Set for forming a multi-substrate mating structure, frame for positioning multiple substrates, substrate composite, substrate with connector, substrate set with connector, inertia device, substrate composite formation method, and substrate composite formation apparatus.

Abstract

This technology prevents overloading of connectors during board connection due to misalignment or bending of connector pins, even during manual assembly, thereby improving and ensuring the reliability of board-to-board connector connections. [Solution] The set 10 for forming a multi-substrate mating structure consists of substrates 5a, 5b, etc. with multiple connectors 6a, 6b, etc., and a frame 2 for mounting the substrates, etc. by connector mating in the internal height direction (vertical direction). The frame is provided with one or more substrate mounting protrusions 3x, 3y, etc. for positioning multiple substrates, etc. at different height positions in the vertical direction inside the frame, and the edges of the substrates, etc. are provided with positioning parts 8a1, 8a2, 8b1, 8b2, etc. for positioning in a direction perpendicular to the vertical direction (horizontal direction). Each positioning part, etc. is an opening that forms a vertical through structure that extends through all the substrates, etc. when connector mating is performed between each substrate, etc.

Description

Technical Field

[0001] The present invention relates to a set for forming a structure in which a plurality of substrates are fitted, a positioning specification frame between a plurality of substrates, a substrate composite, a substrate with a connector, a set of substrates with connectors, an inertial device, a method for forming a substrate composite, and a device for forming a substrate composite. In particular, it relates to a positioning technique when a plurality of substrates are stacked in an inertial sensor, an inertial device, or the like.

Background Art

[0002] FIG. 13 is an explanatory side sectional view showing an example of a conventional method for fixing a plurality of printed circuit boards with connectors to a case. As shown in the figure, conventionally, a spacer 99 is used for connecting a substrate 95a or the like to a case 92 and for connecting between substrates 95b - 95c or the like. In the case of the conventional example, positioning when stacking a plurality of substrates 95a, 95b,... is determined by screw holes for inter-substrate connection.

[0003] The printed circuit board with a connector shown in the figure (hereinafter, also simply referred to as "substrate with a connector", "substrate") has guide pins. The provided substrate with guide pins is relatively large in size, and there are not many options for the number of pins and the distance between substrates. As described above, a space for filling a spacer (insertion jig, etc.) is provided on the substrate, but components cannot be mounted in that space. Therefore, a dead space is formed in the main location of the substrate.

[0004] Conventionally, patent applications and the like have been made in various technical fields regarding the positioning technique between a plurality of substrates. For example, in Patent Document 1 listed below, in order to enable both a circuit board by low-back components and a mounting board by high-back components to be mounted within the same frame (housing) of a card-type electronic device, a positioning portion for supporting the substrate is formed at two locations with different height positions in the frame, and corresponding positioning grooves are also formed on the substrate side.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Japanese Patent Publication No. 10-244791, "Card-type electronic device" [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] In the conventional technologies shown in the figures above, when stacking multiple substrates, positioning is achieved using screw holes for connecting the substrates. However, due to the large tolerance of the screw holes, alignment is difficult when connecting the substrates, placing stress on the connector pins. This can lead to deformation or bending of the connector pins, resulting in a decrease in connection reliability. The importance of this problem is further exacerbated by the pin shape.

[0007] in particular, • Misalignment of mounting holes (fixing holes) between the frame and the circuit board. • Misalignment of connectors within the circuit board (i.e., when mounting the circuit board to the frame, the frame is used as the reference point, so misalignment of the connectors will cause misalignment). - Horizontal misalignment can prevent the parts from fitting together straight in the vertical direction. • Poor connector contact caused by forcing the pins in. These defects make it difficult to position the boards vertically and horizontally when mating them, resulting in connector connection problems when multiple boards are mated together.

[0008] Therefore, the problem that the present invention aims to solve is to eliminate the problems of the conventional technology and to provide a technology that prevents overloading of the connector during board connection due to misalignment or bending of the connector pins during board connection, even when assembled by hand, thereby improving and ensuring the reliability of board connection. [Means for solving the problem]

[0009] As a result of considering the above problems, the inventors of this application conceived the idea that by providing a step and a positioning pin mounting mechanism in a frame (housing) for mounting multiple circuit boards, the position in both horizontal and vertical directions can be determined. This is a method of connecting circuit boards that does not depend on the pin shape of the inter-circuit board connector, and even when assembled by hand, it is possible to prevent misalignment of the connector pins during inter-circuit board connection, overload on the connector due to bending, etc., thereby improving and ensuring connection reliability. Furthermore, the inventors also conceived a method of positioning without using positioning pins, and based on these, completed the present invention. That is to say, the invention claimed in this application, or at least the invention disclosed, as a means of solving the above problems is as follows.

[0010] [1] A set for forming a multi-substrate mating structure, comprising a multi-substrate substrate with a multi-substrate and a frame for mounting the substrate by connector mating in the internal height direction, i.e., vertical direction, wherein the frame is provided on its interior with one or more substrate mounting protrusions for positioning the multi-substrate at different height positions as a means for positioning the substrate in the vertical direction, and the edges of the substrates are provided with positioning portions as a means for positioning in the horizontal direction, which is perpendicular to the vertical direction, and each positioning portion is an opening formed so as to be able to form a vertical through structure that extends through all the substrates when forming a connector mating state between each substrate. [2] The set for forming a multiple substrate fitting structure according to [1], characterized in that the opening is a hole. [3] The set for forming a multiple substrate fitting structure according to [1], characterized in that the opening is a notch. [4] The set for forming a multi-substrate mating structure according to [1], characterized in that the opening has a shape in which the aspect ratio, which is the ratio of the major axis to the minor axis, is greater than 1, and the major axis direction of the opening is different between the two substrates that are mated with the connector. [5] The frame is provided with a positioning pin receiving portion on at least one of the substrate mounting protrusions as a positioning means in the horizontal direction which is perpendicular to the vertical direction, and the positioning pin receiving portion is a portion for receiving and at least temporarily fixing positioning pins used across a plurality of substrates as a vertical positioning means for the substrates, as a set for forming a plurality of substrate fitting structure according to any one of [1], [2], [3], or [4].

[0011] [6] The set for forming a multiple substrate fitting structure according to [5], characterized in that two or more positioning pin receiving portions are provided for each substrate mounting protrusion. [7] The set for forming a multiple substrate fitting structure according to [6], characterized in that at least a portion of the two or more substrate mounting protrusions is formed in a stepped shape, with the degree of protrusion gradually increasing from one opening side of the frame. [8] A set for forming a multiple substrate mating structure according to either [6] or [7], characterized in that it also includes the positioning pins. [9] A frame for mounting multiple circuit boards with connectors in the internal height direction, i.e., vertical direction by connector mating, characterized in that it comprises, as a means for positioning the circuit boards in the vertical direction, one or more circuit board mounting protrusions provided inside the frame for positioning the multiple circuit boards at different height positions.

[10] A positioning frame for positioning multiple substrates according to [9], comprising a positioning pin receiving portion provided on at least one of the substrate mounting protrusions as a positioning means in the horizontal direction which is perpendicular to the vertical direction, wherein the positioning pin receiving portion is a portion for receiving and at least temporarily fixing positioning pins used across a plurality of substrates as a vertical positioning means for the substrates, and two or more are provided per one of the substrate mounting protrusions.

[0012]

[11] The multi-substrate positioning frame according to

[10] , characterized in that at least a portion of the two or more substrate mounting protrusions is formed in a stepped shape, with the degree of protrusion gradually increasing from one opening side of the frame.

[12] A substrate composite characterized in that multiple substrates are mounted on a multi-substrate positioning specification frame described in any of [9],

[10] , or

[11] .

[13] The substrate composite according to

[12] , characterized in that the substrate is provided with an opening which is a positioning portion for receiving the positioning action of the positioning pin.

[14] The substrate composite according to

[13] , characterized in that the opening is a hole or a notch.

[15] The substrate composite according to

[13] , characterized in that the aspect ratio of the opening, which is the ratio of the major axis to the minor axis, is greater than 1, and the major axis of the opening is formed to be different between the two substrates that are mated with the connector.

[0013]

[16] The substrate composite according to any one of

[13] ,

[14] , or

[15] , characterized in that the positioning pin is fixed to the positioning pin receiving portion.

[17] A connector-equipped substrate used for mounting to a multi-substrate positioning specification frame described in any of [9],

[10] , or

[11] , wherein the substrate is provided with an opening that is a positioning portion in the form of a hole or notch for receiving the positioning action of the positioning pin. A circuit board with a connector, characterized by the following features.

[18] A set of connector-equipped circuit boards comprising multiple circuit boards described in

[17] , wherein each circuit board is formed to be used mounted on a single multi-circuit board positioning frame.

[19] An inertial device characterized by having a substrate composite as described in any of

[12] ,

[13] ,

[14] ,

[15] , or

[16] mounted on it.

[20] A method for forming a substrate composite by attaching a plurality of substrates with connectors to a plurality of substrate inter-substrate positioning specification frame described in any of [9],

[10] , or

[11] , characterized in that it comprises a vertical positioning step of positioning each substrate vertically by placing it on a predetermined substrate mounting extension, and a horizontal positioning step of positioning the substrates horizontally by using the positioning pins across each substrate and fixing them at least temporarily to the positioning pin receiving portion.

[21] A substrate composite forming apparatus comprising a plurality of substrates with connectors attached to a plurality of substrate inter-substrate positioning specification frame described in any of [9],

[10] , or

[11] , wherein the apparatus comprises a vertical positioning means for positioning each substrate vertically by placing it on a predetermined substrate mounting extension, and a horizontal positioning means for positioning each substrate positioned by the vertical positioning means by fixing it at least temporarily to the positioning pin receiving portion with the positioning pins, thereby positioning it horizontally. [Effects of the Invention]

[0014] The set for forming a multi-substrate mating structure, the frame for positioning multiple substrates, the substrate composite, the substrate with connector, the substrate set with connector, the inertia device, the substrate composite formation method, and the substrate composite formation apparatus of the present invention are configured as described above. Therefore, regardless of the pin shape of the inter-substrate connector, horizontal and vertical positioning can be easily and reliably performed. Even during manual assembly, it is possible to prevent overloading of the connector due to misalignment or bending of the connector pins during inter-substrate connection, thereby improving and ensuring connection reliability. Consequently, the environmental resistance of the multi-substrate mounting apparatus formed by such connector mating can be improved.

[0015] According to a set for forming a multi-substrate fitting structure of the present invention having a configuration including a frame provided with an overhanging portion for mounting a substrate as a positioning means in the vertical direction and a substrate provided with an opening as a positioning means in the horizontal direction, the positioning accuracy in the vertical and horizontal directions can be improved even without positioning pins, and they can be directly fitted when the connectors are engaged. This realizes the engagement between substrates based on the connectors, thereby preventing a load from being applied to the connectors, preventing connector connection failures, and improving connection reliability.

[0016] In addition to the configuration of the frame with the overhanging portion for mounting the substrate and the substrate with the opening, according to a set for forming a multi-substrate fitting structure of the present invention having a configuration premised on the use of positioning pins, the positioning accuracy in the horizontal direction can be further improved, and excessive position adjustment such as multiple positioning trials can be suppressed. Thereby, an excessive load is not applied when the connectors are engaged, the effect of preventing and reducing the load on the connectors becomes even higher, and the connection reliability can be further improved.

Brief Description of the Drawings

[0017] [Figure 1] It is an explanatory diagram showing a configuration example of a set for forming a multi-substrate fitting structure of the present invention in a side cross-sectional view. [Figure 1-2] It is a side cross-sectional view showing the use result of the set for forming a multi-substrate fitting structure of FIG. 1, that is, the configuration of the substrate composite. [Figure 2] It is a plan view showing a substrate configuration example according to a set for forming a multi-substrate fitting structure of the present invention. [Figure 2-2] It is a plan view showing another substrate configuration example according to a set for forming a multi-substrate fitting structure of the present invention. [Figure 3] It is an explanatory diagram showing a configuration example of a set for forming a multi-substrate fitting structure of the present invention having a positioning pin receiving portion provided in the frame in a side cross-sectional view. [Figure 4]Figure 3 is a side cross-sectional view showing the usage state of the multi-substrate mating structure formation set, i.e., the process of constructing the substrate composite. It also serves as a side cross-sectional view showing the usage state of the multi-substrate mating structure formation set, i.e., the configuration of the substrate composite, as shown in Figure 6. [Figure 4-2] Figure 3 is a side cross-sectional view showing the usage state of the set for forming a multi-substrate mating structure, i.e., the configuration of the substrate composite. [Figure 5] This is an explanatory diagram showing a side cross-sectional view of an example of a substrate composite structure configuration using a set for forming multiple substrate mating structures, which has a substrate mounting protrusion that differs in form from the example using the same set shown in Figures 1 and 3. [Figure 6] This is an explanatory diagram showing a side cross-sectional view of an example configuration of the present invention's set for forming a multi-substrate mating structure, which is equipped with positioning pins. [Figure 7] This is a perspective view (s) and a side view (t) from the T direction in (s) showing an example of the configuration of a connector-equipped substrate of the present invention. [Figure 8] Figure 7 shows an example of a substrate composite structure using the substrate (set), and Figure 7 shows a perspective view (s) and a side cross-sectional view taken along the TT arrow in Figure (s). [Figure 9] Figure 8 is a perspective view showing an example of the frame used in the substrate composite. [Figure 10] This is a side cross-sectional view illustrating an example configuration of the connector-equipped circuit board set of the present invention. [Figure 11] This is a flowchart showing the basic configuration of the substrate composite formation method of the present invention. [Figure 12] This is a conceptual diagram showing the basic configuration of the substrate composite formation apparatus of the present invention. [Figure 13] This is a side cross-sectional view diagram illustrating a conventional method for fixing multiple printed circuit boards with connectors to a case, as an example. [Modes for carrying out the invention]

[0018] The present invention will be described in detail below with reference to the drawings. However, the specific specifications of each element in each drawing, such as its form, arrangement, and quantity, are not particularly limited unless otherwise specified in the following description. Figure 1 is an explanatory diagram showing an example of the configuration of the multi-substrate mating structure formation set of the present invention in a side cross-sectional view. Figure 1-2 is a side cross-sectional view showing the result of using the multi-substrate mating structure formation set of Figure 1, i.e., the configuration of the substrate composite. As shown in Figure 1, the set 10 for forming a multi-substrate mating structure consists of substrates 5a, 5b, etc. with multiple connectors 6a, 6b, etc., and a frame 2 for mounting the substrates 5a, 5b, etc. by connector mating in the internal height direction, i.e., vertical direction. The frame 2 is provided with one or more substrate mounting protrusions 3x, 3y, etc. on its inside as a means for positioning the substrates 5a, 5b, etc. in the vertical direction, for positioning the multiple substrates 5a, 5b, etc. at different height positions. Positioning portions 8a1, 8a2, 8b1, 8b2, etc. are provided on the edges of the substrates 5a, 5b, etc. as a means for positioning in the horizontal direction, which is perpendicular to the vertical direction. The main configuration is that each of the positioning portions 8a1, 8a2, 8b1, 8b2, etc., is an opening formed so as to be able to form a vertical through structure that extends across all substrates 5a, 5b, etc. when forming a connector mating state between each substrate 5a, 5b, etc.

[0019] Using the multi-substrate mating structure formation set 10 of the present invention, which has the above configuration, the multi-substrate mating structure and the substrate composite 30 shown in Figure 1-2 are formed, and this will be explained below. When installing circuit boards 5a, 5b, etc., with connectors 6a, 6b, etc., on frame 2, the circuit boards 5a, 5b, etc., are placed on one or more circuit board mounting protrusions 3x, 3y, etc., which are provided vertically on the inner wall of frame 2. In other words, in the illustrated example, circuit board 5c is placed on the lowest circuit board mounting protrusion 3z, then circuit board 5b is placed on the circuit board mounting protrusion 3y above it, and finally circuit board 5a is placed on the uppermost circuit board mounting protrusion 3x. In this way, multiple circuit boards 5a, 5b, etc., are positioned at different height positions (vertical direction). Simultaneously with this vertical positioning, horizontal positioning and the formation of a mating state between connectors 6a-6b, etc., between each circuit board 5a-5b, etc., occur.

[0020] In other words, as shown in the figure, for example, a vertical through-structure is formed between the positioning parts 8c1, 8c2, etc., which are horizontal positioning means provided on the edge of substrate 5c, and the positioning parts 8b1, 8b2, etc., which are horizontal positioning means provided on the edge of substrate 5b, simultaneously with the vertical positioning described above. That is, the corresponding vertically positioned positioning parts 8c1-8b1 and 8c2-8b2 are aligned when viewed from above. Consequently, horizontal positioning is achieved, and at the same time, the mating state between the connectors 6c-6b' between substrates 5c-5b is formed. The formation of such through-structures, horizontal positioning, and connector mating state is performed for all substrates.

[0021] Figure 2 is a plan view showing an example of a substrate configuration related to the multi-substrate mating structure formation set of the present invention. Three examples of configurations are shown in the figure: (i), (ii), and (iii). As illustrated in these examples, the positioning portion 8a1 of the substrate 5a etc. related to this multi-substrate mating structure formation set is an opening formed so as to be able to form a vertical through structure that extends across all substrates when forming a connector mating state between each substrate, and specifically it can be in the form of a hole, that is, a hole portion.

[0022] Figure 2(i) shows a substrate 5a with oval-shaped positioning parts 8a1, 8a2, 8a3, and 8a4 at its four corners, and a substrate 5b with similarly oval-shaped positioning parts 8b1, 8b2, 8b3, and 8b4 at its four corners. Between the two substrates 5a and 5b, a vertical through structure is formed between corresponding positioning parts, such as between positioning part 8a1 and positioning part 8b1, enabling horizontal positioning and simultaneously forming a mated state between connector 6a and connector 6b. The shape of the positioning parts may be a rectangle with rounded corners instead of an oval shape.

[0023] Furthermore, the shape of the positioning portion 8a1 etc. (opening) shown in (i) is such that the aspect ratio, which is the ratio of the major axis to the minor axis, is greater than 1. As shown in the figure, the major axis directions of the positioning portion 8a1 etc. (opening) can be different between the two substrates 5a and 5b that the connector is mated to. This allows for the absorption of slight positional misalignment between the substrates 5a and 5b, and enables the smooth formation of a good connector mating state.

[0024] Figure 2(ii) shows a substrate 15a with diamond-shaped positioning parts 18a1, 18a2, 18a3, and 18a4 at its four corners, and a substrate 15b with similarly diamond-shaped positioning parts 18b1, 18b2, 18b3, and 18b4 at its four corners. Between the two substrates 15a and 15b, a vertical through structure is formed between corresponding positioning parts, such as between positioning part 18a1 and positioning part 18b1, enabling horizontal positioning and simultaneously forming a mating state between connector 16a and connector 16b. The shape of the positioning parts may be a Greek cross shape instead of a diamond shape.

[0025] Furthermore, the shape of the positioning portion 18a1 etc. (opening) shown in (ii) is such that the aspect ratio, which is the ratio of the major axis to the minor axis, is greater than 1. As shown in the figure, the major axis directions of the positioning portion 18a1 etc. (opening) can be different between the two substrates 15a and 15b that the connector is mated to. This allows for the absorption of slight positional misalignment between the substrates 15a and 15b, and enables the smooth formation of a good connector mating state.

[0026] Figure 2(iii) shows a substrate 25a with circular positioning portions 28a1, 28a2, 28a3, and 28a4 at its four corners, and a substrate 25b with circular positioning portions 28b1, 28b2, 28b3, and 28b4 at its four corners. Between the two substrates 25a and 25b, a vertical through structure is formed between corresponding positioning portions, such as between positioning portion 28a1 and positioning portion 28b1, enabling horizontal positioning and simultaneously forming a mated state between connector 26a and connector 26b.

[0027] The shape of the positioning portion 28a1 etc. (opening) shown in (iii) has an aspect ratio of 1, which is the ratio of the major axis to the minor axis. Therefore, it does not have the effect of absorbing subtle positional misalignments between substrates 5a and 5b, as in the examples of (i) and (ii). However, this example is also within the scope of the present invention and is not excluded.

[0028] Figure 2-2 is a plan view showing another example of a substrate configuration related to the multi-substrate mating structure formation set of the present invention. As shown in the figure, the positioning portion 38a1 of the substrate 35a etc. related to this multi-substrate mating structure formation set is an opening formed so as to be able to form a vertical through structure that extends across all substrates when forming a connector mating state between each substrate, but specifically it can be a notch.

[0029] This figure shows a substrate 35a with positioning sections 38a1, 38a2, 38a3, and 38a4, which are notches, located at its four corners, and a substrate 35b with positioning sections 38b1, 38b2, 38b3, and 38b4, which are also notches, located at its four corners. Between the two substrates 35a and 35b, a vertical through-structure is formed between corresponding positioning sections, such as between positioning section 38a1 and positioning section 38b1, thereby enabling horizontal positioning and simultaneously forming a mated state between connector 36a and connector 36b. The specific shape of the notches is not limited to those shown, and any opening that allows for the formation of a vertical through-structure between corresponding positioning sections is acceptable.

[0030] The shape of the positioning portion 38a1 etc. (opening) shown in the figure is such that the aspect ratio, which is the ratio of the major axis to the minor axis, is greater than 1. As shown in the figure, the major axis directions of the positioning portion 38a1 etc. (opening) can be different between the two substrates 35a and 35b that the connector is mated to. This allows for the absorption of slight positional misalignment between the substrates 35a and 35b, and enables the smooth formation of a good connector mating state. However, the present invention is not excluded even when the aspect ratio is 1.

[0031] In this way, by providing positioning parts 8a1, etc., it is possible to absorb connector misalignment and improve horizontal positioning accuracy. Furthermore, in the examples shown in Figures 2(i), (ii), and 2-2, by making the longitudinal axis direction of the positioning parts 8a1, etc. (openings) different between the two substrates 5a and 5b that the connectors are mated to, play is created in horizontal positioning. This suppresses excessive horizontal adjustment during mating, prevents connection failures, and improves connection reliability.

[0032] Figure 3 is an explanatory diagram showing a side cross-sectional view of an example configuration of the present invention's set for forming a multi-substrate mating structure, which includes a positioning pin receiving portion on the frame. Figure 4 is a side cross-sectional view showing the usage state of the multi-substrate mating structure forming set of Figure 3, i.e., the process of constructing the substrate composite, and Figure 4-2 is a side cross-sectional view showing the usage state of the multi-substrate mating structure forming set of Figure 3, i.e., the configuration of the completed substrate composite. As shown in Figure 3, in addition to the configuration described using Figure 1 above, the multi-substrate mating structure forming set 410 can be configured to include a positioning pin receiving portion 47 on the frame 42, which is a positioning means in the horizontal direction, which is perpendicular to the vertical direction, and is provided on at least one of the substrate mounting protrusions 43x, etc. (substrate mounting protrusion 43z in the figure) for substrate mounting.

[0033] As shown in Figure 4, this positioning pin receiving portion 47 is a part that receives and, at least temporarily, fixes the positioning pins 44 used across multiple substrates such as substrates 45a and 45b as a vertical positioning means. This makes horizontal positioning easier when the substrates are fitted together, improving work efficiency and positioning accuracy. The positioning pins 44 can be fixed by any appropriate method, such as screwing.

[0034] In Figures 3 and 4, the positioning pin receiving portion 47 is an insertion hole with an open lower end into which positioning pins 44 that have penetrated the respective positioning portions 48a1, 48b1, 48c1, etc., of each substrate 45a, 45b, 45c are inserted. However, the specific form is not limited to this. For example, it may be a form where the lower end is not open and is closed, or a form in which the insertion depth of the positioning pins 44 is shallower.

[0035] As shown in the figure, the positioning pin receiving portion 47 can be configured to have two or more per substrate mounting protrusion 43z, etc., which is more desirable. With a single positioning pin receiving portion, one positioning pin 44 will be used, but with two or more, two or more positioning pins 44 can be used, allowing for more precise horizontal positioning. However, as mentioned above, having a moderate amount of play is also beneficial as it can suppress excessive horizontal adjustment during fitting, and considering that it can also simplify the work procedure, a configuration with two positioning pin receiving portions 47, 47 per substrate mounting protrusion 43z, etc., is optimal for achieving the intended purpose of the present invention.

[0036] From the state of the substrate composite 430M shown in Figure 4, which is the state in which a vertical through-structure is formed by inserting the positioning pins 44 into the positioning portion 48a1 etc. and receiving them in the positioning pin receiving portion 47, the positioning pins 44 are removed to become the completed substrate composite 430Z shown in Figure 4-2. However, as will be explained later using Figure 6, the substrate composite 430M shown in Figure 4, that is, the state in which the positioning pins 44 are still inserted, may also be considered the completed form of the substrate composite.

[0037] As shown in Figures 1 and 3 above, in the present invention, the set 10 for forming a multiple substrate fitting structure can be configured such that at least a portion of the two or more substrate mounting protrusions 3x are formed in a stepped shape, with the degree of protrusion gradually increasing from one opening side of the frame 2. In the set 10 for forming a multiple substrate fitting structure shown in Figure 1, the substrate mounting protrusions 3x, 3y, and 3z are provided in order from the upper opening side of the frame 2 in the figure, and a stepped shape with the degree of protrusion gradually increasing is formed in this order. The same applies to the example in Figure 3. In all of these examples, all of the two or more substrate mounting protrusions 3x are formed in a stepped shape, with the degree of protrusion gradually increasing from one opening side of the frame 2.

[0038] When forming a substrate composite 30, etc., using a set 10 for forming a multiple substrate fitting structure, etc., in which vertical positioning is achieved by substrate mounting protrusions 3x, etc., the substrate stacking can be easily achieved by making the bottom substrate 5z, which is installed first, the smallest size, and increasing the size as the layers get higher. Therefore, a configuration in which each substrate mounting protrusion 3x, etc. is provided in a stepped shape from one opening side of the frame 2, etc., with the degree of protrusion gradually increasing is useful.

[0039] Figure 5 is an explanatory diagram showing a side cross-sectional view of an example of a substrate composite structure using a set for forming multiple substrate mating structures, which has a different form of substrate mounting protrusions than the examples using the same set shown in Figures 1 and 3. As shown in the figure, in this example, the substrate composite structure 530 using the set for forming multiple substrate mating structures is formed in a stepped shape where the degree of protrusion gradually increases from one opening side (the bottom side in the figure) of the frame 52, but not all of the two or more substrate mounting protrusions (substrate mounting protrusions 53z, 53y). On the other hand, the uppermost substrate mounting protrusion 53x deviates from the standard / specification of <the degree of protrusion gradually increases from the opening side (the bottom side in the figure)>.

[0040] The method for forming the substrate composite 530 differs from the formation method using the multiple substrate fitting structure formation set 10 shown in Figures 1 and 3. In the latter case, all substrates 5c, 5b, 5a, etc. are placed in that order from one opening side of the frame 2, etc. However, in the example shown in Figure 5, substrates 55b and 55c are placed in that order from one opening side (bottom side in the figure) of the frame 52, while substrate 55a is placed from the opposite opening side (top side in the figure).

[0041] The method for forming this substrate composite 530 involves installing the substrate 55a, etc., into the frame 52 from both openings, rather than from just one. However, both the front and back surfaces of a single inward-facing protrusion 51 can be used as substrate mounting protrusions. In the figure, these are substrate mounting protrusions 53x and 53y. This allows for a relaxation of the size limitations on the stacked substrates. In other words, if all the substrate mounting protrusions are in a stepped shape, as shown in Figures 1-2, 4, and 4-2, the bottommost substrate mounting protrusion will protrude considerably inward, thus limiting the size of the substrate placed there.

[0042] However, in the example shown in Figure 5, by making the stepped shape only a part of it rather than the whole, an inwardly protruding portion 51 can be formed, and both the front and back surfaces can be made into substrate mounting protrusions 53x and 53y, thereby relaxing the size limitations of the substrate to be mounted. Incidentally, in the substrate composite 430M and other examples in Figures 4 and 4-2, the size of the smallest substrate, substrate 45c, is reduced to 84% of the largest substrate, substrate 45a, while in the substrate composite 530 in Figure 5, the size of the smallest substrate, substrate 55b, remains at 91% of the largest substrate, substrate 55a.

[0043] Figure 6 is an explanatory diagram showing a side cross-sectional view of an example configuration of the multi-substrate mating structure forming set of the present invention, which is equipped with positioning pins. As shown in the figure, the multi-substrate mating structure forming set 610 can be configured to include one or more positioning pins 64 in addition to the configurations described above. The figure shows an example in which two pins are provided. The substrate composite formed using this set 610 will be the same as the substrate composite 430M shown in Figure 4 above.

[0044] The frame 2 etc. described above using Figures 1 to 6 is also within the scope of the present invention. That is, a frame 2 etc. for mounting substrates 5a etc. with multiple connectors 6a etc. by connector fitting in the internal height direction, i.e., vertical direction, and comprising, as a means for positioning the substrates 5a etc. in the vertical direction, one or more substrate mounting protrusions 3x etc. provided inside the frame for positioning the multiple substrates 5a etc. at different height positions, is a frame 2 etc. with a multi-substrate positioning specification.

[0045] Furthermore, the following additional configurations may be appropriately added to the multi-substrate positioning specification frame 2 of the present invention. - The configuration includes a positioning pin receiving portion 47, etc., provided on at least one substrate mounting protrusion 43z, etc., as a horizontal positioning means (see Figure 3, etc. The positioning pin receiving portion 47, etc., is a part that receives and at least temporarily fixes positioning pins 44 used across multiple substrates 45a, etc., as a vertical positioning means for substrates 45a, etc.). • The configuration includes two or more positioning pin receiving sections 47, etc., per substrate mounting protrusion 43z, etc. (see Figure 3, etc.). • At least a portion of two or more substrate mounting protrusions 3x, etc., is formed in a stepped configuration from one opening side of the frame, with the degree of protrusion gradually increasing (see Figures 1, 5, etc.).

[0046] Furthermore, the substrate composite 30 described in Figures 1-2, 4, 4-2, and 5 is also within the scope of the present invention. That is, it is a substrate composite in which multiple substrates are attached to a frame for positioning multiple substrates. The following additional configurations may be added to the substrate composite 30 of the present invention as appropriate. The substrate is provided with openings that serve as positioning areas for receiving the positioning action of the positioning pins (see Figure 1, etc.). • The opening is a hole or notch (see Figure 2, 2-2). The opening has an aspect ratio greater than 1, and is formed such that the long axis direction of the opening is different between the two substrates that the connector is mated to (see Figure 2, 2-2). The positioning pin is fixed to the positioning pin receiving portion (see Figure 4).

[0047] Figure 7 shows a perspective view (s) and a side view (t) from the T direction in (s) of an example configuration of a connector-equipped substrate of the present invention. As shown in the figure, the connector-equipped substrate 75a, etc., is used by being attached to a multi-substrate positioning specification frame 2, etc., of any of the above-described configurations, and is provided with an opening 78a1, etc., which is a positioning portion in the form of a hole or notch for receiving a positioning action by a positioning pin (not shown).

[0048] In the figure, the substrate 75a has openings 78a1, 78a2, 78a3, and 78a4 at its four corners, and a connector 76a is provided. On the other hand, the substrate 75b, which forms a connector mating state with the substrate 75a, has openings 78b1, 78b2, 78b3, and 78b4 at its four corners, corresponding to those of the substrate 75a, and a connector 76b corresponding to the connector 76a is provided.

[0049] Figure 8 is a perspective view (s) showing an example of the configuration of a substrate composite using the substrate (set) of Figure 7, and a cross-sectional view taken along the TT arrow in Figure (s). As shown, substrates 75b and 75a are placed on the multiple substrate positioning specification frame 72 in a state where they are positioned vertically and horizontally, and at the same time the connectors 76b and 76a are mated, forming the substrate composite 730. Figure 9 is a perspective view showing the form of an example frame used in the substrate composite of Figure 8, and as shown here, in this frame 72, substrate mounting protrusions 73x and 73y are provided on the upper and lower surfaces of a single inward protrusion 71, respectively. Thus, configurations with substrate mounting protrusions in a form other than the staircase form described above are also within the scope of the present invention.

[0050] Figure 10 is a side cross-sectional view illustrating an example of the configuration of the connector-equipped substrate set of the present invention. As shown in the figure, the connector-equipped substrate set 5S is a set consisting of multiple connector-equipped substrates 5a, 5b, etc., and each substrate 5a, etc. is pre-formed to be used by being mounted on a single multi-substrate positioning specification frame (not shown).

[0051] Furthermore, devices such as inertial devices on which a substrate composite 30 or the like having any of the above-described configurations is mounted are also within the scope of the present invention.

[0052] Figure 11 is a flowchart showing the basic configuration of the substrate composite formation method of the present invention. As shown in the figure, the substrate composite formation method is a method of forming a substrate composite 30 by attaching a plurality of substrates with connectors to a plurality of substrate inter-substrate positioning specification frame of any of the above configurations, and mainly consists of a vertical positioning process P10 in which each substrate is positioned vertically by placing it on a predetermined substrate mounting extension, and a horizontal positioning process P20 in which positioning is performed horizontally by using positioning pins across each substrate and fixing them at least temporarily to a positioning pin receiving part.

[0053] According to this substrate composite formation method, in the vertical positioning process P10, each substrate is placed on a predetermined substrate mounting extension to perform vertical positioning, and then in the horizontal positioning process P20, positioning pins are used across each substrate and fixed at least temporarily to a positioning pin receiving portion to perform horizontal positioning, thereby forming a substrate composite 30 in which multiple substrates with connectors are attached to a multi-substrate positioning specification frame.

[0054] Figure 12 is a conceptual diagram showing the basic configuration of the substrate composite forming apparatus of the present invention. As shown in the figure, the substrate composite forming apparatus 1000 is an apparatus that forms a substrate composite by attaching multiple substrates with connectors to a multiple substrate positioning specification frame having one of the above configurations, and its main configuration is that it comprises a vertical positioning means 560 that positions each substrate vertically by placing it on a predetermined substrate mounting extension, and a horizontal positioning means 580 that positions each substrate positioned by the vertical positioning means by fixing it at least temporarily to a positioning pin receiving part with positioning pins.

[0055] In the substrate composite forming apparatus 1000 with this configuration, each substrate is placed on a predetermined substrate mounting extension by the vertical positioning means 560 to perform vertical positioning, and the horizontal positioning means 580 is fixed to each substrate positioned by the vertical positioning means at least temporarily by positioning pins on positioning pin receiving parts to perform horizontal positioning, and finally a substrate composite is formed in which multiple substrates with connectors are attached to a multi-substrate positioning specification frame. [Industrial applicability]

[0056] According to the present invention's set for forming a multi-substrate mating structure, regardless of the pin shape of the inter-substrate connector, horizontal and vertical positioning can be easily and reliably performed, improving connector connection failures and enhancing the reliability of connector connections. Therefore, this invention has high industrial applicability in manufacturing and usage fields of devices using multiple substrates through connector mating, including inertial devices, and all related fields. [Explanation of Symbols]

[0057] 2, 42, 52, 62, 72… Frames (frames with multiple board positioning specifications) 3x, 3y, 3z, 43x, 43y, 43z, 53x, 53y, 53z, 63x, 63y, 63z, 73x, 73y... Overhang for board placement 5a, 5b, 5c, 15a, 15b, 25a, 25b, 35a, 35b, 45a, 45b, 45c, 55a, 55b, 55c, 65a, 65b, 65c, 75a, 75b...board 5S…Circuit board set with connector 6a, 6b, 6b', 6c, 16a, 16b, 26a, 26b, 36a, 36b, 46a, 46b, 46b', 46c, 56a, 56b, 56b', 56c, 66a, 66b, 66b', 66c, 76a, 76b… Connectors 8a1, 8a2, 8a3, 8a4, 8b1, 8b2, 8b3, 8b4, 8c1, 8c2, 18a1, 18a2, 18a3, 18a4, 18b1, 18b 2, 18b3, 18b4, 28a1, 28a2, 28a3, 28a4, 28b1, 28b2, 28b3, 28b4, 38a1, 38a2, 38a3, 3 8a4, 38b1, 38b2, 38b3, 38b4, 48a1, 48a2, 48b1, 48b2, 48c1, 48c2, 68a1, 68a2, 68b1, 68b2, 68c1, 68c2, 78a1, 78a2, 78a3, 78a4, 78b1, 78b2, 78b3, 78b4... Positioning parts (openings) 10, 410, 610… Set for forming multiple substrate mating structures 30, 430Z, 530, 730...Substrate composite 44, 54, 64… Positioning pins 47, 67... Positioning pin receiving section 51, 71... Inwardly protruding part 430M…The process of constructing a substrate composite (which is also a substrate composite formed by the set for forming a multi-substrate mating structure shown in Figure 6). 560...Vertical positioning means 580... Horizontal positioning means 1000…Substrate composite forming device P10...Vertical positioning process P20...Horizontal positioning process 92... Case 95a, 95b, 95c… circuit boards 96a, 96b, 96b', 96c… Connectors 99...Spacer 930…Substrate composite

Claims

1. A circuit board with multiple connectors, A set for forming a multi-substrate mating structure, comprising a frame for mounting the substrate by connector mating in the internal height direction, i.e., vertical direction, The frame has, on its inside, a means for positioning the substrate in the vertical direction, One or more substrate mounting protrusions are provided for positioning multiple substrates at different height positions. A positioning portion is provided on the edge of the substrate as a positioning means in the horizontal direction, which is perpendicular to the vertical direction. Each positioning part is, When forming the connector mating state between each board This opening is formed to create a vertical through-structure that extends across the entire substrate. A set for forming a multi-substrate mating structure, characterized by the above features.

2. The set for forming a multiple substrate fitting structure according to claim 1, characterized in that the opening is a hole.

3. The set for forming a multiple substrate fitting structure according to claim 1, characterized in that the opening is a notch.

4. The set for forming a multi-substrate mating structure according to claim 1, characterized in that the opening has a shape in which the aspect ratio, which is the ratio of the major axis to the minor axis, is greater than 1, and the major axis direction of the opening is different between the two substrates that are mated with the connector.

5. The aforementioned frame is As a positioning means in the horizontal direction, which is perpendicular to the vertical direction, it is provided with a positioning pin receiving portion provided on at least one of the substrate mounting protrusions, The positioning pin receiving portion is a part for receiving and at least temporarily fixing positioning pins used across multiple substrates as a means of vertical positioning the substrates. A set for forming a plurality of substrate mating structure according to any one of claims 1, 2, 3, or 4, characterized in that

6. The set for forming a multiple substrate fitting structure according to claim 5, characterized in that two or more positioning pin receiving portions are provided for each substrate mounting protrusion.

7. The set for forming a multiple substrate fitting structure according to claim 6, characterized in that at least a portion of the two or more substrate mounting protrusions is formed in a stepped shape, with the degree of protrusion gradually increasing from one opening side of the frame.

8. A set for forming a multiple substrate fitting structure according to any one of claims 6 or 7, characterized in that it also includes the positioning pins.

9. A frame for mounting multiple circuit boards with connectors in the internal height direction, i.e., vertical direction, by connector mating, As a means for positioning the substrate in the vertical direction, the frame includes one or more substrate mounting protrusions provided on the inside of the frame for positioning multiple substrates at different height positions. A frame with a multi-substrate positioning specification, characterized by the above features.

10. As a positioning means in the horizontal direction which is perpendicular to the vertical direction, it is provided with a positioning pin receiving portion provided on at least one of the substrate mounting protrusions, The positioning pin receiving portion is A portion for receiving and at least temporarily fixing positioning pins used across multiple substrates as a means of vertical positioning the substrate, The multi-substrate positioning frame according to claim 9, characterized in that two or more are provided per one of the substrate mounting protrusions.

11. The multi-substrate positioning frame according to claim 10, characterized in that at least a portion of the two or more substrate mounting protrusions is formed in a stepped shape, with the degree of protrusion gradually increasing from one opening side of the frame.

12. A substrate composite characterized in that a plurality of substrates are mounted on a plurality of substrate positioning specification frame according to any one of claims 9, 10, or 11.

13. The substrate composite according to claim 12, characterized in that the substrate is provided with an opening which is a positioning portion for receiving the positioning action by the positioning pin.

14. The substrate composite according to claim 13, characterized in that the opening is a hole or a notch.

15. The substrate composite according to claim 13, characterized in that the aspect ratio of the opening, where the ratio of the major axis to the minor axis is, is greater than 1, and the major axis direction of the opening is different between the two substrates that are mated with the connector.

16. The substrate composite according to any one of claims 13, 14, or 15, characterized in that the positioning pin is fixed to the positioning pin receiving portion.

17. A connector-equipped substrate for use attached to a multi-substrate positioning specification frame according to any one of claims 9, 10, or 11, An opening is provided, which is a positioning portion in the form of a hole or notch, for receiving the positioning action of the positioning pin. A circuit board with a connector, characterized by the following features.

18. A set of connector-equipped circuit boards comprising multiple circuit boards according to claim 17, wherein each circuit board is formed to be used mounted on a single multi-circuit board positioning frame.

19. An inertial device characterized by having a substrate composite according to any one of claims 12, 13, 14, 15, or 16 mounted on it.

20. A method for forming a substrate composite by attaching a plurality of substrates with connectors to a plurality of substrate positioning specification frame according to any one of claims 9, 10, or 11, A vertical positioning process in which each substrate is positioned vertically by placing it on a predetermined substrate mounting extension, Next, a horizontal positioning process is performed by using the positioning pins across each substrate and fixing them at least temporarily to the positioning pin receiving portion to perform horizontal positioning. A method for forming a substrate composite, characterized by comprising the above.

21. An apparatus for forming a substrate composite by attaching a plurality of substrates with connectors to a plurality of substrate positioning specification frame according to any one of claims 9, 10, or 11, A vertical positioning means for positioning each substrate vertically by placing it on a predetermined substrate mounting protrusion, A horizontal positioning means is provided to position each substrate positioned by the vertical positioning means by fixing it at least temporarily to the positioning pin receiving portion with the positioning pins, thereby performing horizontal positioning. A substrate composite forming apparatus characterized by comprising the following:

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