Anti-interference wireless data transmission assembly for complex electromagnetic environment and integrated manufacturing method thereof

Abstract

This invention relates to an anti-interference wireless data transmission component for complex electromagnetic environments and its integrated manufacturing method, comprising at least one substrate, a first filter, a second filter, an amplifier or multi-functional chip, an antenna, and several transmission lines; at least one substrate is vertically arranged, and each substrate is provided with at least one first filter, a second filter, an amplifier or multi-functional chip, an antenna, and several transmission lines. Each first filter, second filter, and transmission line includes a lower ground plane, a side wall, an upper ground plane, and a signal line. The signal line includes an input signal line, an output signal line, and at least one impedance adjustment unit. Each impedance adjustment unit includes two short-circuit stubs, a grounding post, an impedance matching line, and an open-circuit stub. This invention can realize signal transmission in the horizontal or vertical direction. The multi-layer vertical stacking is beneficial for the miniaturization of the structure and can be widely used in the field of high-reliability wireless data communication technology.

Description

Technical Field

[0001] This invention relates to the field of high-reliability wireless data communication technology, and in particular to an anti-interference wireless data transmission component for complex electromagnetic environments and its integrated manufacturing method. Background Technology

[0002] In modern high-reliability applications, such as emergency rescue brain-computer interfaces and robotic radar systems, unprecedented and extreme demands are placed on the performance of wireless data transmission. The core task of these systems relies on achieving continuous, stable, and low-latency transmission of critical data streams in complex electromagnetic environments characterized by high dynamics and strong interference. In the field of brain-computer interfaces, especially in high-risk missions such as emergency rescue, disaster medicine, and special operations, systems need to transmit neural control commands from rescue personnel or neurophysiological data of the injured to remote command or medical centers in real time. The transmission environment in these situations is often filled with interference from various high-power wireless devices such as walkie-talkies, life-detection radars, and drone image transmissions, as well as sudden noises such as electrical sparks. Any interruption, delay, or error in data transmission can lead to command execution failure or misjudgment of vital signs, resulting in serious consequences. Such emergency scenarios place extreme demands on information transmission systems: they must be able to transmit crucial neural commands or physiological data with extremely high reliability, extremely low latency, and stable bandwidth in harsh environments with strong interference such as various rescue radios and equipment spark noise. Similarly, in robotic and radar perception systems, robots, the control center, and radar sensors need to continuously exchange high-bandwidth environmental perception data and real-time control commands. These systems also operate in a complex shared spectrum, facing severe interference from other communication devices, industrial noise, and multipath effects. Unreliable data transmission will directly lead to robot positioning failures, decision-making errors, or coordination failures, jeopardizing the safety and efficiency of the entire task.

[0003] However, existing general-purpose wireless transmission solutions, such as commercial Bluetooth and Wi-Fi modules, have fundamental flaws when facing the aforementioned cross-domain common challenges, constituting a significant bottleneck in system reliability. The electromagnetic environment at emergency sites is extremely complex. Existing general-purpose RF front-end filters have poor selectivity and cannot effectively isolate strong out-of-band interference from various high-power wireless devices such as walkie-talkies, drone image transmission systems, and life-detection radars, leading to a sharp deterioration in the signal-to-noise ratio of neural signal transmission links, or even complete interruption. When transmitting high-density neural data, existing solutions suffer from limited bandwidth, inherent protocol overhead, and poor burst error resilience, easily causing command delays, packet loss, or bit errors—unacceptable in time-sensitive emergency operations. Emergency equipment must be robust, portable, and low-power. Traditional discrete RF solutions are bulky, power-hungry, and have fragile connections, making them difficult to integrate into safety helmets, portable monitors, or lightweight exoskeletons, and unable to maintain stable performance under harsh conditions such as vibration, high temperature, and high humidity.

[0004] In summary, the shortcomings of existing general-purpose wireless transmission methods in terms of anti-interference, real-time reliability, and integrated energy efficiency have become the core bottleneck restricting the reliable deployment and widespread application of cutting-edge systems such as brain-computer interfaces, robots, and radar in real and complex environments. They cannot intelligently adapt to harsh electromagnetic environments and fundamentally guarantee the anti-interference, high reliability, and real-time transmission capabilities of critical data streams. Summary of the Invention

[0005] To address the aforementioned problems, the purpose of this invention is to provide an anti-interference wireless data transmission component for complex electromagnetic environments and its integrated manufacturing method, which can intelligently adapt to harsh electromagnetic environments and fundamentally ensure the anti-interference, high reliability, and real-time transmission capabilities of critical data streams.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: On the one hand, it provides an anti-interference wireless data transmission component for complex electromagnetic environments, including at least one substrate, a first filter, a second filter, an amplifier or multi-functional chip and an antenna, and several transmission lines;

[0007] At least one of the substrates is vertically arranged, and each substrate is provided with at least one first filter, a second filter, an amplifier or a multi-functional chip and an antenna, as well as a plurality of transmission lines. Each of the first filter, the second filter and the transmission line includes a bottom ground, a side wall, an upper ground and a signal line. The signal line includes an input signal line, an output signal line and at least one impedance adjustment unit. Each impedance adjustment unit includes two short-circuit stubs, a grounding post, an impedance matching line and an open-circuit stub. The bottom of the lower ground plane is fixedly connected to the corresponding substrate, and the top of the lower ground plane is fixedly connected to the corresponding upper ground plane through the corresponding side wall. The corresponding signal line is arranged in the space formed by the lower ground plane, the side wall, and the upper ground plane. At least two short-circuit stubs of each impedance adjustment unit are symmetrically arranged at intervals. One side of the short-circuit stub located on the outer side is connected to the corresponding input signal line or output signal line, and the other side of the short-circuit stub located on the outer side is connected to one end of the corresponding impedance matching line. The short-circuit stub located on the inner side is a short-circuit stub shared by two adjacent impedance adjustment units. The two sides of the short-circuit stub are respectively connected to one end of the corresponding impedance matching line of the two impedance adjustment units. The other end of each impedance matching line is connected to a corresponding open-circuit stub. The two open-circuit stubs of each impedance adjustment unit are parallel but do not contact each other. One end of each short-circuit stub is connected to the corresponding grounding post. The first filter is used to filter the analog baseband signal and transmit it to the corresponding amplifier or multifunction chip through the corresponding transmission line; the amplifier or multifunction chip is used to amplify the filtered analog baseband signal and transmit it to the corresponding second filter through the corresponding transmission line; the second filter is used to perform secondary filtering on the amplified analog baseband signal and transmit it to the corresponding antenna through the corresponding transmission line; the antenna is used to transmit the secondary filtered analog baseband signal to the corresponding external receiving device.

[0008] Furthermore, the two adjacent impedance control units share one of the short-circuit stubs, and the input signal line, output signal line, and impedance matching line are located on the same straight line. The short-circuit stub and the open-circuit stub are perpendicular to the straight line.

[0009] Furthermore, it also includes a mixer, an equalizer, and / or a power divider, wherein the mixer is disposed between the first filter and the amplifier or multifunction chip; and the equalizer is connected to the amplifier or multifunction chip.

[0010] Furthermore, the first filter, the second filter, the antenna, and the transmission line are all pure metal structures, formed through an integrated processing technology.

[0011] Furthermore, the transmission line is directly connected to the signal line of the first filter or the second filter, and is manufactured as a single signal line through integrated processing, without the need for additional interconnection processes.

[0012] Furthermore, the upper ground, lower ground, and sidewall of each of the first filter, second filter, and transmission line are all metal and are equipotentially connected.

[0013] Furthermore, the total lengths of the two grounding posts and the corresponding short-circuit stubs of each impedance adjustment unit of the first filter, the second filter, and the transmission line are the same; when the first filter, the second filter, and the transmission line include only one impedance adjustment unit, the lengths of the two short-circuit stubs are the same; when the first filter, the second filter, and the transmission line include more than one impedance adjustment unit, the impedance adjustment units are arranged symmetrically about the axis.

[0014] Furthermore, the multifunctional chip is a multifunctional integrated chip including an amplifier. The multifunctional chip is flip-chip interconnected with the corresponding transmission line through solder balls. A current limiting layer is distributed between the solder balls and the transmission line. Solder and valveable material are distributed on the back side of the multifunctional chip to connect the back side of the multifunctional chip to the sidewall of the transmission line and connect to a common ground plane. The top layer of the back side of the multifunctional chip is at the same height as the sidewall of the transmission line.

[0015] Furthermore, it also includes an upper substrate, an upper metal layer, and conductive holes; The upper substrate is located on top of at least one vertically arranged substrate. The first filter, the second filter, the amplifier or multi-functional chip, the antenna and the transmission line are all encapsulated in a closed cavity formed by at least one vertically arranged substrate and the upper substrate. The upper substrate is provided with a plurality of conductive holes. All inputs, outputs and lower layer wirings are introduced from the upper surface of the substrate to the upper surface of the upper substrate through the corresponding conductive holes.

[0016] On the other hand, an integrated manufacturing method for an anti-interference wireless data transmission component for complex electromagnetic environments is provided, comprising: The signal lines of the transmission line are fabricated using the same photomask, and the cross-sections of the signal lines of the corresponding first and second filters overlap. The signal lines of each transmission line that has been fabricated are located on the same substrate as the signal lines of the corresponding first and second filters. Connect the sidewall, upper ground, and lower ground of the transmission line to the sidewall, upper ground, and lower ground of the corresponding first and second filters, respectively. The components of the anti-interference wireless data transmission component are connected to each other via corresponding lower ground, side wall, and upper ground. When the transmission line is connected to an amplifier or multifunction chip, the signal line of the transmission line is connected to the signal pad of the amplifier or multifunction chip, and the sidewall of the transmission line is connected to the ground pad of the amplifier or multifunction chip.

[0017] The present invention has the following advantages due to the adoption of the above technical solutions: 1. The structure of the present invention can realize signal transmission in the horizontal or vertical direction. The multi-layer vertical stacking is conducive to the miniaturization of the structure and can intelligently adapt to harsh electromagnetic environments, fundamentally ensuring the anti-interference, high reliability and real-time transmission capabilities of critical data streams.

[0018] 2. The structure of the filter of the present invention can enclose the signal in a common ground plane composed of the upper ground, the lower ground and the side wall, which can resist interference. This structure does not require any dielectric material, and the loss is only composed of the metal loss of the signal line. Therefore, the loss is low. Moreover, the signal topology of this structure is simple and easy to manufacture. It can be manufactured in an integrated manner with the transmission line without the need for additional interconnection processes.

[0019] 3. This invention is particularly suitable for devices with extreme requirements for the anti-interference, real-time performance and reliability of wireless links, such as brain-computer interface systems, robot platforms and radar sensing systems.

[0020] In summary, this invention can be widely applied in the field of high-reliability wireless data communication technology. Attached Figure Description

[0021] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts. In the drawings: Figure 1 This is a schematic diagram of the overall structure of an anti-interference wireless data transmission component provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a module structure of an anti-interference wireless data transmission component provided in an embodiment of the present invention; Figure 3 This is provided by an embodiment of the present invention. Figure 1 A top-down view; Figure 4 This is provided by an embodiment of the present invention. Figure 1 A side view diagram; Figure 5 This is an overall schematic diagram of a filter provided in an embodiment of the present invention; Figure 6 This is an internal schematic diagram of a filter provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of another module of the anti-interference wireless data transmission component provided in an embodiment of the present invention; Figure 8 This is a three-dimensional schematic diagram of the connection between a filter and a transmission line according to an embodiment of the present invention; Figure 9This is a schematic diagram of the connection plane between a filter and a transmission line according to an embodiment of the present invention; Figure 10 This is a connection diagram of an amplifier or multi-functional chip provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure of an anti-interference wireless data transmission component provided in an embodiment of the present invention, including an upper substrate, an upper metal layer, and conductive holes.

[0022] The labels in the attached diagram are as follows: 1-Substrate; 2-First filter; 3-Second filter; 4-Amplifier or multi-function chip; 5-Antenna; 6-Transmission line; 7-Mixer; 8-Upper substrate; 9-Upper metal layer; 10-Conductive via; 21-Ground connection; 22-Side wall; 23-Ground connection; 24-Signal line; 25-Input signal line; 26-Output signal line; 27-Impedance adjustment unit; 271-Short-circuit stub; 272-Impedance matching line; 273-Open-circuit stub; 274-Grounding post. Detailed Implementation

[0023] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the invention and to fully convey the scope of the invention to those skilled in the art.

[0024] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0025] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0026] The shortcomings of existing general-purpose wireless transmission methods in terms of anti-interference, real-time reliability, and integrated energy efficiency have become the core bottleneck restricting the reliable deployment and widespread application of cutting-edge systems such as brain-computer interfaces, robots, and radar in real and complex environments. They cannot intelligently adapt to harsh electromagnetic environments and fundamentally guarantee the anti-interference, high reliability, and real-time transmission capabilities of critical data streams. This invention provides an anti-interference wireless data transmission component for complex electromagnetic environments, comprising at least one substrate, a first filter, a second filter, an amplifier or multi-functional chip, an antenna, and several transmission lines. At least one substrate is vertically arranged, and each substrate is provided with at least one first filter, a second filter, an amplifier or multi-functional chip, an antenna, and several transmission lines. Each first filter, second filter, and transmission line includes a lower ground plane, a sidewall, an upper ground plane, and a signal line. The signal line includes an input signal line, an output signal line, and at least one impedance adjustment unit. Each impedance adjustment unit includes two short-circuit stubs, a grounding post, an impedance matching line, and an open-circuit stub. The bottom of the lower ground plane is fixedly connected to the corresponding substrate, and the top of the lower ground plane is fixedly connected to the corresponding upper ground plane via the corresponding sidewall. The corresponding signal line is arranged within the space formed by the lower ground plane, the sidewall, and the upper ground plane. At least two short-circuit stubs of each impedance adjustment unit are symmetrically arranged at intervals, with the short-circuit stub located on the outer side... One side of the short-circuited stub is connected to the corresponding input or output signal line. The other side of the short-circuited stub on the outer side is connected to one end of a corresponding impedance matching line. The short-circuited stub on the inner side is a shared short-circuited stub for two adjacent impedance control units. Both sides of this short-circuited stub are connected to one end of the corresponding impedance matching line of each of the two impedance control units. The other end of each impedance matching line is connected to a corresponding open-circuited stub. The two open-circuited stubs of each impedance control unit are parallel but do not touch. One end of each short-circuited stub is connected to a corresponding grounding post. The first filter is used to filter the analog baseband signal and transmit it to the corresponding amplifier or multi-function chip via the corresponding transmission line. The amplifier or multi-function chip is used to amplify the filtered analog baseband signal and transmit it to the corresponding second filter via the corresponding transmission line. The second filter is used to perform secondary filtering on the amplified analog baseband signal and transmit it to the corresponding antenna via the corresponding transmission line. The antenna is used to transmit the secondary filtered analog baseband signal to the corresponding external receiving device. This invention can solve the problems of poor anti-interference capability, low integration, and high power consumption in wireless data transmission systems of brain-computer interfaces and robot radar systems under complex and dynamic electromagnetic environments.

[0027] Example 1 like Figures 1 to 4 As shown, this embodiment provides an anti-interference wireless data transmission component for complex electromagnetic environments, including at least one substrate 1, a first filter 2, a second filter 3, an amplifier or multi-functional chip 4, an antenna 5, and several transmission lines 6.

[0028] At least one substrate 1 is vertically arranged. Each substrate 1 is provided with at least one first filter 2, a second filter 3, an amplifier or multi-function chip 4, an antenna 5, and several transmission lines 6. The first filter 2 is used to filter the analog baseband signal after EEG feature extraction, compression encoding, and digital-to-analog conversion, and transmits it to the corresponding amplifier or multi-function chip 4 through the corresponding transmission line 6. The amplifier or multi-function chip 4 is used to amplify the filtered analog baseband signal and transmit it to the corresponding second filter 3 through the corresponding transmission line 6. The second filter 3 is used to perform secondary filtering on the amplified analog baseband signal and transmit it to the corresponding antenna 5 through the corresponding transmission line 6. The antenna 5 is used to transmit the secondary filtered analog baseband signal to the corresponding external receiving device.

[0029] Among them, such as Figure 5 and Figure 6 As shown, each of the first filter 2, the second filter 3, and the transmission line 6 includes a lower ground 21, a side wall 22, an upper ground 23, and a signal line 24. The signal line 24 includes an input signal line 25, an output signal line 26, and at least one impedance adjustment unit 27. Each impedance adjustment unit 27 includes two short-circuit stubs 271, an impedance matching line 272, an open-circuit stub 273, and a grounding post 274. It should be noted that two adjacent impedance adjustment units 27 share one of the short-circuit stubs 271. The input signal line 25, the output signal line 26, and the impedance matching line 272 are located on the same straight line, and the short-circuit stub 271 and the open-circuit stub 273 are perpendicular to this straight line.

[0030] The bottom of the lower ground surface 21 is fixedly connected to the corresponding substrate 1, and the top of the lower ground surface 21 is fixedly connected to the corresponding upper ground surface 23 through the corresponding side wall 22. The corresponding signal line 24 is arranged in the space formed by the lower ground surface 21, the side wall 22 and the upper ground surface 23. At least two short-circuit stubs 271 of each impedance adjustment unit 27 are symmetrically arranged at intervals. One side of the short-circuit stub 271 located on the outer side is connected to the corresponding input signal line 25 or output signal line 26, and the other side of the short-circuit stub 271 located on the outer side is connected to one end of a corresponding impedance matching line 272. The short-circuit stub 271 located on the inner side is a short-circuit stub 271 shared by two adjacent impedance adjustment units 27. The two sides of the short-circuit stub 271 are respectively connected to one end of the corresponding impedance matching line 272 of the two impedance adjustment units 27. The other end of each impedance matching line 272 is connected to a corresponding open-circuit stub 273. The two open-circuit stubs 273 of each impedance adjustment unit 27 are parallel but do not contact each other. Each short-circuit stub 271 has one end connected to a corresponding grounding post 274. The input signal line 25 is used to acquire the input radio frequency signal; the short-circuit stub 271 is used to introduce inductive reactance to achieve resonance or impedance modulation at a specific frequency; the grounding post 274 is used to reliably connect the short-circuit stub 271 to the ground plane to ensure that its terminal presents ideal short-circuit boundary conditions and to suppress parasitic radiation and high-order mode interference; the impedance matching line 272 is used to adjust the impedance relationship between the source end (connected to the input signal line 25) and the load (connected to the output signal line 26) to maximize signal transmission efficiency and reduce return loss; the open-circuit stub 273 is used to introduce capacitive reactance to form parallel resonance or provide the required phase response at a specific frequency; the output signal line 26 is used to output the filtered radio frequency signal.

[0031] In a preferred embodiment, such as Figure 7 As shown, the anti-interference wireless data transmission component for complex electromagnetic environments may further include a mixer 7 and / or an equalizer 8. The mixer 7 is positioned between the first filter 2 and the amplifier or multifunction chip 4. The mixer 7 is used to down-convert the received radio frequency signal to an intermediate frequency or baseband frequency for easier subsequent digital processing; it also supports frequency shifting to avoid strong interference bands, improving the system's adaptive anti-interference capability in spectrum congestion environments. The equalizer 8 is connected to the amplifier or multifunction chip 4. The equalizer 8 is used to compensate for channel distortion, dynamically adjust the frequency response through an adaptive filtering algorithm, restore the original signal waveform, and significantly improve the bit error rate performance and communication reliability in dynamic, multipath, or high-noise electromagnetic environments.

[0032] In a preferred embodiment, the first filter 2, the second filter 3, the antenna 5, and the transmission line 6 are all pure metal structures, formed by an integrated processing technology, without the need for additional interconnection processes.

[0033] In a preferred embodiment, such as Figure 8 , Figure 9 As shown, the transmission line 6 is directly connected to the signal line 24 of the first filter 2 or the second filter 3, and can be manufactured into a single signal line 24 through integrated processing without the need for additional interconnection processes.

[0034] In a preferred embodiment, the upper ground plane 23, lower ground plane 21, and sidewall 22 of each first filter 2, second filter 3, and transmission line 6 are all metal and are equipotentially connected.

[0035] In a preferred embodiment, the total length of the two grounding posts 274 and the corresponding short-circuit stubs 271 of the impedance adjustment unit 27 of each first filter 2, second filter 3, and transmission line 6 is the same. When the first filter 2, second filter 3, and transmission line 6 include only one impedance adjustment unit 27, the lengths of the two short-circuit stubs 271 are the same; when the first filter 2, second filter 3, and transmission line 6 include more than one impedance adjustment unit 27, the lengths of the two short-circuit stubs 271 in each impedance adjustment unit 27 may be the same or different, but the impedance adjustment units 27 are arranged symmetrically about the axis.

[0036] In a preferred embodiment, such as Figure 10 As shown, the multifunctional chip is a multifunctional integrated chip including an amplifier. The multifunctional chip is flip-chip interconnected with the corresponding transmission line 6 via solder balls, and a current-limiting layer is distributed between the solder balls and the transmission line 6. Solder and valve-compatible material are distributed on the back side of the multifunctional chip to connect the back side of the multifunctional chip to the sidewall 22 of the transmission line 6 and connect to the common ground plane. Auxiliary layers are distributed on the sidewall 22 of the transmission line 6 to ensure that the top layer of the back side of the multifunctional chip is at the same height as the sidewall 22 of the transmission line 6 after the multifunctional chip is soldered.

[0037] In a preferred embodiment, the substrate 1 may be made of a bottom support material such as glass, silicon, gallium arsenide, gallium nitride, alumina ceramic, low temperature co-fired ceramic (LTCC), polyimide (PI), or liquid crystal polymer (LCP).

[0038] In a preferred embodiment, the interference-resistant wireless data transmission component is formed on a substrate, the substrate material of which may be glass, silicon, gallium arsenide, gallium nitride, alumina ceramic, low-temperature co-fired ceramic (LTCC), polyimide (PI), or liquid crystal polymer (LCP).

[0039] In a preferred embodiment, such as Figure 11 As shown, the anti-interference wireless data transmission component may also include an upper substrate 8, an upper metal layer 9, and conductive holes 10.

[0040] The upper substrate 8 is located on top of at least one vertically arranged substrate 1. Components such as the first filter 2, the second filter 3, the amplifier or multi-functional chip 4, the antenna 5, and the transmission line 6 are all encapsulated within a closed cavity formed by the at least one vertically arranged substrate 1 and the upper substrate 8, achieving modularity. An upper metal layer 9 is provided on the top of the upper substrate 8, and several conductive holes 10 are provided on the upper substrate 8. All input / output and lower-layer wiring are introduced from the upper surface of the substrate 1 through the corresponding conductive holes 10 to the upper metal layer 9.

[0041] Example 2 This embodiment provides an integrated manufacturing method for an anti-interference wireless data transmission component for complex electromagnetic environments, comprising the following steps: 1) The signal line 24 of transmission line 6 and the signal line 24 of the corresponding first filter 2 and second filter 3 are made using the same mask.

[0042] 2) Place the signal lines 24 of each transmission line 6 and the corresponding signal lines 24 of the first filter 2 and the second filter 3 on the same substrate 1. The cross-sectional dimensions of the signal lines 24 of the transmission line 6 can be the same as or different from the cross-sectional dimensions of the signal lines 24 of the first filter 2 and the second filter 3, but they are placed horizontally and vertically centered.

[0043] 3) Connect the side wall 22, upper ground 23 and lower ground 21 of the transmission line 6 to the side wall 22, upper ground 23 and lower ground 21 of the corresponding first filter 2 and second filter 3, respectively.

[0044] 4) The first filter 2 or the second filter 3 is connected to the mixer 7, the transmission line 6 and the antenna 5 in pairs through the corresponding lower ground 21, side wall 22 and upper ground 23. (The mixer 7, the filter and the antenna 5 all have the structure of lower ground 21, side wall 22 and upper ground 23).

[0045] 5) The inputs and outputs of the amplifier or multifunction chip 4 include signal pads and ground pads (the pads are part of the chip surface, and their positions are connected by solder balls). When transmission line 6 is connected to the amplifier or multifunction chip 4, or mixer 7 is connected to the amplifier or multifunction chip 4, the signal lines of transmission line 6 or mixer 7 are connected to the signal pads of the amplifier or multifunction chip 4, and the sidewalls of transmission line 6 or mixer 7 are connected to the ground pads of the amplifier or multifunction chip 4. The connection method is as follows: Figure 10 As shown.

[0046] 6) Vertically connect at least one substrate 1, and set an upper substrate 8 on top of the uppermost substrate 1, and set an upper metal layer 9 on top of the upper substrate 8.

[0047] The above embodiments are only used to illustrate the present invention. The structure, connection method and manufacturing process of each component can be varied. All equivalent transformations and improvements made on the basis of the technical solution of the present invention should not be excluded from the protection scope of the present invention.

Claims

1. An anti-interference wireless data transmission component for complex electromagnetic environments, characterized in that, It includes at least one substrate, a first filter, a second filter, an amplifier or a multi-functional chip and an antenna, as well as several transmission lines; At least one of the substrates is vertically arranged, and each substrate is provided with at least one first filter, a second filter, an amplifier or a multi-functional chip and an antenna, as well as a plurality of transmission lines. Each of the first filter, the second filter and the transmission line includes a bottom ground, a side wall, an upper ground and a signal line. The signal line includes an input signal line, an output signal line and at least one impedance adjustment unit. Each impedance adjustment unit includes two short-circuit stubs, a grounding post, an impedance matching line and an open-circuit stub. The bottom of the lower ground plane is fixedly connected to the corresponding substrate, and the top of the lower ground plane is fixedly connected to the corresponding upper ground plane through the corresponding side wall. The corresponding signal line is arranged in the space formed by the lower ground plane, the side wall, and the upper ground plane. At least two short-circuit stubs of each impedance adjustment unit are symmetrically arranged at intervals. One side of the short-circuit stub located on the outer side is connected to the corresponding input signal line or output signal line, and the other side of the short-circuit stub located on the outer side is connected to one end of the corresponding impedance matching line. The short-circuit stub located on the inner side is a short-circuit stub shared by two adjacent impedance adjustment units. The two sides of the short-circuit stub are respectively connected to one end of the corresponding impedance matching line of the two impedance adjustment units. The other end of each impedance matching line is connected to a corresponding open-circuit stub. The two open-circuit stubs of each impedance adjustment unit are parallel but do not contact each other. One end of each short-circuit stub is connected to the corresponding grounding post. The first filter is used to filter the analog baseband signal and transmit it to the corresponding amplifier or multifunction chip through the corresponding transmission line; the amplifier or multifunction chip is used to amplify the filtered analog baseband signal and transmit it to the corresponding second filter through the corresponding transmission line; the second filter is used to perform secondary filtering on the amplified analog baseband signal and transmit it to the corresponding antenna through the corresponding transmission line; the antenna is used to transmit the secondary filtered analog baseband signal to the corresponding external receiving device.

2. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, The two adjacent impedance control units share one of the short-circuit stubs, and the input signal line, output signal line, and impedance matching line are located on the same straight line. The short-circuit stub and the open-circuit stub are perpendicular to the straight line.

3. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, It also includes a mixer, an equalizer, and / or a power divider, wherein the mixer is disposed between the first filter and the amplifier or multifunction chip; and the equalizer is connected to the amplifier or multifunction chip.

4. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, The first filter, the second filter, the antenna, and the transmission line are all pure metal structures, formed through an integrated processing technology.

5. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, The transmission line is directly connected to the signal line of the first filter or the second filter, and is manufactured as a single signal line through integrated processing, without the need for additional interconnection processes.

6. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, Each of the first filter, the second filter, and the transmission line has a metal upper ground, a metal lower ground, and a sidewall that are equipotentially connected.

7. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, The total length of the two grounding posts and the corresponding short-circuit stubs of each impedance adjustment unit of the first filter, the second filter, and the transmission line is the same; when the first filter, the second filter, and the transmission line include only one impedance adjustment unit, the lengths of the two short-circuit stubs are the same; when the first filter, the second filter, and the transmission line include more than one impedance adjustment unit, the impedance adjustment units are arranged symmetrically about the axis.

8. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, The multifunctional chip is a multifunctional integrated chip including an amplifier. The multifunctional chip is flip-chip interconnected with the corresponding transmission line through solder balls. A current limiting layer is distributed between the solder balls and the transmission line. Solder and valveable material are distributed on the back of the multifunctional chip to connect the back of the multifunctional chip to the sidewall of the transmission line and connect to a common ground plane. The top layer of the back of the multifunctional chip is at the same height as the sidewall of the transmission line.

9. The anti-interference wireless data transmission component for complex electromagnetic environments as described in claim 1, characterized in that, It also includes an upper substrate, an upper metal layer, and conductive vias; The upper substrate is located on top of at least one vertically arranged substrate. The first filter, the second filter, the amplifier or multi-functional chip, the antenna and the transmission line are all encapsulated in a closed cavity formed by at least one vertically arranged substrate and the upper substrate. The upper substrate is provided with a plurality of conductive holes. All inputs, outputs and lower layer wirings are introduced from the upper surface of the substrate to the upper surface of the upper substrate through the corresponding conductive holes.

10. An integrated manufacturing method for an anti-interference wireless data transmission component for complex electromagnetic environments according to any one of claims 1 to 9, characterized in that, include: The signal lines of the transmission line are fabricated using the same photomask, and the cross-sections of the signal lines of the corresponding first and second filters overlap. The signal lines of each transmission line that has been fabricated are located on the same substrate as the signal lines of the corresponding first and second filters. Connect the sidewall, upper ground, and lower ground of the transmission line to the sidewall, upper ground, and lower ground of the corresponding first and second filters, respectively. The components of the anti-interference wireless data transmission component are connected to each other via corresponding lower ground, side wall, and upper ground. When the transmission line is connected to an amplifier or multifunction chip, the signal line of the transmission line is connected to the signal pad of the amplifier or multifunction chip, and the sidewall of the transmission line is connected to the ground pad of the amplifier or multifunction chip.

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