An integrally formed lighting device and method of making the same

Abstract

The application discloses a kind of integrally formed lighting device, comprising: flexible conductive framework is bent or folded into predetermined two-dimensional or three-dimensional shape;Multiple solid-state light sources are fixed at a predetermined interval and electrically connected to the flexible conductive framework, forming multiple groups of evenly arranged light emitting units;Sealing solidified body is made by integrally forming by injection molding process covering the light emitting unit with transparent or translucent AB glue, the sealing solidified body is arranged inside the flexible conductive framework and the multiple solid-state light sources;The application can be bent or folded into a line shape, a plane shape or any three-dimensional shape according to the actual lighting scene requirements, the shape of the sealing solidified body is adapted to the shape of the light emitting substrate after forming, and can be flexibly applied to home decoration, landscape lighting, vehicle atmosphere lamp and other various scenes, meet the diversified installation and decoration requirements, and the flexible conductive framework has little attenuation of conductive performance after being bent for multiple times, and can keep stable work for a long time.

Description

Technical Field

[0001] This invention relates to the field of lighting device technology, and more specifically to a one-piece molded lighting device. Background Technology

[0002] With the continuous development of lighting technology, solid-state light sources such as LEDs have been widely used in various lighting scenarios due to their advantages such as energy saving, long life and small size. From daily home lighting to industrial lighting and landscape lighting, they have put forward increasingly higher requirements for the structural compactness, shape flexibility, protection performance and light emission uniformity of lighting devices.

[0003] Traditional lighting fixtures currently on the market, such as common LED light strips or decorative lights, are typically assembled from multiple discrete components. Their typical structure includes a COB light source module, an independent power controller, a PC or glass lampshade, a metal or plastic base, and the necessary connecting wires and connectors. This traditional structure has several drawbacks:

[0004] 1. Complex structure and cumbersome assembly: Multiple parts need to be assembled using screws, clips, or glue. This consumes a lot of manpower and results in low production efficiency.

[0005] 2. Poor sealing: Light sources (such as LED chips) are usually not completely sealed. Even with a lampshade, the inside may still be exposed to air, leading to corrosion from moisture, oxygen, dust, and corrosive gases. This can cause the light source to age, accelerate light decay, drift in color temperature, or even fail, seriously affecting the lifespan of the lamp.

[0006] 3. Low design freedom: The shape of traditional lamps is limited by the shape of their rigid components (such as PCB boards and lampshades), making it difficult to achieve complex and flexible personalized pattern designs.

[0007] 4. Heat dissipation relies on metal structures: Heat dissipation usually relies on additional metal heat sinks, which increases weight and cost.

[0008] In addition, the sealing process of existing lighting devices mostly adopts conventional adhesive sealing, which has limited sealing effect. Uneven adhesive application can easily lead to defects such as bubbles and cracks after curing, making it impossible to achieve full coverage and protection of the light source and conductive structure. At the same time, the conductive materials used in some flexible lighting products are not flexible enough. After repeated bending, their conductivity is easily degraded or even broken, making it difficult to meet the requirements for long-term flexible use. Summary of the Invention

[0009] Therefore, the present invention provides an integrally molded lighting device to solve the above-mentioned problems in the prior art.

[0010] To achieve the above objectives, the present invention provides the following technical solution:

[0011] According to a first aspect of the present invention, an integrally molded lighting device comprises:

[0012] Flexible conductive framework, which is bent or folded into a predetermined two-dimensional or three-dimensional shape;

[0013] Multiple solid-state light sources are fixed at a preset interval and electrically connected to the flexible conductive frame to form multiple sets of uniformly arranged light-emitting units;

[0014] The sealed curing body is integrally formed by encapsulating the light-emitting unit with transparent or translucent AB glue through an injection molding process. The sealed curing body seals the flexible conductive skeleton and the multiple solid-state light sources inside it.

[0015] Furthermore, the flexible conductive framework includes:

[0016] A conductive frame 1 extends along its length and is provided with multiple mounting holes at intervals;

[0017] Conductive frame 2 is set parallel to conductive frame 1, and is connected to conductive frame 1 and conductive frame 2 by multiple vertical conductive support columns to form multiple vertically arranged installation channels.

[0018] Each group of light-emitting units is disposed on an installation channel. Each light-emitting unit includes at least two solid-state light sources stacked vertically, with a gap between adjacent solid-state light sources.

[0019] The solid-state light source has dimensions that match the width of the mounting channel, and the projection of the solid-state light source along the horizontal direction covers the horizontal cross-section of the mounting channel. The sealed and cured body covers the mounting channel of the flexible conductive skeleton and the outside of the light-emitting unit disposed in the channel, thus sealing and curing the connection parts of the mounting channel, the light-emitting unit and the flexible conductive skeleton as a whole.

[0020] Furthermore, each of the mounting holes is provided in a one-to-one correspondence with each group of light-emitting units, and the axis of the mounting hole is perpendicular to the horizontal plane where the solid-state light source is located.

[0021] Furthermore, the length of the first conductive frame is the same as the length of the second conductive frame, and the width of the first conductive frame is greater than the width of the second conductive frame.

[0022] Furthermore, the flexible conductive skeleton is made of any one of copper, silver-plated copper, or an alloy.

[0023] Furthermore, the solid-state light source is an LED chip, which is fixed to the mounting channel by welding.

[0024] Furthermore, the material of the sealed and cured body is epoxy resin AB glue or silicone AB glue.

[0025] Furthermore, the shape of the sealed and cured body is configured to be linear, planar, or three-dimensional to match the shape of the light-emitting unit after bending and folding.

[0026] Furthermore, a method for manufacturing a one-piece molded lighting device includes the following steps:

[0027] S1. A flexible conductive frame is provided, which is made of copper, silver-plated copper or alloy, and the flexible conductive frame includes a first conductive frame and a second conductive frame arranged in parallel. The two are connected by multiple vertical conductive support columns to form multiple vertically arranged installation channels. The first conductive frame is provided with multiple installation holes at intervals along the length direction.

[0028] S2. Multiple solid light sources are fixed at a preset interval and electrically connected to the flexible conductive frame to form a light-emitting substrate; wherein, if the solid light source is an LED chip, it is fixed to the mounting channel by welding, and each group of light-emitting units corresponds to one mounting channel. Each group of light-emitting units includes at least two solid light sources stacked in the vertical direction, with gaps between adjacent solid light sources, and the external dimensions of the solid light sources match the width of the mounting channel.

[0029] S3. The light-emitting substrate is bent or folded into a predetermined two-dimensional or three-dimensional shape so that the sealed and cured body can form a linear, planar or three-dimensional shape that matches the shape, and the bent or folded light-emitting substrate is placed into a mold.

[0030] S4. Inject the mixed transparent or semi-transparent liquid AB glue into the mold. The AB glue is epoxy resin AB glue or silicone AB glue. Vacuum injection molding process is used to inject the glue to ensure that the AB glue can completely cover the light-emitting unit, the mounting channel and the connection part of the flexible conductive skeleton.

[0031] S5. Allow the AB glue to cure inside the mold to form a sealed cured body that completely seals the light-emitting substrate, and then demold to obtain the finished product.

[0032] Furthermore, the sealed and cured body is used as the lamp body, photon lens, and protective cover of the lighting device.

[0033] The present invention has the following advantages:

[0034] 1. This invention utilizes vacuum injection molding to integrally encapsulate and solidify a flexible conductive frame and a solid light source using transparent or semi-transparent AB glue. This eliminates the need for separately manufacturing components such as the lamp body, protective cover, and photon lens, completely eliminating the multi-part assembly process of traditional assembled lighting devices. This reduces the number of parts, production time, and labor costs. Simultaneously, the integrated molding structure avoids problems such as component loosening and misalignment caused by assembly errors, improving the structural stability of the lighting device. Furthermore, the sealed and cured body can simultaneously serve as the lamp body, photon lens, and protective cover, offering multiple uses and further optimizing the structural layout for a more compact overall size. The transparent AB glue not only provides protection but also directly encapsulates the light source, aiding in heat dissipation. It can also function as a primary optical lens, improving light output.

[0035] 2. The sealed and cured body is made of epoxy resin AB glue or silicone AB glue. These materials have excellent sealing, waterproof, moisture-proof, dustproof and aging resistance properties. They can completely seal the flexible conductive frame and solid light source inside, effectively blocking the intrusion of external moisture, dust and other impurities, avoiding short circuits in the conductive structure, corrosion and damage to the light source and other failures. They are suitable for various harsh operating environments such as humid and dusty environments. At the same time, the AB glue has stable performance after curing, a wide range of high and low temperature resistance, and is injected through vacuum injection molding process, which can avoid defects such as bubbles and cracks, ensuring the integrity and reliability of the seal and significantly extending the service life of the lighting device.

[0036] 3. The flexible conductive frame is made of flexible conductive materials such as copper, silver-plated copper, or alloys. It has excellent flexibility and conductivity stability. It can be bent or folded into linear, planar, or arbitrary three-dimensional shapes according to the actual lighting scene requirements. It can easily realize various complex personalized logos, artistic patterns, or three-dimensional shapes to meet personalized customization needs and break through the limitations of the fixed shape of traditional rigid conductive brackets. After the sealed curing body is formed, it perfectly matches the shape of the light-emitting substrate and can be flexibly applied to various scenarios such as home decoration, landscape lighting, and vehicle ambient lighting to meet diverse installation and decoration needs. Moreover, the conductivity of the flexible conductive frame decreases very little after multiple bending and can maintain stable operation for a long time.

[0037] 4. Multiple solid-state light sources are fixed at preset intervals on the mounting channel of the flexible conductive frame, forming multiple sets of evenly arranged light-emitting units. Each set of light-emitting units uses at least two solid-state light sources stacked vertically, effectively improving the light density. At the same time, the dimensions of the solid-state light sources match the width of the mounting channel, and their horizontal projection covers the cross-section of the mounting channel. Combined with a transparent or semi-transparent sealing curing body, the light can be evenly diffused, avoiding problems such as glare and dark areas, and improving lighting comfort. Gaps are left between adjacent solid-state light sources, which not only facilitates full coverage of AB glue during injection, but also reduces heat accumulation between light sources, reduces light decay, and further improves light efficiency and the lifespan of the light sources.

[0038] 5. The flexible conductive frame is made of copper, silver-plated copper, or alloys. These materials have excellent conductivity, ensuring a stable power supply to the solid-state light source and preventing abnormal light emission due to poor contact. Conductive frame one and conductive frame two are connected by multiple vertical conductive support columns to form a regular installation channel. This facilitates the fixing and electrical connection of the solid-state light source and increases the heat dissipation area of ​​the conductive structure. Combined with the thermal conductivity of AB glue, the heat generated by the solid-state light source during operation can be quickly conducted to the outside, effectively mitigating light decay and damage caused by overheating and further extending the service life of the lighting device.

[0039] 6. The conductive frame of the flexible conductive skeleton has multiple mounting holes, and each mounting hole corresponds to each group of light-emitting units. The axis of the mounting hole is perpendicular to the horizontal plane where the solid light source is located, which can quickly realize the fixed installation of the lighting device and adapt to different installation scenarios. At the same time, the one-piece molded structure is lightweight and sturdy, easy to transport and install, and the production process is mature. The vacuum injection molding process is simple and controllable, which can realize mass production, reduce production costs, and combine practicality and economy. Attached Figure Description

[0040] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0041] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0042] Figure 1 This is a first view of an integrally molded lighting device provided for some embodiments of the present invention.

[0043] Figure 2 A second view of an integrally molded lighting device provided for some embodiments of the present invention.

[0044] Figure 3 A third view of an integrally molded lighting device provided for some embodiments of the present invention.

[0045] Figure 4This is a perspective view of an integrally molded lighting device provided for some embodiments of the present invention.

[0046] Figure 5 An integrally molded lighting device provided for some embodiments of the present invention Figure 4 Enlarged view of part A.

[0047] Figure 6 Color schematic diagram of an integrally molded lighting device provided for some embodiments of the present invention Figure 1 .

[0048] Figure 7 Color schematic diagram of an integrally molded lighting device provided for some embodiments of the present invention Figure 2 .

[0049] In the diagram: 1. Flexible conductive frame; 11. Conductive frame one; 111. Mounting hole; 12. Conductive frame two; 13. Vertical conductive support column; 2. Solid-state light source; 3. Sealed curing body; 4. Light-emitting unit. Detailed Implementation

[0050] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Example 1

[0052] like Figures 1 to 7 As shown, an integrally molded lighting device according to a first aspect embodiment of the present invention includes a flexible conductive frame 1, a plurality of solid light sources 2 and a sealed curing body 3.

[0053] In this embodiment, the flexible conductive frame 1 is made of silver-plated copper, which has excellent flexibility and conductivity and can be bent into a linear shape (suitable for wall decoration linear lighting scenarios); the flexible conductive frame 1 includes a first conductive frame 11 and a second conductive frame 12, which are arranged in parallel. The width of the first conductive frame 11 is greater than the width of the second conductive frame 12. The first conductive frame 11 and the second conductive frame 12 are connected by multiple vertical conductive support columns 13. The adjacent vertical conductive support columns 13 are spaced apart to form multiple vertically arranged installation channels.

[0054] The solid-state light source 2 uses LED chips. Each group of light-emitting units 4 is set on an installation channel. Each group of light-emitting units 4 includes two LED chips stacked vertically. There is a gap between adjacent LED chips. The external dimensions of the LED chips match the width of the installation channel, and the projection of the LED chips in the horizontal direction covers the horizontal cross section of the installation channel. The LED chips are fixed and electrically connected to the installation channel by soldering. Multiple LED chips are evenly arranged at a preset spacing (consistent with the spacing of the installation channel) to form multiple groups of light-emitting units 4.

[0055] The sealed curing body 3 is made by encapsulating the light-emitting unit 4 in one piece with transparent epoxy resin AB glue through vacuum injection molding. Its shape is adapted to the curved lines of the flexible conductive skeleton 1, and its cross-section is rectangular. The sealed curing body 3 completely seals the flexible conductive skeleton 1 and all LED chips inside it, and also serves as a lamp body, photon lens and protective cover.

[0056] The conductive frame 11 has 20 mounting holes 111 spaced along its length. Each mounting hole 111 corresponds to each group of light-emitting units 4. The axis of the mounting hole 111 is perpendicular to the horizontal plane where the light-emitting unit 4 is located, and is used for the fixed installation of the lighting device.

[0057] In this embodiment, it should be noted that the flexible conductive skeleton 1 made of silver-plated copper not only has excellent conductivity but also good oxidation resistance, and can maintain stable conductivity for a long time; the transparent epoxy resin AB glue has a light transmittance of ≥90% after curing, which can effectively ensure the light transmittance, and at the same time has good waterproof and dustproof performance; the LED chips are arranged in a vertical stack, which increases the light density by 1 times compared with a single layer arrangement. After the light is diffused by the transparent sealed curing body 3, the illumination is uniform and there is no glare or dark area phenomenon.

[0058] The technical effects achieved by this embodiment are as follows: compact structure and small size, suitable for wall decorative linear lighting scenarios, no assembly required, high production efficiency; excellent sealing performance, can be used for a long time in humid environments, long service life; flexible structure can be bent flexibly to meet the personalized needs of linear lighting, uniform light emission, and excellent lighting experience; convenient installation, can be quickly fixed through mounting holes, combining practicality and economy.

[0059] Example 2

[0060] like Figures 1 to 7 As shown, this embodiment provides another one-piece molded lighting device, the structure of which includes all the contents of Embodiment 1. Only the different parts are described below.

[0061] In this embodiment, the flexible conductive frame 1 is made of copper and can be folded into a flat square (suitable for desktop decorative lights and sign lighting scenarios). The length of conductive frame 11 and conductive frame 2 12 is 50cm, the width of conductive frame 11 is 8mm, the width of conductive frame 2 12 is 5mm, the spacing between adjacent vertical conductive support columns 13 is 4cm, forming 12 sets of installation channels, each installation channel is 7mm wide.

[0062] Each light-emitting unit 4 includes 3 LED chips stacked vertically, with a gap of 1.5mm between adjacent LED chips. The LED chips are fixed to the mounting channel by laser welding, which has higher welding precision and avoids abnormal light emission caused by poor contact. The sealed curing body 3 is made of semi-transparent organic silicone AB glue and has a square shape (50cm side length and 8mm thickness) that matches the folded shape of the light-emitting substrate. The semi-transparent material can achieve soft light emission and avoid strong light glare, making it suitable for indoor decorative lighting scenarios.

[0063] The mounting holes 111 have a diameter of 2.5mm and there are 12 holes in total, which are evenly distributed on the conductive frame 11. The mounting holes 111 are embedded with metal washers to improve the firmness of the installation and prevent loosening after long-term use.

[0064] In this embodiment, it should be noted that the flexible conductive skeleton 1 made of copper has excellent thermal conductivity, which can quickly conduct the heat generated by the LED chip during operation to the sealed curing body 3 and then dissipate it to the outside, effectively reducing the light decay of the LED chip and extending the life of the light source; the silicone AB glue has excellent high and low temperature resistance and can work stably in an environment of -40℃ to 120℃, making it suitable for use in different temperature scenarios; the semi-transparent sealed curing body 3 has both protective and optical diffusion functions, eliminating the need for additional photonic lenses, simplifying the structure while improving the softness of the lighting.

[0065] The technical effects achieved by this embodiment are as follows: it is suitable for flat lighting scenarios such as desktop decorations and signs, and the semi-transparent light emission effect is soft, which enhances the texture of interior decoration; the copper material has good thermal conductivity, the light decay of LED chips is reduced by 20%, and the service life is further extended; the foldable flat structure is easy to install and can be directly fixed to desktops, walls and other positions; the high and low temperature resistance of the silicone AB glue expands the application range of the lighting device and can work normally in extreme temperature environments.

[0066] Example 3

[0067] like Figures 1 to 7 As shown, this embodiment provides another one-piece molded lighting device, the structure of which includes all the contents of Embodiment 1. Only the different parts are described below.

[0068] In this embodiment, the flexible conductive frame 1 is made of alloy material, which has higher structural strength and flexibility, and can be bent and folded into a three-dimensional shape (such as the letter "L" shape, which is suitable for three-dimensional lighting scenarios such as corners and shelf corners); the length of conductive frame one 11 is 80cm, the length of conductive frame two 12 is 60cm, the width of conductive frame one 11 is 12mm, the width of conductive frame two 12 is 7mm, and the spacing between adjacent vertical conductive support columns 13 is 6cm, forming 13 sets of installation channels, each installation channel being 9mm wide.

[0069] The solid-state light source 2 uses high-brightness LED chips. Each light-emitting unit 4 includes two LED chips stacked vertically. The gap between adjacent LED chips is 0.8mm. The horizontal projection of the LED chips completely covers the horizontal cross section of the installation channel to ensure no light leakage. The sealed curing body 3 is made of transparent silicone AB glue. Its shape is perfectly adapted to the three-dimensional shape (letter "L" shape). The corners are rounded to avoid sharp edges and improve safety. At the same time, it facilitates uniform light diffusion.

[0070] There are 13 mounting holes 111 in total, with a diameter of 3.5mm, which are evenly distributed on the conductive frame 11. The position of the mounting holes 111 corresponds to the center of the light-emitting unit 4 to ensure that the lighting angle is accurate and without deviation after installation. The vertical conductive support column 13 of the flexible conductive frame 1 adopts a thickened design (diameter 2mm) to improve the structural stability and avoid deformation of the three-dimensional shape after long-term use.

[0071] In this embodiment, it should be noted that the flexible conductive skeleton 1 made of alloy material takes into account both flexibility and structural strength, and can maintain stable operation for a long time after repeated bending and folding; the transparent organic silicone AB glue has a light transmittance of ≥92% and has good anti-yellowing properties, and can still maintain excellent light transmission effect after long-term use; the three-dimensional shape design breaks through the planar limitations of traditional lighting devices, and can be adapted to complex installation scenarios such as corners and shelf corners to achieve all-round lighting.

[0072] The technical effects achieved in this embodiment are as follows: the three-dimensional shape is suitable for complex installation scenarios and achieves lighting without blind spots; the alloy material structure is stable, flexible, can be repeatedly bent and has stable conductivity; the high-brightness LED chip combined with the transparent sealed curing body has high luminous efficiency and wide illumination range; the rounded corner transition design improves the safety of use and optimizes the light diffusion effect, eliminating glare and dark areas.

[0073] Example 4

[0074] like Figures 1 to 7 As shown, this embodiment provides another one-piece molded lighting device, the structure of which includes all the contents of Embodiment 1. Only the different parts are described below.

[0075] In this embodiment, the flexible conductive frame 1 is made of silver-plated copper and can be bent into an arc shape (suitable for landscape lighting and vehicle ambient lighting scenarios). The length of conductive frame 11 and conductive frame 2 12 is 150cm, the width of conductive frame 11 is 15mm, the width of conductive frame 2 12 is 8mm, the spacing between adjacent vertical conductive support columns 13 is 7cm, forming 21 sets of installation channels, each installation channel is 10mm wide.

[0076] Each light-emitting unit 4 includes 4 LED chips stacked vertically, with a gap of 1.2mm between adjacent LED chips. The LED chips are fixed to the mounting channel by surface mount welding, which ensures tight fit and better heat conduction. The sealed curing body 3 is made of transparent epoxy resin AB glue, with an arc shape (radius 10cm) and a circular cross-section (diameter 15mm). The circular cross-section can achieve 360° light emission, which is suitable for the all-round light emission needs of landscape lighting.

[0077] There are 21 mounting holes 111 in total, with a diameter of 4mm, which are evenly distributed on the conductive frame 11. The line connecting the mounting holes 111 is parallel to the arc of the arc-shaped conductive frame 11, ensuring that the arc contour of the lighting device is neat after installation and meets the needs of landscape decoration. The surfaces of the conductive frame 11 and the conductive frame 12 of the flexible conductive frame 1 are treated with anti-corrosion to improve corrosion resistance in outdoor environments.

[0078] In this embodiment, it should be noted that the flexible conductive skeleton 1 made of silver-plated copper has excellent conductivity, which can ensure that multiple LED chips (4 in each group) receive stable power supply and avoid uneven light emission; the transparent epoxy resin AB glue has excellent UV resistance, can be used outdoors for a long time, and is not prone to aging or yellowing; the 360° circular cross-section light emission design has a wide light coverage range, which is suitable for landscape lighting, vehicle ambient lighting and other scenarios that require all-round light emission; the corrosion-resistant flexible conductive skeleton can improve the durability for outdoor use.

[0079] The technical effects achieved in this embodiment are as follows: the arc-shaped 360° light emission is suitable for landscape lighting, vehicle ambient lighting and other scenarios, with a wide illumination range and excellent decorative effect; the multi-chip stacked design has high light density and sufficient brightness; the silver-plated copper material has stable conductivity and anti-corrosion treatment to adapt to harsh outdoor environments; the vacuum injection molded sealed and cured body has excellent sealing performance and can be used for a long time in rainy and dusty outdoor environments, with a long service life.

[0080] Example 5

[0081] A method for manufacturing a one-piece molded lighting device includes the following steps:

[0082] S1. A flexible conductive frame 1 is provided. The flexible conductive frame 1 is made of copper, silver-plated copper or alloy. The flexible conductive frame 1 includes a first conductive frame 11 and a second conductive frame 12 arranged in parallel. The two are connected by multiple vertical conductive support columns 13 to form multiple vertically arranged installation channels. The first conductive frame 11 is provided with multiple installation holes 111 at intervals along the length direction.

[0083] S2. Multiple solid light sources 2 are fixed at a preset interval and electrically connected to a flexible conductive frame 1 to form a light-emitting substrate; wherein, if the solid light source 2 is an LED chip, it is fixed to the mounting channel by welding, and each group of light-emitting units 4 corresponds to one mounting channel. Each group of light-emitting units 4 includes at least two solid light sources 2 stacked in the vertical direction, with gaps between adjacent solid light sources 2, and the external dimensions of the solid light source 2 match the width of the mounting channel.

[0084] S3. The light-emitting substrate is bent or folded into a predetermined two-dimensional or three-dimensional shape so that the sealed and cured body 3 can form a linear, planar or three-dimensional shape that matches the shape after molding, and the bent or folded light-emitting substrate is placed into the mold.

[0085] S4. Inject the mixed transparent or semi-transparent liquid AB glue into the mold. The AB glue is epoxy resin AB glue or silicone AB glue. Vacuum injection molding process is used to inject the glue to ensure that the AB glue can completely cover the light-emitting unit 4, the connection part of the mounting channel and the flexible conductive skeleton 1.

[0086] S5. Allow the AB glue to cure inside the mold, forming a sealed cured body 3 that completely seals the light-emitting substrate, and then demold to obtain the finished product.

[0087] Among them, the sealed and cured body 3 is used as the lamp body, photon lens and protective cover of the lighting device.

[0088] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

[0089] The terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

Claims

1. A one-piece molded lighting device, characterized in that, include: Flexible conductive skeleton (1), which is bent or folded into a predetermined two-dimensional or three-dimensional shape; Multiple solid light sources (2) are fixed at a preset interval and electrically connected to the flexible conductive frame (1) to form multiple sets of uniformly arranged light-emitting units (4). The sealed curing body (3) is integrally formed by encapsulating the light-emitting unit (4) with transparent or semi-transparent AB glue through injection molding process. The sealed curing body (3) seals the flexible conductive skeleton (1) and the multiple solid light sources (2) inside it.

2. The integrally molded lighting device according to claim 1, characterized in that, The flexible conductive framework (1) includes: A conductive frame (11) extends along the length direction and is provided with a plurality of mounting holes (111) at intervals. The conductive frame 2 (12) is set parallel to the conductive frame 1 (11) and is connected to the conductive frame 1 (11) and the conductive frame 2 (12) by multiple vertical conductive support columns (13) to form multiple vertically arranged installation channels; Each group of light-emitting units (4) is disposed on an installation channel. The light-emitting unit (4) includes at least two solid light sources (2) stacked in the vertical direction, and there is a gap between adjacent solid light sources (2). The solid light source (2) has an external size that matches the width of the installation channel, and the projection of the solid light source (2) along the horizontal direction covers the horizontal section of the installation channel where it is located; the sealed curing body (3) covers the installation channel of the flexible conductive skeleton (1) and the outside of the light-emitting unit (4) set in the channel, and seals and cures the connection part of the installation channel, the light-emitting unit (4) and the flexible conductive skeleton (1) as a whole.

3. The integrally molded lighting device according to claim 2, characterized in that, Each of the mounting holes (111) is provided in a one-to-one correspondence with each of the light-emitting units (4), and the axis of the mounting hole (111) is perpendicular to the horizontal plane where the solid light source (2) is located.

4. The integrally molded lighting device according to claim 2, characterized in that, The length of the first conductive frame (11) is the same as the length of the second conductive frame (12), and the width of the first conductive frame (11) is greater than the width of the second conductive frame (12).

5. The integrally molded lighting device according to claim 1, characterized in that, The flexible conductive skeleton (1) is made of any one of copper, silver-plated copper or alloy.

6. The integrally molded lighting device according to claim 2, characterized in that, The solid-state light source (2) is an LED chip, which is fixed to the mounting channel by welding.

7. The integrally molded lighting device according to claim 1, characterized in that, The material of the sealed and cured body (3) is epoxy resin AB glue or silicone AB glue.

8. The integrally molded lighting device according to claim 1, characterized in that, The shape of the sealed solidified body (3) is configured to be linear, planar or three-dimensional to match the shape of the light-emitting unit (4) after bending and folding.

9. A method for manufacturing an integrally molded lighting device as described in any one of claims 1-8, characterized in that, Includes the following steps: S1. Provide a flexible conductive frame (1), the flexible conductive frame (1) is made of any one of copper, silver-plated copper or alloy, and the flexible conductive frame (1) includes a first conductive frame (11) and a second conductive frame (12) arranged in parallel. The two are connected by multiple vertical conductive support columns (13) to form multiple vertically arranged installation channels. The first conductive frame (11) is provided with multiple installation holes (111) at intervals along the length direction. S2. Fix and electrically connect multiple solid light sources (2) at a preset interval to the flexible conductive frame (1) to form a light-emitting substrate; wherein, if the solid light source (2) is an LED chip, it is fixed to the mounting channel by welding, and each group of light-emitting units (4) corresponds to one mounting channel. Each group of light-emitting units (4) includes at least two solid light sources (2) stacked in the vertical direction, with gaps between adjacent solid light sources (2), and the external dimensions of the solid light source (2) match the width of the mounting channel; S3. The light-emitting substrate is bent or folded into a predetermined two-dimensional or three-dimensional shape so that the sealed and cured body (3) can form a linear shape, planar shape or three-dimensional shape that matches the shape after molding, and the bent or folded light-emitting substrate is placed into the mold. S4. Inject the mixed transparent or semi-transparent liquid AB glue into the mold. The AB glue is epoxy resin AB glue or silicone AB glue. Vacuum injection molding process is used to inject the glue to ensure that the AB glue can completely cover the light-emitting unit (4), the connection part of the mounting channel and the flexible conductive skeleton (1). S5. The AB glue is cured in the mold to form a sealed cured body (3) that completely seals the light-emitting substrate, and the finished product is obtained by demolding.

10. The method for manufacturing the integrally molded lighting device according to claim 9, characterized in that, The sealed and cured body (3) is used as the lamp body, photon lens and protective cover of the lighting device.

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