Radiation-quickly-settable or curable silicone compositions

Abstract

The present invention provides a radiation-curable, quick-setting or quick-curing silicone composition comprising: (A) an organopolysiloxane having two or more alkenyl groups, (B) an organohydrogenpolysiloxane having two or more SiH groups, (C) an organic crosslinking agent having two or more alkenyl groups, and (D) a photoactive catalyst, wherein the refractive index (N c ) of component (C) and the refractive index (N ab ) of a mixture of components (A) and (B) satisfy the following relationship: |N c -N ab | ≤ 0.1. The present invention also provides a method for producing an encapsulant.

Description

Technical Field

[0001] This invention relates to a radiation-curable polysiloxane composition and its related applications. Background Technology

[0002] Semiconductor packaging materials must be resistant to high temperatures, and even high temperatures and humidity, while maintaining their appearance and optical properties under these conditions. Because polysiloxanes exhibit minimal changes in optical properties even under high temperature or high humidity conditions, and their overall performance is superior to epoxy resins, the industry is gradually shifting from epoxy resins to polysiloxanes as packaging materials.

[0003] Currently, the widely used polysiloxane encapsulation materials are thermosetting, requiring curing temperatures above 120°C and a time of over 2 hours. To prevent the encapsulation material from flowing onto the substrate and overflowing during this long baking process, the dam-and-fill (or dam-and-filling) encapsulation technology was previously used. This involved first coating a high-viscosity dam material around the component to be encapsulated to form a barrier, and then filling the area within the barrier with a low-viscosity, flowable encapsulation material. However, under these high-temperature, long-duration thermosetting conditions, the substrate is prone to shrinkage, warping, or even damage, making subsequent processes impossible.

[0004] To simplify manufacturing processes and reduce material costs, the industry is developing an encapsulation method that involves molding, dispensing, leveling, and curing to replace Dam & Fill. This method involves applying the encapsulation material, then bonding the surface of another substrate (called the upper substrate, typically made of transparent materials like glass or acrylic) coated with an insulating layer (formed by a release agent) to the encapsulation material to achieve leveling. After the encapsulation material cures, the upper substrate is removed (called lift-off) to obtain a flat encapsulation. This method requires the encapsulation material to cure quickly enough to prevent it from flowing onto the substrate and causing overflow, resulting in better precision and flatness in film thickness and appearance. This method is particularly suitable for encapsulating light-emitting elements (LEDs), as LEDs (including inorganic LEDs, OLEDs, MiniLEDs, and MicroLEDs) require encapsulation materials with good flatness and light transmittance compared to other semiconductor materials. Therefore, the packaging materials used for light-emitting elements such as LEDs should be able to withstand high temperature or high temperature and high humidity environments, have good optical transmittance, have good flatness (e.g., no surface ripples), and be resistant to yellowing.

[0005] To achieve the aforementioned rapid curing, radiation curing can be used. However, most current radiation curing (e.g., UV curing) of polysiloxane addition-cured polymers is delayed-type, meaning that after UV irradiation, they remain in a flowable liquid or semi-solid state, requiring further thermal curing (called post-baking) to set the encapsulation material (i.e., prevent it from flowing) and cure it. If the encapsulation material is to be set or cured immediately after UV irradiation, a large amount of metal catalyst (e.g., platinum catalyst) needs to be added. However, besides increasing process costs, this can cause the encapsulation material to yellow easily at high temperatures, resulting in poor optical properties and failing to meet product requirements.

[0006] To address the aforementioned technical challenges, the industry hopes to develop packaging materials that can be rapidly shaped or cured by radiation, possess good thermal stability, and exhibit excellent optical properties. Summary of the Invention

[0007] This invention provides a radiation-fast sizing or curing polysiloxane composition comprising:

[0008] (A) Organopolysiloxanes having two or more alkenyl groups,

[0009] (B) Organohydrogenated polysiloxanes having two or more SiH groups

[0010] (C) Organic crosslinking agents having two or more alkenyl groups, and

[0011] (D) Photoactive catalyst

[0012] The refractive index (N) of component (C) c The refractive index (N) of the mixture with components (A) and (B) ab The following relationship exists:

[0013] |N c -N ab |≤0.1.

[0014] The present invention also provides a two-component composition comprising a combination of component (I) and component (II), wherein component (I) comprises component (A), component (C) and component (D), and component (II) comprises component (B).

[0015] The present invention also provides a method for manufacturing an encapsulation material, wherein the aforementioned composition is irradiated with radiation (such as UV light) to rapidly shape or cure it.

[0016] To make the above-mentioned objectives, technical features and advantages of the present invention more apparent and understandable, the following detailed description is provided with reference to some specific embodiments. Detailed Implementation

[0017] To facilitate understanding of the disclosures presented herein, several terms are defined below.

[0018] The term "rapid setting or curing" is defined in this invention as the ability of the encapsulation material to set (i.e. not flow) or cure within 10 minutes.

[0019] The term "refractive index" refers to the ratio of the speed of light in a vacuum to its phase velocity after entering a medium; the refractive index of a vacuum is 1.

[0020] The term "transmittance" refers to the amount of light that passes through a medium (such as a polysiloxane resin) divided by the total amount of incident light.

[0021] The term "nonlinear" means branching, network, dendritic, star-shaped, waterfall-shaped, or other non-linear shapes.

[0022] The term "alkyl" refers to a saturated straight-chain or branched hydrocarbon group, generally having 1 to 20 carbon atoms (but not limited thereto), preferably having 1 to 6 carbon atoms, more preferably having 1 to 4 carbon atoms, and most preferably having 1 to 3 carbon atoms; examples include (but are not limited to): methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tributyl, n-pentyl, neopentyl, n-hexyl, etc.

[0023] The term "aryl" refers to, for example, a monocyclic, bicyclic, or tricyclic aromatic carbocyclic group, preferably having 6 to 20 ring carbon atoms, examples of which include (but are not limited to): phenyl, indenyl, naphthyl, fluorenyl, anthraceneyl, phenanthrene, and similar groups. Unless otherwise specified, in this invention, "aryl" may be substituted or unsubstituted. Substituents include, but are not limited to: halogens, hydroxyl groups, alkyl groups, etc.

[0024] The term "heterocyclic group" refers to a 3- to 14-membered cyclic group, preferably a 4- to 10-membered cyclic group, more preferably a 5- or 6-membered cyclic group, consisting of a carbon atom and at least one heteroatom selected from N, O, or S, and is either saturated, partially saturated (e.g., named with prefixes such as dihydrogen, trihydrogen, tetrahydrogen, hexahydrogen, etc.), or unsaturated; preferably having 1 to 4 heteroatoms, more preferably having 1 to 3 heteroatoms. The heterocyclic group can be a monocyclic, bicyclic, or tricyclic ring system, comprising a fused ring (e.g., a fused ring formed together with another heterocycle or another aromatic carbide ring). Unless specifically indicated, in this invention, the "heterocyclic group" may be substituted or unsubstituted. Substituents include, but are not limited to, halogens, hydroxyl groups, oxo groups, alkyl groups, hydroxyalkyl groups, etc.

[0025] The term "nitrogen-containing heterocyclic group" refers to a 3- to 14-membered nitrogen-containing heterocyclic group in which at least one ring carbon atom is replaced by a nitrogen atom, preferably a 4- to 10-membered nitrogen-containing heterocyclic group, and more preferably a 5- or 6-membered nitrogen-containing heterocyclic group. Examples include, but are not limited to: pyrrolyl, imidazolyl, pyrazolyl, pyrimidinyl, tri-... Nitrogen-containing heterocyclic groups include triazinyl, thiazolyl, pyridyl, indolyl, isoindolyl, benzimidazolyl, benzothiazolyl, quinolyl, and isoquinolyl. Unless otherwise specified, in this invention, "nitrogen-containing heterocyclic groups" may be substituted or unsubstituted. Substituents include, but are not limited to, halogens, hydroxyl groups, oxo groups, alkyl groups, and hydroxyalkyl groups.

[0026] The term “about” means the acceptable error of a particular value as determined by a person skilled in the art, which depends in part on how the value is measured or determined.

[0027] Each embodiment and each example of the invention disclosed in this specification may be individually combined with all other embodiments and examples of the invention, covering all possible combinations.

[0028] The polysiloxane composition of the present invention contains the aforementioned components (A) to (D), and each component will be described below.

[0029] (A) Organopolysiloxanes having two or more alkenyl groups

[0030] Component (A) has two or more alkenyl groups bonded to silicon, which can be C 2-12 Alkenyl groups, such as vinyl, propenyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, or dodecenyl, preferably vinyl, propenyl, or allyl, and more preferably vinyl. In addition to alkenyl groups, component (A) also contains other groups bonded to silicon, which may be: C 1-12 Alkyl, C 3-6 cycloalkyl, C 6-20 Aryl or C 7-20 Aryl groups, such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tributyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, phenyl, tolyl, xylyl, naphthyl, benzyl, phenethyl, or phenylpropyl, preferably methyl, ethyl, cyclohexyl, phenyl, and tolyl, more preferably methyl, phenyl, or combinations thereof. In some embodiments of the invention, component (A) may have a small amount of silicon-bonded hydroxyl or alkoxy groups, such as methoxy or ethoxy, without prejudice to the purpose of the invention.

[0031] The molecular structure of component (A) is not particularly limited and can be a straight chain, branched chain, a straight chain with partially branched chains, a cyclic structure, or a three-dimensional network structure. Component (A) can be one organopolysiloxane having these molecular structures, or a combination of two or more organopolysiloxanes having these molecular structures.

[0032] The organopolysiloxane (A) of the present invention having two or more alkenyl groups, including straight-chain, branched, partially branched, cyclic, or three-dimensional network structures, is represented by the following average compositional formula (I):

[0033] R x SiO (4-x) / 2 Formula (I)

[0034] Where x is a number from 0.8 to 3.0, for example 0.8, 1, 1.2, 1.5, 1.8, 2, 2.5, or 3; each R can be the same or different, and can be an independently substituted or unsubstituted monovalent hydrocarbon group, and can be C 2-12 alkenyl, C 1-12 Alkyl, C 3-6 cycloalkyl, C 6-20 Aryl or C 7-20 Aryl groups, such as vinyl, propenyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, dodecenyl, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tributyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, pentyl, hexyl, heptenyl, octyl, nonyl, decyl, undecyl, dodecyl, phenyl, tolyl, xylyl, naphthyl, benzyl, phenethyl, or phenylpropyl, preferably methyl, ethyl, cyclohexyl, phenyl, and tolyl; preferably, R is methyl or a combination of methyl and phenyl except for the alkenyl group. According to some embodiments of the present invention, if R is a combination of methyl and phenyl except for alkenyl groups, the molar ratio of methyl to phenyl can be about 9:1, about 8:2, about 7:3, about 6:4, about 5:5, about 4:6, about 3:7, about 2:8 or about 1:9, preferably about 2:3.

[0035] In each molecule of component (A), at least two Rs are alkenyl groups (e.g., 2, 3, 4, 5, 6, 7, 8, 9, 10, or more alkenyl groups). As mentioned earlier, the alkenyl group option can be C. 2-12Alkenyl groups, preferably vinyl groups. According to some embodiments of the invention, the alkenyl groups of component (A) may be bonded to Si at the ends of the molecular chain or to Si on the sides of the molecular chain. The alkenyl content of component (A), based on the total amount of said R, is from about 0.1 mol% to about 40 mol% (e.g., about 0.1 mol%, about 0.5 mol%, about 1 mol%, about 5 mol%, about 10 mol%, about 15 mol%, about 20 mol%, about 25 mol%, about 30 mol%, about 35 mol%, or about 40 mol%), preferably from about 0.5 mol% to about 20 mol%.

[0036] According to some embodiments of the present invention, component (A) has a weight-average molecular weight of 100-100,000, more preferably 200-50,000, more preferably 300-12,000, and even more preferably 1,000 to 10,000, such as 100, 150, 200, 300, 500, 1,000, 2000, 3,000, 4,000, 5,000, 6,000, 10,000, 12,000, 20,000, 50,000, or 100,000.

[0037] According to some embodiments of the present invention, the viscosity of component (A) is preferably in the range of 1 mPa·s to 100,000 mPa·s at 25°C, more preferably in the range of 100 mPa·s to 10,000 mPa·s, for example, 1, 10, 100, 1,000, 10,000 or 100,000 mPa·s.

[0038] According to some embodiments of the present invention, the amount of component (A), based on the total weight of the solid components of the composition, is 20% to 95% by weight, preferably 30% to 90% by weight, more preferably 50% to 85% by weight, for example, it can be 25% by weight, 30% by weight, 40% by weight, 50% by weight, 55% by weight, 60% by weight, 65% by weight, 75% by weight, 80% by weight, 85% by weight, 90% by weight or 95% by weight.

[0039] The organopolysiloxane (A) of the present invention having two or more alkenyl groups may contain SiO2. 4 / 2 Unit (also known as Q unit) and / or RSiO 3 / 2 Unitary element (also known as T-unit) and R3SiO 1 / 2 The unit (also known as the M unit) becomes a branched organopolysiloxane. (A) Organopolysiloxanes having two or more alkenyl groups may also contain only R2SiO 2 / 2 Unitary element (also known as D unit) and R3SiO 1 / 2units to form a linear organopolysiloxane (also known as a straight-chain organopolysiloxane). (A) The organopolysiloxane having two or more alkenyl groups may also contain only RSiO 3 / 2 units, R2SiO 2 / 2 units, and R3SiO 1 / 2 units to form a linear and branched organopolysiloxane (also known as a straight-chain organopolysiloxane having partial branched chains).

[0040] The above-mentioned (A) organopolysiloxane having two or more alkenyl groups represented by the average composition formula (I) may contain one or more (e.g., 1, 2, 3, 4, 5, or 6 kinds) of (A) organopolysiloxanes having two or more alkenyl groups to regulate the overall properties, and each of them may have the following average unit formula (II):

[0041] (SiO 4 / 2 ) p (RSiO 3 / 2 ) q (R2SiO 2 / 2 ) r (R3SiO 1 / 2 ) s Formula (II)

[0042] where R is as described above, and p, q, r, and s satisfy 0 ≤ p < 1, 0 ≤ q < 1, 0 ≤ r < 1, and 0 < s < 1, but p + q + r > 0, and p + q + r + s = 1.

[0043] In some embodiments of the present invention, the above-mentioned individual (A) organopolysiloxane having two or more alkenyl groups may be represented by the following average unit formula:[[]]

[0044] (ViMe2SiO 1 / 2 ) s (PhSiO 3 / 2 ) q

[0045] (ViMe2SiO 1 / 2 ) s (MeSiO 3 / 2 ) q

[0046] (ViMe2SiO 1 / 2 ) s (PrSiO 3 / 2 ) q

[0047] (ViMe2SiO 1 / 2 ) s (ViSiO 3 / 2 ) q

[0048] (ViMePhSiO 1 / 2 ) s (PhSiO 3 / 2 ) q

[0049] (ViMePhSiO 1 / 2 ) s (MeSiO 3 / 2 ) q

[0050] (ViMePhSiO 1 / 2 ) s (PrSiO 3 / 2 ) q

[0051] (ViMePhSiO 1 / 2 ) s (ViSiO) 3 / 2 ) q

[0052] (ViMePhSiO 1 / 2 ) s’ (ViMe2SiO 1 / 2 ) s” (PhSiO 3 / 2 ) q

[0053] (ViMe2SiO 1 / 2 ) s (Ph2SiO 2 / 2 ) r (PhSiO 3 / 2 ) q

[0054] (ViMePhSiO 1 / 2 ) s (Ph2SiO 2 / 2 ) r (PhSiO 3 / 2 ) q

[0055] (ViMe2SiO 1 / 2 ) s (MePhSiO 2 / 2 ) r (PhSiO 3 / 2 ) q

[0056] (ViMePhSiO 1 / 2 ) s (MePhSiO 2 / 2 ) r (PhSiO3 / 2 ) q

[0057] (ViMePhSiO 1 / 2 ) s’ (ViMe2SiO 1 / 2 ) s” (Ph2SiO 2 / 2 ) r (PhSiO 3 / 2 ) q

[0058] (ViMe2SiO 1 / 2 ) s (SiO 4 / 2 ) p (PhSiO 3 / 2 ) q

[0059] (ViMe2SiO 1 / 2 ) s (SiO 4 / 2 ) p

[0060] Among them, Me is methyl, Ph is phenyl, Pr is propyl, Vi is vinyl, p, q, r and s are as described above, 0 < s' < 1, 0 < s" < 1, and s' + s" = s;

[0061] Alternatively, the aforementioned individual (A) organopolysiloxane having two or more alkenyl groups may be represented by the following chemical formula:

[0062] ViMe2SiO(Ph2SiO) u SiMe2Vi

[0063] ViMe2SiO(Me2SiO) v SiMe2Vi

[0064] ViMe2SiO(Ph2SiO) u (Me2SiO) v SiMe2Vi

[0065] ViMePhSiO(Ph2SiO) u SiMePhVi

[0066] ViMe2SiO(MePhSiO) u SiMe2Vi

[0067] ViMePhSiO(MePhSiO) v SiMePhVi

[0068] ViMePhSiO(MePhSiO) v (Me2SiO) u SiMePhVi

[0069] ViMe2SiO (ViMeSiO) u (Me2SiO) v SiMe2Vi

[0070] Me3SiO (ViMeSiO) u SiMe3

[0071] ViMePhSiO(Ph2SiO) u (MePhSiO) v SiMePhVi

[0072] ViMePhSiO(Ph2SiO) u (Me2SiO) v SiMePhVi

[0073] Wherein, Me is methyl, Ph is phenyl, Vi is vinyl, and u and v are each independently an integer from 1 to 200 (e.g., 1, 2, 5, 10, 20, 50, 100, 120, 160, 180 or 200), preferably from 160 to 180.

[0074] The organopolysiloxane (A) of the present invention having two or more alkenyl groups is preferably in a liquid, solid or viscous state at room temperature. If it is a solid, its viscosity can be adjusted by adding a solvent to facilitate operation. The aforementioned solvent can be toluene, hexane, cyclohexane, etc.

[0075] (B) Organohydrogenated polysiloxanes having two or more SiH groups

[0076] The molecular structure of component (B) is not particularly limited and can be a straight chain, branched chain, a straight chain with partially branched chains, a cyclic structure, or a three-dimensional network structure, with a straight chain, branched chain, or a straight chain with partially branched chains being preferred. The position of the hydrogen atoms bonded to silicon in component (B) is not limited and can be located at the ends or sides of the molecular chain or on the branches. In addition to hydrogen atoms, component (B) also contains organic groups bonded to silicon, including but not limited to: alkyl, aryl, and aralkyl groups.

[0077] The polysiloxane composition of the present invention may contain one or more (e.g., 1, 2, 3, 4, 5 or 6) of (B) organohydrogenated polysiloxanes having two or more SiH groups to regulate the overall properties, wherein each may have the following average unit formula (III):

[0078] (SiO 4 / 2 ) a (Rx SiO 3 / 2 ) b (R x 2SiO 2 / 2 ) c (R x 3SiO 1 / 2 ) d Formula (III)

[0079] where each R x may be the same or different and are each independently H or a monovalent hydrocarbon group without aliphatic unsaturated carbon bonds, such as but not limited to C 2-12 alkyl groups, such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, or dodecyl; C 3-6 cycloalkyl groups, such as cyclohexyl, or cyclopentyl; C 6-20 aryl groups, such as phenyl, tolyl, xylyl, or naphthyl; C 7-20 aralkyl groups, such as benzyl, phenethyl, or phenylpropyl; and groups in which some or all of the hydrogens in these groups are substituted by halogens such as fluorine, chlorine, bromine or iodine, preferably R x is methyl or a combination of methyl and phenyl for the rest except H. If R x is a combination of methyl and phenyl for the rest except H, the molar ratio of methyl to phenyl may be about 9:1, about 8:2, about 7:3, about 6:4, about 5:5, about 4:6, about 3:7, about 2:8 or about 1:9.

[0080] In formula (III), a, b, c and d satisfy 0 ≤ a < 1, 0 ≤ b < 1, 0 ≤ c < 1, and 0 < d < 1, but a + b + c > 0, and a + b + c + d = 1.

[0081] Component (B) as a whole may also be represented by the above average unit formula (III).

[0082] According to some embodiments of the present invention, at least two Rs in each molecule of component (B) x are H (such as 2, 3, 4, 5, 6, 7, 8, 9, 10 or more H).

[0083] According to some embodiments of the present invention, component (B) has a weight-average molecular weight of 100-100,000, more preferably 200-50,000, more preferably 300-12,000, and even more preferably 1,000 to 10,000, for example 100, 150, 200, 300, 500, 1,000, 2000, 3,000, 4,000, 5,000, 6,000, 10,000, 12,000, 20,000, 50,000, or 100,000.

[0084] According to some embodiments of the present invention, the amount of component (B), based on the total weight of the solid components of the composition, is from 1 wt% to 70 wt%, preferably from 10 wt% to 60 wt%, more preferably from 15 wt% to 40 wt%, for example, it can be 1 wt%, 5 wt%, 10 wt%, 15 wt%, 20 wt%, 30 wt%, 40 wt%, 50 wt%, 60 wt%, or 70 wt%.

[0085] The viscosity of component (B) is not limited, but it is preferably in the range of 1 mPa·s to 100,000 mPa·s at 25°C, more preferably in the range of 2 mPa·s to 10,000 mPa·s, for example, 1, 2, 10, 100, 1,000, 10,000 or 100,000 mPa·s.

[0086] The organohydrogenated polysiloxane (B) of the present invention having two or more SiH groups is preferably in a liquid, solid or viscous state at room temperature. If it is a solid, its viscosity can be adjusted by adding a solvent to facilitate operation. The aforementioned solvent can be toluene, hexane, cyclohexane, etc.

[0087] In some embodiments of the present invention, the aforementioned individual (B) organohydrogenated polysiloxane having two or more SiH groups may be represented by the following average unit formula:

[0088] (HMe2SiO 1 / 2 ) d (PhSiO 3 / 2 ) b

[0089] (HMePhSiO 1 / 2 ) d (PhSiO 3 / 2 ) b

[0090] (HMePhSiO 1 / 2 ) d’ (HMe2SiO 1 / 2 ) d” (PhSiO3 / 2 ) b

[0091] (HMe2SiO 1 / 2 ) d (Ph2SiO 2 / 2 ) c (PhSiO 3 / 2 ) b

[0092] (HMePhSiO 1 / 2 ) d (Ph2SiO 2 / 2 ) c (PhSiO 3 / 2 ) b

[0093] (HMe2SiO 1 / 2 ) d (MePhSiO 2 / 2 ) c (PhSiO 3 / 2 ) b

[0094] (HMePhSiO 1 / 2 ) d (MePhSiO 2 / 2 ) c (PhSiO 3 / 2 ) b

[0095] (HMePhSiO 1 / 2 ) d’ (HMe2SiO 1 / 2 ) d” (Ph2SiO 2 / 2 ) c (PhSiO 3 / 2 ) b

[0096] (HMe2SiO 1 / 2 ) d (SiO 4 / 2 ) a

[0097] Among them, a, b, c and d are as described above, 0 < d' < 1, 0 < d" < 1, and d' + d" = d.

[0098] Alternatively, the above-mentioned individual (B) organohydropolysiloxane having two or more SiH groups may be represented by the following chemical formula:

[0099] HMe2SiO(Ph2SiO) m SiMe2H

[0100] HMe2SiO(Me2SiO) n SiMe2H

[0101] HMe2SiO(Ph2SiO) m (Me2SiO) n SiMe2H

[0102] HMePhSiO(Ph2SiO) m SiMePhH

[0103] HMe2SiO(MePhSiO) m SiMe2H

[0104] HMePhSiO(MePhSiO) n SiMePhH

[0105] HMePhSiO(MePhSiO) n (Me2SiO) m SiMePhH

[0106] HMe2SiO(HMeSiO) m (Me2SiO) n SiMe2H

[0107] Me3SiO(HMeSiO) m SiMe3

[0108] HMePhSiO(Ph2SiO) m (MePhSiO) n SiMePhH

[0109] HMePhSiO(Ph2SiO) m (Me2SiO) n SiMePhH

[0110] Where m and n are independent integers from 1 to 200 (e.g., 1, 2, 5, 10, 20, 50, 100, 120, 160, 180 or 200), preferably from 160 to 180.

[0111] (C) Organic crosslinking agents having two or more alkenyl groups

[0112] The organopolysiloxane (A) of the present invention, having two or more alkenyl groups, can undergo a hydrosilylation reaction with (B) an organohydrogenated polysiloxane having two or more SiH groups, wherein the alkenyl groups are converted into alkyl groups and bonded to the silicon atoms of the SiH groups, while the hydrogen atoms of the SiH groups are removed. To promote the crosslinking of the polysiloxane and achieve rapid shaping or curing, the polysiloxane composition of the present invention further comprises (C) an organic crosslinking agent having two or more alkenyl groups.

[0113] The inventors in this case discovered that the refractive index (N) of component (C) c The refractive index (N) of the mixture with components (A) and (B) ab The following relationship should exist: |N c -N ab |≤0.1, i.e., N c With N ab The absolute value of the difference must be ≤0.1, preferably ≤0.08, better ≤0.05, and best ≤0.02, for example ≤0.1, ≤0.09, ≤0.08, ≤0.07, ≤0.06, ≤0.05, ≤0.04, ≤0.03, ≤0.02, or ≤0.01. For example, the refractive index (N) of the mixture of components (A) and (B) ab If the refractive index (N) of component (C) is 1.54, then the refractive index (N) of component (C) is... c The refractive index (N) of component (C) should be between 1.44 and 1.64. c The refractive index (N) of the mixture with components (A) and (B) ab When the above relationships are met, the mixture can be homogeneous without layering, emulsification, or fogging. When applied to radiation curing systems (such as UV curing), curing efficiency is significantly improved, achieving a dry, non-stick surface in a short time after irradiation, resulting in rapid setting. For example, if N... c With N ab If the absolute value of the difference is ≤0.1, it can be shaped or cured more quickly after irradiation; conversely, if N c With N ab If the absolute value of the difference is greater than 0.1, it may lead to insufficient cross-linking after irradiation, making it impossible to achieve rapid shaping or curing. Furthermore, adding component (C) helps to form a network structure after curing, increasing the hardness of the cured product and further improving its physical properties. The inventors further discovered that component (C), like component (A), has alkenyl groups and can undergo hydrosilylation reactions with SiH groups. Organic cross-linking agents with two or more alkenyl groups in (C) have small molecular structures and a relatively high proportion of alkenyl groups, thus increasing the probability of the reaction occurring, thereby increasing the UV curing reaction rate and lowering the UV curing reaction temperature.

[0114] The organic crosslinking agent (C) of the present invention having two or more alkenyl groups has two or more alkenyl groups, for example, 2, 3, 4, 5, 6 or 8. The organic crosslinking agent (C) of the present invention having two or more alkenyl groups has a core structure and the core structure is modified by two or more alkenyl groups.

[0115] According to some embodiments of the present invention, the aforementioned core structure may be a multivalent organic structure based on a hydrocarbon group or a heterocyclic group, and the aforementioned hydrocarbon group may contain one or more oxygen atoms as needed. The valence of the core structure corresponds to the number of alkenyl groups modifying the aforementioned core structure. Preferably, the aforementioned core structure may be a divalent organic structure, a trivalent organic structure, or a tetravalent organic structure. In the present invention, a multivalent heterocyclic group, taking a divalent heterocyclic group as an example, refers to the atomic group remaining after removing two hydrogen atoms that are directly bonded to carbon atoms or heteroatoms on the heterocycle.

[0116] According to some embodiments of the present invention, the aforementioned alkenyl group can be connected to the core structure via a linker. The aforementioned linker can be a single bond, -O-, -S-, -C(O)-, -C(O)O-, or -OR. 1 -、-SR 1 -、-C(O)R 1 -or-C(O)OR 1 -, where R 1 C 1-6 Alkylene or C 1-6 Alkyloxy group, preferably C 1-4 Alkylene or C 1-4 Alkyloxy group, preferably C 1-2 Alkylene or C 1-2 alkeneoxy group; preferred linker groups may be -O-, -C(O)-, -C(O)O-, or -OR. 1 - The aforementioned connecting base can be connected to the core structure in any direction. Taking -C(O)O- as an example, the direction of connection between the connecting base and the core structure can be represented by * as follows: -C(O)O-* or *-C(O)O-.

[0117] The aforementioned alkenyl group can be implemented as C 2-6 alkenyl or C 3-8 Cycloalkenyl, such as vinyl, propenyl (e.g., allyl, 1-propenyl, isopropenyl), butenyl, pentenyl, hexenyl or cyclohexenyl, preferably vinyl or propenyl, more preferably allyl or isopropenyl.

[0118] According to some embodiments of the present invention, the organic crosslinking agent (C) having two or more alkenyl groups of the present invention may have the following formula:

[0119] B-(LP) W

[0120] in:

[0121] B is a multivalent organic group with a w-valent structure, serving as the core structure.

[0122] L is the linker base, defined as previously described in this article;

[0123] P is an alkenyl group, as defined previously herein; and

[0124] w is an integer selected from 2 to 8, such as 2, 3, 4, 5, 6, 7 or 8, preferably an integer from 2 to 6, and even more preferably an integer from 2 to 4.

[0125] According to some embodiments of the present invention, B may be a polyvalent hydrocarbon group or a heterocyclic group; the aforementioned hydrocarbon group may contain one or more oxygen atoms as needed; the aforementioned heterocyclic group may be substituted with one to three groups selected from halogens, hydroxyl groups, oxy groups, alkyl groups, and hydroxyalkyl groups as needed. According to further embodiments of the present invention, the aforementioned polyvalent hydrocarbon group may be a polyvalent aliphatic hydrocarbon group (e.g., C...). 1-20 Aliphatic hydrocarbon groups) or aromatic hydrocarbon groups (e.g., C14) 6-20 Aromatic hydrocarbon groups); the above-mentioned polyvalent heterocyclic groups can be 3 to 14-membered heterocyclic groups, such as, but not limited to: pyrrole, imidazolyl, pyrazolyl, pyrimidinyl, tricyclic, etc. The group may be alkyl, thiazolyl, pyridyl, indolyl, isoindolyl, benzimidazole, benzothiazolyl, quinolinyl, or isoquinolinyl. According to some embodiments of the invention, B may be an alkyl, alkoxy, phenyl, biphenyl, a segment derived from a polyol (e.g., polyethylene glycol or polypropylene glycol), or a 3- to 14-membered heterocyclic group substituted with 1 to 3 groups selected from halogens, hydroxyl groups, side-oxygen groups, alkyl groups, and hydroxyalkyl groups, as desired.

[0126] In some embodiments, examples of the B multivalent organic group include, but are not limited to:

[0127] divalent organic groups

[0128] ─CH2─, ─CH2-CH2─, ─CH2-CH2-CH2─, ─CH2-CH2-CH2-CH2─,

[0129] ─CH2-CH2-CH2-CH2-CH2─, ─CH2-CH2-CH2-CH2-CH2-CH2─,

[0130] ─CH2-CH(CH3)─,─CH2-C(CH3)─[O-CH2-CH(CH3)] k —、

[0131] ─CH2-CH2─[O-CH2-CH2] k —、

[0132]

[0133] Where k is an integer from 1 to 10, each R2 may be the same or different and each is independently H, C1-C4 alkyl, C1-C4 perfluoroalkyl, C1-C4 alkoxy or halogen, R3 is a covalent bond, -O-, -S-, -CH2-, -S(O)2-, -C(CF3)2- or -C(CH3)2-, and each y is an integer from 0 to 4.

[0134] Trivalent organic groups

[0135] Or selected from the following trivalent heterocyclic groups: pyrimidinyl, tri-... The trivalent heterocyclic groups, including pyridyl and isoydinol, may be substituted with one to three groups selected from oxy, alkyl and hydroxyalkyl groups as needed;

[0136] Tetravalent organic groups

[0137]

[0138] Each R2 may be the same or different and is independently H, C1-C4 alkyl, C1-C4 perfluoroalkyl, C1-C4 alkoxy or halogen, R3 is covalent, -O-, -S-, -CH2-, -S(O)2-, -C(CF3)2- or -C(CH3)2-, and each y is an independent integer from 0 to 4;

[0139] Hexavalent organic groups

[0140]

[0141] According to some embodiments of the present invention, exemplary linker-alkenyl (i.e., -LP) structures are listed below:

[0142]

[0143] The asterisk (*) indicates the direction of connection with the core structure. Specific (C) organic crosslinking agents having two or more alkenyl groups can be listed (but are not limited to): triallyl isocyanurate (TAIC), tri(2-hydroxyethyl) isocyanurate triacrylate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, tetraallyl pyromellitic ester, 1,6-hexanediol diacrylate, ethylene glycol dimethacrylate, tri(propylene glycol) diacrylate, ethoxylated bisphenol A diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythritol hexaacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, di(trimethylolpropane) tetraacrylate, or combinations thereof.

[0144] According to some embodiments of the present invention, (C) the organic crosslinking agent having two or more alkenyl groups does not contain alkynyl groups, or (C) the organic crosslinking agent having two or more alkenyl groups does not contain silicon atoms (i.e., does not contain silicon-containing groups such as siloxanes or SiH groups). According to a preferred embodiment of the present invention, (C) the organic crosslinking agent having two or more alkenyl groups does not contain alkynyl groups and does not contain silicon atoms; although alkynyl groups can undergo hydrosilylation reactions with SiH groups, this may reduce the reaction rate.

[0145] According to some embodiments of the present invention, component (C) has a weight-average molecular weight of 100-1,500, more preferably 100-1,000, and even more preferably 200-500, such as 100, 200, 300, 400, 500, 600, 700, 800, 900, 1,000, 1,200, or 1,500. According to some embodiments of the present invention, component (C) has a lower weight-average molecular weight than component (A).

[0146] According to some embodiments of the present invention, the amount of component (C), based on the total weight of the solid components of the composition, is from 0.05 wt% to 10 wt%, preferably from 0.1 wt% to 5 wt%, more preferably from 0.2 wt% to 3 wt%, for example, it can be 0.05 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, 1.2 wt%, 1.5 wt%, 1.8 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, or 10 wt%. If the amount of component (C) is too low, it may not be able to achieve the effect of rapid curing, and a longer radiation (such as UV) irradiation time is required for the resin to cure completely; if the amount of component (C) is too high, it may lead to a decrease in light transmittance and affect the high-temperature stability of the resin (i.e., the light transmittance decreases after high-temperature testing).

[0147] The amounts of components (A), (B), and (C) of this invention should be determined by considering the total molar number of alkenyl groups in components (A) and (C) and the total molar number of SiH groups in component (B). The ratio of the total molar number of alkenyl groups to the total molar number of SiH groups should be between 0.1 and 4, preferably between 0.5 and 3, and more preferably between 0.7 and 1, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 2, 2.5, 3, 3.5, or 4. Unreacted alkenyl or SiH groups may have an adverse effect on the long-term stability of the resin. Therefore, in some preferred embodiments of this invention, the ratio of the total molar number of alkenyl groups to the total molar number of SiH groups is preferably close to 0.7 to 1.

[0148] Components (A) and (B) of the present invention both have a polysiloxane structure, exhibit high compatibility, and have a refractive index of approximately 1.35 to 1.65, which varies with R and R x The types vary. If the R and R of components (A) and (B) are different... x Primarily or solely alkyl (e.g., methyl), both have refractive indices between approximately 1.40 and 1.50 (lower refractive index); if components (A) and (B) R, R x Primarily or only for unsubstituted or via one or more C 1-3 Alkyl-substituted phenyl groups (e.g., phenyl) have refractive indices between approximately 1.45 and 1.60 (the latter being the higher refractive index).

[0149] (D) Photoactive catalysts

[0150] The (D) photoactive catalyst of the present invention is a catalyst that can be activated and catalyze hydrosilylation reactions under light irradiation of 200-500 nm. It is preferably a catalyst of a metal element, its salt, or its complex; more preferably a catalyst of a Group VIIIB transition metal (including nickel, palladium, platinum, and rhodium, etc.), its salt, or its complex; and most preferably a catalyst of platinum, its salt, or its complex. The (D) photoactive catalyst of the present invention can be a pure catalyst material or a catalyst material deposited on a support (e.g., silica or carbon black). In some preferred embodiments, the (D) photoactive catalyst of the present invention is soluble or dispersed in an organic phase, facilitating thorough mixing with other components.

[0151] Photoactivation refers to the process by which a catalyst absorbs photons with energy greater than or equal to its band gap, causing it to transition from its ground state to an excited state, forming highly reactive species that then undergo redox reactions with other substances. Therefore, photoactive catalysts will be activated and catalyze during radiation curing.

[0152] According to some embodiments of the present invention, the (D) photoactive catalyst of the present invention comprises platinum complexes of cyclopentadiene, cyclooctadiene, norbornadiene, or β-diketone, and specific types may be listed (but are not limited thereto): (cyclopentadienyl)dimethylplatinum complex, (cyclopentadienyl)trimethylplatinum complex, (methylcyclopentadienyl)trimethylplatinum complex, (cyclopentadienyl)ethyldimethylplatinum complex, (cyclopentadienyl)acetyldimethylplatinum complex, (methylcyclopentadienyl)diethylplatinum complex, (methylcyclopentadienyl)trihexylplatinum complex, (trimethyl) (Silylcyclopentadienyl)diphenylplatinum wrapped compounds, (trimethylsilylcyclopentadienyl)trimethylplatinum wrapped compounds, (dimethylphenylsilylcyclopentadienyl)triphenylplatinum wrapped compounds, (cyclopentadienyl)dimethyltrimethylsilylmethylplatinum wrapped compounds, (1,5-cyclooctadiene)dimethylplatinum, (1,5-cyclooctadiene)diphenylplatinum wrapped compounds, (1,5-cyclooctadiene)dipropylplatinum wrapped compounds, (methylcyclooctyl-1,5-dienyl)diethylplatinum wrapped compounds, (2,5-norbornadiene)dimethylplatinum wrapped compounds, (2,5-norbornadiene)diphenylplatinum wrapped compounds and combinations thereof.

[0153] According to some embodiments of the present invention, the amount of the (D) photoactive catalyst of the present invention, based on the total weight of the solid components of the composition, is from 1 ppm to 50 ppm, preferably from 5 ppm to 25 ppm, more preferably from 8 ppm to 15 ppm, for example, it can be 1 ppm, 2 ppm, 3 ppm, 4 ppm, 5 ppm, 6 ppm, 7 ppm, 8 ppm, 9 ppm, 10 ppm, 12 ppm, 15 ppm, 18 ppm, 20 ppm, 30 ppm, 40 ppm or 50 ppm. It is anticipated that a higher amount of catalyst will result in a faster reaction rate, but adding too much catalyst will lead to increased costs and will worsen the light transmittance of the polysiloxane resin (e.g., <90%) and increase the yellowing coefficient. The polysiloxane composition of the present invention can achieve rapid shaping or curing with a lower amount of catalyst, thus having a cost advantage over the prior art and enabling the polysiloxane resin to have good optical properties.

[0154] Polysiloxane resin

[0155] The components involved in the hydrosilylation reaction of the present invention are (A) an organopolysiloxane having two or more alkenyl groups, (B) an organohydrogenated polysiloxane having two or more SiH groups, (C) an organic crosslinking agent having two or more alkenyl groups, and (D) a photoactive catalyst, wherein the photoactive catalyst (D) is activated under radiation irradiation and catalyzes the hydrosilylation reaction to generate a polysiloxane resin. The aforementioned radiation curing is a process that uses irradiation energy to transform a composition from a liquid or fluid state into a solid state; the radiation implementation includes an electron beam or UV light.

[0156] In UV curing, UV light can be categorized by wavelength into near-ultraviolet (UVA), far-ultraviolet (UVB), and ultra-short ultraviolet (UVC), with typical radiation doses ranging from 1,000 to 10,000 mJ / cm². 2 Within the range, preferably 1,500 to 5,000 mJ / cm 2 For example, 1,000 mJ / cm 2 1,500 mJ / cm 2 2,000 mJ / cm 2 3,000 mJ / cm 2 4,000 mJ / cm 2 5,000 mJ / cm 2 6,000 mJ / cm 2 7,000 mJ / cm 2 8,000 mJ / cm 2 9,000 mJ / cm 2 Or 10,000 mJ / cm 2 To achieve rapid setting or curing, the UV light irradiation time should be within 10 minutes, for example, 0.5 minutes, 1 minute, 1.5 minutes, 2 minutes, 3 minutes, 3.5 minutes, 4 minutes, 5 minutes, 6 minutes, 7 minutes, 8 minutes, 9 minutes, or 10 minutes. According to some embodiments of the present invention, a near-ultraviolet (UVA) light source with an irradiation intensity of 2,000 mJ / cm² is used. 2 .

[0157] Even after radiation irradiation ends, the catalyst within the polysiloxane resin retains its catalytic activity, allowing for continued hydrosilylation reactions and further curing of the resin. If necessary, post-baking can be applied to further cure the resin; however, the temperature and time of subsequent baking should not cause shrinkage or warping of the substrate. Because the polysiloxane resin of this invention can be rapidly shaped or cured under radiation irradiation, it offers ease of processing during subsequent operations (e.g., moving samples to an oven) and reduces or avoids excess resin.

[0158] According to the present invention, the irradiation process may raise the temperature of the composition, but the temperature of the composition remains lower than that of the reaction carried out by thermosetting or by irradiation followed by thermosetting. Generally, the temperature of the thermosetting reaction should reach 120°C or higher and the curing time should reach 2 hours or higher to obtain effective curing; for the reaction carried out by irradiation followed by thermosetting, the temperature of the thermosetting reaction should reach 80°C or higher and the curing time should reach 0.5 hours or higher. However, as mentioned above, high-temperature and long-term thermosetting conditions can easily cause the substrate to shrink or warp or even be damaged, thus not meeting the product and process requirements of the present invention. In contrast, the radiation curing of the present invention achieves a temperature of no more than 80°C and a shorter curing time.

[0159] The polysiloxane resin formed after curing the composition of the present invention can be used for encapsulating light-emitting elements such as LEDs, but is not limited thereto. The polysiloxane resin of the present invention has properties such as good smoothness, good optical transmittance, resistance to yellowing, and high-temperature stability. In some embodiments of the present invention, the polysiloxane resin has a light transmittance of at least 90%, at least 92%, at least 95%, or at least 98%, and retains at least 90%, at least 92%, at least 95%, or at least 98% light transmittance after high-temperature testing (e.g., baking at 150°C for 24 hours). In some embodiments of the present invention, the polysiloxane resin has a low yellowness index, for example, below 5, below 4, below 3, or below 2. In some embodiments of the present invention, the polysiloxane resin has a low average surface roughness, for example, at most 0.05 μm, at most 0.04 μm, at most 0.03 μm, or at most 0.02 μm. The composition of the present invention can achieve good smoothness through the aforementioned leveling and curing encapsulation method.

[0160] This invention also provides a two-component composition comprising a combination of component (I) and component (II), wherein component (I) comprises component (A), component (C), and component (D), and component (II) comprises component (B). By storing component (B) separately, the alkenyl and SiH groups are prevented from coming into contact, thus avoiding spontaneous reaction. A polysiloxane resin can be prepared by mixing component (I) and component (II).

[0161] According to some embodiments of the present invention, the composition may include other optional materials well known in the formulation art, such as antioxidants, hindered amine light stabilizers, UV light absorbers and stabilizers, surfactants, flow control agents, thixotropic agents, fillers, organic solvents, fungicides and other conventional adjuvants.

[0162] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0163] The composition of this invention can be rapidly shaped or cured by radiation, achieving rapid shaped or cured effects with a low catalyst content, and the resulting product possesses excellent optical properties and thermal stability. Because the polysiloxane resin of this invention can be rapidly shaped or cured under radiation irradiation, it is easy to process in subsequent operations, reducing or avoiding adhesive overflow. Furthermore, compared to conventional thermosetting reactions that require high temperatures and long durations, easily causing substrate shrinkage, warping, or even damage, this invention has a shorter curing time, and the radiation curing temperature does not exceed 80°C, giving it a significant advantage.

[0164] Example

[0165] The following embodiments are provided to further illustrate the present invention, but are not intended to limit the scope of the invention. Any modifications and alterations that can be easily made by those skilled in the art are included within the scope of the disclosure in this specification and the claims.

[0166] The components used in each embodiment and comparative example are described in Table 1:

[0167] Table 1

[0168]

[0169] According to the composition and dosage shown in Table 2 below, components (A) to (D) were added to a 5-liter reactor and stirred at room temperature for 1 hour to prepare the compositions of Examples 1 to 8 and Comparative Examples 1 to 4. The compositions of the examples and comparative examples of the present invention were coated onto glass substrates and irradiated with UV light for different durations to obtain cured products (polysiloxane resins). Subsequently, the physical properties of the polysiloxane compositions and polysiloxane resins, including refractive index, light transmittance, and thermal stability, were measured using the following test methods.

[0170] 1. Refractive index

[0171] The Abbe refractometer from ATAGO Corporation was used, with visible light at a wavelength of 589 nm as the light source for the measurement. The refractive index of the sample (e.g., a homogeneous mixture of components (A) and (B) or each component (C)) was measured at 25°C.

[0172] 2. UV Curing Status

[0173] With an energy of 2,000 mJ / cm 2 The mixture was irradiated with a UVA lamp source, and the time required for the composition to react to set or cure was recorded, as well as whether the surface of the colloid was non-sticky.

[0174] 3. Light transmittance and light transmittance after high-temperature testing

[0175] After radiation curing, the initial light transmittance was tested using a HunterLab spectrophotometer. Then, the sample was placed in a 150-degree oven for 24 hours for aging, and the light transmittance was tested again to observe the change in transmittance at a wavelength of 450nm.

[0176] Tables 2 and 3 list the amounts of each component, reaction conditions, and test results used in the preparation of the above examples and comparative examples:

[0177] Table 2

[0178]

[0179] Table 3

[0180]

[0181] Table 2 shows that |N| in Examples 1 to 8 c -N ab |≤0.1, these can reach a set or cured state within 10 minutes of UV light irradiation (generally, at most only 4 minutes of UV light irradiation is required), and it is observed that if |N c -N ab The smaller the value, the more quickly it can be shaped or cured under UV light irradiation for a shorter period. Furthermore, Examples 1 to 8 exhibit good optical properties and thermal stability. In contrast, as shown in Table 3, the composition of Comparative Example 1, without added component (C), does not satisfy |N c -N ab The condition of | ≤0.1 resulted in insufficient crosslinking, and it did not set even after UV irradiation for more than 10 minutes; the composition of Comparative Example 2 also did not add component (C), but the content of component (D) was adjusted to 3 times (i.e., 30 ppm), and it became set or cured after UV irradiation for more than 10 minutes. However, this comparative example added too much platinum catalyst, which led to increased cost and poor thermal stability (the light transmittance decreased to <90% and yellowing occurred after high temperature testing); the composition of Comparative Example 3, although it added component (C), |N c -N ab |>0.1, even after UV irradiation for more than 10 minutes, it remains undefined and exhibits poor optical properties. Furthermore, it satisfies |N c -N ab Under the condition that |≤0.1, the amount of component (C) can be further adjusted to avoid affecting the optical properties. Comparative Example 4 shows that too much component (C) may lead to poor light transmittance and poor thermal stability.

[0182] Therefore, the composition of the present invention satisfies |N c -N ab A concentration of ≤0.1 may achieve rapid shaping or curing, and the resulting product possesses good optical properties and thermal stability. In some preferred embodiments, the amount of component (C) can be further adjusted to give the resulting product good optical properties and thermal stability.

Claims

1. A radiation-curable polysiloxane composition, comprising: (A) Organopolysiloxanes having two or more alkenyl groups, (B) Organohydrogenated polysiloxanes having two or more SiH groups (C) Organic crosslinking agents having two or more alkenyl groups, and (D) Photoactive catalyst The refractive index (N) of component (C) c The refractive index (N) of the mixture with components (A) and (B) ab The following relationship exists: |N c -N ab |≤0.1。 2. The composition according to claim 1, wherein component (A) is represented by the following average formula (I): (R x SiO (4-a) / 2 ) formula (I), Where x is a number between 0.8 and 3.0, Each R is independently C 2-12 alkenyl, substituted or unsubstituted C 1-12 Alkyl, substituted or unsubstituted C 3-6 cycloalkyl, substituted or unsubstituted C 6-20 aryl or substituted or unsubstituted C 7-20 Aryl groups, In each molecule of component (A), at least two Rs are C. 2-12 alkenyl, and Component (A) has a weight-average molecular weight of 100-100,000.

3. The composition according to claim 1, wherein component (B) is represented by the following average unit formula (III): (SiO 4 / 2 ) a (R x SiO 3 / 2 ) b (R x 2SiO 2 / 2 ) c (R x 3SiO 1 / 2 ) d (III) Among them, each R x Independently H, substituted or unsubstituted C 1-12 Alkyl, substituted or unsubstituted C 3-6 cycloalkyl, substituted or unsubstituted C 6-20 aryl or substituted or unsubstituted C 7-20 Aryl groups, Where 0≤a<1, 0≤b<1, 0≤c<1, 0 <d<1、a+b+c> 0 and a+b+c+d=1, Each molecule of component (B) contains at least two Rs. x It is H, and Component (B) has a weight-average molecular weight of 100-100,000.

4. The composition according to claim 1, wherein the amount of component (C) used is from 0.05% to 10% by weight, based on 100% by weight of the solid content of the composition.

5. The composition according to claim 1, wherein the ratio of the total molar number of alkenyl groups contained in components (A) and (C) to the total molar number of SiH groups contained in component (B) ranges from 0.1 to 4.

6. The composition according to claim 1, wherein component (C) may have the following formula: B-(L-P) W in: B is the core structure and is a multivalent organic group with a w valence; L is a linker base, and each can be independently chosen from single bonds, -O-, -S-, -C(O)-, -C(O)O-, -OR. 1 -、-SR 1 -、-C(O)R 1 -or-C(O)OR 1 -The groups that form; P is an alkenyl group; and w is an integer selected from 2 to 8.

7. The composition of claim 6, wherein P is each independently vinyl, propenyl, allyl, isopropenyl, butenyl, pentenyl or hexenyl.

8. The composition of claim 6, wherein B is a polyvalent aliphatic hydrocarbon group, a polyvalent aromatic hydrocarbon group, or a polyvalent 3- to 14-membered heterocyclic group having 1 to 3 heteroatoms selected from N, O, and S, wherein the polyvalent aliphatic hydrocarbon group or polyvalent aromatic hydrocarbon group may contain 1 or more oxygen atoms as desired, and wherein the 3- to 14-membered heterocyclic group may be substituted with 1 to 3 groups selected from halogen, hydroxyl, side oxygen, alkyl, and hydroxyalkyl as desired.

9. A two-component composition comprising a combination of component (I) and component (II), wherein: Component (I) comprises: component (A), component (C), and component (D) as claimed in claim 1, and Component (II) comprises: component (B) as claimed in claim 1. The refractive index (N) of component (C) c The refractive index (N) of the mixture with components (A) and (B) ab The following relationship exists: |N c -N ab |≤0.1。 10. A method of manufacturing an encapsulation material comprising reacting a composition according to any one of claims 1 to 9 with an energy of 1,000 to 10,000 mJ / cm². 2 Expose the product to UVA radiation for no more than 10 minutes to set or cure it.

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