A micro-pitch board-to-board connector and a manufacturing method thereof

Abstract

The application discloses a micro-pitch board-to-board connector and a manufacturing method thereof. The connector comprises a terminal module with a central slot in the middle and connected by two identical half connectors, and a pair of protective fittings sleeved on both ends. The half connector comprises an insulating glue body, two rows of signal contact terminals in reverse staggered arrangement and two metal connecting pieces. The metal connecting pieces are embedded in both ends of the insulating glue body and welded with the protective fittings to fix the two half connectors. The manufacturing method comprises the following steps: material belt preparation and pre-fixing, insert injection molding of the half connector, first cutting, assembly of the half connector, and second cutting to form a finished connector. The half connector is formed by one-time insert injection molding, and then the metal connecting pieces and the protective fittings are welded to fix the half connector, so that the production process is greatly simplified, the process complexity and production cost are reduced, the overall structural strength of the connector is effectively improved, and good electromagnetic shielding effect is achieved.

Description

Technical Field

[0001] This invention belongs to the field of electrical connector technology, and particularly relates to a micro-pitch board-to-board connector and its manufacturing method. Background Technology

[0002] Board-to-board connectors, as core components for PCB interconnection in electronic devices, directly affect the signal transmission stability of electronic products. Their technological development is always deeply tied to the trends of thinner, lighter, and more functionally integrated end-products. With the continuous upgrading of consumer electronics such as smartphones and wearable devices, the number of internal modules has increased significantly, and installation space has become increasingly compact, placing higher demands on the terminal density, structural stability, and connection reliability of board-to-board connectors.

[0003] To achieve synchronous transmission of more signals within limited installation space, board-to-board connectors with four rows of conductive terminals have become the mainstream solution in the industry. These connectors increase signal transmission density through vertically stacked terminals, effectively alleviating the conflict between high-density connections and limited layout space. However, these board-to-board connectors with four rows of high-density staggered terminals have a precise structure and small size, and their manufacturing and structural design still face many technical challenges. They cannot be produced using the traditional one-stage injection molding process for dual-row connectors. Currently, the mainstream manufacturing method in the industry mostly uses a two-stage injection molding process. As disclosed in patent "CN118249102A Connector, Connector Assembly and Connector Manufacturing Method", this process requires first fixing two rows of terminals to form two half-body parts through a first injection molding, and then combining the two half-body parts with the protective hardware into a whole through a second injection molding. This not only requires two sets of injection molds, significantly increasing mold opening costs and mold design difficulty, but also reduces production efficiency due to the cumbersome process and long production cycle. Furthermore, the cumulative errors during multiple injection molding and transfer processes can lead to a decrease in terminal alignment accuracy, affecting product yield and signal transmission stability. In addition, the second injection molding can easily result in insufficient structural integrity and weak strength at the joint of the insulating adhesive, making it prone to breakage and detachment during subsequent assembly or end-use, affecting product reliability.

[0004] Therefore, it is urgent to optimize existing manufacturing methods to further reduce production costs, simplify processes, and improve structural strength while ensuring the connection accuracy and product consistency of board-to-board connectors. Summary of the Invention

[0005] To address the problems of high mold costs, complex processes, long production cycles, low terminal alignment accuracy, and poor product yield associated with existing four-row board-to-board connectors that employ a two-stage injection molding process, this invention aims to provide a micro-pitch board-to-board connector and its manufacturing method. Through a design of "one-time injection molding of half-pieces and separate assembly into a whole," the process is simplified, mold costs are reduced, and product assembly accuracy and structural reliability are ensured, making it suitable for the needs of miniaturized, high-density electronic products.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution:

[0007] A micro-pitch board-to-board connector includes: a terminal module and a pair of protective fittings sleeved at both ends of the terminal module; the terminal module is formed by splicing two identical half-connectors together, with a central slot in the middle; each half-connector includes an insulating body, two rows of signal contact terminals embedded in the main body of the insulating body, and two metal connectors, the two metal connectors being fixed at both ends of the insulating body by an insert injection molding process; the electrical contact areas of the two rows of signal contact terminals are respectively exposed on both sides of the main body, and adjacent signal contact terminals are arranged in a reverse staggered and parallel interval, the two sides of the main body corresponding to the electrical contact areas being the positioning side and the splicing side, respectively; the metal connectors have a welding fixing part near the inner wall of the protective fittings, the welding fixing part being welded to the protective fittings, thereby realizing the mutual connection of the two half-connectors.

[0008] Furthermore, the main body of the insulating colloid has outwardly extending extensions integrally formed at both ends, the metal connector is embedded in the extensions, and the welding fixing part is exposed in the extensions.

[0009] Furthermore, the end of the extension also has a splicing portion extending toward the splicing side, so that the two half-connectors can surround each other to form a rectangular frame-shaped terminal module.

[0010] The present invention also provides a method for manufacturing a micro-pitch board-to-board connector, comprising the following steps:

[0011] S1: Material strip preparation and pre-assembly fixing, preparing hardware material strip with protective hardware, preparing connector material strip with metal connectors, preparing terminal material strip with a row of equally spaced parallel signal contact terminals;

[0012] Take a pair of terminal strips and arrange them opposite each other. Take a pair of connector strips and place them on both sides of the pair of terminal strips. According to the preset reference holes on the terminal strips and connector strips, fix the terminal strips and connector strips to the first metal carrier strip by riveting to form the component to be injection molded.

[0013] S2: Injection-molded half connector, the component to be injection molded is placed into the injection mold, and through the insert injection molding process, the two rows of signal contact terminals and the two metal connectors are firmly bonded to the injection-molded insulating colloid, and integrally molded into a half connector;

[0014] S3: First cut: The first metal carrier strip, the connector strip and the terminal strip on the splicing side of the half connector are removed by punching process, and the terminal strip on the positioning side of the half connector is retained as the subsequent positioning reference.

[0015] S4: Assemble the half-connectors by rotating one of the half-connectors 180° around the central axis of the board-to-board connector insertion direction, with the positioning sides of the two half-connectors facing opposite directions, so that the splicing sides of the two half-connectors are opposite each other and held facing each other at a preset spacing that matches the size of the central slot, forming a terminal module with a four-row terminal arrangement structure; then, using the terminal strip retained on the positioning side, rivet and fix the terminal module to the second metal carrier strip; fit the two prefabricated protective fittings onto the two ends of the terminal module, and then weld the protective fittings to the metal connector through a welding process to achieve a fixed connection between the two half-connectors;

[0016] S5: Second cutting, cutting away the second metal carrier tape and the remaining tape to obtain the finished board-to-board connector.

[0017] Preferably, in step S1, the terminal strip and the connector strip are fixed to the first metal carrier strip by riveting to form the component to be injection molded; in step S4, the fitting strip and the second metal carrier strip are aligned by reference holes and fixed by riveting in the same way; the riveting pressure of each strip and the corresponding metal carrier strip is controlled between 0.3-0.5MPa.

[0018] Preferably, the alignment accuracy between each material strip and the corresponding metal carrier strip is ±0.008mm, and the transmission speed of each metal carrier strip is controlled at 5-8m / min, so as to ensure that the relative position accuracy between the functional components of the connector meets the reliable electrical connection and mechanical fit requirements of the micro-pitch board-to-board connector.

[0019] Preferably, in step S2, the metal connector is made of stainless steel strip by stamping and is embedded at both ends of the insulating colloid, and a portion of the metal connector is exposed outside the extension of the insulating colloid to form a welding fixing part for welding with protective hardware.

[0020] Preferably, in step S1, after the signal contact terminal is stamped, the process further includes electroplating its electrical contact area. The electroplating layer is a tin layer or a gold layer. After the electroplating is completed, the terminal strip and the connector strip are riveted and fixed to the first metal carrier strip.

[0021] Preferably, in step S4, the protective fittings and the metal connectors are welded using laser welding technology, with the welding power controlled at 150-200W, to achieve a fixed connection between the two half-connectors.

[0022] Preferably, in step S2, during insert injection molding, the injection temperature is controlled at 220-250℃ and the injection pressure is controlled at 80-100MPa.

[0023] Compared with the prior art, the beneficial effects of the micro-pitch board-to-board connector and its manufacturing method provided by the present invention are as follows:

[0024] 1. The overall structural strength of the terminal module is significantly improved. This invention reinforces the extensions at both ends of the half-connector by embedding metal connectors at the insulating colloid, greatly enhancing the overall structural strength of the connector and preventing deformation or breakage of the extensions. Furthermore, the two half-connectors are fixed by welding the metal connectors to the protective fittings, replacing traditional secondary insert injection molding or simple splicing methods. This creates a robust whole between the two half-connectors, improving the reliability of the connection between the metal connectors and the insulating colloid, and effectively preventing loosening under high vibration and high impact conditions.

[0025] 2. Excellent electromagnetic shielding effect is achieved. The protective hardware of this invention is designed as a seamless shell structure that fully covers the end of the terminal module, which can form an all-round coverage of the end of the terminal module, protecting the insulating colloid and effectively blocking external electromagnetic interference. At the same time, it prevents internal signals from radiating outward, meets the electromagnetic compatibility requirements of consumer electronics products, and is suitable for high-density signal transmission scenarios.

[0026] 3. Simplified process and reduced cost: Only one injection mold is needed to complete the one-piece injection molding of the half connector, replacing the two injection molding processes of the existing technology, which greatly reduces the number of molds and mold opening costs; at the same time, it simplifies the production process, shortens the production cycle, reduces the complexity of the process, and makes it easier to control the product yield.

[0027] 4. Avoid molding defects and improve product consistency: The "one-time injection molding, split splicing" design avoids defects such as terminal misalignment and insulation deformation caused by factors such as high temperature, mold cavity positioning deviation, and injection parameter fluctuation during the two injection processes; relying on the reference holes on each material strip and the positioning holes on each metal carrier strip throughout the process, the system is adapted to automatic and precise alignment, ensuring that the relative position accuracy of each component is controllable and improving product consistency.

[0028] 5. Adaptable to high-density and miniaturization requirements: The connector adopts four rows of signal contact terminals arranged in reverse staggered pattern, which realizes high-density signal transmission in a limited space, ensures sufficient electrical clearance, and perfectly adapts to the development trend of "thin and light, high-density" in modern electronic products, making it highly practical.

[0029] The specific embodiments of the present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0030] The accompanying drawings described below are merely some embodiments. Those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:

[0031] Figure 1 A schematic diagram of the manufacturing process of a micro-pitch board-to-board connector provided in this embodiment of the invention;

[0032] Figure 2 This invention provides a method for manufacturing a micro-pitch board-to-board connector. After step S1, the molding state of the component to be injection molded is shown in the schematic diagram.

[0033] Figure 3 This invention provides a method for manufacturing a micro-pitch board-to-board connector. After step S2, the schematic diagram shows the forming state of the half-body connector.

[0034] Figure 4 This invention provides a method for manufacturing a micro-pitch board-to-board connector. After step S4, the schematic diagram shows the forming state of the terminal module.

[0035] Figure 5 The present invention provides a method for manufacturing a micro-pitch board-to-board connector, and after step S5, the bottom view of the terminal module is shown.

[0036] Figure 6 A front view structural diagram of a micro-pitch board-to-board connector provided in an embodiment of the present invention;

[0037] Figure 7 A schematic diagram of the bottom view structure of a micro-pitch board-to-board connector provided in an embodiment of the present invention;

[0038] Figure 8 An exploded view of a micro-pitch board-to-board connector provided in this embodiment of the invention;

[0039] Figure 9 This invention provides a schematic diagram of the structure of a half-body connector in a micro-pitch board-to-board connector.

[0040] The attached diagram lists the components represented by each number as follows:

[0041] 100 - Half-body connector, 101 - Insulating colloid, 102 - Extension, 103 - Splice, 110 - Central slot.

[0042] 200 - Signal contact terminal, 201 - Terminal solder pad, 202 - Electrical contact area, 202a - Contact protrusion, 203 - Holding part

[0043] 300 - Protective fittings; 301 - Top plate; 302 - Inner wall plate; 303 - Outer wall plate; 304 - Inner bottom plate; 305 - Outer bottom plate; 306 - Fitting weld feet.

[0044] 400 - Metal connector, 401 - Bending part, 402 - Welded fixing part, 403 - Weld point.

[0045] 500 - Terminal strip, 501 - Reference hole position

[0046] 600-gold tool material belt,

[0047] 700 - Connector strip, 701 - Material bridge

[0048] 800 - First metal carrier tape, 801 - Positioning hole

[0049] 900 - Second metal carrier tape. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] like Figures 6 to 9 As shown, this embodiment of the invention provides a micro-pitch board-to-board connector, including a terminal module with a central slot 110 formed by splicing two identical half-connectors 100 together, and a pair of protective fittings 300 sleeved at both ends of the terminal module. Each half-connector 100 includes an insulating body 101, two rows of signal contact terminals 200 embedded in the main body of the insulating body 101, and two metal connectors 400 embedded at both ends of the insulating body 101. The electrical contact areas 202 of the two rows of signal contact terminals 200 are respectively exposed on both sides of the main body, and adjacent signal contact terminals 200 are arranged in a reverse staggered and parallel interval. The two sides of the main body corresponding to the electrical contact areas 202 are the positioning side and the splicing side, respectively. The metal connectors 400 are welded to the protective fittings 300 to fix the two half-connectors 100.

[0052] The main body of the insulating colloid 101 has outwardly extending extensions 102 integrally formed at both ends. The metal connector 400 is embedded in the extension 102. A portion of the metal connector 400 is bent outward and extended to form a welding fixing portion 402. The welding fixing portion 402 is exposed outside the insulating colloid 101 and close to the inner wall of the protective hardware 300. The welding fixing portion 402 is welded and fixed to the protective hardware 300 by laser welding process. The end of the extension 102 also has a splicing portion 103 extending towards the splicing side. After the two half-connectors 100 are connected, the two half-connectors 100 can be surrounded by the splicing portion 103 to form a rectangular frame-shaped terminal module, thereby improving the overall structural rigidity of the terminal module. Correspondingly, the metal connector 400 has a bent portion 401 that bends and extends toward the splicing side. The bent portion 401 is embedded in the splicing portion 103. Through the design of the bent portion 401, the contact area between the metal connector 400 and the insulating colloid 101 can be increased, the connection reliability between the metal connector 400 and the insulating colloid 101 can be improved, and the overall structural strength of the terminal module can be further enhanced.

[0053] Two rows of signal contact terminals 200 on each insulating colloid 101 are integrally embedded in the insulating colloid 101 by an insert injection molding process. The two rows of signal contact terminals 200 are arranged alternately and parallelly at equal intervals along the transverse length direction of the insulating colloid 101, and arranged in opposite directions along the longitudinal width direction of the insulating colloid 101, so that the electrical contact surfaces (i.e., the outer surfaces of the electrical contact areas 202) of the two rows of signal contact terminals 200 face opposite directions and are exposed on both sides of the insulating colloid 101, ensuring effective electrical contact with the mating female connector. This structure, which alternately sets two rows of signal contact terminals 200 facing opposite directions on an insulating colloid 101, not only achieves a high-density arrangement of the signal contact terminals 200 in the length direction of the connector, but also further increases the insulation distance between the electrical contact areas 202 of two adjacent signal contact terminals 200, thereby effectively reducing the risk of electrical breakdown between adjacent terminals.

[0054] The signal contact terminal 200 includes a terminal solder foot 201 for soldering, an electrical contact area 202 formed by bending the terminal solder foot 201 vertically upward, and a retaining portion 203 formed by bending the electrical contact area 202 away from the terminal solder foot 201. The electrical contact area 202 is integrally bent to form an outwardly protruding contact protrusion 202a. The terminal solder foot 201 is used to solder and fix to the PCB board. The end of the retaining portion 203 is completely embedded in the insulating colloid 101, which improves the bonding stability between the signal contact terminal 200 and the insulating colloid 101. The electrical contact area 202 is exposed on both sides of the insulating colloid 101 and makes electrical contact with the female connector. The contact protrusion 202a can increase the contact pressure, improve the contact holding force, and ensure the stability of signal transmission.

[0055] In a preferred embodiment, the protective hardware 300 is a seamless housing that fully covers the end of the terminal module. Its overall structure is adapted to the shape of the end of the terminal module. Specifically, it includes a U-shaped top plate 301 that fits and covers the top surface of the entire extension 102 (including the splice 103 at the end of the extension 102), an inner wall plate 302 that extends vertically downward from the inner side of the top plate 301 and covers the inner side wall of the extension 102, an outer wall plate 303 that extends vertically downward from the outer side of the top plate 301 and covers the outer side wall of the extension 102, an outer bottom plate 305 that extends horizontally outward from the outer wall plate 303, and an inner bottom plate 304 that extends horizontally from the inner wall plate 302 toward the central slot 110. The protective hardware 300 is integrally formed into a seamless shell structure, which can fully cover the ends of the terminal module, effectively improving the electromagnetic shielding performance of the board-to-board connector. The outer bottom plate 305 is also provided with outwardly extending hardware solder feet 306 for welding with the PCB board. The outer wall plate 303 and the outer bottom plate 305 also have an arc-shaped transition part. The arc-shaped transition part is welded to the exposed welding and fixing part 402 of the metal connector 400, fixing the two half-connectors 100 into a solid whole. The assembly and fixing of the four-row board-to-board connector is realized with a simpler and more reliable process, reducing production costs.

[0056] like Figures 1 to 5 As shown, the present invention also provides a manufacturing method for the above-mentioned micro-pitch board-to-board connector, comprising the following steps:

[0057] S1: Material Strip Preparation and Pre-assembly Fixing: According to product design requirements, the required protective hardware 300, metal connector 400, and signal contact terminals 200 are prepared respectively. The protective hardware 300 and metal connector 400 are both made of stainless steel strip as the base material for the hardware strip 600 and connector strip 700. The metal connector 400 is manufactured by stamping, while the protective hardware 300 is manufactured by a secondary stretching process to provide all-around protection for both ends of the board-to-board connector. The hardware solder feet 306 of the protective hardware 300 are integrally connected to the hardware strip 600. The signal contact terminals 200 are made of copper alloy strip with both conductivity and elasticity as the terminal strip 500, formed on the strip by a high-precision continuous stamping process. Several signal contact terminals 200 are arranged at equal intervals on the terminal strip 500. To ensure the relative positional accuracy of each component, before injection molding, the metal connector 400 is integrally connected to the connector strip 700 via a material bridge 701, and the terminal solder feet 201 of all signal contact terminals 200 are integrally connected to the terminal strip 500. Furthermore, after the signal contact terminals 200 are stamped, an electroplating process is performed on their electrical contact areas 202, using a tin or gold plating layer.

[0058] Then, a pair of terminal strips 500 are arranged opposite each other, and the relative positions of the two terminal strips 500 are adjusted so that the two rows of signal contact terminals 200 on the two terminal strips 500 are arranged in opposite directions and alternately. Then, a pair of connector strips 700 are mirror-symmetrically arranged on both sides of the pair of terminal strips 500, so that the metal connector 400 corresponds to the preset position of the extension 102 of the subsequent insulating colloid 101. Then, according to the preset reference hole positions 501 on the terminal strips 500 and connector strips 700, the terminal strips 500 and connector strips 700 are riveted and fixed to the first metal carrier strip 800 by an automated riveting device. The riveting pressure is controlled between 0.3-0.5MPa to form the component to be injected. The first metal carrier strip 800 has positioning holes 801 along the length direction, which are adapted to the positioning pins of the automated production equipment to ensure the relative position accuracy of the terminal strips 500 and connector strips 700.

[0059] S2: Injection Molded Half-Body Connector 100: The component to be injection molded is placed into the mold cavity of the injection mold. Protective measures are taken to shield the electrical contact area 202 of the signal contact terminals 200 to prevent the injection molding material from covering the electrical contact area 202 and affecting subsequent electrical contact. Then, insulating plastic is injected into the mold cavity through insert injection molding. During insert injection molding, the injection temperature is controlled at 220-250℃ and the injection pressure at 80-100MPa, ensuring that both rows of signal contact terminals 200 and two metal connectors 400 are firmly bonded to the injection-molded insulating material 101, forming a single half-body connector 100. A portion of the bottom outer edge of the metal connector 400 is exposed outside the insulating material 101, forming a welded fixing part 402 that mates with the protective fitting 300. The single-body insulating material 101 includes a main body, an extension 102, and a splicing part 103. The two sides of the main body corresponding to the electrical contact area 202 are the positioning side and the splicing side, respectively.

[0060] S3: First Cut: The injection-molded half connector 100, together with the first metal carrier strip 800, is transferred to the precision punching station. The punching accuracy is controlled at ±0.01mm. The first metal carrier strip 800, the connector strip 700, and the terminal strip 500 on the splicing side of the half connector 100 are removed by the punching process. Only the terminal strip 500 on the positioning side of the half connector 100 is retained. The retained terminal strip 500 serves as the positioning reference for subsequent splicing and positioning processes to ensure the positioning accuracy of subsequent processes.

[0061] S4: Assemble the half-connector 100: The half-connector 100 is picked up by the automated equipment, and one half-connector 100 is rotated 180° around the central axis of the board-to-board connector insertion direction so that it is aligned with another identical half-connector 100 at a preset distance (i.e., aligned at a preset distance of 0.8-1.2mm). The splicing parts 103 of the two half-connectors 100 are mated together to form a rectangular frame-shaped terminal module with a four-row terminal arrangement structure. Then, using the reference hole 501 on the terminal material strip 500 reserved on the positioning side, the spliced ​​terminal module is fixed to the second metal carrier strip 900 by riveting to complete the secondary positioning. The structure of the second metal carrier strip 900 is the same as that of the first metal carrier strip 800, and its positioning hole 801 is adapted to the automated equipment to provide a stable positioning basis for the subsequent packaging and welding of the protective hardware 300.

[0062] Then, two prefabricated protective fittings 300 are fitted onto both ends of the terminal module using an automated positioning device, ensuring that the protective fittings 300 completely cover the extension 102 and splice 103 of the insulating colloid 101. The protective fittings 300 are then spot-welded to the metal connector 400 using laser welding (e.g., ...). Figure 5As shown, the circular area on the welding fixing part 402 that intersects with the protective hardware 300 is the welding point 403. The welding power is controlled at 150-200W to achieve a firm fixed connection between the two half connectors 100.

[0063] S5: Second cutting: After welding, the second metal carrier tape 900 and the remaining material tape are cut off by precision cutting equipment, and the cut surface is deburred to obtain the initial finished product of the micro-pitch board-to-board connector.

[0064] After step S5, the process also includes visual inspection and electrical performance testing of the finished product according to industry standards. Visual inspection checks for defects such as missing materials, burrs, bent terminals, welding deformation, and loose protective hardware. Electrical performance testing measures key indicators such as contact resistance, insulation resistance, and withstand voltage. Once the test is passed, the product is considered a qualified finished product.

[0065] This invention, through its "split molding + welding fixation" structural design, simplifies the production process and reduces complexity and cost by using a single-stage insert injection molding process to form a half-connector 100, which is then welded together with metal connectors 400 and protective fittings 300 to form a finished board-to-board connector. This achieves a high-density arrangement of four rows of signal contact terminals 200 while effectively improving the connector's connection reliability and overall structural strength, resulting in excellent electromagnetic shielding. Furthermore, the entire process utilizes metal carrier tapes and various material strips for positioning and transmission. Based on the pre-set positioning holes 801 on the metal carrier tape and the pre-set reference holes 501 on various material strips, automated equipment completes the riveting, injection molding, punching, splicing, and welding processes. The alignment accuracy between each material strip and its corresponding metal carrier tape is ±0.008mm, and the transmission speed of each metal carrier tape is controlled at 5-8m / min. This reduces the cumulative error caused by positioning reference conversion and ensures that the relative positional accuracy between the connector's functional components meets the reliable electrical connection and mechanical fit requirements of a micro-pitch board-to-board connector.

[0066] The embodiments described above only illustrate some implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A micro-pitch board-to-board connector, characterized in that, include: Terminal module and a pair of protective fittings (300) sleeved at both ends of the terminal module; the terminal module is formed by splicing two identical half connectors (100) together, and a central slot (110) is formed in the middle. Each of the half-body connectors (100) includes an insulating body (101), two rows of signal contact terminals (200) embedded in the main body of the insulating body (101), and two metal connectors (400), which are respectively fixed at both ends of the insulating body (101) by insert injection molding process. The electrical contact areas (202) of the two rows of signal contact terminals (200) are exposed on both sides of the main body, and the adjacent signal contact terminals (200) are arranged in opposite directions and parallel intervals. The two sides of the main body corresponding to the electrical contact areas (202) are the positioning side and the splicing side, respectively. The metal connector (400) has a welding fixing part (402) near the inner wall of the protective fitting (300), the welding fixing part (402) is welded to the protective fitting (300), thereby realizing the mutual connection of the two half connectors (100).

2. The micro-pitch board-to-board connector according to claim 1, characterized in that, The main body of the insulating colloid (101) has an integrally formed extension portion (102) at both ends, the metal connector (400) is embedded in the extension portion (102), and the welding fixing portion (402) is exposed outside the extension portion (102).

3. A micro-pitch board-to-board connector according to claim 2, characterized in that, The extension (102) also has a splicing part (103) extending toward the splicing side, so that the two half connectors (100) can be surrounded by each other to form a rectangular frame-shaped terminal module.

4. A method for manufacturing a micro-pitch board-to-board connector, used to manufacture the micro-pitch board-to-board connector as described in any one of claims 1 to 3, characterized in that, Includes the following steps: S1: Material strip preparation and pre-assembly fixing, preparing a hardware material strip (600) with protective hardware (300), preparing a connector material strip (700) with metal connectors (400), and preparing a terminal material strip (500) with a row of equally spaced parallel signal contact terminals (200). Take a pair of terminal strips (500) and arrange them opposite each other. Take a pair of connector strips (700) and place them on both sides of the pair of terminal strips (500). According to the preset reference hole positions (501) on the terminal strips (500) and connector strips (700), fix the terminal strips (500) and connector strips (700) to the first metal carrier strip (800) by riveting to form the component to be injection molded. S2: Injection-molded half connector (100), the component to be injection molded is placed into the injection mold, and through the insert injection molding process, the two rows of signal contact terminals (200) and the two metal connectors (400) are firmly bonded to the injection-molded insulating colloid (101) and integrally molded into a half connector (100). S3: First cut, the first metal carrier strip (800), the connector strip (700) and the terminal strip (500) on the splicing side of the half connector (100) are removed by punching process, and the terminal strip (500) on the positioning side of the half connector (100) is retained as the subsequent positioning reference. S4: Assemble the half-connector (100), rotate one of the half-connectors (100) 180° around the central axis of the board-to-board connector insertion and removal direction, and make the positioning sides of the two half-connectors (100) face each other, so that the splicing sides of the two half-connectors (100) face each other and are held facing each other at a preset distance that matches the size of the central slot (110), forming a terminal module with a four-row terminal arrangement structure; Subsequently, using the terminal strip (500) retained on the positioning side, the terminal module is riveted and fixed onto the second metal carrier strip (900); two prefabricated protective fittings (300) are fitted onto the two ends of the terminal module, and then the protective fittings (300) are welded to the metal connector (400) through a welding process to achieve a fixed connection between the two half-body connectors (100); S5: Second cutting, cutting away the second metal carrier tape (900) and the remaining material tape to obtain the finished board-to-board connector.

5. A method for manufacturing a micro-pitch board-to-board connector according to claim 4, characterized in that, In step S1, the terminal strip (500) and the connector strip (700) are fixed to the first metal carrier strip (800) by riveting to form the component to be injection molded; in step S4, the fitting strip (600) and the second metal carrier strip (900) are aligned through the reference hole (501) and fixed by riveting in the same way; the riveting pressure of each strip and the corresponding metal carrier strip is controlled between 0.3-0.5MPa.

6. A method for manufacturing a micro-pitch board-to-board connector according to claim 5, characterized in that, The alignment accuracy between each material strip and its corresponding metal carrier strip is ±0.008mm, and the transmission speed of each metal carrier strip is controlled at 5-8m / min to ensure that the relative positional accuracy between the functional components of the connector meets the reliable electrical connection and mechanical fit requirements of the micro-pitch board-to-board connector.

7. A method for manufacturing a micro-pitch board-to-board connector according to claim 4, characterized in that, In step S2, the metal connector (400) is made of stainless steel strip by stamping and is embedded at both ends of the insulating colloid (101). A portion of the metal connector (400) is exposed outside the extension (102) of the insulating colloid (101) to form a welding fixing part (402) for welding with the protective fitting (300).

8. A method for manufacturing a micro-pitch board-to-board connector according to claim 4, characterized in that, In step S1, after the signal contact terminal (200) is stamped, the process of electroplating its electrical contact area (202) is also included. The electroplating layer is a tin layer or a gold layer. After the electroplating is completed, the terminal strip (500) and the connector strip (700) are riveted and fixed to the first metal carrier strip (800).

9. A method for manufacturing a micro-pitch board-to-board connector according to claim 4, characterized in that, In step S4, the protective fitting (300) and the metal connector (400) are welded using laser welding technology, with the welding power controlled at 150-200W, to achieve a fixed connection between the two half-connectors.

10. A method for manufacturing a micro-pitch board-to-board connector according to claim 4, characterized in that, In step S2, during insert injection molding, the injection temperature is controlled at 220-250℃ and the injection pressure is controlled at 80-100MPa.

Images