A semiconductor wafer testing method and system

Abstract

The present application relates to the field of semiconductor, and discloses a kind of semiconductor wafer test method and system, by first obtaining the multimodal detection of wafer to be tested, process history and historical yield data, by pre-processing and fusion analysis division area, generate initial test area map;Then carry out area correlation analysis and defect propagation prediction, generate dynamic risk prediction map;According to the map analysis risk distribution and test time cost, draw test resource allocation index, generate hierarchical difference test resource allocation scheme;Then according to this scheme matching mapping wafer test project configuration, obtain electrical performance test data;Finally, feature extraction and parameter calculation are carried out to the data, combined with risk weight and dynamic threshold comparison analysis, generate wafer yield map and failure analysis report, determine whether wafer or area is qualified, realize the adaptive optimization of test strategy, to effectively balance test cost and efficiency while accurately identifying potential defects.

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