Substrate coating apparatus

Abstract

The application discloses a substrate coating device, comprising: a heat treatment module for heat treating a substrate; a coating module for coating treatment of the substrate; a loading platform for loading a substrate to be treated and unloading a substrate after coating treatment; a substrate conveying module for conveying the substrate between the heat treatment module, the coating module and the loading platform, wherein the substrate conveying module comprises a substrate processing station, a substrate loading and unloading station and a maintenance station, the heat treatment module and the coating module are arranged in the substrate processing station, the loading platform is arranged in the substrate loading and unloading station, and the maintenance station is used for providing a passage for maintenance personnel to enter the substrate conveying module for maintenance. The application achieves the technical effect of reducing the maintenance difficulty of the substrate coating device.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and more particularly to a substrate coating apparatus. Background Technology

[0002] Photolithography is the most critical and repetitive process in the entire semiconductor manufacturing process. The equipment required for photolithography includes coating equipment, exposure equipment, and developing equipment. As one of the most important pieces of equipment in photolithography, coating equipment has a significant impact on improving product integration and yield.

[0003] Figure 1 A coating apparatus 10 arranged in a ring is shown. The coating apparatus 10 includes a substrate heat treatment module 11, a loading stage 12, a substrate transfer module 13, a coating module 14, and a centering module 15. The loading stage 12 is used to load the substrate 20 to be processed and to unload the substrate 20 after coating. The substrate transfer module 13 (e.g., a robotic arm) is used to transfer the substrate 20 between different modules. The coating module 14 is used to coat the surface of the substrate 20 with photoresist. The centering module 15 is used to calibrate the position of the substrate 20 before the substrate transfer module 13 transports the substrate 20 to the coating module 14. The substrate heat treatment module 11 includes several substrate heat treatment devices 110 and several substrate cooling devices 120. The substrate heat treatment devices 110 are used to heat treat the substrate 20, and the substrate cooling devices 120 are used to cool the substrate 20 after heat treatment.

[0004] In the coating equipment 10 described above, since the substrate transfer module 13 is located at the center of the machine, and the substrate heat treatment module 11, loading table 12, coating module 14 and centering module 15 are arranged around the substrate transfer module 13, it is necessary to remove a module (such as the loading table 12) surrounding the substrate transfer module 13 before maintenance personnel can enter the substrate transfer module 13 to perform maintenance operations, which increases the difficulty of equipment maintenance. Summary of the Invention

[0005] To address the aforementioned technical problems, the purpose of this application is to reduce the maintenance difficulty of substrate coating equipment.

[0006] To achieve the above objectives, this application provides a substrate coating apparatus.

[0007] In some embodiments, the substrate coating equipment includes: a heat treatment module for heat treating the substrate; a coating module for coating the substrate; a loading stage for loading the substrate to be processed and unloading the substrate after coating; and a substrate transfer module for transporting the substrate between the heat treatment module, the coating module, and the loading stage. The substrate transfer module is surrounded by a substrate processing station, a substrate loading and unloading station, and a maintenance station. The heat treatment module and the coating module are located at the substrate processing station, the loading stage is located at the substrate loading and unloading station, and the maintenance station provides a passage for maintenance personnel to enter the substrate transfer module for maintenance.

[0008] This application reduces the maintenance difficulty of substrate coating equipment by reserving maintenance workstations around the substrate transfer module to provide maintenance personnel with access to the substrate transfer module for maintenance. Attached Figure Description

[0009] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this application.

[0010] Figure 1 This is a schematic plan view of an existing substrate coating device;

[0011] Figure 2 This is a plan view of a substrate coating apparatus according to an embodiment of this application;

[0012] Figure 3 yes Figure 2 The left view;

[0013] Figure 4 yes Figure 2 The right view;

[0014] Figure 5 yes Figure 2 A right view of another implementation;

[0015] Figure 6 This is a plan view of a substrate coating apparatus according to an embodiment of this application;

[0016] Figure 7 This is a plan view of a substrate coating apparatus according to an embodiment of this application;

[0017] Figure 8 yes Figure 7 Rear view;

[0018] Figure 9 This is a schematic diagram of a heat treatment cavity according to an embodiment of this application;

[0019] Figure 10This is a schematic diagram of a coating cavity according to an embodiment of this application;

[0020] Figure 11 This is a schematic diagram of a cooling cavity according to an embodiment of this application; and

[0021] Figure 12 This is a plan view of a centering device according to an embodiment of this application. Detailed Implementation

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0023] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0024] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] Figure 2This illustration shows a substrate coating apparatus 30 according to an embodiment of this application. The substrate coating apparatus 30 includes a heat treatment module 31, a coating module 32, a loading stage 33, and a substrate transfer module 34. The heat treatment module 31 is used to heat treat a substrate 20, the coating module 32 is used to coat the substrate 20, the loading stage 33 is used to load the substrate 20 to be processed (e.g., an 8-inch or 12-inch wafer), and unload the coated substrate 20. The substrate transfer module 34 (e.g., a robotic arm 55) is used to transport the substrate 20 between the heat treatment module 31, the coating module 32, and the loading stage 33. The substrate transfer module 34 is surrounded by a substrate processing station 41, a substrate loading and unloading station 44, and a maintenance station 45. The heat treatment module 31 and the coating module 32 are disposed at the substrate processing station 41, the loading stage 33 is disposed at the substrate loading and unloading station 44, and the maintenance station 45 provides a passage for maintenance personnel to enter the substrate transfer module 34 for maintenance.

[0027] This application provides a maintenance station 45 around the substrate transfer module 34 to provide maintenance personnel with a channel to enter the substrate transfer module 34 for maintenance, thereby reducing the maintenance difficulty of the substrate coating equipment 30.

[0028] In one embodiment of this application, the substrate processing station 41 includes a first substrate processing station 42 and a second substrate processing station 43. A heat treatment module 31 is located at the first substrate processing station 42, and a coating module 32 is located at the second substrate processing station 43. The first substrate processing station 42 and the second substrate processing station 43 are arranged on both sides of the substrate transfer module 34, and a substrate loading / unloading station 44 and a maintenance station 45 are arranged on the other two sides of the substrate transfer module 34. It should be noted that the first substrate processing station 42 and the second substrate processing station 43 can be configured as follows: Figure 2 The substrate transmission module 34 can be arranged on opposite sides as shown, or it can be arranged on adjacent sides of the substrate transmission module 34.

[0029] In this embodiment, the heat treatment module 31, the coating module 32, and the mounting stage 33 are arranged around the substrate transfer module 34. The substrate transfer module 34 only needs to be equipped with a robot arm 55 to complete the transfer of the substrate 20 between the modules, which reduces the design difficulty of the substrate coating equipment 30.

[0030] In one embodiment of this application, the substrate coating equipment 30 includes a housing 38. The heat treatment module 31, the coating module 32, and the substrate transfer module 34 are located inside the housing 38. A maintenance door 381 is provided on the side of the housing 38 corresponding to the maintenance station 45, so that maintenance personnel can enter the substrate transfer module 34 through the maintenance door 381 to perform maintenance.

[0031] Combination Figure 3 and Figure 4As shown, in one embodiment of this application, the heat treatment module 31 includes at least one row of heat treatment cavities 52 and / or cooling cavities 53 stacked in the vertical direction. The coating module 32 includes at least one row of coating cavities 51 stacked in the vertical direction.

[0032] In this embodiment, by stacking the coating chamber 51, the heat treatment chamber 52 and the cooling chamber 53 in the vertical direction, the number of each process chamber in the substrate coating equipment 30 is increased, thereby improving the production capacity of the substrate coating equipment 30.

[0033] Refer again Figure 3 In one embodiment of this application, the substrate coating apparatus 30 further includes a centering device 54, which is used to perform position calibration on the substrate 20 to be processed and / or the substrate 20 after coating.

[0034] In one embodiment of this application, the centering device 54 is located at the first substrate processing station 42 and is stacked in the vertical direction with the heat treatment cavity 52 and / or the cooling cavity 53.

[0035] Combination Figure 2 and Figure 5 As shown, in one embodiment of this application, the centering device 54 is located at the second substrate processing station 43 and is stacked vertically with the coating cavity 51. For example, the coating module 32 includes two coating cavities 51, one above the other, and the centering device 54 is disposed between the two coating cavities 51, or above or below the two coating cavities 51.

[0036] like Figure 6 As shown, in one embodiment of this application, the substrate processing station 41 includes a third substrate processing station 46, the centering device 54 is located in the third substrate processing station 46, and the third substrate processing station 46 and the maintenance station 45 are located on the same side of the substrate transfer module 34.

[0037] In this embodiment, by placing the third substrate processing station 46 and the maintenance station 45 on the same side of the substrate transfer module 34, and by placing the alignment device 54 at the third substrate processing station 46, relative to... Figure 3 The embodiment shown avoids the centering device 54 occupying the first substrate processing station 42, thereby increasing the number of heat treatment chambers 52 and cooling chambers 53 installed.

[0038] In one embodiment of this application, a maintenance door 382 or maintenance door 383 is provided on the side of the housing 38 corresponding to the maintenance station 45, so that maintenance personnel can enter the housing 38 through the maintenance door 382 or maintenance door 383 and enter the substrate transmission module 34 for maintenance via the maintenance station 45.

[0039] like Figure 7 and Figure 8 As shown, in one embodiment of this application, the third substrate processing station 46 is located above the maintenance station 45. Furthermore, the third substrate processing station 46 and the maintenance station 45 are located between the first substrate processing station 42 and the second substrate processing station 43.

[0040] In this embodiment, by placing the third substrate processing station 46 above the maintenance station 45, the alignment device 54 is prevented from obstructing maintenance personnel from entering the substrate transfer module 34 for maintenance. Furthermore, by positioning the third substrate processing station 46 and the maintenance station 45 between the first substrate processing station 42 and the second substrate processing station 43, on the one hand, relative to... Figure 5 The embodiment shown avoids the centering device 54 occupying the second substrate processing station 43; on the other hand, relative to Figure 6 The embodiment shown reduces the overall horizontal footprint of the substrate coating equipment 30.

[0041] In one embodiment of this application, a maintenance door 384 is provided on the side of the housing 38 corresponding to the maintenance station 45, and the maintenance door 384 is lower than the centering device 54, so that maintenance personnel can enter the housing 38 through the maintenance door 384 and enter the substrate transfer module 34 for maintenance via the maintenance station 45.

[0042] In one embodiment of this application, the centering device 54 has preset distances m1 and m2 between itself and the heat treatment module 31 and the coating module 32, respectively. These preset distances m1 and m2 are configured such that the substrate transfer module 34 can transport the substrate 20 to the coating cavity 51, the heat treatment cavity 52, and / or the cooling cavity 53 located on either side of the centering device 54 via either the preset distances m1 or m2. It should be noted that the preset distances m1 and m2 can be configured to be equal, i.e., the centering device 54 is located precisely in the middle of the heat treatment module 31 and the coating module 32, or they can be configured to be unequal, i.e., the centering device 54 is located between and close to either the heat treatment module 31 or the coating module 32.

[0043] In this embodiment, the centering device 54 has preset distances m1 and m2 between itself and the heat treatment module 31 and the coating module 32, respectively, to prevent the centering device 54 from blocking the substrate transfer module 34 from transporting the substrate 20 to the coating cavity 51, heat treatment cavity 52 and cooling cavity 53 on both sides of the centering device 54.

[0044] Refer again Figure 3 and Figure 4In one embodiment of this application, the substrate coating apparatus 30 further includes a control module 35, a gas supply module 36, and a processing liquid supply module 37. The control module 35 is located at the top of the heat treatment module 31 and / or the coating module 32, and is used to control the substrate transfer module 34, the heat treatment module 31, and the coating module 32. The gas supply module 36 is located at the bottom of the heat treatment module 31 and is used to supply process gases, such as nitrogen, to the heat treatment module 31. The processing liquid supply module 37 is located at the bottom of the coating module 32 and is used to supply processing liquids, such as photoresist, to the coating module 32.

[0045] like Figure 9 As shown, in one embodiment of this application, the heat treatment chamber 52 includes a hot plate 521, a substrate lifting mechanism 522, an upper chamber 523, a lower chamber 524, and a lifting mechanism 525. The upper chamber 523 is located above the lower chamber 524, and the lower chamber 524 is used to accommodate the hot plate 521, which is equipped with an electric heating element (not shown in the figure). The lower chamber 524 is provided with an air inlet 5241 for supplying clean gas into the heat treatment chamber 52 during the heat treatment of the substrate 20, and the top of the upper chamber 523 is provided with an exhaust port 5231 for discharging impurity gas from the interior of the heat treatment chamber 52 during the heat treatment of the substrate 20. The lifting mechanism 525 is used to drive the upper cavity 523 to rise and fall, so as to separate the upper cavity 523 and the lower cavity 524 from each other during the loading / unloading of the substrate 20. The robot arm 55 transports the substrate through the gap between the upper cavity 523 and the lower cavity 524. During the heat treatment of the substrate 20, the lifting mechanism 525 drives the upper cavity 523 and the lower cavity 524 to close, so as to isolate the internal environment of the heat treatment chamber 52 from the external environment. The substrate lifting mechanism 522 includes a plurality of ejector pins 5221 that vertically penetrate the hot plate 521 and an ejector pin lifter 5222. The ejector pin lifter 5222 is used to drive the ejector pins 5221 to move up and down relative to the hot plate 521, so as to lift the substrate 20 during the loading / unloading of the substrate 20, so as to separate the substrate 20 from the hot plate 521, so as to facilitate the robot arm 55 to lift and move the substrate 20 from below.

[0046] like Figure 10As shown, in one embodiment of this application, the coating chamber 51 includes a chamber 511, a substrate carrying mechanism 512 (e.g., a vacuum chuck), a processing liquid storage mechanism 513, a nozzle 514, a nozzle moving mechanism 515, a rotation drive component 516, and a cover 517. The substrate carrying mechanism 512 is disposed within the chamber 511 and is used to carry the substrate 20. The processing liquid storage mechanism 513 is used to store processing liquid. The nozzle 514 is disposed within the chamber 511 and connected to the processing liquid storage mechanism 513, and is used to spray processing liquid (e.g., photoresist) onto the substrate 20. The nozzle moving mechanism 515 is drive-connected to the nozzle 514, and is used to drive the nozzle 514 to move above the center of the substrate 20 during the coating process, and to drive the nozzle 514 to move away from directly above the substrate 20 after the coating process is completed. The rotation drive component 516 is drive-connected to the substrate carrying mechanism 512, and is used to drive the substrate carrying mechanism 512 and the substrate 20 to rotate during the coating process. The cover 517 is disposed outside the substrate support mechanism 512, and the bottom of the cover 517 is provided with a drain port 5171 for collecting and recovering excess processing liquid during the coating process.

[0047] like Figure 11 As shown, in one embodiment of this application, the cooling cavity 53 includes a housing 531, a cold plate 532, and a substrate lifting mechanism 534. The cold plate 532 is located inside the housing 531 and is used to support and cool the substrate. An opening 533 for conveying the substrate 20 is provided on the side of the housing 531. A liquid cooling pipe (not shown in the figure) is provided inside the cold plate 532 to reduce the temperature of the cold plate 532 for cooling the substrate 20. The substrate lifting mechanism 534 includes a plurality of ejector pins 5341 that vertically penetrate the cold plate 532 and an ejector pin lifter 5342. The ejector pin lifter 5342 is used to drive the ejector pins 5341 to move up and down relative to the cold plate 532 to lift the substrate 20 during loading / unloading, so that the substrate 20 is separated from the cold plate 532, making it easier for the robot arm 55 to lift and move the substrate 20 from below.

[0048] like Figure 12 As shown, in one embodiment of this application, the centering device 54 includes a housing (not shown), a substrate support mechanism 541, a clamping assembly 542, and a driving mechanism 543. The substrate support mechanism 541 and the clamping assembly 542 are located inside the housing. The substrate support mechanism 541 supports the substrate 20. The clamping assembly 542 includes a first clamping member 5421 and a second clamping member 5422. The first clamping member 5421 and the second clamping member 5422 are symmetrically arranged on both sides of the substrate support mechanism 541. During the centering process of the substrate 20, the driving mechanism 543 drives the first clamping member 5421 and the second clamping member 5422 to move towards each other so that the center of the substrate 20 coincides with the center of the substrate support mechanism 541, thereby achieving centering of the substrate 20.

[0049] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this application. For those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A substrate coating apparatus, characterized in that, include: A heat treatment module is used for heat treatment of the substrate; A coating module is used to coat the substrate. A loading stage is used to load the substrate to be processed and to unload the substrate after the coating process has been completed. A substrate transfer module is used to transfer substrates between the heat treatment module, the coating module, and the mounting stage. The substrate transfer module is surrounded by a substrate processing station, a substrate loading and unloading station, and a maintenance station. The heat treatment module and the coating module are located at the substrate processing station, the mounting stage is located at the substrate loading and unloading station, and the maintenance station is used to provide maintenance personnel with a passage to enter the substrate transfer module for maintenance.

2. The substrate coating apparatus according to claim 1, characterized in that, The substrate processing station includes a first substrate processing station and a second substrate processing station, the heat treatment module is located at the first substrate processing station, and the coating module is located at the second substrate processing station. The first substrate processing station and the second substrate processing station are arranged on both sides of the substrate transfer module, and the substrate loading and unloading station and the maintenance station are arranged on the other two sides of the substrate transfer module.

3. The substrate coating apparatus according to claim 2, characterized in that, The coating module includes at least one column of coating cavities stacked vertically. The heat treatment module includes at least one column of heat treatment chambers and / or cooling chambers stacked in the vertical direction.

4. The substrate coating apparatus according to claim 3, characterized in that, include: A centering device is used to perform position calibration on the substrate to be processed and / or the substrate that has undergone coating treatment.

5. The substrate coating apparatus according to claim 4, characterized in that, The centering device is located at the first substrate processing station and is stacked vertically with the heat treatment cavity and / or the cooling cavity.

6. The substrate coating apparatus according to claim 4, characterized in that, The centering device is located at the second substrate processing station and is stacked vertically with the coating cavity.

7. The substrate coating apparatus according to claim 4, characterized in that, The substrate processing station further includes a third substrate processing station, the centering device is located at the third substrate processing station, and the third substrate processing station and the maintenance station are located on the same side of the substrate transmission module.

8. The substrate coating apparatus according to claim 7, characterized in that, The third substrate processing station is located above the maintenance station.

9. The substrate coating apparatus according to claim 8, characterized in that, The third substrate processing station and the maintenance station are located between the first substrate processing station and the second substrate processing station.

10. The substrate coating apparatus according to claim 9, characterized in that, The centering device has a preset distance between itself and the coating module and the heat treatment module, respectively. The preset distance is configured such that the substrate transfer module can transport the substrate to the coating cavity, the heat treatment cavity and / or the cooling cavity located on both sides of the centering device through the preset distance.

11. The substrate coating apparatus according to claim 1, characterized in that, include: A control module, located on top of the heat treatment module and / or the coating module, is used to control the substrate transfer module, the heat treatment module, and the coating module.

12. The substrate coating apparatus according to claim 1, characterized in that, include: A gas supply module, located at the bottom of the heat treatment module, is used to supply process gas to the heat treatment module.

13. The substrate coating apparatus according to claim 1, characterized in that, include: The processing liquid supply module, located at the bottom of the coating module, is used to supply processing liquid to the coating module.

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