Circuit board, image sensor module, lens driving device, and camera module

Abstract

This application discloses a circuit board, an image sensor module, a lens driving device, and a camera module. The circuit board includes an insulating portion and a patterned portion. The insulating portion includes a first insulating region and a second insulating region, separated by a separation region. The patterned portion includes a first patterned portion and a second patterned portion. The first patterned portion includes a first terminal portion, a second terminal portion, and a connecting portion disposed on the separation region and connecting the terminal portions. The separation region includes a first corner portion to a fourth corner portion, and the connecting portion includes a first connecting portion to a fourth connecting portion, each of the first to fourth corner portions including a bent portion. The insulating portion also includes an organic material layer disposed on the separation region and covering the upper, lower, and side surfaces of the metal layer of each of the first to fourth connecting portions, thereby insulating the first to fourth connecting portions.

Description

[0001] This application is a divisional application of Chinese patent application No. 202210425542.8, entitled "Circuit Board, Image Sensor Module, Lens Driving Device and Camera Module".

[0002] Cross-reference to related applications

[0003] This application claims priority and benefit to Korean Patent Application No. 10-2021-0051997, filed April 21, 2021; Korean Patent Application No. 10-2021-0065557, filed May 21, 2021; and Korean Patent Application No. 10-2021-0067575, filed May 26, 2021, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0004] The implementation involves a circuit board, an image sensor module, a lens driving device, and a camera module including the same. Background Technology

[0005] The camera module is driven by an actuator based on sensor shifting or module tilting methods. Due to the actuator's structure, the image sensor and sensor substrate are separated from other structures. Therefore, the camera module has a structure in which heat generated from the image sensor and sensor substrate cannot be transferred to the outside. Consequently, the problem with the camera module is that the surface temperature of the image sensor and sensor substrate continuously increases.

[0006] Furthermore, the substrate used to shift the sensor of the camera module (e.g., an interposer) contacts the image sensor or sensor substrate. However, the contact area between the sensor shifting substrate and the image sensor and sensor substrate is very small. Therefore, there is a problem of low heat dissipation efficiency of the camera module.

[0007] Furthermore, when the image sensor size is small, the heat generated by the image sensor is not a major issue. However, the size of image sensors in recent camera modules has increased due to increased resolution. Moreover, as the size of the image sensor increases, reliability issues caused by the heat generated by the image sensor also increase.

[0008] Therefore, a basic solution to this problem is needed. Summary of the Invention

[0009] Technical issues

[0010] The embodiments provide a circuit board, an image sensor module, a lens driving device, and a camera module including the like that can improve the drivability of an image sensor.

[0011] Furthermore, the embodiments provide circuit boards, image sensor modules, lens driving devices, and camera modules including the like that can improve the heat dissipation characteristics of image sensors.

[0012] Furthermore, the embodiments provide a circuit board capable of preventing oxidation of the patterned portions, an image sensor module, a lens driving device, and a camera module including the same.

[0013] Furthermore, the embodiments provide circuit boards, image sensor modules, lens driving devices, and camera modules including the same, which can improve the electrical reliability of the patterned portions.

[0014] Furthermore, the embodiments provide circuit boards, image sensor modules, lens drive devices, and camera modules including the insulating portions and patterned portions that can improve the adhesion between the insulating portions and patterned portions.

[0015] The technical problems to be solved by the proposed embodiments are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art to which the proposed embodiments belong based on the following description.

[0016] Technical solution

[0017] A circuit board according to an embodiment includes: an insulating portion; and a patterned portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region and a second insulating region, the second insulating region being disposed outside the first insulating region and spaced apart from the first insulating region, and having a separation region between the first insulating region and the second insulating region; wherein the patterned portion includes: a first patterned portion for signal transmission; and a second patterned portion, the second patterned portion including a pseudo-pattern separate from the first patterned portion; wherein the first patterned portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connecting portion disposed on the separation region and connecting the first terminal portion and the second terminal portion; wherein the second patterned portion includes: a second-first patterned portion disposed on the first insulating region; and a second-second patterned portion disposed on the second insulating region and separate from the second-first patterned portion.

[0018] Furthermore, the second-first pattern portion is disposed on the central region of the upper surface of the first insulating region, and the first terminal portion is disposed on the edge region of the upper surface of the first insulating region other than the central region.

[0019] Furthermore, the first insulating region includes a first terminal opening portion that overlaps with the first terminal portion in the vertical direction, wherein a portion of the first terminal portion is disposed on the first insulating region; and wherein the remaining portion of the first terminal portion is disposed on the first terminal opening portion.

[0020] Furthermore, the second insulating region includes a second terminal opening portion that overlaps with the second terminal portion in the vertical direction, wherein a portion of the second terminal portion is disposed on the second insulating region; and wherein the remaining portion of the second terminal portion is disposed on the second terminal opening portion.

[0021] Furthermore, at least one of the first terminal opening portion and the second terminal opening portion is not connected to the separation area of ​​the insulating portion.

[0022] In addition, the first insulating region includes a fixed pad opening portion which is disposed adjacent to and spaced apart from the first terminal opening portion.

[0023] In addition, the fixed pad opening is connected to the separation area.

[0024] In addition, the first insulating region includes: a first portion that overlaps in the vertical direction with a first terminal portion of the first pattern portion and a second-first pattern portion of the second pattern portion; and a second portion other than the first portion.

[0025] In addition, the second insulating region includes: a third portion that overlaps in the vertical direction with the second terminal portion of the first pattern portion and the second-second pattern portion of the second pattern portion; and a fourth portion other than the third portion.

[0026] Additionally, the separation region includes a first corner portion to a fourth corner portion, wherein the connecting portion includes a first connecting portion to a fourth connecting portion, the first connecting portion to the fourth connecting portion including a curved portion disposed on each of the first corner portion to the fourth corner portion, and wherein the first connecting portion to the fourth connecting portion extends in the same direction from one end connected to the first terminal portion and connects to the second terminal portion.

[0027] Furthermore, the first insulating region includes a first-first side region to a first-fourth side region, wherein the first terminal portion includes a first-first terminal to a first-fourth terminal disposed on each of the first-first side region to the first-fourth side region, wherein the second insulating region includes a second-first side region to a second-fourth side region facing each of the first-first side region to the first-fourth side region of the first insulating region; and wherein the second terminal portion includes a second-first terminal to a second-fourth terminal disposed on each of the second-first side region to the second-fourth side region.

[0028] Furthermore, the first-first terminal to the first-fourth terminal are respectively disposed adjacent to different corner portions of the first corner portion to the fourth corner portion of the separation region, and wherein the second-first terminal to the second-fourth terminal are respectively disposed adjacent to different corner portions of the first corner portion to the fourth corner portion of the separation region.

[0029] Furthermore, each of the first to fourth connecting portions is bent counterclockwise from the end connected to the first terminal portion to connect to the second terminal portion.

[0030] Furthermore, the first connection portion includes one end connected to the first terminal and the other end connected to the second terminal not facing the first terminal, wherein the second connection portion includes one end connected to the first terminal and the other end connected to the second terminal not facing the first terminal, wherein the third connection portion includes one end connected to the first terminal and the other end connected to the second terminal not facing the first terminal, and wherein the fourth connection portion includes one end connected to the first terminal and the other end connected to the second terminal not facing the first terminal.

[0031] Furthermore, each of the first to fourth connecting portions includes an inner connecting portion and an outer connecting portion, the inner connecting portion being disposed within an open area that exposes a portion of each of the first to fourth corner portions, the outer connecting portion being disposed outside the open area, and wherein the number of inner connecting portions differs from the number of outer connecting portions.

[0032] Furthermore, the number of bends in the inner connection portion is the same as the number of bends in the outer connection portion.

[0033] On the other hand, the image sensor module according to the embodiment includes: a first substrate; a second substrate disposed on the first substrate; and an image sensor disposed on the second substrate; wherein the first substrate includes: an insulating portion including a first insulating region and a second insulating region, the second insulating region being disposed outside the first insulating region and spaced apart from the first insulating region, and having a separation region between the first insulating region and the second insulating region; a first pattern portion including a first terminal portion disposed on the first insulating region, a second terminal portion disposed on the second insulating region, and a connecting portion disposed on the separation region to connect the first terminal portion and the second terminal portion; and a second pattern portion including a second-first pattern portion and a second-second pattern portion, the second-first pattern portion being spaced apart from the first terminal portion on the first insulating region, and the second-second pattern portion being spaced apart from the second terminal portion on the second insulating region and separated from the second-first pattern portion, wherein the second substrate includes: a pad connected to the first terminal portion of the first substrate; and a via through the second substrate, wherein the via is connected to the second-first pattern portion, and an adhesive member is inserted between the via and the second-first pattern portion.

[0034] Furthermore, the first insulating region of the first substrate includes a via formed in a region that overlaps with the second-first pattern portion in the vertical direction and passes through the first insulating region; and wherein the first substrate includes: an adhesive layer disposed in the via; and a heat dissipation portion attached to the first substrate via the adhesive layer.

[0035] Furthermore, the planar area of ​​the second-first patterned portion is greater than the planar area of ​​the first insulating region of the first substrate.

[0036] In addition, at least a portion of the heat dissipation portion is disposed in a through hole formed in the first insulating region.

[0037] On the other hand, a circuit board according to another embodiment includes: an insulating portion; and a patterned portion disposed on the insulating portion, wherein the insulating portion includes a first insulating region and a second insulating region, the second insulating region being disposed outside the first insulating region and spaced apart from the first insulating region, and a separation region being present between the first insulating region and the second insulating region, wherein the patterned portion includes: a first patterned portion for signal transmission; and a second patterned portion, the second patterned portion including a pseudo-pattern separate from the first patterned portion, wherein the first patterned portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connecting portion disposed on the separation region and connecting the first terminal portion and the second terminal portion, wherein each of the first terminal portion, the second terminal portion and the connecting portion includes a metal layer and a plating layer formed on at least one surface of the metal layer, and wherein the average size of the plating particles of the plating layer has a range of 0.8 μm to 5.15 μm.

[0038] In addition, the metal layer includes a rolled copper foil alloy.

[0039] In addition, the coating particles include binary or ternary composite elements selected from Cu, Ni, Co, Mn and Al.

[0040] In addition, the difference between the first plating particle with the largest size and the second plating particle with the smallest size in the plating particles constituting the plating layer is 7.0 μm or less.

[0041] In addition, the area per unit area (1μm) of the coating layer 2 The surface area of ​​the coated particles in the sample is 0.5 μm. 2 Or larger.

[0042] In addition, the centerline average surface roughness (Ra) of the coating ranges from 0.05 μm to 1.5 μm, and the 10-point average surface roughness (Rz) of the coating ranges from 0.6 μm to 15 μm.

[0043] In addition, the peel strength (90° peel strength) between the plating layer and the insulation is 50 gf / mm or greater.

[0044] In addition, each of the first terminal portion, the second terminal portion, and the connecting portion includes a surface treatment layer disposed on the metal layer and the plating layer.

[0045] In addition, the surface treatment layer of the connecting part is generally applied to the upper and side surfaces of the metal layer of the connecting part, as well as the side and lower surfaces of the plating layer of the connecting part.

[0046] Furthermore, a surface treatment layer is disposed on the upper surface and side surface of the metal layer of the first terminal portion, and on a portion of the lower surface of the metal layer of the first terminal portion.

[0047] Furthermore, the lower surface of the metal layer of the first terminal portion includes a first-first lower surface that overlaps with the first insulating region in the thickness direction and a first-second lower surface other than the first-first lower surface, wherein a surface treatment layer of the first terminal portion is disposed on the first-second lower surface of the metal layer of the first terminal portion.

[0048] Furthermore, the lower surface of the metal layer of the second terminal portion includes a second-first lower surface that overlaps with the second insulating region in the thickness direction and a second-second lower surface other than the second-first lower surface, wherein a surface treatment layer of the second terminal portion is disposed on the second-second lower surface of the metal layer of the second terminal portion.

[0049] In addition, the circuit board also includes a second pattern portion disposed on an insulating portion and separated from the first pattern portion. The first pattern portion is a pattern portion for signal transmission, and the second pattern portion is a pseudo-pattern portion. The second pattern portion includes a metal layer, a plating layer, and a surface treatment layer corresponding to the first pattern portion.

[0050] Furthermore, the surface treatment layer of each of the first terminal portion, the second terminal portion, and the connecting portion includes a first surface treatment portion disposed on the metal layer of each of the first terminal portion, the second terminal portion, and the connecting portion, and a second surface treatment portion disposed on the plating layer of each of the first terminal portion, the second terminal portion, and the connecting portion.

[0051] On the other hand, a circuit board according to another embodiment includes: an insulating portion; and a patterned portion disposed on the insulating portion, wherein the insulating portion includes a first insulating region and a second insulating region, the second insulating region being disposed outside the first insulating region and spaced apart from the first insulating region, and a separation region being present between the first insulating region and the second insulating region, wherein the patterned portion includes: a first patterned portion for signal transmission; and a second patterned portion, the second patterned portion including a pseudo-pattern separate from the first patterned portion, wherein the first patterned portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connecting portion disposed on the separation region and connecting the first terminal portion and the second terminal portion, wherein each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer and formed of at least one of an organic material, an inorganic material, and an organic-inorganic composite.

[0052] In addition, the surface treatment layer of the connecting part is uniformly applied to the upper, side, and lower surfaces of the metal layer of the connecting part.

[0053] Furthermore, a surface treatment layer is disposed on the upper surface and side surface of the metal layer of the first terminal portion, and on a portion of the lower surface of the metal layer of the first terminal portion.

[0054] Furthermore, the lower surface of the metal layer of the first terminal portion includes a first-first lower surface that overlaps with the first insulating region in the thickness direction and a first-second lower surface other than the first-first lower surface, wherein a surface treatment layer of the first terminal portion is disposed on the first-second lower surface of the metal layer of the first terminal portion.

[0055] Furthermore, a surface treatment layer is disposed on the upper surface and side surface of the metal layer of the second terminal portion, and on a portion of the lower surface of the metal layer of the second terminal portion.

[0056] Furthermore, the lower surface of the metal layer of the second terminal portion includes a second-first lower surface that overlaps with the second insulating region in the thickness direction and a second-second lower surface other than the second-first lower surface, wherein a surface treatment layer of the second terminal portion is disposed on the second-second lower surface of the metal layer of the second terminal portion.

[0057] In addition, the surface treatment layer contains alkyl imidazole.

[0058] In addition, the circuit board includes a second patterned portion disposed on an insulating portion and separated from the first patterned portion, the first patterned portion being a patterned portion for signal transmission, and the second patterned portion being a pseudo-patterned portion, and the second patterned portion including a metal layer and a surface treatment layer corresponding to the first patterned portion.

[0059] Furthermore, the surface treatment layer of each of the first terminal portion, the second terminal portion, and the connecting portion includes a first surface treatment portion disposed on the metal layer of each of the first terminal portion, the second terminal portion, and the connecting portion; and a second surface treatment portion disposed on the plating layer of each of the first terminal portion, the second terminal portion, and the connecting portion.

[0060] Furthermore, the first surface treatment portion includes a metal element that is different from the metal element constituting the second surface treatment portion.

[0061] Beneficial effects

[0062] The lens driving device of this embodiment includes a sensor portion and a circuit board for moving an image sensor connected to the sensor portion. The circuit board may be an interposer. The sensor portion includes a sensor substrate connected to the circuit board and an image sensor mounted on the sensor substrate. In this case, the sensor substrate includes pads electrically connected to the circuit board and fixing pads other than the pads. In this case, the circuit board may include an opening into which the fixing pads of the sensor substrate are inserted.

[0063] Therefore, the fixing pads of this embodiment can be inserted into the opening during the soldering process between the circuit board and the sensor substrate. This allows for easier alignment between the circuit board and the sensor substrate during the soldering process.

[0064] Furthermore, the implementation method can limit the movement of the sensor substrate while the circuit board and the sensor substrate are aligned. Therefore, the implementation method can solve the problem of positional misalignment between the circuit board and the sensor substrate that occurs during the soldering process. This improves manufacturability.

[0065] The implementation method can also improve the electrical connection between the sensor substrate and the circuit board. Therefore, the implementation method can improve product reliability.

[0066] Furthermore, the circuit board of this embodiment includes an insulating portion and a patterned portion. The insulating portion includes a first insulating region, a second insulating region, and a separation region between the first and second insulating regions. The patterned portion includes a first terminal portion disposed on the first insulating region for connection to a sensor substrate, a second terminal portion disposed on the second insulating region for connection to a main substrate, and a connecting portion disposed on the separation region and connecting the first and second terminal portions. In this case, the connecting portion includes a bent portion disposed at each corner of the separation region. In this case, each of the bent portions of the connecting portion is bent by rotating in the same direction at the corner. Therefore, the bending structure of the connecting portion can improve the mobility of the circuit board to the sensor portion. Furthermore, this embodiment can improve the accuracy of the moving position of the sensor portion.

[0067] Furthermore, the curved portion of the connecting part in the embodiment includes a first open area, which exposes a portion of each corner of the separating area. In this case, the first open area may be formed at a position where it overlaps with the protrusion of the second frame constituting the first moving part in the optical axis direction. Additionally, the connecting part includes an inner connecting portion disposed within the first open area and an outer connecting portion disposed outside the first open area while avoiding it. In this case, the number of inner connecting portions may be less than the number of outer connecting portions.

[0068] Therefore, by making the number of outer connecting portions located outside the first open area greater than the number of inner connecting portions located inside the first open area, the mobility of the first moving portion can be increased. For example, when the number of outer connecting portions is greater than the number of inner connecting portions, the amount of movement of the first moving portion can be easily adjusted compared to the opposite case. For example, the outer connecting portions are located outside the first open area and have a longer length than the inner connecting portions. Furthermore, since the length of the outer connecting portions is greater than the length of the inner connecting portions, the intensity of the driving force required to move the first moving portion can be reduced compared to the inner connecting portions. Therefore, the mobility of the first moving portion in the embodiment can be improved by the difference in the number of inner and outer connecting portions. In addition, the amount of movement of the first moving portion can be finely adjusted.

[0069] Furthermore, each of the outer and inner connecting portions in the embodiment includes multiple bends. In this case, the number of bends in the outer connecting portion can be the same as the number of bends in the inner connecting portion. Additionally, the mobility of the first moving portion can be increased by the same number of bends.

[0070] For example, when the number of bends in the outer connecting part differs from the number of bends in the inner connecting part, the force will concentrate on the connecting part with a relatively larger number of bends. Therefore, the following problem arises: the connecting part where the force is concentrated breaks off before the other connecting parts. Furthermore, the accuracy of movement of the first moving part may be compromised.

[0071] Conversely, when the first moving part moves, since the number of bending points is the same, the force applied to the inner and outer connecting parts in this embodiment can be evenly distributed. Therefore, in this embodiment, the force can be evenly distributed to the inner and outer connecting parts. Thus, this embodiment can solve the problem of cutting off a specific connecting part first. Furthermore, even when the connecting part is cut off, the inner and outer connecting parts in this embodiment can be cut off simultaneously.

[0072] Meanwhile, the implementation includes an adhesive layer disposed in a through-hole passing through a first insulating region of the circuit board, and a heat dissipation portion attached to the circuit board via the adhesive layer. Furthermore, the heat dissipation portion can dissipate heat generated from the sensor substrate.

[0073] Therefore, the implementation method can improve heat dissipation characteristics by dissipating the heat generated by the image sensor to the outside. Thus, the implementation method can improve the operational reliability of the image sensor. Furthermore, the implementation method can improve the quality of images acquired from the image sensor.

[0074] Furthermore, the patterned portion of the embodiment includes a metal layer and a surface treatment layer disposed on the metal layer. The surface treatment layer may be a thin film layer formed by coating an organic material. In this case, the dielectric constant (εr) of the organic material is 3.24. This value is significantly lower than the dielectric constant (εr) of nickel or gold (Au) in a normal surface treatment layer. That is, the dielectric constant (εr) of nickel or gold (Au) is 4 or higher.

[0075] Therefore, this embodiment can improve the signal transmission speed of wiring that varies inversely with the relative permittivity of the surface treatment layer. Consequently, this embodiment can improve the product reliability of the circuit board.

[0076] Furthermore, the organic material used in the surface treatment layer of this embodiment has a higher thermal conductivity than nickel. Therefore, this embodiment can increase the thermal conductivity of the patterned portion.

[0077] In particular, the heat dissipation characteristics of electronic products including camera modules are a major issue because they affect product performance. That is, components included in camera modules have structures that facilitate heat dissipation. Therefore, efforts are being made to improve the heat dissipation characteristics of camera modules. In this case, this embodiment can increase the thermal conductivity of the patterned portions through an organic coating. Therefore, this embodiment can improve the heat dissipation characteristics of the circuit board and the heat dissipation characteristics of the camera module using the circuit board.

[0078] Furthermore, in this embodiment, the patterned portion is part of the configuration of the first moving portion of the camera module. Therefore, the patterned portion can move along with the first moving portion. Additionally, when the first moving portion moves, the patterned portion may come into contact with other components. In this case, electrical reliability issues may arise when the patterned portion comes into contact with other components.

[0079] In this embodiment, the conductivity of the organic material in the surface treatment layer is lower than that of nickel or gold. Therefore, the surface treatment layer can perform an insulating function when the patterned portion comes into contact with other components. Thus, this embodiment can improve the electrical reliability of the circuit board. Furthermore, this embodiment simplifies the plating process by applying an organic coating method, further reducing plating costs.

[0080] On the other hand, the patterned portion of this embodiment includes a plating layer disposed between the metal layer and the surface treatment layer. The plating layer can improve the peel strength between the patterned portion and the insulating portion.

[0081] In this case, the plating layer has a surface roughness. Even as the surface roughness of the plating layer increases, the adhesion between the plating layer and the insulating portion decreases. Therefore, this embodiment improves adhesion by controlling the size of the plating particles constituting the plating layer.

[0082] For example, the average value of the plated particles in the coating layer of this embodiment ranges from 0.8 μm to 5.15 μm. Furthermore, in this embodiment, the difference between the first plated particle with the largest size and the second plated particle with the smallest size in the coating layer is 7.0 μm or less. Additionally, the unit area (1 μm) of the coating layer... 2 The surface area of ​​the coated particles in the coating can be 0.5 μm. 2 Or greater. Furthermore, the average surface roughness (Ra) of the centerline of the coating layer is in the range of 0.05 μm to 1.5 μm. Furthermore, the average surface roughness (Rz) of the coating layer at 10 points is in the range of 0.6 μm to 15 μm. Therefore, this embodiment can further improve the adhesion between the patterned portion and the insulating portion. Furthermore, the peel strength (90° peel strength) between the patterned portion and the insulating portion in this embodiment is 50 gf / mm or greater. Therefore, this embodiment can solve the reliability problem of separation between the patterned portion and the insulating portion in an environment where a camera module is used. Furthermore, this embodiment can improve the operational reliability of the camera module's autofocus or image stabilization functions. Attached Figure Description

[0083] Figure 1 This is an exploded perspective view of the lens driving device according to an embodiment.

[0084] Figure 2 This is a perspective view of the main substrate of the lens driving device according to an embodiment.

[0085] Figure 3 This is a bottom view of the sensor substrate in the embodiment.

[0086] Figure 4a This is an exploded perspective view of the substrate according to the embodiment.

[0087] Figure 4b yes Figure 4a A plan view of the insulating part.

[0088] Figure 4c yes Figure 4a A plan view of the patterned portion.

[0089] Figure 4d yes Figure 4c An enlarged view of the pattern portion.

[0090] Figure 4e This is a plan view of the substrate in the embodiment.

[0091] Figure 4f This is a coupling diagram of the substrate and the sensor substrate in the implementation method.

[0092] Figure 5a This is a cross-sectional view of the image sensor module according to the first embodiment.

[0093] Figure 5b It is shown Figure 5a A view of a modified example of the image sensor module.

[0094] Figure 6 This is a cross-sectional view showing the image sensor module according to the second embodiment.

[0095] Figure 7 This is a view showing an image sensor module according to a third embodiment.

[0096] Figure 8a This is a view used to illustrate the layer structure of the pattern portion according to the first embodiment.

[0097] Figure 8b It is shown Figure 8a A view of the chemical reaction formula of the surface treatment layer.

[0098] Figure 8c It is shown Figure 8a A view of the surface of the surface treatment layer.

[0099] Figure 9a This is a view used to illustrate the layer structure of the pattern portion according to the second embodiment.

[0100] Figure 9b yes Figure 9b Enlarged view of the connecting part.

[0101] Figure 9c It is shown Figure 9a A view of the second surface treatment portion of the surface treatment layer.

[0102] Figure 10 This is a view used to illustrate the surface roughness of the metal layer and plating layer of the patterned portion according to the embodiment.

[0103] Figures 11a to 11e This is a view used to illustrate the relationship between the plating conditions and adhesion of the plating layer according to the embodiment.

[0104] Figures 12a to 12e These are SEM images showing the surfaces of the coating layers according to the first to fifth coating conditions.

[0105] Figure 13a and Figure 13b This is a view showing histograms of the plating particle sizes of the plating layers according to the first to fifth plating conditions.

[0106] Figure 14 It is a graph showing the relationship between the surface area and peel strength of the coated particles according to the embodiment.

[0107] Figure 15 It is a mobile terminal that uses a camera module according to the implementation method.

[0108] Figure 16 This is a perspective view of a vehicle using a camera module according to the implementation method. Detailed Implementation

[0109] In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0110] However, the spirit and scope of the present invention are not limited to the parts of the described embodiments, and can be implemented in various other forms. Furthermore, one or more elements of the embodiments can be selectively combined and substituted within the spirit and scope of the present invention.

[0111] Furthermore, unless otherwise explicitly defined and described, the terminology (including technical and scientific terms) used in the embodiments of this invention may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in commonly used dictionaries may be interpreted as having a meaning consistent with their meaning in the context of the relevant field. Moreover, the terminology used in the embodiments of this invention is for describing the implementation methods and is not intended to limit the invention.

[0112] In this specification, unless explicitly stated otherwise, the singular form may also include the plural form, and when described in “at least one (or more) of A (and) B and C,” the singular form may include at least one of all combinations that may include combinations of A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b) may be used to describe elements of embodiments of the invention.

[0113] These terms are used only to distinguish an element from other elements, and they do not limit the nature, order, or sequence of the elements. Furthermore, when an element is described as being “connected,” “coupled,” or “in contact” with another element, it can include not only cases where the element is directly “connected,” “coupled,” or “in contact” with other elements, but also cases where the element is “connected,” “coupled,” or “in contact” with another element between the element and other elements.

[0114] Furthermore, when described as being formed or positioned "above" or "below" in each element, "above" or "below" can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or positioned between two elements. Additionally, when expressed as "above" or "below," based on an element, it can include not only the upward direction but also the downward direction.

[0115] The configuration of the camera module will be described below with reference to the accompanying drawings.

[0116] Figure 1 This is an exploded perspective view of the lens driving device according to the embodiment. Figure 2 This is a perspective view of the main substrate of the lens driving device according to the embodiment. Figure 3 This is a bottom view of the sensor substrate according to an embodiment.

[0117] Reference Figures 1 to 3 The lens driving device may include a fixed portion 100, a first movable portion 200, a second movable portion 300, a guide member 400, a first elastic member 500, a second elastic member 600, and a substrate 700. The substrate 700 may be an intermediary. The substrate 700 may be coupled to the first movable portion 200. For example, the substrate 700 may be coupled to the sensor portion 240 of the first movable portion 200. Furthermore, the substrate 700 may be electrically connected between the fixed portion 100 and the sensor portion 240. Additionally, the substrate 700 allows the sensor portion 240 to move relative to the fixed portion 100. For example, the substrate 700 may elastically support the sensor portion 240 while being electrically connected between the sensor portion 240 and the fixed portion 100, such that the sensor portion 240 is movable relative to the fixed portion 100. This will be described in more detail below.

[0118] The lens drive device can be a voice coil motor (VCM). It can also be a lens drive motor. Furthermore, it can be a lens drive actuator. It may include an autofocus (AF) module. It may also include an optical insulator (OIS) module.

[0119] The fixed portion 100 can refer to a portion within the components of the lens driving device that has a fixed position. For example, the position of the fixed portion 100 can be fixed during OIS operation or AF operation of the lens driving device. The fixed portion 100 can be configured to surround the exterior of the first moving portion 200. The fixed portion 100 can be spaced apart from the first moving portion 200. Preferably, the fixed portion 100 can be in a fixed position when the first moving portion 200 moves during OIS operation of the lens driving device. Furthermore, the fixed portion 100 can be in a fixed position when the second moving portion 300 moves during AF operation of the lens driving device. The fixed portion 100 may include a main substrate 110, a first frame 120, and a first driving member 130.

[0120] The first movable part 200 can be disposed within the internal space of the fixed part 100. The first movable part 200 can also be disposed within the internal space of the fixed part 100, spaced apart from the first movable part 200.

[0121] The first moving portion 200 can move relative to the fixed portion 100 within the internal space of the fixed portion 100. For example, the first moving portion 200 can rotate about a first axis. For example, the first moving portion 200 can perform a yaw operation to rotate about an x-axis corresponding to the first axis. For example, the first moving portion 200 can rotate based on a second axis perpendicular to the first axis. For example, the first moving portion 200 can perform a pitch operation to rotate about a y-axis corresponding to the second axis. Specifically, the first moving portion 200 can be an OIS module for OIS operation. Here, rotation can include declining or tilting. The first moving portion 200 can include a second frame 210, a sub-frame 220, a second drive member 230, and a sensor portion 240.

[0122] The second moving portion 300 may be disposed within the internal space of the first moving portion 200. The second moving portion 300 may move relative to the fixed portion 100 and the first moving portion 200. For example, the second moving portion 300 may move based on a third axis. For example, the second moving portion 300 may perform an autofocus operation to move along the z-axis (or optical axis) corresponding to the third axis. Specifically, the second moving portion 300 may be an AF module for AF operation. The second moving portion 300 may include a third frame 310, a lens 320, and a third drive member 330.

[0123] The guide member 400 may be a rolled member. For example, the guide member 400 may include multiple balls. The guide member 400 may be disposed between the fixed portion 100 and the first moving portion 200. The guide member 400 may guide the first moving portion 200 to move relative to the fixed portion 100. The guide member 400 may include an upper guide member 410 and a lower guide member 420.

[0124] The first elastic member 500 may be a pressing member. The first elastic member 500 may correspond to the guide member 400. The first elastic member 500 may be configured to correspond to the number of balls constituting the guide member 400. The first elastic member 500 may be disposed on the fixed portion 100. The first elastic member 500 may press against the guide member 400. Specifically, the first elastic member 500 includes a coupling region coupled to the fixed portion 100. Furthermore, the first elastic member 500 may include a contact region extending from the coupling region to contact the guide member 400. Additionally, the contact region of the first elastic member 500 may be elastic. Therefore, the guide member 400 can be pressed in the z-axis direction. The first elastic member 500 may include a first upper elastic member 510 and a first lower elastic member 520.

[0125] The second elastic member 600 can elastically couple the second movable portion 300 to the first movable portion 200. For example, the second elastic member 600 elastically supports the second movable portion 300 relative to the first movable portion 200, such that the second movable portion 300 is movable within the internal space of the first movable portion 200. Therefore, in the state of being elastically coupled to the first movable portion 200, the second movable portion 300 can move in the z-axis direction corresponding to the optical axis by the elastic force of the second elastic member 600. The second elastic member 600 may include a second upper elastic member 610 and a second lower elastic member 620.

[0126] The substrate 700 can electrically connect the fixed portion 100 and the first movable portion 200 to each other. In this case, the substrate 700 can be elastically connected such that the first movable portion 200 is movable relative to the fixed portion 100. The substrate 700 may include a 'patterned portion' that elastically bends when the first movable portion 200 moves in the electrically connected state between the fixed portion 100 and the first movable portion 200. For example, the substrate 700 may be referred to as an "intermediate" disposed between the fixed portion 100 and the sensor portion 240 of the first movable portion 200. For example, the substrate 700 may be referred to as a "sensor moving substrate" that allows the sensor portion 240 of the first movable portion 200 to move relative to the fixed portion 100.

[0127] The fixed portion 100 may include a main substrate 110. The main substrate 110 may also be referred to as a 'first substrate'. The main substrate 110 may be coupled to the first frame 120. The main substrate 110 may be a board electrically connected to an external device. Here, the external device may be a power supply unit and / or control unit of an optical device. The main substrate 110 may be disposed below the first frame 120. The main substrate 110 may include a connector 115 for connecting to the external device.

[0128] The main substrate 110 may include an opening that overlaps with the first moving portion 200 and the second moving portion 300 in the optical axis direction. The main substrate 110 may include pads 114 disposed on its upper surface adjacent to the opening 111. The pads 114 may be formed around the upper surface of the main substrate 110 and adjacent to the opening 111. The pads 114 of the main substrate 110 may be electrically connected to a coil portion (not shown) of the first driving member 130. Specifically, the pads 114 of the main substrate 110 may be electrically connected to the coil substrate (not shown) of the first driving member 130.

[0129] The main substrate 110 may include a first driver IC 112. The first driver IC 112 may be connected to a driving component. Here, the driving component may be a coil portion.

[0130] The first driver IC 112 can be electrically connected to a Hall sensor (not shown). The Hall sensor can detect the position of a moving part that is moved by a drive member. Furthermore, the first driver IC 112 can supply current to the coil portion to control the rotation of the first moving part 200 based on the x-axis or y-axis. Additionally, the first driver IC 112 can adjust the direction or intensity of the current applied to the coil portion 132 based on the position value sensed by the Hall sensor (not shown).

[0131] The main substrate 110 may include a gyroscope sensor 113. The gyroscope sensor 113 can detect hand-shake information. For example, the gyroscope sensor 113 can detect the movement of a user using a camera module equipped with a lens drive.

[0132] On the other hand, the lower surface of the main substrate 110 may include additional pads 116. The pads 116 disposed on the lower surface of the main substrate 110 may be electrically connected to the substrate 700, which will be described later.

[0133] The first moving part 200 may include a sensor part 240.

[0134] The sensor portion 240 can be coupled to the second frame 210. That is, the sensor portion 240 can rotate together with the second frame 210 along the x-axis or y-axis. The sensor portion 240 may include a sensor substrate 241.

[0135] The sensor substrate 241 may include pads.

[0136] For example, pads coupled to substrate 700 may be provided on the lower surface of sensor substrate 241. Specifically, the pads connected to substrate 700 may be formed on the edge of the lower surface of sensor substrate 241.

[0137] For example, a first pad 241-1 can be formed on a first region of the lower surface of the sensor substrate 241. For example, a second pad 241-2 can be formed on a second region of the lower surface of the sensor substrate 241 facing the first region. For example, a third pad 241-3 can be formed on a third region between the first and second regions of the lower surface of the sensor substrate 241. Furthermore, a fourth pad 241-4 can be formed on a fourth region of the lower surface of the sensor substrate 241 facing the third region.

[0138] Each of the first pad 241-1, the second pad 241-2, the third pad 241-3, and the fourth pad 241-4 can be configured to be offset toward one side of the first to fourth regions on the lower surface of the sensor substrate 241.

[0139] For example, a first pad 241-1 may be disposed in a first region on the lower surface of the sensor substrate 241 and adjacent to a fourth region. For example, a second pad 241-2 may be disposed in a second region on the lower surface of the sensor substrate 241 and adjacent to a third region. For example, a third pad 241-3 may be disposed in a third region on the lower surface of the sensor substrate 241 and adjacent to a first region. For example, a fourth pad 241-4 may be disposed in a fourth region on the lower surface of the sensor substrate 241 and adjacent to a second region. Therefore, this embodiment can improve the mobility of the first moving portion 200.

[0140] For example, the pads of the sensor substrate 241 may have a form that rotates in a clockwise or counterclockwise direction (e.g., an form that is offset to one side in a clockwise or counterclockwise direction). This may correspond to the arrangement structure of the patterned portion of the substrate 700.

[0141] The pads formed on the lower surface of the sensor substrate 241 can be electrically connected to the first terminal portion 721-1 of the substrate 700. For example, the pads of the sensor substrate 241 and the first terminal portion 721-1 of the substrate 700 can be coupled by soldering.

[0142] On the other hand, in addition to signal transmission, the pads of the sensor substrate 241 also improve the ease of coupling between the sensor substrate 241 and the substrate 700.

[0143] For example, the pads of the sensor substrate 241 include electrical pads electrically connected to the patterned portion of the substrate 700. Furthermore, the pads of the sensor substrate 241 include pads electrically disconnected from the patterned portion of the substrate 700. These electrically disconnected pads are fixing pads used to secure the sensor substrate 241 to the substrate 700 during the soldering process.

[0144] For example, the first pad 241-1 includes a first-first pad 241-1a electrically connected to a patterned portion of the substrate 700. Multiple first-first pads 241-1a can be configured. Furthermore, the first pad 241-1 may include first-second pads 241-1b that are not electrically connected to a patterned portion of the substrate 700. Although the first-second pad 241-1b is shown as a single pad in the drawings, this embodiment is not limited to this. For example, multiple first-second pads 241-1b can be configured. And when multiple first-second pads 241-1b are configured, all of the multiple first-second pads 241-1b can be arranged on one side of the first-first pad 241-1a. Alternatively, when multiple first-second pads 241-1b are configured, the multiple first-second pads 241-1b can be arranged on one side and the other side of the first pad 241-1, respectively. The first-first pad 241-1a and the first-second pad 241-1b are functionally separate and can be formed from the same metal material. For example, the first-first pad 241-1a and the first-second pad 241-1b can be formed simultaneously.

[0145] For example, the second pad 241-2 includes a second-first pad 241-2a electrically connected to a patterned portion of the substrate 700. Multiple second-first pads 241-2a can be configured. Furthermore, the second pad 241-2 may include a second pad 241-2b not electrically connected to the patterned portion of the substrate 700. Multiple second-second pads 241-2b can also be configured.

[0146] Meanwhile, the third pad 241-3 may consist only of pads electrically connected to the patterned portion of the substrate 700. Similarly, the fourth pad 241-4 may consist only of pads electrically connected to the patterned portion of the substrate 700. However, the third pad 241-3 and the fourth pad 241-4 may include pads corresponding to the first pad 241-1 and the second pad 241-2, as well as fixed pads.

[0147] First and second pads 241-1b and second and second pads 241-2b can be formed to facilitate soldering operations between the substrate 700 and the sensor substrate 241. For example, the first and second pads 241-1b and second and second pads 241-2b can align the patterned portion of the substrate 700 with the pads of the sensor substrate 241. For example, the first and second pads 241-1b and second and second and second pads 241-2b can guide the alignment position between the substrate 700 and the sensor substrate 241.

[0148] For example, in a comparative example excluding the first-second pad 241-1b and the second-second pad 241-2b, difficulties may arise in the soldering process for bonding the substrate 700 and the sensor substrate 241. For instance, the soldering process in the comparative example must be performed by aligning the plurality of pads on the sensor substrate 241 with the patterned portions of the substrate 700, respectively. Furthermore, in the comparative example, positional misalignment between the sensor substrate 241 and the substrate 700 may occur during the soldering process.

[0149] In contrast, when performing the soldering process between the substrate 700 and the sensor substrate 241, the first-second pad 241-1b and the second-second pad 241-2b in this embodiment can be inserted into the fixed pad opening portion of the substrate 700. This facilitates the alignment of the substrate 700 and the sensor substrate 241. Furthermore, the movement of the sensor substrate 241 in this embodiment can be restricted by the first-second pad 241-1b and the second-second pad 241-2b. For example, the movement of the first-second pad 241-1b and the second-second pad 241-2b can be restricted when inserted into the fixed pad opening portion of the substrate 700. Therefore, this embodiment solves the problem of positional misalignment that occurs during soldering. Thus, this embodiment improves operability. Furthermore, this embodiment improves the electrical connection between the sensor substrate 241 and the substrate 700 and product reliability.

[0150] <Substrate for motion image sensors>

[0151] Figure 4a This is an exploded perspective view of the substrate according to the embodiment. Figure 4b yes Figure 4a A plan view of the insulating part. Figure 4c yes Figure 4a A plan view of the patterned portion. Figure 4d yes Figure 4c An enlarged view of the pattern section. Figure 4e This is a plan view of the substrate in the embodiment, and Figure 4f This is a coupling diagram of the substrate and the sensor substrate in the embodiment.

[0152] In the following text, reference will be made to Figures 4a to 4f The substrate 700 and its electrical connection structure according to an embodiment are described.

[0153] The substrate 700 according to this embodiment includes an insulating portion 710 and a patterned portion 720. Furthermore, according to this embodiment, the substrate 700 may also include a connecting spring portion 800.

[0154] The insulating portion 710 may include a first insulating region 711 and a second insulating region 712 spaced apart from the first insulating region 711. Furthermore, the insulating portion 710 may include a separation region 713 between the first insulating region 711 and the second insulating region 712.

[0155] For example, the first insulating region 711 and the second insulating region 712 may be spaced apart from each other, with a separation region 713 positioned between the first insulating region 711 and the second insulating region 712. For example, the second insulating region 712 may be positioned around the outer side of the first insulating region 711. The first insulating region 711 and the second insulating region 712 may have various shapes, such as square, circular, elliptical, and polygonal.

[0156] The first insulating region 711 may correspond to the sensor substrate 241. The second insulating region 712 may correspond to the main substrate 110. For example, the first insulating region 711 may overlap with the sensor substrate 241 in the optical axis direction. The second insulating region 712 may overlap with the main substrate 110 in the optical axis direction.

[0157] The first insulating region 711 and the second insulating region 712 can be separated from each other. Another insulating region of the insulating portion may not exist between the first insulating region 711 and the second insulating region 712. The first insulating region 711 and the second insulating region 712 can be separated from each other at spaced-apart locations. Therefore, this embodiment can improve the mobility of the sensor driving device. Here, the mobility of the sensor driving device can include tilt characteristics along the x, y, and z axes, as well as offset characteristics in the x, y, and z axis directions. Specifically, the intensity of the driving force required to move the first moving portion in this embodiment can be reduced by the separation structure of the first insulating region and the second insulating region. That is, in this embodiment, the first insulating region 711 can move freely together with the first moving portion without being interfered with by the second insulating region 712.

[0158] The first insulating region 711 may include a first portion 711a and a second portion 711b. The first portion 711a may be the central region of the first insulating region 711. The second portion 711b may be the edge region of the first insulating region 711 surrounding the first portion 711a. Preferably, the first portion 711a may be the portion that overlaps with the second-first pattern portion 722-1 of the second pattern portion 722 in the vertical direction or optical axis direction. The second portion 711b may be the portion that does not overlap with the second-first pattern portion 722-1 of the second pattern portion 722 in the vertical direction or optical axis direction. That is, the first insulating region 711 may have a wider width than the second-first pattern portion 722-1. Therefore, at least a portion of the first insulating region 711 may not overlap with the second-first pattern portion 722-1 in the vertical direction or optical axis direction.

[0159] The second insulating region 712 may include a third portion 712a and a fourth portion 712b. The third portion 712a may be the central region of the second insulating region 712. The fourth portion 712b may be the edge region of the second insulating region 712 surrounding the third portion 712a. Preferably, the third portion 712a may be the portion that overlaps with the second-second pattern portion 722-2 of the second pattern portion 722 in the vertical direction or optical axis direction. The fourth portion 712b may be the portion that does not overlap with the second-second pattern portion 722-2 of the second pattern portion 722 in the vertical direction or optical axis direction. That is, the second insulating region 712 may have a wider width than the second-second pattern portion 722-2. Therefore, at least a portion of the second insulating region 712 may not overlap with the second-second pattern portion 722-2 in the vertical direction or optical axis direction.

[0160] The first insulating region 711 may include a plurality of openings. The first insulating region 711 may include a first terminal opening. For example, the first insulating region 711 may include a first terminal opening that exposes a first terminal portion 721.

[0161] The first terminal opening may be formed in a plurality of first side regions of the first insulating region 711. For example, the first insulating region 711 may include a plurality of first side regions. For example, the first insulating region 711 may include a first-first side region R1-1. For example, the first insulating region 711 may include a first-second side region R1-2 opposite to the first-first side region R1-1. For example, the first insulating region 711 may include a first-third side region R1-3 between the first-first side region R1-1 and the first-second side region R1-2. For example, the first insulating region 711 may include a first-fourth side region R1-4 opposite to the first-third side region R1-3.

[0162] The first terminal opening portion may include a first-first terminal opening portion 711-1 formed in a first-first side region R1-1 of the first insulating region 711. For example, the first terminal opening portion may include a first-second terminal opening portion 711-2 formed in a first-second side region R1-2 of the first insulating region 711. For example, the first terminal opening portion may include a first-third terminal opening portion 711-3 formed in a first-third side region R1-3 of the first insulating region 711. For example, the first terminal opening portion may include a first-fourth terminal opening portion 711-4 formed in a first-fourth side region R1-4 of the first insulating region 711.

[0163] The first-first-terminal opening 711-1 may expose a portion of the first terminal portion 721-1. For example, the first-first-terminal opening 711-1 may expose a portion of the first-first-terminal 721-1a of the first terminal portion 721-1. That is, the first-first-terminal 721-1a of the first terminal portion 721-1 includes a first region disposed on the first insulating region 711 and a second region disposed on the first-first-terminal opening 711-1. The first-first-terminal opening 711-1 may overlap with the first pad 241-1 of the sensor substrate 241 in the optical axis direction. The first-first-terminal opening 711-1 may improve the soldering manufacturability between the first-first-terminal 721-1a of the first terminal portion 721-1 and the first pad 241-1 of the sensor substrate 241. For example, the alignment between the first-first-terminal 721-1a of the first terminal portion 721-1 and the first pad 241-1 of the sensor substrate 241 can be inspected from both the upper and lower sides of the substrate 700. Furthermore, this embodiment enables connection testing between the substrate 700 and the sensor substrate 241 while the camera module is being manufactured. For example, the lower surface of the first-first terminal 721-1a exposed through the first-first terminal opening 711-1 can also be used as a test pad for testing mutual electrical connectivity.

[0164] The first-first terminal opening 711-1 may have a closed-loop shape. For example, the first-first terminal opening 711-1 may not be connected to the separation region 713. For example, the separation region 713 and the first-first terminal opening 711-1 may be spaced apart from each other. For example, the first-first terminal opening 711-1 and the separation region 713 may be separated by a first insulating region 711. Therefore, a portion of the first insulating region 711 may be disposed between the first-first terminal opening 711-1 and the separation region 713. A portion of the first insulating region 711 may be a region in which a portion of the first-first terminal 721-1a of the first terminal portion 721-1 is disposed. For example, a portion of the first insulating region 711 may be a support region supporting a portion of the first-first terminal 721-1a of the first terminal portion 721-1. However, because the first-first terminal opening 711-1 has a closed-loop shape, the reliability of the substrate 700 in the embodiment can be further improved.

[0165] That is, when the first-first terminal opening portion 711-1 has an open-loop shape, the reliability of the substrate 700 may be reduced. For example, when the first-first terminal opening portion 711-1 has an open-loop shape, an electrical short circuit may occur when the first moving portion 200 is moved relative to the fixed portion 100 by the lens driving device. For example, when the first moving portion 200 moves, the connecting portion 721-3 bends elastically. At this time, when the first-first terminal opening portion 711-1 has an open-loop shape, the connecting portion 721-3 may contact the first-first terminal 721-1a provided in the first-first terminal opening portion 711-1. Therefore, an electrical short circuit may occur. Therefore, in this embodiment, the first-first terminal opening portion 711-1 has a closed-loop shape. Therefore, even when the connecting portion 721-3 of the patterned portion 720 bends, the contact between the first-first terminal 721-1a and the connecting portion 721-3 can be blocked. Therefore, this embodiment can improve electrical reliability and operational reliability. Furthermore, when the first-first terminal opening portion 711-1 is coupled to the sensor substrate 241, the sensor substrate 241 can also be arranged upside down. For example, in the first embodiment, the pads of the sensor substrate 241 can be provided on the first pattern portion 721 and the second pattern portion 722. Alternatively, in the second embodiment, the first pattern portion 721 and the pads of the sensor substrate 241 can be arranged facing each other, with the insulating portion 710 placed between the first pattern portion 721 and the pads of the sensor substrate 241. For example, in the second embodiment, the first pattern portion 721 and the pads of the sensor substrate 241 can be arranged directly facing each other, with the first-first terminal opening portion 711-1 placed between the first pattern portion 721 and the pads of the sensor substrate 241. Therefore, the soldering process in the second embodiment can be performed by applying adhesive to the first-first terminal opening portion 711-1.

[0166] The first-second terminal opening 711-2 can be formed in the first-second side region R1-2 of the first insulating region 711, exposing a portion of the patterned portion 720. For example, the first-second terminal opening 711-2 can expose a portion of the first-second terminal 721-1b of the first terminal portion 721-1. That is, a portion of the first-second terminal 721-1b of the first terminal portion 721-1 is disposed on the first insulating region 711, and the remaining portion of the first-second terminal 721-1b of the first terminal portion 721-1 can be exposed through the first-second terminal opening 711-2. The first-second terminal opening 711-2 can improve the soldering manufacturability between the first-second terminal 721-1b of the first terminal portion 721-1 and the second pad 241-2 of the sensor substrate 241. Furthermore, the first-second terminal opening 711-2 can be formed for testing between the first-second terminal 721-1b of the first terminal portion 721-1 and the second pad 241-2 of the sensor substrate 241.

[0167] The first-second terminal opening portion 711-2 may have the same closed-loop shape as the first-first terminal opening portion 711-1.

[0168] Meanwhile, the first-second terminal opening 711-2 can be configured to face the first-first terminal opening 711-1. For example, the first-second terminal opening 711-2 can be configured to face the first-first terminal opening 711-1 in the x-axis direction. However, the first-first terminal opening 711-1 and the first-second terminal opening 711-2 can be configured to be offset from each other about the x-axis. For example, the center of the first-first terminal opening 711-1 can be configured to be offset from the center of the first-second terminal opening 711-2 about the x-axis.

[0169] For example, the first-first terminal opening portion 711-1 can be configured to be offset along the -y axis direction in the first-first side region R1-1 of the first insulating region 711. For example, the first-second terminal opening portion 711-2 can be configured to be offset along the +y axis direction in the first-second side region R1-2 of the first insulating region 711.

[0170] Furthermore, a first-third terminal opening 711-3 is formed in the first-third side region R1-3 of the first insulating region 711. The first-third terminal opening 711-3 can expose a portion of the first-third terminal 721-1c of the first terminal portion 721-1. That is, a portion of the first-third terminal 721-1c of the first terminal portion 721-1 is disposed on the first insulating region 711, and the remaining portion of the first-third terminal 721-1c of the first terminal portion 721-1 can be exposed through the first-third terminal opening 711-3. The first-third terminal opening 711-3 can improve the soldering manufacturability between the first-third terminal 721-1c of the first terminal portion 721-1 and the third pad 241-3 of the sensor substrate 241. Furthermore, the first-third terminal opening 711-3 can be formed for testing between the first-third terminal 721-1c of the first terminal portion 721-1 and the third pad 241-3 of the sensor substrate 241.

[0171] The first-third terminal opening portion 711-3 has the same closed-loop shape as the first-first terminal opening portion 711-1 and the first-second terminal opening portion 711-2.

[0172] The first-fourth terminal opening 711-4 is formed in the first-fourth side region R1-4 of the first insulating region 711. The first-fourth terminal opening 711-4 can expose a portion of the first-fourth terminal 721-1d of the first terminal portion 721-1 of the patterned portion 720. That is, a portion of the first-fourth terminal 721-1d of the first terminal portion 721-1 is disposed on the first insulating region 711, and the remaining portion of the first-fourth terminal 721-1d of the first terminal portion 721-1 can be exposed through the first-fourth terminal opening 711-4. The first-fourth terminal opening 711-4 can improve the soldering manufacturability between the first-fourth terminal 721-1d of the first terminal portion 721-1 and the fourth pad 241-4 of the sensor substrate 241. In addition, the first-fourth terminal opening 711-4 can be formed for testing between the first-fourth terminal 721-1d of the first terminal portion 721-1 and the fourth pad 241-4 of the sensor substrate 241.

[0173] Simultaneously, the first-fourth terminal opening portion 711-4 can be configured to face the first-third terminal opening portion 711-3. The first-fourth terminal opening portion 711-4 can be configured to face the first-third terminal opening portion 711-3 in the y-axis direction. However, the first-third terminal opening portion 711-3 and the first-fourth terminal opening portion 711-4 can be configured to be offset from each other based on the y-axis. For example, the center of the first-third terminal opening portion 711-3 can be offset from the center of the first-fourth terminal opening portion 711-4 about the y-axis. For example, the first-third terminal opening portion 711-3 can be configured to be offset along the +x-axis direction in the first-third side region R1-3 of the first insulating region 711. For example, the first-fourth terminal opening portion 711-4 can be configured to be offset along the -x-axis direction in the first-fourth side region R1-4 of the first insulating region 711, different from the first-third terminal opening portion 711-3.

[0174] Meanwhile, the first insulating region 711 may include a fixed pad opening. The fixed pad opening may be disposed adjacent to the first terminal opening. For example, the first insulating region 711 may include a first fixed pad opening 711-5. The first fixed pad opening 711-5 may be disposed adjacent to the first-first terminal opening 711-1. Furthermore, the first fixed pad opening 711-5 may be spaced apart from the first-first terminal opening 711-1. The first fixed pad opening 711-5 may correspond to a fixed pad of the sensor substrate 241. For example, the first fixed pad opening 711-5 may correspond to the first-second pad 241-1b of the sensor substrate 241. For example, the first fixed pad opening 711-5 may overlap with the first-second pad 241-1b in the optical axis direction. The first fixed pad opening 711-5 may be an insertion portion into which the first-second pad 241-1b of the sensor substrate 241 is inserted when the substrate 700 and the sensor substrate 241 are coupled.

[0175] In this embodiment, the first and second pads 241-1b of the sensor substrate 241 are inserted into the first fixed pad opening 711-5. Therefore, when the sensor substrate 241 and the substrate 700 are coupled, positional alignment is facilitated. Furthermore, the sensor substrate 241 can be fixed to the substrate 700. For example, when the first and second pads 241-1b of the sensor substrate 241 are disposed in the first fixed pad opening 711-5, movement of the first and second pads 241-1b of the sensor substrate 241 can be restricted. Therefore, this embodiment can prevent positional misalignment between the sensor substrate 241 and the substrate 700.

[0176] The first fixed pad opening 711-5 can have an open-loop shape. For example, the first fixed pad opening 711-5 can be connected to the separation region 713. Therefore, this embodiment facilitates the insertion of the first and second pads 241-1b when the sensor substrate 241 and the substrate 700 are coupled. As a result, this embodiment can improve manufacturability.

[0177] On the other hand, in this embodiment, the first fixed pad opening 711-5 is spaced apart from and adjacent to the first terminal opening 411-1. Therefore, this embodiment can improve the strength of the first insulating region 711. For example, the first insulating region 711 includes the first terminal opening 411-1 as described above. Therefore, the strength of the first insulating region 711 can be reduced in the region where the first terminal opening 411-1 is formed. In this case, the first fixed pad opening 711-5 in this embodiment is formed adjacent to the first terminal opening 411-1. Thus, the first second pad 241-1b in this embodiment is provided in the first fixed pad opening 711-5. Therefore, the strength of the first-first side region R1-1 of the first insulating region 711 in this embodiment can be improved by using the first second pad 241-1b. Therefore, this embodiment can improve the operational reliability of the lens driving device.

[0178] Furthermore, the first insulating region 711 may include a second fixed pad opening 711-6. The second fixed pad opening 711-6 may be disposed adjacent to the first-second terminal opening 711-2. Additionally, the second fixed pad opening 711-6 may be spaced apart from the first-second terminal opening 711-2. The second fixed pad opening 711-6 may correspond to the second-second pad 241-2b of the sensor substrate 241. For example, the second fixed pad opening 711-6 may overlap with the second-second pad 241-2b in the optical axis direction. The second fixed pad opening 711-6 may be an insertion portion into which the second-second pad 241-2b is inserted.

[0179] The second fixed pad opening 711-6 may have the same open-loop shape as the first fixed pad opening 711-5. The second fixed pad opening 711-5 is disposed adjacent to the first-second terminal opening 711-2. This improves the strength of the first insulating region 711 with respect to the first-second side region R1-2 in this embodiment.

[0180] On the other hand, this embodiment includes a third fixed pad opening 711-7. The third fixed pad opening 711-7 may be provided adjacent to the first-third terminal opening 711-3 of the first insulating region 711. In this case, the fixed pads of the sensor substrate 241 may not be provided in the third fixed pad opening 711-7. However, the third fixed pad opening 711-7 may be formed to improve the processability of bonding the substrate 700 and the sensor substrate 241. For example, when the substrate 700 and the sensor substrate 241 are coupled without the third fixed pad opening 711-7, the first-second pads 241-1b of the sensor substrate 241 should only be provided in the first fixed pad opening 711-5. Alternatively, as described above, the fixed pad openings in this embodiment are respectively formed in adjacent regions of the first terminal opening. Therefore, the first and second pads 241-2b of the sensor substrate 241 in this embodiment may be coupled to the sensor substrate 241 and the substrate 700 at any of the four fixed pad openings. Therefore, this embodiment can improve the processability of bonding sensor substrate 241 and substrate 700. However, this embodiment is not limited to this, and the third fixed pad opening portion 711-7 can be selectively omitted. Alternatively, the fixed pad of the third pad 241-3 of the sensor substrate 241 can be provided in the third fixed pad opening portion 711-7.

[0181] Furthermore, the first insulating region 711 of this embodiment includes a fourth fixed pad opening portion 711-8. The fourth fixed pad opening portion 711-8 may be disposed adjacent to the first-fourth terminal opening portion 711-4 of the first insulating region 711. The fixed pad may be disposed in the first-fourth terminal opening portion 711-4 to correspond to the third fixed pad opening portion 711-7, or alternatively, the fixed pad may not be disposed.

[0182] Meanwhile, the insulating portion 710 in this embodiment includes a second insulating region 712, which is spaced apart from the first insulating region 711, wherein a separation region 713 is placed between them.

[0183] The second insulating region 712 may include a plurality of second side regions. For example, the second insulating region 712 may include second side regions facing the first side region of the first insulating region 711, with the separating region 713 disposed between them. For example, the second insulating region 712 may include a second-first side region R2-1 facing the first-first side region R1-1 of the first insulating region 711. For example, the second insulating region 712 may include a second-second side region R2-2 facing the first-second side region R1-2 of the first insulating region 711. For example, the second insulating region 712 may include a second-third side region R2-3 facing the first-third side region R1-3 of the first insulating region 711. For example, the second insulating region 712 may include a second-fourth side region R2-4 facing the first-fourth side region R1-4 of the first insulating region 711.

[0184] In addition, the second insulating region 712 may include a second terminal opening portion formed in the second side region.

[0185] For example, the second insulating region 712 may include a second-first terminal opening 712-1 formed in the second-first side region R2-1. The second-first terminal opening 712-1 may expose a portion of the patterned portion 720 disposed on the insulating portion 710. For example, the second-first terminal opening 712-1 may expose a portion of the second terminal portion 721-2 constituting the patterned portion 720. For example, the second-first terminal opening 712-1 may expose a portion of the second-first terminal 721-2a of the second terminal portion 721-2. That is, a portion of the second-first terminal 721-2a of the second terminal portion 721-2 is disposed on the second insulating region 712, and the remaining portion of the second-first terminal 721-2a of the second terminal portion 721-2 can be exposed through the second-first terminal opening 712-1. For example, the second-first terminal 721-2a of the second terminal portion 721-2 may include a portion overlapping the second-first terminal opening 712-1 in the optical axis direction. The second-first terminal opening portion 712-1 can be formed to improve solderability and perform electrical connection tests.

[0186] The second-first terminal opening portion 712-1 can be configured to be offset in one direction within the second-first side region R2-1 of the second insulating region 712. For example, in this embodiment, the second-first terminal opening portion 712-1 can be configured to be offset in the +y axis direction within the second-first side region R2-1 of the second insulating region 712. Therefore, in this embodiment, the arrangement space of the connecting portions 721-3 of the pattern portion 720 in the separation region 713 can be ensured. That is, the pattern portion 720 of this embodiment is connected between the first terminal portion and the second terminal portion disposed in the first insulating region 711 and the second insulating region 712, which do not face each other. At this time, when the second-first terminal opening portion 712-1 is disposed at the center of the second-first side region R2-1 of the second insulating region 712, the density of the connecting portions 721-3 in the separation region between the first-first region R1-1 and the second-first side region R2-1 may increase. Furthermore, when the density of the connecting portions 721-3 increases, problems may occur where different connecting portions 721-3 come into contact or connect with each other during operation of the lens driving device. Furthermore, this may reduce drive reliability. Therefore, as described above, the second-first terminal opening portion 712-1 in this embodiment is configured to be biased in one direction within the second-first side region R2-1 of the second insulating region 712. As a result, this embodiment reduces the density of the connecting portions 721-3 to improve the drive reliability of the lens drive device.

[0187] The second-first terminal opening 712-1 is configured to face the first-first terminal opening 711-1. In this case, the center of the second-first terminal opening 712-1 can be positioned offset along the x-axis relative to the center of the first-first terminal opening 711-1. Furthermore, the second-first terminal opening 712-1 may have a closed-loop shape. According to this embodiment, the short-circuit problem that occurs during operation of the lens drive device through the second terminal opening can be solved. Therefore, this embodiment improves operational reliability.

[0188] Furthermore, a second terminal opening portion having a structure corresponding to the second-first terminal opening portion 712-1 is formed in another second side region of the second insulation region 712.

[0189] For example, a second-second terminal opening 712-2 may be formed in the second-second side region R2-2 of the second insulating region 712. For example, a second-third terminal opening 712-3 may be formed in the second-third side region R2-3 of the second insulating region 712. For example, a second-fourth terminal opening 712-4 may be formed in the second-fourth side region R2-4 of the second insulating region 712.

[0190] Meanwhile, the second insulating region 712 may include a first coupling hole 712-5 formed in the corner region. The first coupling hole 712-5 can be used to couple the second insulating region 712 to other components of the lens driving device.

[0191] On the other hand, the substrate 700 of this embodiment includes a patterned portion 720 disposed on the insulating portion 710. The patterned portion 720 can be functionally divided into a first patterned portion 721 and a second patterned portion 722. The first patterned portion 721 may refer to a signal transmission pattern for electrically connecting the sensor substrate 241 and the main substrate 110. For example, the first patterned portion 721 may be a signal pattern portion. The second patterned portion 722 may be a reinforcing pattern portion for improving the rigidity of the substrate 700. For example, the second patterned portion 722 may be a pseudo-pattern portion that does not transmit electrical signals. For example, the second patterned portion 722 may not be electrically connected to the first patterned portion 721. Therefore, the second patterned portion 722 may not be electrically connected to the sensor substrate 241 and the main substrate 110. However, the embodiment is not limited to this. For example, the second patterned portion 722 may be connected to a ground layer (not shown) included in the sensor substrate 241. For example, the second patterned portion 722 may be connected to a ground layer (not shown) included in the main substrate 110. Therefore, the second patterned portion 722 can dissipate heat generated from the substrate 700 while performing a grounding function.

[0192] The patterned portion 720 may include a conductive metal material. For example, the first patterned portion 721 and the second patterned portion 722 may be formed of the same conductive metal material. However, this embodiment is not limited to this, and the first patterned portion 721 and the second patterned portion 722 may include different metal materials.

[0193] The second pattern portion 722 may include a second-first pattern portion 722-1 and a second-second pattern portion 722-2. The second-first pattern portion 722-1 may be disposed on the first insulating region 711. The second-first pattern portion 722-1 may be disposed in the central region of the upper surface of the first insulating region 711.

[0194] The second-first pattern portion 722-1 may include a second open area OR exposing a portion of the surface of the first insulating region 711. The second-first pattern portion 722-1 may increase the rigidity of the first insulating region 711. Furthermore, a second-second pattern portion 722-2 may be disposed on the second insulating region 712 of the insulating portion 710. The second-second pattern portion 722-2 may be spaced apart from the second-first pattern portion 722-1. The second-second pattern portion 722-2 may increase the rigidity of the second insulating region 712. The second-second pattern portion 722-2 may include a coupling hole (not shown) aligned with a coupling hole 712-5 formed in the second insulating region 712 of the insulating portion 710. Simultaneously, the second-first pattern portion 722-1 may be formed to expose a first terminal opening portion on the first insulating region 711. Furthermore, the second-second pattern portion 722-2 may be formed on the second insulating region 712 to expose a second terminal opening portion.

[0195] The second-first pattern portion 722-1 and the second-second pattern portion 722-2 may have predetermined widths. In this case, the second-first pattern portion 722-1 may be disposed on the first insulating region 711 to have a width smaller than the width of the first insulating region 711. For example, the upper surface of the first insulating region 711 may have a first portion 711a covered by the second-first pattern portion 722-1 and a second portion 711b excluding the first portion 711a. The second portion 711b of the upper surface of the first insulating region 711 may be an edge region of the upper surface of the first insulating region 711. For example, the second-first pattern portion 722-1 may be configured to expose the edge region of the upper surface of the first insulating region 711.

[0196] The second-second pattern portion 722-2 can be disposed on the second insulating region 712 to have a width smaller than the width of the second insulating region 712. For example, the upper surface of the second insulating region 712 may include a third portion 712a covered by the second-second pattern portion 722-2 and a fourth portion 712b excluding the third portion 712a. Furthermore, the fourth portion 712b of the upper surface of the second insulating region 712 may be an edge region of the upper surface of the second insulating region 712. For example, the second-second pattern portion 722-2 may be configured to open the edge region of the upper surface of the second insulating region 712.

[0197] The second-first pattern portion 722-1 and the second-second pattern portion 722-2 can be separated from each other. The second-first pattern portion 722-1 and the second-second pattern portion 722-2 can be connected to each other without being connected by any metal other than the first pattern portion which serves as a signal line. Therefore, this embodiment can improve the mobility of the sensor driving device. Specifically, when the space between the first insulating region 711 and the second insulating region 712 is connected by any metal other than the first pattern portion 721, the movement of the sensor substrate disposed on the first insulating region 711 may be interfered with. Therefore, the mobility of the sensor driving device may be reduced. Therefore, according to the exemplary embodiment, the space between the first insulating region 711 and the second insulating region 712 is not connected by any metal other than the first pattern portion 721. Therefore, the movement accuracy of the first moving portion disposed on the first insulating region 711 in this embodiment can be improved.

[0198] The first pattern portion 721 may be disposed on the insulating portion 710. For example, the first pattern portion 721 may be disposed on the first insulating region 711, the second insulating region 712, and the separation region 713 of the insulating portion 710. The first pattern portion 721 may be electrically insulated from the second pattern portion 722.

[0199] The first pattern portion 721 may include a first terminal portion 721-1, a second terminal portion 721-2, and a connecting portion 721-3.

[0200] The first patterned portion 721 allows the first movable portion 200 to move relative to the fixed portion 100 while electrically connecting the main substrate 110 and the sensor substrate 241. For this purpose, the first patterned portion 721 can be elastic. The first patterned portion 721 can be formed of an alloy including copper (Cu). For example, the first patterned portion 721 can be a binary alloy including at least one of nickel (Ni), tin (Sn), beryllium (Be), and cobalt (Co) from copper (Cu), or it can be a ternary alloy including at least two of the foregoing.

[0201] However, this embodiment is not limited to this. The first patterned portion 721 can be made of an alloy such as iron (Fe), nickel (Ni), zinc, etc., which has good electrical properties and elasticity suitable for use as a spring. Furthermore, the first patterned portion 721 can be surface-treated with a metallic or organic material. Preferably, the first patterned portion 721 can be coated with an organic material.

[0202] Specifically, the first pattern portion 721 may have a specific level or higher of characteristic values ​​that will not break even when the first moving portion 200 moves.

[0203] For example, the first patterned portion 721 may have a tensile strength above a certain level and an offset yield strength of 0.2%. For example, the first patterned portion 721 may have a tensile strength of 500 N / mm². 2 Or even greater tensile strength. For example, the first patterned portion 721 can have 800 N / mm². 2 Or even greater tensile strength. For example, the first patterned portion 721 can have 1000 N / mm². 2 Or even greater tensile strength. For example, the first patterned portion 721 can have 1400 N / mm². 2 Or even greater tensile strength. For example, the first patterned portion 721 can have 500 N / mm². 2 Or a greater 0.2% offset yield strength. For example, the first patterned portion 721 can have 800 N / mm². 2 Or a greater 0.2% offset yield strength. For example, the first patterned portion 721 can have 1000 N / mm². 2 Or a greater 0.2% offset yield strength. For example, the first patterned portion 721 can have 1400 N / mm². 2 Or 0.2% greater offset yield strength.

[0204] Meanwhile, the first patterned portion 721 includes a surface that contacts the first insulating region 711 and the second insulating region 712. For example, a portion of the first terminal portion 721-1 and a portion of the second terminal portion 721-2 of the first patterned portion 721 contact the first insulating region 711 and the second insulating region 712. In this case, the reliability of the substrate 700 can be determined based on the roughness of the contact surfaces.

[0205] At this time, when the average surface roughness (Ra) of the centerline of the contact surface is in the range of 0.025 μm to 0.035 μm or / and the average surface roughness of 10 points of the contact surface is in the range of 0.3 μm to 0.5 μm, there may be a problem of separation between the first pattern portion 721 and the insulating portion 710.

[0206] Therefore, the surface of the first patterned portion 721 in the embodiment may have a certain level or greater surface roughness. For example, the surface roughness of the first patterned portion 721 may affect the adhesion of the insulating portion 710.

[0207] For example, the surface of the first pattern portion 721 in this embodiment may have a centerline average surface roughness Ra in the range of 0.05 μm to 0.5 μm. For example, the surface of the first pattern portion 721 in this embodiment may have a centerline average surface roughness Ra in the range of 0.05 μm to 0.2 μm. For example, the surface of the first pattern portion 721 in this embodiment may have a centerline average surface roughness Ra in the range of 0.08 μm to 0.15 μm. For example, the surface of the first pattern portion 721 in this embodiment may have a 10-point average surface roughness Rz in the range of 0.6 μm to 5 μm. For example, the surface of the first pattern portion 721 in this embodiment may have a 10-point average surface roughness Rz in the range of 0.7 μm to 3.0 μm. For example, the surface of the first pattern portion 721 in this embodiment may have a 10-point average surface roughness Rz in the range of 1.0 μm to 2.5 μm.

[0208] The first pattern portion 721 may include a first terminal portion 721-1, a second terminal portion 721-2, and a connecting portion 721-3. In this case, the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 are separated only for the purpose of describing the structure, and they may be integrally formed with each other.

[0209] The first terminal portion 721-1 may be formed on the first side region of the first insulating region 711. Furthermore, at least a portion of the first terminal portion 721-1 may be exposed through the first terminal opening portion of the first insulating region 711.

[0210] The first terminal portion 721-1 may include a plurality of first terminals arranged on different side regions of the first insulating region 711. Furthermore, the plurality of first terminals may be arranged adjacent to different corner portions of the four corner portions of the separation region 713. Therefore, when the moving portion moves, tilting can be performed at the corner portions (edge ​​portions) instead of tilting in the side regions of the substrate 700. Thus, this embodiment can improve the mobility of the moving portion. Furthermore, in this embodiment, the tilting is performed at the corner portions where a plurality of connecting portions 723 are arranged, thereby increasing the accuracy of the tilting of the entire module. Moreover, the connecting portions 723 are arranged densely at the corner portions of the separation region 713 and also have curved portions. According to this embodiment, the second terminal portion 721-2 is arranged adjacent to different corner portions, thereby improving the mobility of the moving portion.

[0211] For example, the first terminal portion 721-1 may include a plurality of first-first terminals 721-1a disposed on the first-first side region R1-1 of the first insulating region 711. The plurality of first-first terminals 721-1a may correspond to the first pads 241-1 of the sensor substrate 241. A portion of the first-first terminal 721-1a may be disposed on the first-first side region R1-1 of the first insulating region 711. Furthermore, the remaining portions of the first-first terminals 721-1a may be exposed through the first-first terminal opening portion 711-1 of the first insulating region 711. Additionally, the first-first terminals 721-1a may be disposed adjacent to the first corner portion CN1 of the separation region 713.

[0212] For example, the first terminal portion 721-1 may include a plurality of first-second terminals 721-1b disposed on the first-second side region R1-2 of the first insulating region 711. The plurality of first-second terminals 721-1b may correspond to the second pad 241-2 of the sensor substrate 241. A portion of the first-second terminals 721-1b may be disposed on the first-second side region R1-2 of the first insulating region 711. Furthermore, the remaining portions of the first-second terminals 721-1b may be exposed through the first-second terminal opening portion 711-2 of the first insulating region 711. Additionally, the plurality of first-second terminals 721-1b may be arranged adjacent to the second corner portion CN2 of the separation region 713.

[0213] For example, the first terminal portion 721-1 may include a plurality of first-third terminals 721-1c disposed on the first-third side region R1-3 of the first insulating region 711. The plurality of first-third terminals 721-1c may correspond to the third pad 241-3 of the sensor substrate 241. A portion of the first-third terminals 721-1c may be disposed on the first-third side region R1-3 of the first insulating region 711. Furthermore, the remaining portion of the first-third terminals 721-1c may be exposed through the first-third terminal opening portion 711-3 of the first insulating region 711. Additionally, the first-third terminals 721-1c may be positioned adjacent to the triangular portion CN3 of the separation region 713.

[0214] For example, the first terminal portion 721-1 may include a plurality of first-fourth terminals 721-1d disposed on the first-fourth side region R1-4 of the first insulating region 711. The plurality of first-fourth terminals 721-1d may correspond to the fourth pad 241-4 of the sensor substrate 241. A portion of the first-fourth terminals 721-1d may be disposed on the first-fourth side region R1-4 of the first insulating region 711. Furthermore, the remaining portion of the first-fourth terminals 721-1d may be exposed through the first-fourth terminal opening portion 711-4 of the first insulating region 711. Additionally, the first-fourth terminals 721-1d may be positioned adjacent to the fourth corner CN4 of the separation region 713.

[0215] The first terminal portion 721-1 can be electrically connected to the pad 241 of the sensor substrate 241.

[0216] The first patterned portion 721 may include a second terminal portion 721-2 connected to the main substrate 110. The second terminal portion 721-2 may include a plurality of second terminals disposed on different side regions of the second insulating region 712. Furthermore, the plurality of second terminals may be disposed adjacent to different corners of the four corners of the separation region 713.

[0217] The second terminal portion 721-2 may include a plurality of second-first terminals 721-2a formed on the second-first side region R2-1 of the second insulating region 712. The plurality of second-first terminals 721-2a may correspond to pads 116 of the main substrate 110. A portion of the second-first terminal 721-2a may be disposed on the second-first side region R2-1 of the second insulating region 712. Furthermore, the remaining portion of the second-first terminal 721-2a may be exposed through the second-first terminal opening portion 712-1 of the second insulating region 712. Additionally, the second-first terminal 721-2a may be positioned adjacent to the triangular portion CN3 of the separation region 713.

[0218] For example, the second terminal portion 721-2 may include a plurality of second-second terminals 721-2b formed on the second-second side region R2-2 of the second insulating region 712. The plurality of second terminals 721-2b may correspond to the pads 116 of the main substrate 110. A portion of the second-second terminal 721-2b may be disposed on the second-second side region R2-2 of the second insulating region 712, and the remaining portion of the second-second terminal 721-2b may be exposed through the second-second terminal opening portion 712-2 of the second insulating region 712. Furthermore, the second terminal 721-2b may be positioned adjacent to the fourth corner CN4 of the separation region 713.

[0219] For example, the second terminal portion 721-2 may include a plurality of second-third terminals 721-2c formed on the second-third side region R2-3 of the second insulating region 712. The plurality of second-third terminals 721-2c may correspond to pads 116 of the main substrate 110. A portion of the second-third terminals 721-2c may be disposed on the second-third side region R2-3 of the second insulating region 712, and the remaining portion of the second-third terminals 721-2c may be exposed through the second-third terminal opening portion 712-3 of the second insulating region 712. Furthermore, the second-third terminals 721-2c may be positioned adjacent to the second corner portion CN2 of the separation region 713.

[0220] For example, the second terminal portion 721-2 includes a plurality of second-fourth terminals 721-2d formed on the second-fourth side region R2-4 of the second insulating region 712. The plurality of second-fourth terminals 721-2d may correspond to pads 116 of the main substrate 110. A portion of the second-fourth terminals 721-2d may be disposed on the second-fourth side region R2-4 of the second insulating region 712, and the remaining portion of the second-fourth terminals 721-2d may be exposed through the second-third terminal opening portion 712-4 of the second insulating region 712. Furthermore, the second-fourth terminals 721-2d may be positioned adjacent to the first corner CN1 of the separation region 713.

[0221] Meanwhile, the connecting portion 721-3 can be connected between the first terminal portion 721-1 and the second terminal portion 721-2.

[0222] The connecting portion 721-3 is not connected to the first terminal portion and the second terminal portion disposed on the side regions facing each other. Preferably, the connecting portion 721-3 is connected between the first terminal portion and the second terminal portion disposed on the side regions that do not face each other.

[0223] The connecting portion 721-3 may not overlap with the insulating portion 710 in the optical axis direction. For example, the connecting portion 721-3 may be arranged to be suspended above the separation region 713 of the insulating portion 710.

[0224] Therefore, this embodiment can improve the mobility of the first moving part 200 by means of the connecting portion 721-3. In other words, this embodiment improves the elasticity of the connecting portion 721-3 to improve the mobility of the first moving part 200.

[0225] For example, the connection portion 721-3 may include a first connection portion 721-3a.

[0226] The first connecting portion 721-3a can be connected between the first terminal 721-1a of the first terminal portion 721-1 and the second terminal 721-2d of the second terminal portion 721-2. Therefore, the first connecting portion 721-3a may include at least one bent portion BP1. Furthermore, as described above, the first connecting portion 721-3a connects between the first terminal portion 721-1 and the second terminal portion 721-2 disposed on each different side region. Therefore, at least a portion of the first connecting portion 721-3a can be disposed on the corner portion of the separation region 713. For example, the separation region 713 may include four corner portions CN1, CN2, CN3, and CN4. Additionally, the first connecting portion 721-3a may include a first bent portion BP1 formed in the first corner portion CN1 of the four corner portions of the separation region 713. The first connecting portion 721-3a may include one end connected to the first terminal 721-1a and the other end extending counterclockwise from the aforementioned end and connected to the second terminal 721-2d. In addition, the first curved portion BP1 of the first connecting portion 721-3a can be bent by rotating counterclockwise from the aforementioned end.

[0227] In addition, the connecting portion 721-3 may include a second connecting portion 721-3b.

[0228] The second connecting portion 721-3b can be connected between the first-second terminal 721-1b of the first terminal portion 721-1 and the second-third terminal 721-2c of the second terminal portion 721-2. Therefore, the second connecting portion 721-3b may include at least one bent portion BP2. Furthermore, as described above, the second connecting portion 721-3b connects between the first terminal portion 721-1 and the second terminal portion 721-2 disposed on each of different side regions. Therefore, the second connecting portion 721-3b may include a second bent portion BP2 formed in the second corner portion CN2. The second connecting portion 721-3b may include one end connected to the first-second terminal 721-1b and another end extending counterclockwise from the aforementioned end and connected to the second-third terminal 721-2c. Additionally, the second bent portion BP2 of the second connecting portion 721-3b can be bent by counterclockwise rotation starting from the aforementioned end. The second bent portion BP2 of the second connecting portion 721-3b can be bent and extended in the same direction as the first connecting portion 721-3a.

[0229] In addition, the connecting portion 721-3 may include a third connecting portion 721-3c.

[0230] The third connecting portion 721-3c can be connected between the first-third terminal 721-1c of the first terminal portion 721-1 and the second-first terminal 721-2a of the second terminal portion 721-2. Therefore, the third connecting portion 721-3c may include at least one bent portion BP3. Furthermore, as described above, the third connecting portion 721-3c connects between the first terminal portion 721-1 and the second terminal portion 721-2 disposed on each of different side regions. Therefore, the third connecting portion 721-3c may include a third bent portion BP3 formed in the triangular portion CN3. The third connecting portion 721-3c may include one end connected to the first-third terminal 721-1c and another end extending counterclockwise from the aforementioned end and connected to the second-first terminal 721-2a. Additionally, the third bent portion BP3 of the third connecting portion 721-3c can be bent by counterclockwise rotation starting from the aforementioned end. In other words, the third curved portion BP3 of the third connecting portion 721-3c can be bent and extended in the same direction as the first connecting portion 721-3a and the second connecting portion 721-3b.

[0231] The connecting portion 721-3 may include a fourth connecting portion 721-3d.

[0232] The fourth connecting portion 721-3d can be connected between the first-fourth terminal 721-1d of the first terminal portion 721-1 and the second-second terminal 721-2b of the second terminal portion 721-2. Therefore, the fourth connecting portion 721-3d may include at least one bent portion BP4. Furthermore, as described above, the fourth connecting portion 721-3d is connected between the first terminal portion 721-1 and the second terminal portion 721-2 disposed on each of different side regions. Therefore, the fourth connecting portion 721-3d may include a fourth bent portion BP4 formed in the fourth corner portion CN4. Furthermore, the fourth connecting portion 721-3d may include one end connected to the first-fourth terminal 721-1d and another end extending counterclockwise from the aforementioned end and connected to the second-second terminal 721-2b. Additionally, the fourth bent portion BP4 of the fourth connecting portion 721-3d can be bent by counterclockwise rotation starting from the aforementioned end. In other words, the fourth curved portion BP4 of the fourth connecting portion 721-3d can be bent and extended in the same direction as the first connecting portion 721-3a, the second connecting portion 721-3b and the third connecting portion 721-3c.

[0233] The connecting portion 721-3 of this embodiment includes multiple connecting portions connecting between the first terminal portion 721-1 and the second terminal portion 721-2. Furthermore, each of the multiple connecting portions includes a curved portion disposed at a different corner of the separation region 713. In this case, the curved portions of the multiple connecting portions can bend and extend in the same direction as the rotation direction. Therefore, this embodiment can improve the reliability of the connecting portion 721-3. Furthermore, this embodiment can improve the mobility of the first moving portion 200 of the lens driving device.

[0234] For example, when the bent portions of multiple connecting parts bend in different directions as rotational directions, different forces may be applied to each connecting part as the first moving part 200 moves. Therefore, the mobility of the first moving part 200 may be reduced. Furthermore, when the bent portions of multiple connecting parts bend in different directions as rotational directions, the force may concentrate on a specific connecting part. Therefore, the connecting part where the force is concentrated may break off earlier than other connecting parts.

[0235] Alternatively, this embodiment allows the bent portions of multiple connecting parts to bend in the same direction relative to each other in the rotational direction. Therefore, when the first moving part 200 moves, the force acting on each connecting part can be evenly distributed. Thus, this embodiment can improve the mobility of the first moving part 200. Furthermore, this embodiment can evenly distribute the force acting on each connecting part to solve the problem of certain connecting parts breaking first. Moreover, even if a connecting part breaks, all connecting parts may break simultaneously. Therefore, this embodiment can improve the tilting characteristics of the first moving part 200.

[0236] Meanwhile, the connecting portion 721-3 may not be supported by the first insulating region 711 and the second insulating region 712. For example, the connecting portion 721-3 may include a portion that does not overlap with the first insulating region 711 and the second insulating region 712 in the optical axis direction. Furthermore, the curved portion of the connecting portion 721-3 does not overlap with the first insulating region 711 and the second insulating region 712 in the optical axis direction. For example, the connecting portion 721-3 may be disposed in a suspended state on the separation region 713.

[0237] Furthermore, in this embodiment, the number of each of the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 can be the same. For example, the first terminal portion 721-1, the second terminal portion 721-2, and the connecting portion 721-3 can be connected to each other in a 1:1 ratio.

[0238] For example, the first-first terminal 721-1a of the first terminal portion 721-1, the second-fourth terminal 721-2d of the second terminal portion 721-2, and the first connecting portion 721-3a can be connected to each other in a 1:1 ratio. Therefore, the number of first-first terminals 721-1a of the first terminal portion 721-1, the number of second-fourth terminals 721-2d of the second terminal portion 721-2, and the number of first connecting portions 721-3a can be the same.

[0239] Furthermore, the first and second terminals 721-1b of the first terminal portion 721-1, the second and third terminals 721-2c of the second terminal portion 721-2, and the second connecting portion 721-3b can be connected to each other in a 1:1 ratio. Therefore, the number of the first and second terminals 721-1b of the first terminal portion 721-1, the number of the second and third terminals 721-2c of the second terminal portion 721-2, and the number of the second connecting portions 721-3b can be the same.

[0240] The first and third terminals 721-1c of the first terminal portion 721-1, the second and first terminals 721-2a of the second terminal portion 721-2, and the third connecting portion 721-3c can be connected to each other in a 1:1 ratio. The number of the first and third terminals 721-1c of the first terminal portion 721-1, the number of the second and first terminals 721-2a of the second terminal portion 721-2, and the number of the third connecting portions 721-3c can be the same.

[0241] Furthermore, the first-fourth terminals 721-1d of the first terminal portion 721-1, the second-second terminals 721-2b of the second terminal portion 721-2, and the fourth connecting portion 721-3d can be connected to each other in a 1:1 ratio. Therefore, the number of the first-fourth terminals 721-1d of the first terminal portion 721-1, the number of the second-second terminals 721-2b of the second terminal portion 721-2, and the number of the fourth connecting portion 721-3d can be the same.

[0242] Meanwhile, the number of first terminals of the first terminal portions 721-1 provided in different first side regions of the first insulation region 711 can be the same. For example, the first-first terminal 721-1a, the first-second terminal 721-1b, the first-third terminal 721-1c, and the first-fourth terminal 721-1d can have the same number of each other.

[0243] Furthermore, the number of second terminals in the second terminal portions 721-2 located in different second side regions of the second insulation region 712 can be the same. For example, the second-first terminal 721-2a, the second-second terminal 721-2b, the second-third terminal 721-2c, and the second-fourth terminal 721-2d can have the same number of each other.

[0244] Furthermore, the number of connecting portions provided in different corners of the separation region 713 can be the same. For example, the first connecting portion 721-3a, the second connecting portion 721-3b, the third connecting portion 721-3c, and the fourth connecting portion 721-3d can have the same number of each other.

[0245] In this embodiment, the number of first terminal portions 721-1, the number of second terminal portions 721-2, and the number of connecting portions 721-3 are equal to each other, thus improving the mobility of the first moving portion 200. For example, when the first terminal portions, second terminal portions, and connecting portions are concentrated in a specific area, or when the number of first terminal portions, second terminal portions, and connecting portions in a specific area is greater than the number of first terminal portions, second terminal portions, and connecting portions in another area, a difference may occur between the amount of movement in the concentrated area and the amount of movement in other areas outside the concentrated area. Therefore, the mobility of the first moving portion 200 can be reduced. Therefore, in this embodiment, the first pattern portions are distributed on the four first side areas of the first insulating area 711, the four second side areas of the second insulating area 712, and the four corner portions of the separation area 713. Therefore, this embodiment can improve the mobility of the first moving portion 200, thereby improving operational reliability.

[0246] On the other hand, the number of each of the first terminal portion 721-1, the second terminal portion 721-2, and the connection portion 721-3 can correspond to the number of signal channels exchanged between the main substrate 110 and the sensor substrate 241. For example, the number of communication channels between the main substrate 110 and the sensor substrate 241 can be 32.

[0247] Therefore, the number of first terminal portions 721-1 can be 32. For example, the number of each of the first-first terminal 721-1a, the first-second terminal 721-1b, the first-third terminal 721-1c, and the first-fourth terminal 721-1d can be 8.

[0248] Furthermore, the number of second terminal portions 721-2 can be 32. Therefore, the number of each of the second-first terminal 721-2a, the second-second terminal 721-2b, the second-third terminal 721-2c, and the second-fourth terminal 721-2d can be 8.

[0249] Furthermore, the number of connection portions 721-3 can be 32. Therefore, the number of each of the first connection portion 721-3a, the second connection portion 721-3b, the third connection portion 721-3c, and the fourth connection portion 721-3d can be 8. However, the number of communication channels is not limited to 32, and can be more or less than 32.

[0250] The thickness of the first patterned portion 721 can be from 10 μm to 60 μm. For example, the thickness of the first patterned portion 721 can be from 15 μm to 50 μm. For example, the thickness of the first patterned portion 721 can be from 20 μm to 45 μm.

[0251] When the thickness of the first pattern portion 721 is less than 10 μm, the first pattern portion 721 may be easily cut when the first moving portion 200 moves. Furthermore, when the thickness of the first pattern portion 721 is greater than 60 μm, the elasticity of the connecting portion 721-3 may be reduced. Therefore, the mobility of the first moving portion 200 may be hindered. For example, when the thickness of the first pattern portion 721 is greater than 60 μm, the driving force required to move the first moving portion 200 may increase due to the reduced elasticity. Therefore, power consumption may increase. Therefore, in this embodiment, the first pattern portion 721 has a thickness of 35 μm ± 5 μm to enable stable movement of the first moving portion 200.

[0252] Furthermore, the length of the connecting portion 721-3 can be 1.5 times or more the width of the separating region 713. The length of the connecting portion 721-3 can be 20 times or less the width of the separating region 713. In this case, the width of the separating region 713 can be 1.5 mm. When the length of the connecting portion 721-3 is less than 1.5 times the width of the separating region 713, the mobility of the first moving portion 200 may decrease due to the reduced elasticity of the connecting portion 721-3. Furthermore, when the length of the connecting portion 721-3 is greater than 20 times the width of the separating region 713, the transmission distance of the signal transmitted through the connecting portion 721-3 may increase. As a result, the resistance of the connecting portion 721-3 may increase, and therefore the noise characteristics of the signal may deteriorate.

[0253] The connecting section 721-3 will be described in more detail below.

[0254] The connecting portion 721-3 includes multiple connecting portions disposed in multiple corner portions of the separation region 713 as described above. Additionally, the multiple connecting portions may include curved portions that are bent in the same direction of rotation at different corner portions of the separation region 713.

[0255] For example, the connecting portion 721-3 may include a first connecting portion 721-3a, which is disposed in the first corner portion CN1 of the separation region 713 and includes a first curved portion BP1.

[0256] Additionally, the first curved portion BP1 of the first connecting portion 721-3a can be provided while avoiding a portion of the first corner portion CN1. For example, the first curved portion BP1 of the first connecting portion 721-3a may include a first open area OR that partially exposes the first corner portion CN1. Furthermore, the first connecting portion 721-3a can be provided both inside and outside the first open area OR while avoiding the first open area OR.

[0257] The first open area OR can be an area that overlaps with the protrusion of the second frame in the optical axis direction or the vertical direction. In this case, the first open area OR in this embodiment can be configured to provide space in which the protrusion 214 of the second frame 210 can move. For example, the protrusion of the second frame 210 can be configured to pass through the first open area OR1 of the connecting portion 732. Therefore, this embodiment can reduce the overall thickness of the camera module. In addition, this embodiment can prevent the connecting portion 732 from being damaged due to the protrusion of the second frame 210.

[0258] For example, the first connection portion 721-3a may include an outer connection portion 721-3a1 disposed outside the first open region OR and an inner connection portion 721-3a2 disposed inside the first open region OR.

[0259] The outer connecting portion 721-3a1 can be disposed outside the first open region OR. For example, the outer connecting portion 721-3a1 can be disposed further away from the first insulating region 711 than the inner connecting portion 721-3a2. For example, the outer connecting portion 721-3a1 can be disposed adjacent to the second insulating region 712. The inner connecting portion 721-3a2 can be disposed inside the first open region OR. For example, the inner connecting portion 721-3a2 can be disposed further away from the second insulating region 712 than the outer connecting portion 721-3a1. For example, the inner connecting portion 721-3a2 can be disposed adjacent to the first insulating region 711.

[0260] In this case, the number of outer connecting portions 721-3a1 can differ from the number of inner connecting portions 721-3a2. For example, the first connecting portion 721-3a may include six lines. A portion of the six lines of the first connecting portion 721-3a may constitute the outer connecting portion 721-3a1, while the remaining portion may constitute the inner connecting portion 721-3a2. Furthermore, the number of lines constituting the outer connecting portion 721-3a1 may differ from the number of lines constituting the inner connecting portion 721-3a2. Preferably, the number of lines in the outer connecting portion 721-3a1 may be greater than the number of lines in the inner connecting portion 721-3a2. For example, the number of lines in the outer connecting portion 721-3a1 may be 1.5 times or more than the number of lines in the inner connecting portion 721-3a2. For example, the number of lines in the outer connecting portion 721-3a1 may be 1.7 times or more than the number of lines in the inner connecting portion 721-3a2. For example, the number of lines in the outer connection portion 721-3a1 can be twice or more the number of lines in the inner connection portion 721-3a2.

[0261] For example, when the number of lines in the first connecting portion 721-3a is six, the number of lines in the outer connecting portion 721-3a1 can be four, and the number of lines in the inner connecting portion 721-3a2 can be two. Therefore, the outer connecting portion 721-3a1 can include the first to the fourth outer connecting portions 721-3a11, 721-3a12, 721-3a13, and 721-3a14. Furthermore, the inner connecting portion 721-3a2 can include the first inner connecting portion 721-3a21 and the second inner connecting portion 721-3a22.

[0262] In this embodiment, the number of outer connecting portions 721-3a1 disposed outside the first connecting portion 721-3a in the first open area OR is greater than the number of inner connecting portions 721-3a2 disposed inside the first connecting portion 721-3a in the first open area OR. Therefore, this embodiment can enhance the mobility of the first moving portion 200. For example, if the number of outer connecting portions 721-3a1 is greater than the number of inner connecting portions 721-3a2, the amount of movement of the first moving portion 200 can be controlled more easily compared to the opposite case. For example, the outer connecting portions 721-3a1 can have a longer length than the inner connecting portions 721-3a2 outside the first open area OR. Furthermore, since the length of the outer connecting portions 721-3a1 is longer than the length of the inner connecting portions 721-3a2, the intensity of the driving force required to move the first moving portion 200 can be reduced. Therefore, in this embodiment, the number of outer connecting portions 721-3a1 can be greater than the number of inner connecting portions 721-3a2 to improve the mobility of the first moving portion 200. Furthermore, the amount of movement of the first moving portion 200 in this embodiment can be finely adjusted.

[0263] On the other hand, each of the outer connecting portion 721-3a1 and the inner connecting portion 721-3a2 includes multiple bending points.

[0264] In this case, the number of bends in the outer connecting portion 721-3a1 can be the same as the number of bends in the inner connecting portion 721-3a2. For example, the number of bends in the outer connecting portion 721-3a1 can be the same as the number of bends in the inner connecting portion 721-3a2. For example, the outer connecting portion 721-3a1 can include five bends. For example, the outer connecting portion 721-3a1 can have a first-first bend A1, a first-second bend A2, a first-third bend A3, a first-fourth bend A4, and a first-fifth bend A5 starting from the end connected to the first terminal portion. Correspondingly, the inner connecting portion 721-3a2 can also include five bends. For example, the inner connecting portion 721-3a2 can have a second-first bend B1, a second-second bend B2, a second-third bend B3, a second-fourth bend B4, and a second-fifth bend B5 starting from the end connected to the first terminal portion.

[0265] However, the number of bending points in each of the outer connecting portions 721-3a1 and the inner connecting portions 721-3a2 may be less than or equal to four, or alternatively six or more.

[0266] In this embodiment, as described above, the number of bending points in the outer connecting portion 721-3a1 and the number of bending points in the inner connecting portion 721-3a2 are equal to each other, thus enhancing the mobility of the first moving portion 200. For example, when the number of bending points in the outer connecting portion 721-3a1 differs from the number of bending points in the inner connecting portion 721-3a2, force can be concentrated on the connecting portion with more bending points. Therefore, the following problem may occur: the connecting portion on which the force is concentrated may be damaged before other connecting portions. Furthermore, the movement accuracy of the first moving portion 200 may be problematic.

[0267] Therefore, in this embodiment, the number of bending points of the outer connecting portion 721-3a1 and the number of bending points of the inner connecting portion 721-3a2 are equal. Therefore, when the first moving portion 200 moves, the force applied to the inner connecting portion 721-3a2 and the outer connecting portion 721-3a1 can be evenly distributed. Therefore, this embodiment can solve the problem of a specific connecting portion being cut off first. Furthermore, even when a connecting portion is cut off, the inner connecting portion 721-3a2 and the outer connecting portion 721-3a1 in this embodiment can be cut off simultaneously.

[0268] Furthermore, when the first moving part 200 moves, the force caused by rotation or tilting is concentrated at each of the bending points of the inner connecting part 721-3a1 or the outer connecting part 721-3a2. In this case, the number of inner connecting parts 721-3a1 and outer connecting parts 721-3a2 in this embodiment can be the same to prevent the force from concentrating at a specific bending point. Moreover, in this embodiment, the difference between the number of bending points of the inner connecting part 721-3a1 and the outer connecting part 721-3a2 can be adjusted within 40%, 20%, or 10%. Therefore, this embodiment can prevent the specific connecting part from breaking when the force is concentrated at a specific bending point.

[0269] The main substrate 110 is electrically connected to the first terminal portion 721-1 of the substrate 700. The sensor substrate 241 is electrically connected to the second terminal portion 721-2 of the first patterned portion 721 of the substrate 700. In this case, a resilient connecting portion 721-3 can be formed between the first terminal portion 721-1 and the second terminal portion 721-2, simultaneously connecting them. Therefore, the main substrate 110 and the sensor substrate 241 can be electrically connected to each other. The first movable portion 200 constituting the sensor substrate 241 can rotate about the x-axis or y-axis by the elasticity of the connecting portion 721-3. Simultaneously, the sensor substrate 241 can be electrically connected to the third drive member 330.

[0270] Therefore, this embodiment may include a connecting spring portion 800. The connecting spring portion 800 may include a first connecting spring portion 810. One end of the first connecting spring portion 810 is connected to the sensor substrate 241. The other end of the first connecting spring portion 810 is connected to one end of the second lower elastic member 620. Additionally, one end of the second lower elastic member 620 may be electrically connected to one end of the third driving member 330. Furthermore, the connecting spring portion 800 includes a second connecting spring portion 820. One end of the second connecting spring portion 820 is connected to the sensor substrate 241. The other end of the second connecting spring portion 820 is connected to the other end of the second lower elastic member 620. Furthermore, the other end of the second lower elastic member 620 may be connected to the other end of the third driving member 330. Therefore, a current of a specific intensity can be applied to the third driving member 330 in a specific direction in this embodiment. Simultaneously, the second lower elastic member 620 includes a first portion connected to the first connecting spring portion 810. The second lower elastic member 620 may include a second portion electrically insulated from the first portion and connected to the second connecting spring portion 820.

[0271] <Image Sensor Module>

[0272] The image sensor module of this embodiment will be described below.

[0273] The image sensor module may include the sensor substrate 241, image sensor 242 and substrate 700 described above.

[0274] In addition, the image sensor module may also include a main substrate 100 coupled to the substrate 700. The substrate 700 corresponding to the intermediate may be referred to as the "first substrate", the sensor substrate 241 on which the image sensor 242 is disposed may be referred to as the "second substrate", and the main substrate 110 may also be referred to as the "third substrate".

[0275] Figure 5a This is a cross-sectional view of the image sensor module according to the first embodiment.

[0276] Reference Figure 5a The image sensor module according to the embodiment can correspond to Figure 1 To Figure 4 (i.e.) Figures 4a to 4f ).

[0277] The image sensor module includes a substrate 700.

[0278] Sensor substrate 241 is disposed on substrate 700. Image sensor 242 can be mounted on sensor substrate 241.

[0279] For example, the first adhesive portion SB1 may be disposed on the first terminal portion 721-1 of the substrate 700. Furthermore, the sensor substrate 241 may be disposed on the first adhesive portion SB1. For example, the sensor substrate 241 may be attached to the substrate 700 via the first adhesive portion SB1. For example, pads 241-1 and 241-2 disposed on the sensor substrate 241 may be electrically connected to the first terminal portion 721-1 of the substrate 700 via the first adhesive portion SB1.

[0280] Furthermore, the main substrate 110 may be disposed on the substrate 700. For example, the main substrate 110 may include a third open region and may be configured to surround the sensor substrate 241.

[0281] For example, the second adhesive portion SB can be disposed on the second terminal portion 721-2 of the substrate 700. Furthermore, the main substrate 110 can be attached to the substrate 700 via the second adhesive portion SB. For example, the pads 116 of the main substrate 110 can be electrically connected to the second terminal portion 721-2 of the substrate 700 via the second adhesive portion SB.

[0282] Figure 5b It is shown Figure 5a A view of a modified example of the image sensor module.

[0283] Reference Figure 5b The image sensor module in the second embodiment Figure 5a The substrate 700 can be set in an inverted state, and the sensor substrate 241 can be coupled to the substrate 700 in an inverted state.

[0284] That is, the image sensor module includes a substrate 700.

[0285] Sensor substrate 241 is disposed on substrate 700. Image sensor 242 can be mounted on sensor substrate 241.

[0286] At this time, with Figure 5a In contrast, the substrate 700 can be configured such that the first patterned portion 721 and the second patterned portion 722 face downwards.

[0287] Furthermore, the pads of the first pattern portion 721 and the sensor substrate 241 can be arranged to face each other directly at a predetermined distance apart from each other by the first terminal opening portion formed on the substrate 700.

[0288] Furthermore, the first adhesive portion SB1 may be disposed in the first terminal opening portion of the substrate 700. Additionally, the sensor substrate 241 may be disposed on the first adhesive portion SB1. For example, the sensor substrate 241 can be attached to the substrate 700 via the first adhesive portion SB1. For example, pads 241-1 and 241-2 disposed on the sensor substrate 241 can be electrically connected to the first terminal portion 721-1 of the substrate 700 via the first adhesive portion SB1. According to a modified example, by disposing a portion of the first adhesive portion SB1 in the first terminal opening portion, the spacing between the substrate 700 and the sensor substrate 241 can be minimized. Therefore, this embodiment can reduce the thickness of the image sensor module.

[0289] Furthermore, the main substrate 110 may be disposed on the substrate 700. For example, the main substrate 110 may include a third open region and may be configured to surround the sensor substrate 241.

[0290] Furthermore, the second adhesive portion SB can be disposed in the second terminal opening portion of the substrate 700. Additionally, the main substrate 110 can be disposed on the second adhesive portion SB. For example, the main substrate 110 can be attached to the substrate 700 via the second adhesive portion SB. For example, the pads 116 disposed on the main substrate 110 can be electrically connected to the second terminal portion 721-2 of the substrate 700 via the second adhesive portion SB.

[0291] On the other hand, the image sensor module can be easily dissipated. That is, the structure has a configuration where the heat generated by the image sensor 242 is trapped in the housing space of the lens drive device.

[0292] Therefore, this implementation allows for enhanced heat dissipation of the image sensor module.

[0293] Figure 6 This is a cross-sectional view showing the image sensor module according to the second embodiment.

[0294] refer to Figure 6 , and Figure 5 (i.e. Figures 5a to 5b The basic structure can be the same as that of an image sensor module.

[0295] However, the image sensor module of the second embodiment may also include a heat dissipation section 930 for heat dissipation.

[0296] Therefore, the first insulating region 711 of the insulating portion 710 and the second-first pattern portion 722-1 of the second pattern portion 722 in the image sensor module of the second embodiment may have a different structure than that of the image sensor module of the first embodiment.

[0297] In this embodiment, the second-first pattern portion 722-1 of the second pattern portion 722 does not include the second open area OR.

[0298] The first insulating region 711 of the insulating portion 710 may include a through-hole 711-9 exposing the lower surface of the second-first patterned portion 722-1. The through-hole 711-9 of the first insulating region 711 may extend through both the upper and lower surfaces of the first insulating region 711. For example, the through-hole 711-9 of the first insulating region 711 may expose the lower surface of the second-first patterned portion 722-1. For example, the through-hole 711-9 of the first insulating region 711 may expose the upper surface of a heat dissipation portion 930 attached to the lower surface of the first insulating region 711.

[0299] Therefore, the area of ​​the first insulating region 711 in this embodiment can be smaller than the area of ​​the second-first pattern portion 722-1. For example, the area of ​​the first insulating region 711 can be 95% or less of the area of ​​the second-first pattern portion 722-1. For example, the area of ​​the first insulating region 711 can be less than or equal to 90% of the area of ​​the second-first pattern portion 722-1. For example, the area of ​​the first insulating region 711 can be less than or equal to 85% of the area of ​​the second-first pattern portion 722-1.

[0300] Therefore, the second-first pattern portion 722-1 may include a first portion disposed on the upper surface of the first insulating region 711 and a second portion disposed on the through hole 711 of the first insulating region 711-9. For example, the second portion of the second-first pattern portion 722-1 may overlap with the through hole 711-9 of the first insulating region 711 in the optical axis direction.

[0301] Simultaneously, an adhesive layer 920 can be formed in the through-holes 711-9 of the first insulating region 711. The adhesive layer 920 can be formed to fill the interior of the through-holes 711-9 of the first insulating region 711. For example, the thickness of the adhesive layer 920 can be the same as the thickness or depth of the through-holes 711-9 of the first insulating region 711.

[0302] An adhesive layer 920 may be disposed in the through-holes 711-9 of the first insulating region 711 to bond between the second-first patterned portion 722-1 and the heat dissipation portion 930. For example, the heat dissipation portion 930 may be attached to the lower surface of the first insulating region 711 via the adhesive layer 920. The adhesive layer 920 may include, but is not limited to, adhesive components such as thermosetting adhesives or curable adhesives. The adhesive layer 920 may be solder paste, but is not limited to. However, the adhesive layer 920 preferably comprises a material with high thermal conductivity.

[0303] Meanwhile, the sensor substrate 241 can be disposed on the substrate 700, and the image sensor 242 can be mounted on the sensor substrate 241.

[0304] In this configuration, the sensor substrate 241 may include vias 241-5. The vias 241-5 of the sensor substrate 241 may be formed to pass through both the upper and lower surfaces of the sensor substrate 241. Furthermore, the vias 241-5 of the sensor substrate 241 may be formed of a metallic material with high thermal conductivity.

[0305] Therefore, the upper surface of the through hole 241-5 can directly contact the lower surface of the image sensor 242.

[0306] Meanwhile, the adhesive portion 910 can be disposed on the lower surface of the via 241-5. For example, the adhesive portion 910 can be attached to the lower surface of the via 241-5. The adhesive portion 910 can be connected to the lower surface of the image sensor 242 through the via 241-5.

[0307] Furthermore, the adhesive portion 910 may be disposed on the second-first patterned portion 722-1. For example, the upper surface of the adhesive portion 910 may directly contact the via 241-5 of the sensor substrate 241. For example, the lower surface of the adhesive portion 910 may directly contact the second-first patterned portion 722-1 disposed on the first insulating region 711. Therefore, in this embodiment, the heat generated by the image sensor 242 can be transferred to the second-first patterned portion 722-1 through the via 241-5 of the sensor substrate 241 and the adhesive portion 910.

[0308] On the other hand, in this embodiment, the heat dissipation portion 930 is provided on the lower surface of the insulating portion 710. For example, the heat dissipation portion 930 may be provided on the lower surface of the first insulating region 711 of the insulating portion 710. For example, the heat dissipation portion 930 may be attached to the lower surface of the first insulating region 711 by means of an adhesive layer 920.

[0309] In the second embodiment, via 241-5 and the second-first pattern portion 722-1 are connected by adhesive portion 910. Furthermore, in this embodiment, the second-first pattern portion 722-1 and the heat dissipation portion 930 are connected by adhesive layer 920. Therefore, in this embodiment, heat generated by the image sensor 242 is transferred to the heat dissipation portion 930 through via 241-5, adhesive portion 910, the second-first pattern portion 722-1, and adhesive layer 920. Thus, in this embodiment, heat generated by the image sensor 242 can be transferred to the substrate 700 more effectively, thereby improving heat dissipation characteristics.

[0310] Meanwhile, in the second embodiment, the heat dissipation portion 930 includes a first portion that contacts the adhesive layer 920 and a second portion that contacts the first insulating region 711. For example, in the second embodiment, the area of ​​the heat dissipation portion 930 may be larger than the area of ​​the adhesive layer 920. For example, the area of ​​the heat dissipation portion 930 may be larger than the area of ​​the through hole 711-9 formed in the first insulating region 711.

[0311] Therefore, in this embodiment, the heat generated by the image sensor 242 can be radiated to the outside, thus improving heat dissipation characteristics. Furthermore, this embodiment can improve the operational reliability of the image sensor 242. Additionally, this embodiment can improve the quality of images acquired by the image sensor 242.

[0312] Figure 7 This is a view showing an image sensor module according to a third embodiment.

[0313] Reference Figure 7 Apart from the structure of the adhesive layer 920a and the heat dissipation portion 930a, the image sensor module according to the third embodiment and the one according to the third embodiment... Figure 6 The image sensor module in the second embodiment is the same as the module in the second embodiment.

[0314] As described above, the heat dissipation portion 930 according to the second embodiment is attached to the lower surface of the first insulating region 711 by an adhesive layer 920.

[0315] In contrast, the heat dissipation portion 930a according to the third embodiment may not contact the lower surface of the first insulating region 711.

[0316] For example, in the third embodiment, the heat dissipation portion 930a may be disposed in the through-hole 711-9 of the first insulating region 711. For example, in the third embodiment, the thickness of the adhesive layer 920a may be less than the depth of the through-hole 711-9 of the first insulating region 711. Therefore, the adhesive layer 920a may fill only a portion of the through-hole 711-9 of the first insulating region 711.

[0317] In this embodiment, the heat dissipation portion 930a may be attached to the adhesive layer 920a. For example, in this embodiment, the heat dissipation portion 930a may be attached to the adhesive layer 920a and disposed in the through hole 711-9 of the first insulating region 711.

[0318] According to the third embodiment, at least a portion of the heat dissipation portion 930a is disposed in the through-holes 711-9 of the first insulating region 711. Therefore, the thickness of the image sensor module can be reduced. Furthermore, this embodiment can reduce the overall thickness of the lens driving device by reducing the thickness of the image sensor module. Therefore, this embodiment can reduce the thickness of the camera module.

[0319] The layer structure of the pattern portion 720 in this embodiment will now be described in detail.

[0320] The patterned portion 720 may have a multi-layer structure. For example, the patterned portion 720 may include a metal layer and a surface treatment layer. The metal layer of the patterned portion 720 may be a raw material constituting the patterned portion 720. For example, the metal layer of the patterned portion 720 may be a rolled material. The surface treatment layer may be formed on the metal layer of the patterned portion 720. The surface treatment layer may be a surface protective layer to prevent oxidation of the patterned portion 720.

[0321] In other words, when no surface treatment layer is formed on the surface of the metal layer of the patterned portion 720, oxidation or discoloration of the exposed surface of the patterned portion 720 may occur. Therefore, electrical reliability may be reduced.

[0322] Therefore, in this embodiment, a surface treatment layer is formed on the metal layer of the patterned portion 720 to protect the surface of the metal layer of the patterned portion 720.

[0323] The surface treatment layer can be an organic coating. That is, in this embodiment, the surface treatment layer can be formed by coating an organic material onto the metal layer of the patterned portion 720. In other words, conventionally, the surface treatment layer is formed by plating nickel (Ni), gold (Au), etc., onto the metal layer. However, the conventional surface treatment layer described above is formed by plating a metal material as described above. In this case, when the surface treatment layer is formed by nickel, it is difficult to control the concentration of phosphorus in the nickel plating bath, thus causing a problem of fairness degradation. Furthermore, when the concentration of phosphorus in the nickel plating bath cannot be properly managed, there is a problem that the surface of the patterned portion 720 turns black due to the oxidation of nickel, resulting in black pad shapes. At this time, gold (Au) plating cannot be properly performed on the areas where black pad phenomena occur. Therefore, when the patterned portion 720 is used as a chip mounting pad, there is a problem that it is difficult to perform normal gold (Au) plating, thereby degrading the chip bonding performance. Furthermore, when the surface treatment layer is formed of gold (Au) as in the prior art, environmental problems may arise due to cyanide ions (CN-) in the gold (Au) plating bath. In other words, cyanide ions in the gold plating bath are not environmentally friendly. Therefore, there is a need for special equipment for wastewater treatment. Additionally, when the surface treatment layer is formed of nickel, signal interference occurs in the high-frequency band due to the magnetism of nickel. Therefore, there is a problem of reduced electrical reliability of the patterned portion 720.

[0324] Therefore, in this embodiment, the surface treatment layer of the patterned portion 720 is formed using organic materials instead of materials such as nickel or gold (Au).

[0325] The layer structure of the pattern portion 720 of this embodiment will be described in detail below.

[0326] Figure 8a This is a view used to explain the layer structure of the patterned portion according to the first embodiment. Figure 8b It is shown Figure 8a A view of the chemical reaction formula of the surface treatment layer, and Figure 8c It is shown Figure 8a A view of the surface of the surface treatment layer.

[0327] Since the specific structure of the pattern portion 720 has already been described in detail, its description will be omitted.

[0328] The first pattern portion 721 and the second pattern portion 722 may include a metal layer corresponding to the rolled material and a surface treatment layer formed on the metal layer.

[0329] For example, the first terminal portion 721-1 of the first pattern portion 721 may include a metal layer 721-11 disposed on the first insulating region 711 and a surface treatment layer 721-12 disposed on the metal layer 721-11.

[0330] For example, the second terminal portion 721-2 of the first pattern portion 721 may include a metal layer 721-21 disposed on the second insulating region 712 and a surface treatment layer 721-22 disposed on the metal layer 721-21.

[0331] For example, the connecting portion 721-3 of the first pattern portion 721 may include a metal layer 721-31 disposed on the separation region 713 of the insulating portion 710 and a surface treatment layer 721-32 disposed on the metal layer 721-31.

[0332] For example, the second-first pattern portion 722-1 of the second pattern portion 722 includes a metal layer 722-11 disposed on the first insulating region 711 and a surface treatment layer 722-12 disposed on the metal layer 722-11.

[0333] For example, the second pattern portion 722-2 of the second pattern portion 722 includes a metal layer 722-21 disposed on the second insulating region 712 and a surface treatment layer 722-22 disposed on the metal layer 722-21.

[0334] Surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 of each of the first pattern portion 721 and the second pattern portion 722 can be formed on the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. For example, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-222 can be formed on the metal layers 721-11, 721-21, 721-31, 722-11, and 722-222 by coating with an organic material.

[0335] In other words, in this embodiment, the surface treatment layer used to protect the surfaces of the first pattern portion 721 and the second pattern portion 722 is formed using an organic material.

[0336] Surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed from non-conductive organic materials. However, the embodiments are not limited thereto. For example, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed from any of organic materials, inorganic materials, and composites thereof having low electrical conductivity.

[0337] At this point, the organic materials constituting the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 as described above have a low relative permittivity ε. In this case, the relative permittivity ε affects the signal transmission speed v of the wiring included in the patterned portion 720. For example, the signal transmission speed v can be determined by Equation 1 below.

[0338] [Equation 1]

[0339]

[0340] Here, v is the signal transmission speed, ε is the relative permittivity of the material constituting the pattern portion 720, C is the speed of light, and K is an integer.

[0341] Here, the relative permittivity ε of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 is 3.24. This is significantly smaller than the relative permittivity ε of nickel or gold (Au). For example, the relative permittivity ε of nickel or gold (Au) is 4 or greater. Therefore, this embodiment can improve the signal transmission speed v of the wiring included in the patterned portion 720. Thus, this embodiment can improve the product reliability of the circuit board.

[0342] Furthermore, the organic materials constituting surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 have higher thermal conductivity than conventional nickel or metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Therefore, in this embodiment, the thermal conductivity of the patterned portion 720 including surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be increased.

[0343] In other words, in this embodiment, thermal conductivity and heat dissipation characteristics can be improved by applying surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 with organic coatings.

[0344] On the other hand, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed on at least one side surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 constituting the pattern portion 720. For example, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed on the exposed surfaces of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, respectively.

[0345] The first terminal portion 721-1 may include an upper surface, a side surface, and a lower surface. Furthermore, the upper surface and side surface of the first terminal portion 721-1 do not contact other components of the circuit board. Therefore, the surface treatment layer 721-12 of the first terminal portion 721-1 can be formed on the upper surface and side surface of the metal layer 721-11 of the first terminal portion 721-1.

[0346] However, the surface treatment layer may not be formed on at least a portion of the lower surface of the metal layer 721-11 of the first terminal portion 721-1. For example, the surface treatment layer 721-12 may not be formed on the lower surface of the metal layer 721-11 of the first terminal portion 721-1 that overlaps with the first insulating region 711 in the vertical direction or the thickness direction. However, a portion of the lower surface of the metal layer 721-11 of the first terminal portion 721-1 may not overlap with the first insulating region 711 in the vertical direction or the thickness direction. For example, a portion of the lower surface of the metal layer 721-11 of the first terminal portion 721-1 may be exposed through a first terminal opening portion formed in the first insulating region 711. For example, the metal layer 721-11 of the first terminal portion 721-1 includes a region that overlaps with the first terminal opening portion of the first insulating region 711 in the vertical direction or the thickness direction. Furthermore, the surface treatment layer 721-12 of the first terminal portion 721-1 may be formed on the lower surface of the metal layer 721-11 of the first terminal portion 721-1 that overlaps with the first terminal opening portion (not shown). For example, the lower surface of the metal layer 721-11 of the first terminal portion 721-1 includes a first-first lower surface that overlaps with the first insulating region 711 in the thickness direction and a first-second lower surface that is different from the first-first lower surface. Furthermore, the first-second lower surface may be a portion that overlaps with the first terminal opening portion of the first insulating region 711 in the thickness direction. Furthermore, the surface treatment layer 721-12 of the first terminal portion 721-1 may be formed only on the first-second lower surfaces of the metal layer 721-11 of the first terminal portion 721-1.

[0347] Additionally, the second terminal portion 721-2 may include an upper surface, a side surface, and a lower surface. Furthermore, the upper surface and side surface of the second terminal portion 721-2 do not contact other components of the circuit board. Therefore, the surface treatment layer 721-22 of the second terminal portion 721-2 can be formed on the upper surface and side surface of the metal layer 721-21 of the second terminal portion 721-2.

[0348] However, it may not be formed on at least a portion of the lower surface of the metal layer 721-21 of the second terminal portion 721-2. A portion of the lower surface of the metal layer 721-21 of the second terminal portion 721-2 is exposed through a second terminal opening portion formed in the second insulating region 712. For example, the metal layer 721-21 of the second terminal portion 721-2 may include a region overlapping the second terminal opening portion (not shown) of the second insulating region 712 in the vertical direction or in the thickness direction. For example, the lower surface of the metal layer 721-21 of the second terminal portion 721-2 includes a second-first lower surface overlapping the second insulating region 712 in the thickness direction and a second-second lower surface different from the second-first lower surface. Furthermore, the second-second lower surface may be a portion overlapping the second terminal opening portion of the second insulating region 712 in the thickness direction. Furthermore, the surface treatment layer 721-22 of the second terminal portion 721-2 may be formed on the second-second lower surface of the metal layer 721-21 of the second terminal portion 721-2.

[0349] Furthermore, the connecting portion 721-3 includes an upper surface, a side surface, and a lower surface. In this case, the connecting portion 721-3 may not contact the insulating portion 710. For example, the connecting portion 721-3 may be disposed in the separation region 713 of the insulating portion 710. For example, the connecting portion 721-3 may be suspended in the separation region 713 of the insulating portion 710. Therefore, the upper surface, side surface, and lower surface of the metal layer 721-31 of the connecting portion 721-3 may not contact other components of the circuit board. Therefore, in this embodiment, the surface treatment layer 721-32 of the connecting portion 721-3 may be disposed on the upper surface, side surface, and lower surface of the metal layer 721-31 of the connecting portion 721-3. Furthermore, according to the embodiment, when the image sensor moves, the surface treatment layer 721-32 of the connecting portion 721-3 may also perform the insulation function of the connecting portion 721-3.

[0350] Simultaneously, the second-first pattern portion 722-1 of the second pattern portion 722 is disposed on the first insulating region 711 of the insulating portion 710. In this case, the second-first pattern portion 722-1 of the second pattern portion 722 may include an upper surface, a side surface, and a lower surface. Furthermore, the entire area of ​​the lower surface of the second-first pattern portion 722-1 can contact the upper surface of the first insulating region 711. Therefore, the surface treatment layer 722-12 of the second-first pattern portion 722-1 may not be formed on the lower surface of the metal layer 722-11 of the second-first pattern portion 722-1. For example, the surface treatment layer 722-12 of the second-first pattern portion 722-1 may only be formed on the upper and side surfaces of the metal layer 722-11 of the second-first pattern portion 722-1.

[0351] Furthermore, a second-second pattern portion 722-2 of the second pattern portion 722 is disposed on the second insulating region 712 of the insulating portion 710. In this case, the second-second pattern portion 722-2 of the second pattern portion 722 may include an upper surface, a side surface, and a lower surface. Furthermore, the entire area of ​​the lower surface of the second-second pattern portion 722-2 may contact the upper surface of the second insulating region 712. Therefore, the surface treatment layer 722-22 of the second-second pattern portion 722-2 may not be formed on the lower surface of the metal layer 722-21 of the second-second pattern portion 722-2. For example, the surface treatment layer 722-22 of the second-second pattern portion 722-2 may be formed only on the upper and side surfaces of the metal layer 722-21 of the second-second pattern portion 722-2.

[0352] Meanwhile, although not shown in the accompanying drawings, an adhesive layer (not shown) can be formed on the insulating portion 710 and the patterned portion 720. That is, the patterned portion 720 can be formed of rolled material. Furthermore, an adhesive layer can be formed between the insulating region 711 and the rolled metal layer to bond the rolled metal layer of the rolled material and the insulating portion 710. Therefore, an adhesive layer can be formed between the patterned portion 720 and the insulating portion 710.

[0353] On the other hand, such as Figure 8b As shown, the surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 constituting the patterned portion 720 can be formed by coating thin films onto the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. These thin films can be formed by applying at least one coating method, such as spraying, dip coating, or deposition. Furthermore, non-conductive or low-conductive organic materials, inorganic materials, organic-inorganic composites, etc., can be used as the coating solution.

[0354] Preferably, the embodiments use alkylimidazolium to form surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22. Alkylimidazolium has low electrical conductivity and high thermal conductivity. That is, alkylimidazolium has excellent insulation and heat dissipation properties.

[0355] At this time, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed through coordination between ions separated from the nitrogen (N) element of the alkyl imidazolium and copper (Cu) ions constituting the patterned portion 720. That is, a thin film is formed on the patterned portion 720 using a coating solution of alkyl imidazolium. At this time, ions separated from the nitrogen element of the alkyl imidazolium coordinate with the copper ions of the patterned portion 720. Therefore, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can be formed on the patterned portion 720.

[0356] Surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can have a thickness ranging from 0.1 μm to 10 μm. For example, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can have a thickness ranging from 0.15 μm to 8 μm. For example, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can have a thickness ranging from 0.2 μm to 5 μm. When the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 is less than 0.1 μm, there is a problem that a uniform surface treatment layer cannot be formed on the surface of the patterned portion 720. In other words, when the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 is less than 0.1 μm, the surface treatment layers cannot be applied to some surfaces of the patterned portion 720, and oxidation may occur in areas where no surface treatment layer is applied. Furthermore, when the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 exceeds 10 μm, the resistance increases with the thickness of the patterned portion 720, resulting in increased signal loss. Additionally, when the thickness of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 exceeds 10 μm, the coating cost of forming the surface treatment layers increases.

[0357] Meanwhile, the metal layer of the rolled material of the patterned portion 720 in the embodiment includes copper (Cu) and titanium (Ti). Therefore, the titanium (Ti) of the patterned portion 720 is included in the surface treatment layers 721-12, 721-22, 721-32, 722-12 and 722-22.

[0358] That is, refer to Figure 8cThe surfaces of surface treatment layers 721-12, 721-22, 721-32, 722-12 and 722-22 may contain different concentrations of metal elements for each region.

[0359] Table 1 shows Figure 8c Surface analysis results for region A.

[0360] [Table 1]

[0361]

[0362] Table 2 shows Figure 8c Surface analysis results for region B.

[0363] [Table 2]

[0364]

[0365] Referring to Tables 1 and 2, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 include copper (Cu) and titanium (Ti), which are metallic elements constituting the patterned portion 720, not the metallic elements constituting the alkylimidazolium. However, the degree of coordination between the patterned portion 720 and the metallic elements can differ for each region of surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22. Therefore, the concentrations of copper (Cu) and titanium (Ti) can differ for each region. For example, the patterned portion 720 is made of rolled material, so the copper and titanium concentrations can differ for each region. Furthermore, surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22 can include elements with different concentrations for each region due to concentration differences in each region, as shown in Tables 1 and 2.

[0366] On the other hand, the manufacturing process for forming the surface treatment layers 721-12, 721-22, 721-32, 722-12 and 722-22 as described above is briefly described below.

[0367] First, the patterned portion in the embodiment can be formed on the insulating portion. That is, the patterned portion 720 in the embodiment can be formed by attaching a metal layer of rolled material to the insulating portion and patterning the attached metal layer.

[0368] Subsequently, the implementation scheme can undergo a surface treatment pretreatment process.

[0369] For example, a certain level or higher roughness can be provided to the surface of the patterned portion 720 in the embodiment by chemical polishing using at least one of sulfuric acid and hydrochloric acid, or by physical polishing using at least one of a brush, sandpaper, and a grinding stone. For example, in order to form surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-22, a surface roughness of Ra (0.05 to 0.2 μm) and Rz (1.0 to 3.0 μm) can be provided to the patterned portion 720.

[0370] Subsequently, the embodiment prepares a coating solution containing at least one of organic materials, inorganic materials, and organic-inorganic composites that do not have or have low electrical conductivity. Furthermore, the prepared coating solution can be applied to the pretreated patterned portion 720 by at least one of coating methods such as spraying, dipping, and deposition to form a surface treatment layer.

[0371] Figure 9a This is a view used to illustrate the layer structure of the patterned portion according to the second embodiment. Figure 9b yes Figure 9b An enlarged view of the connecting part, and Figure 9c It is shown Figure 9a A view of the second surface treatment portion of the surface treatment layer.

[0372] The metal layers 721-11, 721-21, 721-31, 722-11 and 722-21 that constitute the pattern portion 720 are made of rolled material.

[0373] At this point, the average surface roughness (Ra) of the centerline of the metal layer of the general rolled material is in the range of 0.025 μm to 0.035 μm or / and the average surface roughness at 10 points is in the range of 0.3 μm to 0.5 μm. In this case, when the roughness of the metal layer is within the above range, the adhesion between the patterned portion 720 and the insulating portion 710 is reduced due to the low surface roughness. Therefore, there is a problem of the patterned portion detaching from the insulating portion.

[0374] Therefore, the pattern portion 720 may also include a plating layer. The plating layer may refer to a plating layer formed by plating the surfaces of metal layers 721-11, 721-21, 721-31, 722-11 and 722-21, which include rolled material.

[0375] For example, a plating layer 721-13 may be formed between the first insulating region 711 and the metal layer 721-11 of the first terminal portion 721-1. Therefore, the surface treatment layer 721-12 of the first terminal portion 721-1 may be configured to cover the plating layer 721-13 and the metal layer 721-11 of the first terminal portion 721-1.

[0376] For example, plating layer 721-23 can be disposed between the second insulating region 712 and the metal layer 721-21 of the second terminal portion 721-2. Therefore, surface treatment layer 721-12 of the second terminal portion 721-2 can be disposed to cover plating layer 721-23 and metal layer 721-21 of the second terminal portion 721-2.

[0377] Furthermore, the connecting portion 721-3 includes a plating layer 721-33 disposed beneath the metal layer 721-31. Additionally, the surface treatment layer 721-33 of the connecting portion 721-3 can be configured to surround the plating layer 721-33 and the metal layer 721-31 of the connecting portion 721-3.

[0378] Accordingly, a plating layer 722-13 may be formed between the first insulating region 711 and the metal layer 722-11 of the second-first pattern portion 722-1. Therefore, the surface treatment layer 722-12 of the second-first pattern portion 722-1 may be configured to cover the metal layer 722-11 and the plating layer 722-13.

[0379] Furthermore, the plating layer 722-23 can be disposed between the second insulating region 712 and the metal layer 722-21 of the second-second pattern portion 722-2. Therefore, the surface treatment layer 722-12 of the second-second pattern portion 722-2 can be disposed to cover the plating layer 722-23 and the metal layer 722-21 of the second-second pattern portion 722-2.

[0380] Meanwhile, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may include pure copper. Therefore, the elements of the surface treatment layer in the portions formed on metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 may differ from the elements of the surface treatment layer in the portions formed on plating layers 721-13, 721-23, 721-33, 722-13, and 722-23.

[0381] In this context, metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 can be referred to as the first metal layer, while plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be referred to as the second metal layer. The connecting portion 721-3 will be described as an example below.

[0382] The surface treatment layer 721-32 of the connecting portion 721-3 may include a first surface treatment portion 721-321 that contacts the metal layer 721-31 of the connecting portion 721-3, and a second surface treatment portion 721-322 that contacts the plating layer 721-33 of the connecting portion 721-3. Furthermore, the elements in the first surface treatment portion 721-321 and the elements in the second surface treatment portion 721-322 may appear different from each other.

[0383] That is, as shown in Tables 1 and 2, metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 comprise titanium, and therefore surface treatment layers 721-12, 721-22, 721-32, 722-12, and 722-2 comprise titanium. Therefore, the elements shown in Tables 1 and 2 can be included in the first surface treatment portions 721-321.

[0384] Alternatively, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may consist only of copper. For example, titanium is not included in plating layers 721-13, 721-23, 721-33, 722-13, and 722-23. Therefore, titanium may not be included in the second surface treatment portions 721-322.

[0385] For example, such as Figure 9c As shown in Table 3, the surface analysis results in region C of the second surface treatment section 721-322 are presented.

[0386] [Table 3]

[0387]

[0388] As shown in Table 3, the second surface treatment portions 721-322 may not contain titanium (Ti) included in the first surface treatment portions 721-321.

[0389] The coating will be described in detail below.

[0390] The plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be formed by electrolytic plating or electroless plating on the metal layers 721-13, 721-23, 721-33, 722-13, and 722-23, which are rolled copper foil alloys. The plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be formed by plating copper-containing plating particles on the surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. The plating particles constituting the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may contain binary or ternary composite elements, wherein the binary or ternary composite elements include copper as a major component and at least one of Ni, Co, Mn, and Al. The plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may be formed on metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 to have a predetermined thickness. For example, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may have a thickness in the range of 0.5 μm to 10 μm. For example, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can have a thickness ranging from 0.8 μm to 8 μm. For example, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can have a thickness ranging from 1.0 μm to 6 μm. When the thickness of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.5 μm, it may be difficult to form plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 of uniform thickness on the surfaces of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. For example, when the thickness of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.5 μm, a problem may occur where plating layers do not form in specific areas of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Therefore, oxidation of the patterned portion may occur. When the thickness of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 10 μm, the total thickness of the patterned portion increases. Therefore, the elasticity of the patterned portion may be reduced, and the mobility of the moving parts of the camera module may be reduced.Furthermore, when the thickness of the plating layers 721-13, 721-23, 721-33, 722-13 and 722-23 exceeds 10 μm, the resistance of the patterned portion may increase and the signal transmission loss may increase.

[0391] Meanwhile, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the embodiments are described as being disposed on only one surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, but are not limited thereto. That is, the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may also be disposed on the upper surface of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Furthermore, when the plating layer is also disposed on the upper surface of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, the adhesion between the metal layers 721-11, 721-21, and 721-31 and the dry film (not shown) can be improved during the etching process used to pattern the metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Moreover, improved adhesion between the metal layers and the dry film can enhance the etching reliability of the metal layers.

[0392] Figure 10 This is a view used to illustrate the surface roughness of the metal layer and plating layer of the patterned portion according to the embodiment.

[0393] Figure 10 (a) is a view showing the surfaces of the metal layers 721-11, 721-21, 721-31, 722-11 and 722-21 of the patterned portion 720, and Figure 10 (b) is a view showing the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13 and 722-23 of the patterned portion 720.

[0394] like Figure 10 As shown in (a), metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 refer to the surface of the rolled copper foil alloy. Therefore, the surface roughness values ​​of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 are lower than the surface roughness values ​​of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23.

[0395] For example, the surfaces of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 have a centerline average surface roughness (Ra) in the range of 0.025 μm to 0.035 μm and / or a 10-point average surface roughness in the range of 0.3 μm to 0.5 μm. Furthermore, when the surfaces of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 are in direct contact with the surface of the insulating portion 710 (or the surface of the adhesive layer disposed on the surface of the insulating portion), the following problem exists: metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 separate from the insulating portion 710 due to increased adhesion.

[0396] Therefore, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 are formed on the surfaces of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21. Therefore, in this embodiment, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23, rather than the surfaces of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, contact the surface of the insulating portion 710 (or the surface of the adhesive layer). Therefore, this embodiment can improve the adhesion between the patterned portion 720 and the insulating portion 710.

[0397] At this time, the reference range for the surface roughness of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be as follows. That is, the reference range for the centerline average surface roughness (Ra) and the reference range for the 10-point average surface roughness (Rz) of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 can be as follows. For example, the surface of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 (specifically, the lower surface facing the upper surface of the insulating portion 710) can have a centerline average surface roughness (Ra) in the range of 0.05 μm to 1.5 μm. For example, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the embodiments may have a centerline average surface roughness (Ra) in the range of 0.05 μm to 1.0 μm. For example, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the embodiments may have a centerline average surface roughness Ra in the range of 0.08 μm to 0.8 μm. For example, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the embodiments may have a 10-point average surface roughness (Rz) in the range of 0.6 μm to 15 μm. For example, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the embodiments may have a 10-point average surface roughness (Rz) in the range of 0.7 μm to 14.0 μm. For example, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may have a 10-point average surface roughness Rz in the range of 1.0 μm to 12 μm.

[0398] In other words, compared to the surfaces of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the embodiments can have a surface roughness 10 times or greater. That is, compared to the surfaces of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21, the surfaces of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in the embodiments can have a surface roughness 20 times or greater.

[0399] When the surface roughness of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 has a centerline average roughness (Ra) of less than 0.05 μm or a 10-point average roughness (Rz) of less than 0.6 μm, the patterned portion 720 may detach from the insulating portion 710 due to reduced adhesion between the patterned portion 720 and the insulating portion 710. Furthermore, when the surface roughness of plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 has a centerline average roughness (Ra) of less than 0.05 μm or a 10-point average roughness (Rz) of less than 0.6 μm, the etching efficiency of metal layers 721-11, 721-21, 721-31, 722-11, and 722-21 may decrease. Furthermore, when etching efficiency decreases, the difference between the width of the upper surface and the width of the lower surface of the patterned portion 720 may increase, and thus the electrical reliability of the patterned portion 720 may deteriorate.

[0400] Furthermore, when the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 has a centerline average roughness (Ra) exceeding 1.5 μm or a 10-point average roughness (Rz) exceeding 15.0 μm, the thickness of the patterned portion 720 may increase. Additionally, as the thickness of the patterned portion 720 increases, the mobility of the sensor portion relative to the fixed portion can decrease due to a reduction in the elasticity of the patterned portion 720.

[0401] Figures 11a to 11e This is a view used to illustrate the relationship between the plating condition and the adhesion of the plating layer according to the embodiment.

[0402] Figure 11a This is a view showing the relationship between the adhesion strength between the plated layer and the insulating portion and the first plating condition. Figure 11b This is a view showing the relationship between the adhesion between the plated layer and the insulating portion and the second plating condition. Figure 11c This is a view showing the relationship between the adhesion between the plated layer and the insulating portion and the third plating condition. Figure 11d This is a view showing the relationship between the adhesion between the plated layer and the insulating portion and the fourth plating condition, and Figure 11e This is a view showing the relationship between the adhesive strength between the coated layer and the insulating portion and the fifth coating condition.

[0403] In the following text, reference will be made to Figures 11a to 11e Describe the relationship between the coating condition and adhesion strength.

[0404] As described above, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 with a certain level of centerline average surface roughness (Ra) and 10-point average surface roughness (Rz) are formed on the surfaces of the metal layers 721-11, 721-21, 721-31, 722-11, and 722-23 constituting the patterned portion 720. This increases the adhesion between the patterned portion 720 and the insulating portion 710.

[0405] However, it has been confirmed that even if the centerline average surface roughness (Ra) and / or 10-point average surface roughness (Rz) of the surfaces of the plating layers 721-13, 721-23, 721-33, 722-13 and 722-23 meet the above range, there is still a problem of reduced adhesion between the patterned portion 720 and the insulating portion 710.

[0406] Figure 11a This is a view used to illustrate the peel strength (90° peel strength) between the plating layer and the insulating portion under the first plating condition. Figure 11a (a) is a view showing a 3D image of the surface roughness of the coating under the first coating condition, and Figure 11a (b) is a view showing the curve of the surface roughness of the coating under the first coating condition.

[0407] Specifically, Figure 11a The peel strength (90° peel strength) between the plating layer and the insulating portion is shown when the surface roughness of the plating layer has a centerline average roughness (Ra) of 0.2 μm and a 10-point average roughness (Rz) of 6.1 μm, and the thickness of the plating layer is 3.7 μm. At this time, as... Figure 11a As in the case where, when a centerline average roughness (Ra) and a 10-point average roughness (Rz) within the above range are formed under the first plating condition, the peel strength (90° peel strength) between the plating layer and the insulating portion is confirmed to be 79.5 gf / mm.

[0408] Figure 11b This is a view used to illustrate the peel strength (90° peel strength) between the plating layer and the insulating portion under the second electroplating condition. Figure 11b (a) is a view showing a 3D image of the surface roughness of the plating layer under the second plating condition, and Figure 11b (b) is a view showing the curve of the surface roughness of the coating layer under the second coating condition.

[0409] Specifically, Figure 11bThe peel strength (90° peel strength) between the plating layer and the insulating portion is shown when the surface roughness of the plating layer has a centerline average roughness (Ra) of 0.6 μm and a 10-point average roughness (Rz) of 7.4 μm, and the thickness of the plating layer is 1.4 μm. At this time, as... Figure 11b As in the case where a plating layer with a centerline average roughness (Ra) and a 10-point average roughness (Rz) within the above range is formed under the second plating condition, the peel strength (90° peel strength) between the plating layer and the insulating portion is confirmed to be 45.5 gf / mm.

[0410] Figure 11c This is a diagram used to illustrate the peel strength (90° peel strength) between the plating layer and the insulating part under the third plating condition. Figure 11c (a) is a diagram showing a 3D image of the surface roughness of the coating under the third coating condition, and Figure 11c (b) is a graph showing the surface roughness of the coating layer under the third coating condition.

[0411] Specifically, Figure 11c The peel strength (90° peel strength) between the plating layer and the insulating portion is shown when the surface roughness of the plating layer has a centerline average roughness (Ra) of 1.0 μm and a 10-point average roughness (Rz) of 9.9 μm, and the plating layer thickness is 5.7 μm. At this time, as... Figure 11c As shown, when a plating layer is formed under the third plating condition with a centerline average roughness (Ra) and a 10-point average roughness (Rz) within the above range, the peel strength (90' peel strength) between the plating layer and the insulating part is confirmed to be 70.9 gf / mm.

[0412] Figure 11d This is a diagram used to illustrate the peel strength (90° peel strength) between the plating layer and the insulating part under the fourth plating condition. Figure 11d (a) is a diagram showing a 3D image of the surface roughness of the coating under the fourth coating condition, and Figure 11d (b) is a graph showing the surface roughness of the coating layer under the fourth coating condition.

[0413] Specifically, Figure 11d The peel strength (90° peel strength) between the plating layer and the insulating portion is shown when the surface roughness of the plating layer has a centerline average roughness (Ra) of 0.3 μm and a 10-point average roughness (Rz) of 4.5 μm, and the thickness of the plating layer is 4.5 μm. At this time, as... Figure 11dAs shown, when a plating layer is formed under the fourth plating condition with a centerline average roughness (Ra) and a 10-point average roughness (Rz) within the above range, the peel strength (90' peel strength) between the plating layer and the insulating part is confirmed to be 5.9 gf / mm.

[0414] Figure 11e This is a diagram used to illustrate the peel strength (90° peel strength) between the plating layer and the insulating part under the fifth plating condition. Figure 11e (a) is a diagram showing a 3D image of the surface roughness of the coating layer under the fifth coating condition, and Figure 11e (b) is a graph showing the surface roughness of the coating layer under the fifth coating condition.

[0415] Specifically, Figure 11e The peel strength (90° peel strength) between the plating layer and the insulating portion is shown when the surface roughness of the plating layer has a centerline average roughness (Ra) of 0.9 μm and a 10-point average roughness (Rz) of 13.4 μm, and the plating layer thickness is 4.3 μm. At this time, as... Figure 11e As shown, when a plating layer is formed under the fifth plating condition with a centerline average roughness (Ra) and a 10-point average roughness (Rz) within the above range, the peel strength (90° peel strength) between the plating layer and the insulating part is confirmed to be 36.0 gf / mm.

[0416] That is, such as Figures 11a to 11e As shown, the surface roughness of the coating layer formed by the first to fifth coating conditions meets the reference range of centerline average surface roughness (Ra) and 10-point average surface roughness (Rz) required in this embodiment. However, it has been confirmed that even when the centerline average surface roughness Ra and 10-point average surface roughness Rz meet the reference range, the 90° peel strength can still be 50 gf / mm or less.

[0417] In addition, such as Figures 11a to 11e As shown, it is confirmed that even as the centerline average surface roughness (Ra) and 10-point average surface roughness (Rz) of the plating layer increase, the peel strength (90° peel strength) between the plating layer and the insulating portion decreases. For example, as... Figure 11d As shown, even when the average roughness (Ra) of the centerline of the coating is 0.3 μm and the 10-point average surface roughness (Rz) of the coating is 4.5 μm, it is confirmed that the peel strength (90' peel strength) between the coating and the insulating part is significantly low, at 5.9 gf / mm.

[0418] In addition, such as Figures 11a to 11eAs shown, it is confirmed that even when the thickness of the plating layer increases, the peel strength (90° peel strength) between the plating layer and the insulating part does not increase.

[0419] In short, according to Figures 11a to 11e When the centerline average surface roughness (Ra) and 10-point average surface roughness (Rz) of the coating increase or the thickness of the coating increases, it is confirmed that the peel strength (90° peel strength) between the coating and the insulation portion decreases considerably.

[0420] At this point, the adhesion force corresponding to the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 needs to be 50 gf / mm or greater. For example, when the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710 is less than 50 gf / mm, there is a problem of separation between the patterned portion 720 and the insulating portion 710. Therefore, the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710 should have a minimum value of 50 gf / mm or greater.

[0421] In summary, when the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 of the patterned portion 720 of this embodiment has a centerline average surface roughness (Ra) and a 10-point average surface roughness (Rz) within the reference range, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 increases. However, even when the surface roughness of the plating layers has a centerline average surface roughness (Ra) and a 10-point average surface roughness (Rz) within the reference range, the peel strength (90' peel strength) appears to be less than 50 gf / mm.

[0422] Therefore, this embodiment controls other conditions affecting the 90' ​​peel strength, except for the surface roughness of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23. For example, in this embodiment, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is set to have a value greater than or equal to a certain level.

[0423] Figures 12a to 12e These are SEM images showing the surfaces of the coating layers according to the first to fifth coating conditions. For example, Figures 12a to 12e Each of the (a) in the diagram shows a 40° tilt. Figure (b) shows SEM images under 2k conditions, and (b) shows the image at a 40° tilt. Images of SEM images taken at 10k resolution.

[0424] Reference Figures 12a to 12eIt is confirmed that the size of the plating particles of the plating layers 721-13, 721-23, 721-33, 722-13 and 722-23 of the pattern portion 720 should be mainly controlled in order to match the peel strength (90' peel strength) between the pattern portion 720 and the insulating portion 710 to 50 gf / mm or greater.

[0425] The particle size of the coating can be measured using a SEM device. For example, the particle size can be measured using surface images of the coating layers 721-13, 721-23, 721-33, 722-13, and 722-23 obtained by capturing them at a certain magnification using an SEM device. For example, the particle size can refer to the average particle size of the coating layer. For example, the particle size can be measured based on surface images of the coating layer obtained at 10,000x magnification. For example, the size of multiple coating particles can be measured separately in the surface images. The particle size can then be obtained by calculating the average of the measured particle sizes.

[0426] like Figure 12a As shown, when the average particle size of the plating layer under the first plating condition is 1.2 μm, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is confirmed to be 79.5 gf / mm.

[0427] In addition, such as Figure 12b As shown, when the average particle size of the plating layer under the second plating condition is 4.3 μm, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is confirmed to be 45.5 gf / mm.

[0428] In addition, such as Figure 12c As shown, when the average particle size of the plating layer in the third plating condition is 3.0 μm, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is confirmed to be 70.9 gf / mm.

[0429] In addition, such as Figure 12d As shown, when the average particle size of the plating layer under the fourth plating condition is 5.19 μm, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is confirmed to be 5.9 gf / mm.

[0430] In addition, such as Figure 12e As shown, when the average particle size of the plating layer in the fifth plating condition is 5.0 μm, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is confirmed to be 36.0 gf / mm.

[0431] That is, such as Figures 12a to 12e As shown, it is confirmed that the 90° peel strength between the patterned portion 720 and the insulating portion 710 can only be of a certain level when the average value of the plated particle size of the plating layers 721-13, 721-23, 721-33, 722-13 and 722-23 is within a certain range.

[0432] Specifically, when the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 5.15 μm, it is confirmed that the peel strength between the patterned portion 720 and the insulating portion 710 decreases rapidly. Therefore, the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in this embodiment is set to 5.15 μm or less. For example, the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in this embodiment is set to 5.1 μm or less. For example, the average value of the plated particle size of the plating layers 721-13, 721-23, 721-33, 722-13 and 722-23 in this embodiment is set to 5.0 μm or smaller.

[0433] Preferably, in this embodiment, the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is in the range of 0.8 μm to 5.15 μm. For example, the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in this embodiment is in the range of 0.9 μm to 5.10 μm. For example, the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is in the range of 1.0 μm to 5.0 μm.

[0434] At this point, when the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is less than 0.8 μm, the average surface roughness Ra of the centerline and / or the average surface roughness Rz at 10 points of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 may not meet the reference range. Therefore, the peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 can be reduced.

[0435] Furthermore, when the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 5.15 μm, such as Figure 12d As shown, there may be a problem of rapid decrease in the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710.

[0436] Therefore, the average particle size of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 in this embodiment is 0.8 μm to 5.15 μm. Consequently, the peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 can be maintained at a certain level or higher.

[0437] Figure 13a and Figure 13b This is a histogram showing the particle size of the plating layer according to the first to fifth plating conditions. For example, Figure 13a and Figure 13b This is a diagram showing the size distribution of the plating particles in the plating layer according to the first to fifth plating conditions.

[0438] Figures 12a to 12e The average particle size of the coating layer shown can also be expressed as follows: Figure 13a and Figure 13b Size distribution diagram of the coated particles.

[0439] For example, a histogram or size distribution diagram of the coated particles is a graph showing the number of coated particles in terms of size exposed on the surfaces of coatings 721-13, 721-23, 721-33, 722-13, and 722-23. For example, Figures 13a to 13b It can show the difference between the maximum and minimum size of the coated particles.

[0440] Reference Figure 13a When the distribution of the plating particle size of the plating layer according to the first plating condition is 1.60 μm (that is, when the difference between the maximum and minimum size of the plating particles is 1.60 μm), it is confirmed that the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710 remains at a constant level.

[0441] Reference Figure 13b (A) When the distribution of the plating particle size of the plating layer according to the second plating condition is 5.31 μm (i.e., when the difference between the maximum and minimum size of the plating particles is 5.31 μm), it is confirmed that the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710 remains at a constant level.

[0442] Reference Figure 13b(B) When the distribution of the plating particle size of the plating layer according to the third plating condition is 6.55 μm (i.e., when the difference between the maximum and minimum size of the plating particles is 6.55 μm), it is confirmed that the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710 remains at a constant level.

[0443] Reference Figure 13b (C) When the distribution of the plating particle size of the plating layer according to the fourth plating condition is 4.02 μm (i.e., when the difference between the maximum and minimum size of the plating particles is 4.02 μm), it is confirmed that the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710 remains at a constant level.

[0444] Reference Figure 13b (D) When the distribution of the plating particle size of the plating layer according to the fifth plating condition is 4.65 μm (i.e., when the difference between the maximum and minimum size of the plating particles is 4.65 μm), it is confirmed that the 90' ​​peel strength between the patterned portion 720 and the insulating portion 710 remains at a constant level.

[0445] However, when the particle size distribution of the plating layer exceeds 7.0 μm, it is confirmed that the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 decreases rapidly.

[0446] Therefore, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 have a particle size distribution of 7.0 μm or smaller. For example, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 have a particle size distribution of 6.5 μm or smaller. For example, plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 have a particle size distribution of 6.0 μm or smaller.

[0447] For example, in this embodiment, the difference between the size of the first plated particle and the size of the second plated particle in plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is 7.0 μm or less. The first plated particle is the plated particle with the largest size among the plated particles in the plating layer. The second plated particle is the plated particle with the smallest size among the plated particles in the plating layer. For example, the difference between the size of the first plated particle and the size of the second plated particle in plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 is 6.5 μm or less. For example, the difference between the size of the first plated particle and the size of the second plated particle is 6.0 μm or less.

[0448] If the distribution of the plating layers 721-13, 721-23, 721-33, 722-13, and 722-23 exceeds 7.0 μm, or the difference between the first plating particles and the second plating particles exceeds 7.0 μm, the peel strength 90' between the patterned portion 720 and the insulating portion 710 may decrease. Therefore, in the environment of use of the camera module, the patterned portion 720 can be separated from the insulating portion 710.

[0449] Figure 14 This is a graph showing the relationship between the surface area of ​​the coated particles and the peel strength according to the embodiment.

[0450] It is confirmed that the peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 varies depending on the average size of the plated particles of the aforementioned plating layer, the size distribution of the plated particles, and the difference between the maximum and minimum size of the plated particles.

[0451] In addition, the average size of the coated particles, the size distribution of the coated particles, and the difference between the maximum and minimum size of the coated particles can also be expressed as the surface area of ​​the coated particles.

[0452] Furthermore, it has been confirmed that, based on the per unit area (1 μm) of the coated layer... 2 The surface area of ​​the plated particles, and the peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 are different.

[0453] The coating area per unit area (1 μm) can be measured under the following assumptions. 2 The surface area of ​​the coated particles.

[0454] (1) The shape of the coated particles is spherical.

[0455] (2) About half (hemisphere) of the coated particles are exposed on the surface of the coating.

[0456] Furthermore, the surface area can be calculated using the following sequential calculation method.

[0457] (1) Measure the size (e.g., diameter) of the coated particles using the method described above for measuring the size of coated particles.

[0458] (2) Calculate the first surface area of ​​the coated particles with this size.

[0459] (3) Check for areas larger than 1 μm 2 The first area (e.g., 115 μm) 2 The number of coated particles included in the area)

[0460] (4) Calculate the second surface area of ​​half (e.g., half of the first surface area of ​​the coated particle) of the first surface area.

[0461] (5) Calculate the first surface area of ​​the coated particles in the first area using the number of coated particles and the second surface area.

[0462] (6) Calculate the unit area (1 μm) using the first surface area. 2 Surface area of ​​the coated particles in )

[0463] Furthermore, the surface area of ​​the coated particles per coating layer area, calculated based on the above assumptions and calculation methods, is shown in Table 4 below.

[0464] [Table 4]

[0465]

[0466] Referring to Table 4, when the average particle size of the coating layer under the first coating condition is 1.2 μm, it is confirmed that every 3000 μm 2 The surface area of ​​the coated particles (μm) 2 The figure is 4351.99.

[0467] Referring to Table 4, when the average particle size of the coating layer under the second coating condition is 4.3 μm, it is confirmed that every 3000 μm 2 The surface area of ​​the coated particles (μm) 2 The value is 929.41.

[0468] Referring to Table 4, when the average particle size of the coating layer under the third coating condition is 3 μm, it is confirmed that every 3000 μm 2 The surface area of ​​the coated particles (μm) 2 The value is 3308.10.

[0469] Referring to Table 4, when the average particle size of the coating layer under the fourth coating condition is 5.19 μm, it is confirmed that every 3000 μm 2 The surface area of ​​the coated particles (μm) 2 The value is 507.73.

[0470] Referring to Table 4, when the average particle size of the coating layer in the fifth coating condition is 5 μm, it is confirmed that every 3000 μm 2 The surface area of ​​the coated particles (μm) 2 The value is 824.67.

[0471] Furthermore, according to the embodiments in Table 4, the coating layer per unit area (1 μm)2 The surface area of ​​the coated particles can be shown in Table 5 below.

[0472] [Table 5]

[0473]

[0474] According to Table 5, the coating layer per unit area (1 μm) under the first coating condition 2 The surface area (μm) of the coated particles 2 The peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 is 1.5, and at this time, the peel strength (90° peel strength) between them is confirmed to be 79.5 gf / mm.

[0475] Furthermore, based on the second plating condition, the per unit area (1 μm) of the plating layer 2 The surface area (μm) of the coated particles 2 The peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 is 0.3, and at this time, the peel strength (90° peel strength) between them is confirmed to be 45.5 gf / mm.

[0476] Furthermore, based on the third plating condition, the coating layer per unit area (1 μm) 2 The surface area (μm) of the coated particles 2 The value is 1.1, and at this time, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is confirmed to be 70.9 gf / mm.

[0477] Furthermore, based on the fourth plating condition, the per unit area (1 μm) of the plating layer 2 The surface area (μm) of the coated particles 2 The peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 is 0.2, and at this time, the peel strength (90° peel strength) between them is confirmed to be 5.9 gf / mm.

[0478] Furthermore, based on the fifth plating condition, the per unit area (1 μm) of the plating layer 2 The surface area (μm) of the coated particles 2 The value is 0.3, and at this time, the peel strength (90' peel strength) between the patterned portion 720 and the insulating portion 710 is confirmed to be 36 gf / mm.

[0479] Summary Table 5 and Figure 14 The content refers to the amount of plating applied between the patterned portion 720 and the insulating portion 710 per unit area (1 μm). 2 The surface area (μm) of the coated particles 2When the strength is less than 0.5, the 90° peel strength between the patterned portion 720 and the insulating portion 710 is confirmed to be less than 50 gf / mm. Therefore, the peel strength per unit area (1 μm) of the coating layer is less than 50 gf / mm. 2 The surface area (μm) of the coated particles 2 The peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 is 0.5 or greater. Therefore, in the embodiment, the peel strength (90° peel strength) between the patterned portion 720 and the insulating portion 710 is 50 gf / mm or greater.

[0480] Figure 15 It is a mobile terminal that uses a camera module according to the implementation method.

[0481] As shown in Figure 13, the mobile terminal 1500 of this embodiment may include a camera module 1000, a flash module 1530, and an autofocus device 1510 disposed on the rear side. The mobile terminal 1500 of this embodiment may also include a second camera module 1100.

[0482] The camera module 1000 may include image capture functionality and autofocus functionality. For example, the camera module 1000 may include an autofocus function that uses an image.

[0483] The camera module 1000 processes image frames of still or moving images acquired by the image sensor in capture mode or video call mode. The processed image frames can be displayed on a predetermined display unit and stored in memory. The camera (not shown) can also be mounted on the front of the mobile terminal.

[0484] For example, camera module 1000 may include a first camera module and a second camera module, and OIS may be implemented by the first camera module together with AF or zoom function.

[0485] The flash module 1530 may include a light emitting device therein. The flash module 1530 can be operated via camera operation of a mobile terminal or by user control.

[0486] The autofocusing device 1510 may include one of the packages of a surface-emitting laser device as a light-emitting unit.

[0487] The autofocus device 1510 may include an autofocus function using a laser. The autofocus device 1510 can be primarily used to address situations where the autofocus function of the image from the camera module 1000 is degraded, such as when the image is close to 10 m or smaller, or in a dark environment. The autofocus device 1510 may include a light emitting unit and a light receiving unit, the light emitting unit including a vertical-cavity surface-emitting laser (VCSEL) semiconductor device, and the light receiving unit, for example, a photodiode that converts light energy into electrical energy.

[0488] The lens driving device of this embodiment includes a sensor portion and a circuit board for moving an image sensor connected to the sensor portion. The circuit board may be an intermediary. The sensor portion includes a sensor substrate connected to the circuit board and an image sensor mounted on the sensor substrate. In this case, the sensor substrate includes pads electrically connected to the circuit board and mounting pads different from the pads. In this case, the circuit board may include an opening into which the mounting pads of the sensor substrate are inserted.

[0489] Therefore, the fixing pads of this embodiment can be inserted into the opening during the soldering process between the circuit board and the sensor substrate. This allows for easier alignment between the circuit board and the sensor substrate during the soldering process.

[0490] Furthermore, this embodiment can limit the movement of the sensor substrate while maintaining alignment between the circuit board and the sensor substrate. Therefore, this embodiment solves the problem of positional misalignment between the circuit board and the sensor substrate that occurs during the soldering process. Consequently, this embodiment improves manufacturability.

[0491] This implementation method can also improve the electrical connection between the sensor substrate and the circuit board. Therefore, this implementation method can improve product reliability.

[0492] Furthermore, the circuit board of this embodiment includes an insulating portion and a patterned portion. The insulating portion includes a first insulating region, a second insulating region, and a separation region between them. The patterned portion includes: a first terminal portion disposed on the first insulating region for connection to a sensor substrate; a second terminal portion disposed on the second insulating region for connection to a main substrate; and a connecting portion disposed on the separation region and connecting the first terminal portion and the second terminal portion. In this case, the connecting portion includes a bent portion disposed at each corner of the separation region. In this case, each bent portion of the connecting portion is bent by rotating in the same direction at the corner. Therefore, the mobility of the sensor portion by the circuit board can be improved by the bent structure of the connecting portion. Furthermore, this embodiment can improve the accuracy of the moving position of the sensor portion.

[0493] Furthermore, the curved portion of the connecting part in this embodiment includes a first open area that exposes a portion of each corner of the separating area. In this case, the first open area may be formed at a location where it overlaps with the protrusion of the second frame constituting the first moving part along the optical axis. Additionally, the connecting part includes an inner connecting portion disposed within the first open area and an outer connecting portion disposed outside the first open area while avoiding it. In this case, the number of inner connecting portions may be less than the number of outer connecting portions.

[0494] Therefore, by making the number of external connecting portions located outside the first open area greater than the number of internal connecting portions located inside the first open area, this embodiment can increase the mobility of the first moving portion. For example, when the number of external connecting portions is greater than the number of internal connecting portions, the amount of movement of the first moving portion can be easily adjusted compared to the opposite case. For example, the external connecting portions are located outside the first open area and have a longer length than the internal connecting portions. Furthermore, since the length of the external connecting portions is greater than the length of the internal connecting portions, the intensity of the driving force required to move the first moving portion can be reduced compared to the internal connecting portions. Therefore, the mobility of the first moving portion in this embodiment can be improved by the difference in the number of internal and external connecting portions. In addition, the amount of movement of the first moving portion can be finely adjusted.

[0495] Furthermore, each of the outer and inner connecting portions in this embodiment includes multiple bending points. In this case, the number of bending points in the outer connecting portion can be the same as the number of bending points in the inner connecting portion. Additionally, the mobility of the first moving portion can be increased by the same number of bending points.

[0496] For example, when the number of bending points in the outer connecting part differs from the number of bending points in the inner connecting part, the force may concentrate on the connecting part with a relatively large number of bending points. Therefore, the connecting part where the force is concentrated may break before other connecting parts. Furthermore, the accuracy of movement of the first moving part may also be problematic.

[0497] Conversely, when the first moving part moves, because the number of bending points is the same, the force applied to the inner and outer connecting parts in this embodiment can be evenly distributed. Therefore, in this embodiment, the force can be evenly distributed to the inner and outer connecting parts. Thus, this embodiment can solve the problem of a particular connecting part being cut off first. Furthermore, even when a connecting part is cut off, the inner and outer connecting parts in this embodiment can be cut off simultaneously.

[0498] This embodiment also includes an adhesive layer disposed in a through-hole passing through a first insulating region of the circuit board, and a heat dissipation portion attached to the circuit board via the adhesive layer. Furthermore, the heat dissipation portion can dissipate heat generated from the sensor substrate.

[0499] Therefore, this embodiment improves heat dissipation characteristics by dissipating the heat generated by the image sensor to the outside. Consequently, this embodiment improves the operational reliability of the image sensor. Furthermore, this embodiment improves the quality of images acquired from the image sensor.

[0500] Furthermore, the patterned portion of this embodiment includes a metal layer and a surface treatment layer disposed on the metal layer. The surface treatment layer may be a thin film layer formed by coating an organic material. In this case, the dielectric constant (εr) of the organic material is 3.24. This value is significantly smaller than the dielectric constant (εr) of nickel or gold (Au) in a normal surface treatment layer. That is, the dielectric constant (εr) of nickel or gold (Au) is 4 or greater.

[0501] Therefore, this embodiment can improve the signal transmission speed of wiring that changes inversely to the relative permittivity of the surface treatment layer. Consequently, this embodiment can improve the product reliability of the circuit board.

[0502] Furthermore, the organic material used in the surface treatment layer of this embodiment has a higher thermal conductivity than nickel. Therefore, this embodiment can increase the thermal conductivity of the patterned portion.

[0503] In particular, the heat dissipation characteristics of electronic products, including camera modules, are becoming a major issue because they affect product performance. That is, components included in camera modules have structures susceptible to heat dissipation. Therefore, efforts are underway to improve the heat dissipation characteristics of camera modules. In this context, this embodiment can increase the thermal conductivity of the patterned portions through an organic coating. Therefore, this embodiment can improve the heat dissipation characteristics of both the circuit board and the camera module using the circuit board.

[0504] Furthermore, in this embodiment, the patterned portion is part of the configuration of the first moving portion of the camera module. Therefore, the patterned portion can move along with the first moving portion. Additionally, when the first moving portion moves, the patterned portion may come into contact with other components. In this case, electrical reliability issues may arise when the patterned portion comes into contact with other components.

[0505] In this embodiment, the organic material of the surface treatment layer has a conductivity lower than that of nickel or gold. Therefore, the surface treatment layer can perform an insulating function when the patterned portion comes into contact with other components. Thus, this embodiment can improve the electrical reliability of the circuit board. Furthermore, this embodiment can simplify the plating process by applying an organic coating method, thereby further reducing plating costs.

[0506] On the other hand, the patterned portion of this embodiment includes a plating layer disposed between the metal layer and the surface treatment layer. The plating layer can improve the peel strength between the patterned portion and the insulating portion.

[0507] In this case, the plating layer has a surface roughness. Even as the surface roughness of the plating layer increases, the adhesion between the plating layer and the insulating portion decreases. Therefore, this embodiment improves adhesion by controlling the size of the plating particles constituting the plating layer.

[0508] For example, the average value of the coated particles in this embodiment ranges from 0.8 μm to 5.15 μm. Furthermore, in this embodiment, the difference between the first coated particle with the largest size and the second coated particle with the smallest size is 7.0 μm or less. Additionally, the unit area of ​​the coated layer (1 μm²) 2 The surface area of ​​the coated particles in the coating can be 0.5 μm. 2 Or greater. Furthermore, the centerline average surface roughness (Ra) of the coating layer ranges from 0.05 μm to 1.5 μm. Furthermore, the 10-point average surface roughness (Rz) of the coating layer ranges from 0.6 μm to 15 μm. Therefore, this embodiment can further improve the adhesion between the patterned portion and the insulating portion. Furthermore, the peel strength (90° peel strength) between the patterned portion and the insulating portion in this embodiment is 50 gf / mm or greater. Therefore, this embodiment can solve the reliability problem of separation between the patterned portion and the insulating portion in environments where camera modules are used. Furthermore, this embodiment can improve the operational reliability of the camera module's autofocus or image stabilization functions.

[0509] Next, Figure 16 This is a perspective view of a vehicle that utilizes a camera module according to the implementation method.

[0510] For example, Figure 16 It is an external view of a vehicle having a vehicle driving assistance device with a camera module applied according to the embodiment.

[0511] Reference Figure 16 The vehicle 800 according to the embodiment may include wheels 13FL and 13FR that rotate via a power source and predetermined sensors. The sensors may be, but are not limited to, a camera sensor 2000.

[0512] Camera 2000 may be a camera sensor that uses camera module 1000 according to the embodiment.

[0513] In this embodiment, the vehicle 800 can acquire image information via a camera sensor 2000 that captures images of the front or surroundings. Therefore, the vehicle can use the image information to determine if a lane is not recognized, and can generate a virtual lane when a lane is not recognized.

[0514] For example, camera sensor 2000 captures the front of vehicle 800 to obtain a frontal image, and processor (not shown) analyzes objects included in the frontal image to obtain image information.

[0515] For example, when an image captured by the camera sensor 2000 contains objects such as lanes, adjacent vehicles, driving obstacles, and indirect road markings including median strips, curbs, streets, etc., the processor can detect such objects and include them in the image information.

[0516] In this scenario, the processor can also supplement the image information by acquiring distance information from objects detected by the camera sensor 2000. The image information can be information about the objects captured in the image.

[0517] The camera sensor 2000 may include an image sensor and an image processing module. The camera sensor 2000 can process still images or moving images acquired by the image sensor (e.g., CMOS or CCD). The image processing module can process the still images or moving images acquired by the image sensor, extract necessary information, and send the extracted information to a processor.

[0518] In this case, the camera sensor 2000 may include a stereo camera to improve the accuracy of object measurement and further ensure information such as the distance between the vehicle 800 and the object, but is not limited thereto.

[0519] The vehicle 800 in this embodiment can provide an advanced driver assistance system (ADAS).

[0520] For example, Advanced Driver Assistance Systems (ADAS) include: Autonomous Emergency Braking (AEB), which automatically slows down or stops the vehicle without the driver applying the brakes during a collision; Lane Keeping Assist System (LKAS), which maintains the vehicle in its lane by adjusting the driving direction if the vehicle deviates from its lane; Advanced Smart Cruise Control (ASCC), which maintains a safe distance from the vehicle in front while driving at a predetermined speed; Active Blind Spot Detection (ABSD), which detects collision risks in blind spots and helps the vehicle change lanes safely; and Surround View Monitor (AVM), which provides a visual view of the vehicle's surroundings.

[0521] In such advanced driver assistance systems (ADAS), camera modules are used as a core component along with radar and other sensors, and the application of camera modules is gradually increasing.

[0522] For example, when the driver is not in control of the vehicle, the Autonomous Emergency Braking (AEB) system can automatically provide emergency braking by using forward camera sensors and radar sensors to detect vehicles or pedestrians ahead. Alternatively, the Driver Steering Assist System (LKAS) can use camera sensors to detect if the driver is leaving the lane without directional input and automatically steer the steering wheel to maintain lane position. Furthermore, the Surround View Monitor (AVM) system can visually display the vehicle's surroundings using camera sensors placed on all sides of the vehicle.

[0523] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment, but are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc., shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, content related to these combinations and variations should be interpreted as including within the scope of this embodiment.

[0524] The foregoing has primarily described this embodiment, but this is merely an example and does not limit the scope of this embodiment. Those skilled in the art will understand that various modifications and applications not shown above are possible without departing from the fundamental characteristics of this embodiment. For example, each component specifically shown in this embodiment can be implemented through modification. Furthermore, differences related to these modifications and applications should be interpreted as including within the scope of the embodiments set forth in the appended claims.

[0525] Regarding the implementation methods including the above embodiments, the following technical solutions are also disclosed:

[0526] Option 1. A circuit board, comprising:

[0527] Insulation parts; and

[0528] The pattern portion provided on the insulating portion

[0529] The insulating portion includes:

[0530] The first insulation region, and

[0531] A second insulating region is disposed outside the first insulating region and spaced apart from the first insulating region, and a separation region is provided between the first insulating region and the second insulating region;

[0532] The pattern portion includes:

[0533] The first pattern portion for signal transmission; and

[0534] The second pattern portion includes a pseudo-pattern that is separate from the first pattern portion;

[0535] The first pattern portion includes:

[0536] A first terminal portion disposed on the first insulating region;

[0537] The second terminal portion disposed on the second insulating region; and

[0538] A connecting portion is disposed on the separation area and connects the first terminal portion and the second terminal portion.

[0539] The second pattern portion includes:

[0540] The second-first pattern portion disposed on the first insulating region; and

[0541] A second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.

[0542] Solution 2. The circuit board according to Solution 1, wherein the second-first pattern portion is disposed on the central region of the upper surface of the first insulating region, and

[0543] The first terminal portion is disposed on the edge region of the upper surface of the first insulating region, excluding the central region.

[0544] Solution 3. The circuit board according to Solution 1, wherein the first insulating region includes a first terminal opening portion that overlaps with the first terminal portion in the vertical direction.

[0545] A portion of the first terminal portion is disposed on the first insulating region; and

[0546] The remaining portion of the first terminal portion is disposed on the opening portion of the first terminal portion.

[0547] Option 4. The circuit board according to Option 3, wherein the second insulating region includes a second terminal opening portion that overlaps with the second terminal portion in the vertical direction.

[0548] A portion of the second terminal portion is disposed on the second insulating region; and

[0549] The remaining portion of the second terminal portion is disposed on the opening portion of the second terminal portion.

[0550] Option 5. The circuit board according to Option 4, wherein at least one of the first terminal opening portion and the second terminal opening portion is not connected to the separated area of ​​the insulating portion.

[0551] Solution 6. The circuit board according to Solution 3, wherein the first insulating region includes a fixed pad opening portion, the fixed pad opening portion being disposed adjacent to and spaced apart from the first terminal opening portion.

[0552] Option 7. The circuit board according to Option 6, wherein the opening portion of the fixed pad is connected to the separation area.

[0553] Option 8. The circuit board according to Option 1, wherein the first insulating region includes:

[0554] The first portion overlaps, in the vertical direction, with the first terminal portion of the first pattern portion and the second-first pattern portion of the second pattern portion; and

[0555] The second part, in addition to the first part.

[0556] Option 9. The circuit board according to Option 1, wherein the second insulating region includes:

[0557] The third part overlaps, in the vertical direction, with the second terminal portion of the first pattern portion and the second-second pattern portion of the second pattern portion; and

[0558] A fourth part in addition to the third part.

[0559] Solution 10. The circuit board according to Solution 1, wherein the separation region includes a first corner portion to a fourth corner portion.

[0560] The connecting portion includes a first connecting portion to a fourth connecting portion, each of which includes a curved portion disposed on each of the first corner portion to the fourth corner portion.

[0561] The first connecting portion to the fourth connecting portion extends in the same direction from the end connected to the first terminal portion and is connected to the second terminal portion.

[0562] Solution 11. The circuit board according to Solution 10, wherein the first insulating region includes a first-first side region to a first-fourth side region.

[0563] The first terminal portion includes a first terminal to a fourth terminal disposed on each of the first to fourth side regions.

[0564] Wherein, the second insulating region includes a second-first side region to a second-fourth side region facing each of the first-first side region to the first-fourth side region of the first insulating region; and

[0565] The second terminal portion includes a second-first terminal to a second-fourth terminal disposed on each of the second-first side region to the second-fourth side region.

[0566] Solution 12. The circuit board according to Solution 11, wherein the first-first terminal to the first-fourth terminal are respectively disposed adjacent to different corner portions of the first corner portion to the fourth corner portion of the separation region, and

[0567] The second-first terminal to the second-fourth terminal are respectively located adjacent to different corner portions of the first corner portion to the fourth corner portion of the separation region.

[0568] Option 13. The circuit board according to Option 11, wherein each of the first connecting portion to the fourth connecting portion is bent counterclockwise from the end connected to the first terminal portion to connect to the second terminal portion.

[0569] Solution 14. The circuit board according to Solution 12, wherein the first connection portion includes one end connected to the first terminal and the other end connected to the second and fourth terminals not facing the first terminal.

[0570] The second connection portion includes one end connected to the first-second terminal and the other end connected to the second-third terminal that is not facing the first-second terminal.

[0571] The third connection portion includes one end connected to the first-third terminal and the other end connected to the second-first terminal that is not facing the first-third terminal.

[0572] The fourth connection portion includes one end connected to the first-fourth terminal and the other end connected to the second-second terminal that is not facing the first-fourth terminal.

[0573] Option 15. The circuit board according to Option 10, wherein each of the first to fourth connection portions includes:

[0574] An inner connecting portion and an outer connecting portion, the inner connecting portion being disposed within an open area, the open area exposing a portion of each of the first to fourth corner portions, and the outer connecting portion being disposed outside the open area.

[0575] The number of internal connections differs from the number of external connections.

[0576] Solution 16. The circuit board according to Solution 15, wherein the number of bending points of the inner connection portion is the same as the number of bending points of the outer connection portion.

[0577] Solution 17. An image sensor module, comprising:

[0578] First substrate;

[0579] A second substrate disposed on the first substrate; and

[0580] An image sensor disposed on the second substrate,

[0581] The first substrate includes:

[0582] An insulating portion, the insulating portion including a first insulating region and a second insulating region, the second insulating region being disposed outside the first insulating region and spaced apart from the first insulating region, and having a separation region between the first insulating region and the second insulating region;

[0583] The first pattern portion includes a first terminal portion disposed on the first insulating region, a second terminal portion disposed on the second insulating region, and a connecting portion disposed on the separation region to connect the first terminal portion and the second terminal portion; and

[0584] The second pattern portion includes: a second-first pattern portion, which is arranged to be spaced apart from the first terminal portion on the first insulating region; and a second-second pattern portion, which is arranged to be spaced apart from the second terminal portion on the second insulating region and separate from the second-first pattern portion.

[0585] The second substrate includes:

[0586] Pads, the pads being connected to the first terminal portion of the first substrate; and

[0587] Through the via in the second substrate,

[0588] The via is connected to the second-first pattern portion, and an adhesive member is inserted between the via and the second-first pattern portion.

[0589] Solution 18. The image sensor module according to Solution 17, wherein the first insulating region of the first substrate includes a via formed in a region overlapping the second-first pattern portion in the vertical direction and passing through the first insulating region; and

[0590] The first substrate includes:

[0591] An adhesive layer disposed in the through hole; and

[0592] The heat dissipation section is connected to the first substrate via the adhesive layer.

[0593] Solution 19. The image sensor module according to Solution 18, wherein the planar area of ​​the second-first patterned portion is greater than the planar area of ​​the first insulating region of the first substrate.

[0594] Solution 20. The image sensor module according to Solution 19, wherein at least a portion of the heat dissipation portion is disposed in the through hole formed in the first insulating region.

Claims

1. A circuit board, comprising: Insulation part; as well as The pattern portion provided on the insulating portion The insulating portion includes: The first insulation region, and A second insulating region is disposed outside the first insulating region and spaced apart from the first insulating region, and a separation region is provided between the first insulating region and the second insulating region; The pattern portion includes: The first pattern portion for signal transmission; and The second pattern portion is separate from the first pattern portion and includes a pseudo-pattern. The first pattern portion includes: A first terminal portion disposed on the first insulating region; The second terminal portion disposed on the second insulating region; and The connecting portion is disposed on the separation area and connects the first terminal portion and the second terminal portion. The separation region includes the first corner portion to the fourth corner portion. The connecting portion includes a first connecting portion to a fourth connecting portion, each of which includes a curved portion disposed on each of the first corner portion to the fourth corner portion. The insulating portion further includes an organic material layer disposed on the separation area and covering the upper, lower, and side surfaces of the metal layer of each of the first connecting portion to the fourth connecting portion, so as to insulate the first connecting portion to the fourth connecting portion.

2. The circuit board according to claim 1, wherein, The second pattern portion includes a second-first pattern portion disposed on the first insulating region, and a second-second pattern portion disposed on the second insulating region and separate from the second-first pattern portion.

3. The circuit board according to claim 2, wherein, The second-first pattern portion is disposed on the central region of the upper surface of the first insulating region, and The first terminal portion is disposed on the edge region of the upper surface of the first insulating region, excluding the central region.

4. The circuit board according to claim 2, wherein, The first insulating region includes a first terminal opening portion that overlaps with the first terminal portion in the vertical direction. A portion of the first terminal portion is disposed on the first insulating region; and The remaining portion of the first terminal portion is disposed on the opening portion of the first terminal portion.

5. The circuit board according to claim 4, wherein, The second insulating region includes a second terminal opening portion that overlaps with the second terminal portion in the vertical direction. A portion of the second terminal portion is disposed on the second insulating region; and The remaining portion of the second terminal portion is disposed on the opening portion of the second terminal portion.

6. The circuit board according to claim 5, wherein, At least one of the first terminal opening portion and the second terminal opening portion is not in communication with the separated area of ​​the insulating portion.

7. The circuit board according to claim 4, wherein, The first insulating region includes a fixed pad opening portion into which a fixed pad for alignment can be inserted, and the fixed pad opening portion is disposed adjacent to and spaced apart from the first terminal opening portion.

8. The circuit board according to claim 7, wherein, The opening portion of the fixed pad is connected to the separation area.

9. The circuit board according to claim 2, wherein, The first insulating region includes: The first portion overlaps, in the vertical direction, with the first terminal portion of the first pattern portion and the second-first pattern portion of the second pattern portion; and The second part, in addition to the first part, does not overlap with the first terminal part of the first pattern part and the second-first pattern part of the second pattern part in the vertical direction.

10. The circuit board according to claim 2, wherein, The second insulating region includes: The third portion overlaps, in the vertical direction, with the second terminal portion of the first pattern portion and the second-second pattern portion of the second pattern portion; and The fourth part, in addition to the third part, does not overlap with the second terminal part of the first pattern part and the second-second pattern part of the second pattern part in the vertical direction.

11. The circuit board according to claim 2, wherein, The first connecting portion to the fourth connecting portion extends in the same direction from the end connected to the first terminal portion and is connected to the second terminal portion.

12. The circuit board according to claim 11, wherein, The first insulating region includes the first-first side region to the first-fourth side region. The first terminal portion includes a first terminal to a fourth terminal disposed on each of the first to fourth side regions. Wherein, the second insulating region includes a second-first side region to a second-fourth side region facing each of the first-first side region to the first-fourth side region of the first insulating region; and The second terminal portion includes a second-first terminal to a second-fourth terminal disposed on each of the second-first side region to the second-fourth side region.

13. The circuit board according to claim 12, wherein, The first terminal to the fourth terminal are respectively located adjacent to different corner portions of the first to fourth corner portions of the separation region, and The second-first terminal to the second-fourth terminal are respectively located adjacent to different corner portions of the first corner portion to the fourth corner portion of the separation region.

14. The circuit board according to claim 12, wherein, Each of the first to the fourth connecting portions is bent clockwise or counterclockwise from the end connected to the first terminal portion to connect to the second terminal portion.

15. The circuit board according to claim 13, wherein, The first connection portion includes one end connected to the first terminal and the other end connected to the second and fourth terminals that are not facing the first terminal. The second connection portion includes one end connected to the first-second terminal and the other end connected to the second-third terminal that is not facing the first-second terminal. The third connection portion includes one end connected to the first-third terminal and the other end connected to the second-first terminal that is not facing the first-third terminal. The fourth connection portion includes one end connected to the first-fourth terminal and the other end connected to the second-second terminal that is not facing the first-fourth terminal.

16. The circuit board according to claim 11, wherein, Each of the first to the fourth connection portions includes: An open area is provided on the curved portion of each of the first to fourth connecting portions, and exposes a portion of each of the first to fourth corner portions. An inner connecting portion is provided inside the open area and an outer connecting portion is provided outside the open area, and The number of internal connections differs from the number of external connections.

17. The circuit board according to claim 16, wherein, The number of bends in the inner connection portion is the same as the number of bends in the outer connection portion.

Images