An ear muff and method of assembly thereof

Abstract

The present application relates to earphone technical field, disclose a kind of earmuff and its assembly method, including headgear assembly and respectively being arranged in the first earmuff mechanism and the second earmuff mechanism of headgear assembly two ends;The first earmuff mechanism includes first shell, and the second earmuff mechanism includes second shell, by setting tuning slot on first shell and / or second shell, and arranging acoustic adjusting assembly in tuning slot, acoustic adjusting assembly is distributed at preset angle with loudspeaker assembly, and is communicated with the adjusting cavity formed by loudspeaker assembly and shell, to build a non-linear acoustic transmission path in the inside of earmuff, sound wave experiences path extension and direction change before entering tuning structure, to reduce the concentration degree of sound pressure in local area, so that the sound pressure distribution in the inside of earmuff is uniform.In addition, realize multifunctional integrated layout in limited earmuff space, realize the effective organization of acoustic path, facilitate overall miniaturization.

Description

Technical Field

[0001] This invention relates to the field of headphone technology, and more specifically, to an earcup and its assembly method. Background Technology

[0002] With the widespread application of headphones in consumer electronics, communication devices, and smart wearables, the earcups not only fulfill the basic functions of fit and acoustic output, but also directly affect the headphones' low-frequency performance, soundstage stability, sealing, and call pickup. Especially for earcups that integrate speakers, pickup devices, and various acoustic adjustment structures, their internal space is usually quite compact. The layout of the outer shell, speaker components, and related acoustic structures directly impacts the airflow organization, acoustic impedance distribution, and sound pressure transmission path within the earcup's acoustic cavity. Therefore, how to rationally design the internal acoustic path of the earcup within the limited space has become a crucial technical aspect of headphone earcup structural design.

[0003] Existing headphone earcups typically have vents or mesh coverings directly on the earcup shell to connect the internal cavity with the outside, allowing sound waves to travel directly to the tuning position via a shorter path for pressure relief and tuning. However, due to the simple spatial relationship between the tuning structure and the speaker assembly, the sound waves inside the earcup travel a short and direct path within the tuning cavity. This can lead to concentrated sound pressure coupling in localized areas inside the earcup, making the tuning structure more sensitive to the assembly position, cavity size, and sealing condition. Consequently, this can result in significant low-frequency fluctuations or unstable resonance control in specific frequency bands.

[0004] Therefore, there is a need to provide an earmuff and its assembly method to solve the problem that existing earmuffs are prone to forming concentrated sound pressure coupling in local areas. Summary of the Invention

[0005] The main objective of this invention is to provide an earmuff and its assembly method, which aims to solve the technical problems mentioned in the background section.

[0006] The present invention adopts the following technical solution: An earmuff and its assembly method, comprising a headband assembly and a first earmuff mechanism and a second earmuff mechanism respectively disposed at both ends of the headband assembly; The first earmuff mechanism includes a first housing, and the second earmuff mechanism includes a second housing. Both the first housing and the second housing are covered with a protective lip on the side that is close to each other. Both the first housing and the second housing are provided with a speaker assembly. An adjustment cavity is formed between each speaker assembly and the corresponding housing. The first housing and / or the second housing are provided with a tuning groove, and an acoustic adjustment component is provided in the tuning groove. The acoustic adjustment component is distributed at a preset angle with the speaker assembly, and the acoustic adjustment component is connected to the adjustment cavity for adjusting the acoustic performance inside the earcup.

[0007] Furthermore, the acoustic adjustment assembly includes a tuning frame and a tuning sponge. The tuning frame covers the opening of the tuning slot and is connected to the first housing and / or the second housing. The tuning sponge is disposed on the side of the tuning frame facing the adjustment cavity. The tuning slot has an adhesive layer on its walls and / or bottom, and the tuning frame is fixedly connected to the tuning slot through the adhesive layer, so that the tuning frame forms a sealed connection structure along the circumference of the tuning slot.

[0008] Furthermore, the tuning groove is recessed toward the adjustment cavity along the wall thickness direction of the first housing and / or the second housing, and at least one tuning hole is provided at the bottom of the tuning groove. The tuning hole communicates with the adjustment cavity, and the tuning hole is distributed on the side of the speaker assembly away from the lip protector.

[0009] Furthermore, the speaker assembly includes a horn and a speaker bracket, the horn facing the side of the lip protector, the speaker bracket covering the horn, and the speaker bracket being fixedly connected to the first housing and / or the second housing, the side of the speaker bracket facing the adjustment cavity being filled with inner sponge; The speaker bracket extends from the side away from the lip protector and has a snap-fit ​​portion that is fixedly connected to the outer periphery of the speaker. Along the outer periphery of the speaker, an annular sealing layer is applied between the snap-fit ​​portion and the outer periphery of the speaker.

[0010] Furthermore, the first housing is also provided with a sound pickup assembly, which includes a microphone board and a microphone disposed on the microphone board. The microphone board is electrically connected to the speaker assembly. The first housing is provided with a mounting groove and a sound pickup hole. The sound pickup hole and the mounting groove are distributed at an angle. The microphone board is installed in the mounting groove. The microphone is embedded in the sound pickup hole, and the sound pickup end of the microphone faces the outside of the first housing. A hot melt adhesive layer is filled between the microphone and the first outer shell, and the hot melt adhesive layer is connected to a portion of the microphone board.

[0011] Furthermore, the headband assembly includes a headband body, a headband wire passing through the headband body, and connecting wire holes respectively opened on the first outer shell and the second outer shell. A wire protector is installed in the connecting wire hole, and an adhesive layer is filled between the periphery of the wire protector and the connecting wire hole. The headband wire passes through the wire protector and extends into the interior of the first outer shell and the second outer shell, and the headband wire is electrically connected to the microphone board.

[0012] Furthermore, a circuit board is fixedly disposed in the second housing. The circuit board is distributed on the side of the speaker assembly away from the lip protector. The circuit board is electrically connected to the headband wire. A knob is disposed on one side of the circuit board. The knob penetrates the side wall of the second housing. The first housing also contains a battery, which is distributed on one side of the microphone board. The microphone board also contains a charging interface and a light guide column, which both pass through the first housing and extend to the outside of the first housing. An outer sponge covers the space between the speaker assembly and the lip protector. The lip protector is provided with a sound hole corresponding to the speaker assembly, and the sound hole is connected to the outer sponge.

[0013] A method for assembling earmuffs as described in any of the preceding claims, comprising: S1. Take the first outer shell and the second outer shell respectively, and install the acoustic adjustment component at the tuning slot of the first outer shell and the second outer shell; S2. Seal and fix the speaker assembly in the first housing and the second housing respectively to form an adjustment cavity, and connect the acoustic adjustment assembly to the adjustment cavity; S3. Assemble a microphone assembly on the first housing, such that the microphone in the microphone assembly is embedded in the microphone hole of the first housing, and the microphone tip of the microphone faces the outside of the first housing. S4. Assemble the headband assembly, so that the headband wire is threaded through the headband assembly, and thread both ends of the headband wire into the connecting wire holes on the first and second outer shells respectively. S5. Install electrical connection components in the first and second housings respectively, so that the headband cable, pickup assembly and speaker assembly are electrically connected to the electrical connection components respectively; S6. Install lip protectors and outer sponges on the first and second outer shells respectively, and assemble the first and second outer shells at both ends of the headband assembly.

[0014] Further, in step S1, the step of installing the acoustic adjustment components includes: Cover the tuning frame at the opening of the tuning slot and place tuning foam on one side of the tuning frame; apply an adhesive layer to the groove wall and / or bottom of the tuning slot to fix the periphery of the tuning frame to the tuning slot. Step S2 includes: Test the speaker by connecting the positive and negative terminals of the speaker to the wires respectively; install the speaker inside the first housing and / or the second housing, and cover the speaker with the speaker bracket, which is fixedly connected to the first housing and / or the second housing; The speaker bracket is filled with inner sponge on the side facing the adjustment cavity, and the snap-fit ​​part on the side of the speaker bracket away from the lip is fixedly connected to the outer periphery of the speaker, with an annular sealing layer between the snap-fit ​​part and the outer periphery of the speaker.

[0015] Further, step S3 includes: installing the microphone board in the mounting groove of the first housing, so that the microphone is embedded in the pickup hole, filling the space between the microphone and the first housing with a hot melt adhesive layer, and overlapping the hot melt adhesive layer to a portion of the microphone board surface; Step S4 includes: pre-installing the cable protector into the connection hole of the first housing and the second housing, passing the headband cable through the corresponding cable protector and extending it into the first housing and the second housing respectively, and filling the gap between the cable protector and the connection hole with an adhesive layer. After passing the headband cable through the cable protector, a headband cable with a length of 95mm to 100mm is left inside the first housing and the second housing. Step S5 includes: installing a circuit board inside the second housing, installing a battery inside the first housing, and passing the charging interface and light guide on the microphone board through the first housing and extending to the outside of the first housing, wherein the circuit board is located on the side of the speaker assembly away from the lip protector and is electrically connected to the headband wire, a knob that extends through the side wall of the second housing is installed on one side of the circuit board, and the battery is located on one side of the microphone board. Step S6 includes: covering the speaker assembly and the protective lip with an outer sponge, then connecting the speaker hole on the protective lip to the outer sponge, installing the base plate with the protective lip onto the first and second housings respectively, and performing overall performance testing and appearance inspection.

[0016] Beneficial effects: In this invention, a tuning groove is provided on the first and / or second housing, and an acoustic adjustment component is arranged within the tuning groove. The acoustic adjustment component is distributed at a preset angle to the speaker assembly and communicates with the adjustment cavity formed by the speaker assembly and the housing, thereby constructing a non-linear acoustic conduction path inside the earcup. The sound waves emitted by the speaker assembly propagate within the adjustment cavity and are adjusted by the tuning groove and acoustic adjustment component, which are distributed at an angle to it. This causes the sound waves to undergo path extension and direction change before entering the tuning structure, thereby reducing the concentration of sound pressure in local areas and making the sound pressure distribution inside the earcup more uniform. Furthermore, the speaker assembly and the housing together form a relatively independent adjustment cavity, while the tuning groove and acoustic adjustment component are integrated on the housing. This allows the acoustic adjustment structure and the housing structure to be integrated into a single unit, achieving a multi-functional integrated layout within the limited earcup space. This optimizes internal space utilization while ensuring acoustic performance, effectively organizes the acoustic path, facilitates overall miniaturization, and improves structural integration and assembly stability. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an earmuff according to the present invention; Figure 2 This is a cross-sectional structural diagram of an earmuff according to the present invention; Figure 3 This is a schematic diagram of the structure of the first earmuff mechanism of the present invention; Figure 4 This is a partial structural schematic diagram of the first earmuff mechanism of the present invention; Figure 5 This is a schematic diagram of the structure of the first outer casing of the present invention; Figure 6 This is a partial structural schematic diagram of the second earmuff mechanism of the present invention; in: 1. Headband assembly; 101. Headband body; 102. Headband cable; 103. Cable sleeve; 2. First earcup mechanism; 21. First outer shell; 22. Pickup assembly; 221. Microphone board; 222. Talk microphone; 23. Battery; 24. Charging interface; 25. Light guide column; 3. Second earcup mechanism; 31. Second outer shell; 32. Circuit board; 33. Knob; 4. Lip protector; 41. Speaker hole; 5. Speaker assembly; 51. Horn; 52. Speaker bracket; 521. Snap-fit ​​part; 6. Adjustment cavity; 7. Tuning groove; 71. Tuning hole; 8. Acoustic adjustment assembly; 81. Tuning frame; 82. Tuning foam; 9. Outer foam.

[0018] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0020] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] Reference Figures 1 to 6 The present invention proposes an earmuff and its assembly method, including a headband assembly 1 and a first earmuff mechanism 2 and a second earmuff mechanism 3 respectively disposed at both ends of the headband assembly 1; The first earmuff mechanism 2 includes a first outer shell 21, and the second earmuff mechanism 3 includes a second outer shell 31. The first outer shell 21 and the second outer shell 31 are both covered with a protective lip 4 on the side that is close to each other. The first outer shell 21 and the second outer shell 31 are both provided with a speaker assembly 5. An adjustment cavity 6 is formed between each speaker assembly 5 and the corresponding outer shell. The first housing 21 and / or the second housing 31 are provided with a tuning groove 7. An acoustic adjustment component 8 is provided in the tuning groove 7. The acoustic adjustment component 8 is distributed at a preset angle with the speaker assembly 5, and the acoustic adjustment component 8 is connected to the adjustment cavity 6 for adjusting the adjustment cavity 6 to adjust the acoustic performance inside the earmuff.

[0024] In the above embodiment, the device includes a headband assembly 1 and a first earmuff mechanism 2 and a second earmuff mechanism 3 respectively disposed at both ends of the headband assembly 1. The first earmuff mechanism 2 and the second earmuff mechanism 3 are structurally basically corresponding. The first outer shell 21 and the second outer shell 31 are hollow shell structures, and a protective lip 4 for fitting the human ear is respectively provided on their adjacent sides. The protective lip 4 has a sound output area corresponding to the speaker assembly 5. The speaker assembly 5 is installed in a preset mounting position inside the shell, and its installation position is defined by its connection with the shell. An adjustment cavity 6 is formed between the speaker assembly 5 and the shell. The adjustment cavity 6 is a relatively closed or semi-closed structure used to carry the propagation of sound waves inside the earmuff. The first outer shell 21 and / or the second outer shell 31 are provided with a tuning groove 7 formed by recesses along the shell wall thickness direction. The tuning groove 7 is preferably a structure with a groove wall and a groove bottom. The groove bottom is connected to the adjustment cavity 6 through a connecting hole or gap. An acoustic adjustment component 8 is provided inside the tuning slot 7. The acoustic adjustment component 8 includes a tuning frame 81 covering the opening of the tuning slot 7 and a tuning sponge 82 located inside the tuning frame 81. The periphery of the tuning frame 81 is connected to the slot wall of the tuning slot 7 to form a stable installation interface and limit the opening of the tuning slot 7. The tuning sponge 82 is located between the tuning frame 81 and the adjustment cavity 6 and is used to dampen and adjust the airflow and sound waves passing through the tuning slot 7.

[0025] Based on the above structure, the tuning slot 7 and the speaker assembly 5 are spatially distributed at a preset angle, so that the acoustic adjustment component and the speaker assembly are distributed at a preset angle. This preset angle can be designed according to the internal spatial layout of the housing. In this embodiment, the preset angle is preferably set to 45° to 60°. Within this range, a relatively obvious non-linear acoustic path can be formed without making the position of the tuning slot too extreme, which is convenient for arrangement within the limited thickness of the earcup housing. The above angle ensures that the tuning slot 7 does not coincide axially with the sound output direction of the speaker, but is set to the side or back of the speaker assembly 5. When the speaker assembly 5 is working, the sound waves it generates first spread and propagate in the adjustment cavity 6, and under the action of the cavity boundary and internal space, the path is extended and the direction is changed. Subsequently, part of the sound waves enter the acoustic adjustment component 8 area through the tuning slot 7 distributed at an angle to it. When passing through the tuning sponge 82, it is damped, thereby forming an acoustic conduction path with delay and dispersion characteristics. Due to the connection between the tuning slot 7 and the adjustment cavity 6, and the arrangement of the acoustic adjustment component 8, sound waves no longer escape directly through a single straight channel inside the earcup. Instead, they propagate through multiple paths within the cavity before entering the tuning structure, thus improving the sound pressure distribution within the adjustment cavity 6. Simultaneously, the tuning slot 7 and the acoustic adjustment component 8 are directly integrated into the outer shell structure, allowing the shell to function as both structural support and acoustic adjustment. This reduces the need for independent acoustic components, enabling structural integration within a limited space and providing a structural basis for miniaturized earcup design.

[0026] In one embodiment, the acoustic adjustment assembly 8 includes a tuning frame 81 and a tuning sponge 82. The tuning frame 81 covers the opening of the tuning slot 7 and is connected to the first housing 21 and / or the second housing 31. The tuning sponge 82 is disposed on the side of the tuning frame 81 facing the adjustment cavity 6. The tuning groove 7 has an adhesive layer on its walls and / or bottom. The tuning frame 81 is fixedly connected to the tuning groove 7 via the adhesive layer, so that the tuning frame 81 forms a sealed connection structure along the circumference of the tuning groove 7.

[0027] In the above embodiments, the acoustic adjustment assembly 8 includes a tuning frame 81 and a tuning sponge 82. The tuning frame 81 is disposed at the opening of the tuning groove 7 and surrounds the opening, so that the tuning groove 7 forms a boundary structure on the surface of the outer shell. The tuning frame 81 is preferably annular or a sealing structure that matches the shape of the tuning groove 7. Its periphery is attached to the groove wall of the tuning groove 7 and is fixedly connected by an adhesive layer disposed on the groove wall and / or the groove bottom. The adhesive layer is continuously distributed along the circumference of the tuning groove 7, so that a sealed connection interface is formed between the tuning frame 81 and the outer shell, thereby preventing airflow from bypassing and leaking between the tuning frame 81 and the outer shell. The tuning sponge 82 is disposed on the inner side of the tuning frame 81, that is, between the tuning frame 81 and the adjustment cavity 6. It can be embedded inside the tuning groove 7 or form a supporting fit with the tuning frame 81, so that it is stably positioned in space on the sound wave conduction path. The tuning frame 81 not only fixes the tuning sponge 82, but also limits the opening area of ​​the tuning slot 7, controlling the airflow path through the tuning slot 7. The tuning sponge 82 acts as an acoustic damping element, attenuating and filtering the sound waves entering the tuning slot 7. Through the circumferential sealing connection of the tuning frame 81, sound waves can only be transmitted through the area where the tuning sponge 82 is located, thereby improving the stability of acoustic adjustment.

[0028] In one example, the tuning groove 7 is recessed toward the adjustment cavity 6 along the wall thickness direction of the first housing 21 and / or the second housing 31, and at least one tuning hole 71 is provided at the bottom of the tuning groove 7. The tuning hole 71 communicates with the adjustment cavity 6, and the tuning hole 71 is distributed on the side of the speaker assembly 5 away from the lip protector 4.

[0029] In the above embodiment, the tuning groove 7 is recessed along the wall thickness direction of the first outer shell 21 and / or the second outer shell 31 towards the adjustment cavity 6, and its structure can be a blind groove or a semi-through groove. At least one tuning hole 71 is provided at the bottom of the tuning groove 7. The tuning hole 71 serves as a channel connecting the adjustment cavity 6 and the tuning groove 7. Its position is located on the side of the speaker assembly 5 away from the lip 4, that is, close to the back area of ​​the speaker, so that the tuning groove 7 is not directly located on the path opposite to the speaker's sound output direction, but forms a spatial offset relationship with the speaker.

[0030] When the speaker assembly 5 is operating, the sound waves first propagate within the adjustment cavity 6 and diffuse outwards. Some of the sound waves are reflected inside the cavity and then enter the tuning slot 7 area via the tuning hole 71. Because the tuning hole 71 is located on the back side of the speaker, the sound waves must travel a certain path within the adjustment cavity 6 before entering the tuning slot 7, thus preventing the sound waves from leaking out directly through the shortest path. The tuning slot 7 itself acts as a transition structure; its internal space buffers the airflow, making the sound waves entering the acoustic adjustment assembly 8 more uniform.

[0031] In one example, the speaker assembly 5 includes a horn 51 and a speaker bracket 52, the horn 51 facing the lip protector 4, the speaker bracket 52 covering the horn 51, and the speaker bracket 52 being fixedly connected to the first housing 21 and / or the second housing 31, and the side of the speaker bracket 52 facing the adjustment cavity 6 being filled with inner sponge. The speaker bracket 52 extends from the side away from the lip protector 4 and has a snap-fit ​​portion 521 that is fixedly connected to the outer periphery of the speaker 51. Along the outer periphery of the speaker 51, an annular sealing adhesive layer is coated between the snap-fit ​​portion 521 and the outer periphery of the speaker 51.

[0032] In the above embodiment, the speaker assembly 5 includes a horn 51 and a speaker bracket 52. The horn 51 is arranged facing the lip protector 4, and its sound output direction corresponds to the ear area. The speaker bracket 52 is disposed outside the horn 51 and covers the area behind the horn 51. The speaker bracket 52 is fixed to the housing by a connecting structure, forming a stable support structure within the housing. The side of the speaker bracket 52 facing the adjustment cavity 6 is filled with inner sponge. The inner sponge can fit against or be embedded inside the speaker bracket 52 to absorb and buffer sound waves within the adjustment cavity 6. A snap-fit ​​portion 521 is formed on the side of the speaker bracket 52 away from the lip protector 4. The snap-fit ​​portion 521 extends along the outer periphery of the horn 51 and forms a snap-fit ​​structure with the outer periphery of the horn 51, thus restricting the horn 51 in both the radial and axial directions. Meanwhile, an annular sealing layer is coated between the snap-fit ​​part 521 and the outer periphery of the speaker 51. The sealing layer is continuously distributed along the circumference of the speaker 51, thereby forming a sealed interface between the speaker 51 and the speaker bracket 52, preventing sound waves from leaking through the connection gap. At the same time, the inner sponge adjusts the reflected sound inside the cavity, making the sound wave propagation state in the adjustment cavity 6 more stable.

[0033] In one example, the first housing 21 is further provided with a sound pickup assembly 22, which includes a microphone board 221 and a microphone 222 disposed on the microphone board 221. The microphone board 221 is electrically connected to the speaker assembly 5. The first housing 21 is provided with a mounting groove and a sound pickup hole. The sound pickup hole and the mounting groove are distributed at an angle. The microphone board 221 is installed in the mounting groove. The microphone 222 is embedded in the sound pickup hole, and the sound pickup end of the microphone 222 faces the outside of the first housing 21. A hot melt adhesive layer is filled between the microphone 222 and the first outer shell 21, and the hot melt adhesive layer is connected to a portion of the microphone board 221.

[0034] In the above embodiment, a microphone assembly 22 is provided on the first housing 21. The microphone assembly 22 includes a microphone board 221 and a microphone 222 disposed on the microphone board 221. The first housing 21 has a mounting groove that matches the microphone board 221. The microphone board 221 is installed in the mounting groove, and its edge is abutted against the limiting surface of the mounting groove, thereby defining its position within the housing. A microphone hole is provided on the first housing 21. The microphone hole and the mounting groove are distributed at an angle, so that the microphone path is offset from the internal structure of the housing. The microphone 222 is embedded in the microphone hole, and its microphone end faces the outside of the housing, thereby being able to receive external sound signals.

[0035] A hot melt adhesive layer is filled between the microphone 222 and the outer shell. This layer fills the area between the microphone 222's outer perimeter and the pickup hole, and connects to a portion of the microphone board 221, forming a sealed and fixed structure. This makes the microphone 222 more securely mounted on the outer shell, while preventing external airflow from directly entering the internal space through the gap between the pickup hole and the outer shell. Because the pickup hole and the mounting slot are angled, a spatial separation is created between the microphone 222's pickup direction and the acoustic structure inside the earcup. This helps reduce direct interference from speaker sound waves to the pickup signal, thereby improving pickup stability.

[0036] In one example, the headband assembly 1 includes a headband body 101, a headband wire 102 passing through the headband body 101, and connecting wire holes respectively opened on the first outer shell 21 and the second outer shell 31. A wire protector 103 is installed in the connecting wire hole, and an adhesive layer is filled between the periphery of the wire protector 103 and the connecting wire hole. The headband wire 102 passes through the wire protector 103 and extends into the interior of the first outer shell 21 and the second outer shell 31, and the headband wire 102 is electrically connected to the microphone board 221.

[0037] In the above embodiment, the headband assembly 1 includes a headband body 101, the headband body 101 having a channel formed inside for accommodating a headband cord 102. The headband cord 102 extends along the length of the headband and connects to a first outer shell 21 and a second outer shell 31 respectively. The first outer shell 21 and the second outer shell 31 are respectively provided with connecting wire holes for corresponding communication with the headband cord 102. A wire sheath 103 is disposed within the connecting wire hole, the sheath 103 being embedded within the connecting wire hole, its outer wall fitting against the hole wall.

[0038] An adhesive layer is filled between the cable sleeve 103 and the connecting cable hole. The adhesive layer is distributed along the outer periphery of the cable sleeve 103, forming a fixed connection between the cable sleeve 103 and the outer shell. The headband cable 102 passes through the cable sleeve 103 and extends into the outer shell, thus guiding and protecting the headband cable 102 through the cable sleeve 103. Because the cable sleeve 103 forms a sealed connection with the outer shell, the opening where the headband cable 102 enters the outer shell is effectively sealed, thereby preventing airflow from entering the adjustment cavity 6 through this location and affecting the internal acoustic structure. At the same time, the cable sleeve 103 provides support and cushioning for the headband cable 102, keeping the headband cable 102 stable during earcup rotation or use.

[0039] In one embodiment, a circuit board 32 is fixedly disposed in the second housing 31. The circuit board 32 is distributed on the side of the speaker assembly 5 away from the lip protector 4. The circuit board 32 is electrically connected to the headband cable 102. A knob 33 is disposed on one side of the circuit board 32. The knob 33 penetrates the side wall of the second housing 31. The first housing 21 is also provided with a battery 23, which is distributed on one side of the microphone board 221. The microphone board 221 is also provided with a charging interface 24 and a light guide post 25. The charging interface 24 and the light guide post 25 both pass through the first housing 21 and extend to the outside of the first housing 21. An outer sponge 9 covers the space between the speaker assembly 5 and the lip protector 4. The lip protector 4 is provided with a sound hole 41 corresponding to the speaker assembly 5, and the sound hole 41 is connected to the outer sponge 9.

[0040] In the above embodiment, a circuit board 32 is fixedly disposed inside the second housing 31. The circuit board 32 is located on the side of the speaker assembly 5 away from the lip protector 4, i.e., near the area opposite to the adjustment cavity 6. The circuit board 32 is mounted inside the housing by a fixing structure and is electrically connected to the headband cable 102, thereby realizing the transmission of electrical signals between the two earcups. A knob 33 is provided on one side of the circuit board 32. The knob 33 penetrates the side wall of the second housing 31 and extends to the outside, allowing the user to control the headphones. The knob 33 and the circuit board 32 are connected, so that the rotation or pressing of the knob 33 can be transmitted to the circuit board 32.

[0041] A battery 23 is disposed inside the first outer casing 21, positioned on one side of the microphone panel 221, thus creating a relatively independent area between the battery 23 and the pickup assembly 22. The microphone panel 221 is equipped with a charging interface 24 and a light guide post 25, both of which pass through the first outer casing 21 and extend to the outside to facilitate charging connection and indication functions. An outer sponge 9 covers the space between the speaker assembly 5 and the lip protector 4. The outer sponge 9 is located in the sound output path to improve wearing comfort and provide some cushioning for sound waves. The lip protector 4 is provided with a speaker hole 41 corresponding to the speaker assembly 5, which communicates with the outer sponge 9, allowing sound waves to be output to the outside after passing through the outer sponge 9. This structure allows for the spatially partitioned arrangement of the electrical functional modules and acoustic structure while maintaining the overall compactness of the structure.

[0042] The present invention also provides a method for assembling earmuffs, for assembling earmuffs as described in any of the preceding claims, comprising: S1. Take the first outer shell 21 and the second outer shell 31 respectively, and install the acoustic adjustment component 8 at the tuning slot 7 of the first outer shell 21 and the second outer shell 31. In step S1, the steps for installing the acoustic adjustment component 8 include: Cover the opening of the tuning slot 7 with the tuning frame 81 and set the tuning sponge 82 on one side of the tuning frame 81; apply an adhesive layer to the slot wall and / or the bottom of the tuning slot 7 to fix the periphery of the tuning frame 81 to the tuning slot 7. In step S1, an acoustic adjustment structure is constructed for the first outer shell 21 and the second outer shell 31. Specifically, a tuning groove 7 is formed at a predetermined position on the outer shell. The tuning groove 7 is recessed inward along the thickness direction of the outer shell wall, providing space to accommodate the acoustic adjustment component 8. A tuning frame 81 is placed over the opening of the tuning groove 7, with the edge of the tuning frame 81 matching the groove wall of the tuning groove 7, thus defining the boundary of the tuning groove 7. To enhance connection stability, an adhesive layer is pre-installed on the groove wall or bottom of the tuning groove 7, so that the tuning frame 81 forms a fixed connection with the outer shell through the adhesive layer after installation. This connection is continuously distributed along the circumference of the tuning groove 7, thus forming a closed boundary interface. A tuning sponge 82 is placed on the side of the tuning frame 81 facing the inside of the outer shell, positioned between the tuning groove 7 and the subsequently formed adjustment cavity 6. Through this structural arrangement, the tuning groove 7 forms a controlled acoustic channel, while the tuning frame 81 defines the opening, and the tuning sponge 82 is located inside the channel, forming a stable acoustic adjustment path foundation.

[0043] S2. The speaker assembly 5 is sealed and fixed in the first housing 21 and the second housing 31 to form the adjustment cavity 6, and the acoustic adjustment assembly 8 is connected to the adjustment cavity 6. Step S2 includes: Test the speaker 51 by connecting the positive and negative terminals of the speaker 51 to the wires respectively; install the speaker 51 inside the first housing 21 and / or the second housing 31, and cover the speaker 51 with the speaker bracket 52, which is fixedly connected to the first housing 21 and / or the second housing 31. The speaker bracket 52 is filled with inner sponge on the side facing the adjustment cavity 6. The snap-fit ​​part 521 on the side of the speaker bracket 52 away from the lip protector 4 is fixedly connected to the outer periphery of the speaker 51, and an annular sealing adhesive layer is provided between the snap-fit ​​part 521 and the outer periphery of the speaker 51.

[0044] In step S2, after the acoustic adjustment components are arranged, the speaker assembly 5 is installed in a preset position inside the first housing 21 and the second housing 31. The speaker 51 is placed in the mounting position inside the housing, with its sound output direction facing the lip 4. At the same time, the speaker 51 is covered and limited by the speaker bracket 52, forming a connection structure between the speaker bracket 52 and the housing. The speaker bracket 52 is structurally matched with the housing, enabling it to stably support the speaker 51 and limit its spatial position. The side of the speaker bracket 52 facing the adjustment cavity 6 is filled with inner sponge, forming a certain buffer space in this area. On the side of the speaker bracket 52 away from the lip 4, the extended snap-fit ​​part 521 forms a mating connection with the outer periphery of the speaker 51, and an annular sealing layer is provided between the two, forming a continuous sealed boundary at the connection interface. Through the above structure, a relatively closed adjustment cavity 6 is formed between the speaker 51, the speaker bracket 52, and the housing. At the same time, the tuning groove 7 communicates with the adjustment cavity 6 through the tuning hole 71 at its bottom, thereby establishing an acoustic adjustment path.

[0045] S3. Assemble the microphone assembly 22 on the first housing 21, so that the microphone 222 in the microphone assembly 22 is embedded in the microphone hole of the first housing 21, and the microphone end of the microphone 222 faces the outside of the first housing 21. Step S3 includes: installing the microphone board 221 into the mounting groove of the first housing 21, embedding the microphone 222 in the pickup hole, filling the space between the microphone 222 and the first housing 21 with a hot melt adhesive layer, and overlapping the hot melt adhesive layer to a portion of the surface of the microphone board 221. The microphone assembly 22 is disposed inside the first housing 21. Specifically, a mounting groove is pre-set on the first housing 21 to fit the shape of the microphone board 221. The microphone board 221 is embedded in the mounting groove, so that the edge of the microphone board 221 fits against the limiting surface of the mounting groove, thereby defining its position within the housing. Simultaneously, a microphone hole is provided on the housing, arranged at an angle to the mounting groove, creating a spatial offset between the microphone path and the internal structure of the housing. The microphone 222 is embedded in the microphone hole, with its microphone end facing outwards to receive external sounds. Hot melt adhesive is filled between the outer periphery of the microphone 222 and the microphone hole, filling the gap and overlapping with a portion of the microphone board 221, thus forming a continuous and fixed interface. This arrangement creates a stable mounting structure for the microphone assembly 22 on the housing, while the angled arrangement reduces direct overlap with the speaker's sound wave path.

[0046] S4. Assemble the headband assembly 1, so that the headband wire 102 is threaded through the headband assembly 1, and thread both ends of the headband wire 102 into the connecting wire holes on the first housing 21 and the second housing 31 respectively. Step S4 includes: pre-installing the cable protector 103 into the connection hole of the first housing 21 and the second housing 31; passing the headband cable 102 through the corresponding cable protector 103 and extending it into the first housing 21 and the second housing 31 respectively; filling the gap between the cable protector 103 and the connection hole with an adhesive layer; and after passing the headband cable 102 through the cable protector 103, leaving a length of 95mm to 100mm of the headband cable 102 inside the first housing 21 and the second housing 31. In step S4, the headband assembly 1 and the wiring harness channel are constructed. First, connection holes are pre-set on the first housing 21 and the second housing 31, and a protective sleeve 103 is installed in the connection hole, so that the protective sleeve 103 is embedded in the hole, and its outer wall forms a mating relationship with the inner wall of the connection hole. Then, an adhesive layer is filled between the protective sleeve 103 and the connection hole, so that the protective sleeve 103 and the housing form a fixed connection interface, and at the same time, the connection hole is sealed and limited. The headband wire 102 is passed through the inside of the headband body 101, and its two ends pass through the corresponding protective sleeves 103 and extend into the inside of the first housing 21 and the second housing 31, respectively. During the insertion process, the headband wire 102 is guided into the inside of the housing along the internal channel of the protective sleeve 103, so that the wiring harness path is spatially restricted and kept stable. Through the cooperation of the protective sleeve 103 and the adhesive layer, the wiring harness channel ensures the guiding function while sealing the opening of the housing, thereby avoiding interference with the internal adjustment cavity 6 at this position.

[0047] S5. Install electrical connection components in the first housing 21 and the second housing 31 respectively, so that the headband cable 102, the pickup assembly 22 and the speaker assembly 5 are electrically connected to the electrical connection components respectively. Step S5 includes: installing a circuit board 32 inside the second housing 31, installing a battery 23 inside the first housing 21, and passing the charging interface 24 and light guide post 25 on the microphone board 221 through the first housing 21 and extending to the outside of the first housing 21, wherein the circuit board 32 is located on the side of the speaker assembly 5 away from the lip protector 4 and is electrically connected to the headband cable 102, and a knob 33 is installed on one side of the circuit board 32 that extends through the side wall of the second housing 31, and the battery 23 is located on one side of the microphone board 221; Electrical connection structures are respectively provided inside the first housing 21 and the second housing 31. A circuit board 32 is disposed inside the second housing 31, positioned on the side of the speaker assembly 5 away from the lip protector 4, and connected to the housing through a fixing structure, thus spatially separating the circuit board 32 from the adjustment cavity 6. The headband cable 102 is electrically connected to the circuit board 32, establishing an electrical signal path between the two earcups. A knob 33 is disposed on one side of the circuit board 32, passing through the side wall of the second housing 31 and forming an operational connection with the circuit board 32. A battery 23 is disposed inside the first housing 21, located on one side of the microphone board 221, thus spatially separating the battery 23 from the pickup assembly 22. Simultaneously, the charging interface 24 and the light guide post 25 on the microphone board 221 pass through the first housing 21 and extend to the outside, forming a connection interface with the external environment. This allows the electrical modules to be distributed within the two housings and remain relatively independent from the acoustic structure.

[0048] S6. Install the lip protector 4 and the outer sponge 9 on the first outer shell 21 and the second outer shell 31 respectively, and assemble the first outer shell 21 and the second outer shell 31 at both ends of the headband assembly 1.

[0049] Step S6 includes: covering the outer sponge 9 between the speaker assembly 5 and the lip protector 4, then connecting the speaker hole 41 on the lip protector 4 corresponding to the speaker assembly 5 with the outer sponge 9, installing the bottom plate with the lip protector 4 onto the first housing 21 and the second housing 31 respectively, and performing overall performance testing and appearance inspection.

[0050] The output structure and overall structure of the earmuff are further improved. An outer sponge 9 is placed between the speaker assembly 5 and the lip protector 4, covering the sound output path of the speaker assembly 5 and correspondingly arranged on the inner side of the lip protector 4. The lip protector 4 is provided with a sound hole 41 corresponding to the speaker assembly 5, so that the sound hole 41 and the outer sponge 9 are connected, allowing the sound waves to pass through the outer sponge 9 and then be output to the outside through the sound hole 41. The base plate with the lip protector 4 is installed on the first shell 21 and the second shell 31, so that the lip protector 4 and the shell form an integrated structure and surround the wearing area. The first shell 21 and the second shell 31 are respectively installed on both ends of the headband assembly 1, so that the overall structure forms a closed connection. The acoustic path inside the earmuff, the external output path, and the structural connection relationship form a unified system, thereby completing the construction of the overall structure of the earmuff.

[0051] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. An earmuff, characterized in that, It includes a headband assembly (1) and a first earmuff mechanism (2) and a second earmuff mechanism (3) respectively disposed at both ends of the headband assembly (1); The first earmuff mechanism (2) includes a first housing (21), and the second earmuff mechanism (3) includes a second housing (31). The first housing (21) and the second housing (31) are covered with a lip protector (4) on the side that is close to each other. The first housing (21) and the second housing (31) are each provided with a speaker assembly (5). An adjustment cavity (6) is formed between each speaker assembly (5) and the corresponding housing. The first housing (21) and / or the second housing (31) are provided with a tuning groove (7), and an acoustic adjustment component (8) is provided in the tuning groove (7). The acoustic adjustment component (8) is distributed at a preset angle with the speaker assembly (5), and the acoustic adjustment component (8) is connected to the adjustment cavity (6) for adjusting the adjustment cavity (6) to adjust the acoustic performance inside the earmuff.

2. An earmuff according to claim 1, characterized in that, The acoustic adjustment assembly (8) includes a tuning frame (81) and a tuning sponge (82). The tuning frame (81) covers the opening of the tuning slot (7) and is connected to the first housing (21) and / or the second housing (31). The tuning sponge (82) is disposed on the side of the tuning frame (81) facing the adjustment cavity (6). The tuning groove (7) has an adhesive layer on its wall and / or bottom. The tuning frame (81) is fixedly connected to the tuning groove (7) through the adhesive layer, so that the tuning frame (81) forms a sealed connection structure along the circumference of the tuning groove (7).

3. An earmuff according to claim 1, characterized in that, The tuning groove (7) is recessed toward the adjustment cavity (6) along the wall thickness direction of the first outer shell (21) and / or the second outer shell (31). At least one tuning hole (71) is provided at the bottom of the tuning groove (7). The tuning hole (71) communicates with the adjustment cavity (6), and the tuning hole (71) is distributed on the side of the speaker assembly (5) away from the lip protector (4).

4. An earmuff according to claim 1, characterized in that, The loudspeaker assembly (5) includes a horn (51) and a speaker bracket (52). The horn (51) faces the lip guard (4) and the speaker bracket (52) covers the horn (51). The speaker bracket (52) is fixedly connected to the first housing (21) and / or the second housing (31). The side of the speaker bracket (52) facing the adjustment cavity (6) is filled with inner sponge. The speaker bracket (52) extends a snap-fit ​​part (521) on the side away from the lip protector (4) and is fixedly connected to the outer periphery of the speaker (51). Along the outer periphery of the speaker (51), an annular sealing adhesive layer is coated between the snap-fit ​​part (521) and the outer periphery of the speaker (51).

5. An earmuff according to claim 1, characterized in that, The first housing (21) is also provided with a sound pickup assembly (22), which includes a microphone board (221) and a microphone (222) disposed on the microphone board (221). The microphone board (221) is electrically connected to the speaker assembly (5). The first housing (21) is provided with a mounting groove and a sound pickup hole. The sound pickup hole and the mounting groove are distributed at an angle. The microphone board (221) is installed in the mounting groove. The microphone (222) is embedded in the sound pickup hole, and the sound pickup end of the microphone (222) faces the outside of the first housing (21). A hot melt adhesive layer is filled between the microphone (222) and the first outer shell (21), and the hot melt adhesive layer is connected to a portion of the microphone board (221).

6. An earmuff according to claim 5, characterized in that, The headband assembly (1) includes a headband body (101), a headband wire (102) is inserted inside the headband body (101), and a connecting wire hole is opened on the first shell (21) and the second shell (31). A wire protector (103) is installed in the connecting wire hole. An adhesive layer is filled between the periphery of the wire protector (103) and the connecting wire hole. The headband wire (102) is inserted inside the wire protector (103) and extends into the first shell (21) and the second shell (31). The headband wire (102) is electrically connected to the microphone (221).

7. An earmuff according to claim 6, characterized in that, A circuit board (32) is fixedly installed in the second housing (31). The circuit board (32) is distributed on the side of the speaker assembly (5) away from the lip protector (4). The circuit board (32) is electrically connected to the headband wire (102). A knob (33) is provided on one side of the circuit board (32). The knob (33) penetrates the side wall of the second housing (31). The first housing (21) is also provided with a battery (23), which is distributed on one side of the microphone board (221). The microphone board (221) is also provided with a charging interface (24) and a light guide column (25). The charging interface (24) and the light guide column (25) both pass through the first housing (21) and extend to the outside of the first housing (21). An outer sponge (9) covers the space between the speaker assembly (5) and the lip protector (4). The lip protector (4) is provided with a sound hole (41) corresponding to the speaker assembly (5). The sound hole (41) is connected to the outer sponge (9).

8. A method for assembling earmuffs, characterized in that, For assembling the earmuffs as described in any one of claims 1 to 7, comprising: S1. Take the first outer shell and the second outer shell respectively, and install the acoustic adjustment component at the tuning slot of the first outer shell and the second outer shell; S2. Seal and fix the speaker assembly in the first housing and the second housing respectively to form an adjustment cavity, and connect the acoustic adjustment assembly to the adjustment cavity; S3. Assemble a microphone assembly on the first housing, such that the microphone in the microphone assembly is embedded in the microphone hole of the first housing, and the microphone tip of the microphone faces the outside of the first housing. S4. Assemble the headband assembly, so that the headband wire is threaded through the headband assembly, and thread both ends of the headband wire into the connecting wire holes on the first and second outer shells respectively. S5. Install electrical connection components in the first and second housings respectively, so that the headband cable, pickup assembly and speaker assembly are electrically connected to the electrical connection components respectively; S6. Install lip protectors and outer sponges on the first and second outer shells respectively, and assemble the first and second outer shells at both ends of the headband assembly.

9. The method for assembling an earmuff according to claim 8, characterized in that, Step S1, the steps for installing the acoustic adjustment components include: Cover the tuning frame at the opening of the tuning slot and place tuning foam on one side of the tuning frame; apply an adhesive layer to the groove wall and / or bottom of the tuning slot to fix the periphery of the tuning frame to the tuning slot. Step S2 includes: Test the speaker by connecting the positive and negative terminals of the speaker to the wires respectively; install the speaker inside the first housing and / or the second housing, and cover the speaker with the speaker bracket, which is fixedly connected to the first housing and / or the second housing; The speaker bracket is filled with inner sponge on the side facing the adjustment cavity, and the snap-fit ​​part on the side of the speaker bracket away from the lip is fixedly connected to the outer periphery of the speaker, with an annular sealing layer between the snap-fit ​​part and the outer periphery of the speaker.

10. The method for assembling an earmuff according to claim 8, characterized in that, Step S3 includes: installing the microphone board into the mounting groove of the first housing, so that the microphone is embedded in the pickup hole, filling the space between the microphone and the first housing with a hot melt adhesive layer, and overlapping the hot melt adhesive layer to a portion of the microphone board surface; Step S4 includes: pre-installing the cable protector into the connection hole of the first housing and the second housing, passing the headband cable through the corresponding cable protector and extending it into the first housing and the second housing respectively, and filling the gap between the cable protector and the connection hole with an adhesive layer. After passing the headband cable through the cable protector, a headband cable with a length of 95mm to 100mm is left inside the first housing and the second housing. Step S5 includes: installing a circuit board inside the second housing, installing a battery inside the first housing, and passing the charging interface and light guide on the microphone board through the first housing and extending to the outside of the first housing, wherein the circuit board is located on the side of the speaker assembly away from the lip protector and is electrically connected to the headband wire, a knob that extends through the side wall of the second housing is installed on one side of the circuit board, and the battery is located on one side of the microphone board. Step S6 includes: covering the speaker assembly and the protective lip with an outer sponge, then connecting the speaker hole on the protective lip to the outer sponge, installing the base plate with the protective lip onto the first and second housings respectively, and performing overall performance testing and appearance inspection.

Images