Adsorption apparatus, film formation apparatus, adsorption method, and manufacturing method

Abstract

Provided is an adsorption device characterized by including: a substrate support portion that supports a peripheral portion of a first surface of a substrate including the first surface and a second surface on an opposite side to the first surface; an adsorption plate that adsorbs the second surface of the substrate supported by the substrate support portion; a first adjustment portion that adjusts the inclination of the adsorption plate with respect to a mask stage on which a mask for forming a pattern on the first surface of the substrate is placed or the mask; a plurality of pressing members that are respectively provided facing a plurality of portions of a peripheral portion of the second surface of the substrate for pressing the substrate from the second surface side; and a second adjustment portion that adjusts the pressing force of the plurality of pressing members that press the second surface of the substrate supported by the substrate support portion, respectively, in accordance with the inclination of the adsorption plate in a state in which the adsorption plate is inclined by the first adjustment portion.

Description

Technical Field

[0001] This invention relates to adsorption devices, film-forming devices, adsorption methods, and manufacturing methods. Background Technology

[0002] Organic EL display devices (organic EL displays) are used in applications such as smartphones, televisions, automotive displays, and VRHMDs (Virtual Reality Head-Mounted Displays). In the manufacturing process of organic EL display devices, a film-forming apparatus is typically used when forming organic light-emitting elements (organic EL elements: OLEDs) on a substrate.

[0003] The film deposition apparatus allows vapor deposition material (film deposition material) emitted from a vapor deposition source to adhere to a substrate via a mask having a pattern corresponding to the pixel pattern, thereby forming a film such as an organic film or a metal film. At this time, it is necessary to align the substrate and the mask with high precision.

[0004] Previously proposed techniques related to the alignment of substrates and masks (see Patent Documents 1 and 2). Patent Document 1 discloses a technique that adjusts the relative tilt of the adsorption plate for adsorbing the substrate and the mask stage for placing the mask to suppress the reduction in alignment accuracy. Patent Document 2 discloses a technique that presses multiple portions (corners) of the substrate before the adsorption plate adsorbs the substrate to reduce the deflection of the substrate supported by the substrate support unit.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2022-57673 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] However, in the prior art, when the adsorption plate is tilted in accordance with the tilt of the mask stage, multiple parts of the substrate supported by the substrate support unit are pressed down. Afterwards, if the substrate is adsorbed (attached) to the adsorption plate, poor substrate adsorption increases. Poor substrate adsorption in the adsorption plate increases process time, becoming a major cause of reduced yield and productivity.

[0010] This invention provides a technique that helps reduce poor adsorption of the substrate in an adsorption plate.

[0011] Methods for solving problems

[0012] The adsorption device, as an aspect of the present invention, is characterized by comprising: a substrate support portion supporting a peripheral portion of the first surface of a substrate including a first surface and a second surface opposite to the first surface; an adsorption plate adsorbing the second surface of the substrate supported by the substrate support portion; a first adjustment portion adjusting the relative tilt of the adsorption plate to a mask stage or the mask on which a mask for forming a pattern on the first surface of the substrate is mounted; a plurality of pressing members disposed facing a plurality of portions of the peripheral portion of the second surface of the substrate for pressing the substrate from the second surface side; and a second adjustment portion adjusting the pressing force of the plurality of pressing members on the second surface of the substrate supported by the substrate support portion according to the tilt of the adsorption plate when the adsorption plate is tilted by the first adjustment portion.

[0013] Invention Effects

[0014] According to the present invention, for example, a technique can be provided that helps to reduce poor adsorption of the substrate in the adsorption plate.

[0015] Other features and advantages of the invention will become apparent from the following description with reference to the accompanying drawings. Furthermore, in the drawings, the same or identical structures are labeled with the same reference numerals. Attached Figure Description

[0016] The accompanying drawings, which are included in and form a part of this specification, illustrate embodiments of the invention and, together with the description, explain the principles of the invention.

[0017] Figure 1 This is a diagram schematically illustrating a portion of the structure of an electronic device production line.

[0018] Figure 2 This is a diagram that roughly shows the structure of the film-forming device.

[0019] Figure 3 This is a diagram that roughly shows the structure of the adjustment unit.

[0020] Figure 4 This is a diagram showing the positional relationship between the through holes formed in the adsorption plate and the pressing member.

[0021] Figure 5 This is a diagram schematically showing an example of a pressing area of ​​a pressing member on the second surface of a substrate.

[0022] Figure 6 This is a diagram schematically showing an example of a pressing area of ​​a pressing member on the second surface of a substrate.

[0023] Figure 7This is a diagram showing an example of the structure of the pressing adjustment part in this embodiment.

[0024] Figure 8A This is a diagram showing an example of the structure of the pressing adjustment part in this embodiment.

[0025] Figure 8B This is a diagram showing an example of the structure of the pressing adjustment part in this embodiment.

[0026] Figure 9A This is a diagram used to illustrate an organic EL display device as an electronic component.

[0027] Figure 9B This is a diagram used to illustrate an organic EL display device as an electronic component. Detailed Implementation

[0028] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Furthermore, the following embodiments do not limit the invention as defined in the claims, and the complete combination of features described in the embodiments is not limited to the combinations necessary for the invention. Two or more features from the plurality of features described in the embodiments can be combined arbitrarily. Additionally, the same or identical structures are labeled with the same reference numerals, and repeated descriptions are omitted.

[0029] Figure 1 This is a schematic diagram illustrating part of the structure (layout) of a production line for an electronic device that can be applied as an aspect of the present invention. Figure 1 The production line shown is, for example, used to manufacture display panels for organic EL display devices for smartphones. The substrate 100 is sequentially transported to the film forming block 301 (film forming section) for organic EL film forming processing on the substrate 100.

[0030] In the film-forming block 301, a plurality of film-forming chambers 303a to 303d for film-forming the substrate 100 are arranged around a transport chamber 302, which has an octagonal shape when viewed from above, and a mask storage chamber 305 for storing the mask used in the film-forming process. A transport robot 302a for transporting the substrate 100 is provided in the transport chamber 302. The transport robot 302a includes a hand that holds the substrate 100 and a multi-joint arm that moves the hand in the horizontal direction. In other words, the film-forming block 301 is a cluster-type film-forming unit in which a plurality of film-forming chambers 303a to 303d are arranged around the transport robot 302a. Furthermore, when collectively referred to as film-forming chambers 303a to 303d, or when not specifically distinguished, film-forming chambers 303a to 303d are referred to as film-forming chamber 303.

[0031] Along the transport direction (arrow direction) of the substrate 100, a buffer chamber 306, a gyratory chamber 307, and a junction chamber 308 are respectively disposed on the upstream and downstream sides of the film-forming block 301. During the manufacturing process, the film-forming chamber 303, the mask storage chamber 305, the buffer chamber 306, the gyratory chamber 307, and the junction chamber 308 are maintained in a vacuum state (vacuum atmosphere). Figure 1 The diagram shows only one film-forming block 301, but is not limited to this. For example, the production line may also have a structure in which multiple film-forming blocks 301 are connected by a connecting device consisting of a buffer chamber 306, a swirl chamber 307, and a transfer chamber 308. However, the connecting device may also consist of only the buffer chamber 306 or the transfer chamber 308.

[0032] The transport robot 302a moves the substrate 100 from the upstream transfer chamber 308 to the transport chamber 302 and transports the substrate 100 between multiple film deposition chambers 303a to 303d. In addition, the transport robot 302a also transports the mask between the mask storage chamber 305 and the film deposition chamber 303 and moves the substrate 100 from the transport chamber 302 to the downstream buffer chamber 306.

[0033] The buffer chamber 306 is a chamber used to temporarily store substrates 100 according to the operating conditions of the production line. The buffer chamber 306 is equipped with a substrate storage rack, also referred to as a box, and a lifting mechanism. The substrate storage rack has a multi-layer structure capable of storing multiple substrates 100 in a horizontal state where the first surface (film-forming surface) of the substrate 100 is oriented downwards in the direction of gravity (vertical direction). The lifting mechanism, by raising and lowering the substrate storage rack, aligns the layer of substrates 100 being moved in or out with the transport position. Thus, the buffer chamber 306 has the function of temporarily storing and retaining multiple substrates 100.

[0034] In the rotary chamber 307, a transport robot is provided as a mechanism for changing the orientation of the substrate 100. In this embodiment, the transport robot in the rotary chamber 307 rotates the orientation of the substrate 100 by 180 degrees. The transport robot in the rotary chamber 307 rotates 180 degrees while supporting the substrate 100 that has been moved in from the buffer chamber 306 and moves it out to the transfer chamber 308, thereby exchanging the front and rear ends of the substrate 100 in the buffer chamber 306 and the transfer chamber 308. Therefore, the orientation of the substrate 100 when it is moved into the film deposition chamber 303 is the same in each film deposition block 301, so that the scanning direction and the mask orientation in the film deposition process for the substrate 100 can be consistent in each film deposition block 301. As a result, the orientation of the masks stored in the mask storage chamber 305 can be aligned in each film deposition block 301, which simplifies mask management and improves usability.

[0035] The production line, as a control system, includes a host computer 300 that controls the entire production line as a main computer, and control devices 14a-14d, 309, and 310 that control each component. The host computer 300 and control devices 14a-14d, 309, and 310 can communicate via a wired or wireless communication line 300a. Control devices 14a-14d are respectively provided with multiple film-forming chambers 303a-303d, controlling the film-forming apparatus 1 installed in each chamber. Furthermore, they are collectively referred to as control devices 14a-14d, or, unless otherwise specified, as control device 14.

[0036] Control device 309 controls the conveyor robot 302a. Control device 310 controls the device located in the rotary chamber 307. Host device 300 sends information related to the substrate 100, conveying timing, and other instructions to control devices 14, 309, and 310. Control devices 14, 309, and 310 control each device based on the instructions received from host device 300.

[0037] Figure 2 This diagram schematically illustrates the structure of a film-forming apparatus 1, which is one aspect of the present invention. The film-forming apparatus 1 is disposed in a film-forming chamber 303. The film-forming apparatus 1 performs a film-forming process in which a vapor-deposited material is attached (deposited) onto a substrate 100 to form a film. In this embodiment, a predetermined pattern (a thin film of the vapor-deposited material) is formed on the first surface 100A of the substrate 100 via a mask 101. The material of the substrate 100 can be appropriately selected from materials such as glass, resin, and metal; a structure in which a resin layer such as polyimide is formed on glass is preferred. As the vapor-deposited material, organic materials, inorganic materials (e.g., metals, metal oxides, etc.) are used. The film-forming apparatus 1 can be applied, for example, to manufacturing apparatuses for electronic devices and optical components such as display devices (flat panel displays, etc.), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements). The film-forming apparatus 1 is particularly suitable for manufacturing apparatuses for organic EL panels. Here, an example of film deposition on substrate 100 by vacuum evaporation is described, but it is not limited to this, and various film deposition processes (film deposition methods) such as sputtering and CVD can be applied. In addition, in each figure, arrow Z represents the vertical direction (gravity direction), and arrows X and Y represent mutually orthogonal horizontal directions.

[0038] The film-forming apparatus 1 has a box-shaped vacuum chamber 3. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown) to maintain the internal space 3a in a vacuum atmosphere. Furthermore, "vacuum" refers to a state filled with a gas at a pressure lower than atmospheric pressure, i.e., a depressurization state. The vacuum chamber 3 defines the internal space 3a for housing the substrate support unit 6, the mask stage 5 for mounting the mask 101, the film-forming unit 4, the plate unit 9, and the adsorption plate 15.

[0039] The mask 101 has an opening pattern corresponding to the pattern (thin film) formed on the first surface 100A of the substrate 100. The mask 101 is placed on the mask stage 5 and fixed in a predetermined position. The mask stage 5 can be replaced with other mechanisms for fixing the mask 101 in the predetermined position. As the mask 101, a mask having a structure in which a mask foil with a thickness of about a few μm to tens of μm is welded to a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but a metal with a low coefficient of thermal expansion, such as Invar alloy, is preferred. The film formation process is performed with the substrate 100 placed on the mask 101 and the substrate 100 and the mask 101 overlapping each other.

[0040] The plate unit 9 includes a cooling plate 10 and a magnet plate 11. The cooling plate 10 is suspended below the magnet plate 11 in a manner that allows it to be displaced relative to the magnet plate 11 in the Z direction. The cooling plate 10 is a plate-shaped member that functions to cool the substrate 100 adsorbed by the adsorption plate 15 by contacting it during the film-forming process. The cooling plate 10 is not limited to a plate that actively cools the substrate 100 by including a water-cooling mechanism or the like; it can also be a plate that cools the substrate 100 by taking heat away from it by contacting the adsorption plate 15 without a water-cooling mechanism or the like. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force. The magnet plate is disposed above the second surface 100B of the substrate 100 on the side opposite to the first surface 100A, improving the adhesion between the substrate 100 and the mask 101 during the film-forming process. However, the cooling plate 10 and the magnet plate 11 (plate unit 9) do not necessarily need to be provided. For example, if the adsorption plate 15 is provided with a cooling mechanism, the cooling plate 10 may not be provided. Alternatively, when the adsorption plate 15 adsorbs the mask 101, the magnet plate 11 may not be provided.

[0041] The film-forming unit 4 is a deposition source that includes a heater, a gate, a drive mechanism, an evaporation rate monitor, etc., and attaches (deposits) the vapor-deposited material onto the substrate 100. In this embodiment, the film-forming unit 4 is specifically configured as a linear deposition source in which multiple nozzles (not shown) are arranged in the X direction and release vapor-deposited material upward from each nozzle, and is reciprocated in the Y direction.

[0042] The film-forming apparatus 1 includes a substrate support unit 6, an adsorption plate 15, a position adjustment unit 20, a distance adjustment unit 22, a plate unit lifting unit 13, a first measuring unit 7, a second measuring unit 8, and an adjustment unit 17. Additionally, the film-forming apparatus 1 includes multiple pressing members 80 and a control device 14 (control unit).

[0043] The substrate support unit 6 (substrate support portion) supports the substrate 100 that is carried into the film forming apparatus 1 by the transport robot 302a in a horizontal position. The substrate support unit 6 includes a base portion 61 that forms its outer frame and a plurality of support portions 62 that protrude inward from the base portion 61.

[0044] Multiple support portions 62 are arranged at intervals along the periphery of the substrate 100 on the base portion 61. The multiple support portions 62 function to support the periphery of the first surface 100A of the substrate 100 and are also referred to as "receiving claws" or "finger portions". Furthermore, the "periphery" may not necessarily include the periphery of the substrate 100. For example, the multiple support portions 62 may not contact the periphery of the first surface 100A of the substrate 100, but instead support the substrate 100 by contacting a portion extending a predetermined distance from that periphery towards the center of the substrate 100.

[0045] In this embodiment, the multiple support portions 62 are composed of leaf springs. Therefore, when the substrate 100 supported by the multiple support portions 62 is adsorbed onto the adsorption plate 15, the elastic force of the leaf springs can be used to press the substrate 100 against the adsorption plate 15. Alternatively, a structure can be adopted in which multiple clamping portions corresponding to the multiple support portions 62 are provided, and the substrate 100 is supported by clamping it between the multiple support portions 62 and the multiple clamping portions.

[0046] The adsorption plate 15 is disposed above the substrate support unit 6 (multiple support portions 62) in the internal space 3a of the vacuum chamber 3, and adsorbs the second surface 100B of the substrate 100 supported by the substrate support unit 6. Figure 2 As shown, the adsorption plate 15 is disposed between the substrate support unit 6 and the plate unit 9, and is supported by one or more support shafts R1. In this embodiment, the adsorption plate 15 is supported by four support shafts R1. The support shafts R1 are, for example, cylindrical shafts.

[0047] In this embodiment, the adsorption plate 15 is specifically embodied as an electrostatic chuck that adsorbs the substrate 100 using electrostatic force. For example, the adsorption plate 15 has a structure in which circuits such as metal electrodes are embedded inside a ceramic matrix. When a positive (+) and a negative (-) voltage are applied to the metal electrodes disposed in the electrode placement area, polarization charges are guided to the substrate 100 through the matrix. As a result, the substrate 100 is adsorbed (fixed) to the adsorption surface 150 of the adsorption plate 15 by the electrostatic attraction (electrostatic force) between the substrate 100 and the adsorption plate 15. Multiple electrode placement areas may also be disposed separately from each other on the adsorption surface 150 of the adsorption plate 15. Alternatively, a single electrode placement area may be disposed covering approximately the entire surface of the adsorption surface 150 of the adsorption plate 15.

[0048] In the adsorption plate 15, specifically in the adsorption surface 150, a plurality of touch sensors 1621 are embedded as sensors for detecting the contact between the adsorption plate 15 and the substrate 100. By providing touch sensors 1621 at multiple locations on the adsorption surface 150 of the adsorption plate 15, it is possible to detect (confirm) that the entire surface of the second surface 100B of the substrate 100 is adsorbed onto the adsorption surface 150. The number and arrangement of the touch sensors 1621 can be appropriately set.

[0049] In this embodiment, the touch sensor 1621 mechanically detects the contact between the adsorption plate 15 and the substrate 100. For example, the touch sensor 1621 is configured such that its tip protrudes from the adsorption surface 150 when its tip is subjected to force by a spring or the like and is not in contact with the substrate 100 (second surface 100B). Furthermore, when the substrate 100 contacts the tip of the touch sensor 1621, the tip is pressed inward by the substrate 100, moves inward toward the adsorption surface 150, contacts the internal contacts, and outputs a predetermined electrical signal. Thus, the touch sensor 1621 is substantially capable of detecting the contact between the adsorption plate 15 and the substrate 100. In addition, multiple touch sensors 1621 also function as detection units for detecting the tilt (parallelism) between the adsorption plate 15 and the mask stage 5.

[0050] The position adjustment unit 20 adjusts the relative position of the substrate 100 supported by the substrate support unit 6 or the substrate 100 adsorbed by the adsorption plate 15 with respect to the mask 101. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 or the adsorption plate 15 in the XY plane. In other words, the position adjustment unit 20 adjusts the relative horizontal position of the mask 101 and the substrate 100. For example, the position adjustment unit 20 is configured to be able to displace the substrate support unit 6 in the X direction, Y direction, and rotational directions about the Z direction. In this embodiment, the relative position of the mask 101 and the substrate 100 is adjusted by fixing the position of the mask 101 and displacing the substrate 100. However, the relative position of the mask 101 and the substrate 100 can also be adjusted by displacing the mask 101, or by displacing both the substrate 100 and the mask 101.

[0051] The position adjustment unit 20 includes, for example, a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 disposed between the fixed plate 20a and the movable plate 20b. The fixed plate 20a is fixed to the upper wall 30 of the vacuum chamber 3. In addition, a frame-like platform 21 is mounted on the movable plate 20b. The platform 21 supports the distance adjustment unit 22 and the plate unit lifting unit 13. When the movable plate 20b is moved horizontally relative to the fixed plate 20a by means of the actuators 201, the platform 21, the distance adjustment unit 22, and the plate unit lifting unit 13 are moved together.

[0052] The plurality of actuators 201 include, for example, actuators capable of displacing the movable plate 20b in the X direction and actuators capable of displacing the movable plate 20b in the Y direction. By driving (controlling) the plurality of actuators 201, the movable plate 20b can be displaced in the X direction, Y direction, and rotational directions about the Z direction. For example, the plurality of actuators 201 may include a motor as a drive source, a ball screw mechanism that converts the driving force of the motor into linear motion, etc.

[0053] The distance adjustment unit 22 has the function of adjusting the distance between the adsorption plate 15 and the substrate support unit 6 and the mask stage 5 by raising and lowering the adsorption plate 15 and the substrate support unit 6. In this embodiment, the distance adjustment unit 22 brings the substrate 100 and the mask 101 closer together and further apart in the thickness direction (Z direction) of the substrate 100. In other words, the distance adjustment unit 22 brings the substrate 100 and the mask 101 closer together in the overlapping direction or separates them in the opposite direction. The "distance" adjusted by the distance adjustment unit 22 is the vertical distance. Therefore, the distance adjustment unit can also be described as a unit that adjusts the relative position of the mask 101 and the substrate 100 in the vertical direction.

[0054] like Figure 2 As shown, the distance adjustment unit 22 includes a first lifting plate 220. The first lifting plate 220 is configured to move freely up and down in the Z direction along a guide rail 21a formed on the side of the frame 21 and extending in the Z direction. The first lifting plate 220 supports the adsorption plate 15 via a plurality of support shafts R1. When the first lifting plate 220 moves up and down, the adsorption plate 15 moves up and down accordingly. In detail, the first lifting plate 220 supports the plurality of support shafts R1 that support the adsorption plate 15, so by moving the first lifting plate 220 up and down, the plurality of support shafts R1 move up and down synchronously, and the adsorption plate 15 moves up and down while maintaining parallelism.

[0055] Furthermore, the first lifting plate 220 supports the base plate support unit 6 via multiple actuators 65 and multiple support shafts R3. When the first lifting plate 220 rises and falls, the base plate support unit 6 rises and falls accordingly. The multiple actuators 65 are respectively connected to the multiple support shafts R3. The actuators 65 include, for example, motors, ball screw mechanisms, etc., and drive the support shafts R3 in the vertical direction. The base plate support unit 6 is driven relative to the adsorption plate 15 in the vertical direction by the multiple actuators 65.

[0056] The distance adjustment unit 22 includes a drive unit 221 supported on the frame 21 and functioning as an actuator to raise and lower the first lifting plate 220. The drive unit 221 is a transmission mechanism that transmits the driving force of the motor 221a (drive source) to the first lifting plate 220. In this embodiment, the drive unit 221 uses a ball screw mechanism including a ball screw shaft 221b and a ball nut 221c as the transmission mechanism. The ball screw shaft 221b extends along the Z direction and rotates about the Z-axis by the driving force of the motor 221a. The ball nut 221c is fixed to the first lifting plate 220 and engages with the ball screw shaft 221b. By rotating the ball screw shaft 221b and switching the rotation direction of the ball screw shaft 221b, the first lifting plate 220 can be raised and lowered in the Z direction. The amount of raising and lowering of the first lifting plate 220 is controlled, for example, based on the detection results of sensors such as rotary encoders that detect the rotation amount of each motor 221a. Therefore, the position of the adsorption plate 15 of the adsorption substrate 100 in the Z direction can be controlled to control the contact and separation between the substrate 100 and the mask 101.

[0057] In this embodiment, the distance adjustment unit 22 adjusts the distance between the mask stage 5 and the substrate support unit 6 and the adsorption plate 15 in the Z direction by fixing the position of the mask stage 5 and displacing the substrate support unit 6 and the adsorption plate 15. However, the distance between the mask stage 5 and the substrate support unit 6 and the adsorption plate 15 can also be adjusted by fixing the position of the substrate support unit 6 or the adsorption plate 15 and displacing the mask stage 5. Alternatively, the distance between the mask stage 5 and the substrate support unit 6 and the adsorption plate 15 can be adjusted by displacing the substrate support unit 6, the adsorption plate 15, and the mask stage 5 respectively.

[0058] The plate unit lifting unit 13 lifts and lowers the plate unit 9, which is connected to the second lifting plate 12 and disposed inside the vacuum chamber 3, by lifting and lowering the second lifting plate 12 disposed outside the vacuum chamber 3. The plate unit 9 is connected to the second lifting plate 12 via one or more support shafts R2. In this embodiment, the plate unit 9 is supported by two support shafts R2. The support shafts R2 extend upward from the magnet plate 11 and are connected to the second lifting plate 12 through the openings of the upper wall portion 30, the openings of the fixed plate 20a and the movable plate 20b, and the opening of the first lifting plate 220.

[0059] The second lifting plate 12 is configured to move freely up and down in the Z direction along the guide shaft 12a. The plate unit lifting unit 13 includes a drive mechanism supported on the frame 21 and for raising and lowering the second lifting plate 12. The plate unit lifting unit 13 is a transmission mechanism that transmits the driving force of the motor 13a (drive source) to the second lifting plate 12. In this embodiment, the plate unit lifting unit 13 uses a ball screw mechanism including a ball screw shaft 13b and a ball nut 13c as the transmission mechanism. The ball screw shaft 13b extends along the Z direction and rotates about the Z-direction axis by the driving force of the motor 13a. The ball nut 13c is fixed to the second lifting plate 12 and engages with the ball screw shaft 13b. By rotating the ball screw shaft 13b and switching the rotation direction of the ball screw shaft 13b, the second lifting plate 12 can be raised and lowered in the Z direction. The amount of raising and lowering of the second lifting plate 12 is controlled, for example, based on the detection results of sensors such as rotary encoders that detect the rotation amount of each motor 13a. Therefore, the position of the plate unit 9 in the Z direction can be controlled to control the contact and separation between the plate unit 9 and the substrate 100.

[0060] The openings of the upper wall portion 30 through which each support shaft R1~R3 ​​passes have dimensions that allow each support shaft R1~R3 ​​to move in both the X and Y directions. To maintain the airtightness of the vacuum chamber 3, bellows or similar conduits are provided at the openings of the upper wall portion 30 through which each support shaft R1~R3 ​​passes. For example, the support shaft R1 supporting the first lifting plate 220 is covered by a bellows.

[0061] The first measuring unit 7 and the second measuring unit 8 function as measuring units for measuring the positional offset between the substrate 100 supported by the substrate support unit 6 and the mask 101. In this embodiment, the first measuring unit 7 and the second measuring unit 8 include an imaging device (camera) for capturing images of the substrate 100 and the mask 101. The first measuring unit 7 and the second measuring unit 8 are disposed above the upper wall portion 30 and capture images of the substrate 100 and the mask 101 disposed in the internal space 3a of the vacuum chamber 3 through a window (not shown) formed in the upper wall portion 30.

[0062] The first measurement unit 7 includes a low-magnification CCD camera (coarse camera) with a relatively wide field of view and low resolution. The first measurement unit 7 captures images of coarse alignment marks formed on the substrate 100 and coarse alignment marks formed on the mask 101 to obtain images, and measures the coarse positional offset between the substrate 100 and the mask 101 based on the relative positions of these marks.

[0063] The second measurement unit 8 includes a high-magnification CCD camera (fine camera) with a relatively narrow field of view and high resolution (e.g., on the order of several μm). The second measurement unit 8 captures images of fine alignment marks formed on the substrate 100 and fine alignment marks formed on the mask 101 to obtain images, and measures the positional offset between the substrate 100 and the mask 101 with high precision based on the relative positions of these marks.

[0064] In this embodiment, under the control of the control device 14, coarse alignment and fine alignment are performed sequentially to align the substrate 100 and the mask 101. In coarse alignment, the relative positions of the substrate 100 and the mask 101 are roughly adjusted based on the measurement results of the first measurement unit 7. In fine alignment, the relative positions of the substrate 100 and the mask 101 are precisely adjusted based on the measurement results of the second measurement unit 8.

[0065] The adjustment unit 17 (first adjustment section) has the function of adjusting the relative tilt of the adsorption plate 15 and the mask stage 5. In this embodiment, the adjustment unit 17 adjusts the relative tilt of the adsorption plate 15 and the mask stage 5 by tilting (driving) the adsorption plate 15 relative to the mask stage 5. Specifically, the adjustment unit 17 adjusts the relative tilt of the adsorption plate 15 and the mask stage 5 by adjusting the axial position of at least a portion of the plurality of support shafts R1.

[0066] Figure 3 This is a diagram that roughly shows the structure of the adjustment unit 17. (As shown) Figure 3 As shown, the adjustment unit 17 includes a bent portion 18 disposed between the support shaft R1 and the adsorption plate 15. The bent portion 18 connects the support shaft R1 and the adsorption plate 15 in a manner where the angle of the adsorption plate 15 relative to the support shaft R1 is variable. In this embodiment, the plurality of support shafts R1 are configured to be driven only in the vertical direction (axial direction). Therefore, in such a way... Figure 3 The left side, as shown in state ST1, maintains the adsorption plate 15 in a horizontal state and as shown in state ST1. Figure 3In the right-hand state ST2, where the adsorption plate 15 is tilted, the angle between the adsorption plate 15 and the support shaft R1 varies. In this embodiment, by using the bending portion 18 to bend the adsorption plate 15 relative to the support shaft R1, the support shaft R1 can support the adsorption plate 15 even when it is tilted. Furthermore, the bending portion 18 can be appropriately configured to connect two components, such as a universal joint, in a way that allows for changing their connection angle. In addition, to reduce the load applied to the mask 101 when the adsorption plate 15 contacts the mask 101 and to ensure the adsorption plate 15 retracts when it contacts the mask 101, it is preferable to provide a floating portion 19 between the bending portion 18 and the adsorption plate 15.

[0067] The pressing member 80 is disposed above the adsorption plate 15 and faces multiple portions of the peripheral portion of the second surface 100B of the substrate 100 supported by the substrate support unit 6. In this embodiment, the pressing member 80 is a pin-shaped member for pressing the corner of the second surface 100B of the substrate 100 supported by the substrate support unit 6 from the second surface 100B side, and includes a contact end 81 that contacts (aggregates) with the second surface 100B of the substrate 100. Therefore, as Figure 4 As shown, in the adsorption plate 15, corresponding to each of the plurality of pressing members 80, through holes 151 are formed, penetrating between the adsorption surface 150 and the surface opposite to the adsorption surface. Thus, the pressing member 80 is configured such that its contact end 81 protrudes from the adsorption surface 150 of the adsorption plate 15 via the through holes 151, allowing it to press from the second surface 100B side of the substrate 100. Furthermore, the corner of the substrate 100 does not necessarily mean a strictly mathematical "corner," but may be a corner with rounded corners, for example, achieved through corner rounding (R-machining). Figure 4 This is a diagram showing the positional relationship between the through hole 151 formed in the adsorption plate 15 and the pressing member 80. Figure 4 In order to more clearly illustrate the technical features of this embodiment, only the adsorption plate 15 and the substrate support unit 6 (support part 62) are simply illustrated.

[0068] In this embodiment, the adsorption plate 15 adsorbs the substrate 100 pressed by the pressing member 80. In other words, before the adsorption plate 15 adsorbs the second surface 100B of the substrate 100, the substrate 100 is pressed from the second surface 100B side by the multiple pressing members 80. As a result, the substrate support unit 6 can support the peripheral portion and lift the central portion of the substrate 100, which is bent downwards due to its own weight, so that the substrate 100 can be adsorbed onto the adsorption plate 15 in a state where the bending of the substrate 100 is reduced or eliminated. Therefore, not only can the time required to adsorb the substrate 100 onto the adsorption plate 15 be shortened, but also residual wrinkles of the substrate 100 adsorbed onto the adsorption plate 15 can be suppressed.

[0069] In this embodiment, the pressing member 80 presses the area on the second surface 100B of the substrate 100, i.e., the pressing area, located at a corner of the substrate 100. Therefore, the pressing member 80 is positioned facing the corner of the second surface 100B of the substrate 100 supported by the substrate support unit 6. Specifically, the pressing area of ​​the pressing member 80 is located at at least two of the four corners of the substrate 100. For example, as... Figure 5 As shown, the pressing area 80a of the pressing member 80 is arranged to face one of the diagonally opposite corners of the four corners of the substrate 100. This minimizes the number of pressing members 80 and allows for effective pressing of the substrate 100. Furthermore, as... Figure 6 As shown, the pressing area 80a of the pressing member 80 can also be arranged to face all four corners of the substrate 100. By pressing two or four corners of the substrate 100 with the pressing member 80, the deflection of the central portion of the substrate 100 supported by the substrate support unit 6 is lifted, thereby reducing the deflection of the substrate 100 and making it substantially flat. In particular, by pressing the corners away from the central portion where the deflection of the substrate 100 is the greatest with the pressing member 80, the deflection of the substrate 100, especially the deflection of the central portion, can be effectively reduced. Figure 5 and Figure 6 This is a schematic diagram showing an example of a pressing area 80a of a pressing member 80 in the second surface 100B of a substrate 100.

[0070] like Figure 5 and Figure 6 As shown, the pressing member 80 is positioned facing the corner of the second surface 100B of the substrate 100 supported by the substrate support unit 6. Therefore, the pressing area 80a of the pressing member 80 and the supporting area 6a of the substrate support unit 6 (support portion 62) supporting the first surface 100 of the substrate 100 do not overlap when viewed from a direction perpendicular to either the first surface 10A or the second surface 100B (vertical direction). Furthermore, as... Figure 6 As shown, the projection area of ​​the support area 6a and the pressing area 80a, which are vertically projected onto the second surface 100B of the substrate 100, are arranged along an imaginary line L that forms a rectangle. As a result, the pressing member 80 is not restricted by the substrate support unit 6 (support portion 62) and can press the substrate 100 sufficiently.

[0071] The control device 14 controls the entire film-forming apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input / output interface (I / O) 143, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 includes a processor, such as a CPU, which executes programs stored in the storage unit 142 to control the film-forming apparatus 1. The storage unit 142 includes storage devices such as ROM, RAM, and HDD, storing the programs executed by the processing unit 141 and various control information. The I / O 143 is the interface for transmitting and receiving signals between the processing unit 141 and external devices. The communication unit 144 is a communication device that communicates with the host device 300 or control devices 14, 309, and 310 via communication line 300a. The processing unit 141 receives information from or sends information to the host device 300 via the communication unit 144. The display unit 145 includes, for example, a liquid crystal display (LCD) to display various information. The input unit 146 includes, for example, a keyboard and an indicator device, to accept various inputs from the user. Furthermore, all or part of the control devices 14, 309, and 310, and the host device 300 may also be composed of a PLC, ASIC, or FPGA.

[0072] In the film forming apparatus 1, during the alignment of the substrate 100 and the mask 101, the relative tilt between the adsorption plate 15 and the mask stage 5 may affect the alignment accuracy. For example, alignment accuracy can be improved by bringing the substrate 100 and the mask 101 closer together. However, when there is a relative tilt between the adsorption plate 15 and the mask stage 5, sometimes a portion of the substrate 100 may come into contact with the mask 101 and be damaged. Therefore, to avoid damage to the substrate 100, it is necessary to separate the substrate 100 from the mask 101. Since the distance between the substrate 100 and the mask 101 increases, the alignment accuracy decreases.

[0073] To suppress such a decrease in alignment accuracy, in the film forming apparatus 1, the relative tilt of the adsorption plate 15 and the mask stage 5 is typically adjusted so that the internal space 3a of the vacuum chamber 3 is set to atmospheric pressure, and the adsorption plate 15 and the mask stage 5 are parallel. This adjustment is performed, for example, by inserting a shim into the connecting portion of the substrate support unit 6.

[0074] On the other hand, even when adjusting the adsorption plate 15 and the mask stage 5 in a parallel manner under atmospheric pressure, if the internal space 3a of the vacuum chamber 3 is set to a vacuum atmosphere, the vacuum chamber 3 may deform due to the pressure difference between the inside and outside of the vacuum chamber 3. If the vacuum chamber 3 deforms, a tilt will occur between the adsorption plate 15 and the mask stage 5. However, when the internal space 3a of the vacuum chamber 3 is in a vacuum atmosphere, it is not possible to adjust the tilt between the adsorption plate 15 and the mask stage 5 in the same way as in an atmospheric environment.

[0075] Therefore, in this embodiment, with the internal space 3a of the vacuum chamber 3 set to a vacuum atmosphere, the tilt between the adsorption plate 15 and the mask stage 5 is adjusted using the adjustment unit 17. This adjustment is performed when the mask 101 is not placed on the mask stage 5, the substrate 100 is not adsorbed onto the adsorption plate 15, and the substrate 100 is not supported by the substrate support unit 6. Specifically, the tilt of the mask stage 5, i.e., the tilt between the adsorption plate 15 and the mask stage 5, is detected by monitoring the timing of contact with the mask stage 5 using multiple touch sensors 1621 while the adsorption plate 15 is lowered using the distance adjustment unit 22. Furthermore, based on the tilt detected by the touch sensors 1621, the axial position of at least a portion of the support shafts R1 among the multiple support shafts R1 is adjusted using the adjustment unit 17 so that the adsorption plate 15 is tilted relative to the mask stage 5, with the adsorption plate 15 and the mask stage 5 becoming parallel.

[0076] Figure 7 This diagram shows the state in which the substrate 100 is supported by the substrate support unit 6 (support portion 62) after the tilt between the adsorption plate 15 and the mask stage 5 is adjusted so that they are parallel under vacuum. (Refer to...) Figure 7 The adsorption plate 15 is parallel to the mask stage 5, but is tilted in a manner that matches the tilt of the adsorption plate 15 and the mask stage 5. In this state, as described above, consider the case where, before adsorbing the second surface 100B of the substrate 100 using the adsorption plate 15, multiple pressing members 80 press the substrate 100 from the second surface 100B side. In this case, when the multiple pressing members 80 are displaced relative to the adsorption plate 15 by the same amount in the vertical direction (Z direction), due to the tilt of the adsorption plate 15, the positions, i.e., the protrusion amounts, of the contact ends 81 of each pressing member 80 protruding from the adsorption surface 150 are different. This means that the pressing force of the multiple pressing members 80 pressing the second surface 100B of the substrate 100 is different (i.e., the pressing force of each pressing member 80 relative to the second surface 100B of the substrate 100 is different). Thus, if the pressing force of each pressing member 80 deviates and becomes uneven within the surface of the second surface 100B of the substrate 100, the substrate 100 cannot be pressed evenly. Therefore, it is difficult to effectively reduce the deflection of the substrate 100 supported by the substrate support unit 6, resulting in poor adsorption of the substrate 100 in the adsorption plate 15.

[0077] Therefore, in this embodiment, a pressing adjustment section 90 (second adjustment section) is provided, which adjusts the pressing force of the plurality of pressing members 80 pressing the second surface 100B of the substrate 100 according to the tilt of the adsorption plate 15 when the adsorption plate 15 is tilted by the adjustment unit 17. The pressing adjustment section 90 displaces the position of the contact end 81 of each of the plurality of pressing members 80 in the vertical direction (Z direction) according to the tilt of the adsorption plate 15, so that the pressing force of each pressing member 80 in the surface of the second surface 100B of the substrate 100 becomes uniform (equal). Specifically, the pressing adjustment section 90 displaces the position of the contact end 81 of each pressing member 80 in the vertical direction (Z direction) so that the protrusion amount of the contact end 81 of each of the plurality of pressing members 80 protruding from the adsorption surface 150 of the adsorption plate 15 is equal. Therefore, even when the adsorption plate 15 is tilted, the contact ends 81 of each pressing member 80 protrude equally from the adsorption surface 150, resulting in uniform pressing force of each pressing member 80 within the surface of the second surface 100B of the substrate 100. Thus, in this embodiment, the deflection of the substrate 100 supported by the substrate support unit 6 can be effectively reduced, and poor adsorption of the substrate 100 in the adsorption plate 15 can be minimized.

[0078] Furthermore, in this embodiment, the tilt between the adsorption plate 15 and the mask stage 5 has been described. However, from the viewpoint of suppressing the reduction in alignment accuracy, it is also possible to adjust the tilt between the adsorption plate 15 and the mask 101 placed on the mask stage 5. In this case, with the internal space 3a of the vacuum chamber 3 set to a vacuum atmosphere, the tilt between the adsorption plate 15 and the mask 101 placed on the mask stage 5 is adjusted using the adjustment unit 17. This adjustment is performed with the mask 101 placed on the mask stage 5, the substrate 100 not adsorbed onto the adsorption plate 15, and the substrate 100 not supported by the substrate support unit 6. Specifically, the tilt of the mask 101, i.e., the tilt between the adsorption plate 15 and the mask 101, is detected by monitoring the timing of contact with the mask 101 by the multiple touch sensors 1621 while lowering the adsorption plate 15 using the distance adjustment unit 22. Furthermore, based on the tilt detected by the touch sensor 1621, the axial position of at least a portion of the support shafts R1 among the plurality of support shafts R1 is adjusted by the adjustment unit 17 so that the adsorption plate 15 is parallel to the mask 101, thereby tilting the adsorption plate 15 relative to the mask 101.

[0079] The specific structure for achieving the above function using the press adjustment part 90 will be described below.

[0080] For example, such as Figure 7As shown, the press adjustment unit 90 includes multiple operating sections 901 for displacing the contact ends 81 of each of the multiple pressing members 80 in the vertical direction (Z direction) by operation by a user (operator). The multiple operating sections 901 and the multiple pressing members 80 are respectively disposed on the exterior of the vacuum chamber 3, for example, on the upper wall 30. By disposing the operating sections 901 on the exterior of the vacuum chamber 3, the user can perform adjustments based on the press adjustment units 90 even when the internal space 3a of the vacuum chamber 3 is in a vacuum atmosphere.

[0081] The operating unit 901 is specifically designed as an adjusting nut that displaces (drives) the pressing member 80 in the vertical direction. This adjusting nut is configured to engage with threads formed on the pressing member 80 (or the shaft supporting the pressing member 80). Therefore, when the user operates the operating unit 901 (rotates the adjusting nut), the corresponding pressing member 80 displaces independently in the vertical direction from the other pressing members 80. In other words, the multiple operating units 901 can independently adjust the vertical position of the contact end 81 of the corresponding pressing member 80. Therefore, by operating the operating unit 901 according to the inclination of the suction plate 15, the amount of protrusion of the contact end 81 of each pressing member 80 from the suction surface 150 (the pressing force of each pressing member 80 from the suction surface 150) is optimized. From the viewpoint of the degree of freedom related to the adjustment of the vertical position of the contact end 81 of the pressing member 80, it is preferable to provide an operating unit 901 for each of the multiple pressing members 80.

[0082] In addition, such as Figure 8A as well as Figure 8B As shown, the pressing adjustment unit 90 can also be specifically embodied as an adjustment mechanism including multiple shafts 912 and multiple motors 914, etc. (Refer to...) Figure 8A Multiple pressing members 80 are held above the adsorption plate 15 by guide members GM supported on the adsorption plate 15, enabling them to be driven in the vertical direction (Z direction). A shaft 912 is disposed corresponding to each of the pressing members 80, positioned with one end inside the vacuum chamber 3 and the other end outside the vacuum chamber 3, separated by the upper wall 30. The shaft 912 is a shaft member whose end located inside the vacuum chamber 3 can connect (abut) to the pressing member 80. A motor 914 is disposed corresponding to each of the pressing members 80 (multiple shafts 912) outside the vacuum chamber 3, and is composed of a stepper motor or servo motor that drives each of the multiple shafts 912.

[0083] The rotational motion of the motor 914 is converted into linear motion of the shaft 912 via a rack-and-pinion, belt-and-pulley, or other mechanical combination system. In this embodiment, the motor 914 and shaft 912 are configured such that the shaft 912 is driven along the vertical direction (Z direction) by the rotation (driving) of the motor 914. Therefore, by driving the shaft 912 in the vertical direction using the motor 914, as shown in FIG8(B), the shaft 912 abuts against the pressing member 80, which is held by the guide member GM to be driven in the vertical direction. With the shaft 912 abutting against the pressing member 80, further driving the shaft 912 in the vertical direction using the motor 914 causes the contact end 81 of the pressing member 80 to displace in the vertical direction. Thus, when the motor 914 is driven (rotated), the pressing member 80 abutting against the corresponding shaft 912 displaces independently in the vertical direction from the other pressing members 80. In other words, each of the multiple motors 914 can independently adjust the vertical position of the contact end 81 of the pressing member 80 via its corresponding shaft 912. Thus, by driving the motors 914 according to the tilt of the suction plate 15, the amount of protrusion of the contact end 81 of each pressing member 80 from the suction surface 150 (the pressing force of each pressing member 80 from the suction surface 150) is optimized via the shaft 912. From the viewpoint of the degree of freedom related to the adjustment of the vertical position of the contact end 81 of the pressing member 80, it is preferable to provide a motor 914 and a shaft 912 for each of the multiple pressing members 80.

[0084] Furthermore, in the press adjustment unit 90 shown in Figures 8(A) and 8(B), the control device 14 can control the driving amount of each of the multiple shafts 912 driven by multiple motors 914 based on the tilt of the adsorption plate 15. In other words, under the control of the control device 14, the adjustment of the pressing force of each pressing member 80 in the second surface 100B of the substrate 100 can be automated. In this case, the tilt of the adsorption plate 15 can also be input by the user via the input unit 146, but from the viewpoint of automating the adjustment of the pressing force of the pressing member 80, it is preferable to provide a detection unit 92 for detecting the tilt of the adsorption plate 15. Specifically, as the detection unit 92, a touch sensor 922 is provided at the contact end 81 of each of the multiple pressing members 80. The touch sensor 922 provided at the contact end 81 of each of the multiple pressing members 80 detects the contact between the substrate 100 supported by the substrate support unit 6 (support part 62) and the second surface 100.

[0085] By lowering the pressing member 80 using the pressing adjustment unit 90, and simultaneously monitoring the timing of contact with the second surface 100 of the substrate 100 by multiple touch sensors 922 provided on the contact ends 81 of each pressing member 80, the tilt of the adsorption plate 15 is detected. Furthermore, based on the tilt of the adsorption plate 15 detected by the touch sensors 922, the control device 14 controls the driving amount of each shaft 912 driven by each motor 914, so that the protrusion amount of the contact ends 81 of each pressing member 80 from the adsorption surface 150 is equal. As a result, the pressing force of each pressing member 80 becomes uniform within the surface of the second surface 100B of the substrate 100, effectively reducing the deflection of the substrate 100 supported by the substrate support unit 6 and reducing poor adsorption of the substrate 100 in the adsorption plate 15.

[0086] Furthermore, the touch sensor 922 constituting the detection section 92 that detects the tilt of the adsorption plate 15 can be replaced with a distance sensor. Specifically, distance sensors that detect the distance between the contact end 81 of the pressing member 80 and the second surface 100B of the substrate 100 supported by the substrate support unit 6 are provided at the contact ends 81 of each of the plurality of pressing members 80. In this case, it is not necessary to lower the pressing member 80 using the pressing adjustment section 90, and the tilt of the adsorption plate 15 can be obtained based on the distance detected by each distance sensor.

[0087] Next, the adsorption method for adsorbing the substrate 100 using the adsorption plate 15 in the film forming apparatus 1 will be described. In this adsorption method, firstly, as a first step, the peripheral portion of the first surface 100A of the substrate 100 is supported by the substrate support unit 6 (support portion 62). Next, as a second step, the relative tilt of the adsorption plate 15 and the mask stage 5 is adjusted by the adjustment unit 17. Next, as a third step, with the adsorption plate 15 tilted, the substrate 100 is pressed from the second surface 100B side by a plurality of pressing members 80. At this time, in order to make the pressing force of each pressing member 80 in the surface of the second surface 100B of the substrate 100 uniform, the pressing adjustment unit 90 adjusts the pressing force of the plurality of pressing members 80 on the substrate 100 according to the tilt of the adsorption plate 15. And, after the third step, as a fourth step, the substrate 100 pressed by the plurality of pressing members 80 is adsorbed by the adsorption plate 15. According to the adsorption method of this embodiment, even when the adsorption plate 15 is tilted, the substrate 100 can be adsorbed onto the adsorption plate 15 with reduced or eliminated deflection. Therefore, not only can the time required for the substrate 100 to be adsorbed onto the adsorption plate 15 be shortened, but residual wrinkles on the substrate 100 adsorbed onto the adsorption plate 15 can also be suppressed.

[0088] Furthermore, in the film formation process (film formation method) in the film formation apparatus 1, as described above, a pattern is formed on the first surface 100A of the substrate 100 adsorbed by the adsorption plate 15 via the mask 101 (fifth step). At this time, since the substrate 100 is adsorbed onto the adsorption plate 15 without wrinkles or the like, a high-precision pattern can be formed on the first surface 100A of the substrate 100.

[0089] Next, a manufacturing method for producing electronic devices using the film-forming apparatus 1 of this embodiment (a production line having the film-forming apparatus 1 of this embodiment) will be described. Here, an organic EL display device will be used as an example of an electronic device.

[0090] First, let's explain the organic EL display device. Figure 9A This is a diagram showing the overall structure of the organic EL display device 50. Figure 9B This is a diagram showing the cross-sectional structure of a pixel of an organic EL display device 50.

[0091] like Figure 9A As shown, the organic EL display device 50 has a display area 51 comprising a matrix of pixels 52 including multiple light-emitting elements. As described later, each of the multiple light-emitting elements has a structure having an organic layer (organic film) sandwiched between a pair of electrodes. Furthermore, in this embodiment, a pixel refers to the smallest unit capable of displaying a predetermined color in the display area 51. For example, in the organic EL display device 50, a pixel 52 is constructed by a combination of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B capable of displaying different colors. A pixel 52 is typically composed of a combination of red, green, and blue light-emitting elements, but is not limited to this. For example, it may also be composed of a combination of yellow, cyan, and white light-emitting elements, as long as it is composed of light-emitting elements of at least one color.

[0092] Figure 9B yes Figure 9AA partial cross-sectional view at line AB is shown. Pixel 52 is composed of an organic EL element having an anode 54, a hole transport layer 55, any one of light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a cathode 58 on a substrate 53. The hole transport layer 55, light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In this embodiment, the light-emitting layer 56R is a red-emitting organic EL layer, the light-emitting layer 56G is a green-emitting organic EL layer, and the light-emitting layer 56B is a blue-emitting organic EL layer. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to the red, green, and blue light-emitting elements (sometimes referred to as organic EL elements), respectively. The anode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the cathode 58 can be formed shared among multiple light-emitting layers 56R, 56G, and 56B, or they can be formed for each light-emitting element. In addition, an insulating layer 59 is provided between the electrodes to prevent short circuits between the anode 54 and the cathode 58 due to foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer PL is provided to protect the organic EL element from the effects of moisture and oxygen.

[0093] exist Figure 9B In this diagram, the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but depending on the structure of the organic EL device, they may also be formed from multiple layers, including a hole blocking layer and an electron blocking layer. Alternatively, a hole injection layer with a band structure for smoothly injecting holes from the anode 54 to the hole transport layer 55 may be formed between the anode 54 and the hole transport layer 55. Similarly, an electron injection layer may be formed between the cathode 58 and the electron transport layer 57.

[0094] The manufacturing method of an organic EL display device will be described below.

[0095] First, a substrate 53 is prepared having a circuit (not shown) for driving an organic EL display device and an anode 54.

[0096] Next, acrylic resin is spin-coated onto the substrate 53 where the anode 54 is formed, and an insulating layer 59 is formed by photolithography to pattern the acrylic resin in such a way that an opening is formed in the portion where the anode 54 is formed. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

[0097] A substrate 53 patterned with an insulating layer 59 is fed into a film deposition apparatus 1 (first film deposition chamber) in a production line, where a hole transport layer 55 is formed on the anode 54 of the display area 51 as a common layer. The hole transport layer 55 is formed, for example, by vacuum evaporation. The hole transport layer 55 is actually formed in a size larger than the display area 51, so a high-precision mask is not required.

[0098] Next, the substrate 53 to which the hole transport layer 55 is formed is moved into the film forming apparatus 1 (second film forming chamber). The substrate 53 and the mask are aligned, and a red light emitting layer 56R is formed on the portion of the substrate 53 that emits a red light emitting element via the mask.

[0099] Similar to the formation of the light-emitting layer 56R, a green-emitting layer 56G is formed in the film-forming apparatus 1 (third film-forming chamber), and a blue-emitting layer 56B is formed in the film-forming apparatus 1 (fourth film-forming chamber). After forming the light-emitting layers 56R, 56G, and 56B, an electron transport layer 57 is formed over the entire display area 51 in the film-forming apparatus 1 (fifth film-forming chamber). The electron transport layer 57 is formed as a shared layer in the three light-emitting layers 56R, 56G, and 56B.

[0100] Next, the substrate 53 to which the electron transport layer 57 is formed is moved into the film forming apparatus 1 (sixth film forming chamber) to form the cathode 58.

[0101] Then, the substrate 53 formed to the cathode 58 is placed into a sealing device, and a protective layer PL is formed using plasma CVD (sealing process), thus completing the organic EL display device 50. Here, the protective layer PL is formed by CVD, but it is not limited to this method. For example, the protective layer PL can also be formed by ALD or inkjet printing.

[0102] Furthermore, if the substrate 53, patterned with the insulating layer 59, is exposed to an atmosphere containing moisture and oxygen during the period from when the substrate 53 is moved into the film forming apparatus 1 until the protective layer PL is formed, the light-emitting layer made of organic EL material may deteriorate. Therefore, the moving of the substrate 53 between film forming apparatuses is preferably performed under a vacuum atmosphere or an inert gas atmosphere.

[0103] The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.

[0104] This application claims priority based on Japanese Patent Application Publication No. 2023-202139, filed on November 29, 2023, the entire contents of which are incorporated herein by reference.

Claims

1. An adsorption device, characterized in that, have: A substrate support portion supports the peripheral portion of the first surface of a substrate that includes a first surface and a second surface opposite to the first surface. An adsorption plate that adsorbs the second surface of the substrate supported by the substrate support portion; A first adjustment section adjusts the relative tilt of the adsorption plate and the mask stage or the mask itself, which is used to mount a mask for forming a pattern on the first surface of the substrate. Multiple pressing members are respectively disposed facing multiple portions of the peripheral edge of the second surface of the substrate, and are used to press the substrate from the second surface side; as well as The second adjustment unit, when the adsorption plate is tilted by the first adjustment unit, adjusts the pressing force of the plurality of pressing members on the second surface of the substrate supported by the substrate support unit according to the tilt of the adsorption plate.

2. The adsorption device according to claim 1, characterized in that, The plurality of pressing members each include a contact end that contacts the second surface of the substrate supported by the substrate support portion. The second adjustment unit adjusts the pressing force by displacing the position of the contact ends of the plurality of pressing members in the vertical direction.

3. The adsorption device according to claim 2, characterized in that, The adsorption plate includes an adsorption surface that adsorbs the second side of the substrate. The plurality of pressing members press the substrate from the second surface side by having their contact ends protrude from the adsorption surface through through holes in the adsorption plate between the adsorption surface and the surfaces opposite to the adsorption surface. The second adjustment part displaces the position of the contact end of each of the plurality of pressing members in the vertical direction so that the protrusion amount of the contact end of each of the plurality of pressing members from the adsorption surface is equal.

4. The adsorption device according to claim 2, characterized in that, The second adjustment part includes an operating part for displacing the contact ends of each of the plurality of pressing members in the vertical direction.

5. The adsorption device according to claim 4, characterized in that, The adsorption device also has a chamber that defines a space for accommodating the substrate support, the adsorption plate, and the mask stage, and maintains the space in a vacuum atmosphere. The operating unit is located outside the chamber.

6. The adsorption device according to claim 2, characterized in that, The second adjustment unit includes: Multiple shafts, each corresponding to and capable of being connected to a plurality of pressing members; and Multiple motors are provided, each corresponding to one of the multiple pressing components, and each motor drives one of the multiple shafts. By using the plurality of motors to drive the plurality of shafts respectively, the contact ends of the plurality of pressing members are displaced in the vertical direction.

7. The adsorption device according to claim 6, characterized in that, The adsorption device also has a chamber that defines a space for accommodating the substrate support, the adsorption plate, and the mask stage, and maintains the space in a vacuum atmosphere. The plurality of motors are located outside the chamber.

8. The adsorption device according to claim 7, characterized in that, have: The detection unit detects the tilt of the adsorption plate; and The control unit controls the driving amount of each of the plurality of shafts driven by the plurality of motors based on the tilt of the adsorption plate detected by the detection unit.

9. The adsorption device according to claim 8, characterized in that, The adsorption plate includes an adsorption surface that adsorbs the second side of the substrate. The plurality of pressing members press the substrate from the second surface side by having their contact ends protrude from the adsorption surface through through holes in the adsorption plate between the adsorption surface and the surfaces opposite to the adsorption surface. The control unit controls the driving amount of each of the plurality of shafts driven by the plurality of motors respectively, so that the protrusion amount of each of the plurality of pressing members' contact ends protruding from the adsorption surface is equal.

10. The adsorption device according to claim 1, characterized in that, The adsorption device also has a detection unit for detecting the tilt of the adsorption plate.

11. The adsorption device according to claim 10, characterized in that, The plurality of pressing members each include a contact end that contacts the second surface of the substrate supported by the substrate support portion. The detection unit includes a touch sensor disposed at the contact end of each of the plurality of pressing members, and detects contact with the second surface.

12. The adsorption device according to claim 10, characterized in that, The plurality of pressing members each include a contact end that contacts the second surface of the substrate supported by the substrate support portion. The detection unit includes a distance sensor, which is disposed at the contact end of each of the plurality of pressing members and detects the distance between the contact end and the second surface.

13. The adsorption device according to claim 1, characterized in that, Before adsorbing the second surface of the substrate using the adsorption plate, the substrate is pressed from the second surface side using the plurality of pressing members.

14. The adsorption device according to claim 1, characterized in that, The support area, which serves as the region on the first surface of the substrate that supports the substrate, and the pressing area, which serves as the region on the second surface of the substrate that presses the substrate, do not overlap when viewed from a direction perpendicular to the first surface or the second surface.

15. A film-forming apparatus, characterized in that, have: The adsorption device according to any one of claims 1 to 14; and The film-forming section forms a pattern on the first surface of the substrate adsorbed by the adsorption plate of the adsorption device.

16. An adsorption method, characterized in that, have: In the first step, a substrate support portion supports the peripheral portion of the first surface of a substrate that includes a first surface and a second surface opposite to the first surface. In the second step, the relative tilt of the adsorption plate adsorbing the second side of the substrate and the mask stage or the mask used to place the mask for forming a pattern on the first side of the substrate is adjusted. In the third step, while the adsorption plate is tilted by the second step, the substrate is pressed from the second surface side by a plurality of pressing members that are respectively arranged facing multiple parts of the periphery of the second surface of the substrate. as well as In the fourth step, after the third step, the substrate pressed by the plurality of pressing members is adsorbed using the adsorption plate. The third step includes the following steps: adjusting the pressing force of the plurality of pressing members on the second surface of the substrate supported by the substrate support portion according to the tilt of the adsorption plate.

17. The adsorption method according to claim 16, characterized in that, The adsorption method further includes a fifth step of forming the pattern on the first surface of the substrate adsorbed by the adsorption plate.

18. A manufacturing method, characterized in that, The manufacturing method uses the film-forming apparatus of claim 15 to manufacture electronic devices.

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