A low-cost analog multi-beam active phased-array TR assembly and device
By using eight 4-channel 8-beam RF chips and six passive 16-beam RF network modules, the design and manufacturing of analog multi-beam phased array TR components are simplified, solving the high cost problem and realizing a low-cost and simple-process 16-beam TR component.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 10TH RES INST OF CETC
- Filing Date
- 2026-02-09
- Publication Date
- 2026-06-23
AI Technical Summary
As the number of beams increases, the cost of analog multi-beam phased array (TR) components rises sharply, mainly due to the complexity of the phase controller and RF network, which leads to high design difficulty, large area, low yield, and many printed circuit board layers, making the manufacturing process difficult.
It employs eight 4-channel 8-beam RF chips and six passive 16-beam RF network modules, connected through multi-layer printed circuit boards and RF traces, which simplifies the design of RF chips and the number of printed circuit board network layers, thereby reducing costs.
A 16-beam TR component with low cost, easy design and simple process was achieved, which reduced the area of RF chip and the number of printed circuit board layers and improved the yield.
Smart Images
Figure CN122268415A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of active phased array antenna technology, and more specifically, to a low-cost analog multi-beam active phased array (TR) component and device. Background Technology
[0002] Active phased arrays (APA) are widely used in radar, electronic warfare, communications, reconnaissance, and early warning systems due to their non-inertial agility in scanning beams, excellent radio frequency performance, and good channel redundancy. Multi-beam phased arrays, in particular, can provide multiple independent scanning beams simultaneously. This characteristic offers numerous advantages in various fields; for example, in communications, it enables rapid and efficient networking, multi-target communication, and increased communication capacity, thus attracting widespread attention.
[0003] Multibeam phased arrays can be divided into two types: analog multibeam phased arrays and digital multibeam phased arrays. Digital multibeam phased arrays use algorithms in the digital domain to realize multiple beams, and they are not strictly limited in the number of beams, but they are currently facing problems such as high power consumption, narrow radio frequency bandwidth, and large size and weight. Analog multibeam phased arrays realize multiple beams through multibeam TR components.
[0004] Each channel of the multi-beam TR assembly contains a phase controller equivalent to the number of beams for independent beam scanning; this is implemented by the RF chip. Additionally, the TR assembly contains an RF network equivalent to the number of beams for RF signal combining; this is implemented by a multilayer printed circuit board.
[0005] Benefiting from the high-performance RF chips and RF networks of TR components, analog multi-beam phased arrays have advantages such as low power consumption, wide RF bandwidth, and light size and weight. However, as the number of beams increases (e.g., more than 16 beams), multi-beam TR components become very complex because the phase controllers and RF networks are equal to the number of beams, resulting in high costs. This is mainly reflected in: 1) The increase in phase controllers leads to greater design difficulty, larger area, and lower yield of multi-beam RF chips, resulting in a sharp increase in costs; 2) The increase in RF networks leads to more printed circuit board layers, more printed circuit board materials, and more difficult processing technology, resulting in a sharp increase in costs. Summary of the Invention
[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a low-cost analog multi-beam active phased array (TR) component and device, which improves the yield of RF chips, reduces the area of RF chips and the number of printed circuit board network layers, and reduces costs; it also has the advantages of low design difficulty and simple process implementation.
[0007] The objective of this invention is achieved through the following solution: A low-cost analog multi-beam active phased array (TR) component includes multiple beam radio frequency (RF) chips and multiple passive multi-beam RF network modules mounted on the surface of a multilayer printed circuit board; the multiple beam RF chips include eight 4-channel 8-beam RF chips; the multiple passive multi-beam RF network modules include six passive 16-beam RF network modules. It also includes 16 TR component antenna-end RF interfaces and 16 TR component beam-end RF interfaces; among them, 8 4-channel 8-beam RF chips are arranged in two rows and four columns, with 4 passive 16-beam RF network modules arranged between the upper and lower rows, and the remaining 2 passive 16-beam RF network modules are arranged in the center of the printed circuit board, with their assembly direction rotated 90° from the other passive 16-beam RF network modules. The 16 TR component antenna-end RF interfaces are arranged in four rows and four columns, and the 16 TR component beam-end RF interfaces are arranged around the 2 passive 16-beam RF network modules in the center of the printed circuit board. The TR component antenna port RF interface and beam port RF interface are located outside the 4-channel 8-beam RF chips and passive 16-beam RF network modules.
[0008] Furthermore, the 4-channel 8-beam RF chip includes 4 antenna-end RF interfaces and 8 beam-end RF interfaces; the 4 antenna-end RF interfaces are distributed on the top and bottom sides of the chip, with 2 on each side, and the 8 beam-end RF interfaces are distributed on the left and right sides of the chip, with 4 on each side.
[0009] Furthermore, the multilayer printed circuit board has multiple dielectric layers inside, and multiple radio frequency traces are arranged inside them.
[0010] Furthermore, the passive 16-beam RF network module includes 8 beam-end RF interfaces and 16 antenna-end RF interfaces; the 8 beam-end RF interfaces are distributed on the left and right sides of the chip, 4 on each side, and the 16 antenna-end RF interfaces are distributed on the top and bottom sides of the chip, 8 on each side. Each antenna-end RF interface is combined with the antenna-end RF interface in the direction directly opposite it through the inner layer RF traces of the passive 16-beam RF network module to a certain beam-end RF interface.
[0011] Furthermore, the multilayer printed circuit board uses RF traces 104 in a parallel wiring configuration to connect the four left-side RF interfaces of the 4-channel 8-beam RF chip to the four upper-left antenna interfaces of the passive 16-beam RF network module, the four right-side RF interfaces of the 4-channel 8-beam RF chip to the four upper-right antenna interfaces of the passive 16-beam RF network module, the four left-side RF interfaces of the 4-channel 8-beam RF chip to the four lower-left antenna interfaces of the passive 16-beam RF network module, and the four right-side RF interfaces of the 4-channel 8-beam RF chip to the four lower-right antenna interfaces of the passive 16-beam RF network module. The four beam-end RF interfaces are sequentially connected to the four antenna-end RF interfaces at the lower right of the passive 16-beam RF network module one. The beam RF ports of the four-channel eight-beam RF chip two and the four-channel eight-beam RF chip six are connected to the antenna-end RF ports of the passive 16-beam RF network module two. The beam RF ports of the four-channel eight-beam RF chip two and the four-channel eight-beam RF chip seven are connected to the antenna RF ports of the passive 16-beam RF network module three. The beam RF ports of the four-channel eight-beam RF chip four and the four-channel eight-beam RF chip eight are connected to the antenna RF ports of the passive 16-beam RF network module four.
[0012] Furthermore, the multilayer printed circuit board connects the four left-hand beam RF ports of the passive 16-beam RF network module one to the four upper-left antenna ports of the passive 16-beam RF network module five via RF trace two in parallel wiring. The four right-hand beam RF ports of the passive 16-beam RF network module one are connected to the four lower-left antenna ports of the passive 16-beam RF network module five in parallel wiring. The four left-hand beam RF ports of the passive 16-beam RF network module four are connected to the four lower-right antenna ports of the passive 16-beam RF network module five in parallel wiring. The four right-hand beam RF ports of the passive 16-beam RF network module four are connected to the four upper-right antenna ports of the passive 16-beam RF network module five in parallel wiring. The beam RF ports of the passive 16-beam RF network modules two and three are connected to the antenna ports of the passive 16-beam RF network module six.
[0013] Furthermore, the multilayer printed circuit board connects the beam-end RF interfaces of the passive 16-beam RF network module five and the passive 16-beam RF network module six to the beam-end RF interfaces of the eight TR components via RF trace one.
[0014] Furthermore, the multilayer printed circuit board connects the upper right antenna interfaces of the 4-channel 8-beam RF chip one and the 4-channel 8-beam RF chip two to the antenna interface of the TR component in the first row and second column via RF trace one; connects the upper left and lower left antenna interfaces of the 4-channel 8-beam RF chip one and the 4-channel 8-beam RF chip two to the antenna interfaces of the TR component in the first row and first column and the 2nd row and first column via RF trace two; connects the lower right antenna interfaces of the 4-channel 8-beam RF chip one and the 4-channel 8-beam RF chip two to the antenna interface of the TR component in the second row and second column via RF trace three; and connects the 4-channel 8-beam RF chip three and four, the 4-channel 8-beam RF chip five and six, and the 4-channel 8-beam RF chip seven and eight to different TR component antenna interfaces in pairs.
[0015] Furthermore, the passive 16-beam radio frequency network module is implemented via chip form or ceramic integration process.
[0016] An electronic device comprising a low-cost analog multibeam active phased array (TR) component as described in any of the preceding claims.
[0017] The beneficial effects of this invention include: (1) The present invention has the advantage of low cost. In a preferred embodiment, the present invention uses eight 4-channel 8-beam RF chips to complete the 16-beam function of the TR component, which reduces the complexity of a single RF chip and reduces the chip area; at the same time, the 16-beam RF signal combining is realized by using a multilayer printed circuit board with 3 layers of RF network (conventionally equivalent to the number of beams, i.e., 16 layers of RF network are required), which greatly reduces the number of layers of the multilayer printed circuit board. Therefore, it has the beneficial effect of low cost.
[0018] (2) The present invention has the advantage of low design difficulty. In a preferred embodiment, the present invention uses eight 4-channel 8-beam RF chips to complete the 16-beam function of the TR component, which reduces the design difficulty of a single RF chip; at the same time, the multilayer printed circuit board has simple wiring, thus having the effective effect of low design difficulty.
[0019] (3) The present invention has the advantage of simple process implementation. In the preferred embodiment, all chips of the present invention can be mounted on a multilayer printed circuit board through a simple mounting process to realize the function of a 16-channel 16-beam TR component. Therefore, it has the beneficial effect of simple process implementation. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a top view of a low-cost analog 16-channel 16-beam active phased array (TR) component architecture in an embodiment of the present invention. Figure 2 This is a cross-sectional view of a low-cost analog 16-channel 16-beam active phased array (TR) component architecture according to an embodiment of the present invention. Figure 3 This is a schematic diagram of a low-cost analog 16-channel 16-beam active phased array (TR) component architecture, including a 4-channel 8-beam RF chip and a 2-interface, according to an embodiment of the present invention. Figure 4 This is a top view and internal RF wiring diagram of a low-cost analog 16-channel 16-beam active phased array TR component architecture and a low-cost passive 16-beam RF network chip 3 in an embodiment of the present invention. In the diagram, 1 represents a multilayer printed circuit board (PCB); 101 represents the first dielectric layer of the PCB; 102 represents the second dielectric layer of the PCB; 103 represents the third dielectric layer of the PCB; 104 represents the first inner-layer RF trace of the PCB; 105 represents the second inner-layer RF trace of the PCB; 106 represents the third inner-layer RF trace of the PCB; 107 represents the RF interface at the antenna end of the TR module; 108 represents the RF interface at the beam end of the TR module; 2 represents a 4-channel 8-beam RF chip; 201-208 represent the 4-channel RF chip in the first row and first column, respectively. 8-beam RF chip 1, 4-channel 8-beam RF chip 2 (row 1, column 2), 4-channel 8-beam RF chip 3 (row 1, column 3), 4-channel 8-beam RF chip 4 (row 1, column 4), 4-channel 8-beam RF chip 5 (row 2, column 2), 4-channel 8-beam RF chip 6 (row 2, column 3), 4-channel 8-beam RF chip 7 (row 2, column 4), 4-channel 8-beam RF chip 8 (row 2, column 4); 209 is the beam-end RF interface of the 4-channel 8-beam RF chip; 210 is the 4-channel 8-beam... RF chip antenna interface; 3 is a passive 16-beam RF network module; 301~304 are respectively the passive 16-beam RF network module one (combined with 4-channel 8-beam RF chips 201 and 205), the passive 16-beam RF network module two (combined with 4-channel 8-beam RF chips 202 and 206), the passive 16-beam RF network module three (combined with 4-channel 8-beam RF chips 203 and 207), and the passive 16-beam RF network module three (combined with 4-channel 8-beam RF chips 204 and 208). Network module four; 305 is the passive 16-beam RF network module; 301 and 304 are combined into a passive 16-beam RF network module five; 306 is the passive 16-beam RF network module; 302 and 303 are combined into a passive 16-beam RF network module six; 307 is the antenna-end RF interface of the passive 16-beam RF network module; 308 is the beam-end RF interface of the passive 16-beam RF network module; 309~312 are the internal RF traces one to four of the passive 16-beam RF network module respectively. Detailed Implementation
[0022] All features disclosed in all embodiments of this specification, or steps in all methods or processes implied in the disclosure, may be combined and / or extended or replaced in any way, except for mutually exclusive features and / or steps.
[0023] The specific implementation process of this invention is as follows: like Figures 1-4As shown, in a preferred embodiment, a low-cost analog 16-channel 16-beam active phased array (TR) component is provided, comprising: eight 4-channel 8-beam RF chips 2 mounted on the surface of a multilayer printed circuit board 1, six low-cost passive 16-beam RF network modules 3, 16 TR component antenna-end RF interfaces 107, and 16 TR component beam-end RF interfaces 108; wherein, the eight 4-channel 8-beam RF chips are arranged in two rows and four columns, with four low-cost passive 16-beam RF network modules arranged between the upper and lower rows, and the remaining two... The low-cost passive 16-beam RF network module is located at the center of the printed circuit board. Its assembly direction is rotated 90° from the other low-cost passive 16-beam RF network modules. The RF interfaces of the antenna end of the 16 TR components are arranged in four rows and four columns. The RF interfaces of the beam end of the 16 TR components are arranged around the two low-cost passive 16-beam RF network modules at the center of the printed circuit board. The RF interfaces of the antenna port and the RF interfaces of the beam port of the TR components are located outside the 4-channel 8-beam RF chip 2 and the low-cost passive 16-beam RF network module 3.
[0024] The 4-channel 8-beam RF chip 2 contains 4 antenna-end RF interfaces 210 and 8 beam-end RF interfaces 209. The 4 antenna-end RF interfaces 210 are distributed on the top and bottom sides of the chip, with 2 on each side, and the 8 beam-end RF interfaces 209 are distributed on the left and right sides of the chip, with 4 on each side.
[0025] The low-cost passive 16-beam RF network module 3 contains 8 beam-end RF interfaces 308 and 16 antenna-end RF interfaces 307. The 8 beam-end RF interfaces 308 are distributed on the left and right sides of the chip, with 4 on each side. The 16 antenna-end RF interfaces 307 are distributed on the top and bottom sides of the chip, with 8 on each side. Each antenna-end RF interface is combined with the antenna-end RF interface in the direction directly opposite it through the inner layer RF traces 309~312 of the low-cost passive 16-beam RF network module 3 to a certain beam-end RF interface, for a total of 4 layers of RF traces.
[0026] The multilayer printed circuit board 1 has three dielectric layers 101-103 inside, and three radio frequency traces 104-106 inside.
[0027] The multilayer printed circuit board 1, via RF trace 104 in a parallel wiring configuration, connects the four left-side RF interfaces of the 4-channel 8-beam RF chip 201 to the four upper-left antenna RF interfaces of the low-cost passive 16-beam RF network module 301 in sequence; connects the four right-side RF interfaces of the 4-channel 8-beam RF chip 201 to the four upper-right antenna RF interfaces of the low-cost passive 16-beam RF network module 301 in sequence; and connects the four left-side RF interfaces of the 4-channel 8-beam RF chip 205 to the four lower-left antenna RF interfaces of the low-cost passive 16-beam RF network module 301 in sequence. The four beam-end RF interfaces on the right side of chip 205 are sequentially connected to the four antenna-end RF interfaces on the lower right side of the low-cost passive 16-beam RF network module 301. In the same manner, the beam RF ports of the four-channel eight-beam RF chips 202 and 206 are connected to the antenna-end RF ports of the low-cost passive 16-beam RF network module 302, the beam RF ports of the four-channel eight-beam RF chips 203 and 207 are connected to the antenna-end RF ports of the low-cost passive 16-beam RF network module 303, and the beam RF ports of the four-channel eight-beam RF chips 204 and 208 are connected to the antenna-end RF ports of the low-cost passive 16-beam RF network module 304.
[0028] The multilayer printed circuit board 1 connects the four left-side beam RF ports of the low-cost passive 16-beam RF network module 301 to the four upper-left antenna ports of the low-cost passive 16-beam RF network module 305 in parallel wiring via RF trace 2 105. The four right-side beam RF ports of the low-cost passive 16-beam RF network module 301 are connected to the four lower-left antenna RF ports of the low-cost passive 16-beam RF network module 305. The left side of the low-cost passive 16-beam RF network module 304... The four beam RF ports are sequentially connected to the four antenna end RF interfaces at the lower right of the low-cost passive 16-beam RF network module 305. The four beam RF ports on the right side of the low-cost passive 16-beam RF network module 304 are sequentially connected to the four antenna end RF ports at the upper right of the low-cost passive 16-beam RF network module 305. In the same manner, the beam RF ports of the low-cost passive 16-beam RF network modules 302 and 303 are connected to the antenna end RF ports of the low-cost passive 16-beam RF network module 306.
[0029] The multilayer printed circuit board 1 connects the beam-end RF interfaces of the low-cost passive 16-beam RF network modules 305 and 306 to the beam-end RF interfaces of the eight TR components via RF trace 104.
[0030] The multilayer printed circuit board 1 connects the upper right antenna RF interfaces of the 4-channel 8-beam RF chips 201 and 202 to the antenna RF interface of the TR component in the first row and second column via RF trace 104; connects the upper left and lower left antenna RF interfaces of the 4-channel 8-beam RF chips 201 and 202 to the antenna RF interfaces of the TR component in the first row and first column and the second row and first column via RF trace 105; connects the lower right antenna RF interfaces of the 4-channel 8-beam RF chips 201 and 202 to the antenna RF interface of the TR component in the second row and second column via RF trace 106; and connects the lower right antenna RF interfaces of the 4-channel 8-beam RF chips 203 and 204, 205 and 206, and 207 and 208 in pairs to different TR component antenna RF interfaces in the same manner.
[0031] It should be noted that, in other embodiments, the ideas proposed in this invention are not limited to simulating a 16-channel, 16-beam active phased array TR component, but are also applicable to simulating multi-beam TR components with other channels and beam counts.
[0032] It should be noted that, in other embodiments, the low-cost passive 16-beam RF network module proposed in this invention can be in chip form or in other low-cost forms, such as LTCC, HTCC, etc.
[0033] The above description is merely the technical principles and preferred embodiments used in this invention. Those skilled in the art will understand that this invention is not limited to the specific embodiments described herein. Various obvious changes, adjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of this invention. Therefore, although the invention has been described in detail through the above embodiments, this invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the principles and concept of this invention, and the scope of this invention is determined by the scope of the appended claims.
Claims
1. A low-cost analog multi-beam active phased array (TR) component, characterized in that, It includes multiple beam radio frequency chips and multiple passive multi-beam radio frequency network modules mounted on the surface of a multilayer printed circuit board; the multiple beam radio frequency chips include eight 4-channel 8-beam radio frequency chips (2); the multiple passive multi-beam radio frequency network modules include six passive 16-beam radio frequency network modules (3). It also includes 16 TR component antenna end RF interfaces (107) and 16 TR component beam end RF interfaces (108); among them, 8 4-channel 8-beam RF chips are arranged in two rows and four columns, with 4 passive 16-beam RF network modules arranged between the upper and lower rows, and the remaining 2 passive 16-beam RF network modules are arranged in the center of the printed circuit board, with their assembly direction rotated 90° from the other passive 16-beam RF network modules. The 16 TR component antenna end RF interfaces are arranged in four rows and four columns, and the 16 TR component beam end RF interfaces are arranged around the 2 passive 16-beam RF network modules in the center of the printed circuit board. The TR component antenna port RF interface and beam port RF interface are located outside the 4-channel 8-beam RF chip (2) and passive 16-beam RF network module (3).
2. The low-cost analog multi-beam active phased array (TR) component according to claim 1, characterized in that, The 4-channel 8-beam RF chip (2) includes 4 antenna-end RF interfaces (210) and 8 beam-end RF interfaces (209); the 4 antenna-end RF interfaces (210) are distributed on the top and bottom sides of the chip, with 2 on each side, and the 8 beam-end RF interfaces (209) are distributed on the left and right sides of the chip, with 4 on each side.
3. The low-cost analog multi-beam active phased array (TR) component according to claim 1, characterized in that, The multilayer printed circuit board (1) has multiple dielectric layers inside, and multiple radio frequency traces are arranged inside.
4. The low-cost analog multi-beam active phased array (TR) component according to claim 3, characterized in that, The passive 16-beam RF network module (3) includes 8 beam-end RF interfaces (308) and 16 antenna-end RF interfaces (307). The 8 beam-end RF interfaces (308) are distributed on the left and right sides of the chip, with 4 on each side. The 16 antenna-end RF interfaces (307) are distributed on the top and bottom sides of the chip, with 8 on each side. Each antenna-end RF interface is combined with the antenna-end RF interface in the direction directly opposite to it through the inner layer RF trace of the passive 16-beam RF network module (3) to a certain beam-end RF interface.
5. The low-cost analog multi-beam active phased array (TR) component according to claim 3, characterized in that, The multilayer printed circuit board (1) uses RF traces (104) to connect the four left-side RF interfaces of the 4-channel 8-beam RF chip (201) to the four upper-left antenna interfaces of the passive 16-beam RF network module (301) in parallel wiring. The four right-side RF interfaces of the 4-channel 8-beam RF chip (201) are connected to the four upper-right antenna interfaces of the passive 16-beam RF network module (301). The four left-side RF interfaces of the 4-channel 8-beam RF chip (205) are connected to the four lower-left antenna interfaces of the passive 16-beam RF network module (301). The four right-side RF interfaces of the 4-channel 8-beam RF chip (205) are connected to the four lower-left antenna interfaces of the passive 16-beam RF network module (301). The interfaces are connected sequentially to the four antenna-end RF interfaces at the lower right of the passive 16-beam RF network module one (301). The beam RF ports of the four-channel eight-beam RF chip two (202) and the four-channel eight-beam RF chip six (206) are connected to the antenna-end RF ports of the passive 16-beam RF network module two (302). The beam RF ports of the four-channel eight-beam RF chip three (203) and the four-channel eight-beam RF chip seven (207) are connected to the antenna RF ports of the passive 16-beam RF network module three (303). The beam RF ports of the four-channel eight-beam RF chip four (204) and the four-channel eight-beam RF chip eight (208) are connected to the antenna RF ports of the passive 16-beam RF network module four (304).
6. The low-cost analog multi-beam active phased array (TR) component according to claim 3, characterized in that, The multilayer printed circuit board (1) connects the four left-side beam RF ports of the passive 16-beam RF network module one (301) to the four upper-left antenna ports of the passive 16-beam RF network module five (305) in parallel wiring via RF trace two (105). The four right-side beam RF ports of the passive 16-beam RF network module one (301) are connected to the four lower-left antenna ports of the passive 16-beam RF network module five (305). The four left-side beam RF ports of the passive 16-beam RF network module four (304) are connected to the four lower-left antenna ports of the passive 16-beam RF network module four (304). The beam RF ports are sequentially connected to the four antenna end RF interfaces at the lower right of the passive 16-beam RF network module five (305). The four beam RF ports on the right side of the passive 16-beam RF network module four (304) are sequentially connected to the four antenna end RF ports at the upper right of the passive 16-beam RF network module five (305). The beam RF ports of the passive 16-beam RF network module two (302) and the passive 16-beam RF network module three (303) are connected to the antenna end RF ports of the passive 16-beam RF network module six (306).
7. The low-cost analog multi-beam active phased array (TR) component according to claim 3, characterized in that, The multilayer printed circuit board (1) connects the beam-end RF interfaces of the passive 16-beam RF network module five (305) and the passive 16-beam RF network module six (306) to the beam-end RF interfaces of the eight TR components through RF trace one (104).
8. The low-cost analog multi-beam active phased array (TR) component according to claim 1, characterized in that, The multilayer printed circuit board (1) connects the upper right antenna end RF interfaces of the 4-channel 8-beam RF chip one (201) and the 4-channel 8-beam RF chip two (202) to the antenna end RF interface of the TR component in the first row and second column via RF trace one (104); connects the upper left and lower left antenna end RF interfaces of the 4-channel 8-beam RF chip one (201) and the 4-channel 8-beam RF chip two (202) to the antenna end RF interfaces of the TR component in the first row and first column and the second row and first column respectively via RF trace two (105); and connects via RF trace three (106) Connect the lower right antenna end RF interfaces of the 4-channel 8-beam RF chip one (201) and the 4-channel 8-beam RF chip two (202) to the antenna end RF interface of the TR component in the second row and second column. Connect the 4-channel 8-beam RF chip three (203) and the 4-channel 8-beam RF chip four (204), the 4-channel 8-beam RF chip five (205) and the 4-channel 8-beam RF chip six (206), and the 4-channel 8-beam RF chip seven (207) and the 4-channel 8-beam RF chip eight (208) to different TR component antenna end RF interfaces in pairs.
9. The low-cost analog multi-beam active phased array (TR) component according to claim 1, characterized in that, The passive 16-beam radio frequency network module is implemented using chip-based or ceramic integration technology.
10. An electronic device, characterized in that, Includes the low-cost analog multibeam active phased array (TR) component as described in any one of claims 1 to 9.