Display device

Abstract

Disclosed is a display device including a display panel including a short side extending in a first direction, a long side extending in a second direction, and a corner where the short side and the long side intersect, and a molding portion including a first molding portion provided on the short side, a second molding portion provided on the long side, and a third molding portion provided at the corner, and a first pattern in which the third molding portion is recessed from a lower surface of the third molding portion can be provided in the third molding portion.

Description

Technical Field

[0001] Embodiments of this disclosure relate to an apparatus, and in particular, for example, but not limited to, a display apparatus. Background Technology

[0002] With the development of the information society, the demand for display devices for displaying images is increasing, and various types of display devices are being used, such as liquid crystal displays and organic light-emitting diode displays.

[0003] The display device may include a plurality of pixels and a plurality of switching elements configured to drive and control the pixels.

[0004] The descriptions provided in the background section should not be construed as prior art simply because they are mentioned in or associated with that section. The background section may include information describing one or more aspects of the subject matter art, and the descriptions in that section do not limit this disclosure. Summary of the Invention

[0005] Therefore, one object of the embodiments of this disclosure is to overcome the above-mentioned disadvantages of the prior art, and the embodiments of this disclosure can provide a display device that can reduce the impact transmitted from the molding process when the display device is dropped or subjected to external impact.

[0006] Another objective of this embodiment is to provide a display device that can reduce the stress applied to the molding process in a high-temperature environment.

[0007] The aspects of this disclosure are not limited to those described above, and other aspects and advantages not mentioned above may be clearly understood from the following description and may be more clearly understood from the embodiments set forth herein.

[0008] To achieve the objectives of this disclosure, a display device according to one embodiment of this disclosure may include: a display panel including a short side extending along a first direction, a long side extending along a second direction, and a corner where the short side and the long side intersect; and a molding portion including a first molding portion disposed on the short side, a second molding portion disposed on the long side, and a third molding portion disposed on the corner. A first pattern may also be provided on the third molding portion, causing the third molding portion to be recessed from its lower surface.

[0009] In another aspect, a display device according to embodiments of the present disclosure may include: a display panel including a main region, a sub-region overlapping the main region, and a curved region between the main region and the sub-region; a molded portion disposed on the outer side of the display panel; and a cover layer on the display gap. A pattern may be disposed in the molded portion on at least one of a plurality of edges and a plurality of corners of the display panel, and the pattern may overlap with the cover layer.

[0010] Detailed descriptions of other embodiments are provided in the detailed description and accompanying drawings.

[0011] According to embodiments of this disclosure, a third molded portion disposed at a corner of the display panel may include a first pattern, thereby reducing the impact transmitted from the molding when the display device is dropped or subjected to external impact.

[0012] Furthermore, in the display device according to the embodiments of the present disclosure, the molding portions provided on the upper, lower, left and right sides of the display panel may include patterns, thereby reducing the impact transmitted from the molding when the display device is dropped or subjected to external impact.

[0013] Furthermore, in the display device according to the embodiments of the present disclosure, the third molding portion provided at the corner of the display panel may include a first pattern, thereby alleviating stress concentration in the molding portion under high temperature conditions.

[0014] Furthermore, in the display device according to the embodiments of this disclosure, the lifespan can be improved by reducing impact and alleviating stress.

[0015] In addition to the effects described above, the specific effects of this disclosure will be explained in conjunction with the following detailed description of its implementation.

[0016] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0017] The accompanying drawings illustrate embodiments of the present disclosure and, together with the description, serve to illustrate the principles of the disclosure. The drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this application. In the drawings:

[0018] Figure 1 This is a plan view showing a display device according to one embodiment;

[0019] Figure 2 It is shown Figure 1 The diagram shows a cross-sectional view of the display in a bent state.

[0020] Figure 3 It is shown Figure 1A plan view showing the curved state of the display.

[0021] Figure 4 yes Figure 3 A plan view of the molding section shown;

[0022] Figure 5 It is along Figure 3 A cross-sectional view taken from A-A';

[0023] Figure 6 It is along Figure 3 A cross-sectional view taken at B-B';

[0024] Figure 7 It is along Figure 3 A cross-sectional view taken at C-C';

[0025] Figure 8 It is along Figure 3 A cross-sectional view taken from D-D';

[0026] Figure 9 The illustration shows a display device being dropped according to one embodiment and the magnitude of the impulse acting on the display device over time;

[0027] Figure 10 It is a plan view of the molding section according to one embodiment;

[0028] Figure 11 It is a graph showing the improvement in impact on the display device;

[0029] Figure 12 This is a plan view of the molding section according to another embodiment;

[0030] Figure 13 This is a cross-sectional view of a display device according to another embodiment;

[0031] Figure 14 This is a plan view of the molding section according to yet another embodiment; and

[0032] Figure 15 This is a plan view of the molding section according to another embodiment. Detailed Implementation

[0033] In the following description, a display device according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0034] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals may denote the same or similar parts.

[0035] It should be understood that when a component is described as "connected to another component," "on another component," or "connected to another component," the component may be directly connected to the other component, or there may be an intermediate component. Conversely, when a component is described as "directly connected" to another component, there is no intermediate component.

[0036] "And / or" includes any combination of one or more of the associated elements that can be defined.

[0037] Terms such as “below,” “under,” “above,” and “over” are used to describe the positional relationship between the elements shown in the accompanying drawings. These terms are relative concepts and are described relative to the direction shown in the drawings. Conversely, when an element is described as being “directly connected” to another element, there is no intermediate element. One or more other elements may also be present unless “exactly” or “directly” is used when describing positional relationships (e.g., “above,” “below,” “next to,” etc.).

[0038] Throughout this disclosure, each component may be provided as a single component or as multiple components unless expressly stated otherwise. Terms such as “comprising” or “having” are used herein and should be understood to indicate the presence of several components, functions, or steps disclosed in the specification, and should also be understood to mean that more or fewer components, functions, or steps may be utilized. Singular representations may include plural representations unless their meaning is explicitly different from that in the context. When interpreting a component, a range of tolerances should be included, even without a separate explicit description.

[0039] Features of various implementations can be combined with each other in part or in whole, and various connections and drives are possible. Furthermore, implementations can be implemented independently or in relation to each other.

[0040] In the following description, if a detailed description of a well-known function or configuration related to this document is determined to unnecessarily obscure the essential points of the inventive concept, such detailed description will be omitted or may be briefly discussed.

[0041] Any implementation described as an "example" in this article is not necessarily to be interpreted as preferred or superior to other implementations.

[0042] When describing temporal relationships, discontinuous cases may be included if the temporal order is described as such as “after,” “following,” “next,” and “before,” unless more restrictive terms such as “just,” “immediately,” or “directly” are used.

[0043] In describing the elements of this disclosure, the terms “first,” “second,” “A,” “B,” “(a),” and “(b)” may be used. These terms may be used only to distinguish one element from another, and the nature, sequence, order, or number of the corresponding elements shall not be limited by the terms. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0044] The term “at least one” should be understood to include any and all combinations of one or more of the associated listed items. For example, “at least one of the first element, the second element, and the third element” means a combination of all three listed elements, a combination of any two of the three elements, and each individual element: the first element, the second element, or the third element.

[0045] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments pertain. It should also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal sense unless explicitly defined herein. For example, the terms “part” or “unit” can be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the functions described herein that would be understood by one of ordinary skill in the art.

[0046] The display device according to the accompanying drawings and embodiments will be described below.

[0047] Figure 1 This is a plan view showing a display device according to one embodiment.

[0048] Reference Figure 1 According to one embodiment, the display device 1 may include a display panel 100. The display panel 100 may include: a display area DA, which includes a plurality of pixels PX; and a non-display area NDA adjacent to the display area DA. The display area DA may have a rectangular shape. However, the embodiment is not limited to this, and the planar shape of the display area DA may be a square, a circle, an ellipse, or other polygonal shape. For example, the display area (DA) may be a rectangular shape with rounded corners (or curved surfaces), but the embodiment is not limited to this, and it may also be a rectangular shape with sharp corners.

[0049] In the implementation, the first direction DR1 and the second direction DR2 are different directions and represent directions that intersect each other, such as directions that intersect perpendicularly in a plane. Figure 1In this embodiment, the first direction DR1 may be substantially the same as the extension direction of the short side of the display panel 100, and the second direction DR2 may be the same as the extension direction of the long side of the display panel 100. However, it should be understood that the directions mentioned in the embodiment refer to relative directions, and the embodiment is not limited to the mentioned directions.

[0050] The display area DA may include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. The non-display area NDA may surround the display area DA. The non-display area NDA may be arranged on one side of the display area DA along the first direction DR1, the other side of the first direction DR1, one side of the display area DA along the second direction DR2, and the other side of the display area DA along the second direction DR2.

[0051] The display panel 100 may include a non-display area NDA_S and a sensor hole SH surrounded by the non-display area NDA_S. The sensor hole SH may be surrounded by the display area DA on a plane. For example... Figure 1 As shown, one sensor hole SH can be provided, but the implementation is not limited to this. For example, two sensor holes SH can be provided, and each of the two sensor holes SH may include a sensor hole in which an infrared sensor is arranged and a sensor hole in which a camera sensor is arranged, but the implementation is not limited to this.

[0052] The gating driver GIP can be positioned on each non-display area NDA located on one side of the first direction DR1 of the display area DA and on the other side of the first direction DR1. The low-voltage line VSSL can be positioned outside the gating driver GIP on the non-display area NDA. For example, as... Figure 1 As shown, the low-voltage line VSSL can extend from the printed circuit board FPCB, pass through the sub-region SR and the curved region BR, be located outside the gating driver GIP on the non-display region ND, and be arranged to surround the display region DA.

[0053] The non-display area NDA located below the second direction DR2 of the display area DA can extend further downwards from the center of the other side of the second direction DR2 of the display area DA. In the central portion below the second direction DR2 of the display area DA, the width of the non-display area NDA extending further downwards on the first direction DR1 can be smaller than the width of the non-display area NDA adjacent to the lower side of the second direction DR2 of the display area DA on the first direction DR1.

[0054] Display device 1 may include a main region MR, a sub-region SR, and a curved region BR between the main region MR and the sub-region SR. The main region MR may be formed by the display region DA and the non-display region NDA surrounding the four sides of the display region DA, as described above. The curved region BR and the sub-region SR may be formed in the central portion below the second direction DR2 of the display region DA, extending further downwards. The curved region BR may be disposed between the sub-region SR and the main region MR. The sub-region SR may include a first pad region PA1 and a second pad region PA2 disposed at the lower end of the second direction DR2 of the sub-region SR. Display device 1 may also include a data driver DIC and a printed circuit board FPCB. The data driver DIC may be disposed in the first pad region PA1, and the printed circuit board FPCB may be attached to the second pad region PA2. Multiple pads connected to the data driver DIC and the printed circuit board FPCB may be arranged in the first pad region PA1 and the second pad region PA2. For example, the data driver DIC may be formed as a driver chip IC, but the implementation is not limited thereto. In one embodiment, the data driver DIC is arranged as a chip-on-plastic directly mounted on the display panel 100, but the embodiment is not limited to this and may be arranged as a chip-on-glass or a chip-on-film.

[0055] According to one embodiment, the display panel 100 may further include a crack detection pattern CRP. A low-voltage line VSSL may be arranged between the display area DA and the crack detection pattern CRP. The crack detection pattern CRP may be arranged to completely surround the display area DA, such as... Figure 1 As shown. For example, the crack detection pattern CRP can also be placed between the cover portion CLP and the low voltage line VSSL. However, the embodiments of this specification are not limited to this, and the crack detection pattern CRP may not be placed in a portion of the non-display area NDA on the other side of the second direction DR2 of the display area DA. In some embodiments, the crack detection pattern can be formed as a circuit in the non-display area NDA on one side of the second direction DR2 of the display area DA. In this case, the crack detection pattern can be composed of two wires, one of which can be located on the left side (or the lower side of the second direction DR2), and the other can be located on the right side (or one side of the second direction DR2).

[0056] Figure 2 It shows that Figure 1 The diagram shows a cross-sectional view of the display in a bent state.

[0057] Reference Figure 2According to one embodiment, the curved region BR of the display panel 100 of the display device 1 can be curved in the thickness direction DR3 (or in the lower direction relative to a third direction). Thus, the main region MR and the sub-region SR can overlap in the thickness direction DR3. The display panel 100 can be curved such that the lower surface of the main region MR and the upper surface of the sub-region SR face each other. A printed circuit board (FPCB) can be attached to the end of the sub-region SR.

[0058] Figure 3 It shows that Figure 1 The diagram shows a plan view of the curved state of the display.

[0059] Reference Figure 3 The display device 1 may also include a molded part MDP and a housing HSP.

[0060] The curved area BR of the display panel 100 is curved, allowing the sub-area SR to overlap with the main area MR. The printed circuit board FPCB and the data driver DIC can each overlap with the main area MR.

[0061] The molded portion MDP can be disposed on the exterior of the display panel 100. The molded portion MDP can be disposed along the edge of the curved display panel 100. The molded portion MDP can directly contact the side surface of the curved display panel 100. The molded portion MDP can include organic materials. Figure 3 As shown, the molded part MDP may include an organic material that repeatedly shrinks and expands based on heat.

[0062] The housing HSP can be disposed on the outer side of the display panel 100 and the molded part MDP. The housing HSP can be disposed along the edge of the molded part MDP.

[0063] Figure 4 yes Figure 3 The diagram shows a plan view of the molding section.

[0064] Reference Figure 3 and Figure 4 The molding portion MDP may include a first molding portion MDP1 to a fourth molding portion MDP4. The first molding portion MDP1 may be located on the upper short side of the display panel in the second direction DR2. The second molding portion MDP2 may be located on the left and right short sides of the display panel 100. The third molding portion MDP3 may be located at a corner of the display panel 100, and the fourth molding portion MDP4 may be located on the lower short side of the display panel 100 in the second direction DR2.

[0065] The first molding portion MDP1 may have a first width W1 along the second direction DR2. The fourth molding portion MDP4 includes a first portion MDP41 having a second width W2 and a second portion MDP42 having a third width W3. Here, the second width W2 may be greater than the third width W3. The first portion MDP41 and the second portion MDP42 may be arranged repeatedly in the first direction DR1, but the implementation is not limited to this.

[0066] The first pattern H1 can be arranged in the third molding section MDP3. The first pattern H1 can be arranged in multiple ways, such as two or more patterns, but the implementation is not limited to this. Since the third molding section MDP3 includes a curved shape similar to the corner of the display panel 100, the first pattern H1 of the third molding section MDP3 can also have a linear shape extending in a curved shape, but the implementation is not limited to this. Adjacent first patterns H1 are spaced apart from each other, and can be spaced apart by a predetermined interval distance d. Adjacent first patterns H1 can be spaced apart in either direction between the first direction DR1 and the second direction DR2.

[0067] Figure 5 It is along Figure 3 The cross-sectional view taken along line A-A'. (Reference) Figure 5 The display panel 100 may include a substrate 101, a buffer layer 102, a first thin film transistor 120, a second thin film transistor 130, a storage electrode 140, a light-emitting part 150, an encapsulation part 170, a touch part 180, and an upper organic layer 190.

[0068] The substrate 101 may include one or more plastic materials. For example, the substrate 101 may be a multi-substrate including various plastic materials such as polyimide, but the embodiments are not limited thereto. For example, the substrate 101 may include a first substrate portion 101a, a second substrate portion 101b, and a third substrate portion 101c, each of the first substrate portion 101a and the second substrate portion 101b including a plastic material, and the third substrate portion 101c including an inorganic material between the first substrate portion 101a and the second substrate portion 101b, but the embodiments are not limited thereto.

[0069] A buffer layer 102 may be disposed on the substrate 101. The buffer layer 102 may minimize or delay the diffusion of moisture or oxygen that permeates the substrate 101. The buffer layer 102 may be formed by alternately stacking silicon nitride (SiNx) and silicon oxide (SiOx) at least once, but the implementation is not limited to this.

[0070] The first light-shielding layer 126 may be disposed on the buffer layer 102. The first light-shielding layer 126 may be configured to prevent or reduce external light transmission to the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 may be disposed overlapping the first light-shielding layer 126.

[0071] The first insulating layer 103 may be disposed on the first light-shielding layer 126. The first insulating layer 103 may be made of the same material as the buffer layer 102, but the implementation is not limited thereto.

[0072] The first thin-film transistor 120 may be disposed on the first insulating layer 103. The first thin-film transistor 120 may include a first source 121, a first gate 122, a first semiconductor layer 123, and a first drain 124.

[0073] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include a metal oxide semiconductor such as IGZO (indium gallium zinc oxide), a silicon-based semiconductor material such as amorphous silicon or polycrystalline silicon, but the embodiments are not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0074] The second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be made of the same material as the first insulating layer 103, but the implementation is not limited thereto.

[0075] The first gate 122 may be disposed on the second insulating layer 104. The first gate 122 may be disposed on the second insulating layer 104 to overlap with the channel region of the first semiconductor layer 123. The first gate 122 may be composed of a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or compounds thereof, but the embodiments are not limited thereto. The first gate 122 may be disposed together with a gate line.

[0076] The third insulating layer 105 may be disposed on the first gate 122. The third insulating layer 105 may be made of the same material as the first insulating layer 103 or the second insulating layer 104.

[0077] A first source 121 and a first drain can be disposed on the third insulating layer 105.

[0078] The first source 121 and the first drain 124 can be electrically connected to the first semiconductor layer 123 through contact holes. The first source 121 and the first drain 124 can be formed of a metallic material.

[0079] The first source 121 and the first drain 124 can be arranged together with the data line.

[0080] The storage electrode 140 may be spaced apart from the first thin-film transistor 120. The storage electrode 140 may include a first storage electrode 141 and a second storage electrode 142.

[0081] The first storage electrode 141 may be arranged in the same layer having the same material as the first gate 122, but the implementation is not limited to this.

[0082] The second storage electrode 142 can be disposed on the first storage electrode 141. The second storage electrode 142 can be disposed on the third insulating layer 105, and a capacitor can be formed by using the third insulating layer 105 between the first storage electrode 141 and the second storage electrode 142 as a dielectric.

[0083] The second thin-film transistor 130 may be configured to be spaced apart from the first thin-film transistor 120 and the storage electrode 140. The second thin-film transistor 130 may include a second source 131, a second gate 132, a second semiconductor layer 133, and a second drain 134.

[0084] The second light-shielding layer 136 can be disposed on the same layer as the second storage electrode 142.

[0085] The second semiconductor layer 133 can be arranged to overlap with the second light-shielding layer 136.

[0086] The fourth insulating layer 106 may be disposed on the second light-shielding layer 136. The fourth insulating layer 106 may be made of the same material as the first insulating layer 103, the second insulating layer 104 or the third insulating layer 105, but the implementation is not limited to this.

[0087] The second semiconductor layer 133 may be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0088] The second semiconductor layer 133 may include metal oxide semiconductors such as IGZO (indium gallium zinc oxide), silicon-based semiconductor materials such as amorphous silicon or polycrystalline silicon, but the implementation is not limited thereto.

[0089] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105 or the fourth insulating layer 106, but the implementation is not limited to this.

[0090] The second gate 132 can be disposed on the fifth insulating layer 108.

[0091] The second gate 132 may be made of the same material as the first gate 122.

[0092] The sixth insulating layer 109 may be disposed on the second gate 132. The sixth insulating layer 109 may be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, the fourth insulating layer 106 or the fifth insulating layer 108, but the implementation is not limited to this.

[0093] The first source 121, the first drain 124, the third storage electrode 143, the second source 131, and the second drain 134 can be arranged on the sixth insulating layer 109.

[0094] The second source 131 and the second drain 134 can be made of the same material as the first source 121 and the first drain 124, and can be arranged in the same layer.

[0095] The first thin-film transistor 120 can be a driving transistor, and the second thin-film transistor 130 can be a switching transistor, but the implementation is not limited to this.

[0096] The first protective layer 111 can be disposed on the first source 121 and the first drain 124.

[0097] The first protective layer 111 can planarize the upper part of the first thin-film transistor 120 and protect the first thin-film transistor 120. The first protective layer 111 can be made of organic material.

[0098] The second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may be formed of the same material as the first protective layer 111, but the implementation is not limited thereto.

[0099] The connecting electrode 145 can be disposed between the first protective layer 111 and the second protective layer 112.

[0100] The connecting electrode 145 can electrically connect the second thin-film transistor 130 to the light-emitting part 150.

[0101] The light-emitting part 150 may be disposed on the second protective layer 112. The light-emitting part 150 may include an anode 151, an organic layer 152, and a cathode 153.

[0102] The anode 151 may be disposed on the second protective layer 112. The anode 151 may be electrically connected to the second thin-film transistor 130 through a contact hole formed in the second protective layer 112. The anode 151 may be a reflective electrode that reflects light, but the embodiments described herein are not limited thereto. The anode 151 may comprise a highly reflective metallic material such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and ITO (ITO / Al / ITO), or an APC alloy, and may be formed from a single layer or multiple layers, but the embodiments described herein are not limited thereto.

[0103] Organic layer 152 may be disposed on anode 151. Organic layer 152 may include one or more light-emitting structures (or one or more light-emitting elements) stacked on anode 151 in the order of hole transport layer and electron transport layer or in reverse order. Organic layer 152 may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, or a micro mini light-emitting diode, but the implementation is not limited thereto.

[0104] The cathode 153 may be disposed on the organic layer 152. The cathode 153 may be a transparent electrode that transmits light, but the implementation is not limited thereto. For example, the cathode 153 may include a transparent conductive material, such as ITO (indium tin oxide) or IZO (indium zinc oxide) or a metal that transmits visible light.

[0105] The embankment 154 can be arranged to expose the anode 151. The embankment 154 can be arranged to define an opening (or light-emitting area) for a sub-pixel and cover the edge portion (or boundary portion) of the anode 151. Each sub-pixel may include a red light-emitting area, a green light-emitting area, and a blue light-emitting area. For example, a sub-pixel can be a pixel, but is not limited thereto.

[0106] Spacer 155 can be further arranged on embankment 154.

[0107] The encapsulation portion 170 may be disposed on the embankment portion 154 or the light-emitting portion 150. The encapsulation portion 170 may include one or more insulating layers. For example, the encapsulation portion 170 may include a first encapsulation layer 171, a second encapsulation layer 172 on the first encapsulation layer 171, and a third encapsulation layer 173 on the second encapsulation layer 172. The encapsulation portion 170 may include one or more inorganic material layers and one or more organic material layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic materials, and the second encapsulation layer 172 may include organic materials.

[0108] A touch buffer layer 181 can be disposed on the package portion 170. For example, the touch buffer layer 181 can be disposed on the third package layer 173. The touch buffer layer 181 can be made of the same material as the buffer layer 102. A first touch conductive layer can be disposed on the buffer layer 181. A touch insulating layer 184 can be disposed on the first touch conductive layer. The touch insulating layer 184 can prevent short circuits between touch electrodes. The touch insulating layer 184 can include organic or inorganic materials, but the implementation is not limited thereto. Figure 5 The illustration shows that the touch insulating layer 184 comprises an organic material, but the embodiments are not limited thereto. A second touch conductive layer may be disposed on the touch insulating layer 184.

[0109] The first touch conductive layer may include a second touch electrode 182, and the second touch conductive layer may include a first touch electrode 185.

[0110] The second touch electrode 182 can be electrically connected to the first touch electrode 185 through a contact hole formed in the touch insulating layer 184.

[0111] The first touch electrode 185 and the second touch electrode 182 may include metal.

[0112] The upper organic layer 190 may be disposed on the touch portion 180, but the implementation is not limited to this.

[0113] Figure 6 It is along Figure 3 The cross-sectional view taken from B-B'.

[0114] Reference Figure 5 and Figure 6 The display device 1 may include a display panel 100, a polarizing layer 200, a cover layer 300, a back plate layer 600, a plate layer 800, bonding layers 710, 720, 730, 740, 750, 760, 770, 780 and 890, a cover layer MCL, a molding part MDP, a molding frame MFP and a housing HSP.

[0115] The curved region BR of the display panel 100 has a curved shape and is capable of bending in the thickness direction. The main region MR and the sub-region SR of the display panel 100 can overlap each other.

[0116] A polarizing layer 200 can be disposed on the main region MR of the display panel 100. The polarizing layer 200 can polarize light emitted from the display panel 100 by a polarization angle. The polarizing layer 200 can emit light polarized by a polarization angle to the outside. The polarizing layer 200 may include the function of blocking the reflection of light other than light polarized by a polarization angle from the external light. The polarizing layer 200 may include a first phase retardation layer, a second phase retardation layer on the first phase retardation layer, and a polarizing layer on the second phase retardation layer. Figure 5 and Figure 6 In this illustration, the polarization layer 200 and the display panel 100 are shown as separate from each other, but the implementation is not limited to this. In some embodiments, the polarization layer 200 may be omitted and a color filter may be provided.

[0117] The cover layer 300 can be disposed on the polarizing layer 200. The cover layer 300 can be formed of a glass material including glass or quartz, but the embodiments are not limited thereto, and it can also be formed of a plastic material. The cover layer 300 can be disposed on the display panel 100 to externally protect components disposed beneath the cover layer 300. The cover layer 300 can be a cover layer formed by chemical strengthening, but the embodiments are not limited thereto. The cover layer 300 can be a cover window, window cover, or cover component, but the embodiments are not limited thereto.

[0118] The cover layer 300 can protect the components disposed beneath it from the outside. However, as mentioned above, since the cover layer 300 is formed of glass, it may be damaged by external forces, resulting in glass fragments. These glass fragments sometimes fly to the outside of the display device 1. According to embodiments of this disclosure, in order to prevent or reduce glass fragment splashing due to damage to the cover layer 300 or to improve the durability of the cover layer 300, the display device 1 may further include at least one other layer on the cover layer 300. Figure 6 (Not shown in the image). For example, the display device 1 may further include a film layer on the cover layer 300 (not shown in the image). Figure 6 (not shown in the image) or coating ( Figure 6 (not shown in the image), but the implementation is not limited to this.

[0119] The side surface of the cover layer 300 may protrude further outward than the side surface of the display panel 100. For example, the side surface of the cover layer 300 may protrude further outward than the end surface of the curved region BR of the display panel 100, but the implementation is not limited to this.

[0120] A backplate layer 600 may be disposed at the bottom of the display panel 100. The backplate layer 600 may be disposed at the bottom of the display panel 100 to support the display panel 100. The backplate layer 600 may include a material capable of supporting the display panel 100. For example, the backplate layer 600 may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but the embodiments are not limited thereto. The backplate layer 600 may maintain a constant curvature of the display panel 100 when the display device 1 is folded, and may suppress wrinkles generated on the upper surface of the display panel 100.

[0121] The back panel layer 600 may include a first back panel layer 610 on the main region MR and a second back panel layer 620 on the sub-region SR. The first back panel layer 610 may be disposed between the main region MR of the display panel 100 and the panel layer 800, and the second back panel layer 620 may be disposed between the sub-region SR of the display panel 100 and the panel layer 800. The back panel layer 600 may not be disposed on the curved region BR.

[0122] A plate layer 800 may be disposed between a first backplate layer 610 and a second backplate layer 620. The plate layer 800 may include metal. For example, the plate layer 800 may include stainless steel, but the implementation is not limited thereto. The plate layer 800 may include a first plate layer 810 between the first backplate layer 610 and the second backplate layer 620, and a second plate layer 820 between the first plate layer 810 and the second backplate layer 620.

[0123] Additional bonding layers may be arranged between the aforementioned components 100, 200, 300, 600, 610, 620, 810, and 820. The bonding layers may include a first bonding layer 710, a second bonding layer 720, a third bonding layer 730, a fourth bonding layer 740, a fifth bonding layer 750, a sixth bonding layer 760, and a seventh bonding layer 770.

[0124] The first bonding layer 710 can be disposed between the display panel 100 and the polarization layer 200. The first bonding layer 710 can connect or bond the display panel 100 and the polarization layer 200.

[0125] The second bonding layer 720 may be disposed between the polarizing layer 200 and the capping layer 300. The second bonding layer 720 may connect or bond the polarizing layer 200 and the capping layer 300.

[0126] The third bonding layer 730 can be disposed between the first back panel layer 610 and the display panel 100. The third bonding layer 730 can connect or bond the first back panel layer 610 and the display panel 100.

[0127] The fourth bonding layer 740 may be disposed between the first backsheet layer 610 and the first board layer 810. The fourth bonding layer 740 may connect or bond the first backsheet layer 610 and the first board layer 810.

[0128] The fifth bonding layer 750 can be disposed between the second back panel layer 620 and the sub-region SR. The fifth bonding layer 750 can connect or bond the second back panel layer 620 and the display panel 100.

[0129] The sixth bonding layer 760 may be disposed between the second backsheet layer 620 and the second plate layer 820. The sixth bonding layer 760 may connect or bond the second backsheet layer 620 and the second plate layer 820.

[0130] A seventh bonding layer 770 may be disposed between the first plate layer 810 and the second plate layer 820. The seventh bonding layer 770 may connect or bond the first plate layer 810 and the second plate layer 820.

[0131] The eighth bonding layer 780 can be disposed between the molded frame MFP and the cover layer MCL. The eighth bonding layer 780 can connect or bond the molded frame MFP and the cover layer MCL.

[0132] The ninth bonding layer 790 may be disposed between the fourth molding part MDP4 (or molding part) and the housing HSP. The ninth bonding layer 790 may connect or bond the molding part MDP and the housing HSP.

[0133] The first bonding layer 710 and the second bonding layer 720 may each include a transparent adhesive, but the embodiments are not limited thereto. For example, the transparent adhesive may be a transparent resin (OCR) or a transparent adhesive (OCA), but the embodiments are not limited thereto. The third bonding layer 730, the fourth bonding layer 740, the fifth bonding layer 750, the sixth bonding layer 760, the seventh bonding layer 770, the eighth bonding layer 780 and the ninth bonding layer 790 may each include a pressure-sensitive adhesive (PSA), but the embodiments are not limited thereto.

[0134] A cover layer MCL can be disposed on one side of the curved area BR of the display panel 100. The cover layer MCL comprises a plastic material and can be coated on one side of the curved area BR of the display panel 100 to cover the curved area BR of the display panel 100. Link wires can also be disposed on the curved area BR. The cover layer MCL can protect the link wires LL from external impacts while preventing or reducing moisture penetration into the link wires. Furthermore, when the curved area BR of the display panel 100 is bent into a curved shape with a constant radius of curvature, the cover layer MCL can be used to position the link wires in a neutral plane. Within the curved area BR, a neutral plane with zero tensile and compressive forces is formed, and the link wires are located on the neutral plane, such that when the display panel 100 is bent, the link wires are subjected to zero bending stress, thus the display panel 100 can be bent without being damaged by bending stress.

[0135] The cover layer MCL can contact the side surfaces of the polarizing layer 200 and the first bonding layer 710. The cover layer MCL can extend partially into the sub-region SR. On the sub-region SR, the cover layer MCL can be bonded to the molded frame MFP via the eighth bonding layer 780.

[0136] The data driver DIC can be disposed in the first pad area PA1 of the sub-region (SR), and the printed circuit board FPCB can be disposed in the second pad area PA2. The printed circuit board FPCB can be electrically connected to the pads on the display panel 100 through the anisotropic conductive film ACF. The cover layer MCL may not overlap with the data driver DIC, but the implementation is not limited to this.

[0137] The molded frame (MFP) can be placed below the cover layer (MCL).

[0138] The fourth molding portion MDP4 (or molding portion) can be disposed on the cover layer MCL. The fourth molding portion MDP4 (or molding portion) can cover the outer surface of the curved region BR of the display panel 100. For example, it can be in direct contact with the cover layer MCL, the lower surface of the cover layer 300, the side surface of the fifth bonding layer 750, and the upper, side, and lower surfaces of the molding frame MFP. The fourth molding portion MDP4 can also be in contact with the inner surface of the housing HSP. The fourth molding portion MDP4 can also be disposed inside the curved region BR. The fourth molding portion MDP4 can be in contact with the inner surface of the curved region BR, the side surfaces of the first backplate layer 610 and the second backplate layer 620, and the side surfaces of the first plate layer 810 and the second plate layer 820.

[0139] The housing HSP can also be disposed on the outermost side of the display device 1. The portion of the housing HSP extending in the thickness direction (or the third direction DR3) can directly contact the cover layer 300 and the fourth molding portion MDP4. The portion of the housing HSP extending in the second direction DR2 can be bonded to the fourth molding portion MDP4 through the ninth bonding layer 790.

[0140] Figure 7 It is along Figure 3 The cross-sectional view taken from C-C'. Figure 7 The main region MR is shown, which includes the display area DA and the non-display area NDA. Figure 7 A cross-sectional view showing the right corner region of display device 1 is shown as an example. The cross-sectional view of the right side region of display device 1 may be substantially the same as the cross-sectional view of the left corner region of display device 1.

[0141] refer to Figures 4 to 7 The third molding portion MDP3 (or molding portion) can directly contact the side surface of the display panel 100, the side surface of the first back panel layer 610, and the side surface of the first panel layer 810. The third molding portion MDP3 can directly contact the side and lower surfaces of the molding frame MFP. The third molding portion MDP3 can be connected to the housing HSP through the ninth bonding layer 790. The third molding portion MDP3 can contact the lower surface of the cover layer 300 and the inner surface of the housing HSP.

[0142] Simultaneously, the first pattern H1 can be disposed in the third molding portion MDP3. The first pattern H1 can be formed by recessing from the lower surface of the third molding portion MDP3, and the first pattern H1 can be a recess or a slit. For example, if the first pattern H1 is a recess, the first pattern H1 may not completely penetrate the third molding portion MDP3. If the first pattern H1 is a slit, the first pattern H1 can cover the cover layer 300.

[0143] The first pattern H1 will be explained in detail later.

[0144] Figure 8 It is along Figure 3 The cross-sectional view taken from D-D'. Figure 8 The main region MR is shown, which includes the display area DA and the non-display area NDA. Figure 8 A cross-sectional view of the right side region (or a short side in the first direction DR) of the display device 1 is shown. The cross-sectional view of the right side region of the display device 1 may be substantially the same as the cross-sectional views of the left side region and the upper region of the display device 1.

[0145] refer to Figures 4 to 8 The second molded portion MDP2 (or molded part) can directly contact the side surface of the display panel 100, the side surface of the first back panel layer 610, and the side surface of the first panel layer 810. The second molded portion MDP2 can directly contact the side and lower surfaces of the molded frame MFP. The second molded portion MDP2 can be bonded to the housing HSP via the ninth bonding layer 790. The second molded portion MDP2 can contact the lower surface of the cover layer 300 and the inner surface of the housing HSP. Unlike the third molded portion MDP3, the second molded portion MDP2 may not include a pattern.

[0146] Figure 9 The image shows a display device falling according to one embodiment.

[0147] Reference Figure 9 When display device 1 falls, the impact force may act on display device 1. Figure 9 The example shown only illustrates the case of the display device 1 falling, but an impulse can also be generated when an external impulse acts on the display device 1. Figure 9 This represents the change in the magnitude of the impulse acting on display device 1 over time. For example, the impulse can have a positive value, a first impulse with a first area S1, and a second impulse with a lower level following the first impulse. Simultaneously, the shape of the impulse with the first area S1 is only shown for approximately half a cycle, but if the shape of the impulse with the first area S1 is virtually extended to a full cycle, the shape of the impulse with the second area S2 can be obtained. Thus, the period T of the shock wave acting on display device 1 can be derived. Furthermore, the frequency (Hz) of the shock wave can be derived from the period T of the shock wave. Design can be based on the calculated period T and frequency (Hz) of the shock wave. Figure 7 The interval distance d between the first patterns H1 mentioned above.

[0148] In addition, the molding department (MDP, see Figure 4 The spacing distance d is designed based on the material properties of the material. Based on the travel velocity of the shock wave within the molding MDP (e.g., related to the density of the molding MDP and the frequency of the shock wave Hz), the length of the shock wave satisfying one wavelength of the shock wave within the molding MDP can be derived.

[0149] According to one embodiment, the distance (d) between the first patterns H1 can be less than the length of the shock wave to satisfy one wavelength of the shock wave within the third molding section MDP3. In this case, the shock wave applied from outside the third molding section MDP3 can be blocked (or intercepted) in the first patterns H1 or the separation space between the first patterns H1.

[0150] Therefore, external impacts applied to the molding section MDP will not be transmitted to the display panel, thereby preventing or reducing the deterioration of the display panel's reliability.

[0151] Figure 11 It is a graph showing the improvement in impact on the display device. Figure 11 The horizontal axis represents frequency (Hz), and the vertical axis represents strain. Sample a can be a display device in which the molding part does not have the first pattern H1, and sample b can be a display device in which the molding part MDP includes the first pattern H1.

[0152] Figure 9 The frequency of the shock wave described herein can be, for example, from about 200 Hz to about 400 Hz. Figure 11 As shown, it can be confirmed that the strain of sample b at approximately 200 Hz to approximately 400 Hz is lower than that of sample a.

[0153] A display device (1, reference) according to one embodiment Figure 1 As described above, external impacts applied to the molded MDP will not be transmitted to the display panel (100, reference). Figure 1 This prevents or reduces the degradation of display panel reliability.

[0154] Refer again Figure 10 Furthermore, the molded portion MDP can undergo thermal expansion in high-temperature environments. In particular, since the third molded portion MDP3 is located at a corner, stress may concentrate on the third molded portion MDP3 during thermal expansion. However, in a display device according to one embodiment, since the first pattern H1 is arranged in the third molded portion MDP3, even if the third molded portion MDP3 expands, it can fill the first pattern H1, thus alleviating stress concentration in the third molded portion MDP3.

[0155] The following describes displays in other embodiments. In the following embodiments, details regarding displays will be omitted. Figures 1 to 11 The accompanying drawings or the detailed description or repetition of the accompanying reference numerals or structures are described.

[0156] Figure 12 This is a plan view of the molding section in another embodiment.

[0157] Reference Figure 12According to this embodiment, the molding portion MDP_1 includes a third molding portion MDP3_1, and the spacing d_1 between the first patterns H1 of the third molding portion MDP3_1 can be greater than the length of the shock wave to satisfy one wavelength of the shock wave within the third molding portion MDP3_1. In this case, the shock wave applied from outside the third molding portion MDP3_1 can bypass adjacent first patterns H1 or distant first patterns H1, thereby mitigating the impact.

[0158] Other detailed descriptions are omitted because, as mentioned above... Figure 10 It has been described in the text.

[0159] Figure 13 This is a cross-sectional view of a display device according to another embodiment.

[0160] Reference Figure 13 According to this embodiment, the first pattern H1 of the display device 1_2 and according to Figure 7 The difference in display device 1 is that it is further provided with a buffer section DP.

[0161] More specifically, the display device 1_2 may further include a buffer portion DP filling the first pattern H1. The mechanical properties of the buffer portion DP and the mechanical properties of the third molded portion MDP3 may differ from each other. The aforementioned mechanical properties may include impedance or density. The density of the buffer portion DP may be less than the density of the third molded portion MDP3. For example, the buffer portion DP may include rubber or silicone, but the implementation is not limited thereto.

[0162] According to this embodiment, the buffer portion DP is arranged in the first pattern H1. The mechanical characteristics of the buffer portion DP are different from those of the third molding portion MDP3. Therefore, the shock wave applied from the outside can be attenuated at the boundary between the third molding portion MDP3 and the buffer portion DP.

[0163] Other detailed descriptions are omitted because, as mentioned above... Figure 7 It has been described in the text.

[0164] Figure 14 This is a plan view of the molding section in another embodiment.

[0165] Reference Figure 14 According to this embodiment, the first molding part MDP1_1, the second molding part MDP2_1, and the fourth molding part MDP4_1 of the molding part MDP_2 are consistent with those of the molding part MDP_2. Figure 10 The difference between the molded parts of the MDP is that they each include patterns H2, H3 and H4.

[0166] More specifically, the first molding part MDP1_1 may include the second pattern H2, the second molding part MDP2_1 may include the third pattern H3, and the fourth molding part MDP4_1 may include the fourth pattern H4.

[0167] The second pattern H2 can extend along the first direction DR1, the third pattern H3 can extend along the second direction DR2, and the fourth pattern H4 can extend along the first direction DR1. Multiple fourth patterns H4 can be configured. These multiple fourth patterns H4 can be spaced apart from each other along the second direction DR2.

[0168] In the molding section MDP_2 of this embodiment, patterns H2, H3, and H4 can be arranged in other molding sections (first molding section MDP1_1, second molding section MDP2_1, and fourth molding section MDP4_1) other than the third molding section MDP3. Therefore, it has the advantage that the impact applied by the third molding section MDP3 can be reduced by using the patterns H2, H3, and H4 of the molding sections (MDP1_1, second molding section MDP2_1, and fourth molding section MDP4_1) adjacent to the first molding section.

[0169] Figure 15 This is a plan view of the molding section according to another embodiment.

[0170] Reference Figure 15 According to this embodiment, the patterns H2_1 and H3 of the first molding portion MDP1_2 and the second molding portion MDP2_2 of the molding portion MDP_3 are consistent with those of the molding portion MDP_3 according to this embodiment. Figure 14 The difference between the MDP_2 molding section and the MDP_2 is that there are multiple patterns.

[0171] More specifically, the second pattern H2_1 is set in multiple quantities, and the multiple second patterns H2_1 can be arranged in an interlaced manner (or in a zigzag manner) along the first direction DR1. The third pattern H3 is set in multiple quantities, and the multiple third patterns H3 can be arranged in an interlaced manner (or in a zigzag manner) along the second direction DR2.

[0172] Other detailed descriptions are omitted because, as mentioned above... Figure 14 It has been described in the text.

[0173] The display device according to various embodiments can be described as follows.

[0174] The display device according to the embodiment may include: a display panel including a short side extending in a first direction, a long side extending in a second direction, and a corner where the short side and the long side intersect; and a molding portion including a first molding portion disposed on the short side, a second molding portion disposed on the long side, and a third molding portion disposed on the corner. A first pattern may be provided on the third molding portion such that the third molding portion is recessed from the lower surface of the third molding portion.

[0175] Multiple first patterns can be set, and these first patterns are spaced apart from each other.

[0176] In a display device according to an embodiment of the present disclosure, a plurality of first patterns may be diagonally spaced apart from each other along a direction intersecting the first direction and the second direction.

[0177] In a display device according to an embodiment of the present disclosure, the distance between a plurality of first patterns can be determined based on the density of the third molding section and the frequency of the shock wave within the third molding section.

[0178] The display device according to an embodiment of the present disclosure may further include a buffer portion disposed within the first pattern. The density of the buffer portion may be lower than the density of the third molding portion.

[0179] In a display device according to an embodiment of the present disclosure, the buffer portion may include rubber or silicone resin.

[0180] In a display device according to an embodiment of the present disclosure, a second pattern extending along a first direction may be provided in a first molding portion, and a third pattern extending along a second direction may be provided in a second molding portion.

[0181] In a display device according to an embodiment of the present disclosure, a plurality of second patterns may be provided, a plurality of third patterns may be provided, and a first group of a plurality of second patterns may be offset from a second group of a plurality of second patterns in a second direction, and a first group of a plurality of third patterns may be offset from a second group of a plurality of second patterns in a first direction.

[0182] In a display device according to an embodiment of the present disclosure, the short sides may be provided in multiple ways, and the first molding portion is provided on one of the multiple short sides. The molding portion may also include a fourth molding portion provided on another of the multiple short sides, and a fourth pattern extending along the first direction may be provided in the fourth molding portion.

[0183] In a display device according to an embodiment of the present disclosure, the fourth molding portion may include a first portion and a second portion, wherein the width of the second portion in a second direction is smaller than that of the first portion.

[0184] In a display device according to an embodiment of the present disclosure, a fourth pattern may be provided in a first portion, and multiple fourth patterns may be provided, with the multiple fourth patterns spaced apart from each other in a second direction.

[0185] In a display device according to an embodiment of the present disclosure, the corners and the first pattern may include curved surfaces.

[0186] In another aspect, a display device according to embodiments of the present disclosure may include: a display panel including a main region, a sub-region overlapping the main region, and a curved region between the main region and the sub-region; a molding portion disposed on the outer side of the display panel; and a cover layer on the display panel. A pattern may be disposed in the molding portion on at least one edge and corner of the display panel, and the pattern may overlap with the cover layer.

[0187] The display device according to embodiments of the present disclosure may further include: a first backplate layer located on the lower surface of a display panel in a main region; a second backplate layer located between the display panel and the first backplate layer in the sub-region; and a plate layer between the first backplate layer and the second backplate layer. The first backplate layer, the second backplate layer, and the plate layer may be in direct contact with the molding portion.

[0188] In a display device according to an embodiment of the present disclosure, the display panel may include a short side extending in a first direction, a long side extending in a second direction, and a corner where the short side and the long side intersect, and the molding portion may include a first molding portion disposed on the short side, a second molding portion disposed on the long side, and a third molding portion disposed on the corner.

[0189] In a display device according to an embodiment of the present disclosure, a first pattern may be disposed in a third molding section, and multiple first patterns may be disposed, and the multiple first patterns may be spaced apart from each other.

[0190] In a display device according to an embodiment of the present disclosure, a plurality of first patterns may be spaced apart from each other along a diagonal direction intersecting a first direction and a second direction.

[0191] The spacing between multiple first patterns can be determined by taking into account the characteristics of the molding part.

[0192] In a display device according to an embodiment of the present disclosure, a second pattern may be provided in a first molding section, and a third pattern may be provided in a second molding section.

[0193] In a display device according to an embodiment of the present disclosure, a plurality of second patterns may be provided, a plurality of third patterns may be provided, and a first group of a plurality of second patterns may be offset from a second group of a plurality of second patterns in a second direction, and a first group of a plurality of third patterns may be offset from a second group of a plurality of second patterns in a first direction.

[0194] Although this disclosure has been described with reference to exemplary accompanying drawings, it should be understood that this disclosure is not limited to the embodiments and drawings disclosed herein, and those skilled in the art will understand that various modifications can be made without departing from the technical concept and spirit of this disclosure. Furthermore, although the operational effects of configurations according to this disclosure are not explicitly described in the description of embodiments of this disclosure, it should be understood that predictable effects will also be identified through configuration.

[0195] Cross-references to related applications

[0196] This application claims priority and benefit to Korean Patent Application No. 10-2024-0184546, filed on December 12, 2024, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. A display device, the display device comprising: The display panel includes a short side extending along a first direction, a long side extending along a second direction, and a corner where the short side and the long side intersect. as well as The molding portion includes a first molding portion disposed on the short side, a second molding portion disposed on the long side, and a third molding portion disposed at the corner. The third molding part is provided with a first pattern, which causes the third molding part to be recessed from the lower surface of the third molding part.

2. The display device according to claim 1, wherein, The first pattern is arranged in the form of a plurality of first patterns, and the plurality of first patterns are spaced apart from each other.

3. The display device according to claim 2, wherein, The plurality of first patterns are spaced apart from each other along a diagonal direction that intersects both the first direction and the second direction.

4. The display device according to claim 2, wherein, The distance between the plurality of first patterns is determined based on the density of the third molding section and the frequency of the shock wave within the third molding section.

5. The display device according to claim 1, further comprising: A buffer section is disposed inside the first pattern. The density of the buffer section is lower than that of the third molding section.

6. The display device according to claim 5, wherein, The buffer portion comprises rubber or silicone resin.

7. The display device according to claim 1, wherein, A second pattern extending along the first direction is disposed in the first molding portion, and a third pattern extending along the second direction is disposed in the second molding portion.

8. The display device according to claim 7, wherein, The second pattern is arranged in the form of a plurality of second patterns, and the third pattern is arranged in the form of a plurality of third patterns, wherein a first group of the plurality of second patterns is offset from a second group of the plurality of second patterns in the second direction, and a first group of the plurality of third patterns is offset from a second group of the plurality of third patterns in the first direction.

9. The display device according to claim 1, wherein, The short sides are arranged in the form of multiple short sides, and the first molded part is disposed on one of the multiple short sides. The molding portion further includes a fourth molding portion disposed on another short side of the plurality of short sides, and a fourth pattern extending along the first direction is disposed in the fourth molding portion.

10. The display device according to claim 9, wherein, The fourth molding part includes a first part and a second part, wherein the width of the second part in the second direction is smaller than the width of the first part in the second direction.

11. The display device according to claim 10, wherein, The fourth pattern is disposed in the first part, and the fourth pattern is disposed in the form of a plurality of fourth patterns, and the plurality of fourth patterns are spaced apart from each other in the second direction.

12. A display device, the display device comprising: The display panel includes a main region, a sub-region that overlaps with the main region and faces a portion of the main region, and a curved region between the main region and the sub-region; A molding section, wherein the molding section is disposed on the exterior of the display panel; as well as Overlay layer, the overlay layer on the display panel, The molding portion includes a pattern that causes the molding portion to be recessed from the surface of the molding portion on at least one of the plurality of edges or corners of the display panel.

13. The display device according to claim 12, in, The pattern overlaps with the cover layer.

14. The display device according to claim 12, further comprising: A first back panel layer is located on the lower surface of the display panel in the main area. A second back panel layer is located between the display panel and the first back panel layer in the sub-region. as well as A plate layer, wherein the plate layer is located between the first back sheet layer and the second back sheet layer. The first backplate layer, the second backplate layer, and the plate layer are in direct contact with the molding part.

15. The display device according to claim 14, wherein, The display panel includes a short side extending along a first direction, a long side extending along a second direction, and a corner where the short side and the long side intersect. The molding portion includes a first molding portion disposed on the short side, a second molding portion disposed on the long side, and a third molding portion disposed at the corner.

16. The display device according to claim 15, wherein, The first pattern is disposed in the third molding section, and the first pattern is disposed in the form of a plurality of first patterns, and the plurality of first patterns are spaced apart from each other.

17. The display device according to claim 16, wherein, The distance between the plurality of first patterns is determined based on the density of the third molding section and the frequency of the shock wave within the third molding section.

18. The display device according to claim 15, wherein, The second pattern is disposed in the first molding part, and the third pattern is disposed in the second molding part.

19. The display device according to claim 18, wherein, The second pattern is arranged in the form of a plurality of second patterns, and the third pattern is arranged in the form of a plurality of third patterns, and the first group of the plurality of second patterns is offset from the second group of the plurality of second patterns in the second direction, and the first group of the plurality of third patterns is offset from the second group of the plurality of third patterns in the first direction.

20. The display device according to claim 12, further comprising: A buffer section is disposed inside the pattern. The density of the buffer section is lower than the density of the molding section.

Images