Liquid-cooled power conversion device

Abstract

The application relates to a liquid-cooled power conversion device, comprising: a shell; a capacitor assembly arranged in the shell through a mounting piece; a liquid cooling assembly arranged in the shell through the mounting piece and located below the capacitor assembly; a plurality of absorption capacitors arranged in a containing space formed by the liquid cooling assembly, the mounting piece and the capacitor assembly through a limiting piece; wherein the limiting piece is completely limited in the containing space under the action of the liquid cooling assembly, the mounting piece and the capacitor assembly, and the plurality of absorption capacitors are distributed on the top of the liquid cooling assembly in a completely limited manner under the action of the limiting piece. The top of the limiting piece is in abutment with the lower part of the capacitor assembly, the absorption capacitors are pressed down, the limiting piece is fixed and assembled through the capacitor assembly above the limiting piece, the absorption capacitors below the limiting piece and the mounting piece on the side of the limiting piece, and an absorption capacitor fixing scheme with lower assembly cost and installation difficulty is provided.

Description

Technical Field

[0001] This invention relates to the field of automated electronics and power equipment technology, and specifically to a liquid-cooled power conversion device. Background Technology

[0002] The power conversion equipment industry is currently in a phase of "high prosperity and great transformation" driven by the dual demands of "new energy grid connection" and "AI computing power hunger", powered by the dual core technologies of "wide bandgap semiconductors" and "software-defined", and opened up the ceiling for overseas expansion by the "global power grid investment super cycle".

[0003] Taking an inverter as an example, although the DC bus support capacitor has a large capacitance, it is usually far from the IGBT, and the parasitic inductance of the connecting wires still exists. When the IGBT turns off a large current at an extremely high speed, a very high back electromotive force (spiking voltage) will be induced on the parasitic inductance. This spike is directly applied across the IGBT terminals, and if it exceeds the withstand voltage range, it will cause the device to break down and be damaged. The absorption capacitor, due to its small capacitance, good high-frequency response, and the fact that it is installed close to the switching device, significantly shortening the absorption circuit path, achieves "nearby, immediate" spike absorption with a very small loop inductance L. In the existing technology, the absorption capacitor does not have a corresponding installation limiting structure, and the absorption capacitor is prone to failures such as pin fatigue and solder joint cracking due to vibration. Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a liquid-cooled power conversion device that is easy to install and has a good limiting effect.

[0005] This invention provides a liquid-cooled power conversion device, comprising: case; The capacitor assembly is housed within the casing via mounting hardware; The liquid cooling assembly is housed within the casing via mounting hardware and is located below the capacitor assembly; Multiple absorption capacitors are positioned within a receiving space enclosed by liquid cooling components, mounting components, and capacitor components via limiting members; Among them, the limiting component is completely confined within the receiving space by the liquid cooling component, the mounting component, and the capacitor component, and multiple absorption capacitors are distributed on the top of the liquid cooling component in a completely confined manner by the limiting component.

[0006] Optionally, multiple absorption capacitors are in direct contact with the top of the liquid cooling assembly.

[0007] Optionally, the limiting member has a snap-fit ​​portion, and the mounting member has a snap-fit ​​groove that mates with the snap-fit ​​portion. The limiting member achieves limiting by the snap-fit ​​engagement between the snap-fit ​​portion and the snap-fit ​​groove; and / or, The top of the limiting member abuts against the capacitor assembly, which is configured to limit the limiting member from the top.

[0008] Optionally, the snap-fit ​​portion is a lug located at the bottom of the limiting member, and the lug is inclined relative to the top surface of the liquid cooling assembly; The snap-fit ​​slot is positioned near the top surface of the liquid cooling component, with the bottom of the slot lower than the top surface of the liquid cooling component and the top of the slot higher than the top surface of the liquid cooling component.

[0009] Optionally, the absorption capacitor is confined between the top surface of the liquid cooling assembly and the limiting member, wherein the limiting member has through-holes corresponding to the multiple absorption capacitors, and a portion of the absorption capacitor extends through the through-holes to the other side of the limiting member, and the through-holes are configured to define the installation positions of the multiple absorption capacitors.

[0010] Optionally, the projection of the through-hole in the vertical direction is smaller than the projection of the absorption capacitor in the vertical direction.

[0011] Optionally, the limiting member includes a first plate portion located between the capacitor assembly and the liquid cooling assembly and pressed above a plurality of absorption capacitors, and a second plate portion connected to the first plate portion. The first plate portion and the second plate portion have an obtuse angle bend, and the second plate portion and the top surface of the liquid cooling assembly are distributed at an acute angle and the second plate portion is inclined toward the liquid cooling assembly so that the bottom of the second plate portion abuts against the mounting member. Wherein, at the connection between the first plate and the second plate, or on the second plate, a through-hole is provided, through which the portion of the absorbing capacitor extends to the other side of the limiting member.

[0012] Optionally, the first plate portion is further provided with a folded portion at the edge away from the second plate portion, which abuts against the bottom of the capacitor assembly, wherein the area of ​​the top surface of the folded portion is smaller than the area of ​​the top surface of the first plate portion.

[0013] Optionally, the mounting component is located on the same side as the capacitor assembly and the liquid cooling assembly.

[0014] Optionally, the housing also includes multiple IGBT components, which are mounted on the liquid cooling assembly. The multiple IGBT components and mounting components are located on opposite sides of the liquid cooling assembly. The IGBT assembly has terminals on top that are electrically connected to the absorption capacitors. The terminals and mounting hardware are located on opposite sides of the multiple absorption capacitors.

[0015] The beneficial effects of this invention are: This invention provides a liquid-cooled power conversion device, comprising: a housing; a capacitor assembly disposed within the housing via a mounting member; a liquid-cooling assembly disposed within the housing via the mounting member and located below the capacitor assembly; and a plurality of absorption capacitors disposed within a receiving space formed by the liquid-cooling assembly, the mounting member, and the capacitor assembly via limiting members; wherein the limiting members are completely confined within the receiving space by the liquid-cooling assembly, the mounting member, and the capacitor assembly, and the plurality of absorption capacitors are distributed on top of the liquid-cooling assembly in a completely confined manner by the limiting members.

[0016] The pins of the absorption capacitor are soldered to the terminals located on the back of the liquid cooling assembly. The portion of the DC capacitor protruding above the liquid cooling assembly is fixed by a mounting component, namely a Z-shaped heat-conducting plate, for passive heat dissipation. The bottom of the absorption capacitor contacts the top of the liquid cooling assembly, and its pins are soldered to the terminals. A limiting component at least partially presses against the absorption capacitor. The snap-fit ​​portion of the limiting component engages with a corresponding snap-fit ​​groove on the Z-shaped heat-conducting plate to assemble and fix the absorption capacitor. The top of the limiting component abuts against the bottom of the capacitor assembly, pressing down on the absorption capacitor. The limiting component, through the DC capacitor above it, the absorption capacitor below it, and the Z-shaped heat-conducting plate on its side, achieves its own fixed assembly, providing a low-cost and low-difficulty absorption capacitor fixing solution.

[0017] The limiting component is tilted relative to the absorption capacitor, and the absorption capacitor is restricted by the through-hole to prevent large displacement due to vibration during transportation or inverter operation.

[0018] Under the pressure of the capacitor assembly above, the first plate of the limiting member provides a downward pressure on the absorption capacitor, so that the absorption capacitor can make close contact with the liquid cooling assembly and ensure heat dissipation.

[0019] The second plate of the limiting component is inclined relative to the top surface of the absorbing capacitor. Therefore, when the folded part is subjected to downward pressure, the second plate will tend to tilt upward. This upward tilting tendency is counteracted by the snap-fit ​​part at the bottom of the second plate, which works in conjunction with the snap-fit ​​groove on the mounting component. The upper surface of the lug abuts against the upper edge of the snap-fit ​​groove. The absorbing capacitor is fixedly assembled inside the device through the limiting component, ensuring close contact between the absorbing capacitor and the liquid cooling component. After the absorbing capacitor is welded and fixed to the terminal block, the fixed assembly of the absorbing capacitor is achieved solely through the structural cooperation between the limiting component and the capacitor assembly, the liquid cooling component, and the mounting component, reducing assembly costs and maintenance difficulty. Attached Figure Description

[0020] The features and advantages of the invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the invention in any way. In the drawings: Figure 1An overall structural diagram of a liquid-cooled power conversion device according to an embodiment of the present invention is shown; Figure 2 An internal structural diagram of a liquid-cooled power conversion device according to an embodiment of the present invention is shown; Figure 3 This shows one of the enlarged views of the internal structure of a liquid-cooled power conversion device according to an embodiment of the present invention; Figure 4 One of the exploded views of the internal structure of a liquid-cooled power conversion device according to an embodiment of the present invention is shown; Figure 5 This is a second exploded view of the internal structure of a liquid-cooled power conversion device according to an embodiment of the present invention; Figure 6 This is a second enlarged view of the internal structure of a liquid-cooled power conversion device according to an embodiment of the present invention. Detailed Implementation

[0021] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0022] like Figures 1 to 6 As shown, this embodiment of the invention provides a liquid-cooled power conversion device, including a housing 1, a capacitor assembly 2, a mounting component 3, a liquid-cooling assembly 4, multiple absorption capacitors 5, and a limiting component 6. The capacitor assembly 2 is disposed within the housing 1 via the mounting component 3. The liquid-cooling assembly 4 is disposed within the housing 1 via the mounting component 3 and is located below the capacitor assembly 2. The multiple absorption capacitors 5 are disposed within a receiving space formed by the liquid-cooling assembly 4, the mounting component 3, and the capacitor assembly 2 via the limiting component 6. The limiting component 6 completely confines the absorption capacitors 5 within the receiving space under the action of the liquid-cooling assembly 4, the mounting component 3, and the capacitor assembly 2. The multiple absorption capacitors 5 are distributed on top of the liquid-cooling assembly 4 in a completely confined manner by the limiting component 6, resulting in good installation and confinement effects and preventing pin fatigue, solder joint cracking, and other malfunctions caused by vibration in the absorption capacitors 5.

[0023] like Figure 3 As shown, multiple absorption capacitors 5 are in direct contact with the top of the liquid cooling assembly 4. The heat generated by the absorption capacitors 5 is directly carried away by the liquid cooling assembly 4, preventing heat buildup inside the capacitors. The absorption capacitors 5 are directly mounted on the top surface of the liquid cooling assembly 4. As a rigid support structure, the liquid cooling assembly 4 enhances the vibration and shock resistance of the absorption capacitors 5, further preventing pin fatigue, solder joint cracking, and other failures caused by vibration. Furthermore, the direct contact design between the absorption capacitors 5 and the liquid cooling assembly 4 eliminates the need for additional heat dissipation brackets (not shown) or thermal pads (not shown), simplifying the installation structure and making the internal structure of the device more compact and space-efficient.

[0024] In this embodiment, the power conversion component is taken as an inverter, such as... Figures 2 to 4 As shown, capacitor assembly 2 consists of several DC capacitors and is located in the upper half of the device. Liquid cooling assembly 4 is located in the lower half of the device. IGBT assembly 7 is attached to liquid cooling assembly 4 and is also located in the lower half of the device. Absorption capacitor 5 is attached to the top of liquid cooling assembly 4. Terminal 8 is located at the bottom of DC capacitors and on one side of the pins of absorption capacitor 5. Figure 3 The IGBT assembly 7 and the terminal block 8 are located on the same side of the liquid cooling assembly 4. This minimizes the electrical path between the capacitor assembly 2, the absorption capacitor 5, and the IGBT assembly 7, eliminating excessively long trace inductance.

[0025] For ease of explanation, the side of the liquid cooling assembly 4 where the IGBT assembly 7 is located is defined as the back side, and the side opposite the back side is defined as the front side of the liquid cooling assembly 4. The capacitor assembly 2 is connected to the liquid cooling assembly 4 via a mounting member 3. The mounting member 3 can conduct the heat generated by the capacitor assembly 2 to the liquid cooling assembly 4, achieving passive heat dissipation. The mounting member 3 can be a straight plate or a bent plate; in one embodiment, the mounting member 3 is a Z-shaped heat-conducting plate. The mounting member 3 is connected to the front side of the liquid cooling assembly 4. The front and back sides of the liquid cooling assembly 4 are two large end faces, with a large heat dissipation area, which can effectively remove heat from the IGBT assembly 7 and the capacitor assembly 2.

[0026] like Figure 3 As shown, the limiting member 6 is provided with a snap-fit ​​portion 601, and the mounting member 3 is provided with a snap-fit ​​groove 301 that mates with the snap-fit ​​portion 601. The limiting member 6 achieves limiting by snap-fit ​​engagement between the snap-fit ​​portion 601 and the snap-fit ​​groove 301; and / or, the top of the limiting member 6 abuts against the capacitor assembly 2, and the capacitor assembly 2 is configured to limit it from the top of the limiting member 6.

[0027] In this embodiment, as Figure 3 , Figure 5 and Figure 6 As shown, the absorption capacitor 5 is located between the DC capacitor and the liquid cooling assembly 4, and the pins of the absorption capacitor 5 are soldered and fixed to the terminal block 8 located on the back of the liquid cooling assembly 4.

[0028] The bottom of the absorption capacitor 5 contacts the top of the liquid cooling assembly 4, and its pins are welded and fixed to the terminal block 8. The limiting member 6 is at least partially pressed onto the absorption capacitor 5. The snap-fit ​​part 601 of the limiting member 6 cooperates with the snap-fit ​​groove 301 correspondingly opened on the Z-shaped heat-conducting plate to realize the assembly and fixation of the absorption capacitor 5.

[0029] In a specific embodiment, such as Figure 5 and Figure 6As shown, the top of the limiting member 6 abuts against the capacitor assembly 2. Specifically, the capacitor assembly 2 is located above the limiting member 6, and the top of the limiting member 6 abuts against the bottom of the capacitor assembly 2. The capacitor assembly 2 is pressed against the top of the limiting member 6, and the limiting member 6 presses down on the absorbing capacitor 5. Thus, the upward movement freedom of the limiting member 6 and the absorbing capacitor 5 can be restricted by the capacitor assembly 2.

[0030] Under the downward pressure of the limiting member 6, the absorption capacitor 5 makes full contact with the top (top surface) of the liquid cooling component 4, which helps the absorption capacitor 5 to conduct heat to the liquid cooling component 4 and can improve the heat dissipation effect to a certain extent.

[0031] The limiting component 6 achieves its own assembly through the capacitor assembly 2 above it, the absorption capacitor 5 below it, and the Z-shaped heat conduction plate on the side. It makes full use of the surrounding components and does not require fasteners during installation, reducing the number of assembly parts and achieving a low assembly cost and low installation difficulty absorption capacitor installation scheme.

[0032] like Figure 6 As shown, the latching portion 601 is a lug located at the bottom of the limiting member 6, and the lug is inclined relative to the top surface of the liquid cooling assembly 4; the latching groove 301 is located close to the top surface of the liquid cooling assembly 4, with the bottom of the groove 301 lower than the top surface of the liquid cooling assembly 4 and the top of the groove higher than the top surface of the liquid cooling assembly 4. In this application, the latching portion 601 is secured by the inclined distribution of the latching portion 601 and the fact that part of the latching groove 301 is located below the top surface of the liquid cooling assembly 4, eliminating the need for additional springs, buckles, or other parts, resulting in a simpler overall structure and smaller space occupation. It is worth noting that because part of the latching groove 301 is located below the top surface of the liquid cooling assembly 4, the latching portion 601 is not easily disengaged from the latching groove 301.

[0033] like Figure 3 and Figure 6 As shown, the absorption capacitor 5 is confined between the top surface of the liquid cooling assembly 4 and the limiting member 6. The limiting member 6 has through holes 602 that correspond one-to-one with the multiple absorption capacitors 5. Part of the absorption capacitor 5 extends through the through holes 602 to the other side of the limiting member 6. The through holes 602 are configured to limit the installation position of the multiple absorption capacitors 5.

[0034] As an optional implementation, the projection of the through-hole 602 in the vertical direction is smaller than the projection of the absorption capacitor 5 in the vertical direction. In this way, the absorption capacitor 5 can only partially pass through the through-hole 602, thereby ensuring that the limiting member 6 can press against the absorption capacitor 5 to limit the installation position of the absorption capacitor 5 on the top of the liquid cooling assembly 4; at the same time, the through-hole 602 can constrain the relative position between the absorption capacitor 5 and the limiting member 6 to prevent radial displacement between the two.

[0035] In this embodiment, the limiting member 6 is inclined relative to the absorption capacitor 5, and the absorption capacitor 5 is prevented from shifting due to vibration during transportation or inverter operation by the through-hole 602.

[0036] As an optional implementation, the limiting member 6 includes a first plate portion 603 located between the capacitor assembly 2 and the liquid cooling assembly 4 and pressed above the plurality of absorption capacitors 5, and a second plate portion 604 connected to the first plate portion 603. The first plate portion 603 and the second plate portion 604 have an obtuse angle bend, and the second plate portion 604 is distributed at an acute angle with the top surface of the liquid cooling assembly 4, and the second plate portion 604 is inclined toward the liquid cooling assembly 4 so that the bottom of the second plate portion 604 abuts against the mounting member 3. The connection between the first plate portion 603 and the second plate portion 604, or the second plate portion 604, is provided with a through hole 602, through which a portion of the absorption capacitor 5 extends to the other side of the limiting member 6.

[0037] A folded portion 605, which abuts against the bottom of the capacitor assembly 2, is also provided at the edge of the first plate portion 603 away from the second plate portion 604. The folded portion 605 is the top of the limiting member 6. The area of ​​the top surface of the folded portion 605 is smaller than the area of ​​the top surface of the first plate portion 603. The smaller contact area results in higher pressure and concentrated friction, making it less likely for the limiting member 6 to shift or deviate under vibration conditions. The small contact area between the capacitor assembly 2 and the limiting member 6 also results in a narrow heat conduction path, reducing the transfer of heat from the capacitor assembly 2 to the limiting member 6 and the absorbing capacitor 5, thus protecting the absorbing capacitor 5.

[0038] like Figure 6 As shown, under the pressure of the capacitor assembly 2 above, the first plate 603 provides a downward pressure on the absorption capacitor 5, so that the absorption capacitor 5 can be in close contact with the liquid cooling assembly 4, ensuring the heat dissipation effect.

[0039] The design of the through-hole 602 exposes the upper end and front end of the absorption capacitor 5 to the limiting part 6, so as to avoid blocking the absorption capacitor 5 and affecting heat dissipation as much as possible.

[0040] The second plate portion 604 of the limiting member 6 is inclined relative to the top surface of the absorption capacitor 5. Therefore, when the folded portion 605 is subjected to downward pressure, the second plate portion 604 tends to tilt upward. The upward tilting tendency of the folded portion is counteracted by the snap-fit ​​portion 601 provided at the bottom of the second plate portion 604, which cooperates with the snap-fit ​​groove 301 on the mounting member 3. Figure 3As shown, the upper surface of the lug 601 abuts against the upper edge of the snap-fit ​​groove 301. The absorption capacitor 5 is fixedly assembled inside the device through the limiting member 6, ensuring close contact between the absorption capacitor 5 and the liquid cooling component 4. After the absorption capacitor is welded and fixed to the terminal 8, the fixed assembly of the absorption capacitor 5 is achieved only through the structural cooperation between the limiting member 6 and the capacitor assembly 2, the liquid cooling component 4, and the mounting member 3, which reduces assembly costs and maintenance difficulty.

[0041] As an optional implementation, the mounting component 3 is located on the same side as the capacitor assembly 2 and the liquid cooling assembly 4.

[0042] In this embodiment, several through holes 302 at the upper end of the mounting component 3 are used to achieve fixed assembly with the capacitor assembly 2, and several through holes at the lower end of the mounting component 3 are used to achieve fixed assembly with the liquid cooling assembly.

[0043] As an optional implementation, the housing 1 is further provided with a plurality of IGBT components 7, which are disposed on the liquid cooling component 4. The plurality of IGBT components 7 and the mounting component 3 are respectively located on opposite sides of the liquid cooling component 4. The top of the IGBT component 7 is provided with a terminal 8 that is electrically connected to the absorption capacitor 5. The terminal 8 and the mounting component 3 are respectively located on opposite sides of the plurality of absorption capacitors 5.

[0044] like Figure 4 As shown, the IGBT assembly 7 is located on the other side of the liquid cooling assembly 4 relative to the mounting component 3, and the copper busbar 9 is also located on the same side of the IGBT assembly 7.

[0045] In this application, the material of the limiting member 6 is elastic, and the limiting member 6 is an elastic member. Preferably, the limiting member 6 is a sheet metal bending member. During assembly, the limiting member 6 is slightly squeezed or bent, resulting in elastic deformation. After deformation, a rebound force is generated to automatically lock and ensure continuous fit.

[0046] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A liquid-cooled power conversion device, characterized in that, include: Shell (1); The capacitor assembly (2) is disposed within the housing (1) via a mounting component (3); The liquid cooling assembly (4) is disposed inside the housing (1) via the mounting component (3) and is located below the capacitor assembly (2); Multiple absorption capacitors (5) are disposed within a receiving space formed by the liquid cooling assembly (4), the mounting member (3), and the capacitor assembly (2) by means of a limiting member (6); The limiting member (6) is completely confined within the receiving space by the liquid cooling assembly (4), the mounting member (3), and the capacitor assembly (2), and the plurality of absorption capacitors (5) are distributed on the top of the liquid cooling assembly (4) in a completely confined manner by the limiting member (6).

2. The liquid-cooled power conversion device according to claim 1, characterized in that, The plurality of absorption capacitors (5) are in direct contact with the top of the liquid cooling assembly (4).

3. The liquid-cooled power conversion device according to claim 1, characterized in that, The limiting member (6) is provided with a snap-fit ​​portion (601), and the mounting member (3) is provided with a snap-fit ​​groove (301) that mates with the snap-fit ​​portion (601). The limiting member (6) achieves limiting by snap-fit ​​engagement between the snap-fit ​​portion (601) and the snap-fit ​​groove (301); and / or, The top of the limiting member (6) abuts against the capacitor assembly (2), which is configured to limit the limiting member (6) from the top.

4. The liquid-cooled power conversion device according to claim 3, characterized in that, The snap-fit ​​part (601) is a lug provided at the bottom of the limiting member (6), and the lug is inclined relative to the top surface of the liquid cooling assembly (4). The snap-fit ​​groove (301) is located near the top surface of the liquid cooling assembly (4). The bottom of the snap-fit ​​groove (301) is lower than the top surface of the liquid cooling assembly (4), and the top of the groove is higher than the top surface of the liquid cooling assembly (4).

5. The liquid-cooled power conversion device according to claim 1, characterized in that, The absorption capacitor (5) is confined between the top surface of the liquid cooling assembly (4) and the limiting member (6), wherein the limiting member (6) has through holes (602) corresponding to the plurality of absorption capacitors (5) one by one, and a portion of the absorption capacitor (5) extends through the through holes (602) to the other side of the limiting member (6), and the through holes (602) are configured to define the installation position of the plurality of absorption capacitors (5).

6. The liquid-cooled power conversion device according to claim 5, characterized in that, The projection of the through-hole (602) in the vertical direction is smaller than the projection of the absorption capacitor (5) in the vertical direction.

7. The liquid-cooled power conversion device according to claim 1, characterized in that, The limiting member (6) includes a first plate (603) located between the capacitor assembly (2) and the liquid cooling assembly (4) and pressed above the plurality of absorption capacitors (5), and a second plate (604) connected to the first plate (603). The first plate (603) and the second plate (604) have an obtuse angle bend. The second plate (604) and the top surface of the liquid cooling assembly (4) are distributed at an acute angle and the second plate (604) is inclined toward the liquid cooling assembly (4) so ​​that the bottom of the second plate (604) abuts against the mounting member (3). Wherein, at the connection between the first plate portion (603) and the second plate portion (604), or, the second plate portion (604) is provided with a through opening (602), a portion of the absorption capacitor (5) extends through the through opening (602) to the other side of the limiting member (6).

8. The liquid-cooled power conversion device according to claim 7, characterized in that, The first plate portion (603) is further provided with a folded portion (605) at the edge away from the second plate portion (604) and abuts against the bottom of the capacitor assembly (2), wherein the area of ​​the top surface of the folded portion (605) is smaller than the area of ​​the top surface of the first plate portion (603).

9. The liquid-cooled power conversion device according to claim 1, characterized in that, The mounting component (3) is located on the same side as the capacitor assembly (2) and the liquid cooling assembly (4).

10. The liquid-cooled power conversion device according to claim 1, characterized in that, The housing (1) is further provided with a plurality of IGBT components (7), which are disposed on the liquid cooling assembly (4). The plurality of IGBT components (7) and the mounting component (3) are respectively located on opposite sides of the liquid cooling assembly (4). The IGBT assembly (7) is provided with a terminal (8) on its top that is electrically connected to the absorption capacitor (5). The terminal (8) and the mounting component (3) are located on opposite sides of the plurality of absorption capacitors (5).

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