Layered temperature-controlled pre-burn apparatus

Abstract

The present invention provides a layered temperature-controlled burn-in apparatus. The layered temperature-controlled burn-in apparatus includes a fixture, a hollow layer plate, and a fluid supply device. The hollow layer plate is configured to the fixture and has a first fluid chamber. The hollow layer plate is adapted to carry a burn-in plate. The fluid supply device is adapted to supply a temperature-controlled fluid to the first fluid chamber of the hollow layer plate.

Description

Technical Field

[0001] This invention relates to a pre-firing technology, and more particularly to a pre-firing device with layered temperature control. Background Technology

[0002] Nowadays, after electronic components are manufactured, they often undergo reliability testing, such as burn-in testing, to eliminate defective products and ensure product quality. Burn-in testing is typically performed using a burn-in machine. To perform high-wattage burn-in tests, the burn-in temperature must be controlled within a specific range; therefore, the burn-in machine also has a heat dissipation function to assist in temperature control. Currently, the heat dissipation of burn-in machines generally only targets the electronic components mounted on the socket. However, this cannot ensure uniform heat dissipation on the burn-in board, making the board and its circuitry susceptible to damage and preventing functional testing of the electronic components. Summary of the Invention

[0003] In view of the above, the present invention provides a pre-firing device with layered temperature control. In some embodiments, the pre-firing device with layered temperature control includes a mounting frame, a hollow layer plate, and a fluid supply device. The hollow layer plate is disposed on the mounting frame and has a first fluid chamber. The hollow layer plate is adapted to support a pre-firing plate. The fluid supply device is adapted to supply temperature-controlled fluid to the first fluid chamber of the hollow layer plate.

[0004] In some embodiments, the layered temperature-controlled pre-firing equipment includes a mounting frame, a negative pressure shelf, an exhaust duct, and an exhaust device. The negative pressure shelf is disposed on the mounting frame and adapted to support the pre-firing plate. The negative pressure shelf includes a negative pressure duct and opposing top and bottom surfaces. The top surface faces the pre-firing plate, the bottom surface has at least one first air inlet, and the top surface has at least one second air inlet. The at least one first air inlet and the at least one second air inlet communicate with the negative pressure duct. The exhaust duct communicates with the negative pressure duct. The exhaust device is adapted to extract gas from the exhaust duct.

[0005] In summary, according to some embodiments, the present invention can uniformly control the temperature of the pre-burning board to improve the temperature uniformity of the pre-burning board (e.g., uniformly remove the heat accumulated on the pre-burning board), thereby increasing the lifespan of the test circuit used to test the function of the pre-burning components, that is, reducing the risk of damage to the pre-burning board and the test circuit.

[0006] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0007] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0008] Figure 1 This is a three-dimensional schematic diagram of the pre-firing device with layered temperature control according to the first embodiment of the present invention.

[0009] Figure 2 This is a partial side view of the pre-firing device with layered temperature control according to the first embodiment of the present invention.

[0010] Figure 3 This is a partial side view of the pre-firing device with layered temperature control according to the second embodiment of the present invention.

[0011] Figure 4 This is a partial side view of the pre-firing device with layered temperature control according to the third embodiment of the present invention.

[0012] Figure 5 This is a partial side view of the pre-firing device with layered temperature control according to the fourth embodiment of the present invention.

[0013] Figure 6 This is a partial block diagram of a pre-firing device with layered temperature control according to some embodiments of the present invention.

[0014] Figure 7 This is a partial schematic diagram of a pre-firing device with layered temperature control according to some embodiments of the present invention.

[0015] Figure 8 This is a partial side view of a pre-fired device with layered temperature control according to some embodiments of the present invention.

[0016] Figure 9 This is a partial side view of the pre-firing device with layered temperature control according to the fifth embodiment of the present invention.

[0017] Figure 10 This is a partial side view of the pre-firing device with layered temperature control according to the sixth embodiment of the present invention.

[0018] Figure 11 This is a partial side view of the pre-firing device with layered temperature control according to the seventh embodiment of the present invention.

[0019] Explanation of reference numerals in the attached figures:

[0020] 10: Layered temperature-controlled pre-firing equipment;

[0021] 20: Fixture;

[0022] 30: Hollow core board;

[0023] 31: First fluid chamber;

[0024] 33: Fluid connector;

[0025] 330: Intubation;

[0026] 331: Socket joint;

[0027] 333: Flow channel;

[0028] 40: Fluid supply device;

[0029] 50: Pre-fired plate;

[0030] 51A: First pre-burning stand;

[0031] 51B: Second pre-burning seat;

[0032] 52: Pre-burned components;

[0033] 53: Test circuit;

[0034] 54: Erecting the frame;

[0035] 60: Base plate;

[0036] 70A: First heat-conducting block;

[0037] 70B: Second heat-conducting block;

[0038] 70C: Third heat sink;

[0039] 80: Negative pressure shelf;

[0040] 81: Negative pressure channel;

[0041] 90: Ventilation duct;

[0042] 100: Exhaust ventilation device;

[0043] 200: Controller;

[0044] 300: Temperature sensor;

[0045] 400: Pre-fired furnace body;

[0046] 500: Temperature control panel;

[0047] 510: Second fluid chamber;

[0048] 511: Supply loop;

[0049] 512: Recycling loop;

[0050] TF1: First top face;

[0051] BF1: First bottom surface;

[0052] TF2: Second top surface;

[0053] BF2: Second bottom surface;

[0054] AI1: First air inlet;

[0055] AI2: Second air inlet;

[0056] AI3: Third air inlet;

[0057] AF1, AF2, AF3: Arrows;

[0058] GP: Spacing;

[0059] DP1, DP2: Distance. Detailed Implementation

[0060] Reference Figure 1 and Figure 2 . Figure 1 This is a three-dimensional schematic diagram of the pre-firing device 10 with layered temperature control according to the first embodiment of the present invention. Figure 2 This is a partial side view schematic diagram of the pre-firing device 10 with layered temperature control according to the first embodiment of the present invention. The pre-firing device 10 with layered temperature control includes a fixing frame 20, a hollow layer plate 30, and a fluid supply device 40. Here, Figure 1 The diagram shows four fixed frames 20 and four hollow shelves 30. Figure 2 Two mounting brackets 20 and two hollow shelves 30 are illustrated, but the invention is not limited thereto. The number of mounting brackets 20 corresponds to the number of hollow shelves 30, and there may be one or more of them. In some embodiments, the mounting brackets 20 and hollow shelves 30 are arranged in one dimension, such as vertically. The following description uses a single mounting bracket 20, a single hollow shelf 30, and their related structures.

[0061] A hollow laminate 30 is disposed on and supported by a mounting bracket 20. For example, the mounting bracket 20 is connected to both sides of the hollow laminate 30. The hollow laminate 30 is adapted to carry a pre-burn-in board 50. For example, slide rails are provided on both sides of the hollow laminate 30 for the sides of the pre-burn-in board 50 to slide into and be fixed on the hollow laminate 30. The top surface of the pre-burn-in board 50 (hereinafter referred to as the first top surface TF1) has at least one pre-burn-in holder (e.g., a first pre-burn-in holder 51A and a second pre-burn-in holder 51B) for mounting the pre-burn-in element 52. The bottom surface of the pre-burn-in board 50 (hereinafter referred to as the first bottom surface BF1) is provided with a test circuit 53 to test the function of the pre-burn-in element 52 during pre-burn-in testing. In some embodiments, the pre-burn-in element 52 is a semiconductor packaging component, and the pre-burn-in holder is a chip socket.

[0062] The hollow laminate 30 has a first fluid chamber 31. The fluid supply device 40 is adapted to supply a temperature-controlled fluid to the first fluid chamber 31 of the hollow laminate 30. Thus, by flowing through the first fluid chamber 31 with the temperature-controlled fluid, heat from the pre-burning plate 50 can be uniformly removed or heat can be supplied to the pre-burning plate 50 to control its temperature, and the temperature uniformity of the pre-burning plate 50 can be improved, thereby reducing the risk of damage to the pre-burning plate 50. For example, when the temperature-controlled fluid is a high-temperature fluid, the temperature of the pre-burning plate 50 can be uniformly increased; when the temperature-controlled fluid is a low-temperature fluid, the accumulated heat of the pre-burning plate 50 can be uniformly removed. In other words, by providing a high-temperature or low-temperature temperature-controlled fluid, the hollow laminate 30 can be maintained at a high or low temperature, thereby creating a high-temperature or low-temperature testing environment.

[0063] Furthermore, since the test circuit 53 of the pre-burning board 50 is located on the first bottom surface BF1 of the pre-burning board 50, the hollow layer board 30 is relatively close to the test circuit 53 and can effectively control the temperature of the test circuit 53. For example, when a low-temperature temperature-controlled fluid is supplied to the hollow layer board 30, the test circuit 53 can be continuously cooled or maintained at a specific temperature to reduce the risk of damage to the test circuit 53 and thus extend its lifespan.

[0064] In some embodiments, the fluid supply device 40 may be a cooling distribution unit (CDU) or a chiller to directly supply cryogenic liquids. In other embodiments, the fluid supply device 40 may be a cooling gas supply device to directly supply cryogenic gases (such as liquid nitrogen) or temperature-conditioned air, the temperature of which may be regulated by means of a condenser or heat exchanger. In yet another embodiment, the fluid supply device 40 may also supply high-temperature gases or high-temperature liquids, such as liquids or gases that have been temperature-regulated by a heater; the heater may be a heater composed of an electric heating element, a resistance heating source, or other equivalent elements with controllable temperature rise.

[0065] like Figure 2As shown, in some embodiments, the pre-fired plate 50 has a support frame 54 disposed around the perimeter of the body of the pre-fired plate 50, such that a gap GP separates the pre-fired plate 50 from the hollow layer plate 30. Thus, the hollow layer plate 30 can carry away heat from the air within the space formed by the gap GP through air convection, indirectly reducing the temperature of the pre-fired plate 50. In other embodiments, for example, when the hollow layer plate 30 is used for heating, heat is also provided to the air within the space formed by the gap GP through air convection, indirectly increasing the temperature of the pre-fired plate 50. This avoids direct heat conduction between the hollow layer plate 30 and the pre-fired plate 50, which could cause the pre-fired plate 50 to be damaged due to sudden and drastic temperature changes.

[0066] Reference Figure 3 This is a partial side view of the pre-firing device 10 with layered temperature control according to a second embodiment of the present invention. The difference from the first embodiment is that, in the second embodiment, the pre-firing device 10 with layered temperature control further includes a base plate 60 and at least one heat-conducting block (e.g., a first heat-conducting block 70A, a second heat-conducting block 70B, and a third heat-conducting block 70C). The heat-conducting blocks are disposed between the pre-firing plate 50 and the base plate 60, and the base plate 60 is in direct contact with the hollow layer plate 30. Thus, the hollow layer plate 30 can effectively transfer heat energy to the pre-firing plate 50 via thermal conduction through the base plate 60 and the heat-conducting blocks, thereby effectively controlling the temperature of the pre-firing plate 50. Furthermore, when the pre-burning plate 50 is removed from or placed into the pre-burning equipment 10 with layered temperature control, the base plate 60 can move along with the pre-burning plate 50 (such as being removed or placed together). Therefore, through the isolation provided by the base plate 60, when the user removes or places the pre-burning plate 50 from or into the pre-burning equipment 10 with layered temperature control, the user can only contact the base plate 60, thereby avoiding the user directly touching the pre-burning plate 50 and reducing the risk of the user damaging the pre-burning plate 50 due to contact.

[0067] In some embodiments, the two ends of some of the heat-conducting blocks (e.g., the first heat-conducting block 70A and the third heat-conducting block 70C) are respectively in contact with the corresponding areas of the pre-burning base (e.g., the first pre-burning base 51A and the second pre-burning base 51B) projected vertically onto the first bottom surface BF1 of the pre-burning plate 50 and the base plate 60. Therefore, the hollow laminate 30 can regulate the temperature of the pre-burning base through direct heat conduction, using the path with the least thermal resistance. As for the other portion of the heat-conducting blocks (e.g., the second heat-conducting block 70B), the two ends are respectively in contact with the test circuit 53 and the base plate 60. In some embodiments, the test circuit 53 can be an electronic component with a high thermal design power (TDP), such as a controller chip or a voltage regulator module (VRM). Thus, the hollow laminate 30 can regulate the temperature of the test circuit 53 through direct heat conduction using the heat-conducting blocks.

[0068] Reference Figure 4 This is a partial side view of the pre-firing device 10 with layered temperature control according to the third embodiment of the present invention. In the third embodiment of the pre-firing device 10 with layered temperature control, it also includes a fixing frame 20, a hollow layer plate 30, a fluid supply device 40, and at least one heat-conducting block (e.g., a first heat-conducting block 70A, a second heat-conducting block 70B, and a third heat-conducting block 70C). The difference is that the heat-conducting blocks are disposed on the first bottom surface BF1 of the pre-firing plate 50 and directly contact the hollow layer plate 30. For example, the two ends of some of these heat-conducting blocks (e.g., the first heat-conducting block 70A and the third heat-conducting block 70C) respectively contact the corresponding areas of the pre-firing bases (e.g., the first pre-firing base 51A and the second pre-firing base 51B) projected vertically onto the first bottom surface BF1 of the pre-firing plate 50 and the hollow layer plate 30, while the two ends of another portion of these heat-conducting blocks (e.g., the second heat-conducting block 70B) respectively contact the test circuit 53 and the hollow layer plate 30. Thus, by simply using the heat-conducting block as the medium for heat conduction between the pre-burning plate 50 and the hollow layer plate 30, and by using the method of minimum thermal resistance for heat control, the temperature control of the test circuit 53 and the pre-burning components 52 on the pre-burning base can be further enhanced.

[0069] Reference Figure 5 This is a partial side view of the pre-fired device 10 with layered temperature control according to the fourth embodiment of the present invention. The difference from the first embodiment is that, in the fourth embodiment, the pre-fired device 10 with layered temperature control further includes a negative pressure layer 80, an exhaust channel 90, and an exhaust device 100. The negative pressure layer 80 is disposed below the hollow layer 30 and includes a bottom surface (hereinafter referred to as the second bottom surface BF2) and a negative pressure channel 81. The second bottom surface BF2 has at least one air inlet (hereinafter referred to as the first air inlet AI1) and connects to the negative pressure channel 81.

[0070] Thus, the heat emitted by the pre-fired element 52 in the lower layer adjacent to the second bottom surface BF2 (such as...) Figure 5 The air drawn in (as indicated by arrow AF1) will be drawn into the negative pressure channel 81 through the first air inlet AI1 above the preheated element 52. The negative pressure channel 81 connects to the exhaust channel 90 to transfer the drawn-in air to the exhaust channel 90 (e.g., as indicated by arrow AF1). Figure 5 Arrow AF2); and the exhaust duct 90 can collect the hot air discharged from the negative pressure duct 81 of each floor.

[0071] Additionally, an exhaust device 100 can be configured within the exhaust duct 90, or in the space where the exhaust duct 90 communicates with the external atmosphere, to extract gas from the exhaust duct 90 and discharge it to the atmosphere. In this way, the exhaust device 100 can discharge the hot gas emitted by the pre-burning element 52 via air convection without generating heat accumulation or thermal crosstalk effects. Furthermore, in some embodiments, the negative pressure channel 81 can be composed of a negative pressure plate 80 and a hollow plate 30. When a low-temperature temperature-controlled fluid flows through the hollow plate 30, it can further cool the hot gas within the negative pressure channel 81, reducing the temperature of the gas discharged to the atmosphere.

[0072] The exhaust device 100 is, for example, but not limited to, an exhaust fan; and, in some embodiments, the exhaust device 100 may exhaust air at an upward angle to avoid affecting other equipment. The above... Figure 3 The second embodiment and Figure 4 The third embodiment can be with Figure 5 The fourth embodiment is used in conjunction with each other, and the correspondences derived from the mutual application can be referred to in conjunction with each other. Figures 3 to 5 This will not be elaborated upon further here.

[0073] Reference Figure 6 This is a partial block diagram of a pre-firing device 10 with layered temperature control according to some embodiments of the present invention. In some embodiments, the pre-firing device 10 with layered temperature control further includes a controller 200 and at least one temperature sensor 300. The controller 200 is electrically connected to the temperature sensor 300 and a fluid supply device 40. The temperature sensor 300 may be disposed on the hollow layer plate 30 and detects the temperature of the pre-firing element 52 of the pre-firing plate 50 supported by the hollow layer plate 30. The number of temperature sensors 300 may correspond to the number of pre-firing elements 52, and the temperature sensors 300 are respectively distributed in the corresponding areas of the pre-firing base vertically projected onto the hollow layer plate 30, so as to detect the temperature of the pre-firing element 52 supported by the corresponding pre-firing base. In other embodiments, the pre-firing furnace body 400 (see...) Figure 1 (and will be detailed later) any location within or exhaust duct 90 (see below) Figure 5 A temperature sensor 300 can also be configured inside.

[0074] Furthermore, the controller 200 can control the flow rate or temperature of the temperature-controlled fluid supplied by the fluid supply device 40 based on the detected temperature of the pre-burning element 52 on the pre-burning plate 50. For example, if the temperature sensor 300 detects that the temperature of the pre-burning element 52 is greater than a first temperature threshold, it sends a cooling signal to the controller 200. In response to the cooling signal, the controller 200 controls the fluid supply device 40 to lower the temperature of the temperature-controlled fluid it supplies or increase the flow rate of the temperature-controlled fluid. On the other hand, if the temperature sensor 300 detects that the temperature of the pre-burning element 52 is less than a second temperature threshold, it sends a heating signal to the controller 200. In response to the heating signal, the controller 200 controls the fluid supply device 40 to raise the temperature of the temperature-controlled fluid it supplies or lower the flow rate of the temperature-controlled fluid; wherein the first temperature threshold is greater than the second temperature threshold.

[0075] Thus, the controller 200 can control the temperature of the pre-burning plate 50 and the pre-burning element 52 within a certain temperature range (e.g., the temperature range formed by a first temperature threshold and a second temperature threshold) via the fluid supply device 40. The controller 200 is, for example, but not limited to, a central processing unit, a microprocessor, an application-specific integrated circuit (ASIC), or a system on a chip (SOC) and other computing circuits.

[0076] In some embodiments, the controller 200 is also connected to the exhaust device 100, and the controller 200 controls the exhaust volume (i.e., operating speed) of the exhaust device 100 based on the detected temperature of the pre-burning element 52 of the pre-burning plate 50, the temperature inside the pre-burning furnace body 400, or the temperature inside the exhaust channel 90. For example, if the temperature sensor 300 detects that the temperature of the pre-burning element 52 is greater than a first temperature threshold, it sends a cooling signal to the controller 200, and the controller 200 responds to the cooling signal by controlling the exhaust device 100 to increase its exhaust volume; if the temperature sensor 300 detects that the temperature of the pre-burning element 52 is less than a second temperature threshold, it sends a heating signal to the controller 200, and the controller 200 responds to the heating signal by controlling the exhaust device 100 to decrease its exhaust volume, thereby enabling the temperature of the pre-burning plate 50 and the pre-burning element 52 to be controlled within a certain temperature range (e.g., the temperature range formed by the first temperature threshold and the second temperature threshold).

[0077] Reference Figure 7This is a partial schematic diagram of a pre-firing device 10 with layered temperature control according to some embodiments of the present invention. In some embodiments, the pre-firing device 10 with layered temperature control further includes a pre-firing furnace body 400 and a temperature control plate 500. The fixing frame 20, the hollow shelf 30, and the pre-firing plate 50 are housed within the pre-firing furnace body 400. The temperature control plate 500 is disposed on one side of the pre-firing furnace body 400 and has a second fluid chamber 510. The first fluid chamber 31 communicates with the second fluid chamber 510, and the second fluid chamber 510 communicates with the fluid supply device 40. In other words, the first fluid chamber 31, the second fluid chamber 510, and the fluid supply device 40 constitute a closed fluid circulation loop.

[0078] In some embodiments, the second fluid chamber 510 may include a supply circuit 511 and a recovery circuit 512. The fluid supply device 40 can supply temperature-controlled fluid to the first fluid chamber 31 through the supply circuit 511, and the fluid supply device 40 can recover the temperature-controlled fluid from the first fluid chamber 31 through the recovery circuit 512. Thus, the temperature-controlled flow system flowing in the first fluid chamber 31 of each hollow laminate 30 converges to the recovery circuit 512 of the second fluid chamber 510, and then flows to the fluid supply device 40 for unified heat exchange treatment (e.g., heating or cooling). The fluid supply device 40 then flows the temperature-controlled fluid that has undergone heat exchange treatment (e.g., heating or cooling) back to the first fluid chamber 31 through the supply circuit 511 of the second fluid chamber 510 to continue controlling the temperature of the pre-fired plate 50. This further enhances the temperature regulation effect on the pre-fired plate 50.

[0079] like Figure 7 As shown, in some embodiments, the exhaust duct 90 and exhaust device 100 are disposed on the temperature control panel 500. The exhaust device 100 is adapted to draw gas from the pre-fired furnace body 400, which flows through the exhaust duct 90 and is then discharged from the pre-fired furnace body 400. Specifically, the exhaust device 100 concentrates the hot air emitted by each pre-fired element 52 of the pre-fired plate 50 supported by each hollow layer plate 30 into the exhaust duct 90 and then discharges it to the atmosphere in a unified manner, without generating heat accumulation effect or thermal crosstalk effect. In this way, the temperature regulation effect on the pre-fired plate 50 and the interior of the pre-fired furnace body 400 can be further enhanced.

[0080] Reference Figure 8This is a partial side view of the pre-burning device 10 with layered temperature control according to some embodiments of the present invention. In some embodiments, the hollow layer plate 30 has a fluid connector 33, which may include a tube 330, a sleeve 331, and a flow channel 333 passing through the tube 330 and the sleeve 331; the tube 330 and the sleeve 331 may be respectively disposed on the hollow layer plate 30 and the temperature control plate 500, and the connection can be completed by inserting the tube 330 into the sleeve 331 or by fitting the sleeve 331 onto the tube 330. Therefore, the first fluid chamber 31 of the hollow layer plate 30 (not shown) can be quickly connected to the second fluid chamber 510 of the temperature control plate 500 through the fluid connector 33, or the two can be quickly disconnected.

[0081] Reference Figure 9 This is a partial side view of the pre-firing device 10 with layered temperature control according to the fifth embodiment of the present invention. In the fifth embodiment, the pre-firing device 10 with layered temperature control also includes a fixing frame 20, a negative pressure plate 80, an exhaust channel 90, and an exhaust device 100. The difference is that in the fifth embodiment, the negative pressure plate 80 is disposed on the fixing frame 20 and is adapted to support the pre-firing plate 50. For example, the fixing frame 20 is connected to both sides of the negative pressure plate 80, and slide rail grooves are provided on both sides of the negative pressure plate 80 to allow the sides of the pre-firing plate 50 to slide into and be fixed on the negative pressure plate 80. The negative pressure plate 80 includes a negative pressure channel 81 and opposing top surfaces (hereinafter referred to as the second top surface TF2) and bottom surfaces (i.e., the second bottom surface BF2). The second top surface TF2 faces the pre-firing plate 50. The second bottom surface BF2 has at least one first air inlet AI1, and the second top surface TF2 has at least one second air inlet AI2. The first air inlet AI1 and the second air inlet AI2 communicate with the negative pressure channel 81.

[0082] Thus, through air convection, the heat emitted by the first bottom surface BF1 of the pre-fired plate 50 and its test circuit 53, which is supported by the negative pressure plate 80, is dissipated (e.g., heat from the air). Figure 9 The air (arrow AF3) can be drawn into the negative pressure channel 81 through the second air inlet AI2, and then the exhaust device 100 uses the exhaust channel 90 to collect the hot air drawn into the negative pressure channels 81 of each layer (such as...). Figure 9 The heat generated by the pre-burned element 52 (as indicated by arrow AF2) is discharged into the atmosphere, thereby avoiding heat accumulation or thermal crosstalk effects on the first bottom surface BF1 of the pre-burned board 50 and its test circuit 53, thus reducing the risk of damage to the pre-burned board 50 and the test circuit 53. Furthermore, through air convection, the heat emitted by the pre-burned element 52 adjacent to the lower layer of the second bottom surface BF2 (such as...) is discharged into the atmosphere, thus avoiding heat accumulation or thermal crosstalk effects on the first bottom surface BF1 of the pre-burned board 50 and its test circuit 53, thereby reducing the risk of damage to the pre-burned board 50 and the test circuit 53. Figure 9The air (arrow AF1) can be drawn into the negative pressure channel 81 through the first air inlet AI1, and then the exhaust device 100 uses the exhaust channel 90 to collect and discharge the hot air drawn into each layer of the negative pressure channel 81 to the atmosphere, so as to avoid the heat accumulation effect or thermal crosstalk effect of the preheating plate 50. In some embodiments, the first air inlet AI1 corresponds to the second air inlet AI2, so that the negative pressure channel 81 has good air extraction capacity. In some embodiments, the distribution positions of the first air inlet AI1 and the second air inlet AI2 can correspond to each other or be staggered.

[0083] Reference Figure 10 This is a partial side view of the pre-burning device 10 with layered temperature control according to the sixth embodiment of the present invention. The difference from the fifth embodiment is that, in the sixth embodiment, the pre-burning device 10 with layered temperature control further includes a base plate 60 and at least one heat-conducting block (e.g., a first heat-conducting block 70A, a second heat-conducting block 70B, and a third heat-conducting block 70C). The heat-conducting blocks are disposed between the pre-burning plate 50 and the base plate 60. The heat-conducting blocks are spaced apart from the base plate 60 by a distance DP1 to dissipate the heat energy of the pre-burning plate 50 into the air within this distance DP1 to form hot air. In other embodiments, the heat-conducting blocks may also be heat dissipation fins to accelerate the heat dissipation of the pre-burning plate 50.

[0084] The base plate 60 is in contact with the second top surface TF2 of the negative pressure layer 80 and has at least one third air inlet AI3. The third air inlet AI3 is connected to the negative pressure channel 81. Thus, through air convection, the first bottom surface BF1 of the preheated plate 50 and its test circuit 53 supported by the negative pressure layer 80 are heated by the hot air generated by the heat-conducting block (such as... Figure 10 The air (arrow AF3) is drawn into the negative pressure channel 81 through the third air inlet AI3 and the second air inlet AI2, and then the exhaust device 100 collects the hot air drawn into the negative pressure channels 81 through the exhaust channel 90 (e.g., Figure 10 The arrow AF2) is discharged to the atmosphere, thereby avoiding the heat accumulation effect or thermal crosstalk effect on the first bottom surface BF1 of the preheating board 50 and its test circuit 53, thus reducing the risk of damage to the preheating board 50 and the test circuit 53.

[0085] In some embodiments, the first air inlet AI1, the second air inlet AI2, and the third air inlet AI3 correspond to each other (specifically, the distribution positions of the first air inlet AI1, the second air inlet AI2, and the third air inlet AI3 correspond to each other) to give the negative pressure channel 81 good air extraction capability. In other embodiments, the distribution positions of the first air inlet AI1, the second air inlet AI2, and the third air inlet AI3 may be staggered. In some embodiments, some of these heat-conducting blocks (e.g., the first heat-conducting block 70A and the third heat-conducting block 70C) contact the pre-burning base (e.g., the first pre-burning base 51A and the second pre-burning base 51B) and are vertically projected onto the corresponding area of ​​the first bottom surface BF1 of the pre-burning plate 50, while other parts of these heat-conducting blocks (e.g., the second heat-conducting block 70B) contact the test circuit 53. In this way, the temperature control of the test circuit 53 and the pre-burning element 52 on the pre-burning base can be further enhanced.

[0086] Reference Figure 11 This is a partial side view of the pre-burning device 10 with layered temperature control according to the seventh embodiment of the present invention. In the seventh embodiment of the pre-burning device 10 with layered temperature control, it also includes a fixing frame 20, a negative pressure plate 80, an exhaust channel 90, an exhaust device 100, and at least one heat-conducting block (e.g., a first heat-conducting block 70A, a second heat-conducting block 70B, and a third heat-conducting block 70C), the difference being that the heat-conducting block is disposed between the pre-burning plate 50 and the negative pressure plate 80. The heat-conducting block is spaced DP2 from the negative pressure plate 80 to dissipate the heat energy of the pre-burning plate 50 into the air within this distance DP2 to form hot air. In other embodiments, the heat-conducting block can also be a heat dissipation fin to accelerate the heat dissipation of the pre-burning plate 50. Through air convection, the hot air is drawn into the negative pressure channel 81 (e.g., through the second air inlet AI2) via the second air inlet AI2. Figure 11 Arrow AF3), and then the exhaust device 100 uses the exhaust duct 90 to collect the hot air drawn in by the negative pressure ducts 81 of each floor (such as arrow AF3), and the exhaust device 100 uses the exhaust duct 90 to collect the hot air drawn in by the negative pressure ducts 81 of each floor (such as arrow AF3). Figure 11 The arrow AF2) is discharged into the atmosphere without generating heat accumulation or thermal crosstalk effects.

[0087] In summary, according to some embodiments, the present invention can uniformly control the temperature of the pre-burning board to improve the temperature uniformity of the pre-burning board (e.g., uniformly remove the heat accumulated on the pre-burning board), thereby increasing the lifespan of the test circuit used to test the function of the pre-burning components, that is, reducing the risk of damage to the pre-burning board and the test circuit.

Claims

1. A pre-firing device with layered temperature control, comprising: Fixture; A hollow laminate, disposed in the fixing frame and having a first fluid chamber, is adapted to support a pre-fired plate; and A fluid supply device adapted to supply temperature-controlled fluid to the first fluid chamber of the hollow laminate.

2. The pre-firing equipment with layered temperature control according to claim 1 further includes: The base plate and at least one heat-conducting block are disposed between the pre-fired plate and the base plate, and the base plate is in contact with the hollow layer plate.

3. The pre-firing equipment with layered temperature control according to claim 1 further includes: At least one heat-conducting block is disposed on the bottom surface of the preheated plate and in contact with the hollow layer plate.

4. The pre-firing equipment with layered temperature control according to claim 1, further comprising: The negative pressure shelf, the exhaust duct, and the exhaust device are arranged below the hollow shelf and include a bottom surface and a negative pressure duct. The bottom surface has at least one air inlet and is connected to the negative pressure duct. The negative pressure duct is connected to the exhaust duct, and the exhaust device is adapted to extract gas from the exhaust duct.

5. The pre-firing equipment with layered temperature control according to claim 1, further comprising: The controller and at least one temperature sensor are disposed on the hollow layer plate and detect the temperature of at least one pre-burning element of the pre-burning plate carried by the hollow layer plate. The controller controls the temperature of the temperature-controlled fluid supplied by the fluid supply device according to the detected temperature of the at least one pre-burning element of the pre-burning plate.

6. The pre-firing equipment with layered temperature control according to claim 1, further comprising: The pre-fired furnace body and temperature control plate are housed in the pre-fired furnace body. The fixing frame, the hollow layer plate and the pre-fired plate are arranged on one side of the pre-fired furnace body and have a second fluid chamber. The second fluid chamber is connected to the first fluid chamber and the fluid supply device.

7. The pre-firing equipment with layered temperature control according to claim 6, further comprising: An exhaust duct and exhaust device are configured on the temperature control panel. The exhaust device is adapted to draw gas from the pre-fired furnace body, which flows through the exhaust duct and is then discharged from the pre-fired furnace body.

8. The pre-fired device with layered temperature control according to claim 6, wherein the hollow layer has a fluid connector, and the second fluid chamber is connected to the first fluid chamber via the fluid connector.

9. A pre-firing device with layered temperature control, comprising: Fixture; A negative pressure shelf is disposed on the fixing frame and adapted to support a pre-fired plate. The negative pressure shelf includes a negative pressure channel and opposing top and bottom surfaces. The top surface faces the pre-fired plate. The bottom surface has at least one first air inlet and the top surface has at least one second air inlet. The at least one first air inlet and the at least one second air inlet are connected to the negative pressure channel. The exhaust duct connects to this negative pressure duct; and An exhaust system suitable for drawing gas from the exhaust duct.

10. The pre-fired device with layered temperature control according to claim 9, wherein the at least one first air inlet corresponds to the at least one second air inlet.

11. The pre-firing equipment with layered temperature control according to claim 9, further comprising: The base plate and at least one heat-conducting block are disposed between the pre-fired plate and the base plate. The base plate contacts the top surface of the negative pressure layer and has at least one third air inlet, which is connected to the negative pressure channel.

12. The pre-fired device with layered temperature control according to claim 11, wherein the at least one first air inlet, the at least one second air inlet, and the at least one third air inlet correspond to each other.

13. The pre-firing equipment with layered temperature control according to claim 9, further comprising: At least one heat-conducting block is disposed between the preheated plate and the negative pressure plate.

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