Pressing mechanism, testing device, and working machine
By using a flexible, deformable material intermediary in the crimping mechanism for lateral and linear heat exchange, the problem of limited heat exchange area in existing technologies is solved, enabling rapid temperature control and efficient testing.
Patent Information
- Application Number
- CN202411907368.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2026-06-23
AI Technical Summary
The existing crimping fixtures have limited heat exchange area, resulting in long temperature control time for electronic components. Furthermore, the top surface of some components is bent and deformed, making it impossible for them to fit with the crimping fixture, which affects the test quality.
The intermediate component, made of a soft and deformable material, enables lateral heat exchange by defining multiple side transmission surfaces and the side peripheral surfaces of electronic components. Combined with linear heat exchange, the heat exchange area is increased. The intermediate component of the temperature control unit is synchronously displaced with the crimping fixture to achieve rapid temperature control.
It significantly improves temperature conductivity, shortens temperature control time, eliminates heat buildup around electronic components, and enhances test quality and production capacity.
Smart Images
Figure CN122259916A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a crimping mechanism that can rapidly improve temperature control efficiency. Background Technology
[0002] In today's world, electronic components will be used in low-temperature or high-temperature environments. To ensure product quality, electronic components must undergo cold or hot testing in a testing facility. Please refer to [link to relevant documentation]. Figure 1 The testing device includes an electrically connected circuit board 11 and a test socket 12 for mounting and testing electronic components 21. Depending on the type of electronic component 21, it can be directly placed into the test socket 12 for testing, or it can be electrically connected to a carrier board 22 to assemble an electronic module 20, and then the electronic module 20 with electronic components 21 can be placed into the test socket 12 for testing. Taking the electronic module 20 as an example, its carrier board 22 has a plurality of contacts 221 on its bottom surface, a metal frame 23 on the periphery of its top surface, and an electronic component 21 electrically connected to the middle part of the top surface. There is an appropriate distance between the electronic component 21 and the metal frame 23. The testing device also has a transfer arm 13 that can move in the Z direction above the test base 12. The transfer arm 13 is equipped with a crimping fixture 14 and a cooling chip 15. An electronic module 20 with electronic components 21 is placed into the test base 12. The transfer arm 13 drives the crimping fixture 14 to move in the Z direction to press the top surface of the electronic components 21, so that the cooling chip 15 exchanges heat with the electronic components 21 through the crimping fixture 14, thereby controlling the temperature of the electronic components 21 to perform the test operation on the test base 12.
[0003] However, the crimping fixture 14 only exchanges heat with the top surface of the electronic component 21 through its bottom surface. The heat exchange area is limited, which means that the electronic component 21 can only slowly reach the preset test temperature, thus increasing the temperature control time and failing to improve test throughput. Furthermore, the periphery of the top surface of some electronic components 21 may be bent and deformed, and may not be able to make contact with the bottom surface of the crimping fixture 14. This will cause heat to accumulate on the sides of the electronic component 21, thereby affecting the test quality. Summary of the Invention
[0004] The purpose of this invention is to provide a crimping mechanism.
[0005] This invention provides a crimping mechanism, characterized in that it comprises:
[0006] Mounting unit: Equipped with at least one mounting device;
[0007] Joining unit: assembled on the bracket and provided with at least one crimping tool for crimping electronic components;
[0008] Temperature control unit: It is provided with at least one temperature controller and at least one intermediate component. The temperature controller is assembled in the bonding unit and can control the temperature of the crimping tool. The transfer surface of the intermediate component and the receiving surface of the crimping tool can be in contact with each other for direct heat exchange in the test state. The intermediate component and the electronic component can be in contact with each other in the test state. The intermediate component defines a plurality of side transfer surfaces and a plurality of side peripheral surfaces of the electronic component for lateral heat exchange.
[0009] The aforementioned pressing mechanism, wherein: the intermediate component of the temperature control unit is made of a soft and deformable material, and has a fitting portion extending from the transfer surface to the bottom surface, which can fit the electronic component; the periphery of the fitting portion is defined as a plurality of side transfer surfaces, which can fit a plurality of the side peripheral surfaces of the electronic component.
[0010] The aforementioned pressing mechanism, wherein: the intermediate component of the temperature control unit is made of a soft and deformable material, and when the electronic component is attached, the bottom surface of the intermediate component is pressed and deformed inward to form a fitting portion, the periphery of the fitting portion is defined as a plurality of side transmission surfaces, which can fit a plurality of the side peripheral surfaces of the electronic component.
[0011] The aforementioned pressing mechanism, wherein: the intermediate component of the temperature control unit is integrally formed at a position relative to the electronic component and has a recessed fitting portion from the bottom surface toward the transfer surface, the periphery of the fitting portion is defined as a plurality of the side transfer surfaces, which can fit the plurality of the side peripheral surfaces of the electronic component.
[0012] The aforementioned pressing mechanism, wherein the bottom surface of the intermediate component of the temperature control unit is defined as the contact surface.
[0013] The crimping mechanism, wherein: the transfer surface of the intermediate component of the temperature control unit can be assembled to the bearing surface of the crimping tool and move synchronously.
[0014] The aforementioned crimping mechanism, wherein the intermediate component of the temperature control unit is detachably assembled to the electronic component.
[0015] The crimping mechanism, wherein the mounting device of the mounting unit is capable of displacement in at least one direction.
[0016] The present invention also provides a testing device, characterized in that it comprises:
[0017] At least one testing facility: equipped with at least one tester for mounting and testing electronic components;
[0018] At least one of the aforementioned crimping mechanisms: for temperature control and crimping the electronic components of the tester.
[0019] The present invention also provides a work machine, characterized in that it comprises:
[0020] Machine tool;
[0021] Feeding device: disposed on the machine and equipped with at least one feeder for accommodating at least one electronic component to be tested;
[0022] Material receiving device: disposed on the machine and provided with at least one material receiving device for accommodating at least one measured electronic component;
[0023] At least one of the aforementioned testing devices is configured on the machine tool for performing testing operations on the electronic component;
[0024] Conveying device: disposed on the machine tool and equipped with at least one conveyor for conveying at least one of the electronic components;
[0025] Central control unit: Used to control and integrate the operation of various devices to perform automated operations.
[0026] This invention utilizes the intermediate component of the temperature control unit in conjunction with the crimping tool of the bonding unit to perform multi-faceted heat exchange on electronic components, thereby significantly increasing the temperature conduction area and improving the temperature conductivity between the temperature control unit and the electronic components. This allows the temperature of the electronic components to be quickly controlled to the preset test temperature, facilitating the execution of test operations and thus improving temperature control performance and test capacity.
[0027] In a preferred embodiment of the present invention, a pressing mechanism is provided, wherein the intermediate component of the temperature control unit is bonded to the plurality of peripheral surfaces of the electronic component by defining a plurality of side transmission surfaces for lateral heat exchange, which can quickly eliminate the heat accumulation on the periphery of the electronic component, thereby improving the temperature control performance and test quality.
[0028] The present invention provides a testing device comprising at least one testing mechanism and at least one crimping mechanism of the present invention. The at least one testing mechanism is provided with at least one tester for holding and testing electronic components. The at least one crimping mechanism of the present invention comprises a mounting unit, a bonding unit and a temperature control unit for crimping and temperature controlling electronic components, thereby improving testing efficiency. Attached Figure Description
[0029] Figure 1 This is a schematic diagram illustrating the use of a conventional testing device.
[0030] Figure 2 This is a diagram of the first embodiment of the crimping mechanism of the present invention.
[0031] Figure 3 This is a schematic diagram of the crimping mechanism of the present invention applied to a testing device.
[0032] Figure 4 This is a schematic diagram illustrating the use of the crimping mechanism of the present invention.
[0033] Figure 5 This is a diagram of a second embodiment of the crimping mechanism of the present invention.
[0034] Figure 6This is a diagram of the third embodiment of the crimping mechanism of the present invention.
[0035] Figure 7 This is a schematic diagram illustrating the use of the diagram in the third embodiment.
[0036] Figure 8 This is a diagram of the fourth embodiment of the crimping mechanism of the present invention.
[0037] Figure 9 This is a configuration diagram of the test device of the present invention applied to a work machine.
[0038] Explanation of reference numerals in the attached drawings: Circuit board 11; Test socket 12; Transfer arm 13; Crimping fixture 14; Cooling chip 15; Electronic module 20; Electronic component 21; Carrier board 22; Contact 221; Metal frame 23; Test device 30; Transfer arm 31; Base 32; Crimping fixture 33; Receiving surface 331; Cooling chip 34; Intermediate parts 35, 35A, 35B; Transfer surfaces 351, 351A, 351B; Fitting parts 352, 352 A, 352B; Side conveying surfaces 353, 353A, 353B; Abutting surfaces 354, 354A, 354B; Circuit board 361; Test socket 362; Electronic module 40; Carrier board 41; Electronic component 42; Top surface 421; Side peripheral surface 422; Metal frame 43; Accommodation space A; Machine base 50; Feeding device 60; Receiving device 70; Conveying device 80; First conveyor 81; Second conveyor 82; Third conveyor 83. Detailed Implementation
[0039] To provide a better understanding of the present invention, a preferred embodiment is described in detail below with reference to the accompanying drawings:
[0040] Please see Figure 2 The present invention provides a crimping mechanism, comprising a mounting unit, a joining unit, and a temperature control unit.
[0041] The mounting unit is equipped with at least one mounting device. Depending on the operational requirements, the mounting device can be configured as a fixed or movable device; for example, the mounting device is a fixed frame, and the tester (not shown in the figure) can be displaced relative to the mounting device; for example, the mounting device is a transfer arm that can be displaced in at least one direction, and can be displaced relative to the tester. Of course, it is also possible for the mounting device and the tester to be displaced relative to each other.
[0042] In this embodiment, the mounting device is a transfer arm 31, which is driven by a drive source (not shown) to move in the Z direction. Furthermore, the drive source may be a linear motor, a pressure cylinder, or include a motor and at least one transmission assembly, which may be a pulley assembly or a screw and screw seat assembly.
[0043] The bonding unit is mounted on the mounting device and is provided with at least one crimping tool for crimping electronic components.
[0044] Depending on the operational requirements, the bonding unit can be configured with at least one floater between the mounting device and the crimping tool. The floater allows the crimping tool to float in at least one direction to buffer and / or fine-tune the accurate crimping of electronic components.
[0045] Depending on the operational requirements, the crimping tool may be equipped with at least one suction hole for crimping and transferring electronic components.
[0046] In this embodiment, the joining unit is provided with a base 32 and a crimping tool 33. One side of the base 32 is connected to the transfer arm 31 that assembles the mounting unit, and the crimping tool 33 is assembled on the other side, so that the transfer arm 31 can drive the base 32 and the crimping tool 33 to move synchronously in the Z direction. The bottom surface of the crimping tool 33 is defined as the bearing surface 331, which can be attached to the top surface of the crimping and temperature control electronic components (not shown in the figure).
[0047] The temperature control unit includes at least one temperature controller and at least one intermediate component. The temperature controller is mounted on the bonding unit and is capable of temperature controlling the crimping fixture. The transfer surface of the intermediate component and the receiving surface of the crimping fixture can be in contact with each other for direct heat exchange in the test state. The intermediate component and the electronic component can be in contact with each other in the test state. The intermediate component defines a plurality of side transfer surfaces and a plurality of side peripheral surfaces of the electronic component for lateral heat exchange.
[0048] Depending on the operational requirements, the temperature controller may be a heating element, a cooling chip, or a device containing a fluid (such as a refrigerant). The temperature controller may be disposed inside the base 32 of the bonding unit, inside the crimping fixture 33, or between the base 32 and the crimping fixture 33, etc., and is not limited to this embodiment.
[0049] In this embodiment, the temperature controller is a cooling chip 34, which is disposed between the base 32 and the crimping fixture 33 to control the temperature of the crimping fixture 33 and electronic components.
[0050] The intermediary component 35 is made of a flexible and deformable material with good thermal conductivity (e.g., foamed copper). The top surface of the intermediary component 35 is defined as a transfer surface 351 and is fitted onto the receiving surface 331 of the crimping fixture 33, allowing the intermediary component 35 to move in the Z direction with the crimping fixture 33. The intermediary component 35 has a fitting portion 352 extending from the transfer surface 351 to the bottom surface, which can fit electronic components. The four sides of the fitting portion 352 are defined as a plurality of side transfer surfaces 353, which can fit a plurality of side peripheral surfaces of electronic components.
[0051] As described above, the bottom surface of the intermediary 35 may or may not contact a device used to support electronic components (e.g., a carrier board, the inner bottom surface of a test socket of a tester, or the inner bottom surface of a stage, etc.), and is not limited to this embodiment. In this embodiment, the bottom surface of the intermediary 35 is defined as an abutment surface 354 for attaching to the carrier board of the electronic module (not shown in the figure).
[0052] Please see Figure 3 ,Figure 4 The present invention provides a testing device 30, comprising at least one testing mechanism and at least one crimping mechanism of the present invention. The at least one testing mechanism is provided with at least one tester for holding and testing electronic components. In this embodiment, the tester of the testing mechanism is provided with an electrically connected circuit board 361 and a test socket 362. The test socket 362 has a plurality of probes for holding and testing an electronic module 40 containing electronic components. In this embodiment, the bottom surface of the carrier plate 41 of the electronic module 40 is provided with a plurality of contacts, and an electronic component 42 is electrically connected to the middle portion of the top surface of the carrier plate 41. A metal frame 43 is provided around the periphery, the top surface 421 of the electronic component 42 faces upward, and a receiving space A is provided between the plurality of side peripheral surfaces 422 and the metal frame 43.
[0053] The crimping mechanism of the present invention is disposed above the testing mechanism, and the transfer arm 31 carries the crimping tool 33, the cooling chip 34 and the intermediate component 35 above the testing base 362, with the contact surface 354 of the intermediate component 35 facing downward.
[0054] In cold testing, the electronic module 40 is placed into the test socket 362, and the contacts of the carrier plate 41 are electrically connected to the probes of the test socket 362, so that the electronic component 42 faces upwards for testing. Of course, depending on the type of electronic component, it is also possible to directly place electronic components without a carrier plate and metal frame into the test socket 362.
[0055] The transfer arm 31 of the mounting unit is driven by the drive source to move the base 32, crimping tool 33 and intermediate component 35 synchronously downward in the Z direction, so that the intermediate component 35 of the joining unit is placed into the receiving space A between the electronic component 42 and the metal frame 43, and abuts against the carrier plate 41 with the abutting surface 354. The fitting portion 352 of the intermediary 35 can accommodate the electronic component 42, causing the receiving surface 331 of the crimping tool 33 to press against and adhere to the top surface 421 of the electronic component 42, and causing the plurality of side transfer surfaces 353 of the intermediary 35 to adhere to the plurality of side peripheral surfaces 422 of the electronic component 42. The cooling chip 34 of the temperature control unit performs direct heat exchange with the electronic component 42 via the receiving surface 331 of the crimping tool 33. Since the transfer surface 351 of the intermediary 35 adheres to the receiving surface 331 of the crimping tool 33, the transfer surface 351 can conduct the temperature of the crimping tool 33 to the intermediary 35, giving the intermediary 35 a preset function. Temperature control is achieved by having multiple side surfaces 353 of the intermediate component 35 adhere to multiple peripheral surfaces 422 of the electronic component 42. This not only significantly increases the heat exchange area but also allows the intermediate component 35 to conduct heat to the electronic component 42 laterally, thus avoiding heat buildup on the peripheral surface of the electronic component 42. In other words, with the electronic component 42 in a state where both the top surface 421 and multiple peripheral surfaces 422 can improve the heat exchange efficiency, the temperature control unit can quickly control the electronic component 42 to the preset test temperature, thereby shortening the temperature control operation time. This facilitates the crimping tool 33 to crimp the electronic component 42 and quickly perform the test operation, thereby improving the test quality.
[0056] Please see Figure 5 In the second embodiment of the pressing mechanism of the present invention, the mounting unit, joining unit, and temperature control unit are substantially the same as those in the first embodiment. The difference between the second and first embodiments is that the intermediate component 35 of the temperature control unit can be detachably assembled to the electronic component 42. In this embodiment, the intermediate component 35 can be separated from the pressing tool 33 and is pre-embedded in the accommodating space A between the electronic component 42 and the metal frame 43 with the fitting part 352, so that the plurality of side transfer surfaces 353 of the intermediate component 35 are in contact with the plurality of side peripheral surfaces 422 of the electronic component 42. When the transfer arm 31 drives the pressing tool 33, the cooling chip 34, etc. to move downward in the Z direction, the bearing surface 331 of the pressing tool 33 is in contact with the transfer surface 351 of the intermediate component 35, so that the intermediate component 35 can perform lateral temperature conduction heat exchange to the electronic component 42, and in conjunction with the bearing surface 331 of the pressing tool 33 to perform direct temperature conduction heat exchange to the electronic component 42, the temperature control efficiency can also be improved.
[0057] Please see Figure 6 , Figure 7The third embodiment of the crimping mechanism of the present invention has a mounting unit, a joining unit, and a temperature control unit that are substantially the same as the first embodiment. The difference between the third embodiment and the first embodiment is that the intermediate component 35A of the temperature control unit is made of a soft and deformable material, and is assembled on the bearing surface 331 of the crimping tool 33 with a transfer surface 351A. When the transfer arm 31 drives the intermediate component 35A to crimp and bond the electronic component 42, the bottom surface (i.e., the abutment surface 354A) of the intermediate component 35A can be pressed and deformed inward toward the transfer surface 351A to form a fitting part 352A, and the periphery of the fitting part 352A is defined as a plurality of side transfer surfaces 353A, which can bond to a plurality of side peripheral surfaces 422 of the electronic component 42.
[0058] Please see Figure 8 The fourth embodiment of the crimping mechanism of the present invention has a mounting unit, a joining unit, and a temperature control unit that are substantially the same as the first embodiment. The difference between the fourth embodiment and the first embodiment is that the intermediate part 35B of the temperature control unit is made of a soft and deformable material, and is integrally formed at the position relative to the electronic component (not shown in the figure). A fitting part 352B is recessed from the bottom surface (i.e., the abutment surface 354B) toward the transfer surface 351B. There is a thickness between the fitting part 352B and the transfer surface 351B, which can provide an elastic buffer to avoid damage to the electronic component when the crimping tool 33 presses down on the electronic component. The periphery of the fitting part 352B is defined as a plurality of side transfer surfaces 353B, which can fit the plurality of side peripheral surfaces of the electronic component.
[0059] Please see Figures 2 to 4 and Figure 9The testing device 30 of this invention is applied to an electronic component processing machine. This invention provides a processing machine comprising a machine base 50, a feeding device 60, a receiving device 70, a testing device 30, a conveying device 80, and a central control device (not shown). The feeding device 60 is mounted on the machine base 50 and has at least one feeder to accommodate at least one electronic component to be tested. The receiving device 70 is mounted on the machine base 50 and has at least one receiver to accommodate at least one tested electronic component. The testing device 30 is disposed on the machine base 50 and has at least one testing mechanism and at least one pressing mechanism of this invention. The at least one testing mechanism has at least one tester for testing electronic components. In this embodiment, the tester has an electrically connected circuit board 361 and a test socket 362 for holding and testing electronic components. The pressing mechanism of this invention is disposed above the tester and has a mounting unit, a joining unit, and a temperature control unit for temperature control and pressing. Electronic components are received; a conveying device 80 is mounted on the machine base 50 and is provided with at least one conveyor to convey electronic components. In this embodiment, the conveying device 80 is provided with a first conveyor 81 to take out the electronic components to be tested from the feeder of the feeding device 60 and transfer them to the second conveyor 82. The third conveyor 83 carries the electronic components to be tested to the test seat 362 of the testing mechanism of the testing device 30. The testing mechanism, together with the crimping tool 33 of the crimping mechanism and the temperature control unit, crimps and temperature-controls the electronic components to perform testing operations. The third conveyor 83 moves the tested electronic components into the second conveyor 82. The first conveyor 81 takes out the tested electronic components from the second conveyor 82. According to the test results, the tested electronic components are conveyed to the receiver of the receiving device 70 for sorting and storage. A central control device (not shown) is used to control and integrate the operation of each device to perform automated operation and achieve practical benefits in improving work efficiency.
Claims
1. A crimping mechanism, characterized in that, Include: Mounting unit: Equipped with at least one mounting device; Joining unit: assembled on the bracket and provided with at least one crimping tool for crimping electronic components; Temperature control unit: It is provided with at least one temperature controller and at least one intermediate component. The temperature controller is assembled in the bonding unit and can control the temperature of the crimping tool. The transfer surface of the intermediate component and the receiving surface of the crimping tool can be in contact with each other for direct heat exchange in the test state. The intermediate component and the electronic component can be in contact with each other in the test state. The intermediate component defines a plurality of side transfer surfaces and a plurality of side peripheral surfaces of the electronic component for lateral heat exchange.
2. The crimping mechanism as described in claim 1, characterized in that: The intermediate component of the temperature control unit is made of a soft and deformable material and has a fitting part that extends from the transfer surface to the bottom surface, which can fit the electronic component. The periphery of the fitting part is defined by a plurality of side transfer surfaces, which can fit a plurality of the side peripheral surfaces of the electronic component.
3. The crimping mechanism as described in claim 1, characterized in that: The intermediate component of the temperature control unit is made of a soft and deformable material. When it is attached to the electronic component, the bottom surface of the intermediate component is pressed and deformed inward to form a fitting part. The periphery of the fitting part is defined as a plurality of side transmission surfaces, which can fit a plurality of side peripheral surfaces of the electronic component.
4. The crimping mechanism as described in claim 1, characterized in that: The intermediate component of the temperature control unit is integrally formed at the position relative to the electronic component and has a recessed fitting portion from the bottom surface toward the transfer surface. The periphery of the fitting portion is defined as a plurality of side transfer surfaces, which can fit the plurality of side peripheral surfaces of the electronic component.
5. The crimping mechanism as described in claim 1, characterized in that: The bottom surface of the intermediate component of the temperature control unit is defined as the contact surface.
6. The crimping mechanism as described in any one of claims 1 to 5, characterized in that: The transfer surface of the intermediate component of the temperature control unit can be assembled onto the bearing surface of the crimping tool and move synchronously.
7. The crimping mechanism as described in any one of claims 1 to 5, characterized in that: The intermediate component of the temperature control unit can be detachably assembled to the electronic component.
8. The crimping mechanism as described in any one of claims 1 to 5, characterized in that: The mounting unit is capable of displacement in at least one direction.
9. A testing device, characterized in that, Include: At least one testing facility: equipped with at least one tester for mounting and testing electronic components; At least one crimping mechanism as described in claim 1: for temperature control and crimping the electronic components of the tester.
10. A work machine, characterized in that, Include: Machine tool; Feeding device: disposed on the machine and equipped with at least one feeder for accommodating at least one electronic component to be tested; Material receiving device: disposed on the machine and provided with at least one material receiving device for accommodating at least one measured electronic component; At least one testing apparatus as described in claim 9: configured on the machine tool for performing testing operations on the electronic component; Conveying device: disposed on the machine tool and equipped with at least one conveyor for conveying at least one of the electronic components; Central control unit: Used to control and integrate the operation of various devices to perform automated operations.