Circuit board for an imaging system
By designing a mesh structure and widening conductive traces on a printed circuit board, the problem of eddy current heating in magnetic resonance imaging systems is solved, enabling flexible circuit board design and improved signal quality to meet the needs of various imaging systems.
Patent Information
- Application Number
- CN202480052217.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-11
- Filing Date
- 2024-06-20
- Publication Date
- 2026-06-09
AI Technical Summary
In magnetic resonance imaging systems, conductive materials generate heat due to eddy currents induced by rapidly changing magnetic gradient fields, leading to signal drift, reduced component lifespan, and image quality issues in PET systems. Existing solutions, such as using low-conductivity materials or adjusting the orientation of conductive surfaces, are limited and costly.
By designing a mesh structure on the printed circuit board, the impedance of the conductive layer is increased to reduce eddy current heating. At the same time, signal quality is optimized by widening the conductive traces and slits, which can meet the flexible design requirements of different imaging systems.
It effectively reduces eddy current heating, improves signal integrity and flexibility, adapts to the design requirements of different imaging systems, reduces costs, and maintains the functional stability of the circuit board.
Smart Images
Figure CN122180471A_ABST