An epoxy-phenyl synergistic silicone toughening agent, a preparation method and application thereof
By modifying epoxy resin with an epoxy-phenyl synergistic organosilicon toughening agent, the brittleness problem of epoxy resin is solved, and its toughness and aging resistance are improved, making it suitable for electronic packaging materials, adhesives, coatings and composite materials.
CN122167472APending Publication Date: 2026-06-09HARBIN ENG UNIV +2
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HARBIN ENG UNIV
- Filing Date
- 2026-02-02
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Epoxy resins are brittle, easily broken, and have poor toughness and impact resistance after curing, which limits their application in high-end fields.
Method used
An epoxy-phenyl synergistic organosilicon toughening agent is used. By reacting a star-shaped toughening agent composed of organosilicon, epoxy, and allyl structures with epoxy resin, phenyl and epoxy groups are introduced to improve its flexibility and rigidity, and enhance its mechanical properties and aging resistance.
Benefits of technology
It significantly improves the tensile strength, elongation at break, impact strength, and resistance to damp heat and salt spray aging of epoxy resins, making it suitable for electronic packaging materials, adhesives, coatings, and composite materials.
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Smart Images
Figure CN122167472A_ABST
Abstract
This invention discloses an epoxy-phenyl synergistic organosilicon toughening agent, its preparation method, and its application. The chemical structural formula of the organosilicon toughening agent is as follows: where R is one of C1-C4 alkyl groups; R x It consists of four C3-C8 alkyl substituents, each containing one epoxy or phenyl group, with 1-3 epoxy substituents. This toughening agent has a star-shaped structure, combining flexible and rigid groups, which can solve the problem of poor toughness of epoxy resins in the field of electronic packaging. It effectively improves the tensile strength, elongation at break, impact strength, and resistance to damp heat and salt spray aging of epoxy resins, and is suitable for electronic packaging materials, adhesives, coatings, and composite materials.
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