Splitting device and splitting method thereof

Abstract

The application provides a dicing device and a dicing method thereof. The dicing device comprises a support assembly having a dicing protrusion on one side; the top of the dicing protrusion has a ridge; a flexible member is arranged on the side of the support assembly having the dicing protrusion, and the side of the flexible member away from the support assembly is used for bearing a chip array assembly; the ridge of the dicing protrusion is arranged in one-to-one correspondence with at least one cleavage zone in a cleavage group; the edge of the flexible member is sealingly connected with the support assembly, and a cavity is formed between the flexible member and the support assembly; when the pressure in the cavity is less than the pressure outside the cavity, the flexible member is configured to be close to the recess defined by any two adjacent dicing protrusions, to be close to the ridge, to connect the chips connected with the cleavage group corresponding to the cleavage ridge, and to make the chips connected with the multiple cleavage zones of each chip array be cleaved synchronously. The application is simple to operate, can improve the cleaving efficiency, and shorten the cleaving time.

Description

Technical Field

[0001] This invention relates to the field of optical chip technology, and more specifically, to a dicing apparatus and a dicing method thereof. Background Technology

[0002] In the field of laser chip fabrication, a wafer is typically first cleaved into multiple elongated chip arrays. Each chip array is then further cleaved to create multiple independent light-emitting chips, which serve as the laser chip. For example, a chip array may include bar arrays, and a chip may include bar strips; that is, the wafer is cleaved into multiple bar arrays, and each bar array is then cleaved into multiple independent bar strips using a cleaving device.

[0003] In existing processes, a single cleaving operation can typically only cleave chips connected to a single cleaving region within a single chip array, resulting in problems such as cumbersome operation, low cleaving efficiency, and long processing time. Summary of the Invention

[0004] This invention provides a dicing device and a dicing method thereof, the specific technical solution of which is as follows.

[0005] In a first aspect, this application provides a dicing apparatus for cleaving chips, comprising: The support assembly has multiple slit protrusions arranged along a first direction on one side; the top of each slit protrusion has a ridge extending along a second direction; the first direction is perpendicular to the second direction. A flexible component is disposed on the side of the support assembly with the lobed protrusion, and the side of the flexible component away from the support assembly is used to support the chip array assembly; The chip array assembly includes multiple chip arrays arranged along a second direction, and the chip arrays include multiple chips connected along a first direction. There are cleavage regions between two adjacent chips. Along the second direction, collinear cleavage regions form a cleavage group. The ridges of the cleavage protrusions are arranged in a one-to-one correspondence with at least one cleavage region in the cleavage group. The edge of the flexible component is sealed to the support assembly, and a cavity is formed between the flexible component and the support assembly; When the pressure inside the cavity is less than the pressure outside the cavity, the recess defined by any two adjacent cleavage protrusions fits into the ridge, cleaving at least one chip in the cleavage group corresponding to the ridge, and making the chips connected by multiple cleavage regions of each chip array cleaved synchronously.

[0006] In some embodiments, the support component includes: The support section has a hollow area; A support plate is disposed in the hollow area of ​​the support part and is connected to the support part on its outer periphery; a slit protrusion is disposed on one side of the support plate; the edge of the flexible element is sealed to the top of the support part, and the hollow area between the flexible element and the support assembly forms a cavity. When the pressure inside the chamber is equal to or greater than the pressure outside the chamber, there is a gap between the top of the rupture and the flexible component.

[0007] In some embodiments, the support plate has multiple first through holes; Each chip has at least one first through hole on its underside; the chamber includes a main cavity formed on the underside of the chip; The cleavage protrusions are movably connected to the support plate, and the distance between the ridges of two adjacent cleavage protrusions is equal to the distance between two adjacent cleavage sets. Along the third direction, the interval between adjacent slit protrusions overlaps with at least one first through hole, such that the first through hole connects the inner and outer spaces of the main cavity, and the third direction is at least perpendicular to the first direction.

[0008] In some embodiments, along the first direction, one end of the cleavage protrusion has a first tenon and the other end has a second tenon; along the second direction, a first mortise is formed on both sides of the first tenon, and a second mortise is formed between two adjacent second tenons. In two adjacent split protrusions, the second tenon of the first split protrusion corresponds to the first tenon of the second split protrusion, and the second tenon of the first split protrusion corresponds to the first tenon of the second split protrusion; the gap between adjacent split protrusions is at least partially located within the area of ​​the first tenon and the second tenon.

[0009] In some embodiments, along the first direction, the ridge is located between the first tenon and the second tenon; Alternatively, along the second direction, the ridge includes at least one sub-part, corresponding to the top of at least one first tenon, the length of which is not less than the length of the cleavage zone.

[0010] In some embodiments, the slit protrusion is magnetically connected to the support plate, or the slit protrusion is inserted into the support plate.

[0011] In some embodiments, the slit protrusion includes a first sidewall and a second sidewall, at least one of the first sidewall and the second sidewall being inclined relative to the support plate, and a ridge being formed at the connection between the first sidewall and the second sidewall; The tilt angle of the first sidewall is greater than that of the second sidewall. The ridge is offset from the corresponding cleavage group, so that along the third direction, most of the chip is set to correspond to the second sidewall, and a small part of the chip is suspended relative to the second sidewall.

[0012] In some embodiments, along the second direction, the cleavage region includes a first cleavage portion and a second cleavage portion; The ridge includes a first ridge corresponding to the first cleavage section and a second ridge corresponding to the second cleavage section, and the height of the first ridge changes linearly to the height of the second ridge.

[0013] In some embodiments, the support component further includes: a base; The support is connected to the outer periphery of the base; The base has a second through hole, which communicates with the first through hole; A heating device is installed between the base and the support plate.

[0014] Secondly, this application also provides a dicing method, based on any of the dicing apparatuses in the first aspect above, comprising: The wafer is cleaved along the second direction into multiple chip arrays, and multiple cleaving regions are formed on the chip arrays. Chips are formed between adjacent cleaving regions to form a chip array assembly; along the second direction, collinear cleaving regions form a cleaving group; The chip array assembly is positioned at the target location of the flexible component of the dicing device; Adjust the air pressure inside the chamber of the cleaving device so that the pressure inside the chamber is less than the pressure outside the chamber. The flexible part is aligned with the ridge of the recess defined by any two adjacent cleaving protrusions of the cleaving device. At least one chip in the cleaving group corresponding to the ridge is cleaved, and multiple cleaving regions of each chip array are cleaved simultaneously.

[0015] In some embodiments, positioning the chip array assembly at a target location on the flexible element of the dicing device includes: The spacing between adjacent cleavage protrusions is adjusted based on the spacing between adjacent cleavage regions, so that the ridges of multiple cleavage protrusions correspond one-to-one with multiple cleavage groups. The chip array assembly is mounted on the flexible component of the dicing device; The detection device detects the positional correspondence between ridges and cleavage groups by measuring the spacing between adjacent chip arrays, until multiple cleavage groups of the chip array assembly are set to correspond one-to-one with multiple ridges.

[0016] The dicing apparatus and dicing method provided by this invention have the following technical advantages: This application places the entire chip array assembly on a flexible component within a cleaving device. Pressure variations control the indentation of the flexible component, causing the entire chip array assembly to collapse. Under the action of the ridges on the cleaving surface, multiple chip arrays are progressively cleaved along a second direction in a single cleaving operation. Furthermore, multiple cleaving regions of each chip array are simultaneously cleaved along a first direction under the action of their corresponding ridges. Therefore, this application can achieve cleaving in both the first and second directions in a single cleaving operation. In other words, it can cleave multiple chip arrays or simultaneously cleave multiple chips within a single chip array. The operation is simple, improving cleaving efficiency and shortening cleaving time.

[0017] Specifically, the dicing apparatus has a sealed chamber. After dicing the wafer into multiple chip arrays, these chip arrays are integrally mounted on the flexible component of the dicing apparatus, with the chamber located below the chip array assembly. Within each chip array assembly, the chips on the multiple chip arrays are evenly arranged, ensuring that multiple sets of dicing regions on the multiple chip arrays arranged along a second direction are collinear. Each set of collinear dicing regions forms a dicing group. The dicing apparatus includes multiple dicing protrusions, with the ridges of these protrusions corresponding vertically to the multiple dicing groups. By adjusting the air pressure within the chamber, the flexible component is adsorbed and deformed, causing the chip array assembly on the flexible component to collapse. This causes the dicing regions of each dicing group, or their adjacent areas, to contact the ridges with a certain degree of rigidity, thereby causing multiple dicing groups to cleave. This allows the entire chip array assembly to be diced in a single dicing operation. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a chip array assembly before cleaving, provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a chip array assembly after being cleaved by a cleaving device according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a chip array assembly provided in an embodiment of this application; Figure 4 This is a top view of the structure of a chip array assembly before cleaving provided by a cleaving device in an embodiment of this application; Figures 5-6 This is a schematic diagram of the structure of a slicing protrusion of a slicing device provided in an embodiment of this application; Figures 7-8 This is a schematic diagram of another slicing protrusion of a slicing device provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of adjacent slit protrusions in a slit device provided in an embodiment of this application; Figure 10 This is a schematic flowchart of a dicing method provided in an embodiment of this application.

[0020] Figure label: 100 - Support assembly; 110 - Split protrusion; 111 - Ridge; 112 - First tenon; 113 - Second tenon; 114 - First mortise; 115 - Second mortise; 116 - First sidewall; 117 - Second sidewall; 120 - Support part; 130 - Support plate; 131 - First through hole; 150 - Base; 151 - Second through hole; 160 - Heating device; 200 - Flexible component; 300 - Chip array assembly; 310 - Chip array; 311 - Chip; 312 - Cleavage region; 313 - Cleavage group; 400 - Chamber; 410 - Main chamber. Detailed Implementation

[0021] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0022] Those skilled in the art will understand that, unless specifically stated otherwise, the terms "described" and "the" as used herein may also include plural forms. It should be further understood that the term "comprising" as used in this application's specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude implementations of other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by this art. It should be understood that when we say an element is "connected" or "coupled" to another element, the element may be directly connected or coupled to the other element, or it may mean that the element and the other element are connected through an intermediate element. Furthermore, "connected" or "coupled" as used herein may include wireless connections or wireless coupling. The term "and / or" as used herein refers to at least one of the items defined by the term; for example, "A and / or B" may be implemented as "A," or as "B," or as "A and B."

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0024] This application provides a cleaving device for cleaving chip 311, such as... Figures 1-4 As shown, the dicing device includes a support assembly 100 and a flexible component 200.

[0025] The support assembly 100 has a plurality of slit protrusions 110 arranged along a first direction on one side; the top of the slit protrusions 110 has a ridge 111 extending along a second direction; the first direction is perpendicular to the second direction.

[0026] The flexible element 200 is disposed on the side of the support assembly 100 having the slit protrusion 110, and the side of the flexible element 200 away from the support assembly 100 is used to support the chip array assembly 300.

[0027] The chip array assembly 300 includes a plurality of chip arrays 310 arranged along a second direction. Each chip array 310 includes a plurality of chips 311 connected along a first direction. A cleavage region 312 is provided between two adjacent chips 311. Along the second direction, the collinear cleavage regions 312 form a cleavage group 313. The ridges 111 of the cleavage protrusions 110 are correspondingly provided with the cleavage regions 312 in the cleavage group 313.

[0028] The edge of the flexible element 200 is sealed to the support assembly 100, and a cavity 400 is formed between the flexible element 200 and the support assembly 100.

[0029] When the pressure inside the cavity 400 is less than the pressure outside the cavity 400, the flexible member 200 is configured such that the recess defined by any two adjacent cleavage protrusions 110 fits against the ridge 111, cleaving at least one chip 311 of the chip array 310 in the cleavage group 313 corresponding to the ridge 111, and causing the chips 311 connected by the plurality of cleavage regions 312 of each chip array 310 to be cleaved synchronously.

[0030] In this embodiment, by placing the entire chip array assembly 300 on the flexible member 200 in the cleaving device, pressure changes control the indentation of the flexible member 200, causing the entire chip array assembly 300 to collapse. Under the action of the ridges 111 of the cleaving protrusions 110, multiple chip arrays 310 are gradually cleaved along the second direction in a single cleaving operation. Furthermore, multiple cleaving regions 312 of each chip array 310 are simultaneously cleaved along the first direction under the action of their corresponding ridges 111. Therefore, this application can achieve cleaving in both the first and second directions in a single cleaving operation. That is, it can cleave multiple chip arrays 310, and it can also simultaneously cleave multiple chips 311 of a single chip array 310. The operation is simple, and it can improve cleaving efficiency and shorten cleaving time.

[0031] Specifically, the dicing apparatus has a sealed chamber 400. After dicing the wafer into multiple chip arrays 310, the chip array assembly 300 is integrally disposed on the flexible component 200 of the dicing apparatus, with the chamber 400 located below the chip array assembly 300. In each chip array assembly 300, the chips 311 on the multiple chip arrays 310 are evenly arranged, such that the multiple sets of dicing regions 312 on the multiple chip arrays 310 arranged along the second direction are all collinear, and each set of collinear dicing regions 312 forms a dicing group 313. The dicing apparatus includes multiple dicing protrusions 110, and the ridges 111 of the multiple dicing protrusions 110 correspond vertically to the multiple dicing groups 313. By adjusting the air pressure in the chamber 400, the flexible component 200 is adsorbed and deformed, and the chip array assembly 300 on the flexible component 200 collapses, so that the cleavage region 312 of each cleavage group 313, or the adjacent area of ​​the cleavage region 312, touches the ridge 111 with a certain hardness, thereby causing multiple cleavage groups 313 to crack, realizing the cleavage of the entire chip array assembly 300 in one cleavage operation.

[0032] Optionally, such as Figure 3 As shown, the chip array assembly 300 in this embodiment is obtained by cleaving the entire wafer, the chip array 310 includes bar arrays obtained by cleaving the wafer, and the chip 311 includes bar strips obtained by cleaving the bar arrays, which can be used as laser chips.

[0033] Optionally, such as Figure 3 As shown, the chips 311 in this embodiment are of the same size, so that the chips 311 in the same column are all facing each other along the second direction, and the cleavage regions 312 on the edges of the chips 311 in the same column are all collinear, thereby enabling each cleavage region 312 to be cleaved in one cleaving operation.

[0034] Alternatively, the cleavage region 312 can be understood as a semi-etched crack that can be completely cracked under the action of the ridge 111, thereby cleaving the chip 311 connected by the crack.

[0035] Optionally, the flexible element 200 includes a blue film.

[0036] In some embodiments, such as Figure 1 As shown, the support assembly 100 includes a support portion 120 and a support plate 130.

[0037] The support section 120 has a hollow area.

[0038] The support plate 130 is disposed in the hollow area of ​​the support part 120 and is connected to the support part 120 on its outer periphery; the slit protrusion 110 is disposed on one side of the support plate 130; the edge of the flexible member 200 is sealed to the top of the support part 120, and the hollow area between the flexible member 200 and the support assembly 100 forms a cavity 400.

[0039] When the pressure inside the chamber 400 is equal to or greater than the pressure outside the chamber 400, the top of the slit protrusion 110 has a gap with the flexible member 200.

[0040] In this embodiment, the support component 100 is further defined to ensure the overall structural strength of the dicing device. As the main structure of the dicing device, the support component 100 supports the flexible component 200 and the support plate 130. In addition to providing support for the flexible component 200, the hollow area of ​​the support component 100 provides space for the formation of the chamber 400, which facilitates the control of the deformation of the flexible component 200 by pressure.

[0041] In some embodiments, such as Figure 1 and Figure 2 As shown, the support plate 130 has multiple first through holes 131.

[0042] Each chip 311 has at least one first through hole 131 below it; the chamber 400 includes a main cavity 410 formed below the chip 311.

[0043] The cleavage protrusion 110 is movably connected to the support plate 130, and the distance between the ridges 111 of two adjacent cleavage protrusions 110 is equal to the distance between two adjacent cleavage sets 313.

[0044] Along the third direction, the interval between adjacent slit protrusions 110 overlaps with at least one first through hole 131, such that the first through hole 131 connects the inner and outer spaces of the main cavity 410, and the third direction is at least perpendicular to the first direction.

[0045] In this embodiment, the position of the cleavage protrusion 110 is movable, and the spacing between adjacent cleavage protrusions 110 can be set according to different chip 311 sizes, which has strong applicability. Furthermore, since the planar dimensions of the flexible component 200 are large, and the chip 311 is disposed on the entire flexible component 200 with the main cavity 410 located below the chip 311 and the first through-hole 131 also located below the chip 311, when gas is drawn from the main cavity 410 through the first through-hole 131, the flexible component 200 directly below the chip 311 deforms and collapses first, causing the chip 311 to collapse subsequently. This increases the speed at which the chip 311 collides with the ridge 111, enhancing the cleavage effect.

[0046] Optionally, the third direction is the vertical direction when the cleaving device is upright, that is, the direction perpendicular to the chip 311 before cleavage.

[0047] This application provides at least two implementation methods for the cleavage protrusion 110.

[0048] Firstly, in some embodiments, such as Figure 1As shown, the lobed protrusion 110 is a side-mounted triangular prism structure, with the upward-facing edge serving as the ridge 111.

[0049] Secondly, in some embodiments, please refer to Figures 5-8 Along the first direction, one end of the split protrusion 110 has a first tenon 112 and the other end has a second tenon 113; along the second direction, a first mortise 114 is formed on both sides of the first tenon 112, and a second mortise 115 is formed between two adjacent second tenons 113.

[0050] In two adjacent split protrusions 110, the second tenon portion 113 of the preceding split protrusion 110 corresponds to the first tenon portion 114 of the following split protrusion 110, and the second tenon portion 115 of the preceding split protrusion 110 corresponds to the first tenon portion 112 of the following split protrusion 110; the gap between adjacent split protrusions 110 is at least partially located within the area of ​​the first tenon portion 114 and the second tenon portion 115.

[0051] In this embodiment, as Figure 9 As shown, the ends of adjacent cleavage protrusions 110 that are close to each other can interlock, thereby reducing the distance between the ridges 111 of adjacent cleavage protrusions 110, increasing the distance adjustment range of the cleavage protrusions 110, and enabling them to accommodate chips 311 of more sizes, thus improving applicability. Specifically, one end of the cleavage protrusion 110 has a concave-convex structure, and the other end also has a concave-convex structure. The concave-convex structures at both ends are complementary. When adjacent cleavage protrusions 110 are arranged, the concave-convex structures at opposite ends can interlock, so that along the second direction, adjacent cleavage protrusions 110 have a partially overlapping area, thereby making the distance between the ridges 111 of adjacent cleavage protrusions 110 sufficiently small to increase the distance adjustment range.

[0052] In one embodiment, the slit protrusion 110 is detachably connected to the support plate 130; specifically, the slit protrusion 110 is magnetically connected to or plugged into the support plate 130.

[0053] This application also provides the following two different implementations for the aforementioned second type of cleavage protrusion 110.

[0054] Firstly, in some embodiments, along the first direction, the ridge 111 is located between the first tenon portion 112 and the second tenon portion 113.

[0055] like Figures 5-6 As shown, Figure 5 This is a top view of a slit protrusion 110. Figure 6This is a side view of a cleavage protrusion 110. The ridge 111 of the cleavage protrusion 110 is located between the first tenon 112 and the second tenon 113. For example, it can be located near the tail of the second tenon 113 of the first tenon 112. The first tenon 112 and the second tenon 113 are distributed on both sides of the ridge 111. Therefore, the cleavage protrusion 110 has a complete ridge 111 extending along the second direction. One ridge 111 can correspond to an entire cleavage set 313, ensuring the success rate of cleavage.

[0056] Secondly, in some embodiments, along the second direction, the ridge 111 includes at least one sub-part, corresponding to the top of at least one first tenon 112, and the length of the sub-part is not less than the length of the cleavage zone 312.

[0057] It is understood that the second direction described in this application may be consistent with the extension direction of the cleavage region 312, and the first direction may be consistent with the arrangement direction of the chips 311 in the chip array 310.

[0058] like Figures 7-8 As shown, Figure 7 This is a top view of another type of slit protrusion 110. Figure 8 This is a side view of another type of split protrusion 110. The ridge 111 includes a plurality of sub-parts spaced apart along a second direction, each sub-part located at the top of each first tenon 112. Please refer to [further details omitted]. Figure 3 There is a gap between adjacent chip arrays 310. The first tenon 114 of the split protrusion 110 corresponds to the gap between adjacent chip arrays 310, so that each cleavage area 312 corresponds to a sub-part of ridge 111 below, thereby making the sub-part below each cleavage area 312 a complete structure extending along the second direction, ensuring the success rate of cleavage.

[0059] In some embodiments, the slit protrusion 110 is magnetically connected to the support plate 130.

[0060] In this embodiment, the slit protrusion 110 can be magnetically connected to the support plate 130, facilitating the movement and fixation of the slit protrusion 110 relative to the support plate 130. For example, the slit protrusion 110 is made of metal, and the support plate 130 is magnetic, capable of attracting the slit protrusion 110. Alternatively, the slit protrusion 110 may have a built-in magnet, enabling it to attract the support plate 130.

[0061] In some embodiments, the slit protrusion 110 is inserted into the support plate 130.

[0062] In this embodiment, the bottom end of the slit protrusion 110 has some plug-in parts, and the surface of the support plate 130 is provided with some plug-in grooves. The plug-in parts and the plug-in grooves can be fitted and fixed to each other, so as to realize the movement and fixation of the slit protrusion 110 relative to the support plate 130.

[0063] In some embodiments, the slit protrusion 110 includes a first sidewall 116 and a second sidewall 117, at least one of the first sidewall 116 and the second sidewall 117 being inclined relative to the support plate 130, and a ridge 111 being formed at the junction of the first sidewall 116 and the second sidewall 117.

[0064] The tilt angle of the first sidewall 116 is greater than that of the second sidewall 117. The ridge 111 is offset from the corresponding cleavage group 313, so that along the third direction, most of the chip 311 is corresponding to the second sidewall 117, and a small part of the chip 311 is suspended relative to the second sidewall 117.

[0065] In this embodiment, please refer to Figures 1-2 , Figures 5-6 ,as well as Figures 7-8 It can be seen that at least one of the first sidewall 116 and the second sidewall 117 of the slit protrusion 110 is inclined relative to the support plate 130, so that the side of the structure defined by the first sidewall 116, the second sidewall 117 and the support plate 130 forms a triangle (e.g., Figure 1 As shown, the inclination angle of the first sidewall 116 is greater than that of the second sidewall 117, making the second sidewall 117 more gentle, with a larger surface area and occupying a larger planar area. Therefore, when the ridge 111 is offset from the corresponding cleavage group 313, the second sidewall 117 corresponds to most of the area of ​​the chip 311, causing most of the chip 311 to collapse towards the second sidewall 117 under the action of gravity, thus making it easier to be cleaved by the ridge 111.

[0066] In one embodiment, one of the first sidewalls 116 and the second sidewall 117 is inclined relative to the support plate 130. The number of cleavage protrusions 110 is N. The sidewalls adjacent to the odd-numbered cleavage protrusions 110 and the even-numbered cleavage protrusions 110 are perpendicular to the support plate 130. When the adjacent sidewalls of the two cleavage protrusions 110 are tightly fitted, the ridge 111 of any cleavage protrusion 110 forms a ridge 111, which can also realize the cleaving of the chip array 310. The included angle between the two sidewalls of the odd-numbered cleavage protrusions 110 and the even-numbered cleavage protrusions 110 is less than or equal to 60°. The odd-numbered cleavage protrusion 110 is located at the a-th cleavage protrusion among all cleavage protrusions 110, and the even-numbered cleavage protrusion 110 is located at the (a+1)-th cleavage protrusion among the cleavage protrusions 110.

[0067] In one embodiment, the first sidewall 116 and the second sidewall 117 are respectively inclined relative to the support plate 130, and the inclination directions of the first sidewall 116 and the second sidewall 117 are opposite. The first sidewall 116 and the second sidewall 117 define a ridge 111, and the minimum length of the ridge 111 is equal to the length of the cleavage region 312. When the spacing between the chip array 310 with multiple collinear cleavage regions 312 is not constant, the position of the cleavage protrusion 110 provided along the extension direction of the cleavage region 312 can also be adaptively adjusted. In order to achieve efficient and orderly cleavage of the chip 311 / chip array 310, the length of the ridge 111 is set to be equal to the length of the cleavage region 312. By setting the first sidewall 116 and the second sidewall 117 inclined to define the ridge 111, the length of the ridge 111 is the size of a single cleavage protrusion 110 in the second direction, which saves materials on the one hand and reduces the size and volume of the cleavage protrusion 110 and the cleavage device on the other hand.

[0068] It should be noted that chip 311 is divided into two connected regions along the first direction, with the position corresponding to ridge 111, namely the majority region corresponding to the second sidewall 117 and the small portion region corresponding to the first sidewall 116. That is, the area of ​​chip 311 corresponding to the second sidewall 117 is larger than the area of ​​chip 311 corresponding to the first sidewall 116, which is clearly stated.

[0069] In some embodiments, along the second direction, the cleavage region 312 includes a first cleavage portion and a second cleavage portion; the ridge 111 includes a first ridge portion corresponding to the first cleavage portion and a second ridge portion corresponding to the second cleavage portion, wherein the height of the first ridge portion is lower than the height of the second ridge portion.

[0070] In practical applications, a cleavage groove (i.e., the first cleavage section described in this application) is pre-fabricated at one end of the cleavage region 312 to create stress concentration, ensuring that the crack starts precisely from a designated location, and to guide the cleavage path to ensure that the cleavage surface is straight and regular, thereby improving cleavage consistency and product yield. A first ridge with a relatively high height corresponding to the first cleavage section can further guide the cleavage path to achieve efficient and high-yield cleavage.

[0071] Preferably, the ridge 111 includes a first ridge portion disposed corresponding to the first cleavage portion and a second ridge portion disposed corresponding to the second cleavage portion, and the height of the first ridge portion changes linearly to the height of the second ridge portion.

[0072] In this embodiment, along the second direction, the cleavage region 312 includes a first cleavage portion and a second cleavage portion. The chip array 310 has a substantially the same height. The ridge 111 includes a first ridge portion and a second ridge portion. The height of the first ridge portion changes linearly to the height of the second ridge portion, that is, along the second direction, the ridge 111 is at least partially lower in height, so that the ridge 111 and the chip array 310 array have different height differences. Figure 4As shown, at least a portion of the ridge 111 has a decreasing height from top to bottom, resulting in different height differences between the ridges 111 and the corresponding chip array 310. This causes the first cleaving portion of a portion of the chip array 310 to first touch the first ridge of the ridge 111. After the first cleaving portion of the ridge 111 cleaves the first cleaving portion, the chip 311 collapses towards the cleavage protrusion 110 under the action of gravity, gaining a certain acceleration. At the same time, the second cleaving portion begins to touch the second ridge of the ridge 111 with a lower height. With the support of acceleration, the cleaving efficiency of the second cleaving portion is improved.

[0073] Optionally, the height of ridge 111 gradually decreases along the second direction.

[0074] In some embodiments, the support component 100 further includes a base 150.

[0075] The support 120 is connected to the outer periphery of the base 150.

[0076] The base 150 has a second through hole 151, which communicates with the first through hole 131.

[0077] A heating device 160 is provided between the base 150 and the support plate 130.

[0078] In this embodiment, a second through hole 151 is formed on the base 150 and communicates with the first through hole 131, which can draw gas from the chamber 400 and change the pressure of the chamber 400. A heating device 160 is provided between the base 150 and the support plate 130. Under the action of heating, the deformation of the flexible member 200 can be accelerated and the cleavage time can be shortened.

[0079] Based on the same inventive concept, such as Figure 10 As shown, this application also provides a dicing method, based on the dicing apparatus provided in any of the foregoing embodiments, including steps S1-S3: S1: The wafer is cleaved into multiple chip arrays 310 along the second direction, and multiple cleaving regions 312 are formed on the chip arrays 310. Chips 311 are formed between adjacent cleaving regions 312 to form a chip array assembly 300; along the second direction, collinear cleaving regions 312 form cleaving groups 313.

[0080] S2: Position the chip array assembly 300 at the target location of the flexible component 200 of the dicing device.

[0081] S3: Adjust the air pressure inside the chamber 400 of the cleaving device so that the pressure inside the chamber 400 is less than the pressure outside the chamber 400. The flexible member 200 is aligned with the ridge 111 by the recess defined by any two adjacent cleaving protrusions 110 of the cleaving device, and cleaves at least one chip 311 of the chip array 310 in the cleaving group 313 corresponding to the ridge 111, and makes the multiple cleaving regions 312 of each chip array 310 cleaved simultaneously.

[0082] In this embodiment, the cleaving device provided in any of the aforementioned embodiments is used, and its technical principle and effect are similar, so they will not be described again here. This application places the chip array assembly 300 entirely on the flexible member 200 in the cleaving device, and controls the indentation of the flexible member 200 by pressure changes, causing the chip array assembly 300 to collapse as a whole. Under the action of the ridges 111 of the cleaving protrusions 110, multiple chip arrays 310 are gradually cleaved along the second direction in one cleaving operation. Furthermore, the multiple cleaving regions 312 of each chip array 310 are synchronously cleaved along the first direction under the action of the corresponding multiple ridges 111. The operation is simple, and it can improve cleaving efficiency and shorten cleaving time.

[0083] Optionally, step S1 includes: cleaving the wafer into multiple chip arrays 310 along the second direction, increasing the spacing between adjacent chip arrays 310 to facilitate observation of the relative positional relationship between the cleaved region 312 and the ridge 111.

[0084] In some embodiments, step S2 above, which involves placing the chip array assembly 300 at the target position of the flexible member 200 of the dicing device, includes: The spacing of adjacent cleavage protrusions 110 is adjusted based on the spacing of adjacent cleavage regions 312, so that the ridges 111 of multiple cleavage protrusions 110 are set in a one-to-one correspondence with multiple cleavage groups 313.

[0085] The chip array assembly 300 is disposed on the flexible component 200 of the dicing device.

[0086] Based on the detection device, the positional correspondence between the ridges 111 and the cleavage group 313 is detected by the spacing between adjacent chip arrays 310, until the multiple cleavage groups 313 of the chip array assembly 300 are set to correspond one-to-one with the multiple ridges 111.

[0087] In this embodiment, a film expansion operation is performed on the chip array assembly 300 before cleaving, so that there is a gap between adjacent chip arrays 310. The gap can be used to determine the correspondence between chip array 310 and ridge 111, thereby effectively improving the accuracy and success rate of cleaving.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A dicing device, characterized in that, For use in chip cleaving, including: The support assembly (100) has a plurality of slit protrusions (110) arranged along a first direction on one side; the top of the slit protrusions (110) has a ridge (111) extending along a second direction; the first direction is perpendicular to the second direction. A flexible element (200) is disposed on the side of the support assembly (100) having the slit protrusion (110), and the side of the flexible element (200) away from the support assembly (100) is used to support the chip array assembly (300). The chip array assembly (300) includes a plurality of chip arrays (310) arranged along a second direction. The chip arrays (310) include a plurality of chips (311) connected along a first direction. There is a cleavage region (312) between two adjacent chips (311). Along the second direction, the collinear cleavage regions (312) form a cleavage group (313). The ridges (111) of the cleavage protrusions (110) are correspondingly arranged with the cleavage regions (312) in the cleavage group (313). The edge of the flexible member (200) is sealed to the support assembly (100), and a cavity (400) is formed between the flexible member (200) and the support assembly (100). When the pressure inside the cavity (400) is less than the pressure outside the cavity (400), the flexible member (200) is configured such that the recess defined by any two adjacent cleavage protrusions (110) fits against the ridge (111), cleaving at least one chip array (310) chip (311) in the cleavage group (313) corresponding to the ridge (111), and causing the chips (311) connected by the plurality of cleavage regions (312) of each chip array (310) to be cleaved synchronously.

2. The dicing apparatus according to claim 1, characterized in that, The support component (100) includes: The support section (120) has a hollow area; A support plate (130) is disposed in the hollow area of ​​the support part (120) and its outer periphery is connected to the support part (120); the slit protrusion (110) is disposed on one side of the support plate (130); the edge of the flexible member (200) is sealed to the top of the support part (120), and the hollow area between the flexible member (200) and the support assembly (100) forms the chamber (400). When the pressure inside the chamber (400) is equal to or greater than the pressure outside the chamber (400), the top of the slit protrusion (110) has a gap with the flexible member (200).

3. The dicing apparatus according to claim 2, characterized in that, The support plate (130) has a plurality of first through holes (131); Each of the chips (311) has at least one first through hole (131) corresponding to its lower surface; the chamber (400) includes a main cavity (410) formed under the chip (311). The cleavage protrusion (110) is movably connected to the support plate (130), and the distance between the ridges (111) of two adjacent cleavage protrusions (110) is equal to the distance between two adjacent cleavage groups (313). Along a third direction, the interval between adjacent slit protrusions (110) overlaps with at least one of the first through holes (131), such that the first through hole (131) connects the inner and outer spaces of the main cavity (410), and the third direction is at least perpendicular to the first direction.

4. The dicing apparatus according to claim 3, characterized in that, Along the first direction, one end of the split protrusion (110) has a first tenon (112) and the other end has a second tenon (113); along the second direction, a first mortise (114) is formed on both sides of the first tenon (112) and a second mortise (115) is formed between two adjacent second tenons (113). In two adjacent split protrusions (110), the second tenon (113) of the first split protrusion (110) corresponds to the first tenon (114) of the second split protrusion (110), and the second tenon (115) of the first split protrusion (110) corresponds to the first tenon (112) of the second split protrusion (110); the interval between adjacent split protrusions (110) is at least partially located within the area of ​​the first tenon (114) and the second tenon (115).

5. The dicing apparatus according to claim 4, characterized in that, Along the first direction, the ridge (111) is located between the first tenon (112) and the second tenon (113); Alternatively, along the second direction, the ridge (111) includes at least one sub-part corresponding to the top of at least one of the first tenons (112), the length of which is not less than the length of the cleavage zone (312).

6. The dicing apparatus according to claim 3, characterized in that, The slit protrusion (110) is magnetically connected to the support plate (130), or the slit protrusion (110) is inserted into the support plate (130).

7. The dicing apparatus according to claim 2, characterized in that, The slit protrusion (110) includes a first sidewall (116) and a second sidewall (117), at least one of the first sidewall (116) and the second sidewall (117) is inclined relative to the support plate (130), and the ridge (111) is formed at the connection between the first sidewall (116) and the second sidewall (117). The tilt angle of the first sidewall (116) is greater than that of the second sidewall (117). The ridge (111) is offset from the corresponding cleavage group (313), such that along the third direction, most of the area of ​​the chip (311) is corresponding to the second sidewall (117), and a small part of the chip (311) is suspended relative to the second sidewall (117).

8. The dicing apparatus according to claim 1, characterized in that, Along the second direction, the cleavage region includes a first cleavage portion and a second cleavage portion; The ridge (111) includes a first ridge portion corresponding to the first cleavage portion and a second ridge portion corresponding to the second cleavage portion, wherein the height of the first ridge portion and the height of the second ridge portion change linearly.

9. The dicing apparatus according to claim 3, characterized in that, The support assembly (100) further includes: a base (150); The support (120) is connected to the outer periphery of the base (150); The base (150) has a second through hole (151), which communicates with the first through hole (131); A heating device (160) is provided between the base (150) and the support plate (130).

10. A dicing method, based on the dicing apparatus according to any one of claims 1-9, characterized in that, include: The wafer is cleaved into multiple chip arrays (310) along the second direction, and multiple cleaving regions (312) are formed on the chip arrays (310). Chips (311) are formed between adjacent cleaving regions (312) to form a chip array assembly (300); the collinear cleaving regions (312) along the second direction form a cleaving group (313). The chip array assembly (300) is positioned at the target location of the flexible component (200) of the dicing device; The air pressure inside the chamber (400) of the dicing device is adjusted so that the pressure inside the chamber (400) is less than the pressure outside the chamber (400). The flexible member (200) is aligned with the ridge (111) to form a recess defined by any two adjacent dicing protrusions (110) of the dicing device. The chip (311) of at least one chip array (310) in the cleaving group (313) corresponding to the ridge (111) is cleaved, and the multiple cleaving regions (312) of each chip array (310) are cleaved simultaneously.

11. The dicing method according to claim 10, characterized in that, Positioning the chip array assembly (300) at a target location on the flexible component (200) of the dicing device includes: The spacing between adjacent cleavage zones (312) is adjusted to make the ridges (111) of the multiple cleavage zones (313) correspond one-to-one with the multiple cleavage groups (313). The chip array assembly (300) is disposed on the flexible part (200) of the dicing device; Based on the detection device, the positional correspondence between the ridge (111) and the cleavage group (313) is detected by the spacing between adjacent chip arrays (310) until the multiple cleavage groups (313) of the chip array assembly (300) are set to correspond one-to-one with the multiple ridges (111).

Images