System and method for separating semiconductor wafers

By using advanced tools and automated equipment to monitor stress adjustment force settings, the problem of wafer separation in existing wafer bonding processes has been solved, achieving safe and efficient wafer separation, improving the separation success rate and reducing the risk of damage.

CN122161375APending Publication Date: 2026-06-05TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Filing Date
2025-12-03
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

As the feature size of semiconductor integrated circuits shrinks, manufacturing processes become more challenging, and ensuring the reliability of semiconductor devices becomes increasingly difficult. Existing technologies struggle to effectively separate wafers in wafer bonding processes without damaging the wafers or their components.

Method used

Using cutting-edge tools, components are moved independently in multiple directions via automated equipment. Sensors monitor stress and controllers adjust force settings to ensure that the maximum stress limit is not exceeded, thus achieving safe wafer separation.

Benefits of technology

This technology enables efficient separation of wafers in wafer bonding processes without damaging the wafer or its components, improving separation success rate and reducing damage risk.

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Abstract

Embodiments of the present disclosure provide systems and methods for separating semiconductor wafers, and in particular, systems and methods for separating bonded first and second semiconductor wafers. The system includes a tool having a tip comprising a first member and a second member configured to contact the first wafer and the second wafer, respectively; a sensor configured to sense a stress exerted by the first member and the second member; an automated device configured to move the first member and the second member; and a controller configured to: insert the tip of the tool between the wafers; separate the first member from the second member to apply a force based on a force setting; monitor the stress exerted to the wafers; adjust the force setting in response to the stress exerted; and remove the tool from between the wafers in response to complete separation of the wafers or in response to the stress exerted thereto exceeding a maximum stress threshold.
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