Chip substrate reinforcing ring bump forming device

By combining the arc-shaped positioning surface and the raised part for pitting, the problems of flatness control and uneven stress in the pitting of stainless steel ring products are solved, achieving efficient and stable pitting and extending the mold life.

CN122274007APending Publication Date: 2026-06-26WEIFANG YUYUAN ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WEIFANG YUYUAN ELECTRONICS CO LTD
Filing Date
2026-04-11
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In the existing technology, the pitting forming process of stainless steel ring products has the problems of difficulty in controlling flatness, uneven stress, resulting in a high rate of unqualified pitting forming. In addition, the mold structure is complex and difficult to maintain. Furthermore, the uneven surface of the reinforcing ring during stamping leads to inconsistencies in the depth, size, and density of the pits.

Method used

The upper and lower arc-shaped positioning surfaces are matched with the reinforcing ring, and combined with the pitted protrusions and positioning inserts, the hydraulic press is used to achieve precise positioning and uniform force, ensuring that the depth, size and density of the pitting are consistent.

Benefits of technology

It improves the lifespan of parts, ensures the quality and consistency of pitting molding, simplifies the operation process, reduces maintenance costs, and adapts to the processing needs of products of different specifications.

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Abstract

This invention relates to a chip substrate reinforcing ring pitting forming apparatus, specifically within the field of chip substrate reinforcing ring pitting processing technology. It includes an arc-shaped upper positioning surface matching the curvature of the top surface of the reinforcing ring, and an arc-shaped lower positioning surface matching the curvature of the bottom surface of the reinforcing ring. A plurality of pitting forming protrusions are arrayed on the arc-shaped lower positioning surface, and pressure is applied to the arc-shaped upper positioning surface via a press. This invention solves the problems of traditional reinforcing ring pitting processing using progressive die forming processes, which suffer from ineffective control of the reinforcing ring's flatness, uneven force distribution during pitting formation, and lateral force due to the inability of the pressure center to coincide with the force center of each station caused by multiple workstations. Furthermore, the invention addresses the issues of uneven force distribution during reinforcing ring pitting formation caused by the non-flat surface of the reinforcing ring using a pitting stamping method, and the tendency for the reinforcing ring to shift within the die, resulting in irregular deviations in the depth, size, density, and shape of the pits.
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