Wiring circuit board

Abstract

The wiring circuit board (1) includes a wiring portion (3A) and a support portion (2A) for supporting one end of the wiring portion (3A). The wiring portion (3A) includes a first insulating layer (12) and wirings (133A, 133B). The width (W21) of the wiring (133A) is greater than the width (W22) of the wiring (133B).

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] Previously, a wiring circuit board was proposed which has a plurality of wiring elements arranged side by side with spacing between them (for example, see Patent Document 1 below).

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2019-212656 Summary of the Invention The problem that the invention aims to solve In the wiring circuit board as described in Patent Document 1, there is a need to further increase the degree of freedom in circuit design.

[0004] This invention provides a wiring circuit board that enables greater freedom in circuit design.

[0005] Technical solutions for solving the problem The present invention [1] includes a wiring circuit board comprising: a wiring portion; and a support portion supporting one end of the wiring portion, the wiring portion comprising: an insulating layer; a first wiring disposed on one side of the insulating layer in the thickness direction; and a second wiring disposed on one side of the insulating layer in the thickness direction and disposed separately from the first wiring in a width direction orthogonal to the thickness direction, the width of the first wiring being greater than the width of the second wiring.

[0006] According to this structure, the wiring section has a first wiring and a second wiring. The width of the first wiring is greater than the width of the second wiring.

[0007] That is, it is possible to configure two types of wiring (a first wiring and a second wiring) with different widths in a single wiring section.

[0008] Therefore, in a wiring circuit board with wiring section and support section, the degree of freedom in circuit design can be increased.

[0009] The present invention [2] includes the wiring circuit board of [1] above, wherein the wiring portion further comprises a metal support layer, the metal support layer being disposed on the other side of the insulating layer in the thickness direction, the first wiring having a first outer edge in the width direction and a first inner edge disposed between the first outer edge and the second wiring, the second wiring having a second outer edge in the width direction and a second inner edge disposed between the second outer edge and the first wiring, wherein when the center of the region between the first outer edge and the second outer edge in the width direction is set as a first center and the center of the metal support layer in the width direction is set as a second center, the first center is disposed between the second center and the first outer edge in the width direction.

[0010] According to this structure, the first center is offset towards the first outer edge relative to the second center in the width direction.

[0011] Therefore, even when the width of the metal support layer is limited, a narrow second wiring can be reliably configured inside the metal support layer.

[0012] As a result, the second wiring can be reliably supported using a metal support layer.

[0013] The present invention [3] includes the wiring circuit board of [1] or [2] above, wherein the wiring portion further comprises a metal support layer, the metal support layer is disposed on the other side of the insulating layer in the thickness direction, and all of the first wiring in the wiring portion and all of the second wiring in the wiring portion overlap with the metal support layer in the thickness direction.

[0014] With this structure, both the first wiring and the second wiring can be reliably supported by a metal support layer.

[0015] The present invention [4] includes the wiring circuit board of [2] or [3] above, wherein the metal support layer has one end and another end in the thickness direction, and the width of the metal support layer increases from the other end toward the one end.

[0016] With this structure, even when the width of the metal support layer is limited, the first wiring and the second wiring can be reliably supported by one end of the metal support layer in the thickness direction.

[0017] The present invention [5] includes the wiring circuit board of [2] or [3] above, wherein the metal support layer has one end and another end in the thickness direction, and the width of the one end and the width of the other end are greater than the width of the metal support layer between the one end and the other end.

[0018] This structure increases the rigidity of the metal support layer in the thickness direction, thus enabling more reliable support for both the first and second wiring.

[0019] The present invention [6] includes a wiring circuit board of any one of [2] to [5] above, wherein the width of the metal support layer is smaller than the width of the insulating layer.

[0020] Invention Effects The wiring circuit board according to the present invention enables greater freedom in circuit design. Attached Figure Description

[0021] Figure 1 This is a top view showing one embodiment of the wiring circuit board of the present invention.

[0022] Figure 2 yes Figure 1 The diagram shows a cross-sectional view (AA) of the wiring circuit board.

[0023] Figure 3 This is a cross-sectional view showing a modified example (1) of the wiring circuit board.

[0024] Figure 4 This is a cross-sectional view showing a modified example (3) of the wiring circuit board. Detailed Implementation

[0025] 1. Wiring circuit board like Figure 1 As shown, the wiring circuit board 1 has multiple support portions 2A and 2B, and multiple wiring portions 3A and 3B.

[0026] Support portions 2A and 2B are arranged spaced apart from each other in a first direction. Each support portion 2A and 2B extends along a second direction, which is orthogonal to the first direction. The shapes of support portions 2A and 2B are not limited. Support portion 2A supports one end of each of wiring portions 3A and 3B. Terminals 131A, 131B, 131C, and 131D of the circuit pattern 13 described later may also be arranged in support portion 2A. Support portion 2B supports the other end of each of wiring portions 3A and 3B. Terminals 132A, 132B, 132C, and 132D of the circuit pattern 13 described later may also be arranged in support portion 2B.

[0027] Wiring portions 3A and 3B are disposed between support portion 2A and support portion 2B in a first direction. Wiring portions 3A and 3B are arranged along a second direction. Wiring portion 3B is disposed at a distance from wiring portion 3A in the second direction. At least a portion of wiring 133A (described later) is disposed on wiring portion 3A. Wiring portion 3A has a width in the width direction of wiring 133A and extends in the direction in which wiring 133A extends. In this embodiment, the direction in which wiring 133A extends is the same as the first direction, and the width direction of wiring 133A is the same as the second direction. The direction in which wiring 133A extends may also be different from the first direction. In addition, the width direction of wiring 133A may also be different from the second direction. At least a portion of wiring 133B (described later) is disposed on wiring portion 3B. Wiring portion 3B has a width in the width direction of wiring 133B and extends in the direction in which wiring 133B extends. Wiring portion 3B extends in the same direction as wiring portion 3A. One end of each of wiring portions 3A and 3B is connected to support portion 2A. The other end of each of the wiring portions 3A and 3B is connected to the support portion 2B. The shape of each of the wiring portions 3A and 3B is not limited. Each of the wiring portions 3A and 3B can be straight or curved. The length of each of the wiring portions 3A and 3B can also be longer than the distance between the support portions 2A and 2B in the first direction.

[0028] like Figure 2 As shown, the wiring section 3A includes a metal support layer 11, a first insulating layer 12, a circuit pattern 13, and a second insulating layer 14. In other words, the wiring circuit board 1 includes a metal support layer 11, a first insulating layer 12 (insulating layer), a circuit pattern 13, and a second insulating layer 14.

[0029] (1) Metal support layer The metal support layer 11 supports the first insulating layer 12, the circuit pattern 13, and the second insulating layer 14. The metal support layer 11 is made of metal. Examples of materials for the metal support layer 11 include copper, nickel, cobalt, iron, and alloys thereof. Examples of alloys include stainless steel and copper alloys. Copper alloys are preferred as materials for the metal support layer 11.

[0030] The metal support layer 11 has a side end 11A and a side end 11B in the thickness direction. In this embodiment, the width of the metal support layer 11 increases from the other side end 11B toward the side end 11A. It should be noted that the width of the metal support layer 11 may also be approximately the same from the other side end 11B to the side end 11A.

[0031] The metal support layer 11 of the wiring section 3A is disposed in the central portion of the wiring section 3A in the width direction. The width W1 of one end 11A of the metal support layer 11 of the wiring section 3A is smaller than the width W11 of the first insulating layer 12 of the wiring section 3A. The metal support layer 11 of the wiring section 3A is disposed in the width direction between one end edge E11 and the other end edge E12 of the first insulating layer 12 of the wiring section 3A. The metal support layer 11 of the wiring section 3A is disposed separately from one end edge E11 of the first insulating layer 12 of the wiring section 3A in the width direction. The metal support layer 11 of the wiring section 3A is disposed separately from the other end edge E12 of the first insulating layer 12 of the wiring section 3A in the width direction.

[0032] The thickness T1 of the metal support layer 11 of the wiring section 3A is, for example, 10 μm to 300 μm, preferably 50 μm to 250 μm.

[0033] The width W1 of one end 11A of the metal support layer 11 of the wiring section 3A is, for example, 5μm to 300μm, preferably 10μm to 250μm.

[0034] The ratio (T1 / W1) of the thickness T1 of the metal support layer 11 of the wiring section 3A to the width W1 of one end 11A of the metal support layer 11 of the wiring section 3A is, for example, 2 or more, preferably 5 or more. The ratio (T1 / W1) is, for example, 30 or less, preferably 10 or less. The ratio (T1 / W1) may also be 2 to 30 or 5 to 10.

[0035] It should be noted that the metal support layer 11 may also have a protective metal layer (first protective metal layer). The protective metal layer is disposed on one side surface of the metal support layer 11 in the thickness direction. The protective metal layer protects the metal support layer 11. The protective metal layer is, for example, a sputtered layer. Examples of materials for the protective metal layer include chromium, copper, nickel, titanium, and alloys thereof.

[0036] (2) First insulating layer The first insulating layer 12 is disposed on one side of the metal support layer 11 in the thickness direction. In other words, the metal support layer 11 is disposed on the other side of the first insulating layer 12 in the thickness direction. The first insulating layer 12 is disposed on one surface of the metal support layer 11 in the thickness direction. The first insulating layer 12 is disposed between the metal support layer 11 and the circuit pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal support layer 11 from the circuit pattern 13. The first insulating layer 12 is made of resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0037] (3) Circuit diagram like Figure 1As shown, circuit pattern 13 includes multiple terminals 131A, 131B, 131C, 131D, multiple terminals 132A, 132B, 132C, 132D, and multiple wirings 133A, 133B, 133C, 133D. That is, the wiring circuit board 1 includes wiring 133A (first wiring) and wiring 133B (second wiring). It should be noted that the shape of circuit pattern 13 is not limited.

[0038] Terminals 131A, 131B, 131C, and 131D are disposed on the support portion 2A. Each of terminals 131A, 131B, 131C, and 131D has a square pad shape.

[0039] Terminals 132A, 132B, 132C, and 132D are disposed on the support portion 2B. Each of terminals 132A, 132B, 132C, and 132D has a square pad shape.

[0040] Wiring 133A electrically connects terminal 131A and terminal 132A. One end of wiring 133A is connected to terminal 131A. The other end of wiring 133A is connected to terminal 132A.

[0041] Wiring 133B electrically connects terminal 131B and terminal 132B. One end of wiring 133B is connected to terminal 131B. The other end of wiring 133B is connected to terminal 132B.

[0042] At least a portion of wiring 133A and at least a portion of wiring 133B are disposed in wiring section 3A. That is, wiring section 3A has wiring 133A and wiring 133B. One end of wiring 133A and one end of wiring 133B may also be disposed in support section 2A. The other end of wiring 133A and the other end of wiring 133B may also be disposed in support section 2B.

[0043] Wiring 133C electrically connects terminal 131C and terminal 132C. One end of wiring 133C is connected to terminal 131C. The other end of wiring 133C is connected to terminal 132C.

[0044] Wiring 133D electrically connects terminal 131D and terminal 132D. One end of wiring 133D is connected to terminal 131D. The other end of wiring 133D is connected to terminal 132D.

[0045] At least a portion of wiring 133C and at least a portion of wiring 133D are disposed in wiring section 3B. That is, wiring section 3B has wiring 133C and wiring 133D. One end of wiring 133C and one end of wiring 133D may also be disposed in support section 2A. The other end of wiring 133C and the other end of wiring 133D may also be disposed in support section 2B.

[0046] like Figure 2 As shown, circuit pattern 13 is disposed on one side of the first insulating layer 12 in the thickness direction. Circuit pattern 13 is disposed on one surface of the first insulating layer 12 in the thickness direction. Circuit pattern 13 is disposed on the opposite side of the metal support layer 11 in the thickness direction relative to the first insulating layer 12.

[0047] It should be noted that the circuit pattern 13 may also have a protective metal layer (second protective metal layer). The protective metal layer is disposed on one side surface of the first insulating layer 12 in the thickness direction. The protective metal layer protects the circuit pattern 13. The protective metal layer is, for example, a sputtered layer. Examples of materials for the protective metal layer include chromium, copper, nickel, titanium, and alloys thereof.

[0048] (4) Second insulating layer The second insulating layer 14 is disposed on one side of the first insulating layer 12 in the thickness direction. The second insulating layer 14 is disposed on one surface of the first insulating layer 12 in the thickness direction. The second insulating layer 14 covers all wirings 133A, 133B, 133C, and 133D. It should be noted that the second insulating layer 14 does not cover terminals 131A, 131B, 131C, 131D, 132A, 132B, 132C, and 132D. The second insulating layer 14 is made of resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0049] 2. Details of the cabling department Next, refer to Figure 2 The details of wiring section 3A will be explained. Wiring section 3B has the same structure as wiring section 3A. Therefore, the description of wiring section 3B will be omitted.

[0050] As described above, the wiring section 3A has wiring 133A and wiring 133B.

[0051] Wiring 133A is disposed on one side of the first insulating layer 12 in the thickness direction. Wiring 133A is disposed on one side surface of the first insulating layer 12 in the thickness direction. Wiring 133A is disposed on the opposite side of the metal support layer 11 in the thickness direction relative to the first insulating layer 12.

[0052] Width W21 of wiring 133A is greater than width W22 of wiring 133B. It should be noted that the thickness of wiring 133A is the same as the thickness of wiring 133B. Therefore, a larger current than that of wiring 133B can flow through wiring 133A. Width 133A may also be thicker than wiring 133B.

[0053] Specifically, the width W21 of wiring 133A is, for example, 10μm to 25μm, preferably 15μm to 20μm. The width W22 of wiring 133B is, for example, 5μm to 20μm, preferably 8μm to 17μm. The thickness of wiring 133A and wiring 133B is, for example, 1μm to 20μm, preferably 5μm to 15μm.

[0054] Wiring 133A has a first outer edge E21 and a first inner edge E22 in the width direction.

[0055] The first outer edge E21 is one side edge of the wiring 133A in the width direction. The first outer edge E21 is positioned one side further than one side edge E1 of the metal support layer 11 in the width direction. In other words, the first outer edge E21 is positioned opposite to the other side edge E2 of the metal support layer 11 in the width direction. That is, the first outer edge E21 is positioned outside the metal support layer 11 in the width direction. The first outer edge E21 does not overlap with the metal support layer 11 in the thickness direction. Therefore, the width W21 of the wiring 133A can be ensured to extend to the outside of the metal support layer 11.

[0056] The ratio (D1 / W21) of the distance D1 in the width direction between one side edge E1 and the first outer edge E21 of the metal support layer 11 to the width W21 of the wiring 133A is, for example, 1 / 20 or more, preferably 1 / 10 or more. If the ratio (D1 / W21) is above the aforementioned lower limit, the width W21 of the wiring 133A can be further ensured. The ratio (D1 / W21) is, for example, less than 2 / 3, preferably less than 1 / 2. If the ratio (D1 / W21) is below the aforementioned upper limit, the wiring 133A can be reliably supported by the metal support layer 11.

[0057] The first inner edge E22 is the other edge of the wiring 133A in the width direction. The first inner edge E22 is disposed between the first outer edge E21 and the wiring 133B in the width direction. The first inner edge E22 is disposed on the other side of one edge E1 of the metal support layer 11 in the width direction. In other words, the first inner edge E22 is disposed between one edge E1 and the other edge E2 of the metal support layer 11 in the width direction. That is, the first inner edge E22 is disposed inside the metal support layer 11 in the width direction. The first inner edge E22 overlaps with the metal support layer 11 in the thickness direction. Therefore, the wiring 133A can be supported by the metal support layer 11.

[0058] The ratio (D2 / W21) of the distance D2 in the width direction between one side edge E1 and the first inner edge E22 of the metal support layer 11 to the width W21 of the wiring 133A is, for example, 1 / 3 or more, preferably greater than 1 / 2. If the ratio (D2 / W21) is above the lower limit mentioned above, the wiring 133A can be reliably supported by the metal support layer 11. The ratio (D2 / W21) is, for example, less than 1 / 1, preferably 19 / 20 or less, more preferably 9 / 10 or less. If the ratio (D2 / W21) is below the upper limit mentioned above, the width W21 of the wiring 133A can be further ensured.

[0059] Wiring 133B is disposed on one side of the first insulating layer 12 in the thickness direction. Wiring 133B is disposed on one surface of the first insulating layer 12 in the thickness direction. Wiring 133B is disposed on the opposite side of the metal support layer 11 in the thickness direction relative to the first insulating layer 12. Wiring 133B is disposed on the other side of wiring 133A in the width direction. Wiring 133B is disposed separately from wiring 133A in the width direction. The entire wiring 133B is disposed between one end edge E1 and the other end edge E2 of the metal support layer 11 in the width direction. That is, the entire wiring 133B is disposed inside the metal support layer 11 in the width direction. The entire wiring 133B overlaps with the metal support layer 11 in the thickness direction.

[0060] Wiring 133B has a second outer edge E31 and a second inner edge E32 in the width direction. The second outer edge E31 is the other edge of wiring 133B in the width direction. The second outer edge E31 is positioned in the width direction closer to the other edge E2 of the metal support layer 11. The second outer edge E31 overlaps with the metal support layer 11 in the thickness direction. The second inner edge E32 is one edge of wiring 133B in the width direction. The second inner edge E32 is positioned in the width direction between the second outer edge E31 and wiring 133A. The second inner edge E32 overlaps with the metal support layer 11 in the thickness direction. Therefore, wiring 133B can be supported by the metal support layer 11.

[0061] The ratio (D3 / W1) of the distance D3 between the first outer edge E21 and the second outer edge E31 relative to the width W1 of one side end 11A of the metal support layer 11 is, for example, 3.0 or less, preferably 2.0 or less. If the ratio (D3 / W1) is below the aforementioned upper limit, the width W21 of the wiring 133A can be ensured, and the two wirings 133A and 133B can be reliably supported by the metal support layer 11. The ratio (D3 / W1) is, for example, 1.0 or more, preferably 1.5 or more.

[0062] When the center of the region between the first outer edge E21 and the second outer edge E31 is designated as the first center C1 in the width direction, and the center of the metal support layer 11 in the width direction is designated as the second center C2, the first center C1 is disposed between the second center C2 and the first outer edge E21 in the width direction. That is, the first center C1 and the second center C2 are not the same. The first center C1 is offset towards the first outer edge E21 in the width direction relative to the second center C2. As a result, the wiring 133B can be disposed inside the metal support layer 11.

[0063] The ratio (D4 / D3) of the distance D4 between the first central edge C1 and the second central edge C2 to the distance D3 between the first outer edge E21 and the second outer edge E31 is, for example, 1 / 3 or less, preferably 1 / 4 or less. If the ratio (D4 / D3) is below the aforementioned upper limit, it is possible to prevent the first outer edge E21 from being excessively positioned outside the metal support layer 11. Thus, even when the width W21 of the wiring 133A is greater than the width W22 of the wiring 133B, the metal support layer 11 can reliably support both wiring 133A and wiring 133B. The ratio (D4 / D3) is, for example, 1 / 20 or more, preferably 1 / 10 or more.

[0064] The ratio (W22 / W1) of the width W22 of the wiring 133B to the width W1 of one end 11A of the metal support layer 11 is, for example, 2 / 3 or less, preferably 1 / 2 or less. If the ratio (W22 / W1) is below the aforementioned upper limit, the wiring 133B can be disposed inside the metal support layer 11, and the wiring 133B can be reliably supported by the metal support layer 11. The ratio (W22 / W1) is, for example, 1 / 10 or more, preferably 1 / 5 or more.

[0065] 3. Effects (1) According to the wiring circuit board 1, such as Figure 2 As shown, the wiring section 3A has wiring 133A and wiring 133B. The width W21 of wiring 133A is greater than the width W22 of wiring 133B.

[0066] That is, two types of cabling 133A and 133B with different widths can be configured in a single cabling section 3A.

[0067] Therefore, in the wiring circuit board 1 which has a wiring section 3A and a support section 2A, it is possible to increase the degree of freedom in circuit design.

[0068] (2) According to the wiring circuit board 1, such as Figure 2As shown, the first central C1 is disposed between the second central C2 and the first outer edge E21 in the width direction. That is, the first central C1 is offset towards the first outer edge E21 in the width direction relative to the second central C2.

[0069] Therefore, even when the width of the metal support layer 11 is limited, the wiring 133B with a small width W22 can be reliably configured inside the metal support layer 11.

[0070] As a result, the wiring 133B can be reliably supported by the metal support layer 11.

[0071] (3) According to the wiring circuit board 1, such as Figure 2 As shown, the width of the metal support layer 11 increases from the other end 11B toward the other end 11A.

[0072] Therefore, even when the width of the metal support layer 11 is limited, the wiring 133A and wiring 133B can be reliably supported by one end 11A in the thickness direction of the metal support layer 11.

[0073] 4. Variations Next, modified examples will be described. In the modified examples, the same symbols are used to mark the same components as in the implementation method, and the descriptions are omitted.

[0074] (1) such as Figure 3 As shown, the width W1 of one end 11A in the thickness direction of the metal support layer 11 can also be greater than the distance D3 between the first outer edge E21 and the second outer edge E31. In this case, the first outer edge E21 and the second outer edge E31 can also overlap with the metal support layer 11 in the thickness direction. In other words, all of the wiring 133A and all of the wiring 133B in the wiring section 3A can also overlap with the metal support layer 11 in the thickness direction. Thus, the metal support layer 11 can reliably support both wiring 133A and wiring 133B. In addition, the first center C1 can also coincide with the second center C2.

[0075] (2) The first central C1 may also be disposed between the second central C2 and the second outer edge E31 in the width direction. That is, the first central C1 may also be offset relative to the second central C2 towards the second outer edge E31 in the width direction.

[0076] (3) such as Figure 4As shown, the cross-sectional shape of the metal support layer 11 can also be approximately I-shaped. Specifically, the width W1 of one end 11A and the width W2 of the other end 11B of the metal support layer 11 are greater than the width W3 of the metal support layer 11 between one end 11A and the other end 11B. It should be noted that the width W1 of one end 11A of the metal support layer 11 can be different from or the same as the width W2 of the other end 11B of the metal support layer 11.

[0077] According to this modified example, the rigidity of the metal support layer 11 can be increased in the thickness direction. Therefore, the wiring 133A and wiring 133B can be supported more reliably. As a result, when an external force is applied to the wiring portion 3A, stress concentration in wiring 133A and wiring 133B can be suppressed. Consequently, crack formation in wiring 133A and wiring 133B can be suppressed.

[0078] (4) In the variations (1) to (3), the same effect as the above-described embodiments can also be obtained.

[0079] It should be noted that the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that are obvious to those skilled in the art are included within the scope of protection of the technical solutions described below.

[0080] Industrial availability The wiring circuit board of the present invention can be used for the connection of electronic components.

[0081] Symbol Explanation 1: Wiring circuit board 2A: Support section 3A: Cabling Department 11: Metal support layer 11A: One end of the metal support layer in the thickness direction 11B: The other end in the thickness direction of the metal support layer 12: First insulating layer (insulating layer) 133A: Wiring (First Wiring) E21: First outer edge E22: First inner edge W21: Width of the first wiring 133B: Wiring (Second Wiring) E31: Second outer edge E32: Second inner edge W22: Width of the second wiring C1: First Central C2: Second Central W1: Width of one end of the metal support layer in the thickness direction W2: Width of the other end in the thickness direction of the metal support layer W3: Width of the metal support layer between one end and the other end.

Claims

1. A wiring circuit board comprising: a wiring portion; and a support portion supporting one end of the wiring portion. The wiring section includes: Insulating layer; A first wiring is disposed on one side of the insulating layer in the thickness direction of the insulating layer; as well as A second wiring is disposed on one side of the insulating layer in the thickness direction and is disposed separately from the first wiring in the width direction orthogonal to the thickness direction. The width of the first wiring is greater than the width of the second wiring.

2. The wiring circuit board according to claim 1, wherein, The wiring section further includes a metal support layer, which is disposed on the other side of the insulating layer in the thickness direction. The first wiring has a first outer edge in the width direction and a first inner edge disposed between the first outer edge and the second wiring. The second wiring has a second outer edge in the width direction and a second inner edge disposed between the second outer edge and the first wiring. When the center of the region between the first outer edge and the second outer edge is designated as the first center in the width direction, and the center of the metal support layer in the width direction is designated as the second center, the first center is disposed between the second center and the first outer edge in the width direction.

3. The wiring circuit board according to claim 1, wherein, The wiring section further includes a metal support layer, which is disposed on the other side of the insulating layer in the thickness direction. All of the first wiring in the wiring section and all of the second wiring in the wiring section overlap with the metal support layer in the thickness direction.

4. The wiring circuit board according to claim 2 or 3, wherein, The metal support layer has one end and another end in the thickness direction. The width of the metal support layer increases as it moves from the other end toward the first end.

5. The wiring circuit board according to claim 2 or 3, wherein, The metal support layer has one end and another end in the thickness direction. The width of one end and the width of the other end are greater than the width of the metal support layer between the one end and the other end.

6. The wiring circuit board according to claim 2 or 3, wherein, The width of the metal support layer is smaller than the width of the insulating layer.

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