Covering device

Abstract

A decapping device is used to decapsulate a circuit board. The circuit board includes a first surface and a second surface facing away from each other. The first surface has a first waste area, and the second surface has a second waste area. The decapping device includes a feeding component, a receiving component, a first adsorption assembly, a first decapping assembly, a second adsorption assembly, a second decapping assembly, and a guide wheel assembly. The feeding component is used to wind one end of the circuit board and release it; the receiving component is used to wind the other end of the circuit board and collect it; the first adsorption assembly is used to adsorb the second surface; the gap between the first decapping assembly and the first adsorption assembly allows the circuit board to pass through, and the first decapping assembly removes the first waste area; the second adsorption assembly adsorbs the first surface; the gap between the second decapping assembly and the second adsorption assembly allows the circuit board to pass through, and the second decapping assembly removes the second waste area; the guide wheel assembly is located between the feeding component and the receiving component and is used to change the direction of movement of the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing technology, and more particularly to a cover-opening device. Background Technology

[0002] The manufacturing process of circuit boards typically includes opening and removing covers to remove unwanted portions (i.e., waste areas). Current cover-removal processes usually only allow for the removal of waste areas on one side at a time. If the other side of the circuit board needs to be removed, separate operations are required, increasing costs. Summary of the Invention

[0003] In view of this, it is necessary to provide a cover-opening device capable of opening and closing two opposing surfaces of a circuit board to solve the above-mentioned problems.

[0004] A capping device is disclosed for capping a circuit board. The circuit board includes a first surface and a second surface disposed opposite to each other. The first surface has a first waste area, and the second surface has a second waste area. The capping device includes a feeding component, a receiving component, a first adsorption assembly, a first capping assembly, a second adsorption assembly, a second capping assembly, and a guide wheel assembly. The feeding component is used to wind one end of the circuit board and release it; the receiving component is used to wind the other end of the circuit board and collect it; the first adsorption assembly is used to adsorb the second surface; a gap between the first capping assembly and the first adsorption assembly allows the circuit board to pass through, and the first capping assembly removes the first waste area; the second adsorption assembly adsorbs the first surface; a gap between the second capping assembly and the second adsorption assembly allows the circuit board to pass through, and the second capping assembly removes the second waste area; the guide wheel assembly is located between the feeding component and the receiving component and is used to change the direction of movement of the circuit board.

[0005] In one possible embodiment of this application, a first surface has a first groove, which is the edge of a first waste area; a second surface has a second groove, which is the edge of a second waste area; a first lifting assembly includes a first robotic arm, a first piercing needle, and a first swinging clamp; the first robotic arm is connected to the first piercing needle, and the first swinging clamp and the first piercing needle are rotatably connected; the first piercing needle is used to pierce into the first groove; the first swinging clamp and the first piercing needle are used to clamp the first waste area; and the first robotic arm is used to drive the first piercing needle and the first swinging clamp to move to remove the first waste area; a second lifting assembly includes a second robotic arm, a second piercing needle, and a second swinging clamp; the second robotic arm is connected to the second piercing needle, and the second swinging clamp and the second piercing needle are rotatably connected; the second piercing needle is used to pierce into the second groove; the second swinging clamp and the second piercing needle are used to clamp the second waste area; and the second robotic arm is used to drive the second piercing needle and the second swinging clamp to move to remove the second waste area.

[0006] In one possible embodiment of this application, a first positioning hole is provided on the first surface, and a second positioning hole is provided on the second surface; the cover-opening device further includes a processor, a first camera, and a second camera. Both the first camera and the second camera are communicatively connected to the processor. The first camera is used to scan the first positioning hole to facilitate the processor in calculating the position where the first stud is inserted into the first slot, and the second camera is used to scan the second positioning hole to facilitate the processor in calculating the position where the second stud is inserted into the second slot.

[0007] In one possible embodiment of this application, the first needle is conical, and the first needle has a first included angle along a cross section parallel to the direction of gravity, the first included angle being in the range of 10°-15°; the second needle is conical, and the second needle has a second included angle along a cross section parallel to the direction of gravity, the second included angle being in the range of 10°-15°.

[0008] In one possible embodiment of this application, along the direction of gravity, the first capping component is located below the first adsorption component, and the second capping component is located below the second adsorption component.

[0009] In one possible embodiment of this application, along the horizontal direction, the first cover-opening component and the first adsorption component are located on the side of the feeding component away from the receiving component, and the second cover-opening component and the second adsorption component are located between the feeding component and the receiving component.

[0010] In one possible embodiment of this application, the guide wheel assembly includes a first guide wheel, a second guide wheel, a third guide wheel, and a fourth guide wheel. The first guide wheel is located between the feeding component and the first adsorption component, and is used to contact a first surface. The second guide wheel is located on the side of the first adsorption component opposite to the first guide wheel, and is used to contact a second surface. The third guide wheel is located on the side of the second guide wheel opposite to the first guide wheel, and is used to contact the second surface. The fourth guide wheel is located on the side of the second adsorption component opposite to the third guide wheel, and is used to contact the first surface.

[0011] In one possible embodiment of this application, the cap-opening device further includes a retaining wheel located between a third guide wheel and a fourth guide wheel, which are located on opposite sides of the second adsorption assembly. The retaining wheel is used to contact the first surface.

[0012] In one possible embodiment of this application, the first adsorption component includes a first adsorption stage and a first vacuum pump. The first adsorption stage has a plurality of first holes, which are connected to the first vacuum pump. The first vacuum pump is used to generate negative pressure in the first holes to adsorb the second surface. The second adsorption component includes a second adsorption stage and a second vacuum pump. The second adsorption stage has a plurality of second holes, which are connected to the second vacuum pump. The second vacuum pump is used to generate negative pressure in the second holes to adsorb the first surface.

[0013] In one possible embodiment of this application, the cover-opening device further includes a receiving tray located in the projection area of ​​the first cover-opening component and the second cover-opening component along the direction of gravity, and the receiving tray is used to collect the first waste area and the second waste area.

[0014] The capping device provided in this application embodiment has a first adsorption component and a first capping component working together to remove a first waste area located on a first surface, and a second adsorption component and a second capping component working together to remove a second waste area located on a second surface. Thus, in the same process, the two opposing surfaces of the circuit board can be capped simultaneously. During the capping process, the first capping component exerts a strong force on the first waste area. When laser processing is used to form the first and second slots on the circuit board, there are fewer restrictions on the shape and depth of the first and second slots, which can save the time of laser cutting and reduce costs. By setting a guide component to change the moving direction of the circuit board, the first and second waste areas formed after capping can fall freely under the action of gravity, and the first and second waste areas can be directly recycled and resold. Attached Figure Description

[0015] Figure 1 A schematic diagram of the cap-opening process of a cap-opening device provided for some related technologies.

[0016] Figure 2 A schematic diagram of the cap-opening process of a cap-opening device provided for some related technologies.

[0017] Figure 3 A cross-sectional schematic diagram of a circuit board provided for related technologies.

[0018] Figure 4 This is a schematic diagram of the cap-opening process of the cap-opening device provided in the embodiments of this application.

[0019] Figure 5 This is a top view of a circuit board provided in an embodiment of this application.

[0020] Figure 6 This is a cross-sectional schematic diagram of the first piercing pin being inserted into the first slot of the circuit board, as provided in an embodiment of this application.

[0021] Figure 7 for Figure 6 The diagram shows a cross-sectional view of the first swing clamp after it rotates and the first punching needle clamping the first waste area.

[0022] Figure 8 for Figure 7 The diagram shows a cross-sectional view of the first robotic arm moving, which in turn moves the first swinging clamp and the first piercing needle to remove the first waste area. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0025] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0026] Please see Figure 1 and Figure 2 , Figure 1 A schematic diagram of the cap-opening process of the cap-opening device 100' provided for some related technologies. Figure 2 A schematic diagram of the cap-opening process of the cap-opening device 100' provided for some related technologies. The cap-opening device 100 uses adhesive tape 10' to open the cap.

[0027] Specifically, a laser is first used to cut the area of ​​the circuit board 200' that needs to be opened to form a waste area 210'. The laser-treated circuit board 200' is fixed on the fixture 12', and a cover plate 13' is used to cover the area of ​​the circuit board 200' except for the waste area 210'. A roller 11' is used to roll adhesive tape 10' on the circuit board 200'. When the roller 11' rolls over the waste area 210', the adhesive tape 10' adheres to the waste area 210', thereby removing the waste area 210'.

[0028] Using adhesive tape 10' for peeling allows only the same surface of the circuit board 200' to be peeled off in the same step. However, this method is costly due to the large amount of tape used and the difficulty in recycling it. Furthermore, the adhesive strength of the tape is limited, leading to potential gaps in the tape's adhesion. Excessive adhesion requires significant force to secure the circuit board 200', potentially damaging it. Additionally, the limited adhesive strength of the tape 10' necessitates the formation of an annular groove 211' when laser-cutting the circuit board 200'. This groove encloses a waste area 210' to facilitate tape adhesion and removal, but this increases laser processing time and reduces the lifespan of the laser equipment. Moreover, the laser cutting depth of the circuit board 200' needs to be as deep as possible to allow the tape 10' to adhere to and remove the waste area 210', but this may damage the circuit board 200' during the laser cutting process. For example, please refer to [reference needed]. Figure 3 The circuit board 200' includes an inner copper layer 212', an adhesive layer 213', a dielectric layer 214', and an outer copper layer 215' stacked together. The circuit board 200' needs to remove part of the outer copper layer 215' and the corresponding dielectric layer 214'. There is no adhesive layer 213' between the dielectric layer 214' to be removed and the inner copper layer 212'. During the laser cutting process, it is necessary to penetrate the dielectric layer 214' as much as possible. Therefore, the inner copper layer 212' exposed to the dielectric layer 214' may be damaged by the laser.

[0029] Please see Figure 4 , Figure 5 and Figure 6 , Figure 4 This is a structural schematic diagram of the cap-opening process of the cap-opening device 100 provided in the embodiments of this application. Figure 5 This is a top view of the circuit board 200 provided in an embodiment of this application. The peeling device 100 can simultaneously peel off two opposing surfaces of the circuit board 200, and it is low in cost.

[0030] Circuit board 200 is a flexible circuit board 200. Please refer to [link / reference]. Figure 6 The circuit board 200 includes a first surface 23 and a second surface 25 facing each other. First, a laser device is used to laser-process the circuit board 200 to form a predetermined waste area. Specifically, a first groove 233 is formed on the first surface 23; in subsequent steps, the portion of the circuit board 200 removed along the first groove 233 constitutes the first waste area 231. Similarly, a second groove 253 is formed on the second surface 25; in subsequent steps, the portion of the circuit board 200 removed along the second groove 253 constitutes the second waste area 251. There can be one or more of the first waste area 231 and the second waste area 251. A capping device 100 removes both the first waste area 231 and the second waste area 251 simultaneously in the same process.

[0031] In one specific embodiment, the circuit board 200 includes an intermediate substrate 26, a first substrate 27, a second substrate 28, a first adhesive layer 291, and a second adhesive layer 293. The first substrate 27 and the second substrate 28 are located on opposite sides of the intermediate substrate 26. The first substrate 27 and the intermediate substrate 26 are bonded together by the first adhesive layer 291, and the second substrate 28 and the intermediate substrate 26 are bonded together by the second adhesive layer 293.

[0032] The first substrate 27 has a product area M that is approximately L-shaped. The first substrate 27 includes a first dielectric layer 271 and a first copper layer 272 stacked together. The first copper layer 272 is located on the surface of the first dielectric layer 271 away from the intermediate substrate 26. The first substrate 27 has a first waste area 231. The first waste area 231 overlaps with a portion of the product area M. No first adhesive layer 291 is provided between the first waste area 231 and the intermediate substrate 26. A portion of the first slot 233 penetrates the first copper layer 272 and the first dielectric layer 271. The remaining portion of the first slot 233 penetrates the first copper layer 272 but does not penetrate the first dielectric layer 271. The area penetrating the first dielectric layer 271 is the area outside the projected area of ​​the product area M to prevent laser damage to the product area M. The second substrate 28 includes a second dielectric layer 281 and a second copper layer 282 stacked together. The second copper layer 282 is located on the surface of the second dielectric layer 281 facing away from the intermediate substrate 26. The second substrate 28 has a second waste area 251, which overlaps with a portion of the product area M. No second adhesive layer 293 is provided between the second waste area 251 and the intermediate substrate 26. A portion of the second slot 253 penetrates the second copper layer 282 and the second dielectric layer 281. The remaining portion of the second slot 253 penetrates the second copper layer 282 but does not penetrate the second dielectric layer 281. The area penetrating the second dielectric layer 281 is outside the projection area of ​​the product area M to prevent laser damage to the product area M.

[0033] Please see Figure 4The cap-opening device 100 may include a feeding component 30, a receiving component 35, a first adsorption assembly 40, a first cap-opening assembly 60, a second adsorption assembly 50, a second cap-opening assembly 70, a guide wheel assembly (not shown), and a receiving tray 90. A circuit board 200 connects the feeding component 30 and the receiving component 35. The feeding component 30 releases the circuit board 200, and the receiving component 35 collects the circuit board 200. The circuit board 200 gradually moves from the side where the feeding component 30 is located towards the receiving component 35. The gap between the first cap-opening assembly 60 and the first adsorption assembly 40 allows the circuit board 200 to pass through, and the gap between the second cap-opening assembly 70 and the second adsorption assembly 50 also allows the circuit board 200 to pass through. During the movement of the circuit board 200, the first adsorption component 40 adsorbs the second surface 25, the first capping component 60 removes the first waste area 231, the second adsorption component 50 adsorbs the first surface 23, and the second capping component 70 removes the second waste area 251; the guide wheel assembly is used to change the moving direction of the circuit board 200, and the receiving tray 90 is used to collect the removed first waste area 231 and second waste area 251.

[0034] The feeding component 30 is roughly cylindrical. One end of the circuit board 200 is wound around the feeding component 30. The feeding component 30 uses the principle of an air shaft to fix one end of the circuit board 200. The feeding component 30 can rotate and gradually release the circuit board 200 wound around the feeding component 30.

[0035] The receiving component 35 is roughly cylindrical, and the other end of the circuit board 200 is wound around the receiving component 35. The receiving component 35 uses the principle of an air shaft to fix the other end of the circuit board 200. The receiving component 35 can rotate and gradually collect the circuit board 200 that is gradually released by the feeding component 30.

[0036] The first adsorption component 40 and the second adsorption component 50 use the principle of negative pressure adsorption to adsorb the circuit board 200, which helps to ensure the flatness of the area of ​​the circuit board 200 adsorbed by the first adsorption component 40 and the second adsorption component 50, and can avoid precision errors from scratching the circuit board 200.

[0037] In some embodiments, the first adsorption assembly 40 includes a first adsorption stage 41 and a first vacuum pump 43. The first adsorption stage 41 has a plurality of first holes 412, which are connected to the first vacuum pump 43. The first vacuum pump 43 is used to generate a negative pressure in the first holes 412 to adsorb the second surface 25. The second adsorption assembly 50 includes a second adsorption stage 51 and a second vacuum pump 53. The second adsorption stage 51 has a plurality of second holes 512, which are connected to the second vacuum pump 53. The second vacuum pump 53 is used to generate a negative pressure in the second holes 512 to adsorb the first surface 23. In a specific embodiment, both the first adsorption stage 41 and the second adsorption stage 51 include 1421 holes, and the power of both the first vacuum pump 43 and the second vacuum pump 53 is greater than or equal to 110 kW.

[0038] The first cap-opening assembly 60 may include a first robotic arm 61, a first stud pin 63, and a first oscillating clamp 65. The first stud pin 63 is connected to the first robotic arm 61, which is used to adjust the position of the first stud pin 63 relative to the circuit board 200. The first robotic arm 61 is a six-axis arm, meaning it can adjust the position of the first stud pin 63 in six directions: up, down, left, right, forward, and backward. The first oscillating clamp 65 is rotatably connected to the first stud pin 63. (See also...) Figure 6 When the first robotic arm 61 adjusts the position of the first stinger 63, the first oscillating gripper 65 also moves synchronously with the first stinger 63. The first oscillating gripper 65 can also rotate relative to the first stinger 63. (See also...) Figure 7 The first piercing pin 63 is used to pierce the first slot 233 located outside the non-product area M, for example, the first slot 233 penetrating the first copper layer 272 and the first dielectric layer 271. The movement of the first robotic arm 61 causes the first swing clamp 65 and the first piercing pin 63 to rotate at a certain angle, for example, 15° to 20°. The first swing clamp 65 and the first piercing pin 63 together hold the first waste area 231. Please refer to [link / reference]. Figure 8 The first robotic arm 61 moves, causing the first swinging clamp 65 and the first piercing needle 63 to move synchronously to tear off the first waste area 231. After the first waste area 231 is torn off, the first swinging clamp 65 rotates and releases the first waste area 231, which then falls freely under the action of gravity.

[0039] The second cap-opening assembly 70 operates on the same principle as the first cap-opening assembly 60. Specifically, the second cap-opening assembly 70 may include a second robotic arm 71, a second stinging pin 73, and a second swing clamp 75. The second stinging pin 73 is connected to the second robotic arm 71, which is used to adjust the position of the second stinging pin 73 relative to the circuit board 200. The second robotic arm 71 is a six-axis arm, meaning it can adjust the position of the second stinging pin 73 in six directions: up, down, left, right, front, and back. The second swing clamp 75 is rotatably connected to the second stinging pin 73. When the second robotic arm 71 adjusts the position of the second stinging pin 73, the second swing clamp 75 also moves synchronously with the second stinging pin 73. In addition, the second swing clamp 75 can also rotate relative to the second stinging pin 73. The second piercing pin 73 is used to pierce the second slot 253 located outside the non-product area M, for example, the second slot 253 penetrating the second copper layer 282 and the second dielectric layer 281. The movement of the second robotic arm 71 drives the second swing clamp 75 and the second piercing pin 73 to rotate at a certain angle, for example, 15° to 20°. The second swing clamp 75 and the second piercing pin 73 together clamp the second waste area 251. The movement of the second robotic arm 71 drives the second swing clamp 75 and the second piercing pin 73 to move synchronously to tear off the second waste area 251. After the second waste area 251 is torn off, the second swing clamp 75 rotates and releases the second waste area 251, which then falls freely under the action of gravity.

[0040] The first piercing needle 63 is conical, and its cross-section parallel to the gravitational direction L1 has a first included angle ranging from 10° to 15°, facilitating its insertion into the first slot 233. The second piercing needle 73 is also conical, and its cross-section parallel to the gravitational direction L1 has a second included angle ranging from 10° to 15°, facilitating its insertion into the second slot 253.

[0041] The first swing clamp 65 has a roughly trapezoidal cross-section. The short side of the trapezoid is used to contact the first waste area 231, and the long side of the trapezoid is located on the side of the short side away from the first waste area 231, in order to increase the strength of the first swing clamp 65. The second swing clamp 75 has a roughly trapezoidal cross-section. The short side of the trapezoid is used to contact the second waste area 251, and the long side of the trapezoid is located on the side of the short side away from the second waste area 251, in order to increase the strength of the second swing clamp 75.

[0042] The first swing clamp 65 and the first piercing pin 63 exert a relatively large force on the first waste area 231, which can tear off the first waste area 231 along its edge. When the first groove 233 is formed on the circuit board 200 using a laser, a portion of the first groove 233 can penetrate the first waste area 231 to be removed, while the remaining portion of the first groove 233 can only form a groove extending to the first dielectric layer 271 (without penetrating the first dielectric layer 271), for example, cutting to 1 / 3 to 1 / 2 of the thickness of the first dielectric layer 271. This can save time and reduce costs associated with laser cutting. The second swing clamp 75 and the second piercing needle 73 exert a large force on the second waste area 251, which can tear off the second waste area 251 along its edge. When the second groove 253 is formed on the circuit board 200 by laser, part of the second groove 253 can penetrate the second waste area 251 that needs to be removed. The remaining part of the second groove 253 can only form a groove that extends to the second dielectric layer 281 (without penetrating the second dielectric layer 281), for example, cutting to 1 / 3 to 1 / 2 of the thickness of the second dielectric layer 281. This can save laser cutting time and reduce costs.

[0043] The guide wheel assembly includes multiple guide wheels. In this embodiment, the guide wheels include four guide wheels, which are defined as a first guide wheel 81, a second guide wheel 83, a third guide wheel 85, and a fourth guide wheel 87.

[0044] The first guide wheel 81 is located between the feeding component 30 and the first adsorption assembly 40. The first guide wheel 81 is in contact with the first surface 23, and the first adsorption assembly 40 is used to adsorb the second surface 25. That is, the first guide wheel 81 and the first adsorption assembly 40 are located on opposite sides of the circuit board 200. The first guide wheel 81 is used to change the moving direction of the circuit board 200. In this embodiment, the included angle between the circuit boards 200 located on both sides of the first guide wheel 81 is an obtuse angle.

[0045] The second guide wheel 83 is located on the side of the first adsorption assembly 40 opposite to the first guide wheel 81. The second guide wheel 83 is in contact with the second surface 25, that is, the second guide wheel 83 and the first guide wheel 81 are located on opposite sides of the circuit board 200. The second guide wheel 83 is used to change the moving direction of the circuit board 200. In this embodiment, the included angle between the circuit boards 200 located on both sides of the second guide wheel 83 is a right angle.

[0046] The third guide wheel 85 is located on the side of the second guide wheel 83 away from the first guide wheel 81. The third guide wheel 85 is in contact with the second surface 25, that is, the second guide wheel 83 and the third guide wheel 85 are located on the same side of the circuit board 200. The third guide wheel 85 is used to change the moving direction of the circuit board 200. In this embodiment, the included angle between the circuit boards 200 located on both sides of the third guide wheel 85 is a right angle.

[0047] The fourth guide wheel 87 is located on the side of the second adsorption assembly 50 opposite to the third guide wheel 85. The fourth guide wheel 87 is in contact with the first surface 23, that is, the fourth guide wheel 87 and the third guide wheel 85 are located on opposite sides of the circuit board 200. The fourth guide wheel 87 is used to change the moving direction of the circuit board 200. In this embodiment, the included angle between the circuit boards 200 located on both sides of the fourth guide wheel 87 is a right angle.

[0048] The lifting device 100 also includes a retaining wheel 89, which is located between the third guide wheel 85 and the fourth guide wheel 87. The retaining wheel 89 and the fourth guide wheel 87 are located on opposite sides of the second adsorption assembly 50. The retaining wheel 89 contacts the first surface 23 and is approximately on the same horizontal plane as the fourth guide wheel 87. The retaining wheel 89 is used to abut against the circuit board 200. The distance between the third guide wheel 85 and the fourth guide wheel 87 is relatively large. The presence of the retaining wheel 89 between the third guide wheel 85 and the fourth guide wheel 87 can prevent the circuit board 200 from being scratched by the second adsorption assembly 50.

[0049] The receiving tray 90 is located in the projection area of ​​the first opening assembly 60 and the second opening assembly 70 along the gravity direction L1. After being torn off, the first waste area 231 and the second waste area 251 fall freely into the receiving tray 90 under the action of gravity. The receiving tray 90 is used to collect the first waste area 231 and the second waste area 251. Compared with related technologies, the materials collected by the receiving tray 90 in this embodiment are simple (no adhesive tape 10'), requiring no other processing, and can be directly recycled and resold.

[0050] In some embodiments, along the direction of gravity L1, the first capping component 60 is located below the first adsorption component 40. After the first capping component 60 removes the first waste area 231, the first waste area 231 can fall freely into the receiving tray 90 under the action of gravity, without being disturbed by the position of the circuit board 200 or the first adsorption component 40. Along the direction of gravity L1, the second capping component 70 is located below the second adsorption component 50. After the second capping component 70 removes the second waste area 251, the second waste area 251 can fall freely into the receiving tray 90 under the action of gravity, without being disturbed by the position of the circuit board 200 or the second adsorption component 50.

[0051] In some embodiments, along the horizontal direction L2, the first capping assembly 60 and the first adsorption assembly 40 are located on the side of the feeding member 30 away from the receiving member 35, and the second capping assembly 70 and the second adsorption assembly 50 are located between the feeding member 30 and the receiving member 35. When the second capping assembly 70 removes the second waste area 251, the second waste area 251 can fall freely into the receiving tray 90 under the action of gravity, without being disturbed by the circuit board 200, the first capping assembly 60 and the first adsorption assembly 40 located below the second capping assembly 70.

[0052] The cap-opening device 100 may further include a processor (not shown), a first camera (not shown), and a second camera (not shown), both of which are communicatively connected to the processor. The first camera is located around the first swing clamp 65, and a first positioning hole 235 is provided on the first surface 23. The first camera is used to scan the first positioning hole 235 on the circuit board 200, so that the processor of the cap-opening device 100 can calculate the position where the first poking pin 63 is inserted into the first slot 233. The second camera is located around the second swing clamp 75, and a second positioning hole (not shown) is provided on the second surface 25. The second camera is used to scan the second positioning hole on the circuit board 200, so that the processor of the cap-opening device 100 can calculate the position where the second poking pin 73 is inserted into the second slot 253.

[0053] The capping device 100 provided in this application embodiment has a first adsorption component 40 and a first capping component 60 working together to remove the first waste area 231 located on the first surface 23, and a second adsorption component 50 and a second capping component 70 working together to remove the second waste area 251 located on the second surface 25. Thus, the circuit board 200 can be capped on both opposite surfaces simultaneously in the same process. During the capping process, the first capping component 60 exerts a strong force on the first waste area 231. When laser processing is used to form the first groove 233 and the second groove 253 on the circuit board 200, there are fewer restrictions on the shape and depth of the first groove 233 and the second groove 253, which can save the time of laser cutting and reduce costs. By setting a guide component to change the moving direction of the circuit board 200, the first waste area 231 and the second waste area 251 formed after capping can fall freely under the action of gravity, and the first waste area 231 and the second waste area 251 can be directly recycled and resold.

[0054] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the scope of the technical solutions of this application.

Claims

1. A cap-removing device for removing a cover from a circuit board, the circuit board including a first surface and a second surface disposed opposite to each other, the first surface having a first waste area and the second surface having a second waste area, characterized in that, The cover-opening device includes: A feeding component is used to wind one end of the circuit board and release the circuit board; A receiving component is used to wind the other end of the circuit board and collect the circuit board. A first adsorption component is used to adsorb the second surface; The gap between the first capping component and the first adsorption component is for the circuit board to pass through, and the first capping component is used to remove the first waste area; The second adsorption component is used to adsorb the first surface; The gap between the second capping assembly and the second adsorption assembly allows the circuit board to pass through, and the second capping assembly is used to remove the second waste area; and The guide wheel assembly, located between the loading component and the receiving component, is used to change the moving direction of the circuit board.

2. The cover-opening device according to claim 1, characterized in that, The first surface has a first groove, which is the edge of the first waste area; the second surface has a second groove, which is the edge of the second waste area. The first capping assembly includes a first robotic arm, a first piercing pin, and a first swinging clamp. The first robotic arm is connected to the first piercing pin, and the first swinging clamp and the first piercing pin are rotatably connected. The first piercing pin is used to pierce the first slot, and the first swinging clamp and the first piercing pin are used to hold the first waste area. The first robotic arm is used to drive the first piercing pin and the first swinging clamp to move in order to remove the first waste area. The second capping assembly includes a second robotic arm, a second piercing pin, and a second oscillating clamp. The second robotic arm is connected to the second piercing pin, and the second oscillating clamp and the second piercing pin are rotatably connected. The second piercing pin is used to pierce the second slot, and the second oscillating clamp and the second piercing pin are used to hold the second waste area. The second robotic arm is used to drive the second piercing pin and the second oscillating clamp to move in order to remove the second waste area.

3. The cover-opening device according to claim 2, characterized in that, The first surface is provided with a first positioning hole, and the second surface is provided with a second positioning hole; the cover-opening device further includes a processor, a first camera, and a second camera. The first camera and the second camera are both communicatively connected to the processor. The first camera is used to scan the first positioning hole to facilitate the processor in calculating the position where the first stud is inserted into the first slot. The second camera is used to scan the second positioning hole to facilitate the processor in calculating the position where the second stud is inserted into the second slot.

4. The cover-opening device according to claim 2, characterized in that, The first puncture needle is conical, and the first puncture needle has a first included angle along its cross section parallel to the direction of gravity, the first included angle being in the range of 10°-15°; the second puncture needle is conical, and the second puncture needle has a second included angle along its cross section parallel to the direction of gravity, the second included angle being in the range of 10°-15°.

5. The cover-opening device according to claim 1, characterized in that, Along the direction of gravity, the first capping component is located below the first adsorption component, and the second capping component is located below the second adsorption component.

6. The cover-opening device according to claim 1, characterized in that, Along the horizontal direction, the first capping assembly and the first adsorption assembly are located on the side of the feeding component away from the receiving component, and the second capping assembly and the second adsorption assembly are located between the feeding component and the receiving component.

7. The cover-opening device according to claim 1, characterized in that, The guide wheel assembly includes a first guide wheel, a second guide wheel, a third guide wheel, and a fourth guide wheel. The first guide wheel is located between the feeding component and the first adsorption component, and the first guide wheel is used to contact the first surface. The second guide wheel is located on the side of the first adsorption assembly opposite to the first guide wheel, and the second guide wheel is used to contact the second surface; The third guide wheel is located on the side of the second guide wheel that is away from the first guide wheel, and the third guide wheel is used to contact the second surface; The fourth guide wheel is located on the side of the second adsorption assembly away from the third guide wheel, and the fourth guide wheel is used to contact the first surface.

8. The cover-opening device according to claim 7, characterized in that, The cap-opening device further includes a retaining wheel, which is located between the third guide wheel and the fourth guide wheel. The retaining wheel and the fourth guide wheel are located on opposite sides of the second adsorption component, and the retaining wheel is used to contact the first surface.

9. The cover-opening device according to any one of claims 1-8, characterized in that, The first adsorption component includes a first adsorption stage and a first vacuum pump. The first adsorption stage has a plurality of first holes, which are connected to the first vacuum pump. The first vacuum pump is used to generate negative pressure in the first holes to adsorb the second surface. The second adsorption component includes a second adsorption stage and a second vacuum pump. The second adsorption stage has a plurality of second holes, which are connected to the second vacuum pump. The second vacuum pump is used to generate negative pressure in the second holes to adsorb the first surface.

10. The cover-opening device according to any one of claims 1-8, characterized in that, The cover-opening device further includes a receiving tray, which is located in the projection area of ​​the first cover-opening component and the second cover-opening component along the direction of gravity. The receiving tray is used to collect the first waste area and the second waste area.

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