Cooling of electronics for data centers

Abstract

An electronic device enclosure system includes an enclosure, one or more electronic device supports positioned within the enclosure, and a cooling system for cooling the one or more electronic device supports. The cooling system includes a plurality of injection nozzles positioned within the enclosure and configured to inject cooling fluid onto the electronic device supports to cool them. The plurality of injection nozzles are operatively connected to a vapor compression circuit configured to cool the cooling fluid. A method of cooling an electronic device support includes positioning one or more electronic device supports within the enclosure, operating the cooling system to inject cooling fluid from the plurality of injection nozzles positioned within the enclosure onto the electronic device supports to cool them, and cooling the cooling fluid via a vapor compression circuit operatively connected to the plurality of injection nozzles.

Description

Technical Field

[0001] Exemplary embodiments relate to the field of cooling systems, and particularly to the cooling of electronic device enclosures (such as those used in data centers). Background Technology

[0002] The increased power density of next-generation semiconductors used in data centers leads to increased cooling demands. Various methods exist for cooling semiconductors, such as convection cooling, immersion cooling, or circulating coolant around the semiconductor chip via a coolant distribution unit. However, these methods typically require complex architectures. A relatively simple solution for cooling these increasingly demanding data center and other electronic devices is welcome in this field. Summary of the Invention

[0003] In one exemplary embodiment, an electronic device enclosure system includes an enclosure, one or more electronic device supports positioned within the enclosure, and a cooling system for cooling the one or more electronic device supports. The cooling system includes a plurality of injection nozzles positioned within the enclosure and configured to inject cooling fluid onto the electronic device supports to cool them. The plurality of injection nozzles are operatively connected to a vapor compression circuit configured to cool the cooling fluid.

[0004] Alternatively or in this embodiment or other embodiments, the electronic device holder is at least partially immersed in a cooling fluid pool within the enclosure.

[0005] Alternatively or in this embodiment or other embodiments, the cooling fluid is a refrigerant that circulates through a vapor compression circuit.

[0006] Alternatively or in this embodiment or other embodiments, the refrigerant is directed to the compressor in the vapor compression circuit as it leaves the casing.

[0007] Alternatively or in this embodiment or other embodiments, the cooling fluid manifold is configured to distribute cooling fluid to a plurality of injection nozzles.

[0008] Alternatively or in this embodiment or other embodiments, the cooling fluid emitted from the plurality of jet nozzles is in the liquid phase.

[0009] Alternatively or in this embodiment or other embodiments, the enclosure is a plurality of enclosures, and the plurality of enclosures are connected in a fluid parallel arrangement.

[0010] Alternatively or in this embodiment or other embodiments, multiple electronic device supports are positioned within a housing, and multiple nozzles are configured to spray cooling fluid onto the multiple electronic device supports.

[0011] Alternatively or in this embodiment or other embodiments, the intermediate heat exchanger is configured to exchange heat energy between the cooling fluid and the refrigerant in the vapor compression circuit.

[0012] Alternatively or in this embodiment or other embodiments, the electronic device holder is sealed to prevent cooling fluid from entering the electronic device holder.

[0013] In another exemplary embodiment, a method of cooling an electronic device holder includes positioning one or more electronic device holders in a housing, operating a cooling system to spray cooling fluid from a plurality of nozzles positioned inside the housing onto the electronic device holders to cool the electronic device holders, and cooling the cooling fluid via a vapor compression circuit operably connected to the plurality of nozzles.

[0014] Alternatively or in this embodiment or other embodiments, the electronic device holder is at least partially immersed in a cooling fluid pool within the enclosure.

[0015] Alternatively or in this embodiment or other embodiments, the cooling fluid is a refrigerant that circulates through a vapor compression circuit.

[0016] Alternatively or in this embodiment or other embodiments, the refrigerant is directed to the compressor in the vapor compression circuit as it leaves the casing.

[0017] Alternatively or in other embodiments, in this embodiment or other embodiments, cooling fluid is distributed to a plurality of injection nozzles via a cooling fluid manifold.

[0018] Alternatively or in this embodiment or other embodiments, the cooling fluid is emitted in a liquid phase from a plurality of injection nozzles.

[0019] Alternatively or in this embodiment or other embodiments, the enclosure is a plurality of enclosures, and the plurality of enclosures are connected in a fluid parallel arrangement.

[0020] Alternatively or in this embodiment or other embodiments, multiple electronic device supports are positioned within a housing, and cooling fluid is sprayed from multiple nozzles onto the multiple electronic device supports.

[0021] Alternatively or in this embodiment or other embodiments, thermal energy is exchanged between the cooling fluid and the refrigerant in the vapor compression circuit via an intermediate heat exchanger.

[0022] Alternatively or in this embodiment or other embodiments, the electronic device holder is sealed to prevent cooling fluid from entering the electronic device holder. Attached Figure Description

[0023] The following description should not be considered as limiting in any way. Referring to the accompanying drawings, similar element numbers are similar: Figure 1 This is a schematic illustration of an exemplary embodiment of a cooling system for arranging electronic components; Figure 2 This is a schematic illustration of another exemplary embodiment of a cooling system for arranging electronic components; Figure 3 This is a schematic illustration of yet another exemplary embodiment of a cooling system for arranging electronic components; and Figure 4 This is a schematic illustration of yet another exemplary embodiment of a cooling system for arranging electronic components. Detailed Implementation

[0024] Referring to the figures, a detailed description of one or more embodiments of the disclosed devices and methods is presented herein by way of example and not limitation.

[0025] Now for reference Figure 1 The illustration shows an exemplary embodiment of an electronic device housing 10 that includes, for example, an electronic device support 12 comprising one or more semiconductor devices. The housing 10 is configured to contain a container for holding a volume of cooling fluid therein. The housing 10 includes at least one cooling fluid inlet 14 and a cooling fluid outlet 16. In some embodiments, the cooling fluid outlet 16 is configured as a discharge portion and is located at the vertical bottom portion 18 of the housing 10.

[0026] The inlet manifold 20 is configured to distribute cooling fluid to a plurality of injection nozzles 22 via a cooling fluid passage 24 extending from the inlet manifold 20. In some embodiments (such as...) Figure 1 In the embodiment shown, the inlet manifold 20 is located outside the housing 10, wherein the cooling fluid passage 24 extends into the housing 10 via the cooling fluid inlet 14. However, in other embodiments, the inlet manifold 20 may be located inside the housing 10.

[0027] The jet nozzle 22 is configured to directly spray cooling fluid onto the electronic device holder 12 to cool the electronic device holder 12 and the semiconductor devices therein. In some embodiments, the volume of the cooling fluid is such that a cooling fluid pool 44 is located at the bottom of the enclosure 10, and the electronic device holder 12 is at least partially immersed in the cooling fluid pool 44. In some embodiments, the electronic device holder 12 is sealed to protect the electronic components therein from moisture. This combination of impingement cooling via the jet nozzle 22 and immersion cooling via the cooling fluid pool 44 is highly effective in maintaining the electronic device holder 12 at a selected operating temperature.

[0028] In some embodiments, the cooling fluid is a refrigerant, and the housing 10 is integrated into a vapor compression circuit 26. The vapor compression circuit 26 includes a compressor 28 that compresses the refrigerant and directs it to a condenser 30, which outputs liquid refrigerant to the housing 10, which is maintained at a pressure lower than the refrigerant's saturation pressure. The liquid refrigerant enters the housing 10 and is sprayed onto the electronics support 12 via a spray nozzle 22. The refrigerant absorbs heat from the electronics support 12, thus cooling it, and undergoes a vapor phase change. The vaporized refrigerant then exits the housing 10 via a cooling fluid outlet 16 and is directed to the compressor 28 via a return path 32 to repeat the circuit. Exemplary refrigerants may include one or more of R513A, R1233zd(E), and R515B. However, those skilled in the art will readily appreciate that the listed refrigerant materials are merely exemplary and other refrigerant materials may be used.

[0029] In some embodiments (such as) Figure 2 In the embodiment illustrated in the figure, the enclosure 10 may include a plurality of electronic device supports 12, wherein one or more spray nozzles 22 are configured to spray cooling fluid onto each of the electronic device supports 12. In other embodiments (such as...) Figure 3 In the embodiment illustrated in the figure, multiple enclosures 10 (each containing one or more electronic component supports 12) are connected in series or alternatively in parallel as illustrated to a vapor compression circuit 26. One or more cooling fluid valves 34 are operable to selectively direct cooling fluid or refrigerant into each of the enclosures 10. The cooling fluid valves 34 may be operablely connected to a controller 36 that commands the position of the valves 34 based on, for example, a detected temperature of the electronic component support 12 in each of the enclosures 10. The temperature may be detected via one or more temperature sensors 42 disposed at each of the electronic component supports 12, or alternatively via, for example, a thermal imager 46 positioned to detect the temperature distribution in each of the enclosures 10. The controller 36 may be connected to the temperature sensors 42 and / or the thermal imager 46 and is operable to automatically open selected valves 34 to direct a larger volume of cooling fluid toward the electronic component support 12 with a higher detected temperature.

[0030] Figure 4Another embodiment is illustrated in the figure. This embodiment uses an intermediate heat exchanger 40 to transfer heat between the refrigerant flow and the cooling fluid circuit 38 in the vapor compression circuit 26. The cooling fluid circuit 38 circulates the cooling fluid (in some embodiments, a dielectric fluid) through the casing 10 to cool the electronic device holder 12 via the jet nozzle 22. The cooling fluid then exits the casing 10 through the cooling fluid outlet 16 and is guided to the secondary heat exchanger 36 via the return path 32. At the secondary heat exchanger 36, the refrigerant flow exchanges heat with the cooling fluid, which converts the refrigerant into a vapor phase while simultaneously cooling the cooling fluid flow. The refrigerant flow returns from the secondary heat exchanger 36 to the compressor 28 to complete the loop.

[0031] The construction disclosed in this paper provides a simple, cost-effective, and reliable system for achieving high heat transfer rates to cool electronic components in data centers. A properly sealed system also eliminates problems caused by moisture.

[0032] The term “about” is intended to include the degree of error associated with a specific quantity of measurement based on the equipment available at the time of application submission.

[0033] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the terms “comprises” and / or “comprising”, when used in this specification, specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0034] While this disclosure has been described with reference to one or more exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for its elements without departing from the scope of this disclosure. Furthermore, many modifications may be made to adapt particular situations or materials to the teachings of this disclosure without departing from its essential scope. Therefore, this disclosure is intended to be limited to the specific embodiments disclosed as the best mode contemplated for carrying out this disclosure, and will include all embodiments falling within the scope of the claims.

Claims

1. An electronic device enclosure system, comprising: Sealing; One or more electronic device supports are disposed within the enclosure; as well as Cooling system, including: Multiple injection nozzles disposed inside the enclosure are configured to inject cooling fluid onto the electronic device holder to cool the electronic device holder. The plurality of injection nozzles are operatively connected to a vapor compression circuit configured to cool the cooling fluid.

2. The electronic device encapsulation system according to claim 1, wherein, The electronic device support is at least partially immersed in a cooling fluid pool within the enclosure.

3. The electronic device encapsulation system according to claim 1, wherein, The cooling fluid is a refrigerant that circulates through the vapor compression circuit.

4. The electronic device encapsulation system according to claims 2 and 3, wherein, The refrigerant is directed to the compressor in the vapor compression circuit as it leaves the enclosure.

5. The electronic device enclosure system of claim 1, further comprising a cooling fluid manifold configured to distribute the cooling fluid to the plurality of injection nozzles.

6. The electronic device encapsulation system according to claim 1, wherein, The cooling fluid emitted from the plurality of jet nozzles is in the liquid phase.

7. The electronic device encapsulation system according to claim 1, wherein, The enclosure is a plurality of enclosures, which are connected in a fluid parallel arrangement.

8. The electronic device enclosure system of claim 1 further includes a plurality of electronic device supports disposed in the enclosure, the plurality of nozzles being configured to spray the cooling fluid onto the plurality of electronic device supports.

9. The electronic device enclosure system of claim 1 further includes an intermediate heat exchanger configured to exchange heat energy between the cooling fluid and the refrigerant in the vapor compression circuit.

10. The electronic device encapsulation system according to claim 1, wherein, The electronic device holder is sealed to prevent cooling fluid from entering the electronic device holder.

11. A method for cooling an electronic device holder, comprising: Position one or more electronic components within the enclosure; as well as The cooling system is operated to spray cooling fluid from multiple nozzles located inside the enclosure onto the electronic device holder to cool the electronic device holder; as well as The cooling fluid is cooled via a vapor compression circuit operably connected to the plurality of injection nozzles.

12. The method of claim 11, further comprising immersing the electronic device holder at least partially in a cooling fluid pool within the enclosure.

13. The method according to claim 11, wherein, The cooling fluid is a refrigerant that circulates through the vapor compression circuit.

14. The method of claims 12 and 13, further comprising a compressor that directs refrigerant to the vapor compression circuit as it exits the enclosure.

15. The method of claim 11, further comprising distributing the cooling fluid to the plurality of injection nozzles via a cooling fluid manifold.

16. The method of claim 11, further comprising discharging the cooling fluid in a liquid phase from the plurality of injection nozzles.

17. The method according to claim 11, wherein, The enclosure is a plurality of enclosures, which are connected in a fluid parallel arrangement.

18. The method of claim 11, further comprising positioning a plurality of electronic device supports disposed in the enclosure, and causing the cooling fluid to be sprayed from the plurality of nozzles onto the plurality of electronic device supports.

19. The method of claim 11, further comprising exchanging heat energy between the cooling fluid and the refrigerant in the vapor compression circuit via an intermediate heat exchanger.

20. The method of claim 11, further comprising sealing the electronic device holder to prevent cooling fluid from entering the electronic device holder.

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