A circuit temperature phase shift coefficient measuring device and method

Abstract

This application belongs to the field of signal detection and precision measurement, specifically disclosing a device and method for measuring the phase shift coefficient of circuit temperature. The device includes a signal input module, a temperature control module, a phase frequency measurement module, and a data processing module. The signal input module, the circuit under test (DUT), and the phase frequency measurement module are connected sequentially to form a closed-loop measurement link. The signal input module is used to adapt the output sweep frequency excitation signal to the DUT. The temperature control module is used to control the DUT to stabilize sequentially at different temperature points and collect temperature data. The phase frequency measurement module is used to perform sweep frequency excitation and response measurement on the measurement link within a preset frequency band after stabilization at each temperature point to obtain transmission response data. The data processing module is used to receive the transmission response data and temperature data and calculate the phase shift coefficient of the DUT temperature. This application achieves rapid measurement of the phase shift coefficient of circuit temperature across the entire frequency band, significantly improving measurement efficiency and accuracy.

Description

Technical Field

[0001] This application belongs to the field of signal detection and precision measurement, specifically relating to the technical field of electrical sensors, and more specifically, to a circuit temperature phase shift coefficient measuring device and method. Background Technology

[0002] In high-precision cutting-edge scientific missions such as satellite-based Earth gravity field measurements and space gravitational wave detection, transimpedance amplifier circuits are key front-end components for detecting weak laser interferometric beat frequency signals. The phase stability of the received signal directly affects the measurement accuracy of inter-satellite distances or displacements. To achieve ultra-high precision displacement measurements at the picometer level, transimpedance amplifier circuits, along with their corresponding signal amplification and conditioning circuits, are required to have phase shift stability at the micro-radian level. However, the phase frequency characteristics of such circuits drift with changes in ambient temperature, and the resulting thermally induced phase noise is one of the main noise sources limiting system performance. Its impact is usually quantified by the temperature phase shift coefficient, i.e., the sensitivity of the circuit phase to temperature changes.

[0003] In related technologies, the phase shift coefficient of circuit temperature is typically evaluated using a combination of a phase meter and a thermometer. This traditional method can be used for measurements at a single fixed frequency point, but when characterizing the phase shift temperature characteristics within a specific frequency band is required, frequency-by-frequency sweep measurements are necessary. This process not only involves complex system configuration and lengthy measurement cycles, but also introduces significant measurement uncertainties due to multiple factors such as the sweep rate, step interval, signal power stability, and the phase-locked loop speed and performance of the phase meter itself. This affects the accuracy and efficiency of the final evaluation, making it difficult to meet the testing requirements of wide bandwidth, high efficiency, and high precision. Summary of the Invention

[0004] In view of the shortcomings of related technologies, the purpose of this application is to provide a circuit temperature phase shift coefficient measurement scheme, which aims to solve the problem of insufficient measurement efficiency and accuracy within the frequency band caused by the traditional point-by-point frequency sweep measurement method based on phase meter and thermometer.

[0005] The first aspect of this application relates to a circuit temperature phase shift coefficient measuring device, comprising a signal input module, a temperature control module, a phase frequency measurement module, and a data processing module. The signal input module, the circuit under test (DUT), and the phase frequency measurement module are connected sequentially to form a closed-loop measurement link. The signal input module is used to adapt the sweep frequency excitation signal output by the phase frequency measurement module to the DUT. The temperature control module is used to control the DUT to stabilize sequentially at multiple different temperature points and collect the temperature data corresponding to each temperature point. The phase frequency measurement module is used to perform sweep frequency excitation and response measurement on the measurement link within a preset frequency band after stabilization at each temperature point to obtain the transmission response data of the DUT at each temperature point. The data processing module, connected to the phase frequency measurement module and the temperature control module respectively, is used to receive the transmission response data and temperature data, extract the phase from the transmission response data to obtain the phase frequency response data at each temperature point, and calculate the rate of change of the phase frequency response data relative to the temperature to obtain the temperature phase shift coefficient of the DUT.

[0006] The device provided in this embodiment connects the signal input module, the circuit under test, and the phase frequency measurement module in series to form a complete signal loop from excitation to response reception. The core of this link lies in the phase frequency measurement module, which functions as both an excitation source and a high-precision receiver. Under a stable temperature condition, it outputs a series of continuously changing frequency signals and simultaneously measures the amplitude and phase response of the entire loop to this series of frequencies, i.e., transmits response data. Through the time-series coordination of steady-state temperature control and full-band synchronous measurement, efficient, synchronous, and accurate acquisition and processing of two-dimensional temperature-frequency parameter spatial data is achieved.

[0007] This device combines the dozens to hundreds of single-point measurements required by traditional methods into a single rapid continuous measurement, thereby reducing the frequency band measurement time at each temperature point by 1 to 2 orders of magnitude and greatly improving the overall measurement efficiency.

[0008] Furthermore, in traditional, lengthy single-frequency serial measurements, temperature drift and instrument state drift errors are easily introduced. The device provided in this embodiment triggers frequency sweep measurement only after each temperature point has stabilized. Because the frequency sweep process is extremely fast, it can be assumed that all data across the entire frequency band is acquired instantaneously under the same temperature condition, completely eliminating phase errors caused by slow temperature changes during measurement. This rapid frequency sweep measurement ensures that the instrument's state remains essentially unchanged at a single temperature point, further reducing system drift errors and improving measurement accuracy.

[0009] In some implementations, the temperature control module includes a drive unit, a temperature regulating unit, and a temperature sensing unit. The drive unit is electrically connected to the temperature regulating unit and provides controllable electrical power to the temperature regulating unit; the temperature regulating unit is in thermal contact with the circuit under test and is used to actively heat or cool the circuit under test based on the electrical power; the temperature sensing unit is in thermal contact with the circuit under test and is used to measure the temperature of the circuit under test in real time; the data processing module is also used to monitor temperature data in real time, and when the temperature data fluctuation is less than a preset threshold and remains stable for more than a preset duration, it determines that the temperature point is stable and triggers the phase frequency measurement module to perform a sweep frequency measurement at that temperature point.

[0010] This embodiment achieves closed-loop automatic temperature control through a temperature control module, ensuring that each frequency sweep measurement is performed under steady-state conditions where the temperature of the circuit under test has reached and maintained dynamic equilibrium. This provides a reliable temperature reference for subsequent calculation of the temperature phase shift coefficient. Simultaneously, it ensures temperature consistency of response data across all frequency points within the entire frequency band, completely eliminating the systematic error caused by different temperatures corresponding to different frequency points in traditional point-by-point measurements due to long measurement cycles and potential slow temperature drift.

[0011] By integrating the temperature stability judgment logic into the data processing module as a condition to trigger measurement, a seamless transition from temperature readiness to automatic measurement is achieved. This reduces manual intervention and avoids errors introduced by human judgment mistakes or operational delays, making the entire measurement process more efficient and reliable.

[0012] In some implementations, the driving unit is a DC voltage source, the temperature regulating unit is a semiconductor cooling chip, and the temperature sensing unit is a digital thermometer.

[0013] This embodiment constructs a high-precision, fast-response, and bidirectionally controllable integrated temperature control module by selecting standard interface components with matching characteristics. This not only solves the problem of rapid temperature change in wide temperature range measurement, but also provides key hardware support for achieving efficient and accurate circuit temperature phase shift coefficient measurement.

[0014] In some implementations, the data processing module includes: a parameter receiving unit for controlling the phase frequency measurement module to repeatedly perform response measurements and receiving multiple sets of initial complex transmission parameters at each temperature point; and a data averaging unit for averaging the multiple sets of initial complex transmission parameters to obtain average complex transmission parameters, and using the average complex transmission parameters as transmission response data.

[0015] Considering that in actual measurements, transmission response data is subject to various random noise interferences, leading to random fluctuations in single measurement results and not representing the true response of the circuit, and based on statistical principles, uncorrelated random noise will cancel each other out after multiple averaging. Therefore, the signal-to-noise ratio of the average complex transmission parameters obtained in this embodiment is significantly higher than any single measurement result, and is closer to the true transmission response of the circuit under ideal noise-free conditions. This provides cleaner and more reliable raw data for subsequent phase extraction and temperature phase shift coefficient calculation, thereby enhancing the reliability and repeatability of the measurement results. It is particularly suitable for high-precision measurement scenarios where the performance of the circuit under test is extremely sensitive to minute changes.

[0016] In some implementations, the data processing module further includes: a differential calculation unit, used to sequentially calculate the phase frequency response data change of every two adjacent temperature points at each frequency point within the preset frequency band; and a coefficient calculation unit, used to calculate the ratio of the phase frequency response data change to the corresponding temperature change to obtain the temperature phase shift coefficient.

[0017] This embodiment employs a calculation method based on the difference between adjacent temperature points, enabling rapid and real-time conversion from phase frequency response data to temperature phase shift coefficients, outputting a series of temperature phase shift coefficients corresponding to various discrete temperature ranges. Each coefficient clearly represents the average phase temperature sensitivity of the circuit within that specific temperature range. This piecewise constant representation is highly intuitive, clearly showing which temperature range the circuit's phase is most sensitive to temperature, making it particularly suitable for measurement applications with high real-time requirements.

[0018] In some implementations, the excitation signal output port of the phase frequency measurement module is connected to the input port of the signal input module via an RF cable, the output port of the signal input module is connected to the input port of the circuit under test, and the output port of the circuit under test is connected to the receiving measurement port of the phase frequency measurement module via an RF cable, forming a closed-loop measurement link.

[0019] This embodiment ensures high-fidelity, low-loss signal transmission from excitation to reception by using radio frequency cables. By defining the connection topology of the closed-loop measurement link, the physical state of each measurement link setup is highly consistent. This guarantees that differences in measurement results primarily originate from circuit variations or temperature changes, rather than random fluctuations in connection status, further improving measurement accuracy and reliability.

[0020] In some embodiments, the device further includes a calibration module connected to both the signal input module and the phase frequency measurement module; the calibration module is used to control the signal input module to switch to a standard calibration component before measurement and to trigger the phase frequency measurement module to perform a frequency sweep measurement on the calibration link to obtain system error data; the data processing module is connected to the calibration module and is also used to perform error compensation on the transmission response data of the circuit under test based on the system error data.

[0021] This embodiment implements a pre-calibration vector error calibration process through a calibration module, which makes the final calculated temperature phase shift coefficient more accurate and its value more comparable under different test systems and at different times, greatly enhancing the robustness of the entire measurement device and the repeatability of the measurement results.

[0022] In some implementations, the phase frequency measurement module supports multiple sweep modes, including wideband sweep and focused sweep; the data processing module is also used to adaptively determine the key frequency band that the phase is sensitive to temperature changes based on the wideband sweep results, and control the phase frequency measurement module to perform focused sweep within the key frequency band, wherein the frequency interval of the focused sweep is smaller than the frequency interval of the wideband sweep.

[0023] This embodiment combines wideband frequency sweeping with focused frequency sweeping, avoiding indiscriminate high-density frequency sweeping across the entire frequency band. It directs the measurement time towards critical frequency bands that are sensitive to temperature changes, thereby achieving an optimal balance between overall efficiency and measurement accuracy in critical areas.

[0024] Secondly, this application provides a method for measuring the phase shift coefficient of circuit temperature, applied to the aforementioned circuit temperature phase shift coefficient measuring device, the method comprising: The circuit under test (DUT) is controlled to stabilize at multiple different temperature points sequentially, and temperature data corresponding to each temperature point is collected. After stabilization at each temperature point, the measurement link is subjected to frequency sweep excitation signal within a preset frequency band, and the response of the measurement link is measured synchronously to obtain the transmission response data of the DUT at each temperature point. Phase extraction is performed on the transmission response data at each temperature point to obtain the corresponding phase frequency response data. Based on the phase frequency response data and the corresponding temperature data at each temperature point, the rate of change of the phase frequency response data relative to temperature is calculated to obtain the temperature phase shift coefficient of the DUT.

[0025] In some implementations, the method further includes: real-time monitoring of temperature data, and when the temperature data fluctuation is less than a preset threshold and remains stable for more than a preset duration, determining that the temperature point is stable and triggering the phase frequency measurement module to perform a frequency sweep measurement at that temperature point.

[0026] Thirdly, this application provides an electronic device, comprising: at least one memory for storing a program; and at least one processor for executing the program stored in the memory, wherein when the program stored in the memory is executed, the processor is configured to execute the method described in the second aspect or any possible implementation thereof.

[0027] Fourthly, this application provides a computer-readable storage medium storing a computer program that, when run on a processor, causes the processor to perform the method described in the second aspect or any possible implementation thereof.

[0028] Fifthly, this application provides a computer program product that, when run on a processor, causes the processor to perform the method described in the second aspect or any possible implementation thereof.

[0029] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.

[0030] Overall, the technical solutions conceived in this application have the following beneficial effects compared with the prior art: (1) By constructing a closed-loop measurement link and utilizing the wideband sweep capability of the phase frequency measurement module, the transmission response data of the circuit under test in the entire preset frequency band can be acquired synchronously in a single stable temperature state. This innovates the traditional method of sequential acquisition by frequency point to synchronous parallel acquisition across the entire frequency band, greatly shortening the measurement time. While simplifying the structure of the measurement device, it realizes rapid and high-throughput measurement of the circuit temperature phase shift coefficient, which is particularly suitable for scenarios that require a large number of tests in a wide temperature range and wide frequency band.

[0031] (2) By ensuring “temperature consistency of data across the entire frequency band” and “short-term stability of the measurement system”, errors introduced by temperature fluctuations and system drift are eliminated in principle. This significantly improves the accuracy and repeatability of temperature phase shift coefficient measurement results, providing a more reliable data foundation for high-precision circuit design and temperature compensation model establishment.

[0032] (3) Through the efficient acquisition of dense "temperature-frequency" grid data, the continuous surface features of phase change with temperature and frequency are clearly presented. This provides continuous and rich information for observing and analyzing the nonlinear behavior, inflection points and complex change modes of the circuit phase temperature characteristics, revealing the deep thermal characteristics of the circuit that cannot be observed by traditional measurement methods based on sparse discrete points.

[0033] In summary, this device has achieved a collaborative innovation in measurement principles, system architecture, and data processing by constructing a systematic measurement platform that integrates precise temperature control, rapid wideband frequency sweep, synchronous data acquisition, and intelligent data processing. This solves the fundamental problem that traditional methods cannot balance efficiency and accuracy. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the circuit temperature phase shift coefficient measuring device provided in the embodiments of this application.

[0035] Figure 2 This is one of the structural schematic diagrams of the temperature control module provided in the embodiments of this application.

[0036] Figure 3 This is the second structural schematic diagram of the temperature control module provided in the embodiments of this application.

[0037] Figure 4 This is a schematic flowchart of the circuit temperature phase shift coefficient measurement method provided in the embodiments of this application. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0039] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0040] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more, for example, multiple processing units means two or more processing units, multiple elements means two or more elements, etc.

[0041] The embodiments of this application are described below with reference to the accompanying drawings.

[0042] Figure 1 This is a schematic diagram of the circuit temperature phase shift coefficient measuring device provided in the embodiments of this application, as shown below. Figure 1 As shown, the device includes a signal input module 110, a temperature control module 120, a phase frequency measurement module 130, and a data processing module 140. The signal input module, the circuit under test, and the phase frequency measurement module are connected in sequence to form a closed-loop measurement link. The signal input module is used to adapt the sweep frequency excitation signal output by the phase frequency measurement module to the circuit under test; The phase frequency measurement module is used to perform frequency sweep excitation and response measurement on the measurement link within a preset frequency band after each temperature point has stabilized, so as to obtain the transmission response data of the circuit under test at each temperature point. The temperature control module is used to control the circuit under test to stabilize at multiple different temperature points in sequence, and to collect the temperature data corresponding to each temperature point. The data processing module is connected to the phase frequency measurement module and the temperature control module respectively. It is used to receive transmission response data and temperature data, extract the phase from the transmission response data to obtain the phase frequency response data at each temperature point, and calculate the rate of change of the phase frequency response data relative to the temperature to obtain the temperature phase shift coefficient of the circuit under test.

[0043] Specifically, the circuit under test (DUT) refers to an electronic circuit or component whose phase characteristics change with ambient temperature, requiring measurement of the temperature phase shift coefficient. The core characteristic of the DUT is that the equivalent phase of its signal transmission path is a function of temperature. The DUT can be various functional circuits with general input-output transmission relationships, such as transimpedance amplifiers, power dividers, directional couplers, or filters.

[0044] The core function of the signal input module is to adapt the standard RF excitation signal output by the phase frequency measurement module to the actual requirements of the circuit under test. For example, if the circuit under test is a low-voltage differential input circuit, the signal input module needs to include a balun or level conversion circuit to ensure that the excitation signal can be effectively injected into the circuit under test without disrupting its operating point.

[0045] A phase-frequency measurement module is a hardware functional module capable of performing frequency sweep excitation and synchronously and accurately measuring the complex transmission parameters of the circuit under test at multiple discrete or continuous frequency points. Its core output is transmission response data containing amplitude and phase information. A phase-frequency measurement module can be, for example, a vector network analyzer (VNA).

[0046] A closed-loop measurement link can refer to a measurement loop in which a signal originates from the output port of the phase frequency measurement module, is adapted by the signal input module, is input to the circuit under test, and then returns from the output of the circuit under test to the input port of the phase frequency measurement module, forming a physically connected measurement loop in which the signal can cyclically respond.

[0047] As the core measuring instrument, the phase frequency measurement module utilizes its high-precision frequency sweeping characteristics to acquire the transmission characteristics over a wide frequency band in one go. Unlike traditional solutions, it eliminates the need to build complex phase meter circuits, thus significantly simplifying the hardware structure.

[0048] In some embodiments, the specific physical connection relationship between the modules can be as follows: the excitation signal output port of the phase frequency measurement module is connected to the input terminal of the signal input module through an RF cable, the output terminal of the signal input module is connected to the input terminal of the circuit under test, and the output terminal of the circuit under test is connected to the receiving measurement port of the phase frequency measurement module through an RF cable, forming a closed-loop measurement link.

[0049] Specifically, this connection method constructs a standard two-port network measurement topology. The excitation signal output port (usually labeled Port1) of the phase frequency measurement module serves as the excitation source, outputting a swept-frequency RF signal. This signal is first transmitted to the signal input module via an RF cable. It should be understood that RF cables (such as coaxial cables) are transmission lines specifically designed for transmitting RF signals. Their core characteristics are a defined characteristic impedance and the ability to provide a good shielding layer. Through specific shielding structures and impedance control, RF cables can effectively suppress external electromagnetic interference and reduce signal loss during transmission, ensuring that the excitation signal can be transmitted to the signal input module with high quality.

[0050] Subsequently, the signal is adapted by the signal input module and then injected into the circuit under test (DUT). The DUT processes the signal and outputs a response signal, which is also transmitted back via RF cable to the receiving measurement port (usually labeled Port2) of the phase frequency measurement module. The phase frequency measurement module accurately measures the transmission coefficient S21 of the closed-loop link by comparing the incident signal emitted from Port1 with the transmitted signal received from Port2. This explicit connection method ensures a high degree of consistency in the physical state of each established measurement link.

[0051] Understandably, the aforementioned RF cables can be connected using standard RF interfaces such as SMA (SubMiniature version A) connectors or N-type connectors, depending on the interface type of the phase frequency measurement module and the circuit under test.

[0052] Temperature control modules are typically in close physical contact with the circuit under test (DUT), changing the circuit's physical temperature through active heating or cooling. They integrate temperature sensors to monitor the chip temperature or ambient temperature of the DUT in real time and output temperature data in analog or digital form.

[0053] The data processing module typically uses a computer or industrial control computer as the host computer, communicating with the phase frequency measurement module via interfaces such as serial port, USB, LAN, or GPIB, and with the temperature control module via a serial port or data acquisition card. This allows the data processing module to synchronously acquire phase and temperature information at the same time dimension, solving the problem of data asynchrony in traditional measurements.

[0054] When in operation, the measuring device sequentially traverses various temperature points along the time axis. Within a time slice at each temperature point, it utilizes the frequency sweep function of the phase frequency measurement module to acquire the transmission response data of the entire preset frequency band simultaneously and synchronously. That is, it performs systematic gridded data acquisition in a two-dimensional parameter space composed of "temperature-frequency".

[0055] The data processing module analyzes the collected two-dimensional grid data. First, it extracts the phase frequency response data from the transmission response data at each temperature point; then, for each frequency point, it calculates the rate of change of phase with temperature, ultimately obtaining the core thermal characteristic parameter of the circuit—the temperature phase shift coefficient, which describes the sensitivity of the circuit's phase to temperature changes.

[0056] In some embodiments, the temperature control module 120 includes a drive unit 121, a temperature adjustment unit 122, and a temperature sensing unit 123; The drive unit is electrically connected to the temperature control unit to provide controllable electrical power to the temperature control unit; the temperature control unit is in thermal contact with the circuit under test to actively heat or cool the circuit under test based on the electrical power; the temperature sensing unit is in thermal contact with the circuit under test to measure the temperature of the circuit under test in real time.

[0057] The data processing module is also used to monitor temperature data in real time, and when the temperature data fluctuation is less than a preset threshold and remains stable for more than a preset time, it determines that the temperature point is stable and triggers the phase frequency measurement module to perform a frequency sweep measurement at that temperature point.

[0058] Specifically, Figure 2 and Figure 3 This is a schematic diagram of the temperature control module provided in an embodiment of this application, as shown below. Figure 2 and Figure 3 As shown, the drive unit is electrically connected to the temperature regulation unit, providing controllable electrical power to the temperature regulation unit. The drive unit is preferably a DC voltage source. The DC voltage source can output a precisely adjustable DC voltage, and by changing the magnitude and polarity of the output voltage, the magnitude and direction of the current flowing through the temperature regulation unit can be precisely controlled. The control of electrical power is the driving force for achieving active temperature regulation. In other words, by setting different drive voltages, the circuit under test can be stabilized at different temperature points, enabling phase characteristic measurements under different temperature conditions.

[0059] The temperature control unit is in thermal contact with the circuit under test (DUT) and is used to actively heat or cool the DUT based on electrical power. The temperature control unit is preferably a thermoelectric cooler. The thermoelectric cooler utilizes the Peltier effect; when a direct current flows through it, one end absorbs heat (cooling end), and the other end releases heat (heating end). By placing the cooling or heating end of the thermoelectric cooler in close contact with the DUT and adjusting the polarity of the voltage output from the drive unit, the operating mode of the thermoelectric cooler can be flexibly switched. For example, when it is necessary to raise the temperature of the DUT, the voltage polarity is adjusted to heat the contact end; when it is necessary to lower the temperature, the voltage polarity is reversed to cool the contact end.

[0060] The active heating or cooling capability of the temperature regulation unit enables the device in this embodiment to be free from the limitations of ambient temperature, allowing it to quickly establish a stable temperature test point over a wide temperature range. To ensure heat conduction efficiency, thermal grease is typically applied or a thermal pad is placed between the thermoelectric cooler and the circuit under test to fill microscopic air gaps and reduce contact thermal resistance. Simultaneously, the non-working surface of the thermoelectric cooler (such as the hot end in heating mode) is typically connected to a heat sink and a fan, and the time-consuming heat dissipation maintains the thermal balance of the temperature control system.

[0061] The temperature sensing unit is in thermal contact with the circuit under test (DUT) to measure its temperature in real time. The temperature sensing unit is preferably a digital thermometer. Digital thermometers typically include a high-precision temperature probe, such as a thermistor or platinum resistance thermometer, whose output signal is digital, allowing the data processing module to read it directly, eliminating the analog signal conversion step and reducing system noise.

[0062] At each temperature point, it is necessary to wait for the temperature of the circuit under test to reach thermal equilibrium, that is, for the temperature reading to stabilize within the preset error range (such as ±0.1℃) and maintain it for a preset time. At this time, it is determined that the temperature is stable and the phase frequency measurement module is triggered to perform frequency sweep measurement at that temperature point.

[0063] In some embodiments, the voltage sequence of the driving unit is set to 0 V, 0.2 V, 0.3 V, 0.4 V, and 0.5 V, and each voltage point is maintained for 5–10 minutes until the temperature reading displayed on the digital thermometer stabilizes. After the temperature stabilizes, the transmission response data measured by the vector network analyzer is recorded, and the temperature data at that moment is collected simultaneously for subsequent temperature phase shift coefficient analysis.

[0064] In some embodiments, the data processing module includes: The parameter receiving unit is used to control the phase frequency measurement module to repeatedly perform response measurements and receive multiple sets of initial complex transmission parameters at each temperature point. The data averaging unit is used to perform data averaging on multiple sets of initial complex transmission parameters to obtain average complex transmission parameters, which are then used as transmission response data.

[0065] Specifically, considering that random factors such as electromagnetic interference and system thermal noise inevitably couple into the measurement results in actual measurement environments, the averaging function of the phase frequency measurement module is enabled during measurement to record multiple sets of data simultaneously, in order to reduce the impact of random noise on the measurement results.

[0066] For example, for each stable temperature point, the control phase frequency measurement module continuously collects seven sets of S21 data. These seven sets of data will exhibit slight jitter around the true value in the complex plane. By calculating the arithmetic mean of the real and imaginary parts of these seven sets of data, a complex value that is closer to the true transmission characteristics can be obtained, effectively reducing the random errors that may occur in a single measurement.

[0067] In one embodiment, the temperature data synchronously recorded during the measurement process and multiple sets of S21 initial complex transmission parameters measured by the VNA are imported into the data processing module. The five temperature points are sequentially marked as follows: , , , , For each temperature point, the VNA collected seven sets of S21 sweep data under steady-state conditions, denoted as data_1 to data_7. To improve the signal-to-noise ratio, the arithmetic mean of the seven sets of data within each temperature point was calculated:

[0068] The averaged complex data of S21 are denoted as S21_1, S21_2, S21_3, S21_4, and S21_5, corresponding to temperatures T1 to T5 respectively.

[0069] After obtaining the average complex transmission parameters with high signal-to-noise ratio, the phase of the transmission response data is further extracted to obtain the phase frequency response data at each temperature point.

[0070] Phase information is extracted from the averaged S21 data for each group. S21 is a complex number, which can be represented by its real and imaginary parts:

[0071] The corresponding phase is calculated by the following formula:

[0072] Perform the phase extraction described above on S21_1 to S21_5 respectively to obtain five sets of phase frequency response data, denoted as... , , , , .

[0073] Through the above calculations, the transmission parameters in complex form can be converted into phase values ​​in degrees or radians. This conversion process not only extracts temperature-sensitive phase information but also eliminates the interference of amplitude information on the calculation of the temperature phase shift coefficient. The resulting phase frequency response data possesses both the advantage of high signal-to-noise ratio and achieves accurate mapping from the complex domain to the phase domain, laying a solid foundation of data values ​​for the subsequent accurate calculation of the temperature phase shift coefficient.

[0074] After obtaining the phase frequency response data, the rate of change of the phase frequency response data relative to temperature can be further calculated, i.e., the temperature phase shift coefficient. At each frequency point within the preset frequency band, the change in phase frequency response data between every two adjacent temperature points is calculated sequentially; the ratio of the change in phase frequency response data to the corresponding temperature change is calculated to obtain the temperature phase shift coefficient.

[0075] Specifically, to ultimately obtain the temperature phase shift coefficient, at each frequency point, the phase is treated as a function of temperature, and its rate of change is calculated using the following formula:

[0076] in This represents the change in phase frequency response data between two adjacent temperatures. The temperature change between two adjacent temperatures is expressed as follows: and Taking two temperature points as an example, the calculated phase frequency response data is as follows: , Therefore, a temperature phase shift coefficient curve can be calculated:

[0077] In this embodiment, data from five temperature points were measured and recorded. By calculating the phase change rate between adjacent temperature points sequentially, four curves showing the temperature phase shift coefficient as a function of frequency were finally obtained. , , , .

[0078] This embodiment does not perform a global linear fitting of the phase frequency response data at all temperature points to obtain the slope. Instead, it focuses on a local temperature range, sequentially selecting two adjacent temperature points for differential calculation. This is because the temperature sensitivity of actual circuits often exhibits nonlinear characteristics. The phase drift mechanism of the circuit under test may differ across different operating temperature ranges. For example, the phase temperature characteristics of some semiconductor devices in the low-temperature region may be drastically different from those in the high-temperature region, or there may be a phase transition or abrupt change in characteristics at certain specific temperature points. If a global fitting is used to average these nonlinear changes, it will not accurately reflect the true sensitivity of the circuit in a specific temperature range, and may even mask some key thermally induced phase jump phenomena. Through the adjacent temperature point differential calculation method in this embodiment, the local sensitivity of phase change with temperature can be accurately reflected, thereby obtaining a series of temperature phase shift coefficient curves that vary with the temperature range.

[0079] Furthermore, the temperature phase shift coefficient curve calculated by the difference between adjacent temperature points is not only a function of frequency but also correlated with a specific temperature range. For the same circuit under test, the final output may contain multiple temperature phase shift coefficient curves, for example... , Corresponding to the characteristics of the low temperature range, , This approach, which adds data dimensions, provides circuit designers with a more refined basis for temperature compensation, tailored to the characteristics of high-temperature ranges. Designers can select phase shift coefficient data for the corresponding temperature range based on the actual operating temperature range of the circuit to design compensation algorithms, thereby significantly improving compensation accuracy.

[0080] In some possible implementations, the measuring device also includes a calibration module, which is connected to the signal input module and the phase frequency measurement module, respectively; The calibration module is used to switch the control signal input module to the standard calibration component before measurement and to trigger the phase frequency measurement module to perform frequency sweep measurement on the calibration link to obtain system error data. The data processing module, connected to the calibration module, is also used to perform error compensation on the transmission response data of the circuit under test based on system error data.

[0081] Specifically, in actual high-frequency measurement links, phase frequency measurement modules (such as vector network analyzers), RF cables, connectors, and signal input modules are not ideal devices. They introduce inherent systematic errors such as amplitude loss, phase shift, and impedance mismatch. These errors are superimposed on the true response of the circuit under test. If not eliminated, the calculated temperature phase shift coefficient will reflect the hybrid characteristics of the "circuit under test + test system" rather than the thermal characteristics of the circuit itself.

[0082] Before the formal measurement, the control signal input module switches the output to a standard calibration component with known characteristics, forming a calibration link. A frequency sweep measurement of this link is then triggered. By measuring the response of the calibration link and comparing it with the theoretical response of the ideal calibration component, the inherent errors introduced by the entire measurement system in amplitude and phase—that is, the system error data—can be accurately quantified.

[0083] In subsequent actual measurements of the circuit under test, the data processing module uses the acquired system error data to perform mathematical vector error correction on the measured raw transmission response data. After compensation, the resulting phase frequency response data is stripped of the influence of the test system itself to the greatest extent, thus reflecting the characteristics of the circuit under test more realistically and purely, resulting in higher absolute accuracy of the final calculated temperature phase shift coefficient.

[0084] In some possible implementations, the phase frequency measurement module supports multiple sweep modes, including wideband sweep and focused sweep. The data processing module is also used to adaptively determine the key frequency band that the phase is sensitive to temperature changes based on the wideband sweep frequency results, and control the phase frequency measurement module to perform focused sweep frequency within the key frequency band. The frequency interval of the focused sweep frequency is smaller than the frequency interval of the wideband sweep frequency.

[0085] Specifically, while dense frequency sweeping using extremely small frequency intervals across the entire frequency band can yield the finest data, it also leads to a significant increase in measurement time, resulting in low efficiency and potentially generating a large amount of redundant data. Conversely, using larger frequency intervals for rapid wideband frequency sweeping is highly efficient but may miss critical frequencies, leading to insufficient characterization of regions with rapid phase changes and affecting the accuracy of temperature phase shift coefficient calculations.

[0086] This embodiment employs a two-stage adaptive measurement approach. First, a wideband sweep mode is used, with a reasonably large frequency interval to quickly complete a full-field scan, acquiring a global overview of the circuit's phase response at a low time cost. The data processing module analyzes this global data, automatically identifying one or more key frequency bands where the phase value is most sensitive to temperature changes. Within these bands, the circuit's phase may undergo drastic or unusual changes with temperature, making them areas requiring focused attention and analysis. Subsequently, the phase frequency measurement module switches to a focused sweep mode within the identified key frequency bands, using a smaller frequency interval for high-resolution measurements.

[0087] Based on the above embodiments, Figure 4 This is a flowchart illustrating the circuit temperature phase shift coefficient measurement method provided in this application embodiment. The method is applied to the aforementioned circuit temperature phase shift coefficient measurement device and includes steps 410-440.

[0088] Step 410: Control the circuit under test to stabilize at multiple different temperature points in sequence, and collect the temperature data corresponding to each temperature point. Step 420: After stabilizing at each temperature point, perform frequency sweep excitation on the measurement link within the preset frequency band and simultaneously measure the response of the measurement link to obtain the transmission response data of the circuit under test at each temperature point. Step 430: Perform phase extraction on the transmission response data at each temperature point to obtain the corresponding phase frequency response data; Step 440: Based on the phase frequency response data and the corresponding temperature data at each temperature point, calculate the rate of change of the phase frequency response data relative to the temperature to obtain the temperature phase shift coefficient of the circuit under test.

[0089] It is understood that the detailed implementation of each step of this method can be found in the description of the foregoing device embodiments, and will not be repeated here. The above method is applied to the device in the foregoing embodiments, and the process steps, implementation principles, and technical effects of the method are similar to those described in the foregoing device.

[0090] Based on the above embodiments, the method further includes: The system monitors temperature data in real time, and determines that the temperature point is stable and triggers the phase frequency measurement module to perform a frequency sweep measurement at that temperature point when the temperature data fluctuation is less than a preset threshold and remains stable for more than a preset duration.

[0091] It is understood that the various numerical designations used in the embodiments of this application are merely for the convenience of description and are not intended to limit the scope of the embodiments of this application.

[0092] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A device for measuring the phase shift coefficient of circuit temperature, characterized in that, It includes a signal input module, a temperature control module, a phase frequency measurement module, and a data processing module. The signal input module, the circuit under test, and the phase frequency measurement module are connected in sequence to form a closed-loop measurement link. The signal input module is used to adapt the sweep frequency excitation signal output by the phase frequency measurement module to the circuit under test; The temperature control module is used to control the circuit under test to stabilize at multiple different temperature points in sequence, and to collect the temperature data corresponding to each temperature point. The phase frequency measurement module is used to perform frequency sweep excitation and response measurement on the measurement link within a preset frequency band after each temperature point stabilizes, so as to obtain the transmission response data of the circuit under test at each temperature point. The data processing module is connected to the phase frequency measurement module and the temperature control module respectively. It is used to receive the transmission response data and the temperature data, extract the phase from the transmission response data to obtain the phase frequency response data at each temperature point, and calculate the rate of change of the phase frequency response data relative to the temperature to obtain the temperature phase shift coefficient of the circuit under test.

2. The circuit temperature phase shift coefficient measuring device according to claim 1, characterized in that, The temperature control module includes a drive unit, a temperature adjustment unit, and a temperature sensing unit. The drive unit is electrically connected to the temperature regulation unit and is used to provide controllable electrical power to the temperature regulation unit; The temperature control unit is in thermal contact with the circuit under test and is used to actively heat or cool the circuit under test based on the electrical power. The temperature sensing unit is in thermal contact with the circuit under test and is used to measure the temperature of the circuit under test in real time. The data processing module is also used to monitor the temperature data in real time, and when the temperature data fluctuation is less than a preset threshold and remains stable for more than a preset duration, it determines that the temperature point is stable and triggers the phase frequency measurement module to perform a frequency sweep measurement at that temperature point.

3. The circuit temperature phase shift coefficient measuring device according to claim 2, characterized in that, The driving unit is a DC voltage source, the temperature regulating unit is a semiconductor refrigeration chip, and the temperature sensing unit is a digital thermometer.

4. The circuit temperature phase shift coefficient measuring device according to claim 1, characterized in that, The data processing module includes: The parameter receiving unit is used to control the phase frequency measurement module to repeatedly perform response measurements and receive multiple sets of initial complex transmission parameters at each temperature point. The data averaging unit is used to perform data averaging on the multiple sets of initial complex transmission parameters to obtain average complex transmission parameters, and to use the average complex transmission parameters as the transmission response data.

5. The circuit temperature phase shift coefficient measuring device according to claim 4, characterized in that, The data processing module further includes: The differential calculation unit is used to calculate the change in phase frequency response data between every two adjacent temperature points at each frequency point within the preset frequency band. The coefficient calculation unit is used to calculate the ratio of the change in phase frequency response data to the corresponding change in temperature, and to obtain the temperature phase shift coefficient.

6. The circuit temperature phase shift coefficient measuring device according to any one of claims 1 to 5, characterized in that, The excitation signal output port of the phase frequency measurement module is connected to the input port of the signal input module via an RF cable. The output port of the signal input module is connected to the input port of the circuit under test. The output port of the circuit under test is connected to the receiving measurement port of the phase frequency measurement module via an RF cable, forming the closed-loop measurement link.

7. The circuit temperature phase shift coefficient measuring device according to any one of claims 1 to 5, characterized in that, The device also includes a calibration module, which is connected to the signal input module and the phase frequency measurement module respectively; The calibration module is used to control the signal input module to switch to the standard calibration component before measurement, and to trigger the phase frequency measurement module to perform frequency sweep measurement on the calibration link to obtain system error data; The data processing module, connected to the calibration module, is also used to perform error compensation on the transmission response data of the circuit under test based on the system error data.

8. The circuit temperature phase shift coefficient measuring device according to any one of claims 1 to 5, characterized in that, The phase frequency measurement module supports multiple sweep modes, including wideband sweep frequency and focused sweep frequency; The data processing module is also used to adaptively determine the key frequency band that is sensitive to temperature changes based on the wideband sweep frequency results, and control the phase frequency measurement module to perform focused sweep frequency within the key frequency band, wherein the frequency interval of the focused sweep frequency is smaller than the frequency interval of the wideband sweep frequency.

9. A method for measuring the phase shift coefficient of circuit temperature, applied to the circuit temperature phase shift coefficient measuring device according to any one of claims 1 to 8, characterized in that, The method includes: The circuit under test is controlled to stabilize at multiple different temperature points in sequence, and temperature data corresponding to each temperature point is collected. After stabilizing at each temperature point, the measurement link is subjected to frequency sweep excitation signal within a preset frequency band, and the response of the measurement link is measured synchronously to obtain the transmission response data of the circuit under test at each temperature point. Phase extraction is performed on the transmission response data at each temperature point to obtain the corresponding phase frequency response data; Based on the phase frequency response data and the corresponding temperature data at each temperature point, the rate of change of the phase frequency response data relative to the temperature is calculated to obtain the temperature phase shift coefficient of the circuit under test.

10. The method for measuring the phase shift coefficient of circuit temperature according to claim 9, characterized in that, The method further includes: The temperature data is monitored in real time, and when the temperature data fluctuation is less than a preset threshold and remains stable for more than a preset duration, the temperature point is determined to be stable and the phase frequency measurement module is triggered to perform a frequency sweep measurement at that temperature point.

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