A glue-filling process defect early warning method and system
By acquiring glue dispensing process parameters and product structure information, and combining them with glue temperature sequence for flow stability analysis, the problem of low accuracy in existing glue dispensing process defect early warning methods has been solved, enabling precise early warning and clear intervention for glue dispensing process defects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN YUSHENG OPTOELECTRONICS CO LTD
- Filing Date
- 2026-03-26
- Publication Date
- 2026-06-09
AI Technical Summary
Existing methods for early warning of defects in the glue-filling process cannot accurately distinguish the types of defects that are about to occur, resulting in low accuracy of early warning and unclear intervention direction.
By acquiring glue dispensing process parameters, product structure information, and glue temperature sequence, glue flow stability analysis is performed. Combined with the probability sequence of air bubble encapsulation and insufficient filling risk, a comparative analysis is conducted to generate accurate defect early warning signals.
It enables precise early warning of defects in the glue-pouring process, provides clear intervention directions and valuable time windows, and significantly improves the accuracy and pertinence of early warning.
Smart Images

Figure CN122174052A_ABST