Electroplating bath and horizontal electroplating apparatus

Abstract

This invention provides an electroplating tank and horizontal electroplating equipment, relating to the field of photovoltaic equipment technology. The electroplating tank of this invention may include a first tank body, a plating cathode, and a conductive roller. A first overflow structure is provided at the first tank body to maintain the electroplating solution in the first tank at a preset height and to drain excess electroplating solution. The plating cathode is located at the bottom of the first tank body, and the conductive roller is located within the first tank body, with a portion of the conductive roller submerged in the electroplating solution. This portion of the conductive roller submerged in the electroplating solution forms a plating electric field with the plating cathode. During the continuous plating process on the conductive roller, the electroplating tank of this invention draws out the metal generated during plating along with the electroplating solution, preventing metal from adhering to the target object and forming copper nodules, thus reducing product defect rates and increasing production capacity.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic equipment technology, and in particular to an electroplating tank and horizontal electroplating equipment. Background Technology

[0002] In the fabrication of solar cells, horizontal electroplating equipment plays a crucial role. Its operation is based on electrochemical principles. The plating tank contains a specific electroplating solution, the anode is a suitable metal material, and the cathode is connected to the solar cell substrate to be plated. After the power is turned on, metal ions migrate to the substrate at the cathode under the drive of the electric field and deposit, forming the required conductive metal layer and other structures. Generally, horizontal electroplating equipment can continuously electroplat multiple solar cell substrates. However, because the cathode often becomes coated with metal during the electroplating process, it significantly affects subsequent electroplating and is not conducive to continuous electroplating.

[0003] In existing technologies, to enable continuous deplating of the cathode roller, an anode is added above the cathode roller, with the object to be plated below serving as the cathode. Theoretically, this allows electroplating and deplating to occur simultaneously. However, in practice, the metal debris generated during the deplating process still severely affects the electroplating effect and may even damage the surface of the silicon wafer. Summary of the Invention

[0004] One objective of a first aspect of the present invention is to provide an electroplating tank that solves the problem of the impact of metal debris generated during the plating process on the surface of silicon wafers in the prior art.

[0005] Specifically, the present invention provides an electroplating tank, comprising:

[0006] The first tank is used to contain the incoming electroplating solution. The first tank is provided with a first overflow structure to maintain the electroplating solution in the first tank at a preset height and to draw out the excess electroplating solution.

[0007] The plating cathode is located at the bottom of the first tank.

[0008] A conductive roller is located in the first tank. The upper part of the conductive roller is located above the surface of the electroplating solution in the first tank, and the lower part is located in the electroplating solution in the first tank. When the target object comes into contact with the conductive roller, the part of the conductive roller located in the electroplating solution forms an electroplating elimination electric field with the electroplating elimination cathode, thereby eliminating the metal layer on the conductive roller.

[0009] Optionally, when the target object is subjected to a force passing over the first trough, the upper portion of the conductive roller brushes the charge onto the bottom of the target object.

[0010] Optionally, when the conductive roller rotates continuously within the first groove and comes into contact with the target object, it applies a force to the target object that is in the same direction as the target object's movement.

[0011] Optionally, it also includes:

[0012] The second tank is located below the first tank; the second tank is connected to the electroplating solution in the first tank through the first overflow structure, so that the electroplating solution flowing out of the first overflow structure flows into the second tank.

[0013] Optionally, the first overflow structure is disposed on the side and / or bottom of the first tank.

[0014] Optionally, the first overflow structure is disposed on at least one side of the first tank.

[0015] Optionally, a flow guiding structure is provided at the bottom of the second tank, one end of which is connected to the second tank to guide the electroplating solution flowing out of the first overflow structure.

[0016] Optionally, it also includes:

[0017] A pressure roller, positioned above the first trough, controls the height of the target object during the conveying process to increase the contact time between the target object and the conductive roller.

[0018] Optionally, a second overflow structure is provided at the opening of the first tank so that external electroplating solution can overflow into the first tank through the second overflow structure.

[0019] A second aspect of the present invention aims to provide a horizontal electroplating apparatus that solves the problem of mutual interference between the electroplating and deplating electric fields, so as to achieve the purpose of electroplating and deplating simultaneously during the movement of the silicon wafer.

[0020] Specifically, the present invention provides a horizontal electroplating apparatus, comprising:

[0021] The main tank contains an electroplating solution maintained at a first preset height; at least one upper plating anode is disposed within the electroplating solution; and

[0022] At least one of the aforementioned electroplating tanks is disposed in the main tank body; each of the electroplating tanks is disposed on the side of one of the upper plating anodes; the electroplating solution in each of the electroplating tanks is maintained at a second preset height.

[0023] Optionally, the upper anode and the conductive roller are located on the same side of the target object.

[0024] Optionally, if there are at least two electroplating tanks, the distance between the same position of adjacent electroplating tanks is not greater than the size of the target object in the transmission direction, so that the target object is always in contact with the conductive roller during the electroplating process.

[0025] Optionally, it also includes:

[0026] A transfer component is disposed within the main tank; the transfer component applies a force to the electroplating solution to cause the electroplating solution to flow along a predetermined transfer direction.

[0027] Optionally, the height of the uppermost part of the transmission component is lower than the liquid level of the electroplating solution in the main tank.

[0028] Optionally, it also includes:

[0029] A secondary tank is located below the main tank; the secondary tank is connected to the flow guiding structure to store the electroplating solution flowing in from the electroplating tank.

[0030] The electroplating tank of this solution may include a first tank body, a plating cathode, and a conductive roller. A first overflow structure is provided at the first tank body to maintain the electroplating solution in the first tank at a preset height and to drain excess plating solution. The plating cathode is located at the bottom of the first tank body, and the conductive roller is located inside the first tank body, with a portion of the conductive roller submerged in the electroplating solution. This portion of the conductive roller submerged in the electroplating solution forms a plating electric field with the plating cathode. During the continuous plating process on the conductive roller, the electroplating tank of this solution draws out the metal generated during plating along with the electroplating solution, preventing metal from adhering to the target object and forming copper nodules, thus reducing the product defect rate and increasing production capacity.

[0031] This horizontal electroplating equipment significantly improves electroplating efficiency. As the target object is transported within the main tank, an electric field is formed between the object and the upper plating anode, continuously electroplating the bottom surface of the object. Simultaneously, the portion of the object in contact with the conductive roller is continuously coated with negative charges, achieving continuous electroplating. Since the conductive roller is not immersed in the plating solution within the main tank, the amount of metal plating on it is reduced, extending its lifespan and thus increasing production efficiency while reducing costs.

[0032] In this electroplating tank, the conductive roller continuously applies negative charges to the bottom surface of the target object from above, and forms a deplating electric field with the deplating cathode below, thereby deplating the conductive roller. This allows the conductive roller to act as both the cathode for electroplating the target object and the anode for deplating itself, thus achieving simultaneous electroplating and deplating, and ultimately enabling continuous production.

[0033] In addition, the electroplating tank of this scheme completely separates the upper plating anode and the deplating cathode. The electroplating electric field is located in the electroplating solution of the main tank outside the electroplating tank, while the deplating electric field is located in the electroplating solution inside the electroplating tank. This can effectively prevent the two electric fields of electroplating and deplating from interfering with each other and improve the efficiency of electroplating.

[0034] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0035] The following sections will describe some specific embodiments of the invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art will understand that these drawings are not necessarily drawn to scale.

[0036] In the attached image:

[0037] Figure 1 This is a schematic structural diagram of an electroplating tank according to a specific embodiment of the present invention;

[0038] Figure 2 This is a perspective view of an electroplating tank according to a specific embodiment of the present invention;

[0039] Figure 3 This is a partial schematic structural diagram of a horizontal electroplating apparatus according to a specific embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures:

[0041] Horizontal electroplating equipment - 100; Main tank - 110; Electroplating tank - 120; De-plating cathode - 121; Conductive roller - 122; First tank - 123; Second tank - 124; First overflow structure - 125; Second overflow structure - 126; Mounting structure - 127; Roller brush - 128; Guide structure - 129; Top plating anode - 130; Auxiliary tank - 140; Transfer roller - 150; Pressure roller - 160; Target object - 170. Detailed Implementation

[0042] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0043] As a specific embodiment of the present invention, such as Figures 1-3 As shown, this embodiment provides an electroplating tank 120, the tank structure of which may include a first tank body 123, a plating cathode 121, and a conductive roller 122. The plating cathode 121 is disposed at the bottom of the first tank body 123, and the conductive roller 122 is mounted on the first tank body 123 through a mounting structure 127.

[0044] As a specific embodiment, a first overflow structure 125 is provided on the first tank 123 to control the height of the electroplating solution inside the first tank 123 at a second preset height h2. When the electroplating solution in the first tank 123 is higher than the second preset height h2, the electroplating solution in the first tank 123 is drained out through the first overflow structure 125. When the first tank 123 is placed inside the external electroplating solution, the height of the external electroplating solution is the first preset height h1, and the second preset height h2 is lower than the first preset height h1.

[0045] Preferably, the first overflow structure 125 is disposed on the side of the first tank 123.

[0046] Specifically, in this embodiment, the first overflow structure 125 is a through hole, which can be a round hole or a hole of other shapes. Furthermore, the number of through holes can be designed according to actual conditions.

[0047] Specifically, in this embodiment, the through hole is a strip-shaped hole, and a strip-shaped hole is provided on each of the two opposite sidewalls of the first groove 123.

[0048] The conductive roller 122 is located below the second preset height h2, so that the upper part of the conductive roller 122 contacts the bottom surface of the target object 170, thereby plating a negative charge onto the bottom surface of the target object 170. The part of the conductive roller 122 immersed in the electroplating solution forms a plating electric field with the plating cathode 121 to perform plating removal on the roller brush 128 on the conductive roller 122.

[0049] During operation, the conductive roller 122 rotates under the drive of the drive mechanism. Its internal conductive connectors rotate accordingly and sequentially make electrical contact with a first electrode and a second electrode of opposite polarity. That is, the conductive connectors can switch between electrical connection with the first electrode and electrical connection with the second electrode. At any given time, at least one set of roller brushes 128 and at least another set of roller brushes 128 on the conductive roller 122 have opposite polarities. The specific structure of the conductive roller 122 adopts the existing roller structure, which will not be elaborated upon here.

[0050] In this embodiment, the upper part of the conductive roller 122 is located on the surface of the electroplating solution within the first tank 123, and the lower part is located within the electroplating solution within the first tank 123. Simultaneously, the upper part of the conductive roller 122 is electrically connected to the negative electrode, and the lower part is electrically connected to the positive electrode. It is important to note that although the upper part of the conductive roller 122 is located on the surface of the electroplating solution within the first tank 123, the portion of the upper part of the conductive roller 122 electrically connected to the negative electrode is no larger than the area where the upper part of the conductive roller 122 is located; otherwise, effective plating removal cannot be achieved. Similarly, although the lower part of the conductive roller 122 is located within the electroplating solution within the first tank 123, the portion of the lower part of the conductive roller 122 electrically connected to the positive electrode is no larger than the area where the lower part of the conductive roller 122 is located.

[0051] In a specific embodiment, the conductive roller 122 rotates continuously within the electroplating tank 120. The roller brush 128 positioned above the conductive roller 122 can contact the bottom surface of the target object 170, thereby applying a negative charge to the bottom surface of the target object 170. The position below the conductive roller 122 serves as the positive electrode, forming an electric field with the plating cathode 121. This causes the metal layer on the roller brush 128 to be gradually decomposed into metal ions, and a portion of it will gradually detach into the electroplating solution in the form of metal particles.

[0052] Ideally, the metal layer should be completely converted into metal ions. However, considering that the conductive roller 122 is constantly rotating and not stationary, some metal particles will remain in the electroplating solution as the working time increases, and then float to the surface with the electroplating solution.

[0053] Therefore, in response to the above situation, as a specific embodiment, a first overflow structure 125 is provided on the side wall of the first tank 123 (preferably a strip-shaped hole structure to facilitate the outflow of metal particles; if a through-hole structure is used, the outflow effect of metal particles will be greatly reduced). When the liquid level of the electroplating solution in the first tank 123 is higher than the second preset height h2, the electroplating solution will flow outward along the first overflow structure 125. On the one hand, this avoids excessive electroplating solution in the first tank 123, causing the conductive roller 122 to be completely immersed in the electroplating solution, thus making electroplating and deplating inseparable. On the other hand, it avoids insufficient electroplating solution in the first tank 123, causing the conductive roller 122 to be unable to immerse in the electroplating solution and thus unable to achieve timely deplating, thereby affecting subsequent production. Thirdly, it can discharge the metal particles floating on the liquid surface outward together, preventing the conductive roller 122 from carrying the metal particles out of the electroplating solution during its rotation, and thus preventing scratches on the lower surface of the target object 170 during contact with the target object 170.

[0054] As a specific embodiment of the present invention, an air outlet duct can be provided on the side wall of the first tank 123, located above the surface of the electroplating solution inside the first tank 123, facing the conductive roller 122, to at least ensure that the side of the conductive roller 122 that comes out of the electroplating solution is exposed to hot air, so that the roller brush 128 of the conductive roller 122 can be dried quickly, thereby improving the subsequent electroplating efficiency.

[0055] As a specific embodiment of the present invention, the opening of the first tank 123 of this embodiment is provided with a second overflow structure 126 so that the external electroplating liquid can overflow into the first tank 123 through the second overflow structure 126.

[0056] Specifically, the second overflow structure 126 provided at the opening of the first groove 123 in this embodiment can be a groove, the main function of which is to improve the overflow efficiency.

[0057] Specifically, in this embodiment, the first groove 123 is further provided with a mounting structure 127 for mounting the conductive roller 122. The mounting structure 127 is also a groove structure, which mounts the conductive roller 122 and allows the conductive roller 122 to rotate.

[0058] Specifically, in this embodiment, a roller brush 128 is provided on the outside of the conductive roller 122. The roller brush 128 is distributed on the outer surface of the conductive roller 122 and rotates synchronously with the rotation of the conductive roller 122. When the target object 170 comes into contact with the roller brush 128, the roller brush 128 is energized and acts as a negative electrode to brush a negative charge onto the bottom of the target object 170. When the same roller brush 128 rotates to a predetermined area in the electroplating solution in the electroplating tank 120, it can form an anode for plating removal.

[0059] As a specific embodiment of the present invention, the electroplating tank 120 may include a first tank body 123 and a second tank body 124. When the electroplating tank 120 is located within the main tank body 110, the opening of the first tank body 123 is lower than a first preset height h1, allowing the electroplating solution in the main tank body 110 to overflow into the first tank body 123 through the opening. The electroplating solution in the first tank body 123 is maintained at a second preset height h2 under the constraint of the first overflow structure 125. The second tank body 124 is located below the first tank body 123, allowing the electroplating solution overflowing from the first overflow structure 125 to flow into the second tank body 124.

[0060] As a specific embodiment of the present invention, the bottom of the second tank 124 is provided with a flow guiding structure 129. One end of the flow guiding structure 129 is connected to the second tank 124, and the other end passes through the bottom wall of the main tank 110 so as to guide the electroplating liquid in the electroplating tank 120 out through the flow guiding structure 129.

[0061] Specifically, in this embodiment, a flow guiding structure 129 is provided at the bottom of the second tank 124 to guide the electroplating solution in the second tank 124 out, thereby preventing metal particles generated during the plating process from mixing in the electroplating solution and entering the main tank 110. This effectively prevents copper nodules from forming on the surface of the target object 170, reduces the product defect rate, and increases production capacity.

[0062] As a specific embodiment of the present invention, such as Figure 3 As shown, this embodiment provides a horizontal electroplating apparatus 100, including a main tank 110 and at least one electroplating tank 120 disposed within the main tank 110.

[0063] When the target object 170 is conveyed from the main tank 110 to contact the conductive roller 122, an electric field is formed between the conductive roller 122 and the upper plating anode 130 in the main tank 110, thereby continuously electroplating the target object 170. During the electroplating process, since the conductive roller 122 is located in the electroplating bath 120 rather than in the electroplating solution of the main tank 110, the possibility of a metal layer being electroplated on the conductive roller 122 can be effectively reduced. This reduces the plating time and extends the service life of the conductive roller 122, thereby improving production efficiency and reducing costs.

[0064] In addition, the electroplating tank 120 in this embodiment also contains electroplating liquid overflowing from the main tank 110, and the electroplating liquid in the electroplating tank 120 is maintained at a second preset height h2. A plating cathode 121 is provided in the electroplating liquid, which ensures that the conductive roller 122 is always partially immersed in the electroplating liquid to form a plating electric field with the plating cathode 121, thereby plating the conductive roller 122. This allows the conductive roller 122 to act as both a cathode for electroplating the target object 170 and an anode for plating itself, thus achieving simultaneous electroplating and plating, and thus achieving continuous production.

[0065] Specifically, the electroplating tank 120 in this embodiment may include a first tank body 123 and a second tank body 124. The electroplating liquid in the main tank body 110 is kept at a first preset height h1 by the height above the first tank body 123. When it is higher than this height, the electroplating liquid will overflow into the first tank body 123. Generally, due to the influence of the surface tension of the electroplating liquid, the liquid level of the electroplating liquid is generally slightly higher than the height of the opening above the first tank body 123. This also ensures that one side of the target object 170 is in contact with the electroplating liquid while being transported into the electroplating tank 120.

[0066] Specifically, in this embodiment, the upper height of the second tank 124 is located between the first preset height h1 and the second preset height h2. On the one hand, this does not affect the transmission of the target object 170, and on the other hand, it allows the electroplating liquid in the electroplating tank 120 to flow completely into the second tank 124.

[0067] Meanwhile, in order to ensure the smooth transfer of the entire target object 170 within the main tank 110, a transfer component is provided within the main tank 110. This transfer component applies force to the electroplating solution and / or the target object 170 to transfer the target object 170 along a predetermined transfer direction.

[0068] As a specific embodiment, the transmission component is selected as a self-rotating transmission roller 150, the height of which is lower than the liquid level of the electroplating solution in the main tank 110.

[0069] Specifically, the transfer rollers 150 in this embodiment may include multiple rollers arranged side by side along the direction of movement of the target object 170. The uppermost roller of the transfer roller 150 is slightly lower than the first preset height h1. Its rotation can drive the flow of the liquid surface so that the lower surface of the target object 170 contacts the electroplating liquid and moves together along the preset direction. For example, if the target object 170 moves from left to right in this embodiment, each transfer roller 150 rotates clockwise, and the electroplating liquid above will also tend to flow to the right due to the rotation of the transfer roller 150. Therefore, the target object 170 continuously moves to the right under the drive of the transfer rollers 150 and the conductive liquid.

[0070] Under normal circumstances, the rotation of the transfer roller 150 on the liquid surface will inevitably cause the surface of the electroplating solution to fluctuate up and down. When the height of the top of the transfer roller 150 is lower than the first preset height, the entire target object 170 floats completely on the surface of the electroplating solution. The rotation of the transfer roller 150 drives the flow of the electroplating solution, thereby enabling the target object 170 to move forward. Therefore, the height adjustment of the transfer component needs to be adjusted according to various factors such as the required moving speed of the target object 170 and the concentration of the electroplating solution.

[0071] Furthermore, in this embodiment, the electroplating tank 120 completely separates the upper plating anode 130 from the deplating cathode 121. The electroplating electric field is located in the electroplating solution of the main tank 110 outside the electroplating tank 120, while the deplating electric field is located in the electroplating solution inside the electroplating tank 120. This effectively prevents interference between the electroplating and deplating electric fields, improving the efficiency of electroplating. For example... Figure 3 Region a is the electroplating region, and region b is the deplating region. Region a has an electroplating electric field, while region b has a deplating electric field. Regions a and b are separated by the electroplating tank 120, so the electroplating electric field and the deplating electric field are also separated from each other and do not interfere with each other.

[0072] Specifically, as one embodiment, the number of the top plating anode 130 and the electroplating tank 120 in this embodiment can be the same and there are multiple top plating anodes 130. Multiple top plating anodes 130 are arranged in the direction of the target object 170, and each electroplating tank 120 is arranged on the side of one of the top plating anodes 130, so that the electroplating tank 120 is used as the cathode for top plating and is electroplated with metal, and is deplated in time.

[0073] In one embodiment, the upper anode 130 and the conductive roller 122 are located on the same side of the target object 170, so that single-sided electroplating of the target object 170 can be achieved.

[0074] Specifically, in this embodiment, the upper part of the second tank 124 covers the lower part of the first tank 123, and a platform is formed above the second tank 124. On the one hand, it provides space for the electroplating solution to flow, and on the other hand, the platform formed above the two second tanks 124 between two adjacent electroplating tanks 120 can serve as a support platform for the upper plated anode 130, simplifying the design of other support structures.

[0075] As a specific embodiment of the present invention, the horizontal electroplating equipment 100 of this embodiment may further include a secondary tank 140, which is located below the main tank 110 and is connected to the flow guiding structure 129 to store the electroplating solution flowing in from the electroplating tank 120.

[0076] Specifically, in this embodiment, the electroplating solution flowing out of the electroplating tank 120 is not directly discharged, but is stored in the secondary tank 140. The electroplating solution in the secondary tank 140 can be further recycled into the main tank 110 after treatment, thereby improving the utilization rate of the solution and reducing costs.

[0077] As a specific embodiment of the present invention, the electroplating tank 120 in the horizontal electroplating equipment 100 of this embodiment is provided with several groups. In order to ensure that the target object 170 can be kept in a state of being brushed with negative charge and plated with metal layer during the entire electroplating process, the distance between the same position of adjacent electroplating tanks 120 is not greater than the length of the target object 170 in the transmission direction, so that the target object 170 is always in contact with the conductive roller 122 during the electroplating process.

[0078] Specifically, for adjacent electroplating tanks 120, the highest point of the conductive roller 122 of each electroplating tank 120 is the position where a force will definitely be applied to the target object 170. The distance between adjacent electroplating tanks 120 at this position is not greater than the length of the target object 170 in the transmission direction. This ensures that throughout the entire electroplating process, the roller brush 128 will continuously apply negative charges to the target object 170, and the upper plating anode 130 between two adjacent electroplating tanks 120 can continuously form an electric field on the target object 170, thereby plating a metal layer.

[0079] As a specific embodiment of the present invention, the horizontal electroplating equipment 100 of this embodiment may further include a pressure roller 160, which is disposed above the first tank 123 to control the height of the target object 170 during the conveying process in order to increase the contact time between the target object 170 and the conductive roller 122.

[0080] Normally, when the target object 170 moves from the electroplating solution to above the electroplating tank 120, the front end of the target object 170 will first detach from the electroplating solution, which may cause it to tilt upwards. To address this, in this embodiment, the pressure roller 160 is positioned directly above the conductive roller 122, which can work together with the conductive roller 122 on the target object 170. Driven by other transfer rollers 150, the target object 170 will continue to move along the preset direction until the front end of the target object 170 leaves the current electroplating tank 120 and comes into contact with the electroplating solution. This prevents the target object 170 from tilting upwards and also ensures that the roller brush 128 of the conductive roller 122 can be in contact with the bottom of the target object 170 for a long time, thereby improving electroplating efficiency.

[0081] Specifically, the rotation direction of the pressure roller 160 is opposite to that of the conductive roller 122. For example, when the target object 170 moves from left to right in this embodiment, the conductive roller 122 moves clockwise and the pressure roller 160 moves counterclockwise, thereby driving the target object 170 to move to the right.

[0082] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. An electroplating cell characterized by, include: The first tank is used to contain the incoming electroplating solution. The first tank is provided with a first overflow structure to maintain the electroplating solution in the first tank at a preset height and to draw out the excess electroplating solution. The plating cathode is located at the bottom of the first tank. and A conductive roller is located in the first tank. The upper part of the conductive roller is located above the surface of the electroplating solution in the first tank, and the lower part is located in the electroplating solution in the first tank. When the target object comes into contact with the conductive roller, the part of the conductive roller located in the electroplating solution forms an electroplating elimination electric field with the electroplating elimination cathode, thereby eliminating the metal layer on the conductive roller.

2. The electroplating tank according to claim 1, characterized in that, When the conductive roller rotates continuously within the first groove and comes into contact with the target object, it applies a force to the target object that is in the same direction as the target object's movement.

3. The electroplating cell of claim 1, wherein, Also includes: The second tank is located below the first tank; the second tank is connected to the electroplating solution in the first tank through the first overflow structure, so that the electroplating solution flowing out of the first overflow structure flows into the second tank.

4. The electroplating tank according to claim 3, characterized in that, The first overflow structure is disposed on at least one side of the first tank.

5. The electroplating tank according to claim 3, characterized in that, The bottom of the second tank is provided with a flow guiding structure, one end of which is connected to the second tank to guide the electroplating solution flowing out of the first overflow structure.

6. The electroplating cell of claim 1, wherein, Also includes: A pressure roller, positioned above the first trough, controls the height of the target object during the conveying process to increase the contact time between the target object and the conductive roller.

7. The electroplating tank according to claim 1, characterized in that, The opening of the first tank is provided with a second overflow structure so that the external electroplating solution can overflow into the first tank through the second overflow structure.

8. A horizontal electroplating apparatus, characterized by comprising: include: The main tank contains an electroplating solution, which is maintained at a first preset height. At least one upper plating anode is provided in the electroplating solution; and At least one electroplating tank as described in any one of claims 1-7 is disposed in the main tank body; each of the electroplating tanks is disposed on the side of one of the upper anodes; the electroplating solution in each of the electroplating tanks is maintained at a second preset height.

9. The horizontal electroplating equipment according to claim 8, characterized in that, The upper plated anode and the conductive roller are located on the same side of the target object.

10. The horizontal electroplating equipment according to claim 8, characterized in that, If there are at least two electroplating tanks, the distance between the same position of adjacent electroplating tanks shall not be greater than the size of the target object in the transmission direction, so that the target object is always in contact with the conductive roller during the electroplating process.

11. The horizontal electroplating apparatus of claim 8, wherein, Also includes: A transfer component is disposed within the main tank; the transfer component applies a force to the electroplating solution to cause the electroplating solution to flow along a predetermined transfer direction.

12. The horizontal electroplating equipment according to claim 11, characterized in that, The top of the transmission component is located at a height lower than the liquid level of the electroplating solution in the main tank.

13. The horizontal electroplating apparatus of claim 8, wherein, Also includes: A secondary tank is located below the main tank; the secondary tank is connected to a flow guiding structure to store the electroplating solution flowing in from the electroplating tank.

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