SMT reflow soldering processing method

By employing standardized PCB pretreatment, precise solder paste application, accurate component placement, and segmented reflow soldering processes, combined with a nitrogen protective atmosphere, the high soldering defect rate problem in existing technologies has been solved, achieving high-efficiency soldering quality and a high pass rate, making it suitable for large-scale production.

CN122269587APending Publication Date: 2026-06-23CHONGQING TAIJIDA ELECTRONIC TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHONGQING TAIJIDA ELECTRONIC TECH CO LTD
Filing Date
2026-03-13
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In existing SMT reflow soldering methods, incomplete PCB pretreatment, uneven solder paste application, inaccurate component placement, unreasonable reflow soldering temperature control, and incomplete finished product inspection result in high soldering defect rates, low processing pass rates, and long production costs and cycles.

Method used

By employing standardized PCB pretreatment, precise solder paste application, accurate component placement, and segmented reflow soldering processes, combined with a nitrogen protective atmosphere, high-precision visual inspection, and standardized rework procedures, we ensure soldering quality.

Benefits of technology

It significantly improves welding quality stability, reduces welding defect rate, increases processing qualification rate, is suitable for large-scale mass production, and reduces production costs and labor intensity.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The application discloses a kind of SMT reflow soldering processing methods, to solve the problems of many defects, unstable quality, low processing efficiency of existing SMT reflow soldering processing.The method includes five steps: PCB pretreatment, remove surface impurities and moisture by cleaning and drying;Solder paste coating, control parameters to ensure uniform coating, cooperate with visual inspection to remove unqualified products;Chip positioning, accurately place components by chip mounter and secondary detection;Segmented reflow soldering, heating in stages according to the preset temperature curve, nitrogen protection atmosphere to ensure reliable welding;Finished product detection and post-processing, identify defects by AOI detection and standard repair, cleaning.The application can significantly improve the stability of welding quality, form reliable welded joints, improve the processing qualification rate, adapt to large-scale batch production, reduce production cost, with high practicality and popularization value.
Need to check novelty before this filing date? Find Prior Art