An ultra-wetting three-dimensional hollow heat soaking liquid cooling module and a preparation method thereof

Abstract

The application discloses a kind of super infiltration three-dimensional hollow heat soaking liquid cooling module and preparation method thereof, belong to liquid cooling heat dissipation technical field, including heat soaking pedestal, hollow fin cover and liquid cooling top cover;The heat soaking pedestal periphery is equipped with first skirt, and the inner side of first skirt forms inner concave surface, and is used to carry phase change working medium;The hollow fin cover is equipped with inner concave side and outer convex side, and the periphery of hollow fin cover is equipped with second skirt, and the inner concave side and the inner concave surface of heat soaking pedestal jointly constitute negative pressure sealed chamber filled with phase change working medium;The periphery of liquid cooling top cover is provided with third skirt, and the middle part is concave to form liquid cooling chamber, and is equipped with liquid inlet and liquid outlet;First skirt, second skirt and third skirt are overlapped in turn and aligned, and are sealed by closely adhering;The outer convex side of hollow fin cover and the liquid cooling chamber of liquid cooling top cover jointly constitute open chamber.The application can improve liquid cooling heat dissipation performance, while having the advantages of simple structure, mature technology and long-term reliable, etc.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and in particular to an ultra-wetting three-dimensional hollow homogenizing liquid cooling module and its preparation method. Background Technology

[0002] With the rapid development of emerging electronic information technologies such as artificial intelligence (AI), 5G, big data, cloud computing and blockchain, chip power consumption is showing a significant upward trend. In the fields of high-performance computing and high power density chip heat dissipation, traditional air cooling methods and the current mainstream single-phase liquid cooling solutions are gradually becoming insufficient to meet the needs, and there is an urgent need to develop higher-performance heat dissipation modules to meet this challenge.

[0003] A vapor chamber is a closed-loop device that achieves efficient heat transfer by relying on the boiling-condensation cycle of an internal liquid working fluid. Its equivalent thermal conductivity is as high as [missing value]. The above-mentioned technologies have been proven to provide superior cooling performance when used in conjunction with liquid cooling plates (patent application numbers: 202010212537.X, 202510036908.6, and 202511622424.6, etc.). In recent years, with the increasing demands for space efficiency and chip integration in AI servers, integrated heat dissipation modes combining vapor chambers and liquid cooling plates (patent application numbers: 202110422836.0, 202410669543.6, 202410821404.0, 202510191366.X, 202510889949.X, and 202511194773.2, etc.) have begun to emerge, through the introduction of multi-stage flow channels / dense fins (patent application numbers: 202010212537.X, 202510036908.6, and 202511622424.6, etc.). Applicable heat transfer numbers (e.g., 202310285824.7, 202311858403.5, 202322683493.0, 202410437173.3, 202511225554.6, 202511267282.6, 202511267284.5, 202520143387.X, and 202511194773.2) can improve heat transfer performance to a limited extent, but still struggle to meet the 200W / cm² requirement. 2 The above are the application requirements for heat flux density.

[0004] Existing integrated vapor chamber-liquid cooling plate solutions generally suffer from the following drawbacks: They employ a traditional two-dimensional vapor chamber (2D-VC) structure, limiting efficient heat transfer to a two-dimensional plane, while the flow channels or fins still primarily rely on their own thermal conductivity (typically less than 1000 kJ / m²). This largely limits the efficient diffusion and transfer of heat inside the chip; in addition, although the multi-stage flow channel and dense fin design can increase the heat exchange area, it also significantly increases the fluid resistance, hindering the rapid propagation of high-temperature or low-temperature liquid cooling working fluid, which not only weakens the convective heat transfer efficiency, but also increases the operating load of the pump drive system. Summary of the Invention

[0005] The purpose of this invention is to construct a liquid cooling module that combines a high-speed, low-resistance liquid flow space in the upper layer with a three-dimensional phase change heat dissipation system in the lower layer through the design of a hollow fin cover. Combined with an ultra-wetting micro / nano structure optimization scheme, it effectively improves the liquid cooling heat dissipation performance and has the advantages of simple structure, mature process and reliable long-term operation.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an ultra-wetting three-dimensional hollow homogenizing liquid cooling module, comprising a homogenizing base, a hollow fin cover and a liquid cooling top cover; The heat-spreading base is provided with a first skirt on its periphery, and a concave surface is formed on the inner side of the first skirt for supporting the phase change working fluid. The concave surface is provided with actual hot spots corresponding to the location of the external heat source. The hollow fin cover has an inner concave side and an outer convex side. The outer periphery of the hollow fin cover has a second skirt. The negative pressure sealed cavity formed by the inner concave side and the inner concave surface of the heat-spreading base is filled with a phase change working fluid. The liquid-cooled top cover is provided with a third skirt around its perimeter, and its central part is recessed to form a liquid-cooled chamber, which is equipped with a liquid inlet and a liquid outlet; The first, second, and third skirt edges are overlapped and aligned in sequence, and a seal is achieved by tightly fitting them together. The convex side of the hollow fin cover and the liquid-cooled chamber of the liquid-cooled top cover together form an open chamber for conveying liquid cooling working fluid.

[0007] As a further description of the above technical solution: the concave surface has a superwetting micro / nano structure, which includes micron structure and nano morphology, and the static contact angle of the phase change working fluid on the concave surface is less than 10°.

[0008] As a further description of the above technical solution: the micron structure is arranged in a gradient outward with a spacing of 0~50µm, centered on the actual hot spot, or in a periodic and uniform manner.

[0009] As a further description of the above technical solution: the outer convex side of the hollow fin cover is provided with a biomimetic drag-reducing fin, which can be fin-shaped, teardrop-shaped or streamlined prismatic.

[0010] As a further description of the above technical solution: the surface of the biomimetic drag-reducing fin has a periodic uneven texture with a roughness range of 5~500µm.

[0011] As a further description of the above technical solution: the liquid inlet is located at the narrow end of the biomimetic drag-reducing fin, and the liquid outlet is located at the wide end of the biomimetic drag-reducing fin.

[0012] As a further description of the above technical solution: the concave side of the hollow fin cover has superhydrophobic properties, and the static contact angle of the phase change working fluid on the concave side is greater than 150°.

[0013] As a further description of the above technical solution: the volume ratio of the phase change working fluid is between 1 / 6 and 2 / 3 of the total volume of the space enclosed by the heat spreader base and the hollow fin cover.

[0014] As a further description of the above technical solution: the materials of the heat-spreading base, hollow fin cover and liquid-cooled top cover can be copper, aluminum, titanium, nickel, magnesium, diamond, carbon fiber, graphene, boron nitride, silicon carbide and their composite materials or alloys, or carbon steel, alloy steel or stainless steel.

[0015] A method for fabricating a super-wetting three-dimensional hollow homogenizing liquid cooling module includes the following steps: Step S1: Machin the outlines of the heat spreader base, hollow fin cover and liquid cooling top cover, and form a concave surface on the heat spreader base; Step S2: Fabricate ultrawetting micro / nano structures on the concave surface; Step S3: Process periodic concave and convex textures on the outer convex side of the hollow fin cover, and stamp out biomimetic drag-reducing fins; Step S4: Adjust the hydrophilic and hydrophobic properties; Step S5: Stack, align, and weld the first, second, and third skirt edges in sequence; Step S6: Perform negative pressure liquid injection sealing and finished product shaping.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: 1. The 3D-VC architecture with ultra-wetting micro / nano structures can simultaneously enhance boiling heat transfer and condensation reflux of the working fluid during phase change. Compared with the traditional two-dimensional heat exchanger structure, it significantly improves the heat transfer efficiency to over 80% and rapidly and evenly distributes the heat generated by the chip to the surface of the hollow fins, thereby broadening the applicable temperature difference range for convective heat transfer and easily handling high heat flux density conditions of 200~500W / cm².

[0017] 2. The biomimetic drag-reducing hollow fin liquid cooling space can effectively suppress boundary layer separation and significantly reduce flow pressure resistance and frictional resistance. Compared with dense fin microchannels, this design can reduce flow resistance by more than 50% and enable the peak flow rate of the pumped fluid to reach 100 L / min, thereby significantly improving the convective heat transfer coefficient. Under the condition of ultra-high heat flux density of 500 W / cm², this design can control the chip temperature rise below 50℃.

[0018] 3. The module has a simple design, mature manufacturing process, strict quality control, and long-term stable and reliable high-efficiency performance. Attached Figure Description

[0019] Figure 1 A 3D architecture diagram of the present invention is shown; Figure 2 A cross-sectional assembly diagram of the present invention is shown; Figure 3 The diagram shows a top view, a side view, and a partially enlarged view of the gradient / uniformly arranged superwetting micro / nano structures of the present invention. Figure 4 A partially enlarged view of the periodic concave-convex texture on the biomimetic drag-reducing fin of the present invention is shown; Figure 5 A flowchart of the preparation method of the present invention is shown; Figure 6 The figure shows a comparison of chip temperature rise between the 3D-VC-CP and FMC-CP under different heat flux densities using the super-wetting three-dimensional hollow homogeneous liquid cooling scheme of the present invention; Figure 7 A 3D architecture diagram of the present invention is shown.

[0020] Legend: 1. Heat-spreading base; 11. First skirt; 12. Concave surface; 13. Ultrawetting micro / nano structure; 131. Micron structure; 132. Nano morphology; 2. Hollow fin cover; 21. Concave side; 22. Convex side; 23. Second skirt; 24. Bionic drag-reducing fin; 241. Periodic concave-convex texture; 3. Liquid-cooled top cover; 31. Third skirt; 32. Liquid-cooled chamber; 33. Liquid inlet; 34. Liquid outlet; 4. Phase change working fluid; 5. Liquid cooling medium; 6. Current hot topics. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-4 This invention provides a technical solution: a super-wetting three-dimensional hollow homogeneous liquid cooling module, such as... Figure 1 As shown, it includes a heat-spreading base 1, a hollow fin cover 2, and a liquid-cooled top cover 3.

[0023] The hollow fin cover has two concave sides 21 and convex sides 22, as shown below. Figure 2As shown; the concave side 21 and the heat-spreading base 1 together form a negative pressure sealed chamber, which is filled with phase change working fluid 4, thereby forming a 3D-VC internal circulation system; the convex side 22 and the liquid-cooled top cover 3 together form an open chamber, and the liquid-cooled top cover 3 is provided with a liquid inlet 33 and a liquid outlet 34 for conveying liquid-cooled working fluid 5, thereby realizing a liquid-cooled external circulation system.

[0024] In preferred cases, the materials of the heat-spreading base 1, the hollow fin cover 2, and the liquid-cooled top cover 3 can be copper, aluminum, titanium, nickel, magnesium, diamond, carbon fiber, graphene, boron nitride, silicon carbide, and their composite materials or alloys, or carbon steel, alloy steel, or stainless steel.

[0025] Meanwhile, in a preferred embodiment, the thickness of the heat-spreading base 1 is limited to 0.2~20mm, and a first skirt 11 is provided on its periphery for sealing connection. The inner side of the first skirt 11 is a concave surface 12, which is used to support the phase change working fluid 4, and its depth ranges from 0.1~10mm.

[0026] The concave surface 12 has an ultrawetting micro / nano structure 13 to improve boiling heat transfer efficiency and promote condensate reflux.

[0027] This superwetting characteristic is manifested as superhydrophilicity, that is, the static contact angle of the phase change working fluid 4 droplet on the concave surface 12 is less than 10°.

[0028] The superwetting micro / nano structure 13 includes a micron structure 131 and a nano morphology 132, such as Figure 3 As shown, the microstructure 131 takes the form of micron-sized papillae, micron-sized prisms, or micron-sized frustums; the nanomorphic features 132 are distributed on the surface of the microstructure 131, and the nanomorphic features 132 are nanosheets, nanoparticles, or nanowires.

[0029] In a preferred embodiment, the microstructures 131 are arranged in a row and column array, with a height ranging from 5 to 500 µm, a width ranging from 5 to 500 µm, and a spacing of 5 to 500 µm between adjacent microstructures 131.

[0030] The stacking thickness of the nano-morphology 132 is controlled at 0.05~50µm, and the equivalent diameter is 50~500nm.

[0031] Upon further optimization, the superwetting micro / nano structures 13 can be arranged in a gradient distribution pattern, such as... Figure 3 As shown, the design uses the actual hot spot 6 as the center, and the structures are distributed outwards in a gradually increasing manner according to a preset spacing to enhance the nucleation of boiling bubbles and the reflux of condensed liquid at the actual hot spot 6. The spacing increase ranges from 0 to 50 µm, and the actual hot spot 6 is the core heat-generating area of ​​the electronic component to be cooled. When the spacing increase is 0 µm, the superwetting micro / nano structure 13 exhibits a periodic and uniform distribution.

[0032] In a preferred embodiment, the concave side 21 of the hollow fin cover 2 is designed with the same micro / nano structure as the concave surface 12 of the heat spreader base 1 to enhance the steam condensation efficiency and accelerate the dripping of the phase change working fluid 4.

[0033] In a preferred embodiment, the micro / nano structure of the concave side 21 of the hollow fin cover 2 has superhydrophobic properties, that is, the static contact angle of the droplet of the phase change working fluid 4 on the concave side 21 of the hollow fin cover 2 exceeds 150°.

[0034] Selectively, capillary support columns can be added between the concave side 21 of the hollow fin cover 2 and the concave surface 12 of the heat-spreading base 1 to provide auxiliary support and guide the liquid flow.

[0035] In a preferred embodiment, the thickness of the hollow fin cover 2 is set to be 0.5~5mm, and a second skirt 23 is designed on its periphery to facilitate connection and sealing. The inner side of the second skirt 23 is densely distributed with biomimetic drag-reducing fins 24. The biomimetic drag-reducing fins 24 are designed in the shape of fish fins, teardrops or other similar streamlined prismatic shapes to reduce flow pressure resistance and suppress boundary layer separation. The equivalent width of the fins is set to be 1~10mm, and the aspect ratio is controlled at 0.5~10.

[0036] In preferred cases, such as Figure 4 As shown, the surface of the biomimetic drag-reducing fin 24 has periodic uneven texture 241 similar to shark skin or snake skin scales, which is used to reduce friction and suppress turbulence. The roughness of the periodic uneven texture 241 is 5~500µm, and the length / width is 0.05~5mm.

[0037] In a preferred embodiment, the liquid-cooled top cover 3 is designed with a third skirt 31 on its periphery for connection with the sealing structure; the middle of the top cover is recessed to form a liquid-cooled chamber 32 for accommodating the liquid cooling medium 5; in the design, the thickness of the third skirt 31 and the liquid-cooled chamber 32 are both controlled within the range of 0.5~20mm.

[0038] Meanwhile, an inlet 33 and an outlet 34 are respectively provided on both sides of the liquid cooling chamber 32, and their positions are directly opposite the biomimetic drag-reducing fins 24 to achieve full contact between the liquid cooling working fluid 5 and thus enhance the convective heat transfer effect; wherein, the inlet 33 is arranged in the narrow end direction of the biomimetic drag-reducing fins 24, while the outlet 34 faces the wide end direction of the fins to effectively reduce flow resistance.

[0039] In a special design, the connection or corner of the third skirt 31 with the liquid cooling chamber 32 can be rounded or curved. At the same time, the liquid inlet 33 and the liquid outlet 34 can be supplemented with a contraction-expansion or flow guiding structure to optimize the flow field distribution and eliminate flow dead zones.

[0040] Under optimized conditions, phase change working fluid 4 can be water or its aqueous solution, and achieve efficient heat transfer through boiling-condensation phase change cycle; in addition, phase change working fluid 4 can also be other organic liquids such as low-boiling-point fluorinated liquid, Freon, acetone, and ethanol.

[0041] Under these conditions, the volume of the phase change working fluid 4 should occupy 1 / 6 to 2 / 3 of the total volume of the interlayer between the heat spreader base 1 and the hollow finned cover 2. Similarly, in a preferred embodiment, the liquid cooling working fluid 5 can be water or its aqueous solution, achieving effective heat transfer through high-speed convection. In addition, the liquid cooling working fluid 5 can also be other organic liquids such as high-boiling-point fluorinated liquids, mineral oil, silicone oil, ethylene glycol, and propylene glycol. Under these conditions, the flow rate of the liquid cooling working fluid 5 should preferably be controlled within the range of 1 to 100 L / min.

[0042] The method of using a super-wetting three-dimensional hollow vapor chamber liquid cooling module is as follows: First, the vapor chamber base 1 is tightly attached to the surface of the heat-generating chip, and continuous heat dissipation is achieved through the circulation of the liquid cooling medium 5. Its working principle is as follows: The vapor chamber base 1 absorbs the heat generated by the chip during operation, and relies on the super-wetting micro / nano structure 13 of the inner wall of the 3D-VC cavity to significantly enhance the efficient boiling and condensation reflux process of the phase change medium 4, thereby rapidly and evenly transferring heat to the surface of the hollow fins. Then, through sufficient convective heat exchange with the high-speed inflow low-temperature liquid cooling medium 5, the liquid cooling medium 5 is discharged from the system after its temperature rises due to heat absorption, forming a continuous and stable circulating cooling mechanism.

[0043] See Figure 5 A method for preparing a super-wetting three-dimensional hollow homogenizing liquid cooling module includes the following: Step S1 Substrate preparation: The heat-spreading base 1, hollow fin cover 2 and liquid-cooled top cover 3 are processed by casting, forging, stamping, welding or cutting to prepare the target contour required by the design; at the same time, the concave surface 12 is generated on the heat-spreading base 1 by etching process, and the side wall liquid injection hole is retained as a reserved structure.

[0044] Step S2 Micro-carving of the heat-spreading base 1: In the target area of ​​the concave surface 12 of the heat-spreading base 1, a super-wetting micro / nano structure 13 is formed by pulsed laser processing. In the specific operation, the laser movement is controlled to generate a connected trench, and the unetched area constitutes a micron structure 131, while the attached nano morphology 132 is spontaneously formed.

[0045] Step S3 Hollow fin shaping: Based on a preset path, a periodic concave-convex texture 241 is processed on the outer convex side 22 of the hollow fin cover 2 using a pulsed laser, and a biomimetic drag-reducing fin 24 is formed on the inner concave side 21 with the help of a special mold, so as to achieve precise hollow fin shaping.

[0046] Step S4 Superhydrophilic control: Dry or wet heat treatment is performed on the concave surface 12 of the heat spreader 1, the concave side 21 and the convex side 22 of the hollow fin cover 2 to grow hydrophilic nanomorphic morphologies on the corresponding surfaces to impart superhydrophilic properties.

[0047] Step S5 Superhydrophobic Modification: The target area of ​​the concave side 21 of the hollow fin cover 2 is processed with micro / nano structures using pulsed laser technology to destroy the original hydrophilic nanomorphology and thus restore the intrinsic superhydrophobic properties of the surface.

[0048] Step S6 Skirt welding: The first skirt 11 of the heat-spreading base 1, the second skirt 23 of the hollow fin cover 2 and the third skirt 31 of the liquid-cooled top cover 3 are stacked and aligned in sequence, and the components are tightly bonded together by brazing, laser welding, arc welding or ultrasonic welding.

[0049] Step S7 Negative pressure liquid injection sealing: Insert the liquid injection tube into the liquid injection hole on the heat-equalizing base 1 and fix it in place; then fill the phase change working fluid 4 under vacuum conditions and seal it immediately; finally cut off the excess liquid injection tube and compact it to complete the sealing operation.

[0050] Step S8 (Finished Product Shaping): The flatness of the heat-spreading base 1 and the liquid-cooling top cover 3 of the ultra-wetted three-dimensional hollow heat-spreading liquid-cooling module and its surrounding area is adjusted by applying pressure and releasing residual stress, thereby obtaining the final finished product.

[0051] Under preferred conditions, the laser used in steps S3 and S5 can have a pulse width of nanosecond, picosecond, or femtosecond, a wavelength range of 193~1064nm, an output power range of 20~200W, a pulse frequency of 20Hz~2000kHz, and a moving speed setting range of 1~10000mm / s.

[0052] Under preferred conditions, in step S4, dry heat treatment forms nanoscale hydrophilic metal oxides at the target interface through a high-temperature gas-phase reaction. The operating temperature range is 100~400℃, the treatment time is 20 minutes to 72 hours, and the gas used is air or a hydrogen-nitrogen mixture containing 2%~10% hydrogen by volume. Wet heat treatment generates dense nanoscale hydrophilic metal oxides through a hydrothermal reaction. The reaction temperature range is 50~100℃, and the duration is 0.05~48 hours.

[0053] Under preferred conditions, the vacuum degree during the negative pressure injection and sealing process in step S7 is in the range of 0.05~50Pa; under preferred conditions, the pressure used for finished product shaping in step S8 is 0.5~5MPa, and the pressure holding time is 0.1~10 minutes.

[0054] Example 2 This embodiment fabricated a series of ultra-wetting three-dimensional hollow homogenizing liquid cooling modules made of copper, with a total design area of ​​2800 mm². 2 The preparation method is as follows: Step S1: Prepare to process a 3mm thick heat-spreading base 1, a 1mm thick hollow fin cover 2, and a 2mm thick liquid-cooled top cover 3 to form the target outline. Etch a 2mm deep concave surface 12 on the heat-spreading base 1 and leave liquid injection holes on the side wall.

[0055] Step S2: Using a 365nm ultraviolet pulsed laser, a 30mm×30mm superwetting micro / nano structure 13 is fabricated in the target area of ​​the concave surface 12 of the heat-spreading base 1. The power is 5~15W, the frequency is 50~500Hz, and the moving speed is 50~500mm / s. This forms a gradient-arranged micron structure 131 with a width of 0.1mm, an initial spacing of 0.1mm, and a spacing increase of 50μm. At the same time, an initial nano-morphology 132 of 50~100nm is spontaneously formed.

[0056] Step S3: Using a 1064nm wavelength infrared nanosecond pulse laser, periodic concave-convex textures 241 with a length, width, and roughness of 0.1mm are processed on a 30mm×30mm target area on one side of the hollow fin cover 2. The power is 60~80W, the frequency is 20~2000Hz, and the moving speed is 100~1000mm / s. From the other side, fish fin-shaped biomimetic drag-reducing fins 24 with a width and spacing of 4mm are stamped out.

[0057] Step S4: The concave surface 12 of the heat-equalizing base 1 and the surface of the hollow fin cover 2 are hydrothermally treated at 80℃ for 12h to regulate the superhydrophilic properties and generate secondary copper oxide nanomorphic structures of 100~500nm.

[0058] Step S5: Using a 365nm ultraviolet pulsed laser, a 30mm×30mm micro / nano structure is fabricated in the target area of ​​the concave side 21 of the hollow fin cover 2. The power is 5~15W, the frequency is 50~500Hz, and the moving speed is 50~500mm / s. This forms a uniformly arranged micron structure 131 with a height of 0.16mm, a width, and a spacing of 0.08mm, and simultaneously spontaneously forms a 50~100nm liquid-phobic cuprous oxide nanostructure.

[0059] In steps S6 to S8, the heat-spreading base 1, hollow fin cover 2, and liquid-cooled top cover 3 are stacked and aligned in sequence, and their sealing skirts are brazed. Then, 1~3.5g of deionized water is injected as phase change working fluid 4 under a vacuum of 5Pa, and the sealing process is completed immediately. Finally, the module is shaped under a pressure of 2MPa for 2 minutes to produce the finished product of the super-wetting three-dimensional hollow heat-spreading liquid-cooled module.

[0060] An orthogonal experiment was designed based on the height of the superwetting micro / nano structure 13 (100 / 150 / 200 / 250 / 300μm), the aspect ratio of the biomimetic drag-reducing fins 24 (0.5 / 1 / 2 / 4 / 8), and the amount of phase change working fluid 4 (1 / 1.5 / 2 / 2.5 / 3 / 3.5g). The liquid cooling effect on the 28mm×28mm chip was investigated using deionized water as the liquid cooling working fluid 5 within the flow rate range of 10~100L / min.

[0061] The results show that the series of ultra-wetting three-dimensional hollow homogenous liquid cooling modules in this embodiment achieve a cooling efficiency of 200~500 W / cm². 2 The average temperature rise under the chip heat flux density is only 35.4~44.4℃, while the system flow resistance is reduced by 50~110%, fully demonstrating the dual technical advantages of this module in improving heat dissipation performance and reducing liquid cooling flow resistance.

[0062] Example 3 This embodiment compares the most advanced finned microchannel cold plate with the preferred ultra-wetting three-dimensional hollow homogenizing liquid cooling module in Embodiment 2, such as... Figure 6 As shown.

[0063] In the experimental design, the dimensions of the base, cover plate and chamber of the two liquid cooling schemes are consistent with the technical solution of this application. Similarly, the spade tooth microchannel is precisely machined in the target area of ​​30mm×30mm, and the thickness and spacing of the spade tooth fins are 0.2mm.

[0064] Using deionized water as the liquid cooling medium, the maximum temperature rise of the 28mm×28mm chip under different heat flux densities was investigated. The chip power consumption was controlled by forced frequency conversion, with four levels: 200, 300, 400 and 500W / cm², and the power consumption adjustment accuracy was controlled within ±5W / cm².

[0065] Experimental results show that the temperature rise of the ultra-wetting three-dimensional hollow homogenous liquid cooling module at four different settings is 21.1℃, 28.5℃, 40.4℃, and 48.9℃, respectively, while the temperature rise of the finned microchannel liquid cooling device under the same conditions is 25.5℃, 38.2℃, 51.8℃, and 64.2℃, respectively. This demonstrates that the 3D-VC-CP solution has a significant advantage over the FMC-CP solution in terms of chip operating temperature, especially under high power consumption conditions, with a temperature rise reduction of 17.3% to 25.4%. These results fully validate the coupling technology advantages of the 3D-VC architecture in enhancing internal circulation phase change heat transfer and promoting external circulation convection heat transfer.

[0066] It should be noted that, given the extremely high flow resistance of the FMC-CP precision spade microchannel, in the comparative experiment of this embodiment, only the pumping flow rate of the liquid cooling medium 5 was set to the commonly used 30L / min in the market; however, in fact, the ultra-wetting three-dimensional hollow homogenizing liquid cooling module can significantly enhance the cooling efficiency by further increasing the flow rate of the liquid cooling medium 5, and the maximum flow rate can reach 100L / min.

[0067] Example 4 This application aims to provide a novel integrated vapor chamber-liquid cooling plate architecture, which utilizes ultra-wetting micro / nano structures 13 to enhance the boiling-condensation cycle inside the vapor chamber (VC), and achieves a coupled breakthrough in heat dissipation performance through the working fluid convection heat transfer of the 3D-VC enhanced liquid cooling chamber 32 with biomimetic drag-reducing fins 24; therefore, the 3D-VC liquid cooling architecture also supports customized solutions based on the actual chip assembly method inside the server.

[0068] This embodiment provides a double-sided ultra-wetting three-dimensional hollow homogeneous liquid cooling module, such as... Figure 7 As shown, it absorbs the chip heat transferred from the two sides by 3D-VC through a single liquid cooling chamber 32. This "single-cavity double-sided" architecture is particularly suitable for server ports with densely arranged multi-chips, and can significantly demonstrate the ultra-high performance advantage of the solution in this application in a high-speed, low-resistance liquid cooling environment.

[0069] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A super-wetting three-dimensional hollow homogenizing liquid cooling module, characterized in that, It includes a heat-spreading base (1), a hollow fin cover (2), and a liquid-cooled top cover (3); The heat-spreading base (1) is provided with a first skirt (11) on its periphery. The inner side of the first skirt (11) forms a concave surface (12) and is used to support the phase change working fluid (4). The concave surface (12) is provided with actual hot spots (6) corresponding to the location of the external heat source. The hollow fin cover (2) has an inner concave side (21) and an outer convex side (22). The hollow fin cover (2) has a second skirt (23) around its periphery. The negative pressure sealed cavity formed by the inner concave side (21) and the inner concave surface (12) of the heat-spreading base (1) is filled with a phase change working fluid (4). The liquid-cooled top cover (3) is provided with a third skirt (31) around its periphery, and its central part is recessed to form a liquid-cooled chamber (32), and is equipped with a liquid inlet (33) and a liquid outlet (34). The first skirt edge (11), the second skirt edge (23) and the third skirt edge (31) are overlapped and aligned in sequence, and are sealed by close contact; The outer convex side (22) of the hollow fin cover (2) and the liquid cooling chamber (32) of the liquid cooling top cover (3) together form an open chamber for conveying liquid cooling working fluid (5).

2. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 1, characterized in that, The concave surface (12) has a superwetting micro / nano structure (13), which includes a micron structure (131) and a nano morphology (132). The static contact angle of the phase change working fluid (4) on the concave surface (12) is less than 10°.

3. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 2, characterized in that, The micron structure (131) is arranged in a gradient outward with a spacing of 0~50µm, centered on the actual hot spot (6), or in a periodic and uniform manner.

4. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 1, characterized in that, The hollow fin cover (2) has a biomimetic drag-reducing fin (24) on its outer convex side (22). The biomimetic drag-reducing fin (24) can be fin-shaped, teardrop-shaped or streamlined prismatic.

5. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 4, characterized in that, The surface of the biomimetic drag-reducing fin (24) has periodic uneven texture (241) with a roughness range of 5~500µm.

6. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 4, characterized in that, The liquid inlet (33) is located at the narrow end of the biomimetic drag-reducing fin (24), while the liquid outlet (34) is located at the wide end of the biomimetic drag-reducing fin (24).

7. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 1, characterized in that, The concave side (21) of the hollow fin cover (2) has superhydrophobic properties, and the static contact angle of the phase change working fluid (4) on the concave side (21) is greater than 150°.

8. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 1, characterized in that, The volume ratio of the phase change working fluid (4) is between 1 / 6 and 2 / 3 of the total volume of the space enclosed by the heat spreader base (1) and the hollow fin cover (2).

9. The ultra-wetting three-dimensional hollow homogenizing liquid cooling module according to claim 1, characterized in that, The materials of the heat-spreading base (1), hollow fin cover (2) and liquid-cooled top cover (3) can be copper, aluminum, titanium, nickel, magnesium, diamond, carbon fiber, graphene, boron nitride, silicon carbide and their composite materials or alloys, or carbon steel, alloy steel or stainless steel.

10. A method for preparing a super-wetting three-dimensional hollow homogenizing liquid cooling module, characterized in that, Includes the following steps: Step S1: Machin the outlines of the heat-spreading base (1), the hollow fin cover (2) and the liquid-cooled top cover (3), and form an inner concave surface (12) on the heat-spreading base (1). Step S2: Fabricate an ultrawetting micro / nano structure (13) on the concave surface (12); Step S3: Process periodic concave and convex textures (241) on the outer convex side (22) of the hollow fin cover (2) and stamp out biomimetic drag-reducing fins (24). Step S4: Adjust the hydrophilic and hydrophobic properties; Step S5: Stack and align the first skirt edge (11), the second skirt edge (23), and the third skirt edge (31) in sequence and weld them together; Step S6: Perform negative pressure liquid injection sealing and finished product shaping.

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