Wafer processing scheduling method and device

Abstract

The application provides a wafer processing scheduling method and device. The method comprises the following steps: determining a first wafer picking sequence from a loading port to a loading lock chamber based on processing technologies of each wafer to be processed; determining a target wafer according to the first wafer picking sequence, determining a plurality of candidate processing chambers matched with a target processing technology according to a target processing technology of the target wafer; determining a target processing chamber according to a wafer carrying state of each candidate processing chamber, generating a processing moving path of the target wafer based on a wafer processing sequence corresponding to the target processing technology and the target processing chamber, so as to obtain a processing moving path of each wafer to be processed; obtaining machine information of a wafer processing equipment, generating a processing scheduling task of the plurality of wafers to be processed according to the machine information, the first wafer picking sequence and the processing moving path of each wafer to be processed, and controlling the wafer processing equipment to execute the processing scheduling task. By using the application, the resource utilization rate of wafer processing can be improved, and the wafer production efficiency can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a wafer processing scheduling method and apparatus. Background Technology

[0002] With the rapid development of semiconductor manufacturing technology, the production capacity requirements for semiconductor manufacturing equipment are increasing. Semiconductor manufacturing equipment typically includes multiple processing chambers, including but not limited to chambers suitable for processing wafers using different processes such as cleaning, etching, and ion implantation. Based on the wafer's process requirements, the equipment transfers wafers to different processing chambers for processing to complete the required wafer production. To improve production efficiency, path planning and wafer scheduling schemes are usually required based on the wafer's process requirements to guide the semiconductor manufacturing equipment to sequentially transport wafers to different processing chambers. However, the processing speeds of different chambers may vary. Current wafer scheduling schemes can cause wafers to wait between chambers, increasing processing time and reducing the equipment's wafer production efficiency.

[0003] The inventors of this application discovered during their research and practice that existing technologies can assign priorities to each processing chamber based on the remaining processing time of each chamber and the wafer's travel time between different processing chambers to generate a wafer scheduling scheme, ensuring smooth wafer transfer between different processing chambers. However, this scheduling method can lead to some processing chambers being idle while waiting for wafer transfer, resulting in wasted processing chamber resources, low wafer production efficiency, and poor applicability. Summary of the Invention

[0004] This application provides a wafer processing scheduling method and apparatus, which can improve the utilization rate of the chamber resources of wafer processing equipment, improve the wafer production efficiency of wafer processing equipment, and has strong applicability.

[0005] In a first aspect, this application provides a wafer processing scheduling method, comprising: acquiring the processing technology of a plurality of wafers to be processed, and determining a first wafer retrieval order based on the processing technology of each wafer to be processed to move the plurality of wafers to be processed from the loading port to the loading locking chamber; sequentially determining a target wafer to be retrieved from the plurality of wafers to be processed according to the first wafer retrieval order, and determining a plurality of candidate processing chambers matching the target processing technology from all processing chambers according to the target processing technology of the target wafer; and determining at least one target processing chamber matching the target processing technology from the plurality of candidate processing chambers according to the wafer carrying state of each of the candidate processing chambers. Based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, a processing movement path for the target wafer is generated. This process sequentially obtains the processing movement paths for each of the plurality of wafers to be processed. The target processing technology includes at least one processing step, and each processing step corresponds to one target processing chamber. The machine information of the wafer processing equipment is acquired, and processing scheduling tasks for the plurality of wafers to be processed are generated based on the machine information, the first wafer picking sequence, and the processing movement paths of each wafer. The wafer processing equipment is then controlled to execute the processing scheduling tasks to complete the processing scheduling of the plurality of wafers to be processed. In this application, multiple wafers to be processed in the first wafer picking sequence are allocated to corresponding processing chambers according to the wafer carrying status of the processing chambers, and corresponding processing scheduling tasks are generated. The wafer processing equipment is then controlled to execute the processing scheduling tasks to complete the processing scheduling of the plurality of wafers to be processed. This effectively improves the utilization rate of chamber resources in the wafer processing equipment, increases the wafer throughput of the wafer processing equipment, further improves wafer production efficiency, and has strong applicability.

[0006] In one possible implementation of the first aspect, determining the first wafer retrieval sequence based on the processing technology of each wafer to be processed, moving multiple wafers from the loading port to the loading locking chamber, includes: classifying the multiple wafers to be processed based on the processing technology of each wafer to be processed to determine the wafer sets corresponding to various processing technologies, wherein one processing technology corresponds to at least one wafer set; alternately selecting wafers to be processed from each of the wafer sets, and obtaining the first wafer retrieval sequence based on the order in which the wafers to be processed appear during the alternate selection. In this application, the first wafer retrieval sequence is determined by alternately selecting wafers to be processed from sets of wafers to be processed with different processing technologies, so as to reasonably arrange the wafer retrieval sequence of wafers to be processed with different processing technologies, allowing wafers with different processing technologies to be processed alternately, effectively improving the utilization rate of wafer processing equipment chamber resources and improving wafer production efficiency.

[0007] In one possible implementation of the first aspect, the aforementioned alternating selection of wafers to be processed from each of the aforementioned sets of wafers to be processed includes: obtaining a wafer selection ratio for alternating selection from each of the aforementioned sets of wafers to be processed based on the processing time and / or processing priority of wafers to be processed using different processing technologies in the aforementioned wafer processing equipment, and alternatingly selecting wafers to be processed from each of the aforementioned sets of wafers to be processed according to the aforementioned wafer selection ratio. In this application, by rationally arranging the processing sequence of wafers with different processing technologies, it is ensured that wafers with different processing technologies are processed alternately in the processing sequence, which can improve the utilization rate of chamber resources, reduce the waiting time of wafers with the same processing technology in the chamber, and improve wafer production efficiency.

[0008] In one possible implementation of the first aspect, the wafer carrying state includes the number of allocated wafers; determining at least one target processing chamber matching the target processing process from the plurality of candidate processing chambers based on the wafer carrying state of each of the candidate processing chambers includes: obtaining the number of allocated wafers for each of the candidate processing chambers, and determining the candidate processing chamber with the fewest allocated wafers among the plurality of candidate processing chambers as at least one target processing chamber matching the target processing process. In this application, determining the target processing chamber based on the number of allocated wafers in the candidate processing chambers can reduce the waiting time for wafers to be processed in the chamber, achieve load balancing of the processing chambers, thereby effectively improving the utilization rate of chamber resources, increasing wafer production efficiency, and demonstrating strong applicability.

[0009] In one possible implementation of the first aspect, the wafer carrying state includes the chamber task completion time; determining at least one target processing chamber matching the target processing process from the plurality of candidate processing chambers based on the wafer carrying state of each of the candidate processing chambers includes: calculating the chamber task completion time required for each of the candidate processing chambers to complete the processing of all allocated wafers; determining the shortest target chamber task completion time from the chamber task completion times of the plurality of candidate processing chambers; and determining the candidate processing chamber corresponding to the target chamber task completion time as at least one target processing chamber matching the target processing process. In this application, determining the target processing chamber based on the chamber task completion time of the candidate processing chambers can improve the effective utilization rate of the processing time of the processing chambers, thereby improving the utilization rate of chamber resources, increasing the wafer production efficiency of the wafer processing equipment, and demonstrating strong applicability.

[0010] In one possible implementation of the first aspect, the above-mentioned task of generating the processing scheduling of the plurality of wafers to be processed based on the machine information, the first wafer retrieval sequence, and the processing movement path of each wafer to be processed includes: obtaining first wafer information of the first wafer currently being moved between the loading port and the loading locking compartment of the wafer processing equipment based on the machine information; and generating a task for the first robot to move wafers between the loading port and the loading locking compartment based on the first wafer information and second wafer information of at least one wafer to be processed retrieved from the loading port by the first robot as indicated by the first wafer retrieval sequence. The first wafer processing scheduling task involves obtaining third wafer information of the second processing wafer currently being moved between the loading locking chamber and the processing chamber by the second robot arm in the wafer processing equipment, based on the aforementioned machine information. A second wafer processing scheduling task is then generated based on the third wafer information and the processing movement paths of each wafer to be processed, allowing the second robot arm to move wafers between the loading locking chamber and the processing chamber, as well as between different processing chambers. Both the first and second processing wafers are currently residing in the wafer processing equipment. The processing scheduling tasks for the multiple wafers to be processed are then generated based on the first and second wafer processing scheduling tasks. In this application, the processing scheduling tasks of the vacuum robot arm and the atmospheric robot arm are scheduled using machine information, the first wafer picking sequence, and the processing movement paths of each wafer to be processed. This improves the movement efficiency of the atmospheric and vacuum robot arms, reduces the dwell time of wafers in the wafer processing equipment, and further improves the equipment's wafer production efficiency.

[0011] In one possible implementation of the first aspect, the first wafer processing scheduling task, which generates the first wafer processing scheduling task for the first robot to move wafers between the loading port and the loading locking bay, based on the first wafer information and the second wafer information indicated by the first wafer information and the first wafer picking sequence, includes: determining the movement actions of the first robot to move each first wafer indicated by the first wafer information and the second wafer information; performing online scheduling of the movement actions of each first wafer according to the machine information and the online scheduling algorithm of the first robot to generate a task sequence of movement actions of each first wafer; and sorting the task sequences of each first wafer to obtain the first wafer processing scheduling task for the movement actions of the first robot between the loading port and the loading locking bay. In this application, the processing scheduling task of the atmospheric robot is scheduled by scheduling the movement actions of the atmospheric robot to improve the movement efficiency of the atmospheric robot, reduce the dwell time of the wafer in the wafer processing equipment, and further improve the wafer production efficiency of the equipment.

[0012] In one possible implementation of the first aspect, the second wafer processing scheduling task, which generates the second robotic arm's movement of wafers between the loading locking chamber and the processing chamber, and between different processing chambers, based on the third wafer information and the processing movement paths of each wafer to be processed, includes: determining the movement actions of the second robotic arm on each second wafer indicated by the third wafer information based on the third wafer information and the processing movement paths of each wafer to be processed; scheduling the movement actions of each second wafer online based on the machine information and the online scheduling algorithm of the second robotic arm to generate a task sequence of movement actions for each second wafer; and sorting the task sequences of each second wafer to obtain the second wafer processing scheduling task for the second robotic arm's movement actions between the loading locking chamber and the processing chamber, and between different processing chambers. In this application, the processing scheduling task of the vacuum robotic arm is scheduled by scheduling the movement actions of the vacuum robotic arm to improve the movement efficiency of the vacuum robotic arm, reduce the dwell time of the wafers in the wafer processing equipment, and further improve the wafer production efficiency of the equipment.

[0013] In one possible implementation of the first aspect, the online scheduling of the movement actions of each first wafer based on the machine information and the online scheduling algorithm of the first robot includes: determining the loading lock chamber state when the first robot moves any one of the first wafers to the loading lock chamber, the loading lock chamber state including a loading lock chamber idle state and a loading lock chamber non-idle state; when the loading lock chamber state is in the loading lock chamber non-idle state, removing any one of the first wafers to obtain the removed first wafers, and online scheduling the movement actions of the first robot moving the removed first wafers based on the machine information and the online scheduling algorithm of the first robot; when the loading lock chamber state is in the loading lock chamber idle state, online scheduling the movement actions of the first robot moving the first wafers based on the machine information and the online scheduling algorithm of the first robot. In this application, the blocking or deadlock phenomenon in the locking chamber can be effectively avoided when the atmospheric robot arms transfer the wafers into the loading locking chamber, thereby improving the movement efficiency of the atmospheric robot arms, reducing the dwell time of the wafers in the wafer processing equipment, and further improving the wafer production efficiency of the equipment.

[0014] In one possible implementation of the first aspect, the online scheduling of the movement actions of each second wafer based on the machine information and the online scheduling algorithm of the second robot includes: determining the loading lock chamber state or processing chamber state when the second robot moves any of the second wafers to the loading lock chamber or the processing chamber, wherein the loading lock chamber state includes a loading lock chamber idle state and a loading lock chamber non-idle state, and the processing chamber state includes a processing chamber idle state and a processing chamber non-idle state; when it is determined that the locking chamber state when the second robot moves any of the second wafers to the loading lock chamber is in the loading lock chamber non-idle state, or when it is determined that the second robot moves any of the second wafers to the processing chamber... When the processing chamber is in a non-idle state, one of the second wafers is removed from each of the second wafers to obtain the removed second wafers. Based on the machine information and the online scheduling algorithm of the second robot, the movement of the second robot moving the removed second wafers is scheduled online. When it is determined that the locking chamber is idle when the second robot moves any of the second wafers to the loading locking chamber, and when it is determined that the processing chamber is idle when the second robot moves any of the second wafers to the processing chamber, the movement of the second robot moving the second wafers is scheduled online based on the machine information and the online scheduling algorithm of the second robot. In this application, it is possible to effectively avoid blockage or deadlock in the loading locking chamber or processing chamber when the vacuum robot is controlling the wafer to be transferred into the loading locking chamber or processing chamber, thereby improving the movement efficiency of the vacuum robot, reducing the dwell time of the wafer in the wafer processing equipment, and further improving the wafer production efficiency of the equipment.

[0015] In one possible implementation of the first aspect, after sorting the task sequence of each of the first wafers to obtain the first wafer processing scheduling task of the first robot arm moving between the loading port and the loading locking chamber, the method further includes: calling a simulator to simulate the movement of the first robot arm according to the first wafer processing scheduling task, to obtain first simulated movement information of the first robot arm simulating the movement of each of the first wafers between the loading port and the loading locking chamber, the first simulated movement information including the simulated movement actions of the first robot arm simulating the movement of each of the first wafers; and updating the machine information based on the first simulated movement information. In this application, generating processing scheduling tasks for multiple wafers to be processed based on real-time updated machine information can achieve accurate scheduling of multiple wafers to be processed, is simple to operate, and has strong applicability.

[0016] In one possible implementation of the first aspect, after sequencing the task sequence of each of the second wafers to obtain the second wafer processing scheduling task of the second robot moving between the loading locking chamber and the processing chamber, the method further includes: calling a simulator to simulate the movement of the second robot according to the second wafer processing scheduling task, to obtain second simulated movement information of the second robot simulating the movement of each of the second wafers between the loading locking chamber and the processing chamber, the second simulated movement information including the simulated movement actions of the second robot simulating the movement of each of the second wafers; and updating the machine information based on the second simulated movement information. In this application, generating processing scheduling tasks for multiple wafers to be processed based on real-time updated machine information can achieve accurate scheduling of multiple wafers to be processed, is simple to operate, and has strong applicability.

[0017] Secondly, this application provides a wafer processing scheduling apparatus, which includes modules or units for performing a wafer processing scheduling method as described in the first aspect or any possible implementation thereof.

[0018] For example, the above-mentioned apparatus includes:

[0019] The wafer retrieval sequence acquisition module is used to acquire the processing technology of multiple wafers to be processed, and determine the first wafer retrieval sequence of the multiple wafers to be processed moving from the loading port to the loading locking chamber based on the processing technology of each of the wafers to be processed.

[0020] The determination module is used to determine the target wafer to be picked from the plurality of wafers to be processed in the first wafer picking order determined by the wafer picking order acquisition module, and to determine a plurality of candidate processing chambers that match the target processing technology from all processing chambers according to the target processing technology of the target wafer.

[0021] The processing movement path generation module is used to determine at least one target processing chamber that matches the target processing technology from the plurality of candidate processing chambers based on the wafer carrying state of each of the candidate processing chambers determined by the determination module, and to generate a processing movement path for the target wafer based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, thereby sequentially obtaining the processing movement path of each of the plurality of wafers to be processed, wherein the target processing technology includes at least one processing step, and one processing step corresponds to one target processing chamber;

[0022] The processing scheduling task generation module is used to obtain the machine information of the wafer processing equipment, generate the processing scheduling tasks of the multiple wafers to be processed based on the machine information, the first wafer picking order determined by the wafer picking order acquisition module, and the processing movement paths of each wafer to be processed obtained by the processing movement path generation module, and control the wafer processing equipment to execute the processing scheduling tasks to complete the processing scheduling of the multiple wafers to be processed.

[0023] Thirdly, this application provides a wafer processing system, including: wafer processing equipment and wafer processing scheduling equipment, wherein the wafer processing scheduling equipment includes a processor and a memory;

[0024] The processor is connected to the memory, wherein the memory is used to store program code, and the processor is used to call the program code to execute the wafer processing scheduling method provided in the first aspect and any possible implementation of the first aspect to control the wafer processing equipment to perform processing scheduling tasks to complete the processing scheduling of multiple wafers to be processed.

[0025] Fourthly, this application provides a computer-readable storage medium storing a computer program adapted to be loaded by a processor and executed by the wafer processing scheduling method. Attached Figure Description

[0026] Figure 1 This is a structural schematic diagram of the single-cluster type device provided in this application;

[0027] Figure 2 This is a flowchart illustrating the wafer processing scheduling method provided in this application;

[0028] Figure 3 This is another schematic diagram of the wafer processing scheduling method provided in this application;

[0029] Figure 4 This is another schematic diagram of the wafer processing scheduling method provided in this application;

[0030] Figure 5 This is a schematic diagram of the wafer processing scheduling device provided in this application;

[0031] Figure 6 This is a schematic diagram of the wafer processing system provided in this application. Detailed Implementation

[0032] The wafer processing scheduling method, apparatus, and system provided in this application are applicable to wafer processing scheduling, can effectively improve the resource utilization rate of wafer processing chambers, increase wafer production efficiency, and have strong applicability. The following will combine... Figures 1 to 6The wafer processing scheduling method, apparatus and system provided in this application are illustrated by examples.

[0033] To facilitate understanding of this application, the relevant knowledge involved in the implementation of this application will be described in detail before introducing the wafer processing scheduling method:

[0034] Semiconductor manufacturing equipment can include etching equipment (also called wafer fabrication equipment) and wafer fabrication scheduling equipment for processing wafers. Etching equipment includes single-bundle or multi-bundle equipment. A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. See also... Figure 1 , Figure 1 This is a structural schematic diagram of the single-cluster type device provided in this application. For example... Figure 1 As shown, the single-cluster type device includes a LoadPort (LP), an Atmosphere Robot (ATM Robot), a Vacuum Robot (VAC Robot), a LoadLock (LL), and N Process Modes (PM). The LoadPort, serving as the interface for external wafer introduction equipment, is located in an atmospheric environment and is isolated from the external environment. After the wafer is introduced into the single-cluster type device through the LoadPort, it is transferred by internal robots for further processing. These internal robots include both atmospheric and vacuum robots. The atmospheric robot, located in the atmospheric region inside the device, is responsible for transferring the wafer between the LoadPort and the LoadLock, ensuring safe and stable transfer in the atmospheric environment. The LoadLock provides a vacuum environment, maintaining a vacuum state within the device to ensure a vacuum environment is maintained during wafer loading. The vacuum robot, located in the vacuum region inside the device, is responsible for transferring the wafer between the LoadLock, different processing chambers, or within the chambers, and precisely positioning it to the processing location. The processing chamber is the main area where the equipment performs wafer processing. The equipment usually contains multiple processing chambers, which can include processing chambers with the same processing steps and processing chambers with different processing steps. Each processing chamber is equipped with specific processing steps to perform various steps of wafer processing, such as cleaning, etching, and deposition, in order to meet the processing requirements of different types of wafers.

[0035] In this application, the wafer processing flow of the cluster-type equipment includes, but is not limited to, the following steps: 1. An atmospheric robot transfers the wafer to be processed from the loading port to the loading locking chamber; 2. A vacuum robot transfers the wafer from the loading locking chamber to the processing chamber; 3. The wafer is processed in the processing chamber; 4. After the wafer processing is completed, the vacuum robot transfers the processed wafer from the processing chamber to the loading locking chamber; 5. An atmospheric robot transfers the processed wafer from the loading locking chamber to the loading port. Based on the above flow, it can be seen that the wafer goes through multiple stages during processing, such as the atmospheric robot transferring the wafer to be processed from the loading port to the loading locking chamber, the vacuum robot transferring the wafer from the loading locking chamber to the processing chamber, and the transfer of the wafer between different processing chambers. Each stage requires a certain amount of time, therefore, wafer movement scheduling is required in each stage to improve wafer production efficiency.

[0036] The wafer processing scheduling equipment includes a memory and a processor, used to control the various components within the wafer processing equipment to process the wafer. The wafer processing equipment includes processing components such as a loading port, an atmospheric robot, a vacuum robot, a loading locking chamber, and N processing chambers. These components execute specific processing tasks under the control of the wafer processing scheduling equipment. The wafer processing scheduling equipment can use the processor to call program code stored in the memory to control the atmospheric robot, vacuum robot, and other components within the wafer processing equipment to execute the aforementioned wafer processing flow, thereby completing the wafer processing scheduling. Therefore, in semiconductor manufacturing equipment, the wafer processing equipment can perform wafer processing scheduling under the control of the wafer processing scheduling equipment.

[0037] The structures involved in the following embodiments, such as the loading port, atmospheric manipulator, vacuum manipulator, loading locking chamber, and N processing chambers, can all refer to the structures mentioned in the above-mentioned related knowledge. The technical solutions in this application are clearly and completely described below. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0038] See Figure 2 , Figure 2 This is a flowchart illustrating the wafer processing scheduling method provided in this application. In this application, the wafer processing scheduling method can be executed by a wafer processing scheduling device, which can be any of the wafer processing scheduling devices mentioned above in semiconductor manufacturing equipment for processing wafers. The specific device can be determined according to the actual application scenario and is not limited here. Figure 2 As shown, the wafer processing scheduling method provided in this application (or simply the method provided in this application) may include the following steps:

[0039] S101, acquire the processing technology of multiple wafers to be processed, and determine the first wafer retrieval sequence of the multiple wafers to be processed from the loading port to the loading locking chamber based on the processing technology of each of the above-mentioned wafers to be processed.

[0040] In some feasible implementations, the wafer processing scheduling equipment can utilize wafer identification technology to identify and acquire multiple wafers to be processed in the loading port, including but not limited to the identifiers or types of the wafers to be processed, thereby acquiring the processing technology of the multiple wafers to be processed. Optionally, the wafer processing scheduling equipment can use image recognition to identify the identifier of each wafer to be processed in the loading port, thereby accurately acquiring the processing technology of the multiple wafers to be processed. In this application, the wafer processing equipment can use the processing technology of the wafers to be processed to process the wafers to be processed. The processing technology can include one or more processing steps, specifically including but not limited to cleaning, etching, ion implantation, and other processing steps. The wafer processing equipment can orderly execute one or more processing steps of the processing technology of the wafers to be processed to complete the manufacturing of semiconductor devices.

[0041] In some feasible implementations, to improve wafer production efficiency and keep the processing chambers of the wafer processing equipment as busy as possible, the wafer processing scheduling equipment can determine a first wafer retrieval sequence based on the processing technology of each wafer to be processed, whereby multiple wafers move from the loading port to the loading locking chamber. This first wafer retrieval sequence indicates the order in which each wafer leaves the loading port. In other words, the wafer processing scheduling equipment can determine the first wafer retrieval sequence for the atmospheric robot to remove wafers from the loading port based on the processing technology of each wafer. This first wafer retrieval sequence can be marked by the identifier of each wafer among the multiple wafers to be processed; the specific sequence can be determined according to the actual application scenario and is not limited here.

[0042] S102, according to the first wafer picking order, the target wafer to be picked is determined from the plurality of wafers to be processed, and a plurality of candidate processing chambers matching the target processing technology are determined from all processing chambers.

[0043] In some feasible implementations, the wafer processing scheduling equipment can determine multiple candidate processing chambers matching each of the multiple wafers to be processed according to the first wafer picking order, to ensure that each wafer to be processed can be allocated a processing chamber that meets its process requirements in subsequent processing stages. Optionally, when determining the target wafer to be picked according to the first wafer picking order, the wafer processing scheduling equipment can match the target processing technology of the target wafer with all available processing chambers in the wafer processing equipment, and screen out multiple candidate processing chambers that can meet the target processing technology requirements. These candidate processing chambers constitute the candidate processing chambers of the target wafer, and the candidate processing chambers of the target wafer can be marked by a candidate processing chamber list. When the wafer processing scheduling equipment completes the determination of candidate processing chambers for multiple wafers to be processed sequentially according to the first wafer picking order, the wafer processing scheduling equipment can determine the candidate processing chamber list for each of the multiple wafers to be processed.

[0044] In some feasible implementations, when the wafer processing scheduling equipment matches the target processing technology of the target wafer with all processing chambers in the wafer processing equipment, it can first determine each processing step in the target processing technology, and then screen all available processing chambers based on each processing step to obtain multiple candidate processing chambers that match each processing step. In other words, the multiple candidate processing chambers that match the target processing technology are precisely the sum of the multiple candidate processing chambers that match each processing step, thereby ensuring that each processing step of the target wafer can be processed in a suitable processing chamber.

[0045] S103, at least one target processing chamber matching the target processing technology is determined from the plurality of candidate processing chambers according to the wafer carrying state of each of the candidate processing chambers. The processing movement path of the target wafer is generated based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber. The processing movement paths of each wafer to be processed in the plurality of wafers to be processed are obtained in this way.

[0046] In some feasible implementations, since the wafer processing equipment can have multiple processing chambers with the same process, the multiple candidate processing chambers matched with the target wafer can include multiple candidate processing chambers with the same process. The wafer processing scheduling equipment can further determine the target processing chamber that matches the target processing process from the multiple candidate processing chambers based on the wafer carrying status of each candidate processing chamber, and allocate the target wafer to the target processing chamber for processing, thereby improving the chamber resource utilization rate of the wafer processing equipment, reducing wafer dwell time, and improving the overall wafer processing efficiency. Optionally, the target processing process includes at least one processing step, and one processing step corresponds to one target processing chamber. The wafer processing scheduling equipment can determine at least one target processing chamber that matches each processing step in the target processing process from the multiple candidate processing chambers based on the wafer carrying status of each candidate processing chamber that matches each processing step in the target processing process, and allocate the target wafer to at least one target processing chamber corresponding to each processing step. Wafer processing scheduling equipment can allocate target wafers to suitable processing chambers to control the wafer processing equipment in completing each processing step of the target processing process, thereby improving the overall processing efficiency of the wafer processing equipment. In this application, the wafer load status describes the load of the processing chamber and can be measured by various indicators. Optionally, the wafer load status can be the number of wafers allocated to the processing chamber, reflecting the number of wafers currently allocated to the processing chamber for processing; the wafer load status can also be the chamber task completion time, which refers to the time required for the processing chamber to complete the processing of all allocated wafers. It is understood that the wafer load status can also be other information that can be used to describe the load of the processing chamber, such as the processing efficiency of the processing chamber, which can be determined according to the actual application scenario and is not limited here.

[0047] In some feasible implementations, the wafer processing scheduling equipment can follow the minimum load principle to determine the target processing chamber that matches the target processing process from multiple candidate processing chambers based on the wafer load status of each candidate processing chamber. This ensures that the determined target processing chamber can be effectively utilized, thereby improving the chamber resource utilization efficiency of the wafer processing equipment. Optionally, the wafer processing scheduling equipment can obtain the number of allocated wafers in each candidate processing chamber and determine the candidate processing chamber with the fewest allocated wafers as the target processing chamber that matches the target processing process. That is, when the wafer processing scheduling equipment determines the target processing chamber for processing the target wafer, it can consider the current task load (number of allocated wafers) of each candidate processing chamber and obtain the number of wafers currently allocated to be processed in each candidate processing chamber in real time to select a suitable target processing chamber. This helps to balance the utilization of the chamber resources of the wafer processing equipment, reduce the dwell time of wafers in the wafer processing equipment, and improve wafer processing efficiency. Furthermore, since the target processing technology includes at least one processing step, the wafer processing scheduling equipment can obtain the number of allocated wafers in the candidate processing chambers corresponding to each processing step of the target wafer, and select the candidate processing chamber with the fewest allocated wafers for each processing step as the matching target processing chamber, thereby determining at least one target processing chamber that matches the target processing technology. In this way, the wafer processing scheduling equipment can effectively allocate the target wafer to the corresponding target processing chamber and control the wafer processing equipment to efficiently complete the processing of the target wafer according to each step.

[0048] In some feasible implementations, the wafer processing scheduling equipment follows the principle of minimum load to determine the target processing chamber. Specifically, it can calculate the chamber task completion time required for each candidate processing chamber to complete the processing of all assigned wafers, determine the shortest target chamber task completion time from the chamber task completion times of each candidate processing chamber, and determine the candidate processing chamber corresponding to the target chamber task completion time as the target processing chamber. That is, when determining the target processing chamber for processing the target wafer, the wafer processing scheduling equipment considers the estimated completion time of the current task load of each candidate processing chamber (chamber task completion time) and predicts the chamber task completion time of each candidate processing chamber to select a suitable target processing chamber. Optionally, the wafer processing scheduling equipment can simulate each candidate processing chamber processing all assigned wafers using a simulator to calculate the chamber task completion time of each candidate processing chamber. Alternatively, the wafer processing scheduling equipment can also use a learning algorithm to calculate the chamber task completion time required for each candidate processing chamber to complete the processing of all assigned wafers. Therefore, when determining the target processing chamber for processing the target wafer, the wafer processing scheduling equipment combines simulator simulation and learning algorithms to analyze the processing efficiency of the task load of each candidate processing chamber, selecting the optimal target processing chamber. This helps balance the utilization of the wafer processing equipment's chamber resources, reduce the wafer's dwell time in the equipment, and improve wafer processing efficiency. Furthermore, since the target processing technology includes at least one processing step, the wafer processing scheduling equipment can obtain the chamber task completion time of the candidate processing chambers corresponding to each processing step of the target wafer, and select the candidate processing chamber with the shortest chamber task completion time for each processing step as the matching target processing chamber, thus determining at least one target processing chamber matching the target processing technology. In this way, the wafer processing scheduling equipment can effectively allocate the target wafer to the corresponding target processing chamber, ensuring efficient processing of the target wafer according to each process step. It is understandable that the wafer processing scheduling equipment can choose an appropriate method based on the actual situation to determine the target processing chamber following the minimum load principle, thereby achieving the optimal processing chamber allocation strategy.

[0049] In some feasible implementations, when the wafer processing scheduling equipment determines the target processing chamber according to the minimum load principle, the target processing chamber of the target wafer can also be determined using the following formula:

[0050]

[0051] Among them, PM selected For the target processing chamber of the target wafer, Load pm For the wafer carrying state of the candidate processing chamber, PM matchedis a list of candidate processing chambers for the target wafer, and pm is each candidate processing chamber in the list of candidate processing chambers for the target wafer.

[0052] As can be understood from the above, once a target processing chamber matching the target processing technology is identified, the wafer processing scheduling equipment can allocate the target wafer to the target processing chamber and update the wafer loading status of the target processing chamber. Therefore, through this allocation method, the wafer processing scheduling equipment can sequentially process all wafers to be processed in the first wafer picking sequence, sequentially allocating each wafer to its corresponding target processing chamber. This dynamically allocates wafers to the processing chamber with the lowest workload, effectively balancing the load resources of each processing chamber. This prevents excessive load on certain processing chambers in subsequent processing stages, avoiding excessive wafer dwell time and effectively improving the overall wafer processing efficiency of the wafer processing equipment.

[0053] In some feasible implementations, the wafer processing scheduling equipment generates a processing movement path for the target wafer based on the wafer processing sequence corresponding to the target processing technology and the target processing chamber. The wafer processing sequence is determined according to the execution order of each processing step in the target processing technology, which dictates that the target wafer moves to the target processing chamber in a specific order during processing. Therefore, the processing movement path of the target wafer records the movement order and position of the target wafer between various target processing chambers. The wafer processing equipment moves the target wafer sequentially to the target processing chamber corresponding to each processing step according to the wafer processing sequence; this process forms the processing movement path of the target wafer. For example, if the processing steps are sequentially 1, 2, and 3, and their corresponding target processing chambers are a, b, and c, respectively, then the processing movement path of the target wafer can be described as: target chamber a → target chamber b → target chamber c. This processing movement path indicates that the target wafer moves in an orderly manner according to the wafer processing sequence during the processing, ensuring that each processing step is completed in its corresponding target processing chamber to complete the entire processing of the target wafer. Therefore, this application can generate such a processing movement path to instruct the atmospheric and vacuum manipulators in the wafer processing equipment to move the wafer to be processed, ensuring that each processing step is completed in its corresponding target processing chamber. This effectively balances the chamber resources of the wafer processing equipment, reduces the wafer's dwell time in the wafer processing equipment, and improves wafer processing efficiency.

[0054] S104: Obtain the machine information of the wafer processing equipment, generate the processing scheduling task of the multiple wafers to be processed based on the machine information, the first wafer picking order and the processing movement path of each wafer to be processed, and control the wafer processing equipment to execute the processing scheduling task to complete the processing scheduling of the multiple wafers to be processed.

[0055] In some feasible implementations, the equipment information includes the equipment identifier, performance parameters (such as temperature and pressure), and operating status (such as running, standby, or fault) of the wafer processing equipment, reflecting its operating status and capabilities. The wafer processing scheduling equipment can utilize the equipment information, the first wafer pick-up sequence, and the processing movement paths of each wafer to be processed to generate wafer processing scheduling tasks for each wafer. These tasks include movement tasks to be performed by the vacuum robot and the atmospheric robot. These tasks instruct the atmospheric or vacuum robot on the specific movement actions of the wafer to be processed. The wafer processing scheduling equipment can control the atmospheric and vacuum robots in the wafer processing equipment to perform corresponding movement actions according to the scheduling tasks, moving the wafers to appropriate positions for processing, thereby completing the processing scheduling of multiple wafers. In practical applications, to improve the accuracy of wafer processing scheduling tasks, the wafer processing scheduling equipment can periodically acquire the current machine information of the wafer processing equipment and, in conjunction with the first wafer picking order and the processing movement path of each wafer to be processed, perform multiple iterative cycles to generate processing scheduling tasks for the wafers to be processed, until processing scheduling tasks for all wafers to be processed are generated based on the latest machine information. Therefore, in this application, the wafer processing scheduling equipment can control the movement of the atmospheric and vacuum robotic arms on the wafers to be processed by scheduling the movement tasks of the atmospheric and vacuum robotic arms, thereby improving the movement efficiency of the atmospheric and vacuum robotic arms, reducing the wafer dwell time on the equipment, increasing the wafer throughput of the wafer processing equipment, and further improving the wafer production efficiency of the equipment.

[0056] In this application, the wafer processing scheduling equipment can allocate multiple wafers to be processed in the first wafer picking sequence to the corresponding processing chambers according to the wafer carrying status of the processing chambers, and generate corresponding processing scheduling tasks to complete the processing scheduling of multiple wafers to be processed. It can be seen that the wafer processing scheduling equipment can effectively improve the utilization rate of chamber resources in the wafer processing equipment, increase the wafer throughput of the wafer processing equipment, and further improve the wafer production efficiency of the wafer processing equipment in the process of wafer processing scheduling, and has strong applicability.

[0057] See Figure 3 , Figure 3 This is another schematic diagram of the wafer processing scheduling method provided in this application. For example... Figure 3 As shown, the wafer processing scheduling method provided in this application may include the following steps:

[0058] S201, based on the processing technology of each of the above-mentioned wafers to be processed, the above-mentioned wafers to be processed are classified to determine the set of wafers to be processed corresponding to each processing technology.

[0059] In some feasible implementations, the set of wafers to be processed can be a set of jobs. The wafer processing scheduling device can divide multiple wafers to be processed into multiple job sets. Each job set can include wafers to be processed with the same processing technology, or information representing wafers to be processed with the same processing technology, such as identifiers of wafers to be processed with the same processing technology. The processing technology of the wafers to be processed in multiple job sets can be the same. That is, wafers to be processed with the same processing technology can be divided into one or more job sets. This classification method can improve the efficiency of subsequent sorting processing, making the determination of the wafer picking order more efficient. Furthermore, the wafer processing scheduling device sorts the multiple job sets determined above according to a set sorting method to form a set sorting sequence. Optionally, the set sorting method includes merging and sorting of sets with the same processing technology, cross sorting of sets with the same processing technology, Johnson-Bellman rule sorting, etc., which can effectively improve the efficiency of determining the wafer picking order.

[0060] S202, alternately select wafers to be processed from each of the aforementioned sets of wafers to be processed, and obtain a first wafer retrieval order based on the order in which each wafer to be processed appears in the alternate selection, so that the plurality of wafers to be processed move from the aforementioned loading port to the aforementioned loading locking chamber.

[0061] In some feasible implementations, "alternating selection" can refer to the behavior of selecting wafers in turn among multiple sets. The wafer processing scheduling device's ability to alternately select wafers from various sets of wafers to be processed can be understood as the device selecting wafers in turn from each set, achieving a zipper-like wafer selection method. For example, the wafer processing scheduling device can first select a wafer from the first set of wafers to be processed, then select the next wafer from the second set, then the next wafer from the third set, and so on, to achieve alternating selection of wafers from each set. The wafer processing scheduling device can determine the first wafer picking order based on the order in which the wafers appear during the alternating selection.

[0062] In some feasible implementations, the wafer processing scheduling equipment can also select wafers to be processed from different processing technology job sets in turn, and determine the first wafer picking order of multiple wafers to be processed according to the order in which they appear during the selection process. Optionally, the wafer processing scheduling equipment selects wafers to be processed for different processing technologies in turn from the wafer sets corresponding to different processing technologies according to the above-determined set sorting sequence, generates a wafer sequence, and then determines the first wafer picking order according to the order in which each wafer to be processed appears in the wafer sequence. It is evident that this method allows the atmospheric robot to alternately pick up wafers of different processing technologies during the wafer picking process from the loading port, avoiding congestion of wafers of the same processing technology during transmission, improving the utilization rate of the wafer processing equipment's chamber resources, increasing the wafer production efficiency of the wafer processing equipment, and enabling the atmospheric robot to efficiently handle wafers to be processed for various processing technologies.

[0063] In some feasible implementations, the wafer processing scheduling equipment can also alternately select wafers to be processed from the sets of wafers to be processed corresponding to various processing technologies according to the wafer selection ratio, and then determine the first wafer picking order based on the order in which the alternately selected wafers appear. It is understood that the wafer selection ratio is used to indicate the proportion of wafers selected from the sets of wafers to be processed corresponding to various processing technologies, so as to reasonably arrange the wafer picking order of wafers for different processing technologies. This allows wafers of different processing technologies to be processed alternately in the processing order, avoiding waste of chamber resources due to too many or too few wafers for a certain processing technology, improving the chamber resource utilization rate of the wafer processing equipment, and reducing the waiting time in the processing chamber.

[0064] In some feasible implementations, the wafer processing scheduling equipment determines the wafer selection ratio in the following ways: 1. The wafer processing scheduling equipment determines the wafer selection ratio by alternately selecting wafers from each set of wafers to be processed based on the processing time of wafers to be processed using different processing technologies in the wafer processing equipment; 2. The wafer processing scheduling equipment determines the wafer selection ratio by alternately selecting wafers from each set of wafers to be processed based on the processing priority of wafers to be processed using different processing technologies in the wafer processing equipment; 3. The wafer processing scheduling equipment determines the wafer selection ratio by alternately selecting wafers from each set of wafers to be processed based on the processing time and processing priority of wafers to be processed using different processing technologies in the wafer processing equipment. In this application, processing time refers to the length of time required for the wafer to be processed to complete the entire processing flow in the vacuum environment of the wafer processing equipment, including wafer movement time, wafer processing time and wafer waiting time. It can be understood that the processing time may vary for wafers with different processing technologies. Processing priority refers to the priority setting of the wafer to be processed in the processing sequence. According to the importance of different processing technologies, the corresponding processing priority can be set for the corresponding wafer to be processed so that the wafer processing equipment can process the wafers with different processing technologies in sequence according to the processing priority.

[0065] For example, the wafer processing scheduling equipment determines the wafer selection ratio by alternatingly selecting wafers from each set of wafers to be processed based on the processing time of wafers to be processed using different processing technologies in the wafer processing equipment. Specifically, the wafer processing scheduling equipment determines the wafer selection ratio as the inverse ratio of the processing time of wafers to be processed using different processing technologies. For example, when the processing time of the first processing technology is 'a', the processing time of the second processing technology is 'b', and the processing time of the third processing technology is 'c', then the wafer selection ratio determined based on these processing times can be c:b:a. It is evident that the longer the processing time, the smaller the proportion of wafers selected by the wafer processing scheduling equipment for the corresponding processing technology should be. Optionally, the wafer processing scheduling equipment determines the wafer selection ratio by alternatingly selecting wafers from each set of wafers to be processed based on the processing priority of wafers to be processed using different processing technologies in the wafer processing equipment. Specifically, the wafer processing scheduling equipment determines the wafer selection ratio as the weight ratio of the processing priorities of wafers to be processed using different processing technologies. Optionally, the wafer processing scheduling equipment determines the wafer selection ratio for alternatingly selecting wafers from each set of wafers to be processed based on the processing time and priority of wafers processed using different processing technologies in the wafer processing equipment. Specifically, the wafer processing scheduling equipment can calculate the comprehensive weight of wafers to be processed using different processing technologies using the processing time and priority, and determine the wafer selection ratio based on the comprehensive weight ratio of wafers to be processed using different processing technologies. Therefore, the wafer processing scheduling equipment can determine the first wafer picking order by alternatingly selecting a corresponding proportion of wafers to be processed from each set of wafers to be processed according to the wafer selection ratio determined above. For example, when multiple sets of wafers to be processed correspond to three processing technologies, and the wafer selection ratio of the first, second, and third processing technologies is c:b:a, then the wafer processing scheduling equipment can select c wafers to be processed from the set of wafers to be processed corresponding to the first processing technology, b wafers to be processed from the set of wafers to be processed corresponding to the second processing technology, a wafers to be processed from the set of wafers to be processed corresponding to the third processing technology, and so on, selecting wafers to be processed in turn from the sets of wafers to be processed corresponding to the three processing technologies. The first wafer picking order determined based on the order in which the wafers to be processed appear in this alternating selection is c wafers to be processed - b wafers to be processed - a wafers to be processed - c wafers to be processed...

[0066] S203, according to the first wafer picking order, the target wafer to be picked is determined from the plurality of wafers to be processed, and a plurality of candidate processing chambers matching the target processing technology are determined from all processing chambers.

[0067] S204, based on the wafer carrying state of each of the candidate processing chambers, a target processing chamber matching the target processing technology is determined from the plurality of candidate processing chambers. Based on the wafer processing sequence corresponding to the target processing technology and the target processing chamber, a processing movement path for the target wafer is generated. In this way, the processing movement paths of each wafer to be processed in the plurality of wafers to be processed are obtained in sequence.

[0068] S205, obtain the machine information of the wafer processing equipment, generate the processing scheduling task of the multiple wafers to be processed according to the machine information, the first wafer picking order and the processing movement path of each wafer to be processed, and control the wafer processing equipment to execute the processing scheduling task to complete the processing scheduling of the multiple wafers to be processed.

[0069] In some feasible implementations, the specific implementation methods of steps S203 to S205 can be found in the above description. Figure 2 The specific implementation methods of steps S102 to S204 provided in the embodiments will not be described in detail here.

[0070] In this application, the wafer processing scheduling equipment can alternately select wafers to be processed from a set of wafers to be processed with different processing technologies to determine the first wafer picking order, so as to reasonably arrange the wafer picking order of wafers to be processed with different processing technologies, so that wafers with different processing technologies can be processed alternately, effectively improving the utilization rate of the wafer processing equipment chamber resources, improving the wafer throughput and wafer production efficiency of the wafer processing equipment.

[0071] See Figure 4 , Figure 4 This is another schematic diagram of the wafer processing scheduling method provided in this application. For example... Figure 4 As shown, the wafer processing scheduling method provided in this application may include the following steps:

[0072] S301, acquire the processing technology of multiple wafers to be processed, and determine the first wafer retrieval sequence of the multiple wafers to be processed from the loading port to the loading locking chamber based on the processing technology of each of the wafers to be processed.

[0073] S302, according to the first wafer picking order, the target wafer to be picked is determined from the plurality of wafers to be processed, and a plurality of candidate processing chambers matching the target processing technology are determined from all processing chambers.

[0074] S303, based on the wafer carrying state of each of the candidate processing chambers, at least one target processing chamber matching the target processing technology is determined from the plurality of candidate processing chambers. Based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, a processing movement path for the target wafer is generated, thereby sequentially obtaining the processing movement paths for each of the plurality of wafers to be processed.

[0075] In some feasible implementations, the specific implementation methods of steps S301 to S303 can be found in the above description. Figure 2 The specific implementation methods of steps S101 to S103 provided in the embodiments will not be described in detail here.

[0076] S304: Based on the machine information, obtain the first wafer information of the first processed wafer that the first robot arm in the wafer processing equipment is currently moving between the loading port and the loading locking chamber. Based on the first wafer information and the second wafer information of at least one wafer to be processed taken out by the first robot arm from the loading port as indicated by the first wafer picking sequence, generate a first wafer processing scheduling task for the first robot arm to move the wafer between the loading port and the loading locking chamber.

[0077] In some feasible implementations, the first robotic arm can be an atmospheric robotic arm in the wafer processing equipment, responsible for removing the wafer to be processed from the loading port and moving the first wafer to be processed between the loading port and the loading locking compartment to move the wafer to a designated position for placement awaiting further processing. It is understood that the atmospheric robotic arm is used not only to remove the wafer to be processed from the loading port but also for moving the first wafer to be processed residing in the wafer processing equipment. The wafer to be processed refers to the wafer currently placed in the loading port that has not yet been removed from the loading port by the atmospheric robotic arm and transferred into the wafer processing equipment. The first wafer to be processed refers to the wafer that has already been transferred into the wafer processing equipment from the loading port by the atmospheric robotic arm. In other words, the first wafer to be processed is the wafer residing in the wafer processing equipment and processed by moving it between the loading port and the loading locking compartment using the atmospheric robotic arm. For example, the first wafer to be processed can be the wafer moved from the loading port to the loading locking compartment by the atmospheric robotic arm, or it can be the wafer moved from the loading locking compartment to the loading port by the atmospheric robotic arm. Therefore, when scheduling the movement of the atmospheric robotic arm to the wafers to be processed, it is also necessary to coordinate and schedule the movement of the atmospheric robotic arm to the first wafer to be processed residing in the wafer processing equipment. This ensures that each wafer can smoothly reach the designated position according to the scheduling requirements and undergo subsequent processing, thereby improving the movement efficiency of the atmospheric robotic arm. Furthermore, the wafer processing scheduling equipment uses first wafer information and second wafer information to identify the wafers to be processed and the first wafer to be processed that the atmospheric robotic arm needs to move. Optionally, the first wafer information refers to the wafer identifier of the first wafer to be processed that the atmospheric robotic arm is currently moving between the loading port and the loading locking chamber, while the second wafer information refers to the wafer identifier of the wafer to be processed that the atmospheric robotic arm has taken out from the loading port according to the first wafer picking sequence. As can be seen, the first wafer information and the second wafer information cover the wafer information of the wafer that the atmospheric robot needs to move, including the wafer information (such as wafer identification) of the wafer that is moving and the wafer that is about to be moved. Thus, the wafer processing scheduling equipment can use the first wafer information and the second wafer information to comprehensively schedule the movement actions that the atmospheric robot needs to perform in the wafer processing equipment, improve the movement efficiency of the atmospheric robot, and thus improve the wafer production efficiency of the wafer processing equipment.

[0078] In some feasible implementations, the wafer processing scheduling equipment obtains first wafer information based on the equipment's machine information. Optionally, since the machine information records information reflecting the operating status and capabilities of the wafer processing equipment, the wafer processing scheduling equipment can determine the first wafer being processed by the atmospheric robot arm through the machine information, thereby obtaining the first wafer information. Furthermore, the wafer processing scheduling equipment can also determine the second wafer information of at least one wafer to be processed taken from the loading port by the atmospheric robot arm based on a first wafer picking sequence. Optionally, the first wafer picking sequence refers to the order in which the atmospheric robot arm takes out wafers to be processed from the loading port. Therefore, the wafer processing scheduling equipment can use the first wafer picking sequence to determine the second wafer information of one or more wafers to be processed taken out from the loading port by the atmospheric robot arm from among multiple wafers to be processed in the loading port.

[0079] In some feasible implementations, the wafer processing scheduling equipment determines the first wafer processing scheduling task based on the first wafer information and the second wafer information by: determining the movement actions of the atmospheric robot arm to move each first wafer indicated by the first wafer information and the second wafer information; then, performing online scheduling of the movement actions of each first wafer according to the machine information and the online scheduling algorithm of the atmospheric robot arm to generate a task sequence of movement actions for each first wafer; and sorting the task sequences of each first wafer to obtain the first wafer processing scheduling task of the atmospheric robot arm moving between the loading port and the loading locking chamber. Optionally, the operating rules of the atmospheric robot arm specify the movement actions that the atmospheric robot arm can perform, which involve moving from one position to another (movement path undetermined), etc. Then, the wafer processing scheduling equipment can determine the movement actions of the atmospheric robot arm to move each first wafer to a designated position according to the operating rules of the atmospheric robot arm. For example, the movement action could be moving the first wafer from its current position to a second designated position. To improve the efficiency of the atmospheric robot's movement, the wafer processing scheduling equipment can utilize machine information and the atmospheric robot's online scheduling algorithm to optimize the task sequence for each movement. Optionally, the wafer processing scheduling equipment can calculate the optimal path (e.g., shortest path) for each movement using the atmospheric robot's online scheduling algorithm, and generate a task sequence for each movement based on the optimal path. This ensures that the atmospheric robot can complete each movement for each first wafer according to the optimal path. Each task sequence describes the specific steps (specific movement path) required for the atmospheric robot to perform each movement. Finally, these task sequences are sorted to form the first wafer processing scheduling task. This ensures that when the wafer processing scheduling equipment schedules the atmospheric robot through the first wafer processing scheduling task, it can guarantee that the atmospheric robot completes each movement for each first wafer using the optimal path, improving the atmospheric robot's movement efficiency and thus increasing the wafer production efficiency of the wafer processing equipment.

[0080] In some feasible implementations, when the wafer processing scheduling equipment sorts the task sequences of each first wafer, it can sort these task sequences according to the following methods: 1. Priority sorting: First, sort the high-priority wafers. High-priority wafers include wafers that are about to violate dwell time constraints, wafers that meet safety constraints, or wafers that are manually designated as high-priority; 2. Efficiency sorting: For task sequences with the same priority, the algorithm outputs the sorting result of the task that satisfies the constraints and has the highest processing efficiency, and sorts the task sequences according to the sorting result. The algorithms that can be used include rule-based algorithms, heuristic algorithms, optimization algorithms, and learning optimization algorithms.

[0081] In some feasible implementations, when the atmospheric robot performs a task sequence to transfer a new wafer into the loading and locking chamber, the loading and locking chamber cannot receive new wafers during the period when the new wafer is being transferred. If the atmospheric robot continues to transfer new wafers into the loading and locking chamber, the loading and locking chamber will experience blockage or deadlock. Therefore, to avoid blockage or deadlock in the loading and locking chamber, the wafer processing scheduling equipment can control the atmospheric robot to move the wafers into the loading and locking chamber. In some feasible implementations, the wafer processing scheduling equipment performs online scheduling of the movement of each first wafer based on machine information and the online scheduling algorithm of the atmospheric robot. Specifically, the wafer processing scheduling equipment determines the loading and locking chamber state when the atmospheric robot moves any first wafer (e.g., first wafer 1) to the loading and locking chamber. The loading and locking chamber state includes an idle state and a non-idle state. When the loading and locking chamber state is in the non-idle state, the aforementioned first wafer (e.g., first wafer 1) is removed from the first wafers to obtain the removed first wafers. Then, based on the machine information and the online scheduling algorithm of the atmospheric robot, the movement of the removed first wafers by the atmospheric robot is scheduled online. When the loading and locking chamber state is in the idle state, the movement of the first wafers by the atmospheric robot is scheduled online based on the machine information and the online scheduling algorithm of the atmospheric robot. Therefore, the wafer processing scheduling equipment can control the wafer transfer to the loading and locking chamber based on the state of the loading and locking chamber.

[0082] In some feasible implementations, the loading lock chamber has two states: an idle state and a non-idle state. An idle state indicates that no new wafers are currently being loaded into the loading lock chamber, meaning the atmospheric robot can load the first wafer. A non-idle state indicates that a new wafer is currently being loaded into the loading lock chamber. To avoid blockage or deadlock in the loading lock chamber, the atmospheric robot should cancel / pause its current movement of the first wafer into the loading lock chamber until the loading lock chamber state returns to idle. Therefore, to avoid blockage or deadlock in the loading lock chamber, the wafer processing scheduling equipment can adjust the various first wafers that the atmospheric robot currently needs to move, such as deleting conflicting first wafers (which could be potentially blocking wafers), so that the atmospheric robot will not currently move any conflicting first wafers. Optionally, the wafer processing scheduling equipment can predict the loading and locking state of the loading and locking chamber when the atmospheric robot moves any first wafer (e.g., first wafer 1) to the loading and locking chamber based on a time-accumulation rule method or a statistical learning method. When it is determined that the loading and locking chamber is in a non-idle state, the wafer processing scheduling equipment removes any first wafer (e.g., first wafer 1) from the list of first wafers to obtain the removed first wafers. Based on the machine information and the online scheduling algorithm of the atmospheric robot, the equipment performs online scheduling of the movement of the removed first wafers. The process of online scheduling of the movement of the removed first wafers can be found in the above description of the specific process of online scheduling of the movement of each first wafer by the wafer processing scheduling equipment. When it is determined that the loading and locking chamber is in an idle state, the wafer processing scheduling equipment performs online scheduling of the movement of each first wafer by the atmospheric robot based on the machine information and the online scheduling algorithm of the atmospheric robot. The online scheduling process of the movement of each first wafer by the atmospheric robot can be found in the above description of the specific process of the wafer processing scheduling equipment performing online scheduling of the movement of each first wafer.

[0083] In some feasible embodiments, the wafer processing scheduling equipment can also invoke a simulator to simulate the movement of the atmospheric robot arm according to the first wafer processing scheduling task. This allows for the acquisition of first simulated movement information of the atmospheric robot arm simulating the movement of each first wafer between the loading port and the loading locking chamber. This first simulated movement information includes the simulated movement actions of the atmospheric robot arm simulating the movement of each first wafer. The simulator can be implemented using various methods such as state machines and discrete-time simulation. Furthermore, the first simulated movement information can record detailed operational information of the atmospheric robot arm throughout the simulation process, including the execution time of each simulated movement action. The wafer processing scheduling equipment can generate output information for visualization based on this first simulated movement information, such as outputting a Gantt chart of the movement task. This allows users to intuitively understand the execution process of the first wafer processing scheduling task and further optimize it. This makes the simulation process of the wafer processing equipment more transparent and controllable, and makes the wafer production process more reliable, efficient, and economical, thereby improving the wafer production efficiency of the wafer processing equipment. In this application, the first wafer processing scheduling task can be obtained through the above algorithm to guide the production of wafer processing equipment, effectively improving the resource utilization of the equipment, thereby reducing the wafer dwell time and increasing the wafer throughput of the equipment. At the same time, the actual situation of the machine can be dynamically synchronized to the simulator during the wafer processing process to achieve rapid rescheduling. This scheduling scheme that comprehensively considers the uncertainty factors is more suitable for dealing with various challenges in the actual processing process and improving production efficiency and stability.

[0084] In some feasible embodiments, the wafer processing scheduling equipment can also update the machine information based on the first simulated movement information, so that the simulator can dynamically consider the time consumption of various equipment and processes in real time during the simulation process. These times include, but are not limited to: robot arm movement time, wafer processing time, chamber cleaning time, wafer waiting time, etc., so as to more accurately simulate the actual processing process and improve the overall production efficiency of the wafer processing equipment.

[0085] S305, based on the machine information, obtain the third wafer information of the second processing wafer that the second robot arm in the wafer processing equipment is currently moving between the loading locking chamber and the processing chamber and between different processing chambers, and generate a second wafer processing scheduling task for the second robot arm to move the wafer between the loading locking chamber and the processing chamber and between different processing chambers.

[0086] In some feasible implementations, the second robotic arm can be a vacuum robotic arm in a wafer processing apparatus, used to move the wafer between the loading and locking chamber and the processing chamber to move the wafer to a designated position for further processing. It is understood that the wafer moved by the vacuum robotic arm between the loading and locking chamber and the processing chamber can serve as the second processing wafer; that is, the second processing wafer is a wafer already residing in the wafer processing apparatus and moved by the vacuum robotic arm to a specific position between the loading and locking chamber and the processing chamber for processing. Specifically, the vacuum robotic arm moves the second processing wafer from processing chamber a to processing chamber b for placement, so that processing chamber b can process the second processing wafer. Furthermore, the wafer processing scheduling equipment uses third-party wafer information to identify the second processing wafer that the vacuum robot needs to move. Optionally, the third-party wafer information refers to the wafer identifier of the second processing wafer that the vacuum robot is currently moving between the loading locking chamber and the processing chamber. In other words, the third-party wafer information indicates the second processing wafer that the vacuum robot is currently moving. This second processing wafer can be the second processing wafer already on the vacuum robot, or it can have already moved to the loading locking chamber or the processing chamber, or it can be moving between different processing chambers. Therefore, the third-party wafer information encompasses the wafer information (such as the wafer identifier) ​​of the wafer that the vacuum robot currently needs to move. Thus, the wafer processing scheduling equipment can comprehensively schedule the movement actions that the vacuum robot needs to perform based on the third-party wafer information and the processing movement paths of each wafer to be processed, improving the movement efficiency of the vacuum robot and consequently increasing the wafer production efficiency of the wafer processing equipment.

[0087] In some feasible implementations, the wafer processing scheduling equipment obtains third wafer information based on the machine information. Optionally, since the machine information records information that reflects the operating status and capabilities of the wafer processing equipment, the wafer processing scheduling equipment can use the machine information to determine the second wafer currently being processed by the vacuum robot between the loading locking chamber and the processing chamber, as well as between different processing chambers, thereby obtaining the third wafer information. The wafer processing scheduling equipment generating a second wafer processing scheduling task based on the third wafer information and the processing movement paths of each wafer to be processed can be as follows: the wafer processing scheduling equipment can determine the movement actions of the vacuum robot to move each second wafer indicated by the third wafer information based on the third wafer information and the processing movement paths of each wafer to be processed. These movement actions include moving each second wafer according to the order and position recorded in the processing movement path, wherein the second wafer may include the aforementioned second wafer being processed. Optionally, since the processing movement path of the wafer to be processed records the movement sequence and position of the wafers, the wafer processing scheduling equipment can use this information to analyze the positional changes of each second wafer during the processing. These positional changes include moving from one processing chamber to another, or from a processing chamber to a loading and locking chamber, thereby determining the movement actions of the vacuum robot to move each second wafer. These movement actions include moving each second wafer from one processing chamber to another, or from a processing chamber to a loading and locking chamber (the movement path is not determined).

[0088] In some feasible implementations, to improve the movement efficiency of the vacuum robot's motion actions, the wafer processing scheduling equipment can perform online scheduling of the movement actions of each second wafer based on machine information and the vacuum robot's online scheduling algorithm. This generates a task sequence for each second wafer's movement actions, and the task sequences are sorted to obtain the second wafer processing scheduling task for the vacuum robot's movement between the loading locking chamber and the processing chamber. Optionally, the wafer processing scheduling equipment can calculate the optimal path (e.g., shortest path) for each movement action using the vacuum robot's online scheduling algorithm, and generate a task sequence for each movement action based on the optimal path. This ensures that the vacuum robot can complete each movement action on each second wafer according to the optimal path. Each task sequence describes the specific steps (specific movement path) required for the vacuum robot to perform each movement action. Finally, these task sequences are sorted to form the second wafer processing scheduling task. This ensures that when the wafer processing scheduling equipment schedules the vacuum robot through the second wafer processing scheduling task, it can guarantee that the vacuum robot completes each movement action on each second wafer according to the optimal path, improving the vacuum robot's movement efficiency and thus increasing the wafer production efficiency of the wafer processing equipment.

[0089] In some feasible implementations, when the wafer processing scheduling equipment sorts the task sequences of each second wafer, it can sort these task sequences according to the following methods: 1. Priority sorting: First, sort the high-priority wafers. High-priority wafers include wafers that are about to violate dwell time constraints, wafers that meet safety constraints, or wafers that are manually designated as high-priority; 2. Efficiency sorting: For task sequences of the same priority, the algorithm outputs the sorting result of the task that satisfies the constraints and has the highest processing efficiency, and sorts the task sequences according to the sorting result. The algorithms that can be used include rule-based algorithms, heuristic algorithms, optimization algorithms, and learning optimization algorithms.

[0090] In some feasible implementations, when the vacuum robot executes a task sequence to transfer a new wafer into the loading lock chamber or processing chamber, the loading lock chamber or processing chamber cannot receive the new wafer during the period when the new wafer is being transferred into the loading lock chamber or processing chamber. If the vacuum robot continues to transfer a new wafer into the loading lock chamber or processing chamber, the loading lock chamber or processing chamber will become blocked or deadlocked. Therefore, in order to avoid the loading lock chamber or processing chamber from becoming blocked or deadlocked, the wafer processing scheduling equipment needs to control the vacuum robot to control the transfer of the wafer into the loading lock chamber or processing chamber. In some feasible implementations, the wafer processing scheduling equipment performs online scheduling of the movement of each second wafer based on the machine information and the online scheduling algorithm of the vacuum robot. Specifically, the wafer processing scheduling equipment determines the loading lock chamber state or processing chamber state when the vacuum robot moves any second wafer (e.g., second wafer 1) to the loading lock chamber or processing chamber. The loading lock chamber state includes an idle state and a non-idle state, and the processing chamber state includes an idle state and a non-idle state. When it is determined that the locking chamber state when the vacuum robot moves any second wafer (e.g., second wafer 1) to the loading lock chamber is in a non-idle state, or when it is determined that the vacuum robot moves any second wafer (e.g., second wafer 1) to the loading lock chamber, the vacuum robot moves the second wafer (e.g., second wafer 1) to the loading lock chamber. When the processing chamber is not idle when the second wafer 1 is moved to the processing chamber, any one of the aforementioned second wafers (e.g., second wafer 1) is removed from the existing second wafers to obtain the remaining second wafers. Based on the machine information and the online scheduling algorithm of the vacuum robot, the movement of the removed second wafers by the vacuum robot is scheduled online. When it is determined that the locking chamber is idle when the vacuum robot moves any second wafer to the loading locking chamber, and when it is determined that the processing chamber is idle when the vacuum robot moves any second wafer to the processing chamber, the movement of the vacuum robot to the remaining second wafers is scheduled online based on the machine information and the online scheduling algorithm of the vacuum robot. Therefore, the wafer processing scheduling equipment can determine whether the vacuum robot will transfer the wafer to the loading locking chamber or the processing chamber based on the state of the loading locking chamber and the processing chamber.

[0091] In some feasible implementations, the loading lock chamber has two states: an idle state and a non-idle state. An idle state indicates that no new wafer is currently being loaded into the loading lock chamber, meaning the atmospheric manipulator can load a second wafer into the chamber. A non-idle state indicates that a new wafer is currently being loaded into the loading lock chamber. Similarly, the processing chamber also has two states: an idle state and a non-idle state. An idle state indicates that no new wafer is currently being loaded into the processing chamber, meaning the vacuum manipulator can load a second wafer into the processing chamber. A non-idle state indicates that a new wafer is currently being loaded into the processing chamber. To avoid blockages or deadlocks in the loading lock chamber or processing chamber, the vacuum robot should cancel / pause its current movement of the second wafer to the loading lock chamber or processing chamber when the loading lock chamber is not idle, until the loading lock chamber or processing chamber becomes idle again. Therefore, to prevent blockages or deadlocks in the loading lock chamber or processing chamber, the wafer processing scheduling equipment can adjust the various second wafers that the vacuum robot currently needs to move, such as deleting conflicting second wafers (which could be potentially blocking wafers), so that the vacuum robot will not currently move any conflicting second wafers. Optionally, the wafer processing scheduling equipment can predict the loading / locking state or processing chamber state when the vacuum robot moves any second wafer to the loading / locking chamber or processing chamber based on a time-accumulation rule method or a statistical learning method. When it is determined that the loading / locking chamber state is not idle when the vacuum robot moves any second wafer to the loading / locking chamber, or when it is determined that the processing chamber state is not idle when the vacuum robot moves any second wafer to the processing chamber, any second wafer is removed from the various second wafers to obtain the removed second wafers. Based on the machine information and the online scheduling algorithm of the vacuum robot, the movement of the removed second wafers is scheduled online. The online scheduling process of the movement of the removed second wafers can be found in the specific process of the wafer processing scheduling equipment performing online scheduling of the movement of each second wafer described above.When it is determined that the locking chamber state when the vacuum robot moves any second wafer to the loading locking chamber is in an idle state, and when it is determined that the processing chamber state when the vacuum robot moves any second wafer to the processing chamber is in a processing chamber idle state, the wafer processing scheduling equipment performs online scheduling of the movement actions of the vacuum robot to each second wafer based on the machine information and the online scheduling algorithm of the vacuum robot. The online scheduling process of the vacuum robot moving each second wafer can be found in the specific process of the wafer processing scheduling equipment performing online scheduling of the movement actions of each second wafer described above.

[0092] In some feasible embodiments, the wafer processing scheduling equipment can also invoke a simulator to simulate the movement of the vacuum robot arm according to the second wafer processing scheduling task. This obtains second simulated movement information of the vacuum robot arm simulating the movement of each second wafer between the loading locking chamber and the processing chamber. The second simulated movement information includes the simulated movement actions of the vacuum robot arm simulating the movement of each second wafer. The simulator can be implemented using various methods such as state machines and discrete-time simulation. Furthermore, the second simulated movement information can record detailed operational details of the vacuum robot arm throughout the simulation process, including the execution time of each simulated movement action. The wafer processing scheduling equipment can generate output information based on the second simulated movement information and provide visual output, such as a Gantt chart of the movement task. This allows users to intuitively understand the execution process of the second processing scheduling task and further optimize it, making the simulation process of the wafer processing equipment more transparent and controllable, and making the wafer production process more reliable and economical, thereby improving the wafer production efficiency of the wafer processing equipment. As can be seen, in this application, the second wafer processing scheduling task can be obtained through the above algorithm to guide the production of wafer processing equipment, effectively improving the resource utilization of the equipment, thereby reducing the wafer dwell time and increasing the wafer throughput of the equipment. At the same time, the actual situation of the machine can be dynamically synchronized to the simulator during the wafer processing process to achieve rapid rescheduling. This scheduling scheme that comprehensively considers the uncertainty factors is more suitable for dealing with various challenges in the actual processing process and improving production efficiency and stability.

[0093] In some feasible embodiments, the wafer processing scheduling equipment can also update the machine information based on the second simulated movement information, so that the simulator can dynamically consider the time consumption of various equipment and processes in real time during the simulation process. These times include, but are not limited to, robot arm movement time, wafer processing time, chamber cleaning time, wafer waiting time, etc., to more accurately simulate the actual processing process, improve the overall production efficiency of the wafer processing equipment, and even if changes occur during the production process, the wafer processing equipment can quickly respond and readjust the second processing scheduling task to adapt to the actual situation, thereby improving production efficiency and stability.

[0094] S306, Based on the first wafer processing scheduling task and the second wafer processing scheduling task, generate the processing scheduling tasks for the plurality of wafers to be processed.

[0095] In some feasible embodiments, a first wafer processing scheduling task is used to instruct the atmospheric robot arm to perform specific movement actions on multiple wafers to be processed, and a second wafer processing scheduling task is used to instruct the vacuum robot arm to perform specific movement actions on multiple wafers to be processed. Then, the processing scheduling task generated based on the first and second wafer processing scheduling tasks is used to instruct the atmospheric robot arm or the vacuum robot arm to perform specific movement actions on multiple wafers to be processed. Thus, the wafer processing scheduling equipment can control the atmospheric robot arm and the vacuum robot arm to perform corresponding movement actions according to the processing scheduling task, move the wafers to be processed to the appropriate position for processing, and complete the processing scheduling of multiple wafers to be processed.

[0096] In some feasible embodiments, the simulator continuously updates the machine information while simulating wafer processing scheduling tasks. The wafer processing scheduling equipment can generate processing scheduling tasks for the wafers to be processed through multiple iterative cycles based on the latest machine information, combined with the first wafer picking order and the processing movement path of each wafer to be processed, until processing scheduling tasks for all wafers to be processed are generated based on the updated machine information. Therefore, steps S304 to S306 can describe the specific execution of one iterative process in the cyclic iteration. Other iterative processes can be performed cyclically according to the same description to complete the generation of processing scheduling tasks for all wafers to be processed.

[0097] In this application, the wafer processing scheduling equipment can control the movement of the atmospheric robot and the vacuum robot on the wafer to be processed by scheduling the movement tasks of the atmospheric robot and the vacuum robot, so as to improve the movement efficiency of the atmospheric robot and the vacuum robot, reduce the dwell time of the wafer in the equipment, increase the wafer throughput of the wafer processing equipment, and further improve the wafer production efficiency of the equipment.

[0098] See Figure 5 , Figure 5 This is a schematic diagram of the wafer processing scheduling device provided in this application. Figure 5 As shown, the wafer processing scheduling device provided in this application includes:

[0099] The wafer retrieval sequence acquisition module 10 is used to acquire the processing technology of multiple wafers to be processed, and determine the first wafer retrieval sequence of the multiple wafers to be processed moving from the loading port to the loading locking chamber based on the processing technology of each wafer to be processed.

[0100] The determination module 11 is used to determine the target wafer to be wafered from the plurality of wafers to be processed in the first wafer-removal order determined by the wafer-removal order acquisition module 10, and to determine a plurality of candidate processing chambers that match the target processing technology from all processing chambers according to the target processing technology of the target wafer.

[0101] The processing movement path generation module 12 is used to determine at least one target processing chamber that matches the target processing process from the plurality of candidate processing chambers according to the wafer carrying state of each of the candidate processing chambers determined by the determination module 11, and generate a processing movement path of the target wafer based on the wafer processing sequence corresponding to the target processing process and the at least one target processing chamber, thereby sequentially obtaining the processing movement path of each of the plurality of wafers to be processed, wherein the target processing process includes at least one processing step, and one processing step corresponds to one target processing chamber;

[0102] The processing scheduling task generation module 13 is used to obtain the machine information of the wafer processing equipment, generate the processing scheduling task of the multiple wafers to be processed based on the machine information, the first wafer picking order determined by the wafer picking order acquisition module 10, and the processing movement path of each wafer to be processed obtained by the processing movement path generation module 12, and control the wafer processing equipment to execute the processing scheduling task to complete the processing scheduling of the multiple wafers to be processed.

[0103] In some feasible implementations, the above-mentioned chip retrieval order acquisition module 10 includes:

[0104] The wafer classification unit 101 is used to acquire multiple wafers to be processed and classify the multiple wafers to be processed based on the processing technology of each of the multiple wafers to be processed, so as to determine the set of wafers to be processed corresponding to various processing technologies, wherein one processing technology corresponds to at least one set of wafers to be processed.

[0105] The wafer retrieval sequence acquisition unit 102 is used to alternately select wafers to be processed from each of the aforementioned sets of wafers to be processed, and to obtain the first wafer retrieval sequence of the plurality of wafers to be processed moving from the aforementioned loading port to the aforementioned loading locking chamber based on the order in which each wafer to be processed appears in the alternate selection.

[0106] In some feasible implementations, the above-mentioned chip retrieval sequence acquisition unit 102 is specifically used for:

[0107] Based on the processing time and / or processing priority of wafers to be processed in the above-mentioned wafer processing equipment for different processing technologies, a wafer selection ratio is obtained for alternately selecting wafers from each of the above-mentioned sets of wafers to be processed, and wafers to be processed are alternately selected from each of the above-mentioned sets of wafers to be processed according to the above-mentioned wafer selection ratio.

[0108] In some feasible implementations, the aforementioned wafer carrying state includes the number of allocated wafers; the aforementioned processing movement path generation module 12 includes:

[0109] The first processing chamber determination unit 121 is used to obtain the number of allocated wafers for each of the above-mentioned candidate processing chambers, and determine the candidate processing chamber with the fewest allocated wafers among the above-mentioned candidate processing chambers as at least one target processing chamber that matches the above-mentioned target processing process.

[0110] The first path generation unit 122 is used to generate the processing movement path of the target wafer based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, thereby sequentially obtaining the processing movement path of each of the plurality of wafers to be processed.

[0111] In some feasible implementations, the aforementioned wafer carrying state includes the chamber task completion time; the aforementioned processing movement path generation module 12 includes:

[0112] The time calculation unit 123 is used to calculate the time required for each of the above-mentioned candidate processing chambers to complete the processing of all the assigned wafers to be processed;

[0113] The duration determination unit 124 is used to determine the shortest target chamber task completion time from the chamber task completion times of the multiple candidate processing chambers.

[0114] The second processing chamber determination unit 125 is used to determine the candidate processing chamber corresponding to the completion time of the target chamber task as at least one target processing chamber that matches the target processing technology.

[0115] The second path generation unit 126 is used to generate the processing movement path of the target wafer based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, thereby sequentially obtaining the processing movement path of each of the plurality of wafers to be processed.

[0116] In some feasible implementations, the above-mentioned machine information and the above-mentioned processing scheduling task generation module 13 include:

[0117] The first processing scheduling task generation unit 131 is used to obtain the first wafer information of the first processing wafer that the first robot arm in the wafer processing equipment is currently moving between the loading port and the loading locking compartment according to the machine information, and generate a first wafer processing scheduling task for the first robot arm to move the wafer between the loading port and the loading locking compartment according to the first wafer information and the second wafer information of at least one wafer to be processed taken out by the first robot arm from the loading port as indicated by the first wafer picking sequence.

[0118] The second processing scheduling task generation unit 132 is used to obtain the third wafer information of the second processing wafer that the second robot arm in the wafer processing equipment is currently moving between the loading locking chamber and the processing chamber and between different processing chambers, based on the machine information. Based on the third wafer information and the processing movement path of each wafer to be processed, the unit generates a second wafer processing scheduling task for the second robot arm to move the wafer between the loading locking chamber and the processing chamber and between different processing chambers. The first processing wafer and the second processing wafer are both wafers currently residing in the wafer processing equipment.

[0119] The processing scheduling task generation unit 133 is used to generate processing scheduling tasks for the plurality of wafers to be processed based on the first wafer processing scheduling task and the second wafer processing scheduling task.

[0120] In some feasible implementations, the first processing scheduling task generation unit 131 includes:

[0121] The first scheduling subunit 1301 is used to determine the movement actions of the first robot arm to move each of the first wafers indicated by the first wafer information and the second wafer information according to the first wafer information and the second wafer information, and to perform online scheduling of the movement actions of each of the first wafers according to the machine information and the online scheduling algorithm of the first robot arm to generate a task sequence of the movement actions of each of the first wafers.

[0122] The first sorting subunit 1302 is used to sort the task sequences of each of the first wafers to obtain the first wafer processing scheduling task of the first robot arm moving between the loading port and the loading locking chamber.

[0123] In some feasible implementations, the second processing scheduling task generation unit 132 includes:

[0124] The second scheduling subunit 1303 is used to determine the movement action of the second robot arm to move each second wafer indicated by the third wafer information based on the third wafer information and the processing movement path of each wafer to be processed, and to perform online scheduling of the movement action of each second wafer based on the machine information and the online scheduling algorithm of the second robot arm to generate a task sequence of the movement action of each second wafer.

[0125] The second sorting subunit 1304 is used to sort the task sequences of each of the above-mentioned second wafers to obtain the second wafer processing scheduling tasks for the second robotic arm to move between the loading locking chamber and the processing chamber and between different processing chambers.

[0126] In some feasible implementations, the first processing scheduling task generation unit 131 further includes:

[0127] The first state determination subunit 1305 is used to determine the loading lock chamber state when the first robot moves any of the first wafers to the loading lock chamber. The loading lock chamber state includes a loading lock chamber idle state and a loading lock chamber non-idle state.

[0128] The first wafer removal subunit 1306 is used to remove any one of the first wafers from each of the first wafers to obtain the removed first wafers when the loading locking chamber is in a non-idle state. The subunit is also used to perform online scheduling of the movement of the first robot arm to move the removed first wafers according to the machine information and the online scheduling algorithm of the first robot arm.

[0129] The first scheduling subunit 1301 is used to schedule the movement actions of the first robot arm to move each of the first wafers online according to the machine information and the online scheduling algorithm of the first robot arm when the loading and locking chamber is in the idle state.

[0130] In some feasible implementations, the second processing scheduling task generation unit 132 further includes:

[0131] The second state determination subunit 1307 is used to determine the loading lock chamber state or the processing chamber state when the second robot moves any of the second wafers to the loading lock chamber or the processing chamber. The loading lock chamber state includes a loading lock chamber idle state and a loading lock chamber non-idle state. The processing chamber state includes a processing chamber idle state and a processing chamber non-idle state.

[0132] The second wafer removal subunit 1308 is used to remove any one of the second wafers to obtain the removed second wafers when it is determined that the locking chamber is in a non-idle state when the second robot moves any one of the second wafers to the loading locking chamber, or when it is determined that the processing chamber is in a non-idle state when the second robot moves any one of the second wafers to the processing chamber. The subunit also performs online scheduling of the movement action of the second robot moving the removed second wafers according to the machine information and the online scheduling algorithm of the second robot.

[0133] The second scheduling subunit 1303 is used to perform online scheduling of the movement actions of the second robot moving the second wafers when it is determined that the locking chamber is in an idle state when the second robot moves any of the second wafers to the loading locking chamber, or when it is determined that the processing chamber is in an idle state when the second robot moves any of the second wafers to the processing chamber, based on the machine information and the online scheduling algorithm of the second robot.

[0134] In some feasible implementations, the first processing scheduling task generation unit 131 further includes:

[0135] The first simulation subunit 1309 is used to call the simulator to simulate the movement of the first robot arm according to the first wafer processing scheduling task, so as to obtain the first simulation movement information of the first robot arm simulating the movement of each of the first wafers between the loading port and the loading locking chamber. The first simulation movement information includes the simulated movement action of the first robot arm simulating the movement of each of the first wafers.

[0136] The first update subunit 1310 is used to update the machine information based on the first simulated movement information.

[0137] In some feasible implementations, the second processing scheduling task generation unit 132 further includes:

[0138] The second simulation subunit 1311 is used to call the simulator to simulate the movement of the second robot arm according to the second wafer processing scheduling task, so as to obtain the second simulation movement information of the second robot arm simulating the movement of each of the second wafers between the loading locking chamber and the processing chamber. The second simulation movement information includes the simulated movement action of the second robot arm simulating the movement of each of the second wafers.

[0139] The second update subunit 1312 is used to update the machine information based on the second simulated movement information.

[0140] In some feasible implementations, the implementation methods of each module or unit / subunit in the above-mentioned wafer processing scheduling device can be found in [reference needed]. Figures 2 to 4 The implementation methods provided for each step in the wafer processing scheduling method shown are not elaborated here. Each module or unit / subunit in the aforementioned wafer processing scheduling device can be used to execute the above... Figures 2 to 4 The provided wafer processing scheduling method utilizes a built-in processor or memory in the wafer processing scheduling equipment to implement the functions of the wafer processing scheduling equipment.

[0141] The wafer processing scheduling device provided in this application is applicable to wafer processing scheduling, which can effectively improve the utilization rate of the chamber resources of wafer processing equipment, improve wafer production efficiency, and has strong applicability.

[0142] See Figure 6 , Figure 6 This is a schematic diagram of the wafer fabrication system provided in this application. Figure 6 As shown, the wafer processing system 20 includes a wafer processing scheduling device 201 and a wafer processing device 202. The wafer processing scheduling device 201 may include a processor 2001, a network interface 2004, and a memory 2005. Optionally, the wafer processing scheduling device 201 may also include a user interface 2003 and at least one communication bus 2002. The communication bus 2002 is used to enable communication between components such as the processor 2001, network interface 2004, and memory 2005. The user interface 2003 may include a display screen and a keyboard; optionally, the user interface 2003 may also include a standard wired interface or a wireless interface. The network interface 2004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface). Memory 2005 includes random access memory (RAM) and non-volatile memory (NVM), such as erasable programmable read-only memory (EPROM). Memory 2005 may also optionally be at least one storage device located remotely from the aforementioned processor 2001. Figure 6 As shown, the memory 2005, which is a computer-readable storage medium, may include an operating system, a network communication module, a user interface module, and a device control application program.

[0143] In such Figure 6In the wafer processing scheduling device 201 shown, the network interface 2004 provides network communication functionality; the user interface 2003 is mainly used to provide an input interface for users; and the processor 2001 can be used to call the device control application stored in the memory 2005. The wafer processing scheduling device 201 executes the application stored in the memory through the processor to implement the wafer processing scheduling method provided in this application, so as to control the above-mentioned wafer processing device to perform processing scheduling tasks and complete the processing scheduling of multiple wafers to be processed.

[0144] It should be understood that the wafer processing scheduling equipment 201 described in this application can perform the functions described above. Figures 2 to 4 The wafer processing scheduling method corresponding to any of the embodiments will not be described in detail here. In addition, the beneficial effects of using the same method will not be described in detail here either.

[0145] This application also provides a non-volatile computer-readable storage medium, which may be various non-volatile computer-readable storage media such as flash, ROM, disk, optical disk, etc. The computer-readable storage medium stores a computer program executed by the aforementioned wafer fabrication scheduling method, and the computer program includes program instructions. When the processor executes the program instructions, it can execute the aforementioned... Figures 2 to 4 The description of the wafer processing scheduling method in any corresponding embodiment is already provided and will not be repeated here. Furthermore, the beneficial effects of using the same method will also not be repeated. For technical details not disclosed in the computer-readable storage medium embodiments related to this application, please refer to the description of the method embodiments of this application.

[0146] Those skilled in the art will recognize that the system and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Those skilled in the art can implement the described functions using different methods for each specific application, but such implementations should not be considered beyond the scope of this application. The foregoing disclosure is merely a preferred embodiment of this application and should not be construed as limiting the scope of this application. Therefore, equivalent variations made in accordance with the claims of this application are still within the scope of this application.

Claims

1. A wafer processing scheduling method, characterized in that, The method includes: The processing technology of multiple wafers to be processed is obtained, and the first wafer picking order of the multiple wafers to be processed from the loading port to the loading locking chamber is determined based on the processing technology of each wafer to be processed. According to the first wafer picking order, the target wafer to be picked is determined from the plurality of wafers to be processed in sequence, and a plurality of candidate processing chambers matching the target processing technology are determined from all processing chambers according to the target processing technology of the target wafer; Based on the wafer carrying state of each of the candidate processing chambers, at least one target processing chamber matching the target processing technology is determined from the plurality of candidate processing chambers. Based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, a processing movement path for the target wafer is generated. In this way, the processing movement paths for each of the plurality of wafers to be processed are obtained sequentially. The target processing technology includes at least one processing step, and one processing step corresponds to one target processing chamber. The machine information of the wafer processing equipment is obtained, and a processing scheduling task for the multiple wafers to be processed is generated based on the machine information, the first wafer picking order and the processing movement path of each wafer to be processed. The wafer processing equipment is controlled to execute the processing scheduling task to complete the processing scheduling of the multiple wafers to be processed.

2. The method according to claim 1, characterized in that, The determination of the first wafer retrieval sequence based on the processing technology of each wafer to be processed, which involves moving the plurality of wafers from the loading port to the loading locking chamber, includes: The multiple wafers to be processed are classified based on their respective processing technologies to determine the wafer sets corresponding to each processing technology, wherein each processing technology corresponds to at least one wafer set. Wafers to be processed are alternately selected from each of the sets of wafers to be processed, and a first wafer retrieval order is obtained based on the order in which each wafer to be processed appears in the alternate selection, so that the plurality of wafers to be processed can move from the loading port to the loading locking chamber.

3. The method according to claim 2, characterized in that, The step of alternately selecting wafers to be processed from each of the sets of wafers to be processed includes: Based on the processing time and / or processing priority of wafers to be processed in the wafer processing equipment for different processing technologies, a wafer selection ratio is obtained for alternately selecting wafers from each set of wafers to be processed, and wafers to be processed are alternately selected from each set of wafers to be processed according to the wafer selection ratio.

4. The method according to claim 3, characterized in that, The wafer carrying status includes the number of allocated wafers; determining at least one target processing chamber matching the target processing process from the plurality of candidate processing chambers based on the wafer carrying status of each of the candidate processing chambers includes: The number of allocated wafers for each of the candidate processing chambers is obtained, and the candidate processing chamber with the fewest allocated wafers among the plurality of candidate processing chambers is determined as at least one target processing chamber that matches the target processing technology.

5. The method according to claim 3, characterized in that, The wafer carrying status includes the chamber task completion time; determining at least one target processing chamber matching the target processing process from the plurality of candidate processing chambers based on the wafer carrying status of each of the candidate processing chambers includes: Calculate the chamber task completion time required for each of the candidate processing chambers to complete the processing of all assigned wafers to be processed; The shortest target chamber task completion time is determined from the chamber task completion times of the multiple candidate processing chambers; Candidate processing chambers corresponding to the target chamber task completion time are identified as at least one target processing chamber that matches the target processing technology.

6. The method according to any one of claims 1-5, characterized in that, The step of generating the processing scheduling task for the plurality of wafers to be processed based on the machine information, the first wafer picking order, and the processing movement path of each wafer to be processed includes: Based on the machine information, obtain the first wafer information of the first processing wafer that the first robot arm is currently moving between the loading port and the loading locking chamber in the wafer processing equipment. Based on the first wafer information and the second wafer information of at least one wafer to be processed taken out from the loading port by the first robot arm as indicated by the first wafer picking sequence, generate a first wafer processing scheduling task for the first robot arm to move the wafer between the loading port and the loading locking chamber. The third wafer information of the second processing wafer currently being moved between the loading locking chamber and the processing chamber and between different processing chambers is obtained based on the machine information. A second wafer processing scheduling task is generated based on the third wafer information and the processing movement path of each wafer to be processed, where the first processing wafer and the second processing wafer are both wafers currently residing in the wafer processing equipment. The processing scheduling tasks for the plurality of wafers to be processed are generated based on the first wafer processing scheduling task and the second wafer processing scheduling task.

7. The method according to claim 6, characterized in that, The first wafer processing scheduling task, which generates the first wafer processing scheduling task by moving the wafer between the loading port and the loading locking chamber based on the second wafer information of at least one wafer to be processed taken out by the first robot arm from the loading port according to the first wafer information and the first wafer picking sequence, includes: Based on the first wafer information and the second wafer information, the first robot arm determines the movement actions of each first wafer indicated by the first wafer information and the second wafer information. Based on the machine information and the online scheduling algorithm of the first robot arm, the movement actions of each first wafer are scheduled online to generate a task sequence of movement actions of each first wafer. The task sequences of each of the first wafers are sorted to obtain the first wafer processing scheduling task for the first robotic arm to move between the loading port and the loading locking chamber.

8. The method according to claim 6, characterized in that, The second wafer processing scheduling task, which generates the second robotic arm to move wafers between the loading locking chamber and the processing chamber, and between different processing chambers, based on the third wafer information and the processing movement paths of each wafer to be processed, includes: Based on the third wafer information and the processing movement path of each wafer to be processed, the movement action of the second robot arm to move each second wafer indicated by the third wafer information is determined. Based on the machine information and the online scheduling algorithm of the second robot arm, the movement action of each second wafer is scheduled online to generate a task sequence of movement action of each second wafer. The task sequences of each second wafer are sorted to obtain the second wafer processing scheduling task for the movement of the second robot arm between the loading locking chamber and the processing chamber and between different processing chambers.

9. The method according to claim 7, characterized in that, The online scheduling of the movement of each first wafer based on the machine information and the online scheduling algorithm of the first robotic arm includes: The loading lock chamber state is determined when the first robotic arm moves any one of the first wafers to the loading lock chamber. The loading lock chamber state includes an idle state and a non-idle state. When the loading and locking chamber is in a non-idle state, any one of the first wafers is removed from each of the first wafers to obtain the removed first wafers. Based on the machine information and the online scheduling algorithm of the first robot, the movement action of the first robot to move the removed first wafers is scheduled online. When the loading and locking chamber is in an idle state, the movement actions of the first robot arm to move each of the first wafers are scheduled online according to the machine information and the online scheduling algorithm of the first robot arm.

10. The method according to claim 8, characterized in that, The online scheduling of the movement of each second wafer based on the machine information and the online scheduling algorithm of the second robotic arm includes: The loading lock chamber state or processing chamber state is determined when the second robotic arm moves any of the second wafers to the loading lock chamber or the processing chamber. The loading lock chamber state includes a loading lock chamber idle state and a loading lock chamber non-idle state. The processing chamber state includes a processing chamber idle state and a processing chamber non-idle state. When it is determined that the locking chamber is in a non-idle state when the second robot moves any second wafer to the loading locking chamber, or when it is determined that the processing chamber is in a non-idle state when the second robot moves any second wafer to the processing chamber, the second wafer is removed from each of the second wafers to obtain the removed second wafers. Based on the machine information and the online scheduling algorithm of the second robot, the movement action of the second robot moving the removed second wafers is scheduled online. When it is determined that the locking chamber is in an idle state when the second robot moves any of the second wafers to the loading locking chamber, and when it is determined that the processing chamber is in an idle state when the second robot moves any of the second wafers to the processing chamber, the movement actions of the second robot moving each of the second wafers are scheduled online according to the machine information and the online scheduling algorithm of the second robot.

11. The method according to claim 7, characterized in that, After sorting the task sequences of each of the first wafers to obtain the first wafer processing scheduling task for the movement of the first robotic arm between the loading port and the loading locking chamber, the method further includes: The simulator is invoked to simulate the movement of the first robotic arm according to the first wafer processing scheduling task, so as to obtain the first simulated movement information of the first robotic arm simulating the movement of each of the first wafers between the loading port and the loading locking chamber. The first simulated movement information includes the simulated movement actions of the first robotic arm simulating the movement of each of the first wafers. The machine information is updated based on the first simulated movement information.

12. The method according to claim 8, characterized in that, After sorting the task sequences of each of the second wafers to obtain the second wafer processing scheduling task for the movement of the second robotic arm between the loading locking chamber and the processing chamber, the method further includes: The simulator is invoked to simulate the movement of the second robotic arm according to the second wafer processing scheduling task, so as to obtain second simulated movement information of the second robotic arm simulating the movement of each of the second wafers between the loading locking chamber and the processing chamber. The second simulated movement information includes the simulated movement actions of the second robotic arm simulating the movement of each of the second wafers. The machine information is updated based on the second simulated movement information.

13. A wafer processing scheduling device, characterized in that, The device includes: The wafer retrieval sequence acquisition module is used to acquire the processing technology of multiple wafers to be processed, and determine the first wafer retrieval sequence of the multiple wafers to be processed moving from the loading port to the loading locking chamber based on the processing technology of each wafer to be processed. The determination module is used to sequentially determine the target wafer to be processed from the plurality of wafers to be processed according to the first wafer extraction order determined by the wafer extraction order acquisition module, and determine a plurality of candidate processing chambers that match the target processing technology from all processing chambers according to the target processing technology of the target wafer; A processing movement path generation module is used to determine at least one target processing chamber that matches the target processing process from the plurality of candidate processing chambers according to the wafer carrying state of each of the candidate processing chambers determined by the determining module, and generate a processing movement path for the target wafer based on the wafer processing sequence corresponding to the target processing process and the at least one target processing chamber, thereby sequentially obtaining the processing movement path of each wafer to be processed among the plurality of wafers to be processed, wherein the target processing process includes at least one processing step, and one processing step corresponds to one target processing chamber; The processing scheduling task generation module is used to obtain the machine information of the wafer processing equipment, generate processing scheduling tasks for the multiple wafers to be processed based on the machine information, the first wafer picking order determined by the wafer picking order acquisition module, and the processing movement path of each wafer to be processed obtained by the processing movement path generation module, and control the wafer processing equipment to execute the processing scheduling tasks to complete the processing scheduling of the multiple wafers to be processed.

14. The apparatus according to claim 13, characterized in that, The slice retrieval order acquisition module includes: A wafer classification unit is used to acquire multiple wafers to be processed and classify the multiple wafers to be processed based on the processing technology of each wafer to be processed to determine the set of wafers to be processed corresponding to various processing technologies, wherein one processing technology corresponds to at least one set of wafers to be processed. The wafer retrieval sequence acquisition unit is used to alternately select wafers to be processed from each of the sets of wafers to be processed, and obtain the first wafer retrieval sequence of the plurality of wafers to be processed moving from the loading port to the loading locking chamber based on the order in which each wafer to be processed appears in the alternate selection.

15. The apparatus according to claim 14, characterized in that, The slice acquisition order acquisition unit is specifically used for: Based on the processing time and / or processing priority of wafers to be processed in the wafer processing equipment for different processing technologies, a wafer selection ratio is obtained for alternately selecting wafers from each set of wafers to be processed, and wafers to be processed are alternately selected from each set of wafers to be processed according to the wafer selection ratio.

16. The apparatus according to claim 15, characterized in that, The wafer carrying status includes the number of allocated wafers; The processing movement path generation module includes: The first processing chamber determination unit is used to obtain the number of allocated wafers for each of the candidate processing chambers, and determine the candidate processing chamber with the fewest allocated wafers among the plurality of candidate processing chambers as at least one target processing chamber that matches the target processing technology. The path generation unit is used to generate a processing movement path for the target wafer based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, thereby sequentially obtaining the processing movement paths for each of the plurality of wafers to be processed.

17. The apparatus according to claim 15, characterized in that, The wafer carrying status includes the chamber task completion time; The processing movement path generation module includes: The time calculation unit is used to calculate the time required for each of the candidate processing chambers to complete the processing of all the assigned wafers to be processed; The duration determination unit is used to determine the shortest target chamber task completion time from the chamber task completion times of the multiple candidate processing chambers; The second processing chamber determination unit is used to determine candidate processing chambers corresponding to the task completion time of the target chamber as at least one of the target processing chambers that matches the target processing technology; The path generation unit is used to generate a processing movement path for the target wafer based on the wafer processing sequence corresponding to the target processing technology and the at least one target processing chamber, thereby sequentially obtaining the processing movement paths for each of the plurality of wafers to be processed.

18. The apparatus according to any one of claims 13-17, characterized in that, The processing scheduling task generation module includes: The first processing scheduling task generation unit is used to obtain the machine information of the wafer processing equipment, obtain the first wafer information of the first processing wafer that the first robot arm is currently moving between the loading port and the loading locking chamber in the wafer processing equipment according to the machine information, and generate the first wafer processing scheduling task of the first robot arm moving the wafer between the loading port and the loading locking chamber according to the first wafer information and the second wafer information of at least one wafer to be processed taken out by the first robot arm from the loading port as indicated by the first wafer picking sequence. The second processing scheduling task generation unit is used to acquire the machine information of the wafer processing equipment, acquire the third wafer information of the second processing wafer that the second robot arm is currently moving between the loading locking chamber and the processing chamber and between different processing chambers in the wafer processing equipment based on the machine information, and generate a second wafer processing scheduling task for the second robot arm to move the wafer between the loading locking chamber and the processing chamber and between different processing chambers based on the third wafer information and the processing movement path of each wafer to be processed. The first processing wafer and the second processing wafer are both wafers currently residing in the wafer processing equipment. The processing scheduling task generation unit is used to generate processing scheduling tasks for the plurality of wafers to be processed based on the first wafer processing scheduling task and the second wafer processing scheduling task.

19. The apparatus according to claim 18, characterized in that, The first processing and scheduling task generation unit includes: The first scheduling subunit is configured to determine the movement actions of the first robot arm to move each first wafer indicated by the first wafer information and the second wafer information based on the first wafer information and the second wafer information, and to perform online scheduling of the movement actions of each first wafer based on the machine information and the online scheduling algorithm of the first robot arm to generate a task sequence of movement actions of each first wafer. The first sorting subunit is used to sort the task sequences of each of the first wafers to obtain the first wafer processing scheduling task for the first robot arm to move between the loading port and the loading locking chamber.

20. The apparatus according to claim 18, characterized in that, The second processing scheduling task generation unit includes: The second scheduling subunit is used to determine the movement actions of the second robot arm to move each second wafer indicated by the third wafer information based on the third wafer information and the processing movement path of each wafer to be processed, and to perform online scheduling of the movement actions of each second wafer based on the machine information and the online scheduling algorithm of the second robot arm to generate a task sequence of movement actions of each second wafer. The second sorting subunit is used to sort the task sequences of each of the second wafers to obtain the second wafer processing scheduling tasks for the movement of the second robot arm between the loading locking chamber and the processing chamber and between different processing chambers.

21. The apparatus according to claim 19, characterized in that, The first processing and scheduling task generation unit further includes: The first state determination subunit is used to determine the loading lock chamber state when the first robot moves any one of the first wafers to the loading lock chamber. The loading lock chamber state includes a loading lock chamber idle state and a loading lock chamber non-idle state. The first wafer removal subunit is used to remove any one of the first wafers to obtain the removed first wafers when the loading locking chamber is in a non-idle state. The subunit is also used to perform online scheduling of the first robot's movement of the removed first wafers according to the machine information and the online scheduling algorithm of the first robot. The first scheduling subunit is further configured to, when the loading and locking chamber is in an idle state, perform online scheduling of the movement actions of the first robotic arm to move each of the first wafers based on the machine information and the online scheduling algorithm of the first robotic arm.

22. The apparatus according to claim 20, characterized in that, The second processing scheduling task generation unit further includes: The second state determination subunit is used to determine the loading lock chamber state or the processing chamber state when the second robot moves any of the second wafers to the loading lock chamber or the processing chamber. The loading lock chamber state includes a loading lock chamber idle state and a loading lock chamber non-idle state. The processing chamber state includes a processing chamber idle state and a processing chamber non-idle state. The second wafer removal subunit is used to remove any one of the second wafers to obtain the removed second wafers when it is determined that the locking chamber is in a non-idle state when the second robot moves any one of the second wafers to the loading locking chamber, or when it is determined that the processing chamber is in a non-idle state when the second robot moves any one of the second wafers to the processing chamber. The subunit also performs online scheduling of the movement actions of the second robot moving the removed second wafers according to the machine information and the online scheduling algorithm of the second robot. The second scheduling subunit is further configured to, based on the machine information and the online scheduling algorithm of the second robot, perform online scheduling of the movement actions of the second robot moving each of the second wafers when it is determined that the locking chamber state is in the loading locking chamber idle state when the second robot moves any of the second wafers to the loading locking chamber, and when it is determined that the processing chamber state is in the processing chamber idle state when the second robot moves any of the second wafers to the processing chamber, perform online scheduling of the movement actions of the second robot moving each of the second wafers.

23. The apparatus according to claim 19, characterized in that, The first processing and scheduling task generation unit further includes: The first simulation subunit is used to call the simulator to simulate the movement of the first robot arm according to the first wafer processing scheduling task, so as to obtain the first simulation movement information of the first robot arm simulating the movement of each of the first wafers between the loading port and the loading locking chamber. The first simulation movement information includes the simulated movement actions of the first robot arm simulating the movement of each of the first wafers. The first update subunit is used to update the machine information based on the first simulated movement information.

24. The apparatus according to claim 20, characterized in that, The second processing scheduling task generation unit further includes: The second simulation subunit is used to call the simulator to simulate the movement of the second robot arm according to the second wafer processing scheduling task, so as to obtain the second simulation movement information of the second robot arm simulating the movement of each of the second wafers between the loading locking chamber and the processing chamber. The second simulation movement information includes the simulated movement actions of the second robot arm simulating the movement of each of the second wafers. The second update subunit is used to update the machine information based on the second simulated movement information.

25. A wafer processing system, characterized in that, include: Wafer processing equipment and wafer processing scheduling equipment, wherein the wafer processing scheduling equipment includes a processor and a memory; The processor is connected to the memory, wherein the memory is used to store program code, and the processor is used to call the program code to execute the method according to any one of claims 1-12 to control the wafer processing equipment to perform processing scheduling tasks to complete the processing scheduling of multiple wafers to be processed.

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