Hearing device and method of manufacturing a hearing device

Abstract

A hearing device is disclosed. The hearing device comprises a telecoil for communication in a first frequency band, a wireless communication device for communication in a second frequency band, and a printed circuit board (PCB) comprising at least one electrically conductive layer and at least one dielectric layer. The telecoil is arranged in a first section of the PCB, while the wireless communication device is arranged in a second section of the PCB. The electrically conductive layer comprises a first electrically conductive trace provided in the first section of the PCB and a second electrically conductive trace provided in the second section of the PCB. A method of manufacturing a hearing device is also disclosed.

Description

Technical Field

[0001] This invention relates to a hearing device and a method for manufacturing the hearing device. Background Technology

[0002] Hearing devices typically employ wireless radio communication, particularly for audio communication or control signals. Often, such devices are configured to support more than one type of wireless communication (e.g., multiple protocols or communication across various frequency bands).

[0003] Typically, as a type of wireless communication, hearing aids include a pickup coil. A pickup coil is generally understood as at least one typically quite small conductive wire (e.g., copper wire) that acts as a receiver to receive electromagnetic signals. Such pickup coils operate unmodulated in baseband and are widely used, allowing signals to be received from a location where a corresponding sound system (generally also called a loop or loop system) converts these signals into audio. The audio is then typically delivered to the user of the hearing aid via its transducer.

[0004] As another type of wireless communication, hearing devices commonly employ digital wireless radio communication technologies that operate within different frequency ranges. Common digital wireless radio communication technologies include, for example, 2.4 GHz communication technologies (e.g., Bluetooth® technology) or 5 GHz technologies.

[0005] Typically, hearing devices utilize printed circuit boards (PCBs) for mounting at least a portion of electronic components. Traces (i.e., conductive traces) on this PCB are used to conduct electrical signals for various components. In such PCBs, the size of the PCB, and particularly its length, often results in frequency-dependent impedance, potentially causing frequency-dependent damping or resonance at specific frequencies. This frequency-dependent impedance can lead to degraded wireless performance. There remains a desire for hearing devices that provide a PCB that allows for multiple types of wireless communication and offers improved wireless performance.

[0006] Furthermore, there is still a general desire in the field of hearing devices to reduce the size of hearing devices. Summary of the Invention

[0007] The purpose of this invention is to provide a hearing device that overcomes at least some of the above-mentioned disadvantages.

[0008] This objective and further objectives are achieved by a hearing device according to the invention, the hearing device comprising:

[0009] A pickup coil, used for communication in the first frequency band;

[0010] Wireless communication equipment for communication in a second frequency band;

[0011] A printed circuit board (PCB) includes at least one conductive layer and at least one dielectric layer, wherein,

[0012] The pickup coil is disposed in a first segment of the PCB, and the wireless communication device is disposed in a second segment of the PCB, wherein the conductive layer includes a first conductive trace disposed in the first segment of the PCB and a second conductive trace disposed in the second segment of the PCB; wherein the PCB includes:

[0013] The coupling element has a first end and a second end; and

[0014] The cut-off portion decouples the current of the first conductive trace from that of the second conductive trace, wherein the first end of the coupling element is connected to the first conductive trace, and the second end of the coupling element is connected to the second conductive trace, wherein the coupling element is configured to provide frequency-dependent coupling between the first conductive trace and the second conductive trace.

[0015] What has been achieved is that decoupling can be realized from a current perspective by providing coupling elements and cut-off portions that decouple the current of the first conductive trace from that of the second conductive trace, thereby reducing noise related to potentially unmodulated wireless communication in the baseband, while allowing for increased electrical length and physically shorter PCB traces. This, in turn, allows for PCB designs with increased adaptability, enabling improved wireless performance for both wireless technologies through adaptability that allows for increased electrical length and mitigation of (DC) current loops, thereby reducing noise related to unmodulated communication without increasing the physical size of the PCB.

[0016] By providing coupling elements, easy adaptation can also be provided, which in turn allows for improved flexibility of the PCB, since decoupling elements can be replaced with components that can be configured with frequency-dependent impedance provided by the traces for various frequency bands.

[0017] As an example, the pickup coil can be configured to receive unmodulated signals in a first frequency band. Correspondingly, the pickup coil may sense noise, which could reduce performance, introduce audible artifacts into the signal provided to the user of the hearing device, or require additional signal processing to combat the noise, thus requiring additional processing power, which is generally desirable to minimize the impact on battery-powered hearing devices. Given size constraints, certain conventional PCB designs introduce traces extending around the pickup coil or forming loops to provide sufficient routing for communication signals from wireless communication devices operating in a second frequency band, for example. However, such traces can create current loops, thereby introducing noise into the wireless communication of the pickup coil in the first frequency band. The present invention has recognized that by providing a decoupling element between the first and second ends and by providing a cut-off portion in the PCB, current loops can be disrupted, thereby reducing noise that impedes communication in the first frequency band. With the decoupling element, loops can be maintained in the second frequency band for routing communication signals from wireless communication devices. Furthermore, when viewed from the perspective of wireless communication signals in the second frequency band, it has been found that the cut-off portion results in different electrical lengths of the PCB, thereby allowing the resonant frequency to be shifted outside the second frequency band (e.g., far outside).

[0018] In this disclosure, as is known in the art, the term "electrical length" refers to the length of the PCB relative to the frequency of interest. Throughout this disclosure, electrical length is considered to be relative to a second frequency band, and the term electrical length will therefore be understood to be related to the second frequency band.

[0019] As current decoupling, this can be understood in this document as, at least during the operation of the hearing device, from a DC perspective, the first and second traces are decoupled at least at both ends of the gap, specifically such that during the operation of the hearing device, there is no DC travel between the first and second traces (at least at both ends of the gap).

[0020] Frequency-dependent coupling, in this context, can be understood as an electrical connection with a frequency-dependent impedance. Specifically, frequency-dependent coupling can refer to a connection with a complex impedance having a non-zero imaginary part. In other words, an electrical connection or coupling with an impedance that varies with frequency can be provided by frequency-dependent coupling.

[0021] Throughout this disclosure, it will be recognized that the term "pickup coil" (also commonly referred to as a T-coil) refers to a coil (e.g., a bent lead of a conductive material, such as copper). A pickup coil can be configured to receive magnetic (e.g., electromagnetic) signals. A pickup coil may include leads bent around a suitable core (e.g., a ferrite rod). A pickup coil can be configured to receive magnetic signals (e.g., unmodulated signals) from an induction or induction loop. It will be recognized that such pickup coils are generally known and widely used, particularly in hearing aids.

[0022] Throughout this disclosure, it will be appreciated that PCB generally refers to a layered structure comprising at least one conductive layer (i.e., a layer made of conductive material) and at least one dielectric layer (i.e., a layer made of dielectric material). In a PCB, several such layers are typically laminated together. Typically, a PCB can be configured for surface mounting of electronic components and interconnection of these components via conductive traces formed in the conductive layers. Therefore, traces throughout this disclosure generally refer to conductive elements of the material in the conductive layers. These traces are typically provided by etching away portions of the conductive layer, for example, made of copper, leaving the desired conductive traces.

[0023] The PCB can be a multilayer PCB (e.g., a PCB comprising at least two conductive material (e.g., copper) layers and at least one dielectric material (e.g., composite material (e.g., FR-4)) layer disposed between the conductive layers). In some embodiments, the PCB is a four-layer PCB (i.e., comprising four conductive material layers and three dielectric material layers disposed between each of the conductive layers and the adjacent conductive material layer).

[0024] In the case of a multilayer PCB, first and second traces can be provided in any conductive layer (e.g., in the top or bottom conductive layer of the PCB).

[0025] The cut-off portion can be a physical cut-off portion in the PCB (e.g., an opening provided in the PCB).

[0026] Decoupling elements can be connected to both ends of the cut-off portion. A first conductive pad can be provided on a first side of the cut-off portion and connected to a first trace, and a second conductive pad can be provided on a second side of the cut-off portion and connected to a second trace. The second side can be opposite to the first side of the cut-off portion, for example, such that the cut-off portion is arranged between the first and second sides and / or provides current decoupling between the first and second sides. For example, by soldering, the decoupling element can be connected to the first pad with its first connecting segment and to the second pad with its second connecting segment.

[0027] In some embodiments, the decoupling element is or includes an electrical component (e.g., a surface mount device (SMD) component). The decoupling element may be or includes one or more passive components and / or one or more active components.

[0028] Hearing devices may include a housing configured to house a PCB, a pickup coil, a wireless communication device, and a coupling element. The housing may be configured to surround and / or encapsulate the PCB, pickup coil, wireless communication device, and coupling element. In some embodiments, the housing may be made of a polymer or plastic-based material.

[0029] Hearing devices may alternatively or additionally include acoustic transducers (e.g., electroacoustic transducers) operatively connected to a PCB and configured to reproduce sound. The acoustic transducers may be configured to be inserted into a user's ear canal during use of the hearing device. The acoustic transducers may include either acoustic input transducers (e.g., microphones) or acoustic output transducers (e.g., receivers, telephones, or external speakers).

[0030] The PCB can be flexible and / or bendable, for example, such that the first and second segments can be hinged relative to each other, and such that the PCB can bend while maintaining conductivity between the first and second segments. Alternatively or additionally, the PCB may include a bend, optionally located between the first and second segments.

[0031] A hearing device (e.g., its PCB) may include at least one processing unit configured to receive and process signals received from a microphone, a pickup coil, and a wireless communication device. The at least one processing unit may also be configured to provide a signal to be transmitted to the wireless communication device. The at least one processing unit may be and / or include any one or more of a central processing unit (CPU), a microprocessor unit (MCU), a digital signal processor (DSP), a field-programmable gate array (FPGA), etc. The at least one processing unit may be mounted on and connected to the PCB.

[0032] The hearing device (e.g., its PCB) may alternatively or additionally include a memory, optionally coupled to at least one processing unit. The memory may be configured to store instructions that, when executed by the processing unit, cause at least one processing unit to receive and process signals received from a microphone, pickup coil, and wireless communication device, and / or provide a signal to be transmitted to the wireless communication device. The memory may be non-volatile. The memory may be and / or include any of random access memory (RAM), read-only memory (ROM), etc. The memory may be mounted on and connected to the PCB.

[0033] Hearing devices (e.g., their PCBs) may include one or more acoustic transducers (e.g., microphones) for receiving audio signals. The one or more acoustic transducers may include: at least one front microphone for facing forward at least during use of the hearing device; and / or at least one rear microphone, facing backward, optionally positioned distal to the front microphone relative to the user's face.

[0034] In cases where the hearing device includes one or more microphones, at least one processing unit may be configured to receive and process signals received from the microphones. Alternatively or additionally, in cases where the hearing device includes at least one acoustic transducer, at least one processing unit may be configured to process and provide signals to be reproduced and / or amplified by the acoustic transducer. One or more microphones may be mounted on and connected to the PCB of the hearing device.

[0035] Wireless communication devices may be and / or include wireless communication modules configured to provide wireless communication. Wireless communication devices may include transceivers configured to transmit and / or receive wireless communication signals. Wireless communication devices may be configured to provide digital wireless communication (i.e., receive and / or transmit digital wireless signals). Digital wireless signals may be modulated wireless signals.

[0036] Wireless communication devices may alternatively or additionally include any one or more of the following: processing units (e.g., any one or more of CPU, MCU, DSP, etc.); and memory (e.g., any one or more of RAM, ROM, etc.).

[0037] In cases where the hearing device includes a processing unit and / or memory, the wireless communication device can be integrated into the processing unit and / or memory of the hearing device.

[0038] The hearing device (e.g., the PCB of the hearing device) may also include an antenna configured to facilitate the transmission and / or reception of wireless communication signals to and / or from a wireless communication device in a second frequency band. The antenna may be mounted on and / or connected to the PCB of the hearing device.

[0039] Hearing devices can be configured to be battery-powered (i.e., configured to be powered by batteries (e.g., rechargeable batteries or button batteries (e.g., zinc-air batteries))). In cases where the hearing device includes a housing, the housing can be configured to house the batteries.

[0040] Hearing devices (e.g., their PCBs) may include power terminals configured to receive power from a power source (e.g., a DC power source). When the hearing device is configured to be battery-powered, the PCB may include battery terminals (e.g., positive and negative terminals) for connecting to and receiving battery power signals to power the hearing device.

[0041] The PCB may also include sub-segments of a first segment of the PCB. The sub-segments of the first segment may be adjacent to or extend from the pickup coil, optionally to surround at least a portion of the periphery of the pickup coil. The sub-segment may be a via-less sub-segment (e.g., a segment without vias). In this disclosure, it should be understood that a via refers to any connection provided to connect multiple conductive layers of the PCB (i.e., in the vertical direction of the PCB). Alternatively or additionally, the sub-segments of the first segment may be non-laterally connected sub-segments (i.e., sub-segments without conductive lateral connections and / or sub-segments without conductive connections between conductive layers of the PCB).

[0042] Sub-segments can extend from one edge of the PCB to another (e.g., between two edges in the lateral direction of the PCB).

[0043] By providing via-less or transversely connected sub-sections, the amount of signal introduced into the pickup coil can be further reduced.

[0044] Hearing devices may alternatively or additionally include a magnetic induction coil (or MI coil), which is configured for short-range wireless communication in a frequency band different from that of the wireless communication module. The purpose of the MI coil is to communicate with a corresponding MI coil in another hearing device worn on the opposite side of the user's head. Further details of the MI coil are beyond the scope of this application.

[0045] In some embodiments, the pickup coil is arranged in a recess in a first section of the PCB.

[0046] The pickup coil can be arranged such that a first segment of the PCB substantially surrounds the pickup coil and / or the periphery or cross-section of the pickup coil, optionally excluding the cut-out portion. The recess can be an opening connected to the cut-out portion. For example, the recess can be a hole on the PCB, and the cut-out portion can extend from the outside of the PCB into the recess.

[0047] In some embodiments, the PCB has a lateral direction, a longitudinal direction, and a vertical direction, and the cut-out portion of the PCB extends in the lateral direction.

[0048] A PCB can be longer in the vertical direction than in the horizontal direction.

[0049] At least one conductive layer and at least one dielectric layer may be stacked and / or arranged on top of each other in the vertical direction. Specifically, at least one conductive layer may be in contact with the dielectric layer in both the longitudinal and transverse directions of the PCB.

[0050] Alternatively or additionally, the conductive and dielectric layers of a PCB may be stacked alternately in the vertical direction or arranged on top of each other.

[0051] In some embodiments, the cut-out portion extends from a groove in a first segment of the PCB to the edge of the first segment of the PCB.

[0052] Therefore, current decoupling can be provided on one side of the pickup coil in the lateral direction, thereby preventing DC loops, since no current connection is provided on that side of the pickup coil.

[0053] The edge can be a transverse edge located on the pickup coil. Alternatively or additionally, the edge can extend in the longitudinal direction.

[0054] Alternatively, the cut portion may extend between the first and second segments, optionally separating the two segments.

[0055] The coupling element may have non-zero reactance. The coupling element may additionally have non-zero resistance. Alternatively or additionally, the coupling element may have substantially zero resistance (i.e., resistance derived from non-ideal characteristics of the component (e.g., equivalent series resistance (ESR) etc.)).

[0056] The coupling element can be and / or can act as a filter (e.g., a high-pass filter or a band-pass filter) at least during the operation of the hearing device.

[0057] In some embodiments, the coupling element is a capacitive coupling element connected to both ends of the cut-off portion, wherein the capacitive coupling element is configured to provide frequency-dependent coupling in the first segment for frequencies in the second frequency band.

[0058] Therefore, capacitive coupling elements can provide loops for alternating current signals (e.g., radio signals). Furthermore, increased PCB flexibility is achieved because capacitive coupling elements can be selected and / or interchanged, allowing the PCB to be used for communication at different frequencies by replacing capacitive coupling elements with different capacitive coupling elements with different capacitances.

[0059] A capacitive coupling element can be understood as a coupling element with capacitive reactance and / or non-zero capacitance.

[0060] The capacitive coupling element can be configured to have a capacitor that provides low impedance and / or damping for frequencies in the second frequency band.

[0061] In some embodiments, a first end of the capacitive coupling element is connected to a first conductive trace, and a second end of the capacitive coupling element is connected to a second conductive trace.

[0062] In some embodiments, the capacitive coupling element is a capacitor.

[0063] In some embodiments, the capacitive coupling element includes a capacitor.

[0064] Capacitors can be, for example, ceramic capacitors or film capacitors.

[0065] In some embodiments, the capacitive coupling element is or includes a single capacitor. Alternatively, the capacitive coupling element may be or includes multiple capacitors.

[0066] In some embodiments, the coupling element is an inductive coupling element, wherein the inductive coupling element is configured to provide frequency-dependent coupling in the first segment for frequencies in the second frequency band.

[0067] Inductive coupling elements can provide the same advantages as those described for capacitive coupling elements.

[0068] Similarly, an inductively coupled element can be understood as a coupled element with inductive reactance and / or with non-zero inductance.

[0069] The capacitive coupling element can be configured to have an inductor that provides low impedance and / or damping for frequencies in the second frequency band.

[0070] In some embodiments, the inductive coupling element is an inductor.

[0071] In some embodiments, the inductive coupling element includes an inductor (e.g., an SMD inductor).

[0072] In some embodiments, the inductive coupling element is or includes a single inductor. Alternatively, the inductive coupling element may be or includes multiple inductors.

[0073] In some embodiments, at least a portion of the first section of the PCB is adjacent to the pickup coil.

[0074] In some embodiments, when viewed from the radial direction of the pickup coil, the first segment extends along the periphery of the pickup coil (e.g., at least 10%, at least 20%, at least 30%, at least 40%, at least 50% or more of the periphery of the pickup coil).

[0075] In some embodiments, when viewed from the radial direction of the pickup coil, the first trace extends along the periphery of the pickup coil (e.g., at least 10%, at least 20%, at least 30%, at least 40%, at least 50% or more of the periphery of the pickup coil).

[0076] In some embodiments, the second frequency band is a radio frequency band.

[0077] The second frequency band can be correspondingly the frequency band used for sending and receiving radio communications to and from wireless communication devices.

[0078] The second frequency band can be, for example, a band ranging from 20 kHz to 300 GHz (e.g., from 300 MHz to 6 GHz). In some embodiments, the second frequency band can be an unlicensed band (e.g., a band at or including frequencies of 900 MHz, 2.4 GHz, or 5.8 GHz, respectively, and / or a band commonly referred to as the 900 MHz band, the 2.4 GHz band, or the 5.8 GHz band)). Alternatively, the second frequency band can be a 5 GHz band (e.g., a band ranging from 5.250 GHz to 5.350 GHz).

[0079] In some embodiments, the second frequency band may be a band between 2.0 GHz and 3.0 GHz. For example, the second frequency band may extend from 2.4 GHz to 2.4835 GHz (e.g., from 2.402 GHz to 2.48 GHz). Alternatively or additionally, the wireless communication device may be configured to communicate via short-range wireless technology protocols. Alternatively or additionally, the wireless communication device may be configured to provide communication via Bluetooth® (e.g., via Bluetooth® protocols, such as Bluetooth® Low Energy (BLE), Bluetooth Classic (Bluetooth 1.0 / 2.0 / 2.0+EDR / 2.1), and / or Bluetooth® 5.0). Alternatively or additionally, the wireless communication device may be configured to provide communication via ZigBee and / or Z-Wave.

[0080] In some embodiments, the wireless communication device may be configured to communicate via modulated radio signals.

[0081] In some embodiments, the first frequency band is the baseband.

[0082] In this article, "baseband" can be understood as the first frequency band configured to receive unmodulated communication signals.

[0083] The first frequency band may alternatively or additionally be defined as the frequency range that primarily corresponds to human hearing. Alternatively or additionally, the first frequency band may be in the range of 0 Hz to 20 kHz (e.g., from 20 Hz to 20 kHz).

[0084] In some embodiments, the hearing device is a hearing aid (e.g., a behind-the-ear (BTE) hearing aid).

[0085] Behind-the-ear hearing aids can be understood herein as hearing aids configured to be worn outside a user's outer ear. BTE hearing aids can be configured to be positioned outside the outer ear during use (e.g., between the earlobe and a portion of the user's head (e.g., the temporal region of the user's head)). BTE hearing aids can be configured to attach to the user's outer ear.

[0086] BTE hearing aids may include a cannula for insertion into a user's ear canal and coupling to the acoustic transducer of the BTE hearing aid. The cannula can be configured to route audio into the user's ear canal.

[0087] In some embodiments, at least one acoustic transducer is arranged in a first section of the PCB.

[0088] At least one acoustic transducer arranged in the first section may be a microphone. At least one acoustic transducer may be or include the acoustic transducers described above. For example, at least one acoustic transducer arranged in the first section may include the front microphone and the rear microphone described above.

[0089] An alternative first aspect of the present invention relates to a hearing device, comprising:

[0090] A pickup coil, used for communication in the first frequency band;

[0091] Wireless communication equipment for communication in a second frequency band;

[0092] A printed circuit board (PCB) includes at least one conductive layer and at least one dielectric layer, wherein the pickup coil is disposed in a recess in a first segment of the PCB, and the wireless communication device is disposed in a second segment of the PCB.

[0093] Each of the at least one conductive layer and the at least one dielectric layer extends in both the longitudinal and transverse directions of the PCB, and the at least one conductive layer and the at least one dielectric layer are arranged adjacent to each other in the vertical direction of the PCB to provide a multilayer PCB.

[0094] Wherein, at least one conductive trace connected to a second segment of the PCB is provided in the first segment of the PCB, characterized in that the PCB includes: a cut-off portion, located in the PCB, the cut-off portion decouples one or more of the at least one conductive trace from the current of at least one conductive trace in the second segment of the PCB; and a decoupling element, configured to provide frequency-dependent coupling of the one or more of the at least one conductive trace.

[0095] The hearing device that replaces the first aspect can have similar advantages to the hearing device of the first aspect of the present invention. Any features and / or embodiments described with respect to the first aspect can be equally applied to replace the first aspect.

[0096] In some embodiments, a cut-off portion is provided in a first segment of the PCB.

[0097] In some embodiments, the cut-off portion extends laterally from a groove in a first segment of the PCB to the outside of the first segment of the PCB.

[0098] In some embodiments, a first segment of the PCB includes a first lateral side and a second lateral side, the first lateral side extending between a groove and a first edge of the first segment, and the second lateral side extending between a groove and a second edge of the first segment.

[0099] The first segment includes: a proximal segment connecting to the second segment; and a distal segment opposite the proximal segment in the longitudinal direction.

[0100] In the first lateral side portion, one or more conductive traces are provided at the distal end of the pickup coil in the longitudinal direction for an assembly arranged in the distal segment.

[0101] In some embodiments, a portion of the first segment of the PCB extending from one edge of the first segment to the opposite edge of the first segment has no vias. At least a portion of the first segment of the PCB may be adjacent to a pickup coil.

[0102] In some embodiments, the cut-off portion is arranged to decouple the current of a first segment of the PCB from that of a second segment of the PCB, and wherein the decoupling element further includes at least one inductive decoupling element, the at least one inductive decoupling element being arranged to connect one or more (e.g., each) of at least one trace of the first segment to the second segment.

[0103] In some embodiments, a first segment of the PCB is flexibly connected to a second segment.

[0104] In some embodiments, the first section is further flexible around its portion.

[0105] The second frequency band can be a radio frequency band.

[0106] A second aspect of the present invention relates to a method of manufacturing a hearing device, comprising the following steps:

[0107] Provide a pickup coil for communication in the first frequency band;

[0108] Provide wireless communication equipment for use in a second frequency band;

[0109] A printed circuit board (PCB) is provided, the PCB comprising at least one conductive layer and at least one dielectric layer;

[0110] A first conductive trace is provided in the conductive layer of the first segment of the PCB;

[0111] A second conductive trace is provided in the conductive layer of the second segment of the PCB;

[0112] The pickup coil is arranged in the first section of the PCB;

[0113] The wireless communication device is arranged in a second section of the PCB; wherein, the method further includes the following steps:

[0114] A coupling element is provided, the coupling element having a first end and a second end;

[0115] A cut-off portion is provided in the PCB to decouple the current of the first conductive trace from that of the second conductive trace;

[0116] Connect the first end of the coupling element to the first conductive trace;

[0117] The second end of the coupling element is connected to the second conductive trace, wherein the coupling element is configured to provide frequency-dependent coupling between the first conductive trace and the second conductive trace.

[0118] The method according to the second aspect can provide similar or identical advantages to those described with respect to the hearing device according to the first aspect and / or the hearing device that is an alternative to the first aspect.

[0119] Correspondingly, any embodiments or features described with respect to the first aspect and the hearing device and / or the hearing device that is an alternative to the first aspect can be equally applied to the method according to the second aspect of the invention.

[0120] In some embodiments, the method according to the second aspect may be a method for manufacturing a hearing device according to the first aspect of the invention.

[0121] It should be understood that the method steps can be provided in any order. Specifically, it should be understood that the steps of providing a pickup coil, providing a wireless communication device, providing a PCB, and providing a coupling element can be provided in any order. After the step of providing the PCB, the steps of providing a first conductive trace, providing a second conductive trace, and providing a cut-off portion in the PCB can be performed in any order. Furthermore, after the steps of providing the pickup coil and the PCB, the step of arranging the pickup coil can be performed; and after the steps of providing the wireless communication device and the PCB, the step of arranging the wireless communication device can be performed. Similarly, after the steps of providing the coupling element, the PCB, and the first and second traces, the step of connecting the first and second ends of the coupling element can be performed.

[0122] An alternative second aspect of the invention relates to a method of manufacturing a hearing device, comprising the following steps:

[0123] Provide a pickup coil for communication in the first frequency band;

[0124] Provide wireless communication equipment for use in a second frequency band;

[0125] A printed circuit board (PCB) is provided, the PCB comprising at least one conductive layer and at least one dielectric layer;

[0126] The pickup coil is placed in a recess in the first section of the PCB, and the wireless communication device is placed in the second section of the PCB.

[0127] Each of at least one conductive layer and at least one dielectric layer extends in the longitudinal and transverse directions of the PCB, and the at least one conductive layer and at least one dielectric layer are arranged adjacent to each other in the vertical direction of the PCB to provide a multilayer PCB.

[0128] Wherein, at least one conductive trace connected to a second segment of the PCB is provided in a first segment of the PCB, characterized in that the PCB includes: a cut-off portion, located in the PCB, the cut-off portion decouples one or more of the at least one conductive trace from the current of at least one conductive trace in the second segment of the PCB; and a decoupling element, configured to provide frequency-dependent coupling of one or more of the at least one conductive trace.

[0129] The method according to the alternative to the second aspect can provide similar or identical advantages to those described with respect to the hearing device according to the first aspect, the hearing device according to the alternative to the first aspect, and / or the method according to the second aspect.

[0130] Correspondingly, any embodiments or features described with respect to the hearing device according to the first aspect, the hearing device according to an alternative to the first aspect, and / or the method according to the second aspect can be equally applied to the method according to the second aspect of the invention.

[0131] In some embodiments, the method according to the alternative to the second aspect may be a method for manufacturing a hearing device according to the alternative to the first aspect of the invention.

[0132] Different aspects of the invention can be implemented in various ways including the hearing device and the method of manufacturing the hearing device described above and below, each way obtaining one or more of the benefits and advantages described in at least one of the aspects described above, and each way having one or more preferred embodiments corresponding to the preferred embodiments described in at least one of the aspects described above and / or disclosed in the dependent claims. Furthermore, it should be understood that embodiments described in connection with one of the aspects described herein are equally applicable to the other aspects.

[0133] Those skilled in the art will understand that any one or more of the foregoing aspects of this disclosure and their embodiments may be combined with any one or more of the other aspects and embodiments of this disclosure. Attached Figure Description

[0134] In the following description, embodiments of the invention will be described with reference to the accompanying drawings, wherein:

[0135] Figure 1 An embodiment of the hearing device according to the invention is shown during use;

[0136] Figure 2 Show Figure 1 A cross-sectional view of a portion of the hearing device in an embodiment of the hearing device shown;

[0137] Figure 3 A perspective view showing an embodiment of a prior art hearing device;

[0138] Figure 4 Show Figure 3 The Smith chart of existing hearing devices is shown.

[0139] Figure 5 Show Figure 3 The Bode plot of the prior art hearing device is shown below;

[0140] Figure 6 Show Figure 1 and Figure 2 A perspective view of an embodiment of the hearing device shown;

[0141] Figure 7 Show Figure 6 The Smith chart of existing hearing devices is shown.

[0142] Figure 8 Show Figure 6 The Bode plot of the prior art hearing device is shown below;

[0143] Figure 9 A perspective view showing another embodiment of the hearing device according to the present invention;

[0144] Figure 10 Show Figure 9 A Smith chart of an embodiment of the hearing device shown;

[0145] Figure 11 Show Figure 9 Bode plot of an embodiment of the hearing device shown;

[0146] Figure 12 A flowchart illustrating a method for manufacturing a hearing device according to the present invention is shown.

[0147] Similar reference numerals are used for similar elements across the various embodiments and figures described herein. Detailed Implementation

[0148] The invention will now be described in more detail below with reference to the accompanying drawings illustrating embodiments thereof. However, the invention may be embodied in many different forms within the scope of the appended and set forth claims, and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided for thoroughness and completeness.

[0149] Figure 1 , Figure 2 and Figure 6 An embodiment of the hearing device 1 according to the present invention is shown.

[0150] The hearing device 1 includes: a pickup coil 7 for communication in a first frequency band; and a wireless communication device for communication in a second frequency band. The wireless communication device is contained in the processor 21.

[0151] The hearing device 1 also includes a printed circuit board (PCB) 3, which includes at least one conductive layer and at least one dielectric layer.

[0152] The pickup coil 7 is arranged in the first segment 31 of the PCB, and the wireless communication device, shown in this embodiment as being included in the processor 21, is arranged in the second segment 32 of the PCB. The conductive layer includes a first conductive trace provided in the first segment 31 of the PCB and a second conductive trace provided in the second segment 32 of the PCB.

[0153] In other embodiments, processor 21 may be or may include a wireless communication device. In yet another embodiment, the processor may be omitted, and the wireless communication device may be a separate device.

[0154] The hearing device 1 also includes a coupling element 4 having a first end and a second end.

[0155] Furthermore, the hearing device includes a cut-off section 17, which current-decouples a first conductive trace from a second conductive trace. A first end of a coupling element 4 is connected to the first conductive trace, and a second end of the coupling element is connected to the second conductive trace. The coupling element 4 is configured to provide frequency-dependent coupling between the first and second conductive traces.

[0156] exist Figure 1 In the illustrated embodiment, the hearing device 1 is shown as a BTE hearing aid, which is placed outside the outer ear 2 of the user wearing the BTE hearing aid.

[0157] The hearing device includes a housing 11, which is configured to house a PCB, a pickup coil 7, a wireless communication device, and a coupling element 4. The housing 11 is configured to surround and / or encapsulate the PCB 3, the pickup coil 7, the wireless communication device 4 contained in the processor 21, and the coupling element 4.

[0158] Figure 2 Show Figure 1 A cross-sectional view of a portion of an embodiment of the hearing device 1 shown, and Figure 6 A perspective view of the hearing device 1 without its casing 11 is shown.

[0159] exist Figure 2 The diagram shows a current loop 10 occurring in PCB 3 based on the first trace, although interrupted by cut-off portion 17 and coupling element 4, thus providing current decoupling.

[0160] PCB 3 also includes a sub-segment of the first segment 31 of PCB 3. The sub-segment of the first segment 31 is adjacent to and extends from the pickup coil 7 to surround at least a portion of the periphery of the pickup coil 7. The sub-segment is a via-less sub-segment 6 (i.e., a segment without vias), such as... Figure 2 As shown.

[0161] The hearing device 1 includes an acoustic transducer in the form of a front microphone 5 for facing forward at least during use of the hearing device 1; and a rear microphone 8 for facing backward and disposed at the distal end of the front microphone 5 relative to the user's face.

[0162] The hearing device 1 can be configured to be battery powered (i.e., configured to be powered by a battery (not shown) (e.g., a rechargeable battery or a button cell battery (e.g., a zinc-air battery)). The hearing device housing 11 is configured to house the battery.

[0163] The hearing device 1 includes battery terminals 14 (e.g., a positive terminal and a negative terminal) for connecting to a battery and receiving battery power signals for operating the hearing device 1.

[0164] The hearing device 1 also includes a magnetic induction (MI) coil 16.

[0165] The hearing device 1 also includes an antenna 14, which is configured to facilitate the transmission and / or reception of wireless communication signals to and / or from a wireless communication device in a second frequency band. The antenna 14 is connected to the PCB 3 of the hearing device 1. The second frequency band is a 2.4 GHz band extending from 2.0 GHz to 3.0 GHz, such as... Figure 7 The Smith chart shown and the frequency response of hearing device 1 in the frequency range from 2.0 GHz to 3.0 GHz are illustrated. Figure 8 The Bode plot is shown in the figure.

[0166] The pickup coil is arranged in the groove 18 in the first section 31 of PCB 3.

[0167] PCB 3 has a lateral direction W, a longitudinal direction L and a transverse direction T, and the cut-out portion of the PCB extends in the lateral direction W.

[0168] The pickup coil 7 is arranged such that the first section 31 substantially surrounds the periphery of the pickup coil except for the cut-off portion 17 (i.e., in the plane stretched in the longitudinal direction L and the transverse direction W). The groove 18 is an opening connected to the cut-off portion 17.

[0169] PCB 3 is longer in the vertical direction L than in the horizontal direction W.

[0170] PCB 3 is flexible and includes a bend 19 between the first segment 31 and the second segment 32 of PCB 3.

[0171] At least one conductive layer and at least one dielectric layer are disposed on top of each other in the vertical direction T. At least one conductive layer may contact the dielectric layer in the longitudinal direction L and the transverse direction W of the PCB.

[0172] The cut-out portion 17 extends from the groove 18 in the first section 31 of the PCB to the edge of the first section 31 of the PCB.

[0173] Therefore, current decoupling can be provided on one side of the pickup coil in the lateral direction, thereby preventing DC loop 10, since no current connection is provided on this side of the pickup coil 7.

[0174] The edge is the edge of the transverse W of the pickup coil.

[0175] The coupling element 4 is a capacitive coupling element and includes a capacitor, particularly a single capacitor. In other embodiments, the coupling element 4 may include multiple capacitors and / or may be an inductive coupling element.

[0176] The first section 31 of the PCB is adjacent to the pickup coil 7.

[0177] Figure 3 A perspective view showing an embodiment of a prior art hearing device 1'. (As shown) Figure 3 As shown, the prior art hearing device 1' also includes microphones 5 and 8, a processor 21 containing wireless communication devices, an MI coil 16, an antenna 12, and a battery contact 14.

[0178] The existing hearing device 1' also includes a PCB 3', which includes a first segment 31' and a second segment 32 and has a bend 19. PCB 3' and Figure 1 , Figure 2 and Figure 6 The PCB 3 of the hearing device 1 shown is the same, except that no cut-off portion is provided in the first section 31' of PCB 3' or other places in PCB 3'.

[0179] A further difference between the prior art hearing device 1' and the hearing device 1 according to the present invention is that the prior art hearing device 1' does not provide a coupling element.

[0180] Figure 4 Show Figure 3 The prior art hearing device 1' shown is a Smith chart, and Figure 5 Show Figure 3 The Bode plot of the prior art hearing device 1' is shown. From... Figure 4 and Figure 5 It can be seen that the unwanted resonance 30 occurs at around 2.2 GHz in the prior art hearing device 1'.

[0181] As has been recognized in this invention, this can be mitigated by the following operation: introducing Figure 1 , Figure 2 and Figure 6 The cut-off portion 17 and coupling element 4 of the hearing device 1 shown prevent unwanted resonance 30 from occurring. Figure 7 and Figure 8 As can be seen in the Smith chart and Bode plot shown respectively.

[0182] Figure 9 A perspective view showing another embodiment of the hearing device 1'' is shown. Figure 1 , Figure 2 and Figure 6 The hearing device 1 shown in the embodiment is similar to the prior art hearing device 1'. Figure 9 The hearing device 1'' of the illustrated embodiment includes microphones 5 and 8, a processor 21 containing wireless communication devices, an MI coil 16, an antenna 12, and a battery contact 14.

[0183] Hearing device 1'' also includes PCB 3'', which includes a first segment 31' and a second segment 32, the second segment being identical to the second segment 32 of hearing devices 1 and 1'. The first segment 31' and... Figure 3 The first segment 31' of the prior art hearing device 1' shown is the same.

[0184] The hearing device 1'' also includes a cut-off section 17'. The cut-off section 17' is arranged between the first section 31' and the second section 32 of the PCB 3'', and separates the first section 31' and the second section 32.

[0185] The hearing device 1'' also includes a coupling element 4'.

[0186] The coupling element 4' is an inductive coupling element in the form of a single inductor.

[0187] Although no housing is shown, it should be understood that hearing devices 1' and 1'' may similarly include housings that are similar to or the same as housing 11.

[0188] The Smith chart of hearing device 1'' is shown below. Figure 10 And showing the Bode plot of hearing device 1'' Figure 11 As shown, this also provides a hearing device in which unwanted resonances 30 present in prior art hearing devices 1' are mitigated in the frequency band from 2.0 GHz to 3.0 GHz.

[0189] Figure 12 A flowchart of a method 9 for manufacturing a hearing device according to the present invention is shown.

[0190] Method 9 includes the following steps:

[0191] Provide (90) a pickup coil for communication in the first frequency band;

[0192] Provide (91) wireless communication equipment for communication in a second frequency band;

[0193] Provided (92) a printed circuit board (PCB), the PCB including at least one conductive layer and at least one dielectric layer;

[0194] A first conductive trace (93) is provided in the conductive layer of the first segment of the PCB;

[0195] A second conductive trace (94) is provided in the conductive layer of the second segment of the PCB;

[0196] Arrange the pickup coil (95) in the first section of the PCB;

[0197] The wireless communication device is arranged (96) in the second section of the PCB;

[0198] Provide (97) a coupling element having a first end and a second end;

[0199] A cut-off section (98) is provided in the PCB, which decouples the current of the first conductive trace from that of the second conductive trace.

[0200] Connect the first end of the coupling element (99) to the first conductive trace; and

[0201] The second end of the coupling element is connected (100) to the second conductive trace, wherein the coupling element is configured to provide frequency-dependent coupling between the first conductive trace and the second conductive trace.

[0202] Although shown in sequence, it should be understood that steps 90-100 can be performed in any order. For example, any of steps 90, 91, 92, and 97 can be performed simultaneously or in any order. Alternatively or additionally, any of steps 93-96 and 98-100 can be performed in any order or simultaneously following step 92.

[0203] Method 9 can be a method for manufacturing hearing device 1 or 1''.

[0204] While some embodiments have been described in detail and illustrated, the invention is not limited to these embodiments, but may be embodied in other ways within the scope of the subject matter defined in the appended claims. Specifically, it should be understood that other embodiments may be utilized, and structural and functional modifications may be made without departing from the scope of the invention.

[0205] In an apparatus claim that enumerates several means, several of these means may be embodied by one and the same hardware. The mere fact that a particular measure is stated in mutually different dependent claims or described in different embodiments does not indicate that combinations of these measures cannot be advantageously used.

[0206] It should be emphasized that the term "comprises / comprising" as used in this specification is used to specify the presence of the stated features, integers, steps, or components, but does not exclude the presence or addition of one or more other features, integers, steps, components, or groups thereof.

[0207] List of reference numerals

[0208] 1 Hearing equipment

[0209] 1' Existing Hearing Devices

[0210] 1'' Hearing equipment

[0211] 2 outer ears

[0212] 3PCB

[0213] 3'PCB

[0214] 3'' PCB

[0215] 4 coupling elements

[0216] 4' coupling element

[0217] 5 front microphones

[0218] 6 No section past Confucius

[0219] 7 pickup coils

[0220] 8 rear microphones

[0221] 10 DC loop

[0222] 11. Shell

[0223] 12 antennas

[0224] 14 battery contacts

[0225] 16 magnetic induction (MI) coils

[0226] 17PCB Removal Section

[0227] 17' PCB cut-off section

[0228] 18 grooves

[0229] 19PCB Bending Section

[0230] 21 processor

[0231] 30 Unwanted Resonance

[0232] 31 First Section

[0233] 31' First Section

[0234] 32 Second Section

[0235] 9 methods

[0236] 90 Methods and Steps

[0237] 91 Methods and Steps

[0238] 92 Methods and Steps

[0239] 93 Methods and Steps

[0240] 94 Methods and Steps

[0241] 95 Methods and Steps

[0242] 96 Methods and Steps

[0243] 97 Methods and Steps

[0244] 98 Methods and Steps

[0245] 99 Methods and Steps

[0246] 100 methods and steps

[0247] L longitudinal direction

[0248] T Vertical direction

[0249] W horizontal direction

[0250] entry

[0251] 1. A hearing device, comprising

[0252] A pickup coil, used for communication in the first frequency band;

[0253] Wireless communication equipment for communication in a second frequency band;

[0254] A printed circuit board (PCB) includes at least one conductive layer and at least one dielectric layer, wherein the pickup coil is disposed in a recess in a first segment of the PCB, and the wireless communication device is disposed in a second segment of the PCB.

[0255] Each of the at least one conductive layer and the at least one dielectric layer extends in both the longitudinal and transverse directions of the PCB, and the at least one conductive layer and the at least one dielectric layer are arranged adjacent to each other in the vertical direction of the PCB to provide a multilayer PCB.

[0256] Wherein, at least one conductive trace connected to a second segment of the PCB is provided in a first segment of the PCB, characterized in that the PCB includes: a cut-off portion, located in the PCB, the cut-off portion decouples one or more of the at least one conductive trace from the current of at least one conductive trace in the second segment of the PCB; and a decoupling element, configured to provide frequency-dependent coupling of the one or more of the at least one conductive trace.

[0257] 2. The hearing device as described in item 1, wherein the cut-off portion is provided in a first section of the PCB.

[0258] 3. The hearing device as described in item 2, wherein the cut-off portion extends in the transverse direction from a groove in the first segment of the PCB to the outside of the first segment of the PCB.

[0259] 4. The hearing device as described in item 2 or 3, wherein the decoupling element is a capacitive decoupling element connected to both ends of the cut-off portion, such that frequency-dependent coupling is provided in the first segment for frequencies in the second frequency band.

[0260] 5. The hearing device as described in item 4, wherein the capacitive decoupling element is a capacitor.

[0261] 6. The hearing device as described in any of the preceding entries, wherein a first segment of the PCB includes a first lateral side and a second lateral side, the first lateral side extending between the groove and a first edge of the first segment, and the second lateral side extending between the groove and a second edge of the first segment.

[0262] The first segment includes: a proximal segment connected to the second segment; and a distal segment opposite to the proximal segment in the longitudinal direction.

[0263] In the first lateral side portion, one or more conductive traces are provided at the distal end of the pickup coil in the longitudinal direction for components to be arranged in the distal segment.

[0264] 7. The hearing device as described in any of the preceding entries, wherein a portion of the first segment of the PCB extending from one edge of the first segment to the opposite edge of the first segment is free of vias.

[0265] 8. The hearing device as described in item 7, wherein at least a portion of a first segment of the PCB is adjacent to the pickup coil.

[0266] 9. The hearing device as described in any of the preceding entries, wherein the cut-off portion is arranged to decouple the first segment of the PCB from the second segment of the PCB, and wherein the decoupling element further comprises at least one inductive decoupling element, the at least one inductive decoupling element being arranged to connect one or more (e.g., each) of the at least one trace of the first segment to the second segment.

[0267] 10. The hearing device as described in any of the preceding entries, wherein the first segment of the PCB is flexibly connected to the second segment.

[0268] 11. The hearing device as described in any of the preceding entries, wherein the first segment is further flexible around its portion.

[0269] 12. The hearing device as described in any of the preceding entries, wherein the second frequency band is a radio frequency band.

[0270] 13. The hearing device as described in any of the preceding entries, wherein the hearing device is a hearing aid such as a behind-the-ear BTE hearing aid.

[0271] 14. The hearing device as described in any of the preceding entries, wherein at least one transducer is further disposed in the first segment of the PCB.

[0272] 15. A method for manufacturing a hearing device, comprising the following steps:

[0273] Provide a pickup coil for communication in the first frequency band;

[0274] Provide wireless communication equipment for use in a second frequency band;

[0275] A printed circuit board (PCB) is provided, the PCB comprising at least one conductive layer and at least one dielectric layer;

[0276] The pickup coil is arranged in a recess in the first section of the PCB, and the wireless communication device is arranged in the second section of the PCB.

[0277] Each of the at least one conductive layer and the at least one dielectric layer extends in both the longitudinal and transverse directions of the PCB, and the at least one conductive layer and the at least one dielectric layer are arranged adjacent to each other in the vertical direction of the PCB to provide a multilayer PCB.

[0278] Wherein, at least one conductive trace connected to a second segment of the PCB is provided in a first segment of the PCB, characterized in that the PCB includes: a cut-off portion, located in the PCB, the cut-off portion decoupling one or more of the at least one conductive trace from the current of at least one conductive trace in the second segment of the PCB; and a decoupling element configured to provide frequency-dependent coupling of the one or more of the at least one conductive trace.

Claims

1. A hearing device, comprising: A pickup coil, used for communication in the first frequency band; Wireless communication equipment for communication in a second frequency band; A printed circuit board (PCB) includes at least one conductive layer and at least one dielectric layer, wherein... The pickup coil is arranged in a first segment of the PCB, and the wireless communication device is arranged in a second segment of the PCB, wherein the conductive layer includes a first conductive trace disposed in the first segment of the PCB and a second conductive trace disposed in the second segment of the PCB; characterized in that the PCB comprises: The coupling element has a first end and a second end; and The cut-off portion decouples the current of the first conductive trace from that of the second conductive trace, wherein a first end of the coupling element is connected to the first conductive trace, and a second end of the coupling element is connected to the second conductive trace, wherein the coupling element is configured to provide frequency-dependent coupling between the first conductive trace and the second conductive trace.

2. The hearing device as described in claim 1, wherein, The pickup coil is arranged in a groove in the first section of the PCB.

3. The hearing device as described in claim 1 or 2, wherein, The PCB has a horizontal direction, a vertical direction, and a perpendicular direction, and The cut-out portion of the PCB extends in the lateral direction.

4. The hearing device as described in claim 3, wherein, The cut-off portion extends from a groove in the first segment of the PCB to the edge of the first segment of the PCB.

5. The hearing device as described in any one of claims 1-4, wherein, The coupling element is a capacitive coupling element, which is connected to both ends of the resected portion. The capacitive coupling element is configured to provide frequency-dependent coupling in the first segment for frequencies in the second frequency band.

6. The hearing device as described in claim 5, wherein, The first end of the capacitive coupling element is connected to the first conductive trace, and the second end of the capacitive coupling element is connected to the second conductive trace.

7. The hearing device as described in claim 5 or 6, wherein, The capacitive coupling element is a capacitor.

8. The hearing device as described in any one of claims 1-4, wherein, The coupling element is an inductive coupling element. The inductive coupling element is configured to provide frequency-dependent coupling in the first segment for frequencies in the second frequency band.

9. The hearing device as claimed in any of the preceding claims, wherein, At least a portion of the first section of the PCB is adjacent to the pickup coil.

10. The hearing device as claimed in any of the preceding claims, wherein, The second frequency band is the radio frequency band.

11. The hearing device as claimed in any of the preceding claims, wherein, The first frequency band is the baseband.

12. The hearing device as claimed in any of the preceding claims, wherein, The hearing device is a hearing aid, such as a behind-the-ear BTE hearing aid.

13. The hearing device as claimed in any of the preceding claims, wherein, At least one acoustic transducer is arranged in the first section of the PCB.

14. The hearing device as claimed in any of the preceding claims, wherein, The PCB is a multilayer PCB.

15. A method for manufacturing a hearing device, comprising the following steps: Provide a pickup coil for communication in the first frequency band; Provide wireless communication equipment for use in a second frequency band; A printed circuit board (PCB) is provided, the PCB comprising at least one conductive layer and at least one dielectric layer; A first conductive trace is provided in the conductive layer of the first segment of the PCB; A second conductive trace is provided in the conductive layer of the second segment of the PCB; The pickup coil is arranged in the first section of the PCB; The wireless communication device is arranged in the second section of the PCB; characterized by the following steps: A coupling element is provided, the coupling element having a first end and a second end; A cut-off portion is provided in the PCB to decouple the current of the first conductive trace from that of the second conductive trace; Connect the first end of the coupling element to the first conductive trace; The second end of the coupling element is connected to the second conductive trace, wherein the coupling element is configured to provide frequency-dependent coupling between the first conductive trace and the second conductive trace.

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