Transferring an electronic component from a first carrier to a second carrier

Abstract

An apparatus and method for transferring electronic components from a first carrier to a second carrier, wherein the first carrier carries a plurality of discrete components and the second carrier carries a plurality of electronic assemblies, and one of the components from the first carrier is transferred to each electronic assembly. The device and method provide the following functions: accommodating a first carrier in or on a first receiving portion; accommodating a second carrier in or on a second receiving portion; conveying the second carrier along its longitudinal direction toward the second receiving portion or above, wherein the first carrier is accommodated in or on the first receiving portion such that the components it carries are oriented toward the second receiving portion; separating one of the components from the first carrier in a contact or non-contact manner to convey the component to the second carrier at a mounting position; conveying the second carrier with its orientation relative to the mounting position such that electronic components on the second carrier reach the mounting position; detecting the component mounting position on the electronic components on the second carrier upstream of the mounting position using a first image acquisition device, and notifying the control unit with image acquisition signaling to determine the positioning and / or orientation of the electronic components on the second carrier; applying a portion of adhesive to the electronic components on the second carrier downstream of the first image acquisition device using an adhesive application unit; detecting the positioning and / or orientation of this portion of adhesive on the electronic components downstream of the adhesive application unit using a second image acquisition device, and notifying the control unit with image acquisition signaling to determine the positioning and / or orientation of this portion of adhesive.

Description

Technical Field

[0001] This document describes an apparatus and method for transferring electronic components from a first carrier to a second carrier. It also describes an apparatus and method for applying an adhesive to the second carrier. Specifically, this disclosure describes an apparatus and method for separating electronic components from a first carrier and transferring them directly to a second carrier. The second carrier may, for example, carry one or more electronic components, onto which electronic components are transferred. Background Technology

[0002] When transferring electronic components, especially chips, and particularly when transferring loose electronic components, a common problem is that the components are extremely fragile and must be handled with care. Furthermore, the continuous miniaturization of electronic components necessitates increasingly higher precision in their transfer.

[0003] WO2017 / 076989A1 relates to a processing system and method for processing flexible substrates (e.g., rolls), wherein a tensioner is used, including a vacuum plate movable along the transport direction of the flexible substrate and an indexer for intermittently moving the flexible substrate for processing. The vacuum plate is configured to move along the transport direction. A control unit controls the tensioner and the indexer so that, under various operating conditions, the relative speed between the indexer of the tensioner and the vacuum plate is maintained above a predetermined threshold, even when the flexible substrate is stopped. The rolls available in the processing system include multiple electrical structures spaced apart at intervals. These electrical structures can be any type of flexible electronics.

[0004] DE 10 2011 104 225 B4 relates to an apparatus for positioning an electronic component to be transferred relative to an ejection device, the ejection device including a slider for at least one electronic component and a housing surrounding the slider, the housing having a first light-transmitting area. A first carrier provides the electronic component to be transferred. The first carrier has a first side facing the ejection device and a second side facing away from the ejection device. A plurality of electronic components are disposed on the second side. An image data acquisition device is configured to acquire image data of an area where the slider interacts with at least one electronic component through the first light-transmitting area of ​​the housing. A control unit is configured to determine position data of the electronic component to be transferred based on the acquired image data and generate control commands based on the position data. At least one actuator is configured to move the first carrier and the ejection device relative to each other based on the control commands to change the offset between the longitudinal axis of the slider and the central axis of the electronic component to be transferred, wherein the ejection device has a first reflector disposed inside the housing.

[0005] DE 103 49 847B3 relates to a positioning device and method for transferring electronic components. A semiconductor wafer on a carrier film is arranged above and parallel to a strip substrate. A wafer holder allows the wafer to move both within its plane and rotate about an axis of rotation perpendicular to the wafer plane. An ejector device includes a ejector pin that acts downwards on the back side of the chip to be removed and detaches it from the carrier film. The chip detached from the carrier film is then mounted onto an adhesive position on the strip substrate.

[0006] JP 2003-109979A relates to an apparatus having at least two sliding elements for separating components from a first carrier. Each component is picked up by a suction tube of a transfer element. In a final step, the transfer element, along with the suction tube and the components, is positioned over a second carrier prepared with adhesive, and the components are attached to the second carrier. The components are not transferred directly from the first carrier to the second carrier, but rather separated from the first carrier, picked up by the transfer element, and then precisely oriented and attached to the second carrier in subsequent steps via the transfer element.

[0007] Other electronic component transfer devices and methods described in this document and those mentioned in the background art can be found in the following patent documents: CN 103620756 B, JP 5267451 A, EP 0 565 781 B1, DE 198 22512A1, DE10 2020 001 439 A1, US 4,667,402 B1, US2008 / 0086874 A1, EP 2 764826A1, US2002 / 0019074 A1, US2009 / 242124 A1, EP 0 140 126 A1, US 4,990,051B1, US2006 / 237142 A1, US2007 / 293022 A1, US 6,201,306 B1, JP 2009-238881 A, JP 2010-161155A, JP 60-097634A, JP 01-109737A, JP 55-070041A, JP 2002-050670A, JP 09-162204A, JP 53-100765A, JP 2008-004936 A, WO 2007 / 137888 A1, WO 2000 / 014789A1, EP 949 662A2, US2006 / 013680 A1, US2016 / 308269 A1, DE 102011 017218A1, EP 2 491 583 B1. Summary of the Invention

[0008] Technical issues

[0009] Therefore, when transferring components from the first carrier to the second carrier with high-level component placement accuracy, a space-saving, high-throughput, and safe process is required. Even with an opaque second carrier, there should be no loss of quality in terms of placement accuracy. Furthermore, components must be handled gently.

[0010] Proposed solution

[0011] To address the aforementioned technical problems, this disclosure proposes an apparatus for transferring electronic components from a first carrier to a second carrier. This apparatus transfers electronic components (e.g., RFID chips) from a first carrier (e.g., a wafer carrier film) to a second carrier (e.g., a quasi-endless (antenna) carrier material), the second carrier carrying multiple electronic components, such as antennas, in its lateral and / or longitudinal directions. In one variant, the first carrier carries multiple detachable, discrete components, such as RFID chips. The individual components (RFID chips) from the first carrier (wafer carrier film) are then transferred to the second carrier, i.e., the (antenna) carrier material.

[0012] In one variant, the device includes:

[0013] The first accommodating section is designed and configured to accommodate the first carrier.

[0014] The second receiving portion is designed and configured to convey the second carrier along its longitudinal direction. The first receiving portion is designed and configured to receive the first carrier such that the components it carries are oriented toward the second receiving portion.

[0015] The separation device is designed and configured to separate one of the components from the first carrier in a contact or non-contact manner in response to information notified by the control unit via signaling, so as to transfer the component to the second carrier at the mounting position.

[0016] The first conveying device is designed and configured to convey the second carrier along its orientation relative to the mounting position in response to information notified by the control unit via signaling, so that the electronic components on the second carrier reach the mounting position.

[0017] The first image acquisition device is designed and configured to detect each electronic component on the second carrier upstream of the component mounting position, and to notify the control unit by signaling to determine the positioning and / or orientation of the electronic components on the second carrier.

[0018] The adhesive application unit is designed and configured to apply a portion of adhesive to the electronic components on the second carrier downstream of the first image acquisition device.

[0019] The second image acquisition device is designed and configured to detect a portion of adhesive on the electronic component downstream of the adhesive application unit and notify the control unit via signaling to determine the location and / or orientation of this portion of adhesive on the electronic component.

[0020] Specifically, the device is used to transfer electronic components from a first carrier to a second carrier. The first carrier carries multiple detachable, discrete components. The second carrier has a quasi-endless design and carries multiple electronic assemblies along its longitudinal direction, to which one of the components from the first carrier is transferred. The device includes a first receiving portion configured to receive the first carrier. The device also includes a second receiving portion configured to guide the second carrier along its longitudinal direction in a transport direction. The first receiving portion is configured to receive the first carrier such that the components it carries are oriented toward the second receiving portion.

[0021] The corresponding conveying device is configured to move the first receiving portion longitudinally and / or laterally and rotate relative to the second receiving portion in response to information notified by the control unit via signaling.

[0022] In one variant, the above-mentioned technical solution includes a single second receiving portion, such as a second receiving portion in the form of a rotary vacuum cylinder, which conveys a second carrier, such as a strip, along its cylindrical side surface. Around the vacuum cylinder are a dispensing unit that dispenses adhesive onto the second carrier under control, and a separating device. The dispensing unit dispenses adhesive onto the second carrier under control. The separating device separates an element from the first carrier under control and transfers the element to the position on the second carrier where adhesive was previously applied. To precisely adjust the positioning and orientation of the first and second carriers relative to each other and relative to the dispensing unit and the separating device, image acquisition along the second carrier from different positions (e.g., before and after the dispensing unit and after the separating device) is transmitted to the control unit. The control unit feeds corresponding signals to the adjusting device based on these image acquisitions.

[0023] The above-described technical solution increases the throughput (UPH) of component transfer in the equipment. In contrast, traditional deployments require less space to complete adhesive application and component transfer in a separate device.

[0024] The aforementioned technical solution reduces both equipment power requirements and costs. In traditional equipment, increasing throughput typically involves optimizing process parameters or using more precise and faster components (such as cameras and servo drives), but this increases deployment costs. In traditional deployments, discrete systems for adhesive application and component transfer require two separate cylinders, each with its own negative pressure system, driver, control unit, etc.

[0025] In this specification, the term "adhesive" refers to a material that mechanically and / or electrically connects a component to an electronic assembly. This adhesive may then be further treated with heat or light (ultraviolet light). If the adhesive is conductive, establishing a separate electrical connection can be omitted. If the adhesive is non-conductive, an additional electrical connection must be established between the component and the electronic assembly, for example, by soldering. As an alternative to or supplement to "adhesive," a coating unit may be used to apply solder paste, thereby establishing a mechanical and electrical connection between the component and the electronic assembly. An additional coating unit may also be used to apply solder paste. In this variant, the second image acquisition device may be designed and configured to detect a portion of adhesive and a portion of solder paste on the electronic assembly and signal to the control unit to determine the location and / or orientation of this portion of adhesive on the electronic assembly. In this specification, the terms "adhesive" and "solder paste" may be replaced simultaneously or individually with the general term "connecting material."

[0026] The technical solution disclosed in this article only requires a second housing (e.g., a cylinder with a negative pressure system), a driver, and a control unit.

[0027] In a variant of the device, the second receiving portion is cylindrical. In another variant, in response to a signaling notification from the control unit, the first conveying device rotates the second receiving portion to allow the second carrier to be conveyed in its orientation relative to the mounting position, so that the electronic components on the second carrier reach the mounting position. In another variant, the second receiving portion has an opening in its side surface facing the second carrier for connection to a negative pressure source, so that the second carrier is in close contact with the side surface of the second receiving portion. In yet another variant, a heating unit is provided on the side surface of the second receiving portion, designed and configured to perform temperature control from its side facing away from the first receiving portion before, during, and / or after the second carrier enters the mounting position, in response to a signaling notification from the control unit.

[0028] In one variant, the device includes a third image acquisition device to detect components on an electronic assembly downstream of the mounting position and to signal to a control unit to determine the positioning and / or orientation of the components on the corresponding electronic assembly. In another variant, the first, second, and / or third image acquisition devices are oriented toward a second carrier to detect the electronic assembly, a sheet of adhesive, and / or the mounted components. In yet another variant, the first, second, and / or third image acquisition devices have corresponding first, second, and / or third adjustment devices for adjusting the first, second, and / or third image acquisition devices in one or more longitudinal or rotational directions. In yet another variant, the first, second, and / or third image acquisition devices have corresponding first, second, and / or third illumination devices for illuminating the corresponding image acquisitions.

[0029] In a variant of the device, the first image acquisition device is located upstream of the adhesive application unit; the second image acquisition device is located upstream of the separation device; and / or the third image acquisition device is located downstream of the separation device.

[0030] In a variant of the device, the heating unit is configured to establish electrical and mechanical connections when the component is mounted on the second carrier in response to information notified by the control unit via signaling. This is achieved by heating the electronic components on the second carrier to a certain temperature, thereby heating at least the exposed end area of ​​the electronic components with a portion of adhesive and / or solder, and bringing the contact area or contact point of the component into contact with it when the component is mounted.

[0031] In a variant of the device, the first adjustment device is configured to adjust the distance between the first receiving portion and the second receiving portion in response to information notified by the control unit via signaling. In another variant of the device, the second adjustment device is configured to adjust the positioning and / or orientation of the adhesive application unit relative to the electronic components on the second carrier in response to information notified by the control unit via signaling. In yet another variant of the device, the third adjustment device is configured to adjust the orientation and positioning of the first receiving portion relative to the separation device and / or the mounting position in response to information notified by the control unit via signaling.

[0032] In a variant of the device, the separation device is configured to emit a laser beam or an actuating needle toward one of the electronic components on the first carrier, so as to separate one of the components from the first carrier in response to information notified by the control unit via signaling.

[0033] In a variant of the device, at least one pressing unit is configured to subject the second carrier to negative pressure in the area upstream and / or downstream of the mounting position.

[0034] A method for transferring electronic components from a first carrier to a second carrier, wherein the first carrier carries a plurality of discrete components, and the second carrier carries a plurality of electronic assemblies, and one of the components from the first carrier is transferred to each electronic assembly. The method includes:

[0035] The first carrier is housed in or on the first receiving part.

[0036] The second carrier is housed within or on the second receiving section.

[0037] The second carrier is conveyed along its longitudinal range toward or above the second receiving portion in a conveying direction, wherein the first carrier is received in or above the first receiving portion such that the element it carries is oriented toward the second receiving portion.

[0038] One of the components is separated from the first carrier by contact or non-contact means so that the component can be transferred to the second carrier at the mounting position.

[0039] The second carrier is conveyed with its orientation relative to the mounting position so that the electronic components on the second carrier reach the mounting position.

[0040] The first image acquisition device detects the component mounting position on the electronic component on the second carrier upstream of the mounting position, and notifies the control unit of the image acquisition via signaling to determine the positioning and / or orientation of the electronic component on the second carrier.

[0041] An adhesive is applied to the electronic components on the second carrier downstream of the first image acquisition device using an adhesive application unit.

[0042] The positioning and / or orientation of a portion of adhesive on an electronic component downstream of the adhesive application unit is detected by a second image acquisition device, and the image acquisition is signaled to the control unit to determine the positioning and / or orientation of this portion of adhesive.

[0043] In a variation of the method, a second carrier is conveyed to load a portion of adhesive and the element is transferred into or onto a single second receptacle. An application unit and a separation device are distributed along the second receptacle. The application unit, under control, dispenses adhesive onto the second carrier in portions, and the separation device, under control, separates the element from the first carrier and transfers it onto the second carrier at the previously applied adhesive position. In another variation of the method, to adjust the positioning and orientation of the first and second carriers relative to each other and relative to the application unit and the separation device, image acquisition along the second receptacle from before and after the application unit and after the separation device is transmitted to a control unit. Based on these image acquisitions, the control unit feeds signals to corresponding adjustment devices of the first and / or second receptacle and / or the separation device and / or the application unit and / or the image acquisition device.

[0044] In one variant, the heating unit is configured to act on the second carrier so that the second carrier is temperature-controlled from the side facing away from the first receiving portion before, during, and / or after it enters the mounting position.

[0045] In one variant, the conveying device is configured to convey the second carrier to its position relative to the mounting position in response to a signaling notification from the control unit, so that the electronic components on the second carrier reach the mounting position on the second receiving portion that guides the second carrier. In another variant, the second receiving portion has a second carrier bonding surface curved along the conveying direction of the second carrier, such as a roller surface. In yet another variant, the conveying device is configured to convey the second carrier along the conveying direction (without sliding or stretching) in response to a signaling notification from the control unit, so that at least one of a plurality of electronic components on the second carrier reaches the mounting position according to the signaling notification.

[0046] In one variant, the heating unit is configured to act on the area of ​​the second receiving portion so that temperature control is performed from the side opposite to the first receiving portion before, during, and / or after the second carrier enters the mounting position.

[0047] In another variation, the second receiving portion is designed as a cylindrical roller and can be heated as a whole by a heating unit. In a further variation, this heatable roller can be rotated by a conveyor with a driver that conveys the second carrier in a conveying direction toward / away from the component mounting position.

[0048] Instead of a cylindrical roller, the second receiving portion can also be designed as a convex or curved surface toward the first receiving portion, the surface being arranged in a fixed position and spatially and / or functionally equipped with an additional third conveying device for the second carrier.

[0049] For assembling components or frames via Direct Chip Attach (DCA), a single-row tape is commonly used as the second carrier. Components from the first carrier are then mounted on the second carrier. Traditional single-row roll-to-roll DDA systems use a camera to identify the mounting positions on the roll before component mounting; this camera is directly mounted on the mounting area on the back / bottom side of the roll on the second carrier. With this deployment, traditional DDA systems, unless there are limitations on mounting accuracy, can only handle completely transparent materials, such as PET, and generally cannot use opaque materials as the second carrier. The technical solution proposed in this disclosure allows for the replacement of prior art's inspection of the second carrier at the mounting position, as the position on the second carrier is checked and determined beforehand. Thus, when mounting components, even using a second carrier with low transparency or even opaqueness, precise component-to-assembly fit can be achieved without reducing accuracy.

[0050] The technical solution proposed in this disclosure utilizes a second image acquisition device to directly detect the mounting positions (spatially / temporally) on the roll material before the actual component mounting. That is, it does not require passing through the second carrier, but rather detects the corresponding component mounting points on the second carrier itself. Then, the second carrier is conveyed to the mounting position under control, so that when the separation device separates the component from the first carrier and transfers it to the second carrier, the component mounting points are aligned as precisely as possible with the position of the component to be mounted on the first carrier.

[0051] Compared to pick-and-place systems or flip-chip systems, the technical solution proposed in this disclosure significantly improves component throughput due to its reduced structural complexity. Components can be directly separated from the (sawing) wafer and mounted onto corresponding components (or frames, etc.) on a second carrier, eliminating the need for intermediate carriers as in traditional automated assembly machines. During component mounting, the transparency of the second carrier material no longer affects positioning accuracy.

[0052] The apparatus disclosed herein allows for the production, for example, of RFID inlays or RFID modules, in which an electrical contact between an RFID chip and an antenna is established by soldering. For this purpose, the antenna comprises a conductive material molten at an appropriate temperature. In this molten state, the RFID chip and its contacts (bumps) are attached to the molten exposed end of the antenna. In this way, a durable and sufficient electrical and mechanical connection is established between the contacts of the RFID chip and the contacts of the antenna.

[0053] When a component is mounted onto a carrier material (strip), or more precisely, onto an antenna attached to a carrier material (strip), electrical and mechanical connections must have been established. This requires, for example, heating the carrier material (strip) used to mount the component to a temperature at which the antenna solder / material reaches its melting point, at least in the exposed area of ​​the antenna, allowing the RFID chip contacts to make contact.

[0054] If temperature control of the second carrier fails to reach the solder softening temperature to establish the aforementioned solder joint between the exposed end of the antenna and the contact of the RFID chip, an RFID inlay can be created, for example, using conductive adhesive (ACA) between the exposed end of the antenna and the contact of the RFID chip.

[0055] For example, compared to traditional soldering, anisotropic conductive adhesive (ACA) requires only lower process temperatures. Furthermore, the adhesive process allows for contact on surfaces that are impossible or difficult to solder.

[0056] Anisotropic conductive adhesives (ACAs) achieve electrical connections between the chip and the substrate through conductive particles (metals or metal-encapsulated polymers) within the adhesive. These conductive particles are randomly distributed within the adhesive matrix and are sandwiched between the electrodes during the bonding process. The advantages of ACA adhesives include the ease of application of ACA pastes or films, and their rapid curing at relatively low temperatures.

[0057] Alternatively, non-conductive adhesive (NCA) can be used to achieve extremely low contact resistance that is stable over the long term, comparable to that of welding or thermoforming.

[0058] If adhesives are used to connect the RFID chip to the antenna, only a mechanical connection needs to be ensured. Low-cost (epoxy) adhesives or hot melt adhesives without conductive materials will suffice. If the carrier material (strip) is temperature-controlled, the antenna solder / material and non-conductive adhesive will reach their melting temperature.

[0059] Furthermore, in some variants, the final bonding module, which is commonly used in the process chain, can be omitted. This significantly reduces the complexity, size, and cost of the machine.

[0060] Using the apparatus and method disclosed herein, a carrier material (strip) to which an antenna is applied is heated by at least one corresponding heating element during its journey to, at, and / or away from the mounting position. This heating element acts on the carrier material (strip) on the side facing away from the assembly (e.g., the antenna) so that at least the solder / material at the exposed end of the antenna reaches its melting temperature. By releasing the element from the first carrier, the contacts of the RFID chip come into contact with the exposed end of the antenna. After the solder / material at the exposed end of the antenna is cooled (under control) below its melting temperature, the element (RFID chip) and the assembly (antenna) are electrically and mechanically connected.

[0061] In a variant of the device, the second receiving portion and / or conveying device has orifices connected to a negative pressure source. These orifices are configured to ensure that the second carrier, particularly in the mounting position, is in close contact with the curved bonding surface. During the transport of the second carrier, the orifices under negative pressure hold the second carrier in place without slippage, thus enabling controlled transport and precise mounting of components from the first carrier relative to the assemblies on the second carrier.

[0062] In another variation, the device is equipped with a buffer unit upstream and / or downstream of the mounting position or the curved bonding surface, the buffer unit being configured to accommodate a reserve of the second carrier. In one variation, the buffer unit is designed as a storage box open toward the mounting position, which, if necessary, utilizes negative pressure to hold the second carrier or delay the guidance of the second carrier.

[0063] In another variation, the first image acquisition device is configured to acquire an image of at least one component located on the first carrier within the mounting area and notify the control unit via signaling. In yet another variation, a second image acquisition device and / or a third image acquisition device are arranged, configured to acquire an image (regardless of whether there is a component) of at least one electronic component on the second carrier in areas upstream and / or downstream of the mounting position and notify the control unit via signaling.

[0064] In another variation, the distance between the first receiving portion and the second receiving portion can be adjusted by an adjusting device.

[0065] In another variation, in the region upstream and / or downstream of the mounting position, at least one pressing unit is configured to press the second carrier onto the second receiving portion.

[0066] This temperature control is achieved by the control unit appropriately controlling the heating unit. Based on the material properties / contact melting point of the element to be transferred and / or the material properties / contact melting point of the components / electronic assemblies on the second carrier, the temperature is uniformly or segmented / zoned within the area of ​​the second receiving portion. This ensures a secure mechanical and electrical connection between the element to be transferred and the components / electronic assemblies on the second carrier, making operation simple and quick.

[0067] Image acquisition devices are used to determine the position of the second carrier and its components before, at, and / or after the mounting position, in order to mount the component to be mounted. The control unit then uses the results of the image acquisition, combined with position data from other transport devices, to determine the precise positioning of the components on the second carrier at the mounting position, and accordingly positions the first carrier containing the component to be mounted. One of these image acquisition devices examines the top side of the second carrier. This means that the quality of the image acquisition is independent of the transparency of the carrier material.

[0068] As a substitute or supplement to the main contact heating method using heating strips, non-contact heating can be performed on the second carrier and its components using methods such as laser, infrared, or induction.

[0069] In one variant, a first receiving portion carrying a first carrier is located directly above a second carrier on a second receiving portion. The movement space of the first receiving portion and the separation device transverse to the transport direction of the second carrier is at least approximately equivalent to the width of the second carrier. This significantly expands the work / component mounting area across the width of the second carrier. Therefore, adjacent rows of electronic components (e.g., RFID antennas) can be placed together with the first carrier onto the wider second carrier and assembled at the mounting position by actuating the separation device.

[0070] In one variant, the first carrier has a first side facing the separation device and a second side facing away from the separation device. The second side faces the second carrier on the second receiving portion. An image acquisition device is arranged in the area of ​​the first carrier on either the first or second side. On the second side of the first carrier, i.e., the side facing away from the separation device, multiple elements are detachably attached to the first carrier. The separation device is configured to interact with at least one element in a contact manner (e.g., with a needle) or non-contact manner (e.g., with a laser beam) to separate it from the first carrier. The image acquisition device provides the control unit with images or data that position and orient the separation device relative to the first carrier. The control unit generates positioning commands for the separation device based on the acquired images or data, and generates control commands for the separation device and various conveying devices based on the acquired images or data.

[0071] In one variant, based on the transport direction of the second carrier, a second image acquisition device is arranged upstream of the mounting position on the second carrier. The second image acquisition device is configured to detect the position of one or more of the numerous electronic components on the second carrier relative to the second receiving portion along the transport direction of the second carrier and / or laterally to the transport direction of the second carrier, and to notify the control unit of the measured position information by signaling.

[0072] In one variant, the control unit is configured to control the second conveying device based on information from the second image acquisition device regarding the position of at least one electronic component and information regarding the conveying direction and path of the second carrier, and based on information from the first image acquisition device regarding the position of at least one element relative to the mounting position, so that the separating device moves laterally to the mounting position in the conveying direction of the second carrier and initiates the separating device to separate the element from the first carrier.

[0073] In one variant, the device includes a conveying device for a first receiving portion, the conveying device being configured to: move the first receiving portion longitudinally or laterally relative to a second receiving portion along the conveying direction of a second carrier in response to information notified by the control unit via signaling; and / or rotate the first receiving portion relative to the second receiving portion by a certain angle in response to information notified by the control unit via signaling.

[0074] In a variant of the device, if the separation device is configured to separate elements from the first carrier in a contact manner, the separation device includes a needle configured to pierce the first carrier in response to a signaling notification from the control unit, so as to detach the elements from the first carrier and transfer them to the second carrier; or, if the separation device is configured to separate elements from the first carrier in a non-contact manner, the separation device includes a controllable energy source configured to feed energy to the first carrier in response to a signaling notification from the control unit, so as to detach the elements from the first carrier and transfer them to the second carrier.

[0075] In another variation of the device, the second receiving portion includes a (cylindrical) roller or a convex surface through which the second carrier reaches the mounting position on the second receiving portion. In another variation, the second receiving portion has outlets on its side / surface guiding the second carrier, and these outlets are configured to hold the second carrier on the second receiving portion by negative pressure (without slippage or stretching).

[0076] In another variant, the device includes a third image acquisition device positioned downstream of the mounting position, based on the transport direction of the second carrier. The third image acquisition device is configured to detect the relative positions of at least one of a plurality of electronic components on the second carrier and the elements transferred thereto, and to signal the control unit with information indicating the measured positions.

[0077] In another variant, the device includes: a conveying device configured to convey a second image acquisition device relative to a second receiving portion and a mounting position, such that the second image acquisition device detects at least one component mounting point on a second carrier and / or detects the position of at least one component among a plurality of electronic components on the second carrier, and notifies a control unit of information indicating the measured position via signaling; and / or a conveying device configured to convey a third image acquisition device relative to the second receiving portion and the mounting position, such as detecting at least one component among a plurality of electronic components on the second carrier and the relative positions of components transferred thereto, and notifying a control unit of information indicating the measured position via signaling.

[0078] Alternatively, the second image acquisition device and / or the third image acquisition device may be pivotally mounted on the second receiving portion and may be oriented by electronic control or manual adjustment to the component mounting points or electronic components on the second carrier and the components transferred thereon.

[0079] In one variant, the device includes an adhesive application unit configured to apply adhesive from a supply source to a second carrier. The second carrier is designed to be quasi-endless, carrying multiple electronic components along its longitudinal and / or lateral dimensions. On each of these electronic components, adhesive is applied in portions to adhesive points on the second carrier at designated application locations under controlled conditions, so that the component can be subsequently transferred to one of the components.

[0080] The sizing unit also allows multiple rows of strip to be used as a second carrier.

[0081] The technical solution proposed in this disclosure directly detects the mounting positions (spatially / temporally) on the roll material using an image acquisition device before the actual application of adhesive. That is, it does not require the second carrier but detects the corresponding adhesive points (related to their respective electronic components) on the second carrier itself. Then, the second carrier is conveyed to the adhesive application position under control so that when the adhesive application device (dispensing one unit) applies adhesive to the adhesive points, the adhesive points are aligned as precisely as possible with the exit position of the adhesive application device.

[0082] Based on the transport direction of the second carrier, an image acquisition device is arranged upstream of the adhesive application position on the second carrier. The image acquisition device is configured to detect the position of one or more of the numerous electronic components on the second carrier relative to the second housing and / or the second carrier, transverse to the transport direction of the second carrier, and to notify the control unit of the measured position information by signaling.

[0083] In a variant of the image acquisition device, the illumination device of the image acquisition device includes a white light source, a red light source, and / or a (super) blue light source.

[0084] In a variant of the lighting device, the red light source and / or (super)blue light source are designed as a ring light source that at least partially surrounds the detection area of ​​the image acquisition device.

[0085] In a variant of the image acquisition device, a white light source is arranged on the side of the beam deflection unit that is at least partially transparent, facing away from the detection area of ​​the image acquisition device.

[0086] While some of the above aspects have been described in conjunction with equipment operating modes, these aspects may also relate to equipment structure. Similarly, the aspects of the equipment described above may also apply to operating modes. Although this document describes various aspects of the above equipment and operating modes to explain their interactions, its disclosure may be independent of other equipment and other operating modes. Attached Figure Description

[0087] Non-limiting embodiments will now be described in conjunction with the accompanying drawings, illustrating further objectives, features, advantages, and possible applications. All described and / or illustrated features, whether alone or in any combination, are illustrative of the subject matter of this disclosure and are not dependent on the combinations of features in the claims or their dependencies. The dimensions and scales of the components shown in the figures are not necessarily drawn to scale, and these components may differ from the illustrated representation in the intended implementation.

[0088] Figure 1 A side view of a device for transferring electronic components from a first carrier to a second carrier is shown.

[0089] Figure 2 A plan view of the first receiving part, which can be used as a first carrier, is shown, with the worktable adjustable in X / Y / θ coordinates.

[0090] Figure 3 A partial planar schematic diagram of the second carrier with multiple electronic components is shown.

[0091] The methods and apparatus variations described herein, along with their functions and operational aspects, are provided for ease of understanding of their structure, function, and characteristics, and are not intended to limit the embodiments of this disclosure. The accompanying drawings are partial schematic diagrams, with enlarged portions illustrating essential characteristics and technical effects to clarify functions, working principles, technical designs, and features. The various functions, principles, technical designs, and features disclosed in the drawings and text, along with features in the claims, other drawings, and other functions, principles, technical designs, and features covered by or derived from this disclosure, can be freely and arbitrarily combined, thus enabling the apparatus to be used in all conceivable combinations. This also includes combinations between all individual embodiments described herein (paragraphs of the specification, claims) and combinations between different variations described herein, in the claims, and in the drawings, all of which can constitute the subject matter of further claims.

[0092] The claims do not limit this disclosure, nor do they limit the possible combinations of the illustrated features. Each feature of this disclosure may be explicitly disclosed individually or in combination with all other features. Detailed Implementation

[0093] In the accompanying drawings, corresponding or functionally similar elements are marked with corresponding reference numerals. The following examples illustrate the method and apparatus.

[0094] Figure 1 An apparatus 100 for transferring electronic components B from a first carrier W to a second carrier T is shown. In this variant, the first carrier W has an approximately circular semiconductor wafer shape and carries multiple loose components B, which can be detached from the first carrier W in the following manner. The second carrier T is designed as a quasi-endless tape and carries multiple electronic components ANT in its longitudinal and / or lateral directions. In the variant shown in this figure, the component ANT is a printed or wired antenna segment of an RFID module (see also). Figure 3 The device transfers individual elements B from the first carrier W to each of the multiple electronic components ANT (specifically, to mounting position 140). The device has a first receiving portion 110 configured to receive the first carrier W. The shape of the first receiving portion 110 is adapted to the first carrier W.

[0095] In the variant shown, the second receiving portion 120 is in the shape of a cylindrical roller. The second carrier 120 is guided along its longitudinal direction by its outer cylindrical outer wall, as detailed below. The first receiving portion 110 receives the first carrier W such that the element B it carries is oriented toward the second receiving portion 120. Figure 1(Center facing down). A separation device TE is provided on the side of the first receiving portion 110 facing away from the second receiving portion 120. The first carrier W has a first side facing the separation device 130 and a second side facing away from the separation device 130, the second side facing the second carrier T on the second receiving portion 120. A plurality of components B are detachably attached to the second side of the first carrier W. The separation device 130, controlled by the electronic control unit ECU, is used to separate the components B from the first carrier W in a contact or non-contact manner so as to precisely position and transfer the components B at the mounting position 140 to the second carrier T, i.e., one of the components ANT.

[0096] Figure 1 A portion of the second carrier T is shown, wherein multiple elements B have been transferred from the first carrier W to the second carrier T by the separation device 130.

[0097] The first receiving portion 110 is part of a worktable adjustable in X / Y / rot coordinates, and its respective X / Y axes and rotational position Rot can be adjusted by transfer devices 112a, 112b, and 112c controlled by an electronic control unit (ECU). Specifically, the transfer device 112a, in the form of a linear servo drive, is used to move the first receiving portion 110 relative to the second receiving portion 120 transversely to the transfer direction → (along the Y direction) of the second carrier T (see also). Figure 2 ).

[0098] The linear servo drive type of the transfer device 112b is used to move the first receiving portion 110 relative to the second receiving portion 120 in the transfer direction → (along the X direction) of the second carrier T (see also). Figure 2 The servo drive-type transmission device 112c is used to rotate the first receiving portion 110 clockwise or counterclockwise about the Z-axis by a certain angle (see also...). Figure 2 ).

[0099] In one embodiment, a transfer device 250 in the form of a linear servo drive is used to move the separation device 130 relative to the second receiving portion 120 transversely to the transfer direction → (along the Y direction) of the second carrier T.

[0100] The image acquisition device 260, in the form of a camera, is associated with the separation device 130 for top-view detection of the position of at least one element B relative to the mounting position 140 on the second receiving portion 120 of the guide second carrier T. To orient the image acquisition device 260 in the X, Y, and Z directions, the image acquisition device 260 includes an adjustment device 262 and an annular light 264 directed toward the first carrier W.

[0101] In one variant, the adhesive application unit 170 and / or the solder paste application unit 170' can also be adjusted to be mounted along the outer surface or circumference of the second carrier 120 in the longitudinal direction of the roll. This allows the corresponding positions of the adhesive application unit 170 or the solder paste application unit 170' to be adjusted according to the different lengths of the electronic component ANT in the longitudinal direction of the second carrier T.

[0102] An additional image acquisition device 180 is arranged upstream of the mounting position 140 and associated with the second receiving portion 120. The image acquisition device 180 can be moved laterally in the transport direction → of the second carrier T under control, and / or in some variants, it can be manually or electrically adjusted at a predetermined angle along a route on the side surface of the second receiving portion 120. In a variant where the second carrier T carries a single row of ANT components, the image acquisition device 180 can be fixedly mounted and its field of view only needs to be adjusted once. The image acquisition device 180 is used to detect the position of at least one of the multiple electronic components ANT on the second carrier T relative to the second receiving portion 120 and to signal the measured position to the control unit ECU.

[0103] In this embodiment, the conveying device 196 for the second carrier T consists of two controllably driven conveying rollers, which are respectively arranged upstream and downstream of the second receiving portion 120 (in this embodiment, they are roller-shaped) and guide the second carrier T around it. In response to information notified by signaling from the ECU, the two controllably driven conveying rollers convey the second carrier T to the mounting position 140. Thus, at least one of the plurality of electronic components ANT on the second carrier T reaches the mounting position 140 on the second receiving portion 120 that guides the second carrier T.

[0104] Alternatively or supplementarily, the conveying device 150 rotates the roller-shaped second receiving portion 120 of the second carrier T in response to a signaling notification from the control unit ECU. This conveys the second carrier T to the mounting position 140, so that the electronic components ANT on the second carrier T reach the mounting position 140 on the second receiving portion 120 that guides the second carrier T.

[0105] In this alternative / supplementary embodiment, if the second receiving portion 120 is designed as a cylindrical roller, the additional conveying device 150 for the second carrier T is an electrically driven rotary drive for the roller (see [link]). Figure 1 ).

[0106] It should be understood that the mounting position 140 can vary both longitudinally and laterally on the second carrier T to precisely mount component B to the predetermined position on the assembly ANT, while the corresponding area of ​​the second carrier T is located on the second receiving portion 120 and corresponds to the position of component B on the first carrier W. Accordingly, the control unit ECU controls the first carrier W to shift both longitudinally and laterally on the second carrier T.

[0107] Multi-row tapes serving as a second carrier T are tapes that carry, for example, two, three, or more components ANT in transverse rows, which repeat almost infinitely along the longitudinal direction of the tape (conveyor direction →). Carriers with very low or even no transparency can be used as second carrier T without reducing the accuracy of the mounted components.

[0108] Figure 1 In the embodiment shown, the second receiving portion 120 is a rigid roller that is approximately cylindrical along the cylindrical axis, which can be rotated by a driver or by a corresponding drive / transmission device.

[0109] Upstream of the separation device 130 and the image acquisition device 180, a dispensing unit 170 is arranged on the second receiving portion 120. This dispensing unit is designed and configured to apply a portion of adhesive E (e.g., anisotropic epoxy conductive adhesive) to the electronic component ANT on the second carrier T. To precisely control this dispensing in time and space, an image acquisition device 160 is arranged upstream of the dispensing unit 170. The image acquisition device 160 is designed and configured to detect the positioning and orientation of the electronic component ANT on the second carrier T upstream of the dispensing unit 170 and notify the control unit ECU via signaling.

[0110] If the adhesive E is non-conductive, in a variation, a solder paste application unit 170' is arranged on the second receiving portion 120 upstream of the separation device 130 and the image acquisition device 180. This solder paste application unit is designed to apply a portion of solder paste S to the electronic component ANT on the second carrier T. This can be done spatially and temporally before or after the application of adhesive E by the application unit 170. To precisely control the application of solder paste S in time and space, an image acquisition device 160 is used upstream of the solder paste application unit 170'. The image acquisition device 160 is designed to detect the positioning and orientation of the electronic component ANT on the second carrier T upstream of the application unit 170 and the solder paste application unit 170', and notify the control unit ECU via signaling. The control unit ECU can then orient the application unit 170 and the solder paste application unit 170' relative to the corresponding electronic component ANT via corresponding adjustment devices 172, 172'. If component B is soldered to the electronic component ANT, the application of adhesive E can be replaced by the application of solder paste.

[0111] In one variant, the adhesive application unit 170 and / or the solder paste application unit 170' can also be adjusted to be mounted along the outer surface or circumference of the second carrier 120 in the longitudinal direction of the roll. This allows the corresponding positions of the adhesive application unit 170 or the solder paste application unit 170' to be adjusted according to the different lengths of the electronic component ANT in the longitudinal direction of the second carrier T.

[0112] A heating unit 220 is provided on the inner side of the side surface of the second receiving portion 120. The heating unit is configured to perform temperature control on the side of the second carrier T facing away from the first receiving portion W before, during and / or after the second carrier T enters the mounting position 140, in response to information notified by the control unit ECU via signaling.

[0113] Downstream of mounting position 140, an image acquisition device 190 is arranged on the second receiving portion 120 to detect component B after component B has been mounted on the electronic component ANT, and to notify the control unit ECU by signaling to determine the positioning and / or orientation of component B on the corresponding electronic component ANT.

[0114] In the illustrated variant, three image acquisition devices 160, 180, and 190 are oriented onto a second carrier T to detect an electronic component ANT (uncoated and without components), a portion of adhesive E on the electronic component ANT, and a component B mounted on the electronic component ANT and adhesive E. The three image acquisition devices 160, 180, and 190 have corresponding first adjustment devices 162, second adjustment devices 182, and / or third adjustment devices 192 to adjust the three image acquisition devices 160, 180, and 190 along one or more longitudinal directions X, Y, Z, or rotational directions rot. Finally, the three image acquisition devices 160, 180, and 190 have corresponding first illumination devices 164, second illumination devices 184, and / or third illumination devices 194 for illuminating the corresponding image acquisition.

[0115] The first image acquisition device 160 is arranged upstream of the adhesive application unit 170 and is used to detect the positioning and orientation of the electronic component ANT. The second image acquisition device 180 is arranged upstream of the separation device 130 and is used to detect the positioning and orientation of a portion of adhesive on the electronic component ANT. The third image acquisition device 190 is arranged downstream of the separation device 130 and is used to control the transfer of components to the electronic component ANT.

[0116] In a variant, the image acquisition devices 160, 180, 190, and 260, and their corresponding lighting devices 164, 184, 194, and 264, can also be adjusted to be mounted along the outer surface or circumference of the second carrier 120 in the longitudinal direction of the roll material. Thus, since the electronic components ANT have different lengths in the longitudinal direction of the second carrier T, the corresponding positions of the image acquisition devices 160, 180, 190, and 260, and their corresponding third lighting devices 164, 184, 194, and 264 can be adjusted.

[0117] In the variant shown, the heating unit 220 is configured to establish electrical and mechanical connections when component B is mounted onto the second carrier T in response to information notified by the control unit ECU via signaling. For this purpose, the electronic component ANT on the second carrier T is heated to a temperature at which a portion of the adhesive E and / or solder applied to the electronic component ANT is heated at least in the exposed end K region of the electronic component ANT (see [reference]). Figure 3 When component B is mounted, the contacts of component B come into contact with the exposed terminal K of electronic component ANT.

[0118] In the variant shown in this figure, a heating unit 220 is arranged in the cylindrical wall of the roller. This heating unit is configured to generate heat in response to information notified by the control unit ECU via signaling, particularly in the area upstream and / or downstream of the mounting position 140 and / or along the lateral range of the mounting position 140.

[0119] The second receiving portion 120 has an orifice (not shown) in the curved bonding surface of the cylindrical wall of the roller to which a negative pressure source p- is connected. If the second carrier T is guided around the curved bonding surface and the orifice is connected to the negative pressure source p-, the second carrier T is pressed tightly against the curved bonding surface by negative pressure.

[0120] The adjusting device 240 is used to adjust the distance D between the first receiving portion 110 and the second receiving portion 120 in response to information notified by the control unit ECU via signaling.

[0121] The adjustment device 260 is used to adjust the positioning and / or orientation of the application unit 170 relative to the electronic component ANT on the second carrier T in response to information notified by the control unit ECU via signaling.

[0122] Adjustment devices 112a, 112b, and 112c are used to adjust the orientation and positioning of the first receiving portion 110 relative to the separating device 130 and / or the mounting position 140 in response to information notified by the control unit ECU via signaling.

[0123] Figure 1In the variant shown, the separation device 130 has a needle 132 that extends toward one of the electronic components B on the first carrier W in response to information signaled to the separation device 130 by the control unit ECU, so as to separate the corresponding component B from the first carrier W.

[0124] For example, the aforementioned equipment is used to perform a method for transferring electronic components from a first carrier to a second carrier. The first carrier carries multiple individual components. The second carrier carries multiple electronic assemblies, to which one of the components from the first carrier is transferred. The method includes the steps of: accommodating the first carrier in or on a first receiving portion; accommodating the second carrier in or on a second receiving portion; and conveying the second carrier along its longitudinal direction toward the second receiving portion or above in a conveying direction. In this scenario, the first carrier is housed within or on the first receiving portion so that the component it carries is oriented toward the second receiving portion; one of the components is separated from the first carrier by contact or non-contact means to transfer the component to the second carrier at the mounting position; the second carrier is transferred with its orientation relative to the mounting position so that the electronic component on the second carrier reaches the mounting position; the mounting position of the component on the electronic component on the second carrier is detected upstream of the mounting position by means of a first image acquisition device, and the image acquisition signal is sent to the control unit to determine the positioning and / or orientation of the electronic component on the second carrier; a portion of adhesive is applied to the electronic component on the second carrier downstream of the first image acquisition device by means of an adhesive application unit; the positioning and / or orientation of this portion of adhesive on the electronic component is detected downstream of the adhesive application unit by means of a second image acquisition device, and the image acquisition signal is sent to the control unit to determine the positioning and / or orientation of this portion of adhesive.

[0125] In this configuration, a second carrier is conveyed to load a portion of adhesive and transfer the component into or onto a single second receiving portion. An application unit and a separation device are distributed along the second receiving portion. Under control, the application unit dispenses adhesive onto the second carrier in portions, and under control, the separation device separates the component from the first carrier and transfers it to the second carrier at the previously applied adhesive position. To adjust the positioning and orientation of the first and second carriers relative to each other and relative to the application unit and separation device, image acquisition along the second carrier before and after the application unit and after the separation device is transmitted to the control unit. Based on these image acquisitions, the control unit feeds signals to corresponding adjustment devices for the first and second receiving portions, the separation device, the application unit, and the image acquisition device.

Claims

1. An apparatus (100) for transferring an electronic component (B) from a first carrier (W) to a second carrier (T), wherein, The first carrier (W) detachably carries a plurality of discrete components (B) from the first carrier (W), and the second carrier (T) is designed as a quasi-endless carrier and carries a plurality of electronic components (ANT) along its longitudinal direction, transferring one of the components from the first carrier (W) to each of the electronic components, wherein the device (100) includes: - A first receiving portion (110) is designed and configured to receive the first carrier (W); - The second receiving portion (120) is designed to convey the second carrier (T) along its longitudinal range in the conveying direction (→), wherein the first receiving portion (110) is designed to receive the first carrier so that the element (B) it carries faces the second receiving portion (120); - Separation device (130) is designed and configured to separate one of the elements (B) from the first carrier (W) in a contact or non-contact manner in response to information notified by the control unit (ECU) by signaling, so as to transfer the element (B) to the second carrier (T) at the mounting position (140); - A first conveying device (150) is designed and configured to convey the second carrier (T) along its orientation relative to the mounting position (150) in response to information notified by the control unit (ECU) via signaling, so that the electronic components (ANT) on the second carrier (T) reach the mounting position (140). - A first image acquisition device (160) is designed and configured to detect each electronic component (ANT) on the second carrier (T) upstream of the mounting position (140) of the element (B) and notify the control unit (ECU) by signaling to determine the positioning and / or orientation of the electronic component (ANT) on the second carrier (T); - An adhesive application unit (170) is designed and configured to apply a portion of adhesive (E) to the electronic component (ANT) on the second carrier (T) downstream of the first image acquisition device (160); and - A second image acquisition device (180) is designed and configured to detect a portion of adhesive (E) on the electronic component (ANT) downstream of the adhesive application unit (170) and notify the control unit (ECU) by signaling to determine the location and / or orientation of the portion of adhesive (E) on the electronic component (ANT).

2. The device (100) according to claim 1, wherein, Second receiving section (120): - It is cylindrical; and / or - In response to a signaling notification from the control unit (ECU), the first conveying device (150) is rotated to allow the second carrier (T) to be conveyed in its orientation relative to the mounting position (150), so that the electronic components (ANT) on the second carrier (T) reach the mounting position (140); and / or - The second receiving portion (120) has an opening in its side surface facing the second carrier (T) for connection to a negative pressure source (p--), the opening being configured to allow the second carrier (T) to be in close contact with the side surface of the second receiving portion (120); and / or - A heating unit (220) is provided on the side surface of the second receiving portion (120). The heating unit is configured to perform temperature control on the side of the second carrier (T) facing away from the first receiving portion (W) before, during and / or after the second carrier (T) enters the mounting position (140) in response to information notified by the control unit (ECU) by signaling.

3. The device (100) according to claim 1 or 2, comprising: - A third image acquisition device (190) is designed and configured to detect a component (B) on the electronic assembly (ANT) downstream of the mounting position (140) and notify the control unit (ECU) by signaling to determine the positioning and / or orientation of the component (B) on the corresponding electronic assembly (ANT); wherein, - The first image acquisition device (160), the second image acquisition device (180), and / or the third image acquisition device (190) are oriented toward the second carrier (T) to detect the electronic component (ANT), the adhesive (E), and / or the mounted element (B); and / or - The first image acquisition device (160), the second image acquisition device (180), and / or the third image acquisition device (190) have corresponding first adjustment devices (162), second adjustment devices (182), and / or third adjustment devices (192) to adjust the first image acquisition device (160), the second image acquisition device (180), and / or the third image acquisition device (190) in one or more longitudinal or rotational directions (X, Y, Z, rot); and / or - The first image acquisition device (160), the second image acquisition device (180) and / or the third image acquisition device (190) have corresponding first lighting devices (164), second lighting devices (184) and / or third lighting devices (194) for illuminating the corresponding image acquisition.

4. The device (100) according to claim 1 or 2, wherein, - The first image acquisition device (160) is arranged upstream of the adhesive application unit (170); - The second image acquisition device (180) is arranged upstream of the separation device (130); and / or - The third image acquisition device (190) is arranged downstream of the separation device (130).

5. The device (100) according to claim 2, 3 or 4, wherein, The heating unit (220) is configured to establish electrical and mechanical connections when the component (B) is mounted onto the second carrier (T) in response to information notified by the control unit (ECU) via signaling, wherein an applied portion of adhesive (E) and / or solder of the electronic component (ANT) is heated to a certain temperature, at least in the exposed end region of the electronic component (ANT), and the contact area or contact point of the component (B) is brought into contact with it when the component (B) is mounted.

6. The device (100) according to any one of claims 1 to 5, wherein, - The first adjustment device (240) is configured to adjust the distance (D) between the first receiving portion (110) and the second receiving portion (120) in response to information notified by the control unit (ECU) via signaling; and / or - The second adjustment device (260) is configured to adjust the positioning and / or orientation of the application unit (170) relative to the electronic components (ANT) on the second carrier (T) in response to information notified by the control unit (ECU) via signaling; and / or - The third adjustment device (112a, 112b, 112c) is configured to adjust the orientation and positioning of the first receiving portion (110) relative to the separating device (130) and / or the mounting position (140) in response to information notified by the control unit (ECU) via signaling.

7. The device (100) according to any one of claims 1 to 6, wherein, The separation device (130) is configured to emit a laser beam or an actuating needle (132) toward one of the electronic components (B) on the first carrier (W) to separate one of the components (B) from the first carrier (W) in response to a signaling notification from the control unit (ECU).

8. The device according to any one of claims 1 to 7, wherein, - In the region upstream and / or downstream of the mounting position (AP), at least one pressing unit is configured to subject the second carrier to negative pressure (p--) in the region of the mounting position (AP).

9. A method for transferring electronic components from a first carrier to a second carrier, wherein, The first carrier carries multiple scattered components, and the second carrier carries multiple electronic components, transferring one of the components from the first carrier to each electronic component; wherein the method includes: The first carrier is housed in or on the first receiving portion; The second carrier is housed in or on the second receiving portion; The second carrier is conveyed along its longitudinal direction toward the second receiving portion or above, wherein the first carrier is received in or above the first receiving portion such that the element it carries is oriented toward the second receiving portion. One of the components is separated from the first carrier by contact or non-contact method in order to transfer the component to the second carrier at the mounting position; The second carrier is conveyed with its orientation relative to the mounting position so that the electronic components on the second carrier reach the mounting position; The first image acquisition device detects the component mounting position on the electronic component on the second carrier upstream of the mounting position, and notifies the control unit of the image acquisition via signaling to determine the positioning and / or orientation of the electronic component on the second carrier; A portion of adhesive is applied to the electronic components on the second carrier downstream of the first image acquisition device using an adhesive application unit. The positioning and / or orientation of a portion of adhesive on the electronic component is detected downstream of the adhesive application unit using a second image acquisition device, and the image acquisition is signaled to the control unit to determine the positioning and / or orientation of the portion of adhesive.

10. The method according to claim 9, wherein, The second carrier is conveyed to load the adhesive portion and transfer the element into or onto a single second receiving portion, wherein the application unit and the separation device are distributed along the second receiving portion, the application unit dispenses the adhesive onto the second carrier in portions under control, and the separation device separates the element from the first carrier under control and transfers the element to the second carrier at the previously applied adhesive position; and / or wherein, in order to adjust the positioning and orientation of the first and second carriers relative to each other and relative to the application unit and the separation device, image acquisition along the second carrier from before and after the application unit and after the separation device is transmitted to the control unit, and the control unit feeds signals based on these image acquisitions to corresponding adjustment devices of the first receiving portion and / or the second receiving portion and / or the separation device and / or the application unit and / or the image acquisition device.

Images