Light emitting diode and packaging method thereof

Abstract

This invention belongs to the field of LED packaging technology and discloses a light-emitting diode and its packaging method. The light-emitting diode includes a packaging bracket, a first pad, and a second pad. The packaging bracket has through-holes extending to its top and bottom surfaces. A first connecting post and a second connecting post are disposed on the bottom surface of the packaging bracket. The first pad has a first connecting hole and is disposed on the bottom surface of the packaging bracket. The first connecting post passes through the first connecting hole and is fixedly connected to it. The second pad has a second connecting hole and is disposed on the bottom surface of the packaging bracket. The second connecting post passes through the second connecting hole and is fixedly connected to it. This light-emitting diode increases the connection strength between the pads and the packaging bracket, preventing the pads from detaching when the light-emitting diode is subjected to mechanical stress or vibration. It greatly enhances the shear resistance between the pads and the packaging bracket, improving the mechanical stability and long-term reliability of the device.

Description

Technical Field

[0001] This invention relates to the field of LED packaging technology, and in particular to a light-emitting diode and its packaging method. Background Technology

[0002] LEDs (Light Emitting Diodes) are characterized by long lifespan, zero pollution, and low power consumption. As a green and environmentally friendly lighting fixture, they are gradually being promoted and widely recognized. The main supporting structure of an LED is a packaged bracket, with the light-emitting chip housed inside the packaged bracket. The positive and negative electrodes are located on the bottom surface of the packaged bracket and electrically connected to the light-emitting chip.

[0003] To improve the heat dissipation performance of LEDs, most existing technologies use surface-mount electrodes to increase the contact area between the positive and negative electrodes and the light-emitting chip. However, surface-mount electrodes lack an internal bending structure, resulting in poor bonding strength between the surface-mount electrodes and the package substrate. When the LED is subjected to mechanical stress or vibration, interface peeling or cracking can easily occur at the contact surface between the surface-mount electrodes and the package substrate, thereby affecting the mechanical stability and long-term reliability of the device. Summary of the Invention

[0004] The purpose of this invention is to provide a light-emitting diode and its packaging method, which increases the connection strength between the pads and the package support, avoids the pads from falling off when the light-emitting diode is subjected to mechanical stress or vibration, greatly enhances the shear resistance between the pads and the package support, and improves the mechanical stability and long-term reliability of the device.

[0005] To achieve this objective, the present invention adopts the following technical solution: A light-emitting diode, comprising: The packaging bracket has through holes extending to the top and bottom surfaces, and the bottom surface of the packaging bracket is provided with a first connecting post and a second connecting post. The first pad has a first connection hole. The first pad is disposed on the bottom surface of the package bracket and partially blocks the through hole. The first connecting post passes through the first connection hole and is fixedly connected to the first connection hole. The second pad has a second connection hole. The second pad is located on the bottom surface of the package bracket and partially blocks the through hole. The second connecting post passes through the second connection hole and is fixedly connected to the second connection hole.

[0006] Preferably, the top dimension of the first connecting hole is smaller than the bottom dimension of the first connecting hole, and the top dimension of the second connecting hole is smaller than the bottom dimension of the second connecting hole.

[0007] Preferably, the top dimension of the first connecting hole is 10% to 15% smaller than the bottom dimension of the first connecting hole, and the top dimension of the second connecting hole is 10% to 15% smaller than the bottom dimension of the second connecting hole.

[0008] Preferably, the first pad includes a first connecting portion and a first fixing portion, the first connecting portion is disposed on the side of the first fixing portion opposite to the second pad, and a first waterproof wall is protruding from the outer periphery of the first connecting portion; The second pad includes a second connecting portion and a second fixing portion. The second connecting portion is disposed on the side of the second fixing portion opposite to the first pad, and a second waterproof wall is protruding from the outer periphery of the second connecting portion.

[0009] Preferably, the angle between the first waterproof wall and the first connecting part is 90°~140°; the angle between the second waterproof wall and the second connecting part is 90°~140°.

[0010] Preferably, the first pad has multiple first grooves on the side facing the package holder, and the package holder fills the multiple first grooves; the second pad has multiple second grooves on the side facing the package holder, and the package holder fills the multiple second grooves.

[0011] Preferably, the packaging bracket further includes an insulating barrier disposed between the first pad and the second pad, wherein the first pad, the insulating barrier, and the second pad close the bottom end of the through hole to form a light-emitting cavity within the through hole.

[0012] Preferably, the opening angle α of the light-emitting cavity is 30°~50°; and / or, The opening width of the light-emitting cavity is L, and the depth of the light-emitting cavity is D, where D / L≤0.6.

[0013] Preferably, the contact area between the first pad and the package bracket is S1, the contact area between the second pad and the package bracket is S2, the bottom area of ​​the light-emitting cavity is S3, and S1+S2≥2.5S3.

[0014] A method for packaging a light-emitting diode (LED), used to fabricate the LED, comprising: S01: Obtain the first pad and the second pad, and set the first pad and the second pad at a distance; S02: Injection molding is performed on the first pad and the second pad to form a package bracket; S03: Place the light-emitting chip in the through hole and connect the light-emitting chip to the first pad and the second pad; S04: Fill the through hole with encapsulating adhesive.

[0015] Preferably, step S02 includes: The first connecting hole and the second connecting hole are injection molded under a first pressure. The injection molding of the other parts of the packaging bracket is completed using a second pressure; The first pressure is less than the second pressure.

[0016] Preferably, the first pressure is 60 MPa to 70 MPa; and / or, the second pressure is 100 MPa to 110 MPa.

[0017] Preferably, in step S02, the injection molding temperature of the first connecting hole and the second connecting hole is 90℃~100℃, and the injection molding temperature of other parts of the packaging bracket is 80℃~90℃.

[0018] Preferably, step S01 further includes: A first trench is etched on the first pad using a pulsed laser, and a second trench is etched on the second pad using a pulsed laser.

[0019] The beneficial effects of this invention are: This invention provides a light-emitting diode and its packaging method. In this light-emitting diode, the bottom of the package holder has a first connecting post and a second connecting post. The first connecting post passes through and is fixedly connected to a first connecting hole, and the second connecting post passes through and is fixedly connected to a second connecting hole. This improves the reliability of the connection between the first pad and the package holder, and also improves the reliability of the connection between the second pad and the package. Furthermore, using the connecting post and connecting hole for connection also improves the resistance to lateral impacts.

[0020] This LED increases the connection strength between the pads and the package support, preventing the pads from detaching when the LED is subjected to mechanical stress or vibration. It greatly enhances the shear resistance between the pads and the package support, improving the mechanical stability and long-term reliability of the device. Attached Figure Description

[0021] Figure 1 This is a top view of the light-emitting diode provided in an embodiment of the present invention; Figure 2 This is a first side view of a light-emitting diode provided in an embodiment of the present invention; Figure 3 This is a second side view of a light-emitting diode provided in an embodiment of the present invention; Figure 4 This is a top view of the first and second pads provided in an embodiment of the present invention.

[0022] In the picture: 1. Encapsulation bracket; 11. First connecting post; 12. Second connecting post; 13. Light-emitting cavity; 14. Insulating barrier; 2. First solder pad; 21. First connecting hole; 22. First connecting part; 23. First fixing part; 24. First waterproof wall; 25. First groove; 3. Second solder pad; 31. Second connecting hole; 32. Second connecting part; 33. Second fixing part; 34. Second waterproof wall; 35. Second groove; 4. Light-emitting chip; 5. Connecting wires. Detailed Implementation

[0023] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0024] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0027] Example 1 LEDs (Light Emitting Diodes) are characterized by long lifespan, zero pollution, and low power consumption, and as a green and environmentally friendly lighting fixture, they are gradually being promoted and widely recognized. Figure 1 As shown, this embodiment provides a light-emitting diode (LED), which includes a light-emitting chip 4, a package bracket 1, a first pad 2, and a second pad 3. The package bracket 1 has through holes extending to the top and bottom surfaces. The first pad 2 is disposed on the bottom surface of the package bracket 1 and partially blocks the through holes. The second pad 3 is disposed on the bottom surface of the package bracket 1 and partially blocks the through holes. The light-emitting chip 4 is disposed in the through holes. Both the first pad 2 and the second pad 3 are connected to the light-emitting chip 4 to supply power to the light-emitting chip 4.

[0028] For ease of description, in this embodiment, the first pad 2 and the second pad 3 are located below the package bracket 1 as an example, that is, the light-emitting diode illuminates upwards after being lit.

[0029] It is worth noting that the top surfaces of the first pad 2 and the second pad 3 are used as pads to be electrically connected to the light-emitting chip 4, and the bottom surfaces of the first pad 2 and the second pad 3 are used as pins to be attached and connected to the external circuit so that the external circuit can supply power to the light-emitting chip 4.

[0030] like Figure 1 and Figure 2 As shown, to prevent short circuits caused by contact between the first pad 2 and the second pad 3, the package holder 1 also includes an insulating barrier 14. The insulating barrier 14 is disposed between the first pad 2 and the second pad 3. The first pad 2, the insulating barrier 14, and the second pad 3 seal the bottom end of the through hole to form a light-emitting cavity 13 within the through hole. The insulating barrier 14 can both ensure the stability of the first pad 2 and the second pad 3, preventing them from contacting and short-circuiting, and can also seal the bottom end of the through hole together with the first pad 2 and the second pad 3, thereby ensuring the airtightness of the light-emitting cavity 13 and increasing the hermeticity and reliability after packaging.

[0031] In this embodiment, the area of ​​the first pad 2 is larger than the area of ​​the second pad 3. The light-emitting chip 4 is attached to the first pad 2, and the light-emitting chip 4 is electrically connected to the second pad 3 via a connecting wire 5. Specifically, the light-emitting chip 4 is bonded and fixed to the first pad 2 with conductive adhesive. The conductive adhesive can both fix the light-emitting chip 4 and provide circuit conductivity, simplifying the structure.

[0032] However, the lack of an inner bending structure between the first pad 2 and the second pad 3 results in poor bonding strength between the first pad 2 and the package support 1, as well as between the second pad 3 and the package support 1. Consequently, the light-emitting diode is prone to interface peeling or cracking when subjected to mechanical stress or vibration, which in turn affects the mechanical stability and long-term reliability of the device.

[0033] like Figures 2-4As shown, to solve the above problems, in the light-emitting diode provided in this embodiment, the bottom surface of the package bracket 1 is provided with a first connecting post 11 and a second connecting post 12. The first pad 2 has a first connecting hole 21, the first connecting post 11 passes through the first connecting hole 21 and is fixedly connected to the first connecting hole 21. The second pad 3 has a second connecting hole 31, the second connecting post 12 passes through the second connecting hole 31 and is fixedly connected to the second connecting hole 31. This improves the reliability of the connection between the first pad 2 and the package bracket 1, improves the reliability of the connection between the second pad 3 and the package, and the connection by using the connecting post and the connecting hole can also improve the resistance to lateral impact.

[0034] This LED increases the connection strength between the pad and the package bracket 1, preventing the pad from falling off when the LED is subjected to mechanical stress or vibration. It greatly enhances the shear resistance between the pad and the package bracket 1, improving the mechanical stability and long-term reliability of the device.

[0035] The encapsulation bracket 1 is formed by injection molding the encapsulation material onto the first pad 2 and the second pad 3 using an injection molding process. Since the LED is not typically disassembled or repaired, to further improve the stability of the connection between the first pad 2, the second pad 3, and the encapsulation material, a clamping structure is provided on the inner wall of both the first connecting hole 21 and the inner wall of the second connecting hole 31. When the encapsulation bracket 1 is injection molded, a first connecting post 11 is formed within the first connecting hole 21. The surface of the first connecting post 11 is adapted to the clamping structure of the first connecting hole 21 to improve the connection strength. Similarly, when the encapsulation bracket 1 is injection molded, a second connecting post 12 is formed within the second connecting hole 31. The surface of the second connecting post 12 is adapted to the clamping structure of the second connecting hole 31 to improve the connection strength. Specifically, the inner wall of the first connecting hole 21 is provided with a gripping groove or a gripping protrusion, and the inner wall of the second connecting hole 31 is provided with a gripping groove or a gripping protrusion. The gripping groove or gripping protrusion is a gripping structure.

[0036] In this embodiment, the top dimension of the first connecting hole 21 is smaller than the bottom dimension of the first connecting hole 21, and the top dimension of the second connecting hole 31 is smaller than the bottom dimension of the second connecting hole 31. During the injection molding process, the first connecting post 11 adapts to the inner wall of the first connecting hole 21 to form a structure that is smaller at the top and larger at the bottom, thereby achieving the snap-fit ​​between the first connecting post 11 and the first connecting hole 21. Similarly, the second connecting post 12 adapts to the inner wall of the second connecting hole 31 to form a structure that is smaller at the top and larger at the bottom, thereby achieving the snap-fit ​​between the second connecting post 12 and the second connecting hole 31. This ensures the stability and reliability of the connection between the first pad 2 and the package bracket 1, and also ensures the stability and reliability of the connection between the second pad 3 and the package bracket 1. It is worth noting that the inclined inner walls of the first connecting hole 21 and the second connecting hole 31 at this time constitute the clamping structure.

[0037] Preferably, the top dimension of the first connecting hole 21 is 10% to 15% smaller than the bottom dimension of the first connecting hole 21. This difference in size should not be too large or too small. If the top dimension of the first connecting hole 21 is too small, the strength of the first connecting post 11 itself will be insufficient, and it will easily break. If the top dimension of the first connecting hole 21 is too large, the inclination of the inner wall of the first connecting hole 21 will be small, resulting in a reduction in the locking force between the first connecting post 11 and the first connecting hole 21, and the first connecting post 11 will easily detach from the first connecting hole 21. In both of these cases, the first connecting post 11 will fail to provide reinforcement for the connection between the package bracket 1 and the first pad 2.

[0038] Specifically, the top dimension of the first connecting hole 21 can be 10%, 11%, 12%, 13%, 14% or 15% smaller than the bottom dimension of the first connecting hole 21.

[0039] Similarly, the top dimension of the second connecting hole 31 should be 10% to 15% smaller than the bottom dimension of the second connecting hole 31. This difference in size should not be too large or too small. If the top dimension of the second connecting hole 31 is too small, the strength of the second connecting post 12 itself will be insufficient, and it will easily break. If the top dimension of the second connecting hole 31 is too large, the inclination of the inner wall of the second connecting hole 31 will be too small, resulting in a reduction in the locking force between the second connecting post 12 and the second connecting hole 31, and the second connecting post 12 will easily detach from the second connecting hole 31. In both of these cases, the second connecting post 12 will fail to provide reinforcement for the connection between the package bracket 1 and the second pad 3.

[0040] Specifically, the top dimension of the second connecting hole 31 can be 10%, 11%, 12%, 13%, 14% or 15% smaller than the bottom dimension of the second connecting hole 31.

[0041] To further improve the connection strength, the first pad 2 is provided with multiple first connection holes 21, and the second pad 3 is provided with multiple second connection holes 31. The more first connection holes 21 and second connection holes 31 there are, the better, as long as the first pad 2 and the second pad 3 themselves have sufficient strength.

[0042] Because the size of the light-emitting diode is small, the diameters of the first connection hole 21 and the second connection hole 31 are also not large. Generally speaking, taking the 2835 model light-emitting diode as an example, the diameters of the first connection hole 21 and the second connection hole 31 are 0.2mm~0.5mm, specifically 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm.

[0043] like Figure 4As shown, the first pad 2 has multiple first grooves 25 on the side facing the package holder 1, and the package holder 1 fills the multiple first grooves 25; the second pad 3 has multiple second grooves 35 on the side facing the package holder 1, and the package holder 1 fills the multiple second grooves 35. During injection molding of the package holder 1, the encapsulation material also fills the first grooves 25 and the second grooves 35. The first grooves 25 and the second grooves 35 can generate a certain lateral constraint force on the package holder 1, further improving the stability of the light-emitting diode.

[0044] Specifically, the distance between the multiple first grooves 25 is 80μm to 150μm, specifically 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm, 120μm, 125μm, 130μm, 135μm, 140μm, 145μm or 150μm; the depth of the first grooves 25 is 20μm to 50μm, specifically 20μm, 25μm, 30μm, 35μm, 40μm, 45μm or 50μm.

[0045] Similarly, the distance between the multiple second grooves 35 is 80μm~150μm, specifically 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm, 120μm, 125μm, 130μm, 135μm, 140μm, 145μm or 150μm; the depth of the second grooves 35 is 20μm~50μm, specifically 20μm, 25μm, 30μm, 35μm, 40μm, 45μm or 50μm.

[0046] like Figure 4 As shown, the first pad 2 includes a first connecting portion 22 and a first fixing portion 23. The first connecting portion 22 is disposed on the side of the first fixing portion 23 facing away from the second pad 3, and a first waterproof wall 24 protrudes from the outer periphery of the first connecting portion 22. The first connecting portion 22 is used to connect the light-emitting chip 4, and the first fixing portion 23 is used to fix it to the package holder 1; therefore, the first connecting hole 21 is formed on the first fixing portion 23. The first waterproof wall 24 can both increase the complexity of the interface between the first pad 2 and the package holder 1 to improve the connection strength and stability, and block and extend the moisture penetration path, increasing the airtightness and reliability of the light-emitting diode after packaging.

[0047] Similarly, the second pad 3 includes a second connecting portion 32 and a second fixing portion 33. The second connecting portion 32 is disposed on the side of the second fixing portion 33 opposite to the first pad 2, and a second waterproof wall 34 protrudes from the outer periphery of the second connecting portion 32. The second connecting portion 32 is used to connect the light-emitting chip 4, and the second fixing portion 33 is used to fix it to the package holder 1; therefore, the second connecting hole 31 is formed on the second fixing portion 33. The second waterproof wall 34 can both increase the complexity of the interface between the second pad 3 and the package holder 1 to improve the connection strength and stability, and block and extend the moisture penetration path, increasing the airtightness and reliability of the packaged light-emitting diode.

[0048] In this embodiment, the height of the first waterproof wall 24 is 0.05mm~0.2mm, and the width of the first waterproof wall 24 is 0.05mm~0.15mm. Specifically, the height of the first waterproof wall 24 can be 0.05mm, 0.1mm, 0.15mm or 0.2mm, and the width of the first waterproof wall 24 can be 0.05mm, 0.1mm or 0.15mm.

[0049] Similarly, the height of the second waterproof wall 34 is 0.05mm~0.2mm, and the width of the second waterproof wall 34 is 0.05mm~0.15mm. Specifically, the height of the second waterproof wall 34 can be 0.05mm, 0.1mm, 0.15mm or 0.2mm, and the width of the second waterproof wall 34 can be 0.05mm, 0.1mm or 0.15mm.

[0050] In this embodiment, the included angle between the first waterproof wall 24 and the first connecting portion 22 is 90°~140°. This angle should not be too large or too small. If it is too large, the height of the first waterproof wall 24 will be insufficient, which will not only fail to increase the complexity of the interface between the first pad 2 and the package bracket 1 to improve the connection strength and stability, but also fail to block and extend the moisture penetration path. Specifically, the included angle between the first waterproof wall 24 and the first connecting portion 22 can be 90°, 95°, 100°, 105°, 110°, 115°, 120°, 125°, 130°, 135° or 140°.

[0051] Similarly, the included angle between the second waterproof wall 34 and the second connecting part 32 is 90°~140°. This angle should not be too large or too small. If it is too large, the height of the second waterproof wall 34 will be insufficient, which will not only fail to increase the complexity of the interface between the second pad 3 and the package bracket 1 to improve the connection strength and stability, but also fail to block and extend the moisture penetration path. Specifically, the included angle between the second waterproof wall 34 and the second connecting part 32 can be 90°, 95°, 100°, 105°, 110°, 115°, 120°, 125°, 130°, 135° or 140°.

[0052] To further enhance the connection strength between the first pad 2, the second pad 3, and the package holder 1, the contact area between the first pad 2 and the package holder 1 is S1, the contact area between the second pad 3 and the package holder 1 is S2, and the bottom area of ​​the light-emitting cavity 13 is S3, where S1 + S2 ≥ 2.5S3. In this embodiment, the contact area between the package holder 1 and the first pad 2 and the second pad 3 accounts for more than 80% of the total area of ​​the first pad 2 and the second pad 3. By increasing the contact area between the first pad 2 and the package holder 1, and the contact area between the second pad 3 and the package holder 1, the bonding force between the package holder 1 and the first pad 2 and the second pad 3 is effectively increased, while simultaneously improving the overall heat dissipation capacity of the light-emitting diode.

[0053] In the prior art, to ensure that the light-emitting chip 4 is not affected by the external environment, encapsulating adhesive is usually used to fill the light-emitting cavity 13, thereby encapsulating the light-emitting chip 4. However, the opening angle of the light-emitting cavity 13 of existing light-emitting diodes is too large, usually 70°~80°. When the light-emitting diode is subjected to lateral vibration, the encapsulating adhesive may detach from the inner wall of the light-emitting cavity 13 due to shear force, posing a high risk of encapsulating adhesive detachment.

[0054] like Figure 2 and Figure 3 As shown, to solve the above problems, the opening angle α of the light-emitting cavity 13 is 30°~50°. The opening angle refers to the angle between the two lines formed by the intersection of the inner wall of the light-emitting cavity 13 and the axial section. This angle is reduced from the existing 70°~80° to 30°~50°, so that the force between the encapsulating adhesive and the inner wall of the light-emitting cavity 13 changes from shear mode to compression mode, reducing the risk of the encapsulating adhesive failing due to shear stress at the edge and falling off.

[0055] Preferably, the opening width of the light-emitting cavity 13 is L, and the depth of the light-emitting cavity 13 is D, where D / L ≤ 0.6. That is, the light-emitting cavity 13 has a small depth and a large opening. Even if the opening angle of the light-emitting cavity 13 is reduced, it will not affect the illumination range of the light-emitting diode. Moreover, reducing the depth of the light-emitting cavity 13 is equivalent to reducing the thickness of the encapsulating adhesive, which is equivalent to improving the light transmittance of the light-emitting diode and thus improving energy efficiency.

[0056] Wherein, the opening width L of the light-emitting cavity 13 refers to the maximum width of the opening position of the light-emitting cavity 13. If the light-emitting cavity 13 is frustum-shaped, then L refers to the diameter of the opening of the light-emitting cavity 13. In this embodiment, the horizontal cross-section of the light-emitting cavity 13 is approximately rectangular, then L refers to the length of the long side of the rectangle.

[0057] Example 2 This embodiment provides a packaging method for a light-emitting diode (hereinafter referred to as the packaging method) for fabricating the aforementioned light-emitting diode. The packaging method includes: S01: Obtain the first pad 2 and the second pad 3, and set the first pad 2 and the second pad 3 at an interval.

[0058] S02: Injection molding is used to form the encapsulation bracket 1 on the first pad 2 and the second pad 3.

[0059] The first pad 2 and the second pad 3 are fixed by the packaging bracket 1, and a first connecting post 11 is formed in the first connecting hole 21 and a second connecting post 12 is formed in the second connecting hole 31, so that the first pad 2, the second pad 3 and the packaging bracket 1 form an integral structure, ensuring the formation of the light-emitting diode support structure.

[0060] S03: Place the light-emitting chip 4 inside the through hole and connect the light-emitting chip 4 to the first pad 2 and the second pad 3.

[0061] The light-emitting chip 4 is attached to the first pad 2 and can also dissipate heat through the first pad 2, thereby improving the performance of the light-emitting diode and ensuring the stability of the light-emitting diode during operation.

[0062] S04: Fill the through hole with encapsulating adhesive.

[0063] The encapsulating adhesive can ensure that the light-emitting chip 4 is not affected by the external environment. Since the first pad 2, the insulating barrier 14 and the second pad 3 have sealed the bottom of the through hole to form a light-emitting cavity 13 inside the through hole, it is only necessary to pour the encapsulating adhesive into the light-emitting cavity 13 to fill the light-emitting cavity 13 and wait for the encapsulating adhesive to cure.

[0064] This LED increases the connection strength between the pad and the package bracket 1, preventing the pad from falling off when the LED is subjected to mechanical stress or vibration. It greatly enhances the shear resistance between the pad and the package bracket 1, improving the mechanical stability and long-term reliability of the device.

[0065] In this embodiment, step S01 can be performed by cutting metal strip and stamping the first pad 2 and the second pad 3 on the metal strip, while simultaneously stamping out the trapezoidal first connecting hole 21, the first waterproof wall 24, the second connecting hole 31 and the second waterproof wall 34, thereby improving efficiency.

[0066] In this embodiment, step S01 further includes: A pulsed laser is used to etch a first groove 25 on the first pad 2, and a pulsed laser is used to etch a second groove 35 on the second pad 3. Due to the advantages of high precision and high processing quality of pulsed lasers, the yield rate of the first pad 2 and the second pad 3 can be guaranteed, while ensuring the consistency of the first groove 25 and the second groove 35. This provides a foundation for the subsequent injection molding of the package bracket 1 and ensures that the connection strength between the package bracket 1 and the first pad 2 and the second pad 3 meets the design requirements.

[0067] The pulsed laser has a wavelength of 1000nm~1100nm and a power density of 15-20J / cm². 2 .

[0068] It is worth noting that, due to the presence of microparticles on the surfaces of the first pad 2 and the second pad 3 after pulsed laser etching, it is necessary to clean the surfaces of the first pad 2 and the second pad 3. To avoid affecting the surface quality of the first pad 2 and the second pad 3, ultrasonic cleaning is used in this embodiment. Ultrasonic cleaning has good cleaning effect and high cleaning efficiency, and does not affect the surface quality of the first pad 2 and the second pad 3.

[0069] To further ensure the stability of the first pad 2 and the second pad 3 and prevent them from being corroded, electroplating can be performed on the first pad 2 and the second pad 3 to form a Ni-Ag coating on their surfaces. The Ni-Ag coating is a high-performance composite functional layer that combines the mechanical strength and corrosion resistance of nickel with the excellent conductivity and antibacterial properties of silver. It can both protect the first pad 2 and the second pad 3 and improve their conductivity, thereby enhancing the performance of the light-emitting diode.

[0070] It is understandable that, since the injection molding material needs to fill the first connecting hole 21 and the second connecting hole 31 when forming the first connecting post 11 and the second connecting post 12, the injection molding environment is different from that of other parts of the encapsulation bracket 1. Therefore, in order to ensure the overall yield of the encapsulation bracket 1, this embodiment adopts two-stage injection molding to complete the injection molding steps of the encapsulation bracket 1.

[0071] Preferably, step S02 includes: The first connecting hole 21 and the second connecting hole 31 are injection molded under a first pressure. The injection molding of the other parts of the encapsulation bracket 1 is completed using the second pressure; The first pressure is less than the second pressure.

[0072] Because the diameters of the first connecting hole 21 and the second connecting hole 31 are small, the injection rate needs to be reduced during injection molding so that the encapsulation material can fully fill the first connecting hole 21 and the second connecting hole 31, making the filling rate of the first connecting hole 21 and the second connecting hole 31 greater than or equal to 99%. At this time, a smaller pressure is used for injection molding. Other parts of the encapsulation material do not have this concern, so a larger pressure can be used to increase the injection rate, thereby improving the overall encapsulation efficiency.

[0073] In this embodiment, the first pressure is 60 MPa to 70 MPa; specifically, the first pressure can be 60 MPa, 61 MPa, 62 MPa, 63 MPa, 64 MPa, 65 MPa, 66 MPa, 67 MPa, 68 MPa, 69 MPa or 70 MPa.

[0074] In this embodiment, the second pressure is 100 MPa to 110 MPa; specifically, the second pressure can be 100 MPa, 101 MPa, 102 MPa, 103 MPa, 104 MPa, 105 MPa, 106 MPa, 107 MPa, 108 MPa, 109 MPa or 110 MPa.

[0075] It is worth noting that, in order to ensure that the filling rate of the first connecting hole 21 and the second connecting hole 31 meets the requirements, the injection molding of the encapsulation bracket 1 can also be performed by controlling the mold temperature gradient. Preferably, in step S02, the injection temperature of the first connecting hole 21 and the second connecting hole 31 is 90℃~100℃, and the injection temperature of other parts of the encapsulation bracket 1 is 80℃~90℃. The higher injection temperature of the first connecting hole 21 and the second connecting hole 31 can improve the fluidity of the encapsulation material, making it easier for the encapsulation material to fill the first connecting hole 21 and the second connecting hole 31, while the lower injection temperature of other parts of the encapsulation bracket 1 can cool and solidify quickly, ensuring the overall encapsulation efficiency.

[0076] In this embodiment, the injection temperature of the first connecting hole 21 and the second connecting hole 31 can be 90℃, 91℃, 92℃, 93℃, 94℃, 95℃, 96℃, 97℃, 98℃, 99℃ or 100℃.

[0077] In this embodiment, the injection molding temperature of other parts of the encapsulation bracket 1 can be 80°C, 81°C, 82°C, 83°C, 84°C, 85°C, 86°C, 87°C, 88°C, 89°C or 90°C.

[0078] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A light-emitting diode, characterized in that, include: The packaging bracket (1) has through holes extending to the top and bottom surfaces, and the bottom surface of the packaging bracket (1) is provided with a first connecting post (11) and a second connecting post (12). The first pad (2) has a first connection hole (21). The first pad (2) is located on the bottom surface of the packaging bracket (1) and partially blocks the through hole. The first connecting post (11) passes through the first connection hole (21) and is fixedly connected to the first connection hole (21). The second pad (3) has a second connection hole (31). The second pad (3) is located on the bottom surface of the package bracket (1) and partially blocks the through hole. The second connecting post (12) passes through the second connection hole (31) and is fixedly connected to the second connection hole (31).

2. The light-emitting diode according to claim 1, characterized in that, The top dimension of the first connecting hole (21) is smaller than the bottom dimension of the first connecting hole (21), and the top dimension of the second connecting hole (31) is smaller than the bottom dimension of the second connecting hole (31).

3. The light-emitting diode according to claim 2, characterized in that, The top dimension of the first connecting hole (21) is 10% to 15% smaller than the bottom dimension of the first connecting hole (21), and the top dimension of the second connecting hole (31) is 10% to 15% smaller than the bottom dimension of the second connecting hole (31).

4. The light-emitting diode according to claim 1, characterized in that, The first pad (2) includes a first connecting part (22) and a first fixing part (23). The first connecting part (22) is disposed on the side of the first fixing part (23) away from the second pad (3). A first waterproof wall (24) is protruding from the outer periphery of the first connecting part (22). The second pad (3) includes a second connecting part (32) and a second fixing part (33). The second connecting part (32) is disposed on the side of the second fixing part (33) away from the first pad (2). A second waterproof wall (34) is protruding from the outer periphery of the second connecting part (32).

5. The light-emitting diode according to claim 4, characterized in that, The included angle between the first waterproof wall (24) and the first connecting part (22) is 90°~140°; the included angle between the second waterproof wall (34) and the second connecting part (32) is 90°~140°.

6. The light-emitting diode according to claim 1, characterized in that, The first pad (2) has multiple first grooves (25) on the side facing the package holder (1), and the package holder (1) is filled with multiple first grooves (25); the second pad (3) has multiple second grooves (35) on the side facing the package holder (1), and the package holder (1) is filled with multiple second grooves (35).

7. The light-emitting diode according to any one of claims 1 to 6, characterized in that, The packaging bracket (1) further includes an insulating barrier (14), which is disposed between the first pad (2) and the second pad (3). The first pad (2), the insulating barrier (14) and the second pad (3) close the bottom end of the through hole to form a light-emitting cavity (13) in the through hole.

8. The light-emitting diode according to claim 7, characterized in that, The opening angle α of the light-emitting cavity (13) is 30°~50°; and / or, The opening width of the light-emitting cavity (13) is L, and the depth of the light-emitting cavity (13) is D, where D / L≤0.

6.

9. The light-emitting diode according to claim 7, characterized in that, The contact area between the first pad (2) and the package bracket (1) is S1, the contact area between the second pad (3) and the package bracket (1) is S2, the bottom area of ​​the light-emitting cavity (13) is S3, and S1+S2≥2.5S3.

10. A method for packaging a light-emitting diode (LED), used to prepare the LED according to any one of claims 1 to 9, characterized in that, include: S01: Obtain the first pad (2) and the second pad (3), and set the first pad (2) and the second pad (3) at an interval; S02: Injection molding is performed on the first pad (2) and the second pad (3) to form a package bracket (1); S03: Place the light-emitting chip (4) in the through hole and connect the light-emitting chip (4) to the first pad (2) and the second pad (3); S04: Fill the through hole with encapsulating adhesive.

11. The packaging method for a light-emitting diode according to claim 10, characterized in that, Step S02 includes: The first connecting hole (21) and the second connecting hole (31) are injection molded under a first pressure; The other parts of the encapsulation bracket (1) are injection molded under a second pressure; The first pressure is less than the second pressure.

12. The packaging method for a light-emitting diode according to claim 11, characterized in that, The first pressure is 60 MPa to 70 MPa; and / or, the second pressure is 100 MPa to 110 MPa.

13. The packaging method for a light-emitting diode according to claim 10, characterized in that, In step S02, the injection temperature of the first connecting hole (21) and the second connecting hole (31) is 90℃~100℃, and the injection temperature of the other parts of the encapsulation bracket (1) is 80℃~90℃.

14. The packaging method for a light-emitting diode according to claim 10, characterized in that, Step S01 also includes: A first groove (25) is etched on the first pad (2) using a pulsed laser, and a second groove (35) is etched on the second pad (3) using a pulsed laser.

Images