A lengthened enhanced bamboo orthogonal laminated wood without splicing and its preparation method

CN122165512APending Publication Date: 2026-06-09TREEZO NEW MATERIAL TECH GRP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TREEZO NEW MATERIAL TECH GRP CO LTD
Filing Date
2024-12-06
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing cross-laminated timber requires splicing and lengthening processes during production, resulting in weak points in the components, affecting the mechanical properties of the material and production efficiency. Furthermore, the strength of the plywood along the grain is relatively low, making it difficult to meet the needs of multi-story and high-rise timber structure buildings.

Method used

Bamboo-based oriented strand board is used as the substrate, and orthogonal laminated wood is formed by cold pressing and gluing. Steel strips are embedded in the bottom layer to form an enhanced composite substrate, avoiding splicing and lengthening, and optimizing the layer assembly process.

Benefits of technology

It eliminates the need for splicing and lengthening, avoids weak points in components, simplifies the process, improves product quality stability and strength controllability, and meets the needs of bamboo and wood structure buildings.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application relates to the field of cross-laminated timber (CFL), specifically disclosing a reinforced bamboo CFL that does not require splicing or lengthening, and its preparation method. The maximum planar dimensions of the CFL are 2440mm wide and 19520mm long. The CFL comprises at least three layers of veneer, which are orthogonally assembled and pressed together after being glued. The veneer is made by oriented and glued bamboo shavings, with the bamboo shavings having a thickness of 0.7–0.9mm, a width of 10–30mm, and a length of 120–180mm. The glue application rate for the veneer is 10%–15%. The CFL of this application eliminates the need for splicing or lengthening, avoiding weak points in the components, and the CFL exhibits excellent performance.
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