Leveling device, wafer alignment apparatus, and leveling method

Abstract

The application belongs to the technical field of semiconductor material bonding, and discloses a leveling device, wafer alignment equipment and a leveling method. The leveling device comprises a base, a support frame and a leveling mechanism. The support frame is installed on the base. A clamp adapter is arranged on the support frame. A clamp tool is arranged on the clamp adapter. The clamp tool is used for fixing a first wafer. The leveling mechanism is arranged on the base. A chuck is arranged on the top of the leveling mechanism. The chuck is used for fixing a second wafer. The leveling mechanism is configured to be capable of adjusting the parallelism of the chuck. The clamp adapter comprises a driving member and a ball assembly in transmission connection with the output end of the driving member. The ball assembly comprises a connecting member and a ball. The driving member is configured to be capable of driving the ball assembly to move between the clamp tool and the chuck, so that the two ends of the ball are in contact with the clamp tool and the chuck, respectively. The wafer alignment equipment comprises the above leveling device. The leveling method is completed by using the above leveling device. The application can effectively improve the leveling precision and is simple to operate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor material bonding technology, and in particular to a leveling device, wafer alignment equipment and leveling method. Background Technology

[0002] A wafer is the core substrate (also known as a substrate) for manufacturing semiconductor transistors or integrated circuits. It is called a wafer because it is made of crystalline materials and has a circular shape. As the fundamental carrier for semiconductor device manufacturing, the processing precision of the wafer directly determines the performance, reliability, and integration level of the semiconductor device. Wafer bonding or temporary bonding processes are key steps in semiconductor manufacturing to achieve three-dimensional integration and ultra-thin packaging of devices. They are widely used in MEMS, power devices, and advanced packaging, and are one of the core processes driving the semiconductor industry towards high integration and high performance.

[0003] Before bonding or temporary bonding of two wafers, wafer alignment is an indispensable pre-process. Alignment accuracy is a core performance parameter ensuring bonding quality, directly affecting chip area utilization, and is a crucial prerequisite for avoiding bonding failures and improving device yield. In actual production, the first and second wafers must first be mounted on a fixture before being transferred to the bonding chamber for bonding. The alignment process is completed during the wafer mounting process. Specifically, the fixture is mounted to a fixture adapter, the first wafer is fixed on the fixture, and then the second wafer is fixed on the chuck. Alignment is achieved by identifying the marks on the two wafers using an identification unit. However, because the fixture and chuck need to be installed and repeatedly loaded for each pair of wafers, factors such as repeated clamping, assembly gaps, and machining errors make it difficult to maintain ideal parallelism between the fixture and the chuck after each reloading. This leads to problems such as relative tilting and inconsistent reference surfaces between the two wafers before entering the alignment process, affecting alignment accuracy and bonding quality.

[0004] Therefore, there is an urgent need to provide a leveling device, wafer alignment equipment, and leveling method to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this invention is to provide a leveling device, a wafer alignment device, and a leveling method, which aims to solve the problems of wafer tilting and inconsistent reference planes caused by insufficient parallelism between the fixture and chuck in the existing wafer bonding process. The leveling device, wafer alignment device, and leveling method can effectively improve alignment accuracy and bonding quality, and increase device yield.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The leveling device includes:

[0008] Base;

[0009] A support frame is mounted on the base, and a clamp adapter is provided on the support frame. A clamp fixture is provided on the clamp adapter, and the clamp fixture is used to fix the first wafer.

[0010] A leveling mechanism is disposed on the base, and a chuck is provided on the top of the leveling mechanism. The chuck is positioned below the fixture and is used to fix the second wafer. The leveling mechanism is configured to adjust the parallelism of the chuck.

[0011] The fixture adapter includes a drive member and a ball assembly that is throttle-connected to the output end of the drive member. The ball assembly includes a connector and a ball. The ball is movably disposed on the connector, and both ends of the ball protrude from the upper and lower end faces of the connector. The drive member is configured to drive the ball assembly to move between the fixture fixture and the chuck, such that both ends of the ball contact the fixture fixture and the chuck, respectively.

[0012] In some possible implementations, the leveling mechanism includes:

[0013] A first substrate is disposed on the base;

[0014] The second substrate is disposed above the first substrate at a distance, and the chuck is disposed on the second substrate;

[0015] Multiple driving components are provided, and the multiple driving components are evenly disposed between the first substrate and the second substrate. The driving components are used to drive the second substrate to move up and down in the vertical direction.

[0016] Multiple limiting components are provided, and the multiple limiting components are evenly disposed between the first substrate and the second substrate. The limiting components can adaptively deflect according to the position of the second substrate.

[0017] Multiple tension springs are provided, and the multiple tension springs are evenly disposed between the first substrate and the second substrate.

[0018] In some possible implementations, the drive assembly includes a cylinder, the fixed end of which is connected to the first substrate, and the output end of which has a protruding structure that forms point contact with the second substrate.

[0019] In some possible implementations, the limiting assembly includes a needle roller guide post and a spherical bearing, wherein the fixed end of the needle roller guide post is fixedly connected to the first substrate, the inner ring of the spherical bearing is fixedly connected to the movable end of the needle roller guide post, and the outer ring of the spherical bearing is slidably connected to the second substrate.

[0020] In some possible implementations, the chuck includes a disc body and a first protruding ring protruding from the outer peripheral surface of the disc body, and the fixture includes a fixture body and a second protruding ring protruding from the outer peripheral surface of the fixture body, wherein the two ends of the ball can respectively contact the first protruding ring and the second protruding ring.

[0021] In some possible implementations, the connector includes a first limiting plate and a second limiting plate that are parallel to each other and connected by a connecting plate. The first limiting plate has a first limiting hole, and the second limiting plate has a second limiting hole that is directly opposite to the first limiting hole. The two ends of the ball are respectively movably limited within the first limiting hole and the second limiting hole. The diameter of the first limiting hole is smaller than the diameter of the ball, and the diameter of the second limiting hole is smaller than the diameter of the ball.

[0022] In some possible implementations, the fixture adapter is provided with a clearance groove, the drive is mounted on the base plate of the fixture adapter, the ball assembly is received in the clearance groove, and when leveled, the drive drives the ball assembly to extend out of the clearance groove and move between the fixture fixture and the chuck.

[0023] In some possible implementations, the connector further includes an extension plate, one end of which is connected to the connecting plate, and the other end of which is connected to the output end of the drive.

[0024] In some possible implementations, the leveling device further includes a lifting assembly disposed on the base, the leveling mechanism disposed at the output end of the lifting assembly, and the lifting assembly being configured to drive the leveling mechanism to move up and down.

[0025] Wafer alignment equipment, including a leveling device as described in any of the above embodiments.

[0026] The leveling method, using a leveling device as described in any of the above schemes, includes the following steps:

[0027] The fixture fixes the first wafer;

[0028] The chuck secures the second wafer;

[0029] The driving component drives the ball assembly to move between the fixture and the chuck;

[0030] The chuck is moved by the leveling mechanism, so that the chuck is leveled and the two ends of the ball contact the fixture and the chuck respectively.

[0031] The beneficial effects of this invention are:

[0032] The leveling device provided by this invention, by setting up a driving component and a ball assembly, drives the ball assembly to move between the fixture and the chuck. The leveling mechanism then adjusts the parallelism of the chuck so that the two ends of the ball contact the fixture and the chuck respectively. By leveling between the chuck and the fixture, the parallelism between the second wafer and the first wafer is indirectly adjusted. The operation is simple and the leveling accuracy is high, which can effectively improve the alignment accuracy and bonding quality, and improve the device yield.

[0033] The wafer alignment device provided by the present invention indirectly adjusts the parallelism between the second wafer and the first wafer by setting the above-mentioned leveling device and leveling between the chuck and the fixture tooling. It is easy to operate and has high leveling accuracy.

[0034] The leveling method provided by the present invention is completed using the above-mentioned leveling device. During leveling, the leveling mechanism drives the chuck to move, thereby leveling the chuck. At the same time, the two ends of the rolling ball contact the fixture and the chuck respectively. By leveling between the chuck and the fixture, the parallelism between the second wafer and the first wafer is indirectly adjusted. The operation is simple and the leveling accuracy is high. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the leveling device provided in an embodiment of the present invention;

[0036] Figure 2 This is a partial sectional view of the leveling device provided in an embodiment of the present invention;

[0037] Figure 3 yes Figure 2 A magnified view of a section at point A in the middle;

[0038] Figure 4 This is a three-dimensional view of the clamp adapter from one perspective provided in an embodiment of the present invention;

[0039] Figure 5 yes Figure 4 A magnified view of a section at point B in the middle;

[0040] Figure 6 This is a three-dimensional view of the clamp adapter from another perspective provided in an embodiment of the present invention;

[0041] Figure 7 This is a three-dimensional view of the leveling mechanism provided in an embodiment of the present invention;

[0042] Figure 8 This is a partial cross-sectional view of the leveling mechanism provided in an embodiment of the present invention.

[0043] In the picture:

[0044] 10. First wafer; 20. Second wafer;

[0045] 100. Fixture adapter; 110. Drive unit; 120. Ball assembly; 121. Connector; 1211. First limiting plate; 1212. Second limiting plate; 1213. Connecting plate; 1214. Extension plate; 122. Ball; 130. Base plate; 131. Clearance groove; 200. Fixture tooling; 210. Fixture body; 220. Second convex ring; 300. Leveling mechanism; 310. First base plate; 320. Second base plate; 330. Drive assembly; 331. Cylinder; 332. Protrusion structure; 340. Limiting assembly; 341. Needle roller guide post; 342. Spherical bearing; 350. Tension spring; 400. Chuck; 410. Disc body; 420. First convex ring; 500. Adsorption block; 600. Guide rail; 700. Slider; 800. Hook block. Detailed Implementation

[0046] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0047] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0048] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0049] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0050] This embodiment provides a leveling device, wafer alignment equipment, and leveling method, which is applicable to process scenarios where the bonding surfaces of two wafers are prohibited from contacting each other before bonding, and can achieve wafer leveling without contact.

[0051] like Figures 1 to 8 As shown, the leveling device includes a base, a support frame, and a leveling mechanism 300. The support frame is mounted on the base, and a clamp adapter 100 is mounted on the support frame. A clamp fixture 200 is mounted on the clamp adapter 100 and is used to fix the first wafer 10. The leveling mechanism 300 is mounted on the base, and a chuck 400 is mounted on top of the leveling mechanism 300, positioned below the clamp fixture 200. The chuck 400 is used to fix the second wafer 20, and the leveling mechanism 300 is configured to adjust the parallelism of the chuck 400. Optionally, an adsorption block 500 is mounted on top of the leveling mechanism 300, and the leveling mechanism 300 uses the adsorption block 500 to adsorb and fix the chuck 400. The fixture adapter 100 includes a drive member 110 and a ball assembly 120 that is pulsatorically connected to the output end of the drive member 110. The ball assembly 120 includes a connector 121 and a ball 122. The ball 122 is movably disposed on the connector 121, and both ends of the ball 122 protrude from the upper and lower end faces of the connector 121. The drive member 110 is configured to drive the ball assembly 120 to move between the fixture fixture 200 and the chuck 400, so that both ends of the ball 122 contact the fixture fixture 200 and the chuck 400, respectively.

[0052] The leveling device provided in this embodiment, by setting a driving component 110 and a ball assembly 120, drives the ball assembly 120 to move between the fixture 200 and the chuck 400. The leveling mechanism 300 then adjusts the parallelism of the chuck 400, so that the two ends of the ball 122 contact the fixture 200 and the chuck 400 respectively. By leveling between the chuck 400 and the fixture 200, the parallelism between the second wafer 20 and the first wafer 10 is indirectly adjusted. The operation is simple and the leveling accuracy is high, which can effectively improve the alignment accuracy and bonding quality, and improve the device yield.

[0053] In some embodiments, the leveling mechanism 300 includes a first substrate 310, a second substrate 320, a driving component 330, a limiting component 340, and a tension spring 350. The first substrate 310 is disposed on a base; the second substrate 320 is disposed above the first substrate 310 at intervals, and a chuck 400 is disposed on the second substrate 320; multiple driving components 330 are provided, and the multiple driving components 330 are evenly disposed between the first substrate 310 and the second substrate 320, and the driving components 330 are used to drive the second substrate 320 to move up and down in the vertical direction; multiple limiting components 340 are provided, and the multiple limiting components 340 are evenly disposed between the first substrate 310 and the second substrate 320, and the limiting components 340 can adaptively deflect according to the position of the second substrate 320; multiple tension springs 350 are provided, and the multiple tension springs 350 are evenly disposed between the first substrate 310 and the second substrate 320. By setting multiple limiting components 340 and multiple driving components 330, each of the multiple driving components 330 can independently drive the second substrate 320 to rise and fall in the vertical direction, adjust the tilt posture of the second substrate 320, and thus adjust the parallelism of the chuck 400 and the second wafer 20 on the chuck 400. At the same time, the multiple limiting components 340 can adaptively deflect according to the position of the second substrate 320, adapt to the change of the tilt angle of the second substrate 320, eliminate rigid interference during the leveling process, avoid jamming, and achieve high-precision parallelism adjustment of the second substrate 320 under the action of multiple driving components 330. One end of the tension spring 350 is connected to the first substrate 310 and the other end is connected to the second substrate 320. The tension spring 350 can always apply a downward reverse preload to the second substrate 320, which works in coordination with the upward driving force of the driving components 330 to prevent the second substrate 320 from becoming loose, suspended, or displaced during the driving process of the driving components 330, thereby improving the reliability of the leveling process.

[0054] Optionally, the drive assembly 330 includes a cylinder 331. The fixed end of the cylinder 331 is connected to the first substrate 310, and the output end of the cylinder 331 has a protruding structure 332. The protruding structure 332 forms point contact with the second substrate 320. Point contact transmits driving force through a small contact area, which can avoid large-area contact between the cylinder 331 and the second substrate 320, reduce friction or compression of the second substrate 320 by the cylinder 331, and prevent the second substrate 320 from warping or deforming due to uneven contact force. At the same time, point contact concentrates the driving force of the cylinder 331 on the contact point, reducing the lifting lag and offset problems caused by dispersed force, facilitating precise control of the lifting height and lifting speed of the second substrate 320, and ensuring smooth lifting process of the second substrate 320.

[0055] Optionally, both the first substrate 310 and the second substrate 320 are provided with hook blocks 800. The hook blocks 800 have mounting holes for hooking the tension spring 350. Both ends of the tension spring 350 are connected to the first substrate 310 and the second substrate 320 respectively through the hook blocks 800. The hook blocks 800 can serve as a connection reference for the tension spring 350, fixing it to preset positions on the first substrate 310 and the second substrate 320 respectively, precisely defining the connection points at both ends of the tension spring 350, preventing the tension spring 350 from shifting, falling off, or becoming entangled during stretching and contraction. The hooking engagement between the tension spring 350 and the hook blocks 800 allows for quick installation and removal of the tension spring 350, reducing maintenance costs. The hook blocks 800 can prevent the tension of the tension spring 350 from directly acting on the first substrate 310 and the second substrate 320, preventing damage or deformation of the first substrate 310 and the second substrate 320 due to localized stress concentration.

[0056] In some embodiments, the limiting component 340 includes a needle roller guide post 341 and a spherical bearing 342. The fixed end of the needle roller guide post 341 is fixedly connected to the first substrate 310, the inner ring of the spherical bearing 342 is fixedly connected to the movable end of the needle roller guide post 341, and the outer ring of the spherical bearing 342 is slidably connected to the second substrate 320. The needle roller guide post 341 has a precise vertical guiding function and can limit horizontal offset and torsion. The needle roller guide post 341 can ensure that the second base plate 320 does not wobble or misalign during the lifting process, and provides a stable vertical support reference for the spherical bearing 342. Together with the drive component 330, it realizes the vertical positioning of the second base plate 320. The spherical bearing 342 has an angle adaptive capability and can generate a small angle deflection in any direction. When the drive strokes of multiple drive components 330 are inconsistent, the second base plate 320 will tilt. The spherical bearing 342 can follow the tilt angle of the second base plate 320 in real time and automatically make a small angle adaptive deflection to avoid the stiffness, jamming, stress concentration and movement jamming caused by rigid connection. In addition, by setting the outer ring of the spherical bearing 342 to slide and connect with the second base plate 320, when the second base plate 320 tilts, the connection point between the second base plate 320 and the limiting component 340 will generate a small horizontal displacement. The sliding connection can absorb the micro displacement, retain unidirectional sliding, and ensure smooth and non-interfering movement. In this embodiment, both the needle roller guide post 341 and the spherical bearing 342 are standard parts, and the specific structures of the needle roller guide post 341 and the spherical bearing 342 will not be described in detail.

[0057] Optionally, the limiting component 340 also includes a guide rail 600 disposed at the bottom of the second substrate 320 and a slider 700 that slides with the guide rail 600. The outer ring of the spherical bearing 342 is fixedly connected to the slider 700. The sliding engagement between the slider 700 and the guide rail 600, as well as the angular adaptive capability of the spherical bearing 342, can achieve dual adaptation of angle and micro-displacement, ensuring smooth and interference-free movement of the second substrate 320.

[0058] In some embodiments, the chuck 400 includes a chuck body 410 and a first protruding ring 420 protruding from the outer peripheral surface of the chuck body 410. The fixture 200 includes a fixture body 210 and a second protruding ring 220 protruding from the outer peripheral surface of the fixture body 210. The two ends of the ball 122 can respectively contact the first protruding ring 420 and the second protruding ring 220. The first protruding ring 420 and the second protruding ring 220 belong to the non-wafer carrier area, which can avoid scratches, pressure damage, and wafer contamination, thereby improving yield.

[0059] Optionally, the connector 121 includes a first limiting plate 1211 and a second limiting plate 1212 that are parallel to each other and connected by a connecting plate 1213. The first limiting plate 1211 has a first limiting hole, and the second limiting plate 1212 has a second limiting hole that is directly opposite to the first limiting hole. The two ends of the ball 122 are respectively movably limited within the first limiting hole and the second limiting hole. The diameter of the first limiting hole is smaller than the diameter of the ball 122, and the diameter of the second limiting hole is smaller than the diameter of the ball 122. The first limiting hole and the second limiting hole limit the ball 122 from both ends, and both holes are smaller than the diameter of the ball 122. The ball 122 is movably constrained between the first limiting hole and the second limiting hole and will not come out of the connector 121. During assembly and movement, the ball 122 has high stability and no risk of falling off.

[0060] In some embodiments, the clamp adapter 100 is provided with a clearance groove 131, the drive member 110 is mounted on the base plate 130 of the clamp adapter 100, and the ball assembly 120 is received within the clearance groove 131. During leveling, the drive member 110 drives the ball assembly 120 to extend from the clearance groove 131 and move between the clamp fixture 200 and the chuck 400. By providing the clearance groove 131, the ball assembly 120 is received within the clearance groove 131, avoiding interference with other components, preventing collisions, jamming, or foreign object entry during movement, and improving operational stability and service life.

[0061] Preferably, the connector 121 further includes an extension plate 1214, one end of which is connected to the connecting plate 1213, and the other end of which is connected to the output end of the drive member 110. By providing the extension plate 1214, the ball assembly 120 is completely housed within the clearance groove 131 in the vertical direction, optimizing the structural distribution and further improving operational stability and service life.

[0062] Optionally, the leveling device further includes a lifting assembly, which is disposed on the base. The leveling mechanism 300 is disposed at the output end of the lifting assembly, and the lifting assembly is configured to drive the leveling mechanism 300 to rise and fall. By providing the lifting assembly, the lifting assembly can drive the leveling mechanism 300 to rise and fall, thereby facilitating the adjustment of the position of the second wafer 20 by adjusting the height of the chuck 400 of the leveling mechanism 300 and the second wafer 20 disposed on the chuck 400.

[0063] This embodiment also provides a wafer alignment device, including the leveling device described above.

[0064] The wafer alignment equipment provided in this embodiment, by setting the above-mentioned leveling device, indirectly adjusts the parallelism between the second wafer 20 and the first wafer 10 through the leveling between the chuck 400 and the fixture 200. The operation is simple and the leveling accuracy is high.

[0065] This embodiment also provides a leveling method using the above-described leveling device. The leveling method includes the following steps:

[0066] S1. Fixture 200 fixes the first wafer 10;

[0067] S2, Chuck 400 fixes the second wafer 20;

[0068] S3, the drive unit 110 drives the ball assembly 120 to move between the fixture 200 and the chuck 400;

[0069] S4. The chuck 400 is moved by the leveling mechanism 300, so that the chuck 400 is leveled and the two ends of the ball 122 are in contact with the fixture 200 and the chuck 400 respectively.

[0070] The leveling method provided in this embodiment is accomplished using the aforementioned leveling device. During leveling, the leveling mechanism 300 drives the chuck 400 to move, thereby leveling the chuck 400. Simultaneously, both ends of the ball 122 contact the fixture 200 and the chuck 400, respectively. Through the leveling between the chuck 400 and the fixture 200, the parallelism between the second wafer 20 and the first wafer 10 is indirectly adjusted. The operation is simple, and the leveling accuracy is high, which can effectively improve the alignment accuracy and bonding quality, and increase the device yield.

[0071] Optionally, after step S3 and before step S4, the method further includes:

[0072] The leveling mechanism 300 is driven to rise by the lifting component, so that the second wafer 20 fixed to the chuck 400 is moved to the preset position.

[0073] The lifting assembly can drive the leveling mechanism 300 to rise and fall, thereby adjusting the height of the chuck 400 and the second wafer 20 set on the chuck 400 through the lifting and falling of the leveling mechanism 300, so as to facilitate the adjustment of the position of the second wafer 20.

[0074] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A leveling device, characterized in that, include: Base; A support frame is mounted on the base, and a clamp adapter (100) is provided on the support frame. A clamp fixture (200) is provided on the clamp adapter (100), and the clamp fixture (200) is used to fix the first wafer (10). A leveling mechanism (300) is disposed on the base. A chuck (400) is disposed on the top of the leveling mechanism (300) and below the fixture (200). The chuck (400) is used to fix the second wafer (20). The leveling mechanism (300) is configured to adjust the parallelism of the chuck (400). The fixture adapter (100) includes a drive member (110) and a ball assembly (120) pulsatorically connected to the output end of the drive member (110). The ball assembly (120) includes a connector (121) and a ball (122). The ball (122) is movably disposed on the connector (121), and both ends of the ball (122) protrude from the upper and lower end faces of the connector (121). The drive member (110) is configured to drive the ball assembly (120) to move between the fixture fixture (200) and the chuck (400), such that both ends of the ball (122) contact the fixture fixture (200) and the chuck (400) respectively.

2. The leveling device according to claim 1, characterized in that, The leveling mechanism (300) includes: A first substrate (310) is disposed on the base; The second substrate (320) is disposed above the first substrate (310) at intervals, and the chuck (400) is disposed on the second substrate (320); Multiple driving components (330) are provided, and the multiple driving components (330) are evenly disposed between the first substrate (310) and the second substrate (320). The driving components (330) are used to drive the second substrate (320) to move up and down in the vertical direction. Multiple limiting components (340) are provided, and the multiple limiting components (340) are evenly disposed between the first substrate (310) and the second substrate (320). The limiting components (340) can adaptively deflect according to the position of the second substrate (320). Multiple tension springs (350) are provided, and the multiple tension springs (350) are evenly disposed between the first substrate (310) and the second substrate (320).

3. The leveling device according to claim 2, characterized in that, The drive assembly (330) includes a cylinder (331), the fixed end of which is connected to the first substrate (310), and the output end of the cylinder (331) has a protrusion structure (332) that forms point contact with the second substrate (320).

4. The leveling device according to claim 2, characterized in that, The limiting component (340) includes a needle roller guide post (341) and a spherical bearing (342). The fixed end of the needle roller guide post (341) is fixedly connected to the first substrate (310), the inner ring of the spherical bearing (342) is fixedly connected to the movable end of the needle roller guide post (341), and the outer ring of the spherical bearing (342) is slidably connected to the second substrate (320).

5. The leveling device according to claim 1, characterized in that, The chuck (400) includes a disc body (410) and a first protruding ring (420) protruding from the outer peripheral surface of the disc body (410). The fixture (200) includes a fixture body (210) and a second protruding ring (220) protruding from the outer peripheral surface of the fixture body (210). The two ends of the ball (122) can contact the first protruding ring (420) and the second protruding ring (220) respectively.

6. The leveling device according to claim 1, characterized in that, The connector (121) includes a first limiting plate (1211) and a second limiting plate (1212) that are parallel to each other and connected by a connecting plate (1213). The first limiting plate (1211) has a first limiting hole, and the second limiting plate (1212) has a second limiting hole that is directly opposite to the first limiting hole. The two ends of the ball (122) are respectively movably limited within the first limiting hole and the second limiting hole. The diameter of the first limiting hole is smaller than the diameter of the ball (122), and the diameter of the second limiting hole is smaller than the diameter of the ball (122).

7. The leveling device according to claim 6, characterized in that, The fixture adapter (100) is provided with a clearance groove (131). The drive member (110) is installed on the base plate (130) of the fixture adapter (100). The ball assembly (120) is received in the clearance groove (131). When leveled, the drive member (110) drives the ball assembly (120) to extend out of the clearance groove (131) and move between the fixture fixture (200) and the chuck (400).

8. The leveling device according to claim 7, characterized in that, The connector (121) further includes an extension plate (1214), one end of which is connected to the connecting plate (1213), and the other end of which is connected to the output end of the drive (110).

9. The leveling device according to claim 1, characterized in that, The leveling device further includes a lifting assembly, which is disposed on the base. The leveling mechanism (300) is disposed at the output end of the lifting assembly, and the lifting assembly is configured to drive the leveling mechanism (300) to rise and fall.

10. A wafer alignment device, characterized in that, Includes the leveling device as described in any one of claims 1-9.

11. A leveling method, characterized in that, Using the leveling device as described in any one of claims 1-9, the leveling method includes the steps of: The fixture (200) fixes the first wafer (10); The chuck (400) secures the second wafer (20); The drive unit (110) drives the ball assembly (120) to move between the fixture (200) and the chuck (400); The chuck (400) is moved by the leveling mechanism (300) so that the chuck (400) is leveled and the two ends of the ball (122) come into contact with the fixture (200) and the chuck (400) respectively.

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