Robotic, wafer caching apparatus, and wafer cassette grasping method

Abstract

The application provides a robot, a wafer caching device and a wafer box grabbing method. The robot is used for conveying a wafer box, and the wafer box comprises a fitting part which has a positioning part. The robot comprises: a mechanical arm which can be moved from a positioning position to a target position; a detection part which is arranged on the mechanical arm and is arranged opposite the positioning part when the mechanical arm is in the positioning position; and a control module which is electrically connected with any one of the detection part and the mechanical arm, is used for determining the relative position between the fitting part and the mechanical arm according to the detection result of the detection part, and is used for controlling the mechanical arm to move from the positioning position to the target position according to the relative position. When the mechanical arm is in the target position, the mechanical arm can grab the fitting part, that is, the position adjustment of the mechanical arm can be performed before grabbing, so that the one-time accurate alignment and grabbing of the fitting part can be realized, the overall grabbing time is significantly shortened, and the wafer box grabbing efficiency is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a method for grasping a robot, a wafer cache device, and a wafer cassette. Background Technology

[0002] Currently, in the automated handling of wafer cassettes, robotic arms typically grasp the mushroom-shaped handle on top of the cassette to move it. However, in actual production lines, multiple types of wafer cassettes are often used interchangeably, or the cassettes themselves experience wear and tear after prolonged use.

[0003] To avoid grasping failure, related technologies typically require multiple fine-tuning and searching operations after the robotic arm contacts the mushroom head to achieve accurate grasping. This process is time-consuming, affects production line cycle time, and carries the risk of scratching the mushroom head or causing the wafer cassette to fall during the searching process. Summary of the Invention

[0004] This invention provides a method for grasping a robot, a wafer caching device, and a wafer cassette, to solve the problems of low efficiency and the risk of scratching the robot head or dropping the wafer cassette in related technologies.

[0005] This invention provides a robot for transporting wafer cassettes, the wafer cassettes including mating parts, the mating parts having positioning parts, and the robot comprising: A robotic arm capable of moving from a positioning position to a target position; A detection element is disposed on the robotic arm, and when the robotic arm is located in the positioning position, the detection element is disposed opposite to the positioning part; The control module is electrically connected to either the detection component or the robotic arm, and is used to determine the relative position between the mating component and the robotic arm based on the detection result of the detection component, and to control the robotic arm to move from the positioning position to the target position based on the relative position; When the robotic arm is located at the target position, the robotic arm is able to grasp the mating component.

[0006] According to the present invention, the positioning part includes a positioning notch, and the manipulator includes a positioning pin; Wherein, when the robotic arm is located at the positioning position, the detection element is positioned opposite to the positioning notch; When the robotic arm grasps the mating part, the positioning pin is inserted into the positioning notch.

[0007] According to the present invention, the robotic arm includes: robotic arm; A gripper assembly is disposed on the robotic arm, a positioning pin is disposed on the gripper assembly, and a detection element is disposed on at least one of the robotic arm and the gripper assembly; When the robotic arm is located at the target position, the gripper assembly can abut against the mating member to grasp the mating member.

[0008] According to a robot provided by the present invention, the detection component includes a laser beam sensor, the laser beam sensor having a transmitting part and a receiving part; When the robotic arm is in the positioning position, the transmitting part and the receiving part are respectively located on opposite sides of the positioning notch. The laser beam emitted by the transmitting part passes through the positioning notch and is received by the receiving part.

[0009] According to a robot provided by the present invention, the mating component further includes a target notch, and the target notch and the positioning notch are arranged at intervals along the moving direction of the manipulator; When the robotic arm is located at the target position, the transmitting part and the receiving part are located on opposite sides of the target gap, respectively. The laser beam emitted by the transmitting part passes through the target gap and is received by the receiving part.

[0010] According to a robot provided by the present invention, the number of laser beam sensors is multiple; When the robotic arm is in the positioning position, laser beams emitted by the emitting parts of at least two of the laser beam sensors pass through the positioning gaps respectively, and / or, the number of positioning gaps is at least two, and laser beams emitted by the emitting parts of at least two of the laser beam sensors pass through at least two of the positioning gaps respectively.

[0011] According to a robot provided by the present invention, the detection component includes a plurality of photoelectric sensors; When the robotic arm is in the positioning position, at least one of the photoelectric sensors emits a light spot that enters the positioning notch, and at least one of the photoelectric sensors emits a light spot that illuminates the surface of the mating part.

[0012] According to the present invention, a robot is provided in which the detection component includes a semiconductor image sensor and a laser light source; When the robotic arm is in the positioning position, the line laser emitted by the laser source illuminates the positioning notch and the surface of the mating part respectively, forming a positioning light strip, and the semiconductor image sensor captures the positioning light strip.

[0013] According to a robot provided by the present invention, the positioning part includes a plurality of positioning surfaces, the plurality of positioning surfaces are respectively disposed on the outer periphery of the mating part, and the detection part includes a plurality of distance detection parts; When the robotic arm is in the positioning position, multiple distance detection units are respectively arranged opposite to multiple positioning surfaces to detect the distance between each distance detection unit and the positioning surface opposite to it.

[0014] According to a robot provided by the present invention, the positioning unit includes an identification tag, and the detection component includes a tag reader; When the robotic arm is in the specified positioning position, the tag reader is able to read the identification tag.

[0015] The present invention also provides a wafer caching device, including any of the robots described above.

[0016] The present invention also provides a method for grasping a wafer cassette, for use with any of the above-mentioned robots, the grasping method comprising: The robotic arm is controlled to move to a positioning position so that the detection element is positioned opposite to the positioning part. Based on the detection results of the detection component, the relative position between the mating component and the robotic arm is determined; Based on the relative position, control the robotic arm to move from the positioning position to the target position; When the robotic arm is in the target position, control the robotic arm to grasp the mating part.

[0017] According to a wafer cassette gripping method provided by the present invention, the step of controlling the robotic arm to move from the positioning position to the target position based on the relative position specifically includes: Based on the relative position, determine the amount of movement compensation of the robot arm relative to the target position in the robot arm's movement direction; Based on the movement compensation amount, the robot arm is controlled to move from the positioning position to the target position.

[0018] According to a wafer cassette gripping method provided by the present invention, the positioning part includes a positioning notch, the detection element includes a laser beam sensor, the laser beam sensor includes an emitting part and a receiving part, when the robot arm is located at the positioning position, the laser beam emitted by the emitting part passes through the positioning notch and is received by the receiving part, and the laser beam sensor outputs a conduction signal; Determining the relative position between the mating component and the robotic arm based on the detection results of the detection component specifically includes: Receive the conduction signal output by the laser beam sensor to determine the position of the positioning notch; The relative position between the mating component and the robotic arm is determined based on the location of the positioning notch.

[0019] The robot, wafer caching device, and wafer cassette gripping method provided by this invention determine the relative position between the mating component and the robot arm based on the detection results of the inspection component before gripping the wafer cassette. Then, the robot arm is controlled to move to the target position according to the determined relative position. This allows for robot arm position adjustment before gripping, enabling precise one-time alignment and gripping of the mating component, significantly shortening the overall gripping time, effectively improving wafer cassette gripping efficiency, and thus contributing to increased production cycle time.

[0020] Moreover, compared to blind grasping and multiple fine adjustments after contact in related technologies, controlling the movement of the robot arm based on the relative position of the mating parts and the robot arm can achieve precise locking of the target position, ensuring accurate grasping of the wafer cassette while avoiding collisions, which is conducive to improving the stability and reliability of the entire semiconductor manufacturing process. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a partial structural schematic diagram of the robot provided by the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of the laser beam sensor and its mating parts provided by the present invention.

[0024] Figure 3 This is a schematic diagram of the structure of the wafer cassette provided by the present invention.

[0025] Figure 4 This is a schematic block diagram of the robot provided by the present invention.

[0026] Figure 5 This is a flowchart of the wafer cassette gripping method provided by the present invention.

[0027] Figure label: 1: Robot; 10: Robotic hand; 12: Robotic arm; 14: Gripper assembly; 20: Detection component; 22: Laser beam sensor; 222: Transmitter; 224: Receiver; 30: Control module; 4: Wafer box; 40: Mating component; 42: Positioning part; 422: Positioning notch; 44: Target notch; 5: Laser beam; X: Direction of movement. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0029] Currently, as semiconductor manufacturing processes advance to smaller nodes, the requirements for precision, stability, and contamination prevention during wafer cassette transport are becoming increasingly stringent. In automated semiconductor material handling systems, precise positioning and transport of wafer cassettes are crucial for ensuring safe wafer transport. Specifically, during wafer cassette transport, the robotic arm needs to precisely grasp the mushroom-shaped handle at the top of the wafer cassette to achieve transport.

[0030] Traditional "blind gripping" combined with force sensing relies on the robot's extremely high repeatability and the absolute consistency of the wafer cassette placement. For actual production lines where multiple brands and models of wafer cassettes are used together or wear and tear occurs over long-term use, this can easily lead to gripping failures or collisions.

[0031] In related technologies, in order to avoid grasping failure, the vision-assisted "trial teaching positioning" method is used. This usually requires multiple fine adjustments and searches after the robot arm contacts the mushroom head in order to achieve accurate grasping of the mushroom head. The process is time-consuming and affects the production line cycle time. In addition, there is a risk of scratching the mushroom head or the wafer cassette falling off during the search process, which affects the stability and efficiency of the entire semiconductor manufacturing process.

[0032] Based on this, the present invention provides a robot with a detection component mounted on its robotic arm. Before grasping a wafer cassette, the robotic arm is first controlled to move to a positioning position. Since the detection component and the positioning part are positioned relative to each other at this position, the control module can determine the relative position between the mating part and the robotic arm based on the detection result of the detection component. Then, based on the determined relative position, the robotic arm is controlled to move to the target position. This allows for position adjustment of the robotic arm before grasping, enabling precise one-time alignment and grasping of the mating part, significantly shortening the overall grasping time, effectively improving wafer cassette grasping efficiency, and thus contributing to increased production cycle time.

[0033] Moreover, compared to blind grasping and multiple fine adjustments after contact in related technologies, controlling the movement of the robot arm based on the relative position of the mating parts and the robot arm can achieve precise locking of the target position, ensuring accurate grasping of the wafer cassette while avoiding collisions, which is conducive to improving the stability and reliability of the entire semiconductor manufacturing process.

[0034] The following is combined Figures 1 to 5 The present invention describes the robot, wafer cache device, and wafer cassette grasping method.

[0035] Firstly, such as Figure 1 and Figure 4 As shown, this embodiment provides a robot 1 for transporting a wafer cassette 4. The wafer cassette 4 includes a mating component 40, which has a positioning part 42. The robot 1 includes a manipulator 10, a detection component 20, and a control module 30. The manipulator 10 is capable of moving from a positioning position to a target position. The detection component 20 is disposed on the manipulator 10. When the manipulator 10 is in the positioning position, the detection component 20 is positioned opposite to the positioning part 42. The control module 30 is electrically connected to either the detection component 20 or the manipulator 10, and is used to determine the relative position between the mating component 40 and the manipulator 10 based on the detection result of the detection component 20, and control the manipulator 10 to move from the positioning position to the target position based on the relative position. When the manipulator 10 is in the target position, the manipulator 10 is capable of grasping the mating component 40.

[0036] The robot 1 in this embodiment includes a robotic arm 10, a detection component 20, and a control module 30. Specifically, the robotic arm 10 can move from a positioning position to a target position. It can be understood that the positioning position is the position before the robotic arm 10 moves to the target position. Specifically, in the movement direction X of the robotic arm 10, the robotic arm 10 first passes through the positioning position and finally reaches the target position.

[0037] When the robot arm 10 is in the positioning position, the detection element 20 is positioned opposite to the positioning part 42. Therefore, the detection element 20 can output detection information to the control module 30. This detection information may include the position information of the positioning part 42 or the distance information between the positioning part 42 and the detection element 20, so that the control module 30 can determine the relative position between the mating part 40 and the robot arm 10.

[0038] Before gripping the wafer cassette 4, the relative position between the mating part 40 and the robot arm 10 is determined based on the detection results of the inspection component 20. Then, the robot arm 10 is controlled to move to the target position according to the determined relative position. This allows for position adjustment of the robot arm 10 before gripping, enabling precise one-time alignment and gripping of the mating part 40. This significantly shortens the overall gripping time, effectively improves the gripping efficiency of the wafer cassette 4, and thus helps to increase production cycle time.

[0039] Moreover, compared to blind grasping and multiple fine adjustments after contact in related technologies, controlling the movement of the robotic arm 10 based on the relative position of the mating part 40 and the robotic arm 10 can achieve precise locking of the target position, ensuring accurate grasping of the wafer cassette 4 while avoiding collisions, which is conducive to improving the stability and reliability of the entire semiconductor manufacturing process.

[0040] Furthermore, the inspection process is seamlessly integrated into the gripping preparation action. The process of the robotic arm 10 moving towards the wafer cassette 4 with the inspection component 20 is simultaneously the inspection process. The position of the robotic arm 10 can be adjusted before the gripping action, achieving efficient connection between inspection and position adjustment.

[0041] Optionally, wafer cassette 4 is a front-opening wafer transport cassette (FOUP).

[0042] Optionally, the mating part 40 can be the mushroom head on the top of the wafer cassette 4.

[0043] In some embodiments, such as Figure 2 As shown, the positioning part 42 includes a positioning notch 422, and the robot arm 10 includes a positioning pin. When the robot arm 10 is in the positioning position, the detection element 20 is positioned opposite to the positioning notch 422. When the robot arm 10 grips the mating part 40, the positioning pin is inserted into the positioning notch 422.

[0044] In this embodiment, the positioning part 42 is defined to include a positioning notch 422. Specifically, when the robot arm 10 moves to the positioning position, the detection element 20 is opposite to the positioning notch 422, and the position of the positioning notch 422 can be detected, thereby determining the relative position between the mating part 40 and the robot arm 10.

[0045] Because the robotic arm 10 is equipped with a positioning pin, when the robotic arm 10 moves to the target position and grasps the mating part 40, the positioning pin inserts into the positioning notch 422. Thus, during the transport of the wafer cassette 4, the positioning pin and the positioning notch 422 work together to limit the movement of the wafer cassette 4. In other words, the positioning notch 422, which is used to limit the movement in conjunction with the positioning pin, serves as a positioning mark before the robotic arm 10 grasps the wafer cassette 4. This utilizes the inherent structure of the wafer cassette 4 to achieve precise alignment and grasping between the wafer cassette 4 and the robotic arm 10, which simplifies the system structure and improves grasping efficiency.

[0046] In some embodiments, such as Figure 1As shown, the robotic arm 10 includes a robotic arm 12 and a gripper assembly 14. The gripper assembly 14 is disposed on the robotic arm 12, and a positioning pin is disposed on the gripper assembly 14. A detection element 20 is disposed on at least one of the robotic arm 12 and the gripper assembly 14. When the robotic arm 10 is in the target position, the gripper assembly 14 can abut against the mating member 40 to grasp the mating member 40.

[0047] In this embodiment, the robotic arm 10 is defined as including a robotic arm 12 and a gripper assembly 14. Specifically, the detection element 20 is disposed on the robotic arm 12, or the detection element 20 is disposed on the gripper assembly 14, or a portion of the detection element 20 is disposed on the robotic arm 12 and another portion is disposed on the gripper assembly 14, or there are multiple detection elements 20, wherein at least one detection element 20 is disposed on the robotic arm 12 and at least one detection element 20 is disposed on the gripper assembly 14. The specific configuration can be adjusted according to actual needs.

[0048] Since the positioning pin is set on the gripper assembly 14, when the robot arm 10 moves to the target position, the robot arm 10 is controlled to move upward so that the gripper assembly 14 abuts against the mating part 40. At the same time, the positioning pin is inserted into the positioning notch 422, realizing the synchronous movement of the gripper assembly 14 and the positioning pin. This not only ensures the reliable transport of the wafer cassette 4, but also helps to further improve the gripping efficiency.

[0049] Optionally, the gripper assembly 14 includes multiple grippers, each of which can be opposed to the mating member 40 to grip the wafer cassette 4. A locating pin may be provided on one of the grippers.

[0050] In some embodiments, such as Figure 2 and Figure 3 As shown, the detection component 20 includes a laser beam sensor 22, which has an emitting part 222 and a receiving part 224. When the robot arm 10 is in the positioning position, the emitting part 222 and the receiving part 224 are located on opposite sides of the positioning notch 422, and the laser beam 5 emitted by the emitting part 222 passes through the positioning notch 422 and is received by the receiving part 224.

[0051] In this embodiment, one implementation method is defined. Specifically, the detection element 20 includes a laser beam sensor 22, wherein the laser beam sensor 22 has an emitting part 222 and a receiving part 224. When the robot arm 10 is in the positioning position, since the emitting part 222 and the receiving part 224 are respectively located on opposite sides of the positioning notch 422, for example, the emitting part 222 is located above the positioning notch 422 and the receiving part 224 is located below the positioning notch 422, the laser beam 5 emitted by the emitting part 222 passes through the positioning notch 422 and is received by the receiving part 224. At this time, the laser beam sensor 22 can output a conduction signal to the control module 30. The control module 30 can determine the position of the positioning notch 422 based on the conduction signal, and thus determine the relative position between the mating part 40 and the robot arm 10.

[0052] By setting the detection element 20 as a laser beam sensor 22, complex image processing or precise contact measurement is eliminated, and a simple and reliable laser beam continuity detection is used as the direct basis for position determination. The problem of position alignment in three-dimensional space is transformed into a one-dimensional binary signal judgment of "light path continuity", which greatly simplifies signal processing and calculation logic and results in extremely fast response speed.

[0053] Moreover, the laser beam 5-way beam detection principle is simple, and the response speed is in the millisecond range, which is much faster than the image processing flow of machine vision, greatly improving the detection cycle. Compared with vision sensors, which are affected by ambient light, dust, etc., the laser beam sensor 22 (especially the modulated laser) has stronger resistance to light interference and is more stable and reliable in industrial environments.

[0054] Furthermore, it eliminates the need for complex lenses, cameras, and image processing units; the core sensor is low-cost; the system structure is simple; and it is easy to install and maintain. Moreover, the laser beam is extremely fine, making it sensitive to minute changes in position; with proper optical path design, it can detect alignment deviations at the sub-millimeter level.

[0055] In some embodiments, such as Figure 2 As shown, the mating part 40 also includes a target notch 44, which is arranged at intervals with the positioning notch 422 along the moving direction X of the robot arm 10. When the robot arm 10 is in the target position, the transmitting part 222 and the receiving part 224 are located on opposite sides of the target notch 44, and the laser beam 5 emitted by the transmitting part 222 passes through the target notch 44 and is received by the receiving part 224.

[0056] In this embodiment, the mating component 40 has a positioning notch 422 and a target notch 44. When the robot arm 10 moves to the positioning position, the position of the positioning notch 422 is determined according to the detection result of the detection component 20, and then the relative position of the mating component 40 and the detection component 20 is determined. Based on the relative position, the robot arm 10 is controlled to move to the target position. At this time, the laser beam 5 emitted by the emitting unit 222 passes through the target notch 44 and is received by the receiving unit 224, indicating that the robot arm 10 has reached the target position. That is, while locking the target position, the robot arm 10 is verified to have reached the target position, further realizing the precise alignment and gripping of the mating component 40 by the robot arm 10, shortening the gripping time, improving the gripping efficiency, and thus improving the cycle time and handling reliability of the entire wafer production line.

[0057] In some embodiments, the number of laser beam sensors 22 is multiple. When the robot arm 10 is in the positioning position, the laser beams 5 emitted by the emitting parts 222 of at least two laser beam sensors 22 pass through the positioning notches 422 respectively, and / or, the number of positioning notches 422 is at least two, and the laser beams 5 emitted by the emitting parts 222 of at least two laser beam sensors 22 pass through at least two positioning notches 422 respectively.

[0058] In this embodiment, the number of laser beam sensors 22 is limited to multiple. Specifically, when the robot arm 10 is in the positioning position, the laser beams 5 emitted by the emitting parts 222 of at least two laser beam sensors 22 pass through the positioning notch 422 respectively, that is, at least two laser beam sensors 22 correspond to one positioning notch 422, and / or, the laser beams 5 emitted by the emitting parts 222 of at least two laser beam sensors 22 pass through at least two positioning notches 422 respectively, that is, at least two laser beam sensors 22 correspond to at least two positioning notches 422 respectively. The specific configuration can be adjusted according to actual needs.

[0059] By setting the number of laser beam sensors 22 to multiple, the detection accuracy of the positioning notch 422 can be improved, thereby enhancing the detection accuracy of the relative position between the mating part 40 and the robot arm 10, and further realizing the precise alignment and accurate grasping of the mating part 40.

[0060] Optionally, when at least two laser beam sensors 22 correspond to one positioning notch 422, the laser beams 5 emitted by the emitting parts 222 of the at least two laser beam sensors 22 are not coplanar, that is, they pass through the positioning notch 422 from different heights or different angles. Thus, when the robot arm 10 moves to the positioning position, the laser beam sensors 22 at different heights will be "activated" at different times.

[0061] By recording the precise moment when each laser beam sensor 22 switches from "off" to "on", and combining this with the known spatial coordinates of each laser beam 5, the three-dimensional spatial line position of the positioning notch 422 can be calculated. This allows for a more accurate deduction of the position and tilt angle of the mating part 40. By treating the movement process as a scanning process, it is possible not only to detect horizontal offset but also to detect whether the mating part 40 is tilted (parallelism), providing more positional information and achieving higher precision position compensation.

[0062] In some embodiments, the detection element 20 includes a plurality of photoelectric sensors. When the robot arm 10 is in the positioning position, at least one photoelectric sensor emits a light spot that enters the positioning notch 422, and the light spot emitted by at least one photoelectric sensor illuminates the surface of the mating element 40.

[0063] In this embodiment, another implementation method is defined. Specifically, each photoelectric sensor operates independently. When the robot arm 10 is in the positioning position, the light spot emitted by at least one photoelectric sensor enters the positioning notch 422 and receives the light reflected back from the inner wall of the positioning notch 422. At the same time, the light spot emitted by at least one photoelectric sensor illuminates the surface of the mating part 40 and receives the light reflected back from the surface of the mating part 40.

[0064] Understandably, the photoelectric sensor located directly in front of the positioning notch 422 will output a signal that is drastically different from the signal when the light beam is incident on the smooth surface of the mating part 40 (where the reflected light intensity is higher). This is because the light beam from the photoelectric sensor can penetrate deep into the positioning notch 422, resulting in extremely weak or no reflected light. By identifying which photoelectric sensors are in the "notch signal" state, the position of the positioning notch 422 can be precisely delineated, thereby calculating the relative position between the mating part 40 and the robotic arm 10.

[0065] By forming a two-dimensional array analysis of multi-point reflection intensity, the transmitter and receiver do not need to be perfectly aligned, resulting in greater installation tolerance. Furthermore, it can simultaneously detect the angular and radial positions of the positioning notch 422, providing richer information and strong resistance to minor contamination; even if individual photoelectric sensors are blocked, it will not affect the overall judgment.

[0066] Optionally, the photoelectric sensor can be a miniature photoelectric diffuse reflection sensor or a miniature photoelectric mirror reflection sensor, that is, a dense array of multiple miniature photoelectric diffuse reflection sensors or miniature photoelectric mirror reflection sensors can be integrated on the robot arm 10.

[0067] In some embodiments, the detection element 20 includes a semiconductor image sensor and a laser source. When the robot arm 10 is in the positioning position, the linear laser emitted by the laser source illuminates the positioning notch 422 and the surface of the mating member 40, forming a positioning light band, which is then captured by the semiconductor image sensor.

[0068] This embodiment defines yet another implementation method. It is understood that the laser line (positioning light band) captured by the semiconductor image sensor will produce a characteristic "depression" or "break" at the positioning notch 422 due to a sudden change in depth. By identifying the position of this feature point through image processing algorithms, the precise offset of the robot arm 10 relative to the positioning notch 422 can be calculated. This is a one-dimensional vision-based detection method with a simple structure, large information capacity, and high accuracy. It can achieve non-contact micron-level displacement measurement and directly provide continuous positional deviations.

[0069] Alternatively, the semiconductor image sensor can be a miniature linear CMOS (complementary metal-oxide-semiconductor) sensor with high resolution, adapted to a linear laser light source.

[0070] In some embodiments, the positioning part 42 includes a plurality of positioning surfaces, which are respectively disposed on the outer periphery of the mating part 40, and the detection part 20 includes a plurality of distance detection parts. When the robot arm 10 is in the positioning position, the plurality of distance detection parts are respectively disposed opposite to the plurality of positioning surfaces, and are used to detect the distance between each distance detection part and the positioning surface opposite it.

[0071] In this embodiment, a fourth implementation method is defined. Specifically, when the robot arm 10 is in the positioning position, multiple distance detection units are respectively arranged opposite to multiple positioning surfaces. The multiple distance detection units measure the distance between their probes and the positioning surfaces in real time. If the mating part 40 is centered, the multiple distance values ​​are equal. If there is an offset, the multiple distance values ​​will change in pairs. By comparing the multiple distance values, the offset of the center of the mating part 40 relative to the center of the multiple distance detection units can be directly calculated, that is, the relative position between the mating part 40 and the robot arm 10.

[0072] Since the detection focuses on the outer contour edge of the mating part 40, with the mechanical center of the mating part 40 as the detection reference, the principle is more direct. Compared to the positioning notch 422, it does not depend on the specific shape of the notch and can be applied to mating parts 40 with different notch forms. Moreover, it detects the reference that needs to be aligned during the final gripping, making the logic simpler.

[0073] Optionally, the distance detection unit can be an eddy current proximity sensor or a capacitive proximity sensor.

[0074] Optionally, the number of distance detection units corresponds one-to-one with the number of positioning surfaces. Alternatively, multiple distance detection units can be arranged opposite to a positioning surface. Specifically, there can be four distance detection units, with the four units corresponding to the four sides of the mating component 40 when the robot arm 10 is in the positioning position.

[0075] In some embodiments, the positioning unit 42 includes an identification tag, and the detection unit 20 includes a tag reader. When the robot arm 10 is in the positioning position, the tag reader is able to read the identification tag.

[0076] This embodiment defines a fifth implementation. Specifically, a signal source (identification tag) is built into the mating part 40, and a corresponding reader (tag reader) is integrated into the robot arm 10. When the robot arm 10 moves to the positioning position, the tag reader can read the identification tag, and thus calculate the position of the identification tag (matting part 40) relative to the tag reader (robot arm 10) based on the read signal strength, realizing active detection. The detection process can be initiated at a greater distance. This achieves non-contact, long-distance, and pre-positioning, thereby allowing the trajectory to be adjusted in advance during the robot arm 10's approach, further improving the production cycle.

[0077] Optionally, the identification tag can be a miniature radio frequency (RF) tag or a magnetic beacon, i.e., a miniature RF tag or magnetic beacon is pre-embedded inside the mushroom head (mating part 40) of the wafer cassette 4. A corresponding RFID reader or magnetic sensor array is integrated on the robotic arm 10. Specifically, when the robotic arm 10 approaches the wafer cassette 4, the tag reader begins to read the tag signal. By detecting the distribution of RF signal strength (RSSI) on the sensor array, or the spatial distribution of the magnetic field, and using an angle of arrival or signal strength positioning algorithm, the three-dimensional position and angle of the identification tag (i.e., the mushroom head) relative to the tag reader (i.e., the robotic arm 10) are calculated in real time.

[0078] Secondly, this embodiment provides a wafer caching device, including the robot 1 described in the first aspect embodiment above. Since the wafer caching device shown in this embodiment includes the robot 1 described in the first aspect embodiment, it possesses all the beneficial technical effects of the robot 1, which will not be elaborated further here.

[0079] Thirdly, this embodiment provides a wafer cassette gripping method for the robot described in the first aspect embodiment. Since the wafer cassette gripping method shown in this embodiment is used with the robot described in the first aspect embodiment, it possesses all the beneficial technical effects of that robot, and will not be elaborated further here.

[0080] like Figure 5 As shown, this embodiment provides a wafer cassette gripping method, including: Step 102: Control the robot arm to move to the positioning position so that the detection part is positioned relative to the positioning part; Step 104: Determine the relative position between the mating part and the robot arm based on the inspection results of the inspected part; Step 106: Based on the relative position, control the robotic arm to move from the positioning position to the target position; Step 108: With the robotic arm in the target position, control the robotic arm to grasp the mating part.

[0081] The wafer cassette gripping method provided in this embodiment allows the robotic arm to move from a positioning position to a target position. It can be understood that the positioning position is the position the robotic arm is in before moving to the target position. Specifically, in the direction of movement, the robotic arm first passes through the positioning position and finally reaches the target position.

[0082] When the robot arm is in the positioning position, the detection component is positioned relative to the positioning part. Therefore, the detection component can output detection information to the control module. This detection information may include the position information of the positioning part or the distance information between the positioning part and the detection component, so that the control module can determine the relative position between the mating part and the robot arm.

[0083] Before gripping the wafer cassette, the relative position between the mating component and the robotic arm is determined based on the inspection results of the inspection component. Then, the robotic arm is controlled to move to the target position according to the determined relative position. This allows for position adjustment of the robotic arm before gripping, enabling precise one-time alignment and gripping of the mating component. This significantly shortens the overall gripping time, effectively improves the gripping efficiency of the wafer cassette, and thus helps to increase production cycle time.

[0084] Moreover, compared to blind grasping and multiple fine adjustments after contact in related technologies, controlling the movement of the robot arm based on the relative position of the mating parts and the robot arm can achieve precise locking of the target position, ensuring accurate grasping of the wafer cassette while avoiding collisions, which is conducive to improving the stability and reliability of the entire semiconductor manufacturing process.

[0085] Furthermore, the inspection process is seamlessly integrated into the gripping preparation action. The process of the robotic arm moving towards the wafer cassette with the inspection component is simultaneously the inspection process. The position of the robotic arm can be adjusted before the gripping action, achieving efficient integration of inspection and position adjustment.

[0086] In some embodiments, controlling the robot arm to move from a positioning position to a target position based on the relative position specifically includes: determining a movement compensation amount of the robot arm relative to the target position in the robot arm's movement direction based on the relative position; and controlling the robot arm to move from the positioning position to the target position based on the movement compensation amount.

[0087] In this embodiment, when the robot arm is in the positioning position, the relative position between the robot arm and the mating part can be determined according to the detection information output by the detection component. Then, the movement compensation amount of the robot arm relative to the target position in the movement direction can be calculated. Based on the movement compensation amount, the robot arm is controlled to move to the target position, which can achieve precise locking of the target position of the robot arm, realize non-contact, fast and accurate alignment and grasping, improve grasping efficiency, success rate and accuracy, and reduce the risk of equipment damage.

[0088] In some embodiments, the positioning part includes a positioning notch, and the detection element includes a laser beam sensor. The laser beam sensor includes an emitting part and a receiving part. When the robot is in the positioning position, the laser beam emitted by the emitting part passes through the positioning notch and is received by the receiving part, and the laser beam sensor outputs a conduction signal. Based on the detection result of the detection element, the relative position between the mating part and the robot is determined, specifically including: receiving the conduction signal output by the laser beam sensor to determine the position of the positioning notch; and determining the relative position between the mating part and the robot based on the position of the positioning notch.

[0089] In this embodiment, one implementation method is defined. Specifically, the detection element includes a laser beam sensor, which has an emitting part and a receiving part. When the robot is in the positioning position, since the emitting part and the receiving part are located on opposite sides of the positioning notch, for example, the emitting part is located above the positioning notch and the receiving part is located below the positioning notch, the laser beam emitted by the emitting part passes through the positioning notch and is received by the receiving part. At this time, the laser beam sensor can output a conduction signal to the control module. The control module can determine the position of the positioning notch based on the conduction signal, and thus determine the relative position between the mating part and the robot.

[0090] By setting the detection element as a laser beam sensor, complex image processing or precise contact measurement is eliminated, and a simple and reliable laser beam continuity detection is used as the direct basis for position determination. The problem of alignment in three-dimensional space is transformed into a one-dimensional binary signal judgment of "light path continuity", which greatly simplifies signal processing and calculation logic and results in extremely fast response speed.

[0091] Moreover, laser beam through-beam detection is simple in principle and has a response speed in the millisecond range, far faster than the image processing of machine vision, greatly improving the detection cycle time. Compared to vision sensors, which are affected by ambient light and dust, laser beam through-beam sensors (especially modulated lasers) are more resistant to light interference and are more stable and reliable in industrial environments.

[0092] Furthermore, it eliminates the need for complex lenses, cameras, and image processing units; the core sensor is low-cost; the system structure is simple; and it is easy to install and maintain. Moreover, the laser beam is extremely fine and sensitive to minute changes in position; with proper optical path design, it can detect alignment deviations at the sub-millimeter level.

[0093] In one specific embodiment, the wafer cassette 4 is the object to be detected and grasped, and its top mushroom head (mating part 40) has a specific positioning notch 422. The laser beam sensor 22 consists of a pair of laser emitting ends (emitting part 222) and laser receiving ends (receiving part 224), preferably arranged at a certain spatial angle (e.g., diagonally). The robotic arm 10 is the mechanism for performing grasping and movement.

[0094] The detection method's steps and principles: Preliminary alignment: The robotic arm moves the detection component at its end. Robotic arm grasping and detecting the mushroom head: The robotic arm moves horizontally, allowing the mushroom head to slide into it. A laser beam sensor illuminates the positioning notch, thus determining the relative position of the robotic arm and the mushroom head. Signal discrimination and calculation: When the notch on the mushroom head is perfectly aligned with the laser beam path, the laser beam emitted from the laser emitter will pass through the notch without obstruction and be normally received by the laser receiver on the opposite side. The laser beam sensor outputs a "pass" signal. If the laser beam is blocked by the solid part of the mushroom head, the receiver cannot receive the light or the signal strength is below the threshold. The sensor outputs a "disconnect" signal, indicating that the robotic arm has not moved to the positioning position, or the robotic arm has not moved to the target position.

[0095] The location of the notch can be determined by detecting the conduction status of the laser beam sensor. Combining this with the geometry of the mushroom head and the installation position of the laser sensor, the offset of the robotic arm relative to the target position can be calculated. The control module generates a compensation command based on the calculated offset. The robotic arm moves a corresponding distance along the direction of movement, aligning the mushroom head notch (target notch) with the preset correct position within the detection component (i.e., the laser beam should be able to pass through the target notch). After compensation, the robotic arm performs the final grasping action.

[0096] The laser beam sensor is used to detect whether the laser beam can pass through the notch at a specific position on the mushroom head, so as to directly and quickly determine the current alignment status and calculate the movement compensation of the robot arm.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A robot, characterized in that, The robot is used to transport wafer cassettes, the wafer cassettes including mating parts, the mating parts having positioning parts, and the robot comprising: A robotic arm capable of moving from a positioning position to a target position; A detection element is disposed on the robotic arm, and when the robotic arm is located in the positioning position, the detection element is disposed opposite to the positioning part; The control module is electrically connected to either the detection component or the robotic arm, and is used to determine the relative position between the mating component and the robotic arm based on the detection result of the detection component, and to control the robotic arm to move from the positioning position to the target position based on the relative position; When the robotic arm is located at the target position, the robotic arm is able to grasp the mating component.

2. The robot according to claim 1, characterized in that, The positioning part includes a positioning notch, and the robotic arm includes a positioning pin; Wherein, when the robotic arm is located at the positioning position, the detection element is positioned opposite to the positioning notch; When the robotic arm grasps the mating part, the positioning pin is inserted into the positioning notch.

3. The robot according to claim 2, characterized in that, The robotic arm includes: robotic arm; A gripper assembly is disposed on the robotic arm, a positioning pin is disposed on the gripper assembly, and a detection element is disposed on at least one of the robotic arm and the gripper assembly; When the robotic arm is located at the target position, the gripper assembly can abut against the mating member to grasp the mating member.

4. The robot according to claim 2, characterized in that, The detection device includes a laser beam sensor, which has a transmitter and a receiver. When the robotic arm is in the positioning position, the transmitting part and the receiving part are respectively located on opposite sides of the positioning notch. The laser beam emitted by the transmitting part passes through the positioning notch and is received by the receiving part.

5. The robot according to claim 4, characterized in that, The mating component also includes a target notch, which is arranged at intervals from the positioning notch along the moving direction of the robot arm; When the robotic arm is located at the target position, the transmitting part and the receiving part are located on opposite sides of the target gap, respectively. The laser beam emitted by the transmitting part passes through the target gap and is received by the receiving part.

6. The robot according to claim 4, characterized in that, The number of laser beam sensors is multiple; When the robotic arm is in the positioning position, laser beams emitted by the emitting parts of at least two of the laser beam sensors pass through the positioning gaps respectively, and / or, the number of positioning gaps is at least two, and laser beams emitted by the emitting parts of at least two of the laser beam sensors pass through at least two of the positioning gaps respectively.

7. The robot according to claim 2, characterized in that, The detection device includes multiple photoelectric sensors; When the robotic arm is in the positioning position, at least one of the photoelectric sensors emits a light spot that enters the positioning notch, and at least one of the photoelectric sensors emits a light spot that illuminates the surface of the mating part.

8. The robot according to claim 2, characterized in that, The detection device includes a semiconductor image sensor and a laser light source; When the robotic arm is in the positioning position, the line laser emitted by the laser source illuminates the positioning notch and the surface of the mating part respectively, forming a positioning light strip, and the semiconductor image sensor captures the positioning light strip.

9. The robot according to claim 1, characterized in that, The positioning part includes multiple positioning surfaces, which are respectively disposed on the outer periphery of the mating part; the detection part includes multiple distance detection parts. When the robotic arm is in the positioning position, multiple distance detection units are respectively arranged opposite to multiple positioning surfaces to detect the distance between each distance detection unit and the positioning surface opposite to it.

10. The robot according to claim 1, characterized in that, The positioning unit includes an identification tag, and the detection element includes a tag reader; When the robotic arm is in the specified positioning position, the tag reader is able to read the identification tag.

11. A wafer cache device, characterized in that, Including the robot as described in any one of claims 1 to 10.

12. A method for gripping a wafer cassette, characterized in that, For a robot as described in any one of claims 1 to 10, the grasping method comprises: The robotic arm is controlled to move to a positioning position so that the detection element is positioned opposite to the positioning part; Based on the detection results of the detection component, the relative position between the mating component and the robotic arm is determined; Based on the relative position, control the robotic arm to move from the positioning position to the target position; When the robotic arm is in the target position, control the robotic arm to grasp the mating part.

13. The wafer cassette gripping method according to claim 12, characterized in that, The step of controlling the robotic arm to move from the positioning position to the target position based on the relative position specifically includes: Based on the relative position, determine the amount of movement compensation of the robot arm relative to the target position in the robot arm's movement direction; Based on the movement compensation amount, the robot arm is controlled to move from the positioning position to the target position.

14. The wafer cassette gripping method according to claim 12, characterized in that, The positioning part includes a positioning notch, and the detection element includes a laser beam sensor. The laser beam sensor includes an emitting part and a receiving part. When the robot is located at the positioning position, the laser beam emitted by the emitting part passes through the positioning notch and is received by the receiving part. The laser beam sensor outputs a conduction signal. Determining the relative position between the mating component and the robotic arm based on the detection results of the detection component specifically includes: Receive the conduction signal output by the laser beam sensor to determine the position of the positioning notch; The relative position between the mating component and the robotic arm is determined based on the location of the positioning notch.

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