module 11 for use.

[0028] FOUP 20 is used for batch loading and transporting wafers 70. When FOUP 20 is placed on loading stage 30, its front opening faces the wafer transfer cavity 10. FOUP 20 is located between clean air supply module 11 and gas collection module, allowing clean air from clean air supply module 11 to enter FOUP 20 and clean the surface of wafers 70. A wafer 70 robot can reach into the front opening of FOUP 20 to perform wafer 70 loading and unloading operations.

[0029] The loading stage 30 is used to carry and position the FOUP 20. The loading stage 30 and the wafer transfer cavity 10 are arranged side by side in the transverse direction. The loading stage 30 is typically equipped with sensors and a docking mechanism to ensure that the FOUP 20 is accurately fixed in the correct position for docking with the wafer transfer cavity 10. After the FOUP 20 is placed on the loading stage 30 and docking is completed, the sealing cover at its front opening is opened, and the front opening communicates with the operating window of the wafer transfer cavity 10.

[0030] A longitudinal air curtain duct 40 is positioned above the front opening of the FOUP 20 and extends longitudinally. The longitudinal air curtain duct 40 has an exhaust port, which can be an opening formed in the side wall of the longitudinal air curtain duct 40 or a nozzle formed in the side wall of the longitudinal air curtain duct 40, capable of continuously ejecting clean gas to form an air curtain. The clean gas may include nitrogen. On one hand, during the movement of the wafer 70 robotic arm into and out of the FOUP 20, the clean gas provided by the longitudinal air curtain duct 40 can form a dynamic barrier at the front opening, preventing particles from outside the FOUP 20 from entering and contaminating the wafer 70. On the other hand, the clean gas provided by the longitudinal air curtain duct 40 can blow clean the surface of the wafer 70, effectively supplementing the clean air supply module 11 and providing a localized enhanced cleaning effect.

[0031] In some examples, the wafer transfer device also includes a first drive unit, which is a motor that outputs rotary motion. The first drive unit is connected to the longitudinal air curtain duct 40. Under the driving force of the first drive unit, the longitudinal air curtain duct 40 can rotate around its own central axis to adjust the angle of the air outlet of the longitudinal air curtain duct 40 and optimize the shape and coverage of the air curtain.

[0032] For example, if it is necessary to prevent particles outside of FOUP 20 from entering and contaminating wafer 70, the longitudinal air curtain duct 40 can be adjusted so that the air outlet faces downwards, at which point the air curtain ejected from the longitudinal air curtain duct 40 will be vertically downwards.

[0033] For example, when it is necessary to purge the surface of the wafer 70 inside the FOUP 20, the longitudinal air curtain duct 40 can be adjusted so that the air outlet is at a preset angle to the vertical direction, so that the air curtain ejected from the longitudinal air curtain duct 40 is tilted relative to the vertical direction, and then more clean gas can enter the FOUP 20 to purge the surface of the wafer 70.

[0034] For example, the first driving unit can be controlled to rotate the longitudinal air curtain duct 40 according to the real-time position of the wafer 70, so that there is always a large amount of clean gas to purge the surface of the wafer 70.

[0035] In some application scenarios, FOUP 20 is loaded onto loading platform 30, and the sealing cap of FOUP 20 is opened using a cap opener. At this time, as... Figure 2 As shown, the clean air supply module 11 within the wafer transfer cavity 10 continuously supplies clean air, while the gas collection module continuously draws air, forming a stable unidirectional flow within the wafer transfer cavity 10. Simultaneously, as... Figure 1 and Figure 3 As shown, the longitudinal air curtain duct 40 forms a clean air curtain at the front opening. During the process of the wafer 70 robot arm entering the FOUP 20 through the front opening to retrieve or place the wafer 70, under the dual action of the clean air delivered by the clean air supply module 11 and the clean air curtain provided by the longitudinal air curtain duct 40, particles are effectively carried downwards and captured by the gas collection module and then discharged, greatly reducing the risk of the wafer 70 being contaminated by particles during transportation.

[0036] This application provides a wafer transfer device. By configuring a clean air supply module 11 and a gas collection module inside the wafer transfer cavity 10, the clean air supply module 11 is located at the upper part of the wafer transfer cavity 10, and the clean air provided by the clean air supply module 11 is used to clean the wafer 70. The clean air recovery module is located at the lower part of the wafer transfer cavity 10, and the clean air recovery module is used to collect the gas inside the wafer transfer cavity 10. By configuring a longitudinal air curtain duct 40, which is located above the front opening of the FOUP 20, the clean gas provided by the longitudinal air curtain duct 40 is used to clean the wafer 70. In this way, the clean air provided by the clean air supply module 11 and the clean gas provided by the longitudinal air curtain duct 40 achieve dual cleanliness. When the FOUP 20 is opened, even if the internal space of the FOUP 20 is connected to the outside, the wafer 70 will not be contaminated by particles.

[0037] In some embodiments, the longitudinal air curtain duct 40 is disposed adjacent to the upper edge of the front opening of the FOUP 20.

[0038] Specifically, the longitudinal air curtain duct 40 extends parallel to the longitudinal direction (the width direction of the front opening) and is installed directly above the front opening, for example, a few millimeters to a few centimeters above the upper edge of the front opening. This arrangement, close to the upper edge, allows the clean gas ejected from the longitudinal air curtain duct 40 to cover the entire width of the front opening with almost no attenuation, forming a dense and continuous longitudinal air curtain at the opening. This air curtain acts as a dynamic isolation barrier, promptly blowing away particles that may escape or intrude from the opening.

[0039] In some embodiments, for ease of maintenance, cleaning or replacement, the longitudinal air curtain duct 40 is detachably mounted to the sidewall of the wafer transfer cavity 10.

[0040] For example, the longitudinal air curtain duct 40 is detachably mounted to the side wall of the wafer transfer cavity 10 using connectors such as screws, bolts, quick-release clips, or clamps. For instance, a mounting bracket is provided on the side wall of the wafer transfer cavity 10, and flanges are provided at both ends of the longitudinal air curtain duct 40. The flanges are fastened to the mounting bracket using fasteners, thereby achieving fixation. When the longitudinal air curtain duct 40 can be rotated and adjusted, it can be connected to the flanges via a slewing bearing.

[0041] like Figures 1 to 5 As shown, in some embodiments, the wafer transfer device further includes: a first lateral air curtain duct 50, which extends in the vertical direction and is located on one side of the front opening of the FOUP 20, and provides clean gas for cleaning the wafer 70.

[0042] The first lateral air curtain duct 50 has an exhaust port on one side facing the center of the front opening. The exhaust port can be an opening in the side wall of the first lateral air curtain duct 50 or a nozzle in the side wall of the first lateral air curtain duct 50, which can continuously spray clean gas and form an air curtain.

[0043] The first lateral air curtain duct 50 is positioned near one side edge of the front opening of the FOUP 20 to reduce or even avoid the attenuation of clean gas, thus facilitating the clean gas coverage of the front opening.

[0044] On the one hand, during the process of the robotic arm moving the wafer 70 into and out of the FOUP 20, the clean gas provided by the first lateral air curtain duct 50 can form a dynamic barrier at the front opening, preventing particles outside the FOUP 20 from entering and contaminating the wafer 70. On the other hand, the air curtain provided by the first lateral air curtain duct 50 can blow clean the surface of the wafer 70 that is about to be removed, effectively supplementing the clean air supply module 11 and providing a localized enhanced cleaning effect.

[0045] The air curtain provided by the first lateral air curtain duct 50 can achieve lateral isolation and pollution prevention. Combined with the vertical air curtain provided by the clean air supply module 11 and the longitudinal air curtain duct 40, it can further improve the cleanliness of the wafer 70 transmission.

[0046] In some examples, the wafer transfer device also includes a second drive unit, which is a motor that outputs rotary motion. The second drive unit is connected to the first lateral air curtain duct 50. Under the driving force of the second drive unit, the first lateral air curtain duct 50 can rotate around its own central axis to adjust the angle of the air outlet of the first lateral air curtain duct 50 and optimize the shape and coverage of the air curtain.

[0047] For example, if it is necessary to prevent particles outside of FOUP 20 from entering and contaminating wafer 70, the first lateral air curtain duct 50 can be adjusted so that the axis of the air outlet is parallel to the longitudinal direction. At this time, the air curtain ejected from the first lateral air curtain duct 50 is along the longitudinal direction.

[0048] For example, when it is necessary to purge the surface of the wafer 70 inside the FOUP 20, the first lateral air curtain duct 50 can be adjusted so that the outlet is at a preset angle to the longitudinal direction, so that the air curtain ejected from the first lateral air curtain duct 50 is tilted relative to the longitudinal direction and toward the inside of the FOUP 20, thereby allowing more clean gas to enter the FOUP 20 to purge the surface of the wafer 70.

[0049] For example, the second driving unit can be controlled to drive the first lateral air curtain duct 50 to rotate according to the real-time position of the wafer 70, so that there is always a large amount of clean gas to blow the surface of the wafer 70.

[0050] In some examples, for ease of maintenance, cleaning or replacement, the first lateral air curtain duct 50 is detachably mounted to the sidewall of the wafer transfer cavity 10.

[0051] For example, the first lateral air curtain duct 50 is detachably mounted to the side wall of the wafer transfer cavity 10 using connectors such as screws, bolts, quick-release clips, or clamps. For instance, a mounting bracket is provided on the side wall of the wafer transfer cavity 10, and flanges are provided at both ends of the first lateral air curtain duct 50. The flanges are fastened to the mounting bracket using fasteners, thereby achieving fixation. When the first lateral air curtain duct 50 can be rotated and adjusted, it can be connected to the flanges via a slewing bearing.

[0052] like Figures 1 to 5 As shown, in some embodiments, the wafer transfer device further includes: a second lateral air curtain duct 60, which extends in the vertical direction and is located on the side of the front opening of the FOUP 20 away from the first lateral air curtain duct 50, and provides clean gas for cleaning the wafer 70.

[0053] The second lateral air curtain duct 60 has an exhaust port on one side facing the center of the front opening. The exhaust port can be an opening opened on the side wall of the second lateral air curtain duct 60 or a nozzle set on the side wall of the second lateral air curtain duct 60, which can continuously spray clean gas and form an air curtain.

[0054] The second lateral air curtain duct 60 is disposed near one of the side edges of the front opening of the FOUP 20 to reduce or even avoid the attenuation of clean gas and facilitate clean gas coverage of the front opening. The second lateral air curtain duct 60 and the first lateral air curtain duct 50 are respectively disposed at opposite side edges of the front opening.

[0055] On the one hand, during the process of the robotic arm moving the wafer 70 into and out of the FOUP 20, the clean gas provided by the second lateral air curtain duct 60 can form a dynamic barrier at the front opening, preventing particles outside the FOUP 20 from entering and contaminating the wafer 70. On the other hand, the air curtain provided by the second lateral air curtain duct 60 can blow clean the surface of the wafer 70 that is about to be removed, effectively supplementing the clean air supply module 11 and providing a localized enhanced cleaning effect.

[0056] The second lateral air curtain duct 60 provides air curtains that can achieve lateral isolation and pollution prevention. Combined with the clean air supply module 11 and the vertical air curtains provided by the longitudinal air curtain duct 40, it can provide all-round clean gas protection for the wafer 70 and further improve the cleanliness of the wafer 70 transmission.

[0057] In some examples, the wafer transfer device also includes a third drive unit, which is a motor that outputs rotary motion. The third drive unit is connected to the second lateral air curtain duct 60. Under the driving force of the third drive unit, the second lateral air curtain duct 60 can rotate around its own central axis to adjust the angle of the air outlet of the second lateral air curtain duct 60 and optimize the shape and coverage of the air curtain.

[0058] For example, if it is necessary to prevent particles outside of FOUP 20 from entering and contaminating wafer 70, the second lateral air curtain duct 60 can be adjusted so that the axis of the air outlet is parallel to the longitudinal direction. At this time, the air curtain ejected from the second lateral air curtain duct 60 is along the longitudinal direction.

[0059] For example, when it is necessary to purge the surface of the wafer 70 inside the FOUP 20, the second lateral air curtain duct 60 can be adjusted so that the outlet is at a preset angle to the longitudinal direction, so that the air curtain ejected from the second lateral air curtain duct 60 is tilted relative to the longitudinal direction and toward the inside of the FOUP 20, thereby allowing more clean gas to enter the FOUP 20 to purge the surface of the wafer 70.

[0060] For example, the third driving unit can be controlled to drive the second lateral air curtain duct 60 to rotate according to the real-time position of the wafer 70, so that there is always a large amount of clean gas to purge the surface of the wafer 70.

[0061] In some examples, the second lateral air curtain duct 60 is detachably mounted to the sidewall of the wafer transfer cavity 10 for ease of maintenance, cleaning or replacement.

[0062] For example, the second lateral air curtain duct 60 is detachably mounted to the side wall of the wafer transfer cavity 10 using connectors such as screws, bolts, quick-release clips, or clamps. For instance, a mounting bracket is provided on the side wall of the wafer transfer cavity 10, and flanges are provided at both ends of the second lateral air curtain duct 60. The flanges are fastened to the mounting bracket using fasteners, thereby achieving fixation. When the second lateral air curtain duct 60 can be rotated and adjusted, it can be connected to the flanges via a slewing bearing.

[0063] In some embodiments, the longitudinal air curtain duct 40, the first lateral air curtain duct 50, and the second lateral air curtain duct 60 may be connected to the same air source.

[0064] For example, the longitudinal air curtain duct 40, the first lateral air curtain duct 50, and the second lateral air curtain duct 60 are each connected to an external air source. Control valves are installed between the longitudinal air curtain duct 40, the first lateral air curtain duct 50, the second lateral air curtain duct 60 and the external air source to regulate the gas flow rate of the corresponding duct. It can be understood that when the gas flow rate is 0, the corresponding air curtain duct is closed.

[0065] For example, the clean air supply module 11 can supply air to the longitudinal air curtain duct 40, the first lateral air curtain duct 50, and the second lateral air curtain duct 60 through the delivery pipe.

[0066] In other embodiments, the longitudinal air curtain duct 40, the first lateral air curtain duct 50, and the second lateral air curtain duct 60 can be connected to different external air sources. Alternatively, the longitudinal air curtain duct 40 can be connected to one external air source, and the first lateral air curtain duct 50 and the second lateral air curtain duct 60 can be connected to another external air source.

[0067] In some embodiments, the clean air supply module 11 includes a chemical filter, an air supply fan, and a high-efficiency filter. The chemical filter, air supply fan, and high-efficiency filter can be arranged sequentially along the airflow direction.

[0068] As the first stage of airflow treatment, a chemical filter is installed at the air inlet of the clean air supply module 11. The interior of the chemical filter is filled with a chemical adsorption medium (such as activated carbon), specifically designed to adsorb and remove contaminants in the airflow, including but not limited to acidic gases, alkaline gases, and adulterants. Placing the chemical filter at the very beginning allows for the removal of chemicals that may degrade or clog subsequent components, especially high-efficiency filters.

[0069] An air supply fan is located downstream of the chemical filter. The air supply fan provides stable airflow power, pushing the pre-purified air from the chemical filter to the next processing stage at a set airflow and static pressure, ensuring a stable and uniform airflow within the wafer transfer cavity 10.

[0070] The high-efficiency particulate air (HEPA) filter, as the final stage of airflow treatment, is a key component ensuring particle cleanliness. It is located downstream of the air supply fan and directly faces the interior space of the wafer transfer cavity 10. This HEPA filter can be an ultra-high-efficiency particulate air (ULPA) filter. The HEPA filter is used to trap residual particulate contaminants in the airflow and those that may be generated during the operation of the air supply fan, outputting nearly particle-free clean air.

[0071] Other configurations of the wafer transfer device in the above embodiments can be adopted from various technical solutions now and in the future known to those skilled in the art, and will not be described in detail here.

[0072] This embodiment also provides a wafer cleaning method for the wafer transport device in any of the foregoing embodiments. The similarities with the foregoing embodiments will not be repeated here.

[0073] like Figure 6 As shown, the wafer cleaning method of this embodiment includes the following steps S610 to S640: S610. After placing the front-opening wafer transfer box onto the loading stage, use the cover opener to open the sealing cover at the front opening of the front-opening wafer transfer box. S620: Clean air is delivered through a clean air supply module located at the top of the wafer transfer cavity; S630, clean gas is delivered into the front-opening wafer transfer box through a longitudinal air curtain duct; the longitudinal air curtain duct is located above the front opening of the front-opening wafer transfer box. S640: Gas in the wafer transport cavity is collected by a gas collection module located at the bottom of the wafer transport cavity.

[0074] In some embodiments, the wafer cleaning method further includes: Clean gas for cleaning the wafers is provided through a first lateral air curtain duct; the first lateral air curtain duct extends vertically and is located on one side of the front opening of the front-opening wafer transfer box.

[0075] In some embodiments, the wafer cleaning method further includes: Clean gas for cleaning the wafers is provided through a second lateral air curtain duct; the second lateral air curtain duct extends vertically and is located on the side of the front opening of the front-opening wafer transfer box away from the first lateral air curtain duct.

[0076] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0077] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0078] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0079] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0080] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements have been described above. Of course, these are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0081] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A wafer transport device, characterized in that, include: The wafer transfer cavity is equipped with a clean air supply module and a gas collection module; the clean air supply module is located at the upper part of the wafer transfer cavity, and the clean air provided by the clean air supply module is used to purge the wafer; the clean air recovery module is located at the lower part of the wafer transfer cavity, and the clean air recovery module is used to collect the gas in the wafer transfer cavity. A front-opening wafer transfer box, used for loading wafers, is located between the clean air supply module and the gas collection module; A loading stage, used to carry the front-opening wafer transfer box, is arranged side by side with the wafer transfer cavity in the transverse direction; A longitudinal air curtain duct, located above the front opening of the front-opening wafer transfer box, provides clean gas for cleaning the wafer.

2. The wafer transport device according to claim 1, characterized in that, The longitudinal air curtain duct is located near the upper edge of the front opening of the front-opening wafer transfer box.

3. The wafer transport device according to claim 1, characterized in that, The longitudinal air curtain duct is detachably installed to the sidewall of the wafer transfer cavity.

4. The wafer transport device according to claim 1, characterized in that, Also includes: The first lateral air curtain duct extends vertically and is located on one side of the front opening of the front-opening wafer transfer box, providing clean gas for cleaning the wafer.

5. The wafer transport device according to claim 4, characterized in that, Also includes: The second lateral air curtain duct extends vertically and is located on the side of the front opening of the front-opening wafer transfer box away from the first lateral air curtain duct. The clean gas provided is used to clean the wafer.

6. The wafer transport device according to claim 5, characterized in that, The first lateral air curtain duct and the second lateral air curtain duct are detachably installed to the sidewall of the wafer transfer cavity.

7. The wafer transport device according to claim 1, characterized in that, The clean air supply module includes: a chemical filter, an air supply fan, and a high-efficiency filter.

8. A wafer cleaning method, used in the wafer transport apparatus according to any one of claims 1 to 7, characterized in that, The wafer cleaning method includes: After placing the front-opening wafer transfer box onto the loading stage, the sealing cover at the front opening of the front-opening wafer transfer box is opened using a cover opener. Clean air is delivered through a clean air supply module located at the top of the wafer transfer cavity; Clean gas is supplied into the front-opening wafer transfer box via a longitudinal air curtain duct; the longitudinal air curtain duct is located above the front opening of the front-opening wafer transfer box. The gas inside the wafer transport cavity is collected by a gas collection module located at the bottom of the wafer transport cavity.

9. The wafer cleaning method according to claim 8, characterized in that, Also includes: Clean gas for cleaning the wafer is provided through a first lateral air curtain duct; the first lateral air curtain duct extends vertically and is located on one side of the front opening of the front-opening wafer transfer box.

10. The wafer cleaning method according to claim 9, characterized in that, Also includes: Clean gas for cleaning the wafer is provided through a second lateral air curtain duct; the second lateral air curtain duct extends vertically and is located on the side of the front opening of the front-opening wafer transfer box opposite to the first lateral air curtain duct.

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