Deposition source, manufacturing apparatus and manufacturing method of display device, electronic device and manufacturing method thereof

Abstract

A deposition source, a manufacturing apparatus and a manufacturing method of a display device, an electronic device and a manufacturing method thereof are disclosed. The deposition source includes a crucible to accommodate a deposition material, a nozzle portion connected to the crucible and having a nozzle to guide the deposition material in the crucible to an outside, and a plurality of reflectors arranged at a side of the nozzle portion and above the nozzle portion and spaced apart from each other, the plurality of reflectors including an opening portion to expose the nozzle to the outside, one of the plurality of reflectors including a first portion spaced apart from a portion of another one of the plurality of reflectors, wherein the another one of the plurality of reflectors is spaced apart from at least a portion of the one of the plurality of reflectors, and a second portion arranged on the opening portion and bent from the first portion and in contact with the another one of the plurality of reflectors. The manufacturing apparatus of the display device includes the deposition source arranged to face a substrate, and a mask assembly arranged between the deposition source and the substrate.

Description

Technical Field

[0001] The embodiments of the present invention relate to an apparatus and a method, and more specifically to a deposition source, an apparatus and method for manufacturing a display device, and an electronic device and a method for manufacturing the same. Background Technology

[0002] Mobile electronic devices are widely used. Besides small electronic devices such as mobile phones, tablet PCs have recently become increasingly common as mobile electronic devices.

[0003] To support multiple functions and to provide users with visual information such as images or videos, such mobile electronic devices include display devices. Recently, with the miniaturization of other components used to drive the display device, the proportion of display devices in electronic devices has been gradually increasing, and structures that can be bent from a flat state at a specified angle are also being developed. Summary of the Invention

[0004] Typically, in the manufacture of display devices, a deposit material is supplied onto a substrate to form at least one layer. At this time, the deposition source supplying the deposit material can heat the deposit material at high temperatures. This deposit material may adhere to the deposition source, reducing its functionality. To address this problem, embodiments of the present invention provide a deposition source, a manufacturing apparatus and method for a display device, and an electronic device and method thereof, which reduce the amount of deposit material adhering to the deposition source.

[0005] An embodiment of the present invention discloses a deposition source comprising: a crucible for receiving deposited material; a nozzle portion connected to the crucible and having a nozzle for guiding the deposited material within the crucible to the outside; and a plurality of reflectors arranged on the sides and above the nozzle portion and spaced apart from each other, the plurality of reflectors including an opening exposing the nozzle to the outside, one of the plurality of reflectors comprising: a first portion spaced apart from a portion of another of the plurality of reflectors, wherein the other of the plurality of reflectors is spaced apart from at least a portion of the first of the plurality of reflectors; and a second portion arranged in the opening and bent from the first portion and contacting the other of the plurality of reflectors.

[0006] In this embodiment, the second portion of at least two of the plurality of reflectors may be arranged in a stepped shape.

[0007] In this embodiment, at least a portion of the surface of the second part may be inclined.

[0008] In this embodiment, the area of ​​the opening of some of the plurality of reflectors can be increased sequentially in the direction away from the inlet of the nozzle.

[0009] In this embodiment, the plurality of reflectors may include: a first reflector disposed on the side of the nozzle and having a first opening for insertion of the nozzle; and a second reflector disposed above the nozzle and having a second opening.

[0010] In this embodiment, each of the reflectors may include a carbon composite material.

[0011] In this embodiment, a heat insulation component may be further included, which is arranged between adjacent reflectors of the plurality of reflectors.

[0012] In this embodiment, the emissivity of the reflector and the emissivity of the heat insulation component may be different from each other.

[0013] In this embodiment, the heat insulation component may include metal.

[0014] Another embodiment of the present invention discloses a manufacturing apparatus for a display device, comprising: a deposition source as described above, arranged to face a substrate; and a mask assembly disposed between the deposition source and the substrate.

[0015] Another embodiment of the present invention discloses a method for manufacturing a display device, comprising the following steps: arranging a substrate and a mask assembly inside a cavity; and supplying a deposition material to the substrate from a deposition source, the deposition material being deposited on the substrate via the mask assembly, the deposition source comprising: a crucible for receiving the deposition material; a nozzle portion connected to the crucible and having a nozzle for guiding the deposition material within the crucible to the outside; and a plurality of reflectors arranged on the sides and above the nozzle portion and spaced apart from each other, the plurality of reflectors including an opening exposing the nozzle to the outside, one of the plurality of reflectors comprising: a first portion spaced apart from a portion of another of the plurality of reflectors, wherein the other of the plurality of reflectors is spaced apart from at least a portion of the first of the plurality of reflectors; and a second portion arranged in the opening and bent from the first portion and contacting the other of the plurality of reflectors.

[0016] In this embodiment, the second portion of at least two of the plurality of reflectors may be arranged in a stepped shape.

[0017] In this embodiment, at least a portion of the surface of the second part may be inclined.

[0018] In this embodiment, the area of ​​the opening of some of the plurality of reflectors can be increased sequentially in the direction away from the inlet of the nozzle.

[0019] In this embodiment, the plurality of reflectors may include: a first reflector disposed on the side of the nozzle and having a first opening for insertion of the nozzle; and a second reflector disposed above the nozzle and having a second opening.

[0020] In this embodiment, each of the reflectors may include a carbon composite material.

[0021] In this embodiment, the deposition source may further include a heat insulation component disposed between adjacent reflectors of the plurality of reflectors.

[0022] In this embodiment, the emissivity of the reflector and the emissivity of the heat insulation component may be different from each other.

[0023] In this embodiment, the heat insulation component may include metal.

[0024] Another embodiment of the present invention discloses an electronic device comprising a display device manufactured by the above-described display device manufacturing apparatus.

[0025] Another embodiment of the present invention discloses a method for manufacturing an electronic device, which is used to manufacture an electronic device including a display device, the display device being manufactured by: arranging a substrate and a mask assembly inside a cavity, and supplying a deposition material to the substrate by a deposition source, the deposition material being deposited on the substrate through the mask assembly, the deposition source including: a crucible for receiving the deposition material; a nozzle portion connected to the crucible and having a nozzle for guiding the deposition material in the crucible to the outside; and a plurality of reflectors arranged on the sides and above the nozzle portion and spaced apart from each other, the plurality of reflectors including an opening that exposes the nozzle to the outside, one of the plurality of reflectors including: a first portion spaced apart from a portion of another of the plurality of reflectors, wherein the other of the plurality of reflectors is spaced apart from at least a portion of the first of the plurality of reflectors; and a second portion arranged in the opening and bent from the first portion and contacting the other of the plurality of reflectors.

[0026] Other aspects, features, and advantages, in addition to those described above, will become clear from the following drawings, claims, and detailed description of the invention.

[0027] This general and specific aspect can be implemented by using systems, methods, computer programs, or any combination of systems, methods, and computer programs.

[0028] The manufacturing apparatus, method, and method of the display device according to embodiments of the present invention can reduce the deposited material adsorbed onto the reflector.

[0029] The manufacturing apparatus, method, and method of the display device according to embodiments of the present invention can avoid obstructing the path of the deposited material.

[0030] The display device manufacturing apparatus, display device manufacturing method, and electronic device manufacturing method of the present invention can uniformly deposit a deposition material on a substrate.

[0031] The electronic device of an embodiment of the present invention can provide a clear image. Attached Figure Description

[0032] Figure 1 This is a cross-sectional view schematically illustrating a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0033] Figure 2a It is a schematic representation Figure 1 The cross-sectional view of the sediment source is shown.

[0034] Figure 2b It is a schematic representation Figure 2a A partial three-dimensional view of the first reflector shown.

[0035] Figure 3 This is a cross-sectional view schematically illustrating a portion of a deposition source in a manufacturing apparatus for a display device according to another embodiment of the present invention.

[0036] Figure 4 This is a cross-sectional view schematically illustrating a portion of a deposition source in a manufacturing apparatus for a display device according to another embodiment of the present invention.

[0037] Figure 5 This is a plan view schematically illustrating a display device according to an embodiment of the present invention.

[0038] Figure 6 It is a schematic representation Figure 5 The circuit diagram of the display device shown is shown.

[0039] Figure 7 It means Figure 5 A cross-sectional view of a portion of the display device shown.

[0040] Figure 8 This is a block diagram of an electronic device according to an embodiment of the present invention.

[0041] Figures 9 to 11 This is a schematic diagram of an electronic device according to various embodiments of the present invention.

[0042] Explanation of reference numerals in the attached figures

[0043] 1: Support part 423: Internal reflector

[0044] 10: Mask assembly 424: Heater

[0045] 100: Substrate; 425: Crucible

[0046] 2: Mask 426: Nozzle

[0047] 400: Manufacturing apparatus for display devices; 427: Substrate reflector

[0048] 410: Chamber; 428: Nozzle reflector

[0049] 420: Sediment source; 429: Capping

[0050] 421: Outer casing; 430: Fixing part

[0051] 422: Inner shell; 440: Pressure regulating section Detailed Implementation

[0052] This invention can be modified in many ways and can have many embodiments. Specific embodiments are schematically illustrated in the accompanying drawings, and detailed descriptions are provided in the specific embodiments. The effects and features of the invention, as well as methods of implementing them, will become clear with reference to the accompanying drawings and the embodiments described in detail below. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms.

[0053] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding structural elements are given the same reference numerals, and repeated descriptions of them are omitted.

[0054] In the following embodiments, the terms "first," "second," etc., are not used in a limiting sense, but are used for the purpose of distinguishing one structural element from another.

[0055] In the following embodiments, the singular expression includes the plural expression unless it is obvious in the context that the singular expression has a different meaning.

[0056] In the following embodiments, terms such as "comprising" or "having" indicate the presence of features or structural elements described in the specification, but do not preclude the possibility of adding more than one other feature or structural element.

[0057] In the following embodiments, when a portion referred to as a membrane, region, structural element, etc. is located above or on top of another portion, this includes not only the case where it is directly above the other portion, but also the case where there are other membranes, regions, structural elements, etc. in between.

[0058] For ease of explanation, the size of structural elements may be exaggerated or reduced in the accompanying drawings. For example, the size and thickness of the structures shown in the figures are arbitrarily depicted for ease of explanation, and therefore the invention is not necessarily limited to the depicted content.

[0059] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system, but can be interpreted to include the broad meaning of the three axes of a Cartesian coordinate system. For example, the x-axis, y-axis, and z-axis can be orthogonal to each other, but can also refer to mutually different directions that are not orthogonal to each other.

[0060] Where an embodiment can be implemented in different ways, a particular process sequence may be performed in a different order than that described. For example, two processes described consecutively may be performed substantially simultaneously, or they may be performed in the reverse order of that described process.

[0061] Figure 1 This is a cross-sectional view schematically illustrating a manufacturing apparatus for a display device according to an embodiment of the present invention. Figure 2a It is a schematic representation Figure 1 The cross-sectional view of the sediment source is shown. Figure 2b It is a schematic representation Figure 2a A partial three-dimensional view of the first reflector shown.

[0062] Reference Figures 1 to 2b The manufacturing apparatus 400 for the display device may include a chamber 410, a deposition source 420, a fixing part 430, and a pressure regulating part 440.

[0063] A space is formed inside the chamber 410, which may be equipped with a gate valve 411 that can be opened and closed. When the gate valve 411 is opened, the chamber 410 can communicate with the outside, and when the gate valve 411 is closed, the chamber 410 can be isolated from the outside.

[0064] The deposition source 420 can hold the deposited material and supply it by heating the material. The deposition source 420 can be fixed in the chamber 410. The deposition source 420 can have various shapes. For example, the deposition source 420 can be arranged in the center of the chamber 410 to supply the deposited material in a point-like manner. As another embodiment, the deposition source 420 can be arranged in a linear shape and placed in the center of the chamber 410. In this case, the length direction of the deposition source 420 can be perpendicular to the movement direction of the display substrate DS.

[0065] The deposition source 420 may include an outer shell 421, an inner shell 422, an internal reflector 423, a heater 424, a crucible 425, a nozzle 426, a substrate reflector 427, a nozzle reflector 428, and a cover 429.

[0066] The housing 421 can form the appearance of the deposition source 420, and space can be provided inside the housing 421. In this case, the housing 421 may have coolant channels for coolant circulation. Such coolant channels may be pipes inserted into the interior of the housing 421 for coolant movement. As another embodiment, the coolant channels may be spaces arranged inside the housing 421 for coolant movement.

[0067] The shape of the outer shell 421 can correspond to the shape of the sedimentation source 420. For example, when the sedimentation source 420 supplies sediment in a point-like manner, the sedimentation source 420 can be polygonal or cylindrical. As another embodiment, when the sedimentation source 420 is linear, the outer shell 421 can be in one direction (e.g., Figure 1 It forms long in the u or v direction.

[0068] The inner shell 422 may be disposed inside the outer shell 421. In this case, the inner shell 422 may include a first inner shell 422a and a second inner shell 422b joined together. This inner shell 422 may provide space between the first inner shell 422a and the second inner shell 422b. Furthermore, the inner shell 422 may have a groove to receive the crucible 425.

[0069] An internal reflector 423 may be arranged in the space between the inner shell 422 and the outer shell 421. Multiple internal reflectors 423 may be arranged, spaced apart from each other. In this case, the internal reflectors 423 may be secured by additional fixing components connected to the inner shell 422 and / or the outer shell 421. The internal reflector 423 may block radiant heat generated by the heater 424.

[0070] Heater 424 may be arranged between the first inner shell 422a and the second inner shell 422b and generate heat. In this case, heater 424 may include a sheath heater. In addition, although heater 424 is illustrated to be arranged on the upper part of crucible 425, it is not limited thereto and may also be arranged in the center and / or lower part of crucible 425.

[0071] A crucible 425 can be arranged within the inner shell 422 and contains the deposited material. The deposited material inside the crucible 425 can be vaporized by heat applied by the heater 424. At least one crucible 425 may be provided. When the deposition source 420 is linear, multiple crucibles 425 may be provided.

[0072] Nozzle 426 can be connected to crucible 425 and guide the deposited material to the outside of crucible 425. In this case, the cross-section of nozzle 426 perpendicular to its length direction can be circular, elliptical, or polygonal. For ease of explanation, the following detailed description will focus on the case where the cross-section of nozzle 426 perpendicular to its length direction is circular. When the deposition source 420 is linear, multiple nozzles 426 can be provided. In this case, at least one of the multiple nozzles 426 can be connected to one crucible 425.

[0073] The base reflector 427, by being combined with the outer shell 421 and / or the inner shell 422, prevents impurities from entering between the outer shell 421 and the inner shell 422, and / or inside the inner shell 422. Furthermore, the base reflector 427, by being arranged to surround the outer surface of the crucible 425 and / or the nozzle 426, reduces the inflow of material from inside the chamber 410 into the space between the crucible 425 and the inner shell 422. The base reflector 427 not only reduces heat leakage from inside the crucible 425 to the outside, but also prevents temperature variations inside the crucible 425 due to external environmental changes. In particular, the base reflector 427, by being arranged to surround the periphery of the nozzle 426, reduces abrupt temperature changes along the length of the nozzle 426. In this case, the thickness of the base reflector 427 can be greater than the thickness of a nozzle reflector 428, which will be described later.

[0074] By arranging multiple nozzle reflectors 428 stacked on top of each other, leakage of radiant heat from the heater 424 to the outside can be blocked. The nozzle reflectors 428 can reduce the temperature drop of the nozzle 426. In this case, the nozzle reflectors 428 can be carbon composite materials. Specifically, in the case of the nozzle 426, a temperature difference can be generated along the length of the nozzle 426 surface. In this case, the deposited material may solidify and adhere to the interior of the nozzle 426. Furthermore, during deposition, the uppermost portion of the nozzle reflector 428 faces the display substrate DS; therefore, if the temperature of the uppermost portion of the nozzle reflector 428 is too high, the display substrate DS may be damaged by the heat of the nozzle reflector 428. However, by arranging multiple nozzle reflectors 428, the heat release described above can be reduced. This reduces the temperature difference between the nozzle 426 and its surrounding area. In particular, when the nozzle reflector 428 is constructed as eight segments, the temperature at the end of the lowest nozzle reflector 428 can be approximately 100°C to 200°C higher than when the nozzle reflector 428 is constructed as two segments, and the temperature at the end of the highest nozzle reflector 428 can be approximately 200°C to 300°C lower than when the nozzle reflector 428 is constructed as two segments. Therefore, when multiple nozzle reflectors 428 are stacked, the temperature around the nozzle 426 can be kept as high as possible at the lower part of the nozzle 426, and the temperature at the uppermost part of the nozzle reflector 428 can be kept relatively low.

[0075] The plurality of nozzle reflectors 428 described above may each have an opening corresponding to the nozzle 426. In this case, the planar shape of the opening may correspond to the cross-sectional shape of the nozzle 426. Furthermore, each opening may be formed to be larger than the cross-sectional shape of the nozzle 426. Thus, the inner surface of each opening may be separated from the outer surface of the nozzle 426. The size of the planar shape of each opening, as described above, may increase in the direction away from the nozzle 426. That is, the area of ​​each opening may increase sequentially in the direction away from the inlet of the nozzle 426. Alternatively, a portion of the openings may have the same planar shape size, and the planar shape of the remaining portion of the openings (excluding the aforementioned portion) may increase sequentially.

[0076] Multiple nozzle reflectors 428 may include a first nozzle reflector 428-1 and a second nozzle reflector 428-2. In this case, there may be multiple first nozzle reflectors 428-1 and / or multiple second nozzle reflectors 428-2. For ease of explanation, the following detailed description will focus on the case where multiple first nozzle reflectors 428-1 and multiple second nozzle reflectors 428-2 are respectively provided.

[0077] In the configuration described above, a plurality of first nozzle reflectors 428-1 may be arranged in a first region A1, wherein the first region A1 is arranged to surround the side of the nozzle 426. Furthermore, a plurality of second nozzle reflectors 428-2 may be arranged in a second region A2, wherein the second region A2 is the area along the path of the deposited material ejected from the upper end of the nozzle 426. In this configuration, the plurality of first nozzle reflectors 428-1 and the plurality of second nozzle reflectors 428-2 may be stacked.

[0078] Each first nozzle reflector 428-1 may have a first opening OP1 for insertion of a nozzle 426, and each second nozzle reflector 428-2 may have a second opening OP2 corresponding to the first opening OP1. In this case, the sizes of the first opening OP1 and the second opening OP2 may be different from each other. That is, the size of the first opening OP1 may be smaller than the size of the second opening OP2. Furthermore, the planar shapes of each first opening OP1 may be the same. The planar shapes of each second opening OP2 may gradually increase in size as it moves away from the nozzle 426.

[0079] As described above, the first nozzle reflector 428-1 and the second nozzle reflector 428-2 do not limit the angle of diffusion of the deposited material ejected by the nozzle 426. That is, when the deposited material is ejected by the nozzle 426, the path of the deposited material can be consistent with the inner diameter of the first opening OP1 and the inner diameter of the second opening OP2, or arranged inside the planar shape of the first opening OP1 and the planar shape of the second opening OP2.

[0080] The first nozzle reflector 428-1 as described above may include a first nozzle reflector body portion 428-1a as a first part and a first bent portion 428-1b as a second part. The first nozzle reflector body portion 428-1a may be a flat plate. Furthermore, the first bent portion 428-1b may be bent from the bottom of the first nozzle reflector body portion 428-1a towards the inner shell 422. In this case, the first bent portion 428-1b may define a first opening OP1. Furthermore, at least a portion of the inner surface of the first bent portion 428-1b may be formed at an angle. In this case, the first opening OP1 may resemble a funnel shape. In the above-described case, the first bent portion 428-1b may contact other first nozzle reflector body portions 428-1a adjacent to the first nozzle reflector body portion 428-1a or an adjacent first bent portion 428-1b. Furthermore, the first bend 428-1b of the lowest-positioned first nozzle reflector 428-1 can contact the base reflector 427. This reduces the likelihood of deposited material flowing between adjacent first nozzle reflectors 428-1 or between adjacent first nozzle reflectors 428-1 and the base reflector 427. Additionally, this reduces the likelihood of deposited material adhering to the bottom surface of the first nozzle reflector 428-1.

[0081] The direction in which the first bent portion 428-1b bends on the bottom surface of the first nozzle reflector body 428-1a can vary. Although not shown, the first bent portion 428-1b can be bent diagonally from the bottom surface of the first nozzle reflector body 428-1a. In this case, the shape of the first bent portion 428-1b can be inclined downwards towards the side end away from the first nozzle reflector body 428-1a.

[0082] The second nozzle reflector 428-2 may include a second nozzle reflector body portion 428-2a as a first part and a second bend portion 428-2b as a second part. In this case, the second nozzle reflector body portion 428-2a and the second bend portion 428-2b are similar to the first nozzle reflector body portion 428-1a and the first bend portion 428-1b described above, so detailed descriptions are omitted.

[0083] The second bends 428-2b of the stacked second nozzle reflectors 428-2 can be arranged along an oblique direction. For example, the inclined surface formed on the inner surface of the second bend 428-2b and the line segment connecting the apex of the second bend 428-2b can be oblique lines.

[0084] The housing 429 can be combined with the base reflector 427 and / or the outer casing 421. In this case, the housing 429 can shield the side ends of the nozzle reflector 428. Thus, the housing 429 can reduce the inflow of deposited material from the side ends of the nozzle reflector 428 into the space between the nozzle reflectors 428. The housing 429 can be arranged at the top of the deposition source 420 and determines the spray angle of the deposited material.

[0085] The fixing part 430 can support the display substrate DS and the mask assembly 10. At this time, the fixing part 430 can simultaneously support the display substrate DS and the mask assembly 10, or support the display substrate DS and the mask assembly 10 separately. One fixing part 430 as described above can be provided, or multiple fixing parts 430 as described above can be provided in a manner that allows them to be separated from each other. The fixing part 430 can have various forms. For example, the fixing part 430 can be a shuttle-shaped part that can move linearly inside the cavity 410 and move to the outside of the cavity 410. As another embodiment, the fixing part 430 can be a component-shaped part that can move linearly inside the cavity 410. Hereinafter, for ease of explanation, a detailed description will focus on the case where the fixing part 430 is a shuttle-shaped part that simultaneously supports the display substrate DS and the mask assembly 10 and can move linearly inside and outside the cavity 410.

[0086] The mask assembly 10 may include a support portion 1 and a mask 2. An opening may be provided in the central portion of the support portion 1. The mask 2 may be disposed on the support portion 1 and may include at least one opening area. The opening area of ​​the mask 2 may be a single opening with the same shape as the opening of the support portion 1, or the opening areas of the mask 2 may be multiple and spaced apart from each other; the multiple opening areas may also be disposed inside the opening of the support portion 1. In this case, a portion of the mask 2 may be disposed between the opening areas of the mask 2, thereby dividing the adjacent opening areas. The mask 2 may be integrally formed with the support portion 1, or it may be formed independently of the support portion 1 and joined to the support portion 1 by welding or the like. Hereinafter, for ease of explanation, the case where the mask 2 is formed independently of the support portion 1 and fixed to the support portion 1 by welding will be described in detail. Furthermore, hereafter, for ease of explanation, the case where the mask 2 has only one opening area will be described in detail.

[0087] The pressure regulating unit 440 can regulate the internal pressure of the chamber 410 by connecting to the chamber 410. In this case, the pressure regulating unit 440 may include a connecting pipe 442 connected to the chamber 410 and a pump 441 arranged on the connecting pipe 442.

[0088] During the manufacture of the display device, the display substrate DS can be inserted from the outside of the cavity 410 into the inside of the cavity 410. This display substrate DS can refer to the substrate 100 described later (see reference 100). Figure 7(This refers to a layer arranged below the layer to be deposited. For example, in a display device manufacturing apparatus 400, a layer is formed...) Figure 7 When the common electrode 230 is in the display substrate DS, it can represent the output from the common electrode 230. Figure 7 The substrate 100 to the intermediate layer 220 shown.

[0089] In the case described above, the mask assembly 10 can be arranged facing the display substrate DS. In this case, the display substrate DS and the mask assembly 10 can be arranged facing each other on the fixing portion 430, and simultaneously enter the interior of the cavity 410 through the fixing portion 430. Alternatively, the display substrate DS and the mask assembly 10 can also enter the interior of the cavity 410 from the outside of the cavity 410 and be arranged on the fixing portion 430.

[0090] With the display substrate DS and mask assembly 10 arranged inside the cavity 410 as described above, the deposition source 420 can supply deposition material. The deposition material can be deposited on the display substrate DS through the mask assembly 10. At this time, the deposition material can be masked. Figure 7 The entire display area DA is arranged on the display substrate DS in the manner shown. Furthermore, deposited materials can be formed... Figure 7 The common electrode 230 is shown.

[0091] During the process described above, the pressure regulating unit 440 can regulate the pressure inside the chamber 410. For example, when at least one of the display substrate DS and the mask assembly 10 is inserted into the chamber 410, the pressure regulating unit 440 can inject external gas into the chamber 410, thereby making the pressure inside the chamber 410 the same as or close to atmospheric pressure. Furthermore, during the process performed inside the chamber 410, the pressure regulating unit 440 can discharge the internal gas inside the chamber 410 to the outside of the chamber 410, thereby maintaining the pressure inside the chamber 410 at a level lower than atmospheric pressure.

[0092] The display device manufacturing apparatus 400 and the display device manufacturing method can reduce the possibility of the deposition source 420 malfunctioning or operating incorrectly due to the deposition material adhering to the nozzle 426 of the deposition source 420 during the supply of deposition material. The display device manufacturing apparatus 400 and the display device manufacturing method can uniformly supply deposition material through the deposition source 420 for a long time, and can make the thickness of the layer formed during the manufacturing of the display device uniform.

[0093] Furthermore, the display device manufacturing apparatus 400 and the display device manufacturing method can increase the replacement life of the nozzle reflector 428 and reduce replacement costs by reducing the amount of deposited material adhering to the surface of the nozzle reflector 428. The display device manufacturing apparatus 400 and the display device manufacturing method can also reduce the performance degradation of the nozzle reflector 428 by reducing the amount of deposited material adhering to its surface.

[0094] The manufacturing apparatus 400 for the display device and the manufacturing method for the display device can reduce the amount of material placed on the substrate 100 (see reference) during the deposition process by lowering the temperature of the nozzle reflector 428 portion opposite to the display substrate DS. Figure 7 Damage to at least one of the multiple layers on the surface.

[0095] Figure 3 This is a cross-sectional view schematically illustrating a portion of the deposition source of a manufacturing apparatus for a display device according to another embodiment of the present invention.

[0096] A manufacturing apparatus for a display device according to another embodiment of the present invention may include a chamber, a deposition source, a fixing part, and a pressure regulating part. In this case, the chamber, the fixing part, and the pressure regulating part are integrated with the above-described... Figures 1 to 2b The structures described herein are the same or similar, therefore detailed descriptions are omitted.

[0097] The deposition source may include a housing, an internal reflector, an inner shell, a heater, a crucible, a nozzle, a substrate reflector, a nozzle reflector 428, and a cover. At this time, the housing, the internal reflector, the inner shell, the heater, the crucible, the nozzle, the substrate reflector, and the cover are in accordance with the above... Figures 1 to 2b The structures described herein are the same or similar, therefore detailed descriptions are omitted.

[0098] Reference Figure 3 The nozzle reflector 428 may include a first nozzle reflector 428-1 arranged around the nozzle of the deposition source and a second nozzle reflector 428-2 arranged spaced apart from the first nozzle reflector 428-1. In this case, multiple first nozzle reflectors 428-1 and / or second nozzle reflectors 428-2 may be provided. For ease of explanation, the following detailed description will focus on the case where multiple first nozzle reflectors 428-1 and multiple second nozzle reflectors 428-2 are provided. In this case, multiple first nozzle reflectors 428-1 may be arranged in the first region A1, and multiple second nozzle reflectors 428-2 may be arranged in the second region A2.

[0099] In the configuration described above, the first nozzle reflector 428-1 may include a first opening OP1, and the portion having the first opening OP1 includes a first bend 428-1b. Furthermore, the first nozzle reflector 428-1 may include a plate-shaped first nozzle reflector body 428-1a connected to the first bend 428-1b. In the configuration described above, the planar shapes of the first openings OP1 of the plurality of first nozzle reflectors 428-1 may all be identical. Furthermore, the first bend 428-1b of the lowest-positioned first nozzle reflector 428-1 may contact the base reflector 427. Additionally, the first bend 428-1b of each first nozzle reflector 428-1 may contact the first bend 428-1b of an adjacent first nozzle reflector 428-1. This reduces the likelihood of deposited material inside the chamber flowing between the first nozzle reflectors 428-1 or between the first nozzle reflector 428-1 and the base reflector 427. In particular, it can reduce the inflow of deposited material sprayed through the nozzle into the space between the first nozzle reflectors 428-1 or between the first nozzle reflectors 428-1 and the substrate reflector 427.

[0100] In the case described above, at least a portion of the inner surface of the first bend 428-1b and / or at least a portion of the inner surface of the second bend 428-2b can be formed at an angle. This allows for the spray angle of the deposited material ejected from the nozzle to be unrestricted. Furthermore, the plurality of second bends 428-2b can be made in a stepped shape. In this case, the plurality of second openings OP2 can be stepped, and the planar shape of the plurality of second openings OP2 can increase as it moves away from the nozzle.

[0101] In the cross-sectional view, as described above, the inclined surfaces and / or vertices arranged on the inner surface of the second bend 428-2b can be arranged in a smooth shape. For example, the inclined inner surface of the second bend 428-2b can meet a point of an imaginary arc, and the inclined inner surface of the second bend 428-2b can be a tangent direction at a point of the imaginary arc. In this case, the imaginary arc can be an arc that is concave from the center of the nozzle towards the outside of the nozzle. As another embodiment, the vertex of the second bend 428-2b can be located on the imaginary arc.

[0102] Therefore, the manufacturing apparatus and method for display devices can reduce the possibility of malfunctions or errors in the deposition source due to the deposition material adhering to the nozzle during the supply of deposition material. The manufacturing apparatus and method for display devices can provide deposition material uniformly for an extended period through the deposition source, and can ensure uniform thickness of the layers formed during the manufacturing of the display device.

[0103] Furthermore, the manufacturing apparatus and method for the display device can increase the replacement life of the nozzle reflector 428 by reducing the amount of deposited material adhering to the nozzle reflector 428, and can also reduce replacement costs. The manufacturing apparatus and method for the display device can also reduce the performance degradation of the nozzle reflector 428 by reducing the amount of deposited material adhering to the surface of the nozzle reflector 428.

[0104] The manufacturing apparatus and method for manufacturing a display device can reduce damage to at least one of the multiple layers disposed on the substrate during the deposition process by lowering the temperature of the portion of the nozzle reflector 428 opposite to the display substrate.

[0105] Figure 4 This is a cross-sectional view of a portion of the deposition source of a manufacturing apparatus for a display device according to another embodiment of the present invention.

[0106] A manufacturing apparatus for a display device according to another embodiment of the present invention may include a chamber, a deposition source, a fixing part, and a pressure regulating part. In this case, the chamber, the fixing part, and the pressure regulating part are integrated with the above-described... Figures 1 to 2b The structures described herein are the same or similar, therefore detailed descriptions are omitted.

[0107] The deposition source may include a housing, an internal reflector, an inner shell, a heater, a crucible, a nozzle, a substrate reflector, a nozzle reflector 428, and a cover. At this time, the housing, the internal reflector, the inner shell, the heater, the crucible, the nozzle, the substrate reflector, and the cover are in accordance with the above... Figures 1 to 2b The structures described herein are the same or similar, therefore detailed descriptions are omitted.

[0108] Reference Figure 4 The nozzle reflector 428 may include a first nozzle reflector 428-1 disposed in the first region A1 and a second nozzle reflector 428-2 disposed in the second region A2. The first nozzle reflector 428-1 may include a first nozzle reflector body 428-1a having a first opening OP1 and a first bent portion 428-1b protruding from the first nozzle reflector body 428-1a and forming the inner diameter of the first opening OP1. The second nozzle reflector 428-2 may include a second nozzle reflector body 428-2a having a second opening OP2 and a second bent portion 428-2b protruding from the second nozzle reflector body 428-2a and forming the inner diameter of the second opening OP2. The first nozzle reflector 428-1 and the second nozzle reflector 428-2 may be combined with the above-described... Figures 1 to 2b The structure described in the text is the same as or similar to that in the text. Figure 3 The structures described herein are the same or similar. Hereinafter, for ease of explanation, the first nozzle reflector 428-1 and the second nozzle reflector 428-2 will be used in conjunction with those described above. Figures 1 to 2b The cases described herein are the same or similar, and will be explained in detail.

[0109] The deposition source may include a heat insulation component CS disposed between adjacent nozzle reflectors 428. In this case, the heat insulation component CS may be formed in the form of a plate and may be disposed between adjacent first nozzle reflector body portions 428-1a, between adjacent first nozzle reflector body portions 428-1a and substrate reflector 427, between adjacent first nozzle reflector body portions 428-1a and second nozzle reflector body portions 428-2a, and / or between adjacent second nozzle reflector body portions 428-2a.

[0110] The emissivity of the heat insulation component CS described above may differ from the emissivity of the first nozzle reflector 428-1 and / or the second nozzle reflector 428-2. For example, the emissivity of the heat insulation component CS may be lower than that of the first nozzle reflector 428-1 and / or the second nozzle reflector 428-2. Specifically, the emissivity of the first nozzle reflector 428-1 and / or the second nozzle reflector 428-2 may be approximately 0.8, and the emissivity of the heat insulation component CS may be approximately 0.2. In this case, emissivity can be expressed as the radiant heat of an object when the same amount of heat is applied to it and a blackbody, assuming the radiant heat of the blackbody is 1. In the case described above, the heat insulation component CS may comprise a metal such as tungsten and / or titanium.

[0111] In the case described above, the heat insulation component CS can reduce the transfer of radiant heat from the nozzle reflector 428 located at the lower part of the heat insulation component CS to the nozzle reflector 428 located at the upper part of the heat insulation component CS. As a result, the excessive rise in surface temperature of the second nozzle reflector 428-2 located at the uppermost part of the plurality of nozzle reflectors 428 can be reduced.

[0112] Therefore, the manufacturing apparatus and method for display devices can reduce the possibility of malfunctions or errors in the deposition source due to the deposition material adsorbing onto the nozzle during the supply of the deposition material. The manufacturing apparatus and method for display devices can provide the deposition material uniformly for an extended period through the deposition source, and can ensure uniform thickness of the layers formed during the manufacturing of the display device.

[0113] Furthermore, the manufacturing apparatus and method for the display device can increase the replacement life of the nozzle reflector 428 by reducing the amount of deposited material adhering to the nozzle reflector 428, and can also reduce replacement costs. The manufacturing apparatus and method for the display device can also reduce the performance degradation of the nozzle reflector 428 by reducing the amount of deposited material adhering to the surface of the nozzle reflector 428.

[0114] The manufacturing apparatus and method for manufacturing a display device can reduce damage to at least one of the multiple layers disposed on the substrate during the deposition process by lowering the temperature of the portion of the nozzle reflector 428 opposite to the display substrate.

[0115] Figure 5 This is a plan view schematically illustrating a display device according to an embodiment of the present invention.

[0116] Reference Figure 5 The display device 30 may include a display area DA and a peripheral area PA located outside the display area DA. The display device 30 can provide an image by means of an array of multiple sub-pixels PX arranged in two dimensions in the display area DA. At this time, a portion of the multiple sub-pixels PX, another portion of the multiple sub-pixels PX, and yet another portion of the multiple sub-pixels PX can emit light of different colors from each other. For example, a portion of the multiple sub-pixels PX, another portion of the multiple sub-pixels PX, and yet another portion of the multiple sub-pixels PX can emit light of one color among red, green, and blue. As another embodiment, the multiple sub-pixels PX can also all emit white light.

[0117] The peripheral area PA is the area that does not provide an image and may surround the display area DA, either entirely or partially. Drivers for providing electrical signals or power to the sub-pixel circuitry corresponding to each sub-pixel PX may be arranged in the peripheral area PA. Pads may be arranged in the peripheral area PA; these pads are areas that can be electrically connected to electronic components or printed circuit boards.

[0118] The following description addresses the case where the display device 30 includes an organic light-emitting diode (OLED) as a light-emitting element, but the display device 30 of the present invention is not limited thereto. As another embodiment, the display device 30 may be a light-emitting display device including an inorganic light-emitting diode, i.e., an inorganic light-emitting display. The inorganic light-emitting diode may include a PN junction diode comprising an inorganic semiconductor-based material. When a forward voltage is applied to the PN junction diode, holes and electrons are injected, and light of a predetermined color can be emitted by converting the energy generated by the recombination of the holes and electrons into light energy. The aforementioned inorganic light-emitting diode may have a width of several micrometers to several hundred micrometers, and in some embodiments, the inorganic light-emitting diode may be referred to as a micro-light-emitting diode. As yet another embodiment, the display device 30 may be a quantum dot light-emitting display.

[0119] Figure 6 It is a schematic representation Figure 5 The circuit diagram of the display device shown is shown. Figure 7 It means Figure 5 A cross-sectional view of a portion of the display device shown. Figure 7 It means along Figure 5 A cross-sectional view taken from the C-C' line.

[0120] Reference Figure 6 and Figure 7 Each sub-pixel PX may include a sub-pixel circuit PC and a display element (e.g., an organic light-emitting diode OLED) connected to the sub-pixel circuit PC. The sub-pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst. Each sub-pixel PX may emit light, such as red, green, blue, or white, through the organic light-emitting diode OLED.

[0121] The second thin-film transistor T2 can be a switching thin-film transistor connected to the scan line SL and the data line DL, and based on the switching voltage input from the scan line SL, it transmits the data voltage input from the data line DL to the first thin-film transistor T1. A storage capacitor Cst can be connected to the second thin-film transistor T2 and the drive voltage line PL, and stores a voltage corresponding to the difference between the voltage received from the second thin-film transistor T2 and the first power supply voltage ELVDD supplied to the drive voltage line PL.

[0122] The first thin-film transistor T1 can be a driving thin-film transistor, connected to a driving voltage line PL and a storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL through the organic light-emitting diode (OLED) according to the voltage value stored in the storage capacitor Cst. The OLED can emit light with a specified brightness through the driving current. The counter electrode (e.g., cathode) of the OLED can receive a second power supply voltage ELVSS.

[0123] Although Figure 6 The invention describes a sub-pixel circuit PC comprising two thin-film transistors and one storage capacitor, but is not limited thereto. The number of thin-film transistors and the number of storage capacitors can be varied depending on the design of the sub-pixel circuit PC. For example, in addition to the aforementioned two thin-film transistors, the sub-pixel circuit PC may further include four, five, or more thin-film transistors.

[0124] The display device 30 may include a stacked structure of a substrate 100, a sub-pixel circuit layer PCL, a display element layer DEL, and an encapsulation layer 300. In this case, the display substrate (not shown) may be a concept that includes a portion of the substrate 100, the sub-pixel circuit layer PCL, and the display element layer DEL. That is, the display substrate may represent the area from the substrate 100 to the encapsulation layer 1117.

[0125] The substrate 100 may be a multilayer structure comprising a base layer and an inorganic layer, the base layer comprising a polymer resin. For example, the substrate 100 may include a base layer comprising a polymer resin and a barrier layer as an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 sequentially stacked. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate, cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP), etc. The first barrier layer 102 and the second barrier layer 104 may comprise inorganic insulators such as silicon oxide, silicon oxide nitride, and / or silicon nitride. The substrate 100 may have flexible properties.

[0126] A sub-pixel circuit layer PCL is disposed on the substrate 100. Figure 7 The sub-pixel circuit layer PCL shown in the figure includes a thin-film transistor (TFT) and a buffer layer 1111, a first gate insulating layer 1112, a second gate insulating layer 1113, an interlayer insulating layer 1114, a first planarization insulating layer 1115, and a second planarization insulating layer 1116 disposed below and / or above the structural elements of the TFT.

[0127] The buffer layer 1111 can reduce or block the penetration of impurities, moisture or external gases from below the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 1111 may include an inorganic insulating material such as silicon oxide, silicon oxide nitride or silicon nitride, and may be formed as a single layer or multilayer structure including the aforementioned materials.

[0128] The thin-film transistor (TFT) on the buffer layer 1111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon (poly-Si). Alternatively, the semiconductor layer Act may include amorphous silicon (a-Si), or an oxide semiconductor, or an organic semiconductor, etc. The semiconductor layer Act may include a channel region C and a drain region D and a source region S respectively disposed on both sides of the channel region C. The gate electrode GE may overlap with the channel region C.

[0129] The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material, such as molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and the gate electrode GE may be formed as a multilayer or single-layer structure including the above materials.

[0130] The first gate insulating layer 1112 between the semiconductor layer Act and the gate electrode GE may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). X ), silicon nitride oxide (SiO) x N y Aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO) X Inorganic insulating materials such as zinc oxide (ZnO). X () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0131] The second gate insulating layer 1113 may be configured to cover the gate electrode GE. Similar to the first gate insulating layer 1112, the second gate insulating layer 1113 may include materials such as silicon oxide (SiO2) or silicon nitride (SiN). X ), silicon nitride oxide (SiO) x N y Aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO) X Inorganic insulating materials such as zinc oxide (ZnO). X () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0132] An upper electrode Cst2 of a storage capacitor Cst may be arranged above the second gate insulating layer 1113. The upper electrode Cst2 may overlap with the gate electrode GE below it. At this time, the gate electrode GE and the upper electrode Cst2, which overlap through the second gate insulating layer 1113, can form the storage capacitor Cst. That is, the gate electrode GE can function as the lower electrode Cst1 of the storage capacitor Cst.

[0133] Thus, the storage capacitor Cst and the thin-film transistor TFT can be formed overlapping. In some embodiments, the storage capacitor Cst can also be formed without overlapping with the thin-film transistor TFT.

[0134] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single-layer or multi-layer structure of the aforementioned materials.

[0135] Interlayer insulating layer 1114 may cover the upper electrode Cst2. Interlayer insulating layer 1114 may include silicon oxide (SiO2) or silicon nitride (SiN). X ), silicon nitride oxide (SiO) x N y Aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO) X ), etc. Zinc oxide (ZnO) X The interlayer insulation layer 1114 can be a single-layer or multi-layer structure including the aforementioned inorganic insulation material.

[0136] The drain electrode DE and the source electrode SE can be located on the interlayer insulating layer 1114, respectively. The drain electrode DE and the source electrode SE can be connected to the drain region D and the source region S, respectively, through contact holes formed in the insulating layer beneath them. The drain electrode DE and the source electrode SE can include materials with good conductivity. The drain electrode DE and the source electrode SE can include conductive materials, such as molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and the drain electrode DE and the source electrode SE can be formed as a multilayer or single-layer structure including the above-mentioned materials. As an embodiment, the drain electrode DE and the source electrode SE can have a Ti / Al / Ti multilayer structure.

[0137] The first planarization insulating layer 1115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 1115 may include organic insulating materials such as: common general-purpose polymers (such as polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof.

[0138] The second planarization insulating layer 1116 may be disposed on the first planarization insulating layer 1115. The second planarization insulating layer 1116 may include the same material as the first planarization insulating layer 1115, and may include organic insulating materials such as: common general-purpose polymers (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof.

[0139] A display element layer (DEL) may be arranged on the sub-pixel circuit layer (PCL) of the aforementioned structure. The display element layer (DEL) may include an organic light-emitting diode (OLED) as a display element (i.e., a light-emitting element), and the OLED may include a stacked structure of a sub-pixel electrode 210, an intermediate layer 220, and a common electrode 230. The OLED may emit red, green, or blue light, or red, green, blue, or white light, for example. The OLED can emit light through a light-emitting region, which may be defined as a sub-pixel (PX).

[0140] The sub-pixel electrode 210 of the organic light-emitting diode (OLED) can be electrically connected to the thin-film transistor (TFT) through contact holes formed in the second planarization insulating layer 1116 and the first planarization insulating layer 1115 and contact metal CM disposed on the first planarization insulating layer 1115.

[0141] The sub-pixel electrode 210 may include a conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). As another embodiment, the sub-pixel electrode 210 may include a reflective film, which may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. As another embodiment, the sub-pixel electrode 210 may further include a film formed of ITO, IZO, ZnO, or In2O3 above / below the aforementioned reflective film.

[0142] A dam layer 1117 is disposed on the sub-pixel electrode 210, the dam layer 1117 having an opening 117OP exposing the central portion of the sub-pixel electrode 210. The dam layer 1117 may comprise an organic insulator and / or an inorganic insulator. The opening 117OP may define a light-emitting area for light emitted from an organic light-emitting diode (OLED). For example, the size / width of the opening 117OP may correspond to the size / width of the light-emitting area. Therefore, the size and / or width of the sub-pixel PX may depend on the size and / or width of the opening 117OP of the corresponding dam layer 1117.

[0143] The intermediate layer 220 may include a light-emitting layer 2222 formed corresponding to the sub-pixel electrode 210. The light-emitting layer 2222 may include a high- or low-molecular-weight organic material that emits light of a specified color. Alternatively, the light-emitting layer 2222 may include an inorganic light-emitting material or include quantum dots.

[0144] As one embodiment, the intermediate layer 220 may include a first functional layer 2221 and a second functional layer 2223 disposed below and above the light-emitting layer 2222, respectively. The first functional layer 2221 may include, for example, a hole transport layer (HTL), or a hole transport layer and a hole injection layer (HIL). The second functional layer 2223 is a structural element disposed above the light-emitting layer 2222, and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 2221 and / or the second functional layer 2223 may be configured as a common layer covering the entire substrate 100, similar to the common electrode 230 described later.

[0145] At least one of the intermediate layers 220 described above can be manufactured using the display device manufacturing apparatus described above. In this case, the resolution of the display device 30 itself can vary depending on how many intermediate layers 220 are arranged within a specified area, wherein the intermediate layers 220 are arranged spaced apart from each other by the display device manufacturing apparatus. In this case, when forming at least one of the intermediate layers 220 by the display device manufacturing apparatus, a larger number of intermediate layers 220 can be arranged within a specified area by reducing the distance between the spaced-apart intermediate layers 220.

[0146] The common electrode 230 may be disposed above and overlap with the sub-pixel electrode 210. The common electrode 230 may be formed of a conductive material with a low work function. For example, the common electrode 230 may include a (semi-)transparent layer, which may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. Alternatively, the common electrode 230 may further include a layer such as ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer comprising the aforementioned materials. The common electrode 230 may be integrally formed to cover the entire substrate 100.

[0147] The encapsulation layer 300 can be disposed on and cover the display element layer DEL. The encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. As one embodiment, in... Figure 7 The encapsulation layer 300 shown in the figure includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330 stacked in sequence.

[0148] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon nitride. The organic encapsulation layer 320 may comprise polymer-based materials. Polymer-based materials may include acrylic resins, epoxy resins, polyimides, and polyethylene, etc. As an embodiment, the organic encapsulation layer 320 may comprise acrylate. The organic encapsulation layer 320 may be formed by curing monomers or coating a polymer. The organic encapsulation layer 320 may be transparent.

[0149] Although not illustrated, a touch sensor layer may be disposed on the encapsulation layer 300, and an optical functional layer may be disposed on the touch sensor layer. The touch sensor layer can acquire coordinate information based on external input (e.g., touch events). The optical functional layer can reduce the reflectivity of light (external light) incident on the display device from the outside, and / or can improve the color purity of light emitted from the display device. As one embodiment, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may be of thin film type or liquid crystal coated type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be of thin film type or liquid crystal coated type. The thin film type may include a stretched synthetic resin film, and the liquid crystal coated type may include liquid crystals arranged in a prescribed array. The phase retarder and polarizer may further include a protective film.

[0150] An adhesive component may be disposed between the touch sensor layer and the optical functional layer. The adhesive component can be any conventional adhesive component known in the art. The adhesive component may be a pressure-sensitive adhesive (PSA).

[0151] Figure 8 This is a block diagram illustrating an electronic device according to an embodiment of the present invention.

[0152] Reference Figure 8 In one embodiment, the electronic device 1 may include a display module 2 including a display panel, a processor 3, a memory 4, and a power module 5.

[0153] Processor 3 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller. In one embodiment, processor 3 may be provided in more than two parts from a functional or structural point of view. For example, processor 3 may include: a main processor in the form of a first driver chip, which includes the central processing unit; and an auxiliary processor in the form of a second driver chip, which includes a controller that receives image signals from the main processor and processes the image signals to match the interface specifications of display module 2.

[0154] The memory 4 may include at least one of non-volatile memory and volatile memory. The memory 4 may store data information required for the operation of the processor 3 and the display module 2. When the processor 3 executes the application program stored in the memory 4, image data signals and / or input control signals are transmitted to the display module 2, and the display module 2 can process the received signals and output image information through the display screen.

[0155] The power module 5 may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 1. The power conversion of the power conversion module may include, but is not limited to, DC-DC conversion, AC-DC conversion, and DC-AC conversion.

[0156] The electronic device 1 may further include an input module 6, an output module 7, and / or a communication module 8.

[0157] Input module 6 can provide input information to processor 3 and / or display module 2. Input module 6 can include not only physical buttons, keyboards, and microphones, but also various sensor modules. Examples of sensor modules include not only touch sensors, pressure sensors, proximity sensors, position sensors, digitizers, motion recognition sensors, camera sensors, light sensors, photoelectric conversion sensors, and temperature sensors, but also biometric sensors such as blood pressure sensors, blood glucose sensors, electrocardiogram sensors, and heart rate sensors.

[0158] Output module 7 may be a non-image output module, which can receive information other than images transmitted from processor 3 and provide such information to the user. Examples of non-image output modules 7 include audio modules, tactile modules, light-emitting modules, etc., and may include other functional modules inherent to electronic device 1 (e.g., cooling modules of refrigerators, etc.).

[0159] The communication module 8 is responsible for transmitting and receiving information between the electronic device 1 and external devices, and may include a receiving unit and a transmitting unit. The communication module 8 may include various wireless communication modules such as mobile communication modules, Wi-Fi modules, and Bluetooth modules, or various wired communication modules.

[0160] At least one of the structures of the electronic device 1 described above may be included within the display device of the above embodiments. Additionally, a portion of an individual module functionally included within a single module may be included within the display device, while another portion may be provided independently of the display device. For example, the display device may include a display module 2, and the processor 3, memory 4, and power module 5 may be provided as other devices within the electronic device 1, without being included in the display device. As another example, the power module 5 may also be located within the display device and supply power to the processor 3 and memory 4 provided within the electronic device 1, but is not limited to the examples described above.

[0161] Figures 9 to 11 These are schematic diagrams of electronic devices according to various embodiments of the present invention. Figures 9 to 11 The illustrations show examples of various electronic devices to which embodiments of the present invention are applied.

[0162] exist Figure 9 The illustration shows examples of electronic devices, including a smartphone 1_1a, a tablet PC 1_1b, a laptop computer 1_1c, a television 1_1d, and a desktop monitor 1_1e.

[0163] In addition to the display module 2, the smartphone 1_1a may also include an input module (such as a touch sensor) and a communication module. The smartphone 1_1a can process information received through the communication module or other input modules and display the information through the display module of the display device.

[0164] In the case of a tablet PC 1_1b, a laptop computer 1_1c, a television 1_1d, or a desktop monitor 1_1e, a display module and an input module may be included, similar to a smartphone 1_1a, and a communication module may be further included as appropriate.

[0165] exist Figure 10 The illustration shows an application of an electronic device, including a display module, in a wearable electronic device. The wearable electronic device could be smart glasses 1_2a, a head-mounted display 1_2b, or a smartwatch 1_2c, etc.

[0166] The smart glasses 1_2a and the head-mounted display 1_2b may include a display module for emitting display images and a reflector for reflecting the emitted display images to the user's eyes, thereby providing the user with virtual reality or augmented reality images.

[0167] The smartwatch 1_2c may include a biometric sensor as an input device and provide the user with biometric information identified by the biometric sensor through a display module.

[0168] exist Figure 11 The illustration shows an application of electronic devices, including a display module, in a vehicle. For example, electronic devices 1_3 can be applied to the vehicle's dashboard or center console panel, or to a center information display (CID) or a room mirror display that replaces the rearview mirror, etc.

[0169] Although not illustrated, the electronic devices used in the application embodiments for displaying images can include not only devices primarily displaying images, such as billboards, illuminated panels, or game consoles, but also various home appliances that display information through display modules, such as refrigerators, washing machines, dryers, air conditioners, or cleaning robots. Furthermore, when the display module has a light-transmitting function, it can be applied to electronic devices such as smart windows or transparent display devices that simultaneously display backgrounds and images. The types of electronic devices used in the embodiments are not limited to the examples described above, and various other electronic devices not illustrated can be applied.

[0170] Therefore, the electronic device described above can provide a clear image.

[0171] The invention has been described above with reference to an embodiment illustrated in the accompanying drawings, but this is merely illustrative. Those skilled in the art will understand that various modifications and variations of the embodiment are possible. Therefore, the true scope of protection of the invention should be determined by the technical concept of the claims.

Claims

1. A sediment source, comprising: A crucible for storing deposited material; The nozzle section is connected to the crucible and has a nozzle for guiding the deposited material inside the crucible to the outside; and A plurality of reflectors are arranged on the sides and above the nozzle portion and spaced apart from each other, the plurality of reflectors including openings that expose the nozzle to the outside. One of the plurality of reflectors includes: The first part is separated from a portion of another of the plurality of reflectors, wherein the other of the plurality of reflectors is separated from at least a portion of the first of the plurality of reflectors; and The second part is arranged in the opening and bends from the first part to contact the other of the plurality of reflectors.

2. The sediment source according to claim 1, wherein, The second portion of at least two of the plurality of reflectors is arranged in a stepped configuration.

3. The sediment source according to claim 1, wherein, At least a portion of the surface of the second part is inclined.

4. The sediment source according to claim 1, wherein, The area of ​​the opening of some of the plurality of reflectors increases sequentially in the direction away from the inlet of the nozzle.

5. The sediment source according to claim 1, wherein, The plurality of reflectors includes: A first reflector is disposed on the side of the nozzle and has a first opening for insertion of the nozzle; and A second reflector is disposed above the nozzle and has a second opening.

6. The sediment source according to claim 1, wherein, Each of the reflectors comprises a carbon composite material.

7. The sediment source according to claim 1, It further includes a heat insulation component arranged between adjacent reflectors of the plurality of reflectors.

8. The sediment source according to claim 7, wherein, The emissivity of the reflector and the emissivity of the heat insulation component are different from each other.

9. The sediment source according to claim 7, wherein, The heat insulation component comprises metal.

10. An apparatus for manufacturing a display device, comprising: The deposition source according to any one of claims 1 to 9 is arranged to face the substrate; and A mask assembly is disposed between the deposition source and the substrate.

11. A method for manufacturing a display device, comprising the following steps: The substrate and mask assembly are arranged inside the cavity; and A deposition material is supplied to the substrate by any one of claims 1 to 9, and the deposition material is deposited on the substrate through the mask assembly.

12. An electronic device comprising a display device manufactured by the manufacturing apparatus of the display device according to claim 10.

13. A method for manufacturing an electronic device, comprising manufacturing an electronic device including a display device, wherein, The display device is manufactured by arranging a substrate and a mask assembly inside a cavity, and supplying a deposition material to the substrate by a deposition source according to any one of claims 1 to 9, the deposition material being deposited on the substrate through the mask assembly.

Images