Electroplating apparatus and electroplating method

Abstract

The application belongs to the technical field of electroplating, and discloses an electroplating device and an electroplating method. The electroplating device comprises an electroplating assembly, a shielding tool and a circulating assembly. The electroplating assembly has an electroplating tank. The shielding tool can be connected to the tank opening of the electroplating tank and can be fixedly connected to a workpiece to be plated, so that the plated area of the workpiece to be plated, part of the inner surface of the shielding tool and at least part of the inner surface of the electroplating tank form an accommodation space. The circulating assembly is connected to the electroplating assembly and can drive the electroplating liquid to flow between the electroplating assembly and the circulating assembly, so that the electroplating liquid in the accommodation space can be in a flowing state. By rotating the electroplating assembly so that the plated area is located below the accommodation space, the electroplating liquid can completely cover the plated area, and the bubbles float upwards, ensuring that the plated area can fully contact the electroplating liquid and avoiding the phenomenon of missed plating. The electroplating liquid in the flowing state can effectively improve the quality and uniformity of the plated layer.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and more particularly to an electroplating apparatus and an electroplating method. Background Technology

[0002] Localized electroplating is a process that coats specific areas of a workpiece. Its core requirement is to mask the non-plating areas, ensuring the electroplating solution only contacts the desired area, thus achieving precise coating placement. In existing technologies, masking methods for localized electroplating are mainly divided into two categories: pad masking and adhesive masking. Pad masking involves prefabricating elastic pads (such as rubber or silicone pads) with corresponding contours based on the shape of the non-plating areas. Mechanical pressure is used to tightly adhere the pads to the workpiece surface, utilizing the physical isolation effect of the pads to prevent the electroplating solution from entering the non-plating areas. Adhesive masking involves directly brushing or spraying liquid masking adhesive (such as epoxy resin, silicone rubber, or polyurethane adhesive) onto the non-plating areas of the workpiece. After curing at room temperature or with heat, a dense masking layer is formed, thus protecting the non-plating areas.

[0003] However, both padding and adhesive masking complicate the surface shape of the workpiece, making it prone to forming air pockets when the workpiece is immersed in the electroplating solution. This can lead to defects such as incomplete plating and uneven plating thickness. Furthermore, this phenomenon necessitates additional auxiliary steps when using padding or adhesive masking methods, complicating the electroplating process and increasing costs.

[0004] Therefore, there is an urgent need for an electroplating apparatus and electroplating method to solve the above-mentioned technical problems. Summary of the Invention

[0005] One object of the present invention is to provide an electroplating apparatus that can perform local electroplating processes in a relatively simple manner, and can improve yield and reduce electroplating costs.

[0006] To achieve this objective, the present invention adopts the following technical solution: Electroplating apparatus, comprising: An electroplating assembly having an electroplating tank, the electroplating assembly having a first state and a second state, wherein in the first state the opening of the electroplating tank is facing upwards, and in the second state the opening of the electroplating tank is facing downwards; A shielding fixture is available for connection to the opening of the electroplating tank and for fixed connection to the workpiece to be plated, such that the area to be plated of the workpiece, a portion of the inner surface of the shielding fixture, and at least a portion of the inner surface of the electroplating tank enclose a receiving space. A circulation component is connected to the electroplating component and is capable of driving the electroplating solution to circulate between the electroplating component and the circulation component, so that the electroplating solution located in the accommodating space can be in a flowing state.

[0007] In some embodiments, the electroplating apparatus further includes a clamping assembly fixedly connected to the electroplating assembly, and the clamping assembly has a clamping member. The distance between the clamping member and the electroplating tank along the opening direction of the electroplating tank is adjustable. The clamping member can abut against the end of the workpiece to be plated away from the electroplating assembly to limit and abut against the workpiece to be plated, the masking fixture, and the electroplating assembly.

[0008] In some embodiments, the clamping member is connected to a first electrical connector, which is capable of abutting against and being electrically connected to the workpiece to be plated.

[0009] In some embodiments, the electroplating assembly includes a second electrical connector disposed within the accommodating space, and when the electroplating assembly is in the second state, the second electrical connector is able to contact and be electrically connected to the electroplating solution.

[0010] In some embodiments, the second electrical connector is provided with an electroplating solution inlet channel and a plurality of electroplating solution inlets. The plurality of electroplating solution inlets are evenly spaced and communicate with the electroplating solution inlet channel. The second electrical connector is also provided with an electroplating solution return channel. The electroplating solution can flow into the accommodating space through the electroplating solution inlet channel and the electroplating solution inlets, and flow out of the accommodating space through the electroplating solution return channel.

[0011] In some embodiments, the circulation assembly includes a vessel-side inlet pipe, a vessel-side outlet pipe, a medicine storage tank, a circulation pump, a tank-side outlet pipe, a tank-side inlet pipe, and a rotary joint. The rotary joint includes a fixed portion and a rotating portion that are rotatably connected. One end of the vessel-side inlet pipe and one end of the vessel-side outlet pipe are connected to the fixed portion. The other end of the vessel-side inlet pipe is connected to the medicine storage tank. The other end of the vessel-side outlet pipe is connected to the circulation pump. The circulation pump is connected to the medicine storage tank. The tank-side inlet pipe... One end of the tube is connected to the electroplating solution inlet channel, one end of the tube side outlet is connected to the electroplating solution return channel, and the other ends of the tube side inlet and outlet are connected to the rotating part. The circulating pump can drive the electroplating solution to circulate along the path of the solution storage, the circulating pump, the tube side outlet, the rotary joint, the tube side inlet, the electroplating solution inlet channel, the electroplating solution return channel, the tube side outlet, the rotary joint, and the tube side inlet.

[0012] In some embodiments, the shielding fixture includes a rigid inner support and a flexible pad, the flexible pad being disposed over the rigid inner support, and the workpiece to be plated being embedded and connected to the shielding fixture in an interference fit manner.

[0013] In some embodiments, the shielding fixture further includes a rigid outer support, the flexible pad being able to be embedded and connected to the rigid outer support in an interference fit manner, the rigid outer support being able to be fixedly connected to the electroplating assembly to form the accommodating space, and... The rigid outer support is provided with a clamping structure, which is used to position, clamp, and move the shielding fixture.

[0014] In some embodiments, the electroplating component is provided with a first positioning structure, and the rigid outer bracket has a second positioning structure. The first positioning structure and the second positioning structure can be plugged into each other to limit the connection between the rigid outer bracket and the electroplating component.

[0015] Another objective of this invention is to provide an electroplating method that can achieve local electroplating processes with relatively simple steps, and can improve yield and reduce electroplating costs.

[0016] To achieve this objective, the present invention adopts the following technical solution: Electroplating methods include: The electroplating apparatus, the masking fixture, and the workpiece to be plated are connected to form an accommodating space, and the area to be plated of the workpiece is exposed in the accommodating space and located at the bottom of the accommodating space. The electroplating solution is driven to circulate between the circulation component and the accommodating space via the circulation component.

[0017] The above technical solution has the following advantages or beneficial effects: Using the electroplating apparatus and method described above, the electroplating assembly is first rotated to a first state, and the masking fixture, the workpiece to be plated, and the electroplating assembly are connected to form the aforementioned accommodating space. Then, the electroplating assembly is rotated to a second state, and the electroplating solution is circulated into the accommodating space via a circulation component, ensuring the electroplating solution is in a flowing state within the space. At this point, the area to be plated is located at the bottom of the accommodating space. Under the influence of gravity, the electroplating solution completely covers the area, and under the influence of buoyancy, air bubbles in the electroplating solution float upwards and leave the area to be plated, ensuring sufficient contact between the area and the electroplating solution and preventing incomplete plating. Furthermore, the flowing electroplating solution not only facilitates the removal of air bubbles from the area to be plated but also improves the uniformity of the electroplating solution, thereby ensuring electroplating quality and a uniform coating. This not only improves process efficiency and quality but also reduces process costs. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the electroplating apparatus in an embodiment of the present invention; Figure 2 This is a three-dimensional assembly diagram of the electroplating assembly, the shielding fixture, and the workpiece to be plated in the first state of the present invention. Figure 3 This is a schematic diagram of the assembly process of the electroplating component, the shielding fixture, and the workpiece to be plated when the workpiece is in the first state in this invention. Figure 4 It is along Figure 3 Internal structure diagram of electroplating components and masking fixtures in the AA direction; Figure 5 yes Figure 4 A magnified view of a section at point B in the middle; Figure 6 This is an internal structural diagram of the electroplating assembly and the shielding fixture in the second state. Figure 7 This is a perspective view of the second electrical connector in an embodiment of the present invention; Figure 8 This is a structural diagram of the electroplating solution inlet channel in the second electrical connector in an embodiment of the present invention; Figure 9 This is a perspective structural diagram of the rotary joint in an embodiment of the present invention; Figure 10 This is a front view of the rotary joint in an embodiment of the present invention; Figure 11 This is an exploded view of a portion of the rotary joint structure in an embodiment of the present invention. Figure 12 It is along Figure 10 Internal structure diagram of the rotary joint in the CC direction.

[0019] In the picture: 100. Workpiece to be plated; 1. Electroplating assembly; 10. Electroplating tank; 11. Electroplating tank base; 111. First part; 112. Second part; 12. Base; 13. First electrical connector; 14. Second electrical connector; 141. Electroplating solution inlet channel; 142. Electroplating solution inlet; 143. Electroplating solution return channel; 144. Electroplating solution return outlet; 15. First positioning structure; 16. First sealing ring; 17. Inlet connector; 18. Return connector; 2. Shielding fixture; 21. Rigid inner support; 22. Flexible rubber pad; 23. Rigid outer support; 231. Clamping structure; 232. Second positioning structure; 3. Circulation assembly; 31. Inlet pipe on the device side; 32. Outlet pipe on the device side; 33. Liquid storage tank; 34. Circulation pump; 35. Outlet pipe on the tank side; 36. Inlet pipe on the tank side; 37. Rotary joint; 371. Rotating part; 3711. First channel; 3712. Second channel; 3713. Fluid tank; 372. Fixing part; 373. Bearing; 374. Second sealing ring; 375. First connector on the device side; 376. Second connector on the device side; 377. First connector on the tank side; 378. Second connector on the tank side; 4. Rotating assembly; 41. Rotating bracket; 42. Rotating drive component; 5. Clamping assembly; 51. Clamping drive; 52. Clamping support arm; 53. Clamping component. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0021] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," "fixed," and "abutting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0024] The following is based on Figures 1 to 12 The electroplating apparatus and electroplating method provided in the embodiments of the present invention are described.

[0025] like Figure 1 As shown, in this embodiment, the electroplating apparatus mainly includes an electroplating component 1, a shielding fixture 2, and a circulation component 3. The electroplating component 1 has an electroplating tank 10 and can have a first state and a second state. When the electroplating component 1 is in the first state, the opening of the electroplating tank 10 faces upwards. When the electroplating component 1 is in the second state, the opening of the electroplating tank 10 faces downwards. The electroplating component 1 can rotate to switch between the first and second states.

[0026] The shielding fixture 2 can seal and connect to the workpiece 100 to be plated, and can be connected to the opening of the electroplating tank 10. At this time, a part of the surface of the workpiece 100 to be plated is covered and blocked by the shielding fixture 2, while another predetermined area is not covered and blocked by the shielding fixture 2, and the predetermined area, the inner surface of the shielding fixture 2, and at least a part of the inner surface of the electroplating tank 10 enclose a receiving space. The circulation component 3 is connected to the electroplating component 1 and communicates with the receiving space. Driven by the circulation component 3, the electroplating solution can circulate between the electroplating component 1 and the circulation component 3, so that the electroplating solution in the receiving space is in a flowing state. At this time, the electroplating solution can electroplat the aforementioned predetermined area (i.e., the area to be plated).

[0027] In a specific implementation, for example, the electroplating assembly 1 is first rotated to a first state, and the shielding fixture 2, the workpiece 100 to be plated, and the electroplating assembly 1 are connected to form the aforementioned accommodating space. Then, the electroplating assembly 1 is rotated to a second state, and the electroplating solution is circulated into the accommodating space through the circulation assembly 3, so that the electroplating solution in the accommodating space is in a flowing state. At this time, the area to be plated is located at the bottom of the accommodating space. Under the action of gravity, the electroplating solution can completely cover the area to be plated, and under the action of buoyancy, the air bubbles in the electroplating solution will also float upward and leave the area to be plated, ensuring that the area to be plated can fully contact the electroplating solution and avoiding incomplete plating. Furthermore, the flowing state of the electroplating solution not only facilitates the removal of air bubbles from the area to be plated, but also improves the uniformity of the electroplating solution, thereby ensuring the electroplating quality and making the coating uniform.

[0028] Therefore, with the above-mentioned electroplating device, it is only necessary to install the masking fixture 2 and the workpiece 100 to be plated on the electroplating component 1, then rotate the electroplating component 1 and start the circulation component 3, so that the electroplating process can be carried out quickly and conveniently, and the phenomenon of missed plating is greatly reduced, and the uniformity of the plating layer is improved. This not only helps to improve the process efficiency and process quality, but also achieves the effect of reducing process costs.

[0029] Continue to refer to Figure 1 As shown, in this embodiment, the electroplating apparatus further includes a rotating assembly 4. The rotating assembly 4 includes a rotating bracket 41 and a rotating drive 42, wherein the rotating bracket 41 includes a first support member and a second support member. The first support member fixes the rotating drive 42 in place, and the output end of the rotating drive 42 is fixedly connected to one side of the electroplating assembly 1. The other side of the electroplating assembly 1 is rotatably connected to the second support member via a bearing 373, thereby rotatably setting the electroplating assembly 1. Exemplarily, in this embodiment, the rotating assembly 4 uses a servo motor. The servo motor can not only realize the rotation of the electroplating assembly 1, allowing the electroplating assembly 1 to switch between a first state and a second state, but also realize a shaking action through slight rotation, thereby further facilitating the separation of bubbles from the area to be plated.

[0030] like Figure 2 , Figure 3 As shown, in this embodiment, the electroplating apparatus further includes a clamping assembly 5. Specifically, the electroplating assembly 1 includes a base 12, which is fixedly connected to the aforementioned rotary drive member 42 and rotatably connected to the second support member. The clamping assembly 5 includes a clamping drive member 51 and a clamping support arm 52. The clamping drive member 51 is fixedly connected to the base 12, and the clamping support arm 52 is connected to the output end of the clamping drive member 51 and can move in a direction away from or close to the base 12 under the action of the clamping drive member 51. The electroplating assembly 1 also includes an electroplating tank base 11, which is fixedly connected to the base 12. The aforementioned electroplating tank 10 is disposed on the side of the electroplating tank base 11 away from the base 12. Furthermore, along the axial direction of the opening of the electroplating tank 10, the electroplating tank base 11 is located between the base 12 and the clamping support arm 52.

[0031] More specifically, one end of the clamping arm 52 is connected to the clamping drive 51, and the other end is connected to the clamping member 53. Before rotating the electroplating assembly 1, the workpiece 100 to be plated and the masking fixture 2 are assembled and connected. Then, the clamping drive 51 moves the clamping member 53 away from the electroplating tank base 11. At this time, the workpiece 100 to be plated and the masking fixture 2 can enter between the electroplating tank base 11 and the clamping member 53, thus placing them at the opening of the electroplating tank 10. After being placed in place, the clamping drive 51 moves the clamping member 53 closer to the electroplating tank base 11, so that the clamping member 53 abuts against the workpiece 100 to be plated or the masking fixture 2, thereby limiting and abutting the workpiece 100 to be plated, the masking fixture 2, and the electroplating assembly 1, preventing the electroplating solution from leaking after rotating the electroplating assembly 1.

[0032] It should be noted that, due to the presence of the aforementioned clamping member 53, the clamping drive member 51 can be spaced apart from the electroplating tank base 11, thus avoiding any limitation on the size of the electroplating tank 10. At the same time, the clamping member 53 can abut against the center of the workpiece 100 to be plated or the shielding fixture 2, so that the circumferential direction of the shielding fixture 2 and the electroplating tank base 11 can achieve abutment and sealing with the same or similar pressure, thereby further preventing the phenomenon of local electroplating liquid leakage.

[0033] like Figure 2 , Figure 3 As shown, the clamping member 53 is connected to a first electrical connector 13. One end of the first electrical connector 13 is located on the side of the clamping member 53 away from the workpiece 100 to be plated, while the other end can pass through the clamping member 53 and abut against the workpiece 100 to be plated. During the electroplating process, by connecting the first electrical connector 13 to the cathode, an electrical connection can be formed between the workpiece 100 to be plated and the cathode. A second electrical connector 14 is provided in the electroplating tank 10, and an electrical connecting wire is passed through the electroplating tank base 11, with the electrical connecting wire and the second electrical connector 14 electrically connected. During the electroplating process, by connecting the electrical connecting wire to the anode, an electrical connection can be formed between the second electrical connector 14 and the anode. At this time, the electroplating solution in the containing space can come into contact with and be electrically connected to the second electrical connector 14, and directly contact the area to be plated, thereby realizing the electroplating process.

[0034] Preferably, the first electrical connector 13 is connected to a spring and is adjustablely positioned within the clamping member 53 in a direction close to the workpiece 100 to be plated. The spring connects the first electrical connector 13 and the clamping member 53, which allows the first electrical connector 13 to move relative to the clamping member 53 while preventing the first electrical connector 13 from applying a large clamping force to the workpiece 100 to be plated, thereby protecting the surface of the workpiece 100 to be plated.

[0035] Optionally, the electroplating tank substrate 11 includes a first portion 111 and a second portion 112, which are detachably connected. A second electrical connector 14 is disposed between the first portion 111 and the second portion 112, and when the first portion 111 and the second portion 112 are connected, the first portion 111 and the second portion 112 can clamp and fix the second electrical connector 14 between them, thereby fixing the second electrical connector 14.

[0036] Continue to refer to Figure 3 As shown, in this embodiment, a clamping structure 231 is provided on the outer side of the shielding fixture 2. The clamping structure 231 facilitates automated workpiece handling via a robotic arm or robot during workpiece transport. Exemplarily, in this embodiment, the clamping structure 231 includes clamping holes provided on the outer side of the shielding fixture 2. The robotic arm or robot is connected to corresponding pin structures, which can be inserted into the clamping holes to achieve stable clamping and accurate positioning of the shielding fixture 2 and the workpiece 100 to be plated.

[0037] like Figure 4 , Figure 5 As shown, the masking fixture 2 and the workpiece 100 to be plated are connected by an interference fit, thereby ensuring a fixed and sealed connection between the workpiece 100 and the masking fixture 2 during handling and electroplating. Specifically, the masking fixture 2 includes a rigid inner support 21 and a flexible rubber pad 22. The rigid inner support 21 is designed according to the shape of the workpiece 100 to be plated, and the flexible rubber pad 22 covers the rigid inner support 21. Generally, the masking fixture 2 has a through hole at its center, into which the workpiece 100 to be plated can be inserted, and the area to be plated can be located within the through hole without being covered by the flexible rubber pad 22. The elastic deformation capability of the flexible rubber pad 22 allows the workpiece 100 to be plated and the masking fixture 2 to be stably and sealed by an interference fit, while the rigid inner support 21 prevents the masking fixture 2 from undergoing large deformation that would cover the area to be plated, and ensures high reliability of the sealing contact between the masking fixture 2 and the electroplating assembly 1.

[0038] Preferably, the shielding fixture 2 further includes a rigid outer support 23, which has a mounting hole at its center. The assembly of the rigid inner support 21 and the flexible rubber pad 22 can also be inserted into the mounting hole, and the elastic deformation capability of the flexible rubber pad 22 allows the assembly to be stably and sealed to the rigid outer support 23 through an interference fit. The rigid outer support 23 is provided with the aforementioned clamping structure 231, so that when automated handling is performed by a robotic arm or robot, the shielding fixture 2 and the workpiece 100 to be plated can move together with higher positional accuracy, thereby providing a good positioning basis for electroplating and other upstream and downstream processes.

[0039] Furthermore, such as Figure 5 As shown, the electroplating tank base 11 is also provided with a first positioning structure 15, and the rigid outer support 23 is provided with a corresponding second positioning structure 232. When the shielding fixture 2 is placed at the opening of the electroplating tank 10, the first positioning structure 15 and the second positioning structure 232 can be inserted and connected, thereby achieving the effect of limiting and positioning. Optionally, the first positioning structure 15 includes a positioning pin, and the second positioning structure 232 includes a positioning hole. Of course, in some other embodiments, a limiting groove can also be directly provided at the opening, and the rigid outer support 23 can be embedded and inserted into the limiting groove, which can also achieve the limiting effect and is also within the scope of protection of this invention.

[0040] Optionally, in this embodiment, a first sealing ring 16 is also provided in the limiting groove to further enhance the sealing between the shielding fixture 2 and the electroplating tank substrate 11, and to avoid leakage of electroplating solution.

[0041] like Figure 6 As shown, preferably, the second electrical connector 14 is provided with an electroplating solution inlet channel 141 at the center position, so that the plating metal ions in the electroplating solution can be evenly distributed in the accommodating space, which is beneficial to improving the uniformity of the plating layer.

[0042] Specifically, such as Figure 7 , Figure 8 As shown, the second electrical connector 14 has five electroplating solution inlets 142 at its center, and a cross-shaped electroplating solution inlet channel 141. The five electroplating solution inlets 142 are evenly distributed and all communicate with the electroplating solution inlet channel 141. The electroplating tank substrate 11 is connected to an inlet connector 17, through which the electroplating solution can enter the electroplating tank substrate 11, flow into the electroplating solution inlet channel 141 through the channel inside the electroplating tank substrate 11, and then flow evenly into the accommodating space through the electroplating solution inlets 142, contacting the workpiece 100 to be plated and forming a plating layer.

[0043] Furthermore, the second electrical connector 14 is also provided with an electroplating solution return channel 143 and an electroplating solution return port 144. The electroplating tank substrate 11 is connected to a return connector 18. The electroplating solution in the accommodating space can flow into the channel in the electroplating tank substrate 11 through the electroplating solution return port 144 and the electroplating solution return channel 143, and then flow out of the electroplating assembly 1 through the return connector 18, thereby realizing the circulation of the electroplating solution. Exemplarily, in this embodiment, along the length direction of the second electrical connector 14 (as shown by the X-axis in the figure), an electroplating solution return channel 143 and an electroplating solution return port 144 are provided on each side of the second electrical connector 14, thereby further improving the uniformity of the distribution of plating metal ions in the accommodating space.

[0044] Reference Figure 1As shown, the circulation assembly 3 mainly includes a device-side inlet pipe 31, a device-side outlet pipe 32, a liquid storage tank 33, a circulation pump 34, a tank-side outlet pipe 35, a tank-side inlet pipe 36, and a rotary joint 37. The rotary joint 37 includes a fixed part 372 and a rotating part 371 that are rotatably connected. One end of the device-side inlet pipe 31 and one end of the device-side outlet pipe 32 are connected to the fixed part 372. The other end of the device-side inlet pipe 31 is connected to the liquid storage tank 33, and the other end of the device-side outlet pipe 32 is connected to the circulation pump 34, which is also connected to the liquid storage tank 33. One end of the tank-side inlet pipe 36 is connected to the inlet connector 17, one end of the tank-side outlet pipe 35 is connected to the return connector 18, and the other ends of both the tank-side inlet pipe 36 and the tank-side outlet pipe 35 are connected to the rotating part 371. The circulating pump 34 can drive the electroplating solution to circulate along the path of the solution storage 33, the circulating pump 34, the outlet pipe 32 on the tank side, the rotary joint 37, the inlet pipe 36 on the tank side, the inlet channel 141 of the electroplating solution, the return channel 143 of the electroplating solution, the outlet pipe 35 on the tank side, the rotary joint 37, and the inlet pipe 31 on the tank side.

[0045] Specifically, such as Figures 9 to 12 As shown, in the rotary joint 37, the fixed part 372 is connected to the device-side first connector 375 and the device-side second connector 376, and the rotating part 371 is connected to the groove-side first connector 377 and the groove-side second connector 378. The rotating part 371 passes through the fixed part 372, and the fixed part 372 and the rotating part 371 are rotatably connected by a bearing 373. Two fluid grooves 3713 are arranged around the outer peripheral surface of the rotating part 371, and the two fluid grooves 3713 are spaced apart along the axial direction of the rotating part 371. The interior of the rotating part 371 is provided with a first channel 3711 and a second channel 3712, which are respectively connected to one fluid groove 3713. The first channel 3711 is connected to the groove-side first connector 377, and the second channel 3712 is connected to the groove-side second connector 378. Along the axial direction of the rotating part 371, a second sealing ring 374 is provided on both sides of the two fluid grooves 3713, so that an independent annular channel is formed between the inner wall surface of each fluid groove 3713, the second sealing ring 374, and part of the inner wall surface of the fixing part 372. One annular channel communicates with the first channel 3711 and the groove-side first connector 377, while the other annular channel communicates with the second channel 3712 and the groove-side second connector 378. At the same time, the vessel-side first connector 375 and the vessel-side second connector 376 on the fixing part 372 are spaced apart along the axial direction of the rotating part 371 and are each communicated with an annular channel, so that when the rotating part 371 and the fixing part 372 rotate, the communication between the groove-side first connector 377 and the vessel-side first connector 375, and the communication between the groove-side second connector 378 and the vessel-side second connector 376 are maintained.

[0046] It should be noted that by decoupling the rotation of the electroplating assembly 1 from the fixed arrangement of some components in the circulation assembly 3 through the rotary joint 37, the electroplating assembly 1 can rotate without restriction. This also facilitates the installation of filters, heaters, and other regulators in the circulation assembly 3 to adjust the electroplating solution, thereby further enabling the electroplating process to be implemented with various preset parameters, which helps to expand the applicability of the electroplating apparatus and improve process quality.

[0047] The present invention also provides an electroplating method, implemented using the above-described electroplating apparatus, specifically comprising: The electroplating assembly 1, the masking fixture 2, and the workpiece 100 to be plated are connected to form an accommodating space, and the plated area of ​​the workpiece 100 to be plated is exposed in the accommodating space and located at the bottom of the accommodating space. The electroplating solution is driven to circulate between the circulation component 3 and the containment space via the circulation component 3.

[0048] In the above steps, mounting the workpiece 100 to be plated onto the masking fixture 2 can be done upstream of the electroplating process or during the preparation stage before implementing the electroplating process. Connecting the electroplating assembly 1, the masking fixture 2, and the workpiece 100 can be achieved using the aforementioned clamping assembly 5, or other methods such as bolt connections; this invention does not impose specific limitations on these methods. The rotation of the electroplating assembly 1 can be precisely driven by a servo motor or achieved manually; this invention also does not impose specific limitations on these methods.

[0049] This electroplating method enables the electroplating process to be carried out quickly and conveniently, greatly reducing plating defects and improving coating uniformity. It not only helps to improve process efficiency and quality, but also reduces process costs.

[0050] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0051] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. An electroplating apparatus, characterized in that, include: Electroplating assembly (1), the electroplating assembly (1) has an electroplating tank (10), the electroplating assembly (1) has a first state and a second state, in the first state the opening of the electroplating tank (10) is arranged facing upward, and in the second state the opening of the electroplating tank (10) is arranged facing downward; The shielding fixture (2) can be connected to the opening of the electroplating tank (10), and the shielding fixture (2) can be fixedly connected to the workpiece (100) to be plated, so that the area to be plated of the workpiece (100), part of the inner surface of the shielding fixture (2) and at least part of the inner surface of the electroplating tank (10) enclose a receiving space. A circulation component (3) is connected to the electroplating component (1) and can drive the electroplating solution to circulate between the electroplating component (1) and the circulation component (3) so that the electroplating solution located in the accommodating space can be in a flowing state.

2. The electroplating apparatus according to claim 1, characterized in that, The electroplating apparatus further includes a clamping assembly (5), which is fixedly connected to the electroplating assembly (1). The clamping assembly (5) has a clamping member (53). The distance between the clamping member (53) and the electroplating tank (10) along the groove direction of the electroplating tank (10) is adjustable. The clamping member (53) can abut against the end of the workpiece (100) to be plated that is away from the electroplating assembly (1) to limit and abut against the workpiece (100), the masking fixture (2), and the electroplating assembly (1).

3. The electroplating apparatus according to claim 2, characterized in that, The clamping member (53) is connected to a first electrical connector (13), which is able to abut against the workpiece to be plated (100) and be electrically connected to the workpiece to be plated (100).

4. The electroplating apparatus according to claim 1, characterized in that, The electroplating assembly (1) includes a second electrical connector (14), which is disposed within the accommodating space. When the electroplating assembly (1) is in the second state, the second electrical connector (14) can contact and be electrically connected to the electroplating solution.

5. The electroplating apparatus according to claim 4, characterized in that, The second electrical connector (14) is provided with an electroplating solution inlet channel (141) and a plurality of electroplating solution inlets (142). The plurality of electroplating solution inlets (142) are evenly spaced and communicate with the electroplating solution inlet channel (141). The second electrical connector (14) is provided with an electroplating solution return channel (143). The electroplating solution can flow into the accommodating space through the electroplating solution inlet channel (141) and the electroplating solution inlets (142), and flow out of the accommodating space through the electroplating solution return channel (143).

6. The electroplating apparatus according to claim 5, characterized in that, The circulation assembly (3) includes a device-side inlet pipe (31), a device-side outlet pipe (32), a liquid storage tank (33), a circulation pump (34), a tank-side outlet pipe (35), a tank-side inlet pipe (36), and a rotary joint (37). The rotary joint (37) includes a fixed part (372) and a rotating part (371) for rotatable connection. One end of the device-side inlet pipe (31) and one end of the device-side outlet pipe (32) are connected to the fixed part (372). The other end of the device-side inlet pipe (31) is connected to the liquid storage tank (33). The other end of the device-side outlet pipe (32) is connected to the circulation pump (34). The circulation pump (34) is connected to the liquid storage tank (33). The tank-side inlet pipe (36) is connected to the liquid storage tank (372). One end of the 6) is connected to the electroplating solution inlet channel (141), one end of the tank-side outlet pipe (35) is connected to the electroplating solution return channel (143), and the other end of the tank-side inlet pipe (36) and the other end of the tank-side outlet pipe (35) are connected to the rotating part (371). The circulating pump (34) can drive the electroplating solution to circulate along the path of the solution storage (33), the circulating pump (34), the device-side outlet pipe (32), the rotary joint (37), the tank-side inlet pipe (36), the electroplating solution inlet channel (141), the electroplating solution return channel (143), the tank-side outlet pipe (35), the rotary joint (37), and the device-side inlet pipe (31).

7. The electroplating apparatus according to claim 1, characterized in that, The shielding fixture (2) includes a rigid inner support (21) and a flexible pad (22). The flexible pad (22) is provided to cover the rigid inner support (21). The workpiece (100) to be plated can be embedded and connected to the shielding fixture (2) in an interference fit manner.

8. The electroplating apparatus according to claim 7, characterized in that, The shielding fixture (2) also includes a rigid outer support (23). The flexible rubber pad (22) can be embedded and connected to the rigid outer support (23) in an interference fit manner. The rigid outer support (23) can be fixedly connected to the electroplating assembly (1) to form the accommodating space. The rigid outer support (23) is provided with a clamping structure (231), which is used to position, clamp and move the shielding fixture (2).

9. The electroplating apparatus according to claim 8, characterized in that, The electroplating component (1) is provided with a first positioning structure (15), and the rigid outer bracket (23) has a second positioning structure (232). The first positioning structure (15) and the second positioning structure (232) can be plugged in to limit the connection between the rigid outer bracket (23) and the electroplating component (1).

10. An electroplating method, characterized in that, include: The electroplating assembly (1), the masking fixture (2), and the workpiece to be plated (100) are connected so that an accommodating space is formed between the electroplating assembly (1), the masking fixture (2), and the workpiece to be plated (100), and the plated area of ​​the workpiece to be plated (100) is exposed in the accommodating space and located at the bottom of the accommodating space. The electroplating solution is driven to circulate between the circulation component (3) and the accommodating space via the circulation component (3).

Images