Full-automatic feeding and discharging device for laser stripping system

Abstract

This invention relates to the field of semiconductor processing equipment technology, specifically to a fully automated loading and unloading device for laser lift-off systems. It primarily addresses the problems of poor buffer coordination, low positioning accuracy, and inability to automatically connect with AGVs in existing loading and unloading methods. The device includes a loading mechanism, an unloading mechanism, and a transport mechanism. Both the loading and unloading mechanisms are equipped with buffer stations and docking stations with a Y-axis telescopic carrier plate. The loading mechanism also includes a docking station integrating a rotating structure and alignment sensors. The transport mechanism's transport grippers move along an X-axis transport guide rail to transfer crystal ingots. This device uses multi-station buffering to match the difference in cycle time between AGV batch handling and single-piece processing, rotary positioning to ensure high repeatability, and the docking station to achieve unmanned docking with AGVs, comprehensively improving production efficiency and process stability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, and in particular to a fully automatic loading and unloading device for a laser lift-off system. Background Technology

[0002] Silicon carbide (SiC), a typical representative of third-generation semiconductor materials, possesses excellent properties such as wide bandgap, high breakdown electric field, and high thermal conductivity, making it suitable for manufacturing power devices in extreme environments such as high voltage, high frequency, and high temperature. In the manufacturing process of SiC power devices, laser lift-off (LLO) is a crucial step, separating the SiC epitaxial layer from the original substrate to form an independent device processing substrate. However, laser lift-off equipment has stringent requirements for the loading and unloading processes: on the one hand, laser lift-off is performed one substrate at a time, with a relatively fixed and fast cycle time; on the other hand, in actual production lines, SiC substrates are typically transported in batches from upstream processes to the laser lift-off station by automated guided vehicles (AGVs).

[0003] Existing loading and unloading methods mainly rely on manual operation or semi-automatic mechanical devices: In manual operation, operators remove substrates one by one from the material box and place them at the processing station, then remove them and place them in the receiving box after processing; semi-automatic methods use simple robotic arms with simple fixtures for grasping and placing. These methods have the following shortcomings in practical applications: First, the lack of a dedicated loading buffer station makes it impossible to balance the difference in cycle time between AGV batch transport and laser lift-off system's individual processing, easily leading to excessively long AGV waiting times or insufficient material supply from the laser lift-off equipment; Second, the positioning repeatability of manual operation or simple mechanical devices cannot meet the high precision requirements of the laser lift-off system for substrate position, and excessive positional deviation will lead to uneven laser energy distribution or substrate breakage; Third, existing loading and unloading devices lack a stable and reliable standard interface with the AGV, and substrate transfer between devices still requires manual intervention or relies on simple physical alignment, failing to achieve seamless automated handover.

[0004] In summary, existing laser peeling loading and unloading methods have shortcomings in terms of buffer coordination, handling and positioning accuracy, and automatic handover between equipment, making it difficult to meet the needs of full-process automation in laser peeling production lines. Summary of the Invention

[0005] To overcome the technical defects of existing laser peeling loading and unloading methods, such as poor multi-station buffer coordination, poor handling and positioning accuracy, and inability to achieve automatic handover with AGVs, this invention proposes a fully automatic loading and unloading device for laser peeling systems.

[0006] The fully automatic loading and unloading device for a laser peeling system provided by the present invention includes: The feeding mechanism includes a feeding frame, which has multiple feeding buffer stations arranged along the Y direction, a feeding handover station located on the Y-front side of the feeding buffer stations, and a feeding docking station located on the Y-rear side of the feeding buffer stations. The feeding buffer stations are used to carry crystal ingots. The feeding handover station integrates a rotating structure and a positioning sensor and is used to achieve circumferential positioning of the crystal ingots. The feeding docking station integrates a feeding carrier plate and a feeding drive component. The feeding drive component is used to drive the feeding carrier plate to translate along the Y direction to extend or retract within the feeding frame. The feeding frame is also equipped with a feeding transport module, which is used to realize the transfer of crystal ingots between the feeding buffer stations, the feeding handover station, and the feeding carrier plate retracted within the feeding frame. The unloading mechanism includes an unloading frame, which has multiple unloading buffer stations arranged along the Y direction and an unloading docking station located behind the unloading buffer stations. The unloading buffer stations are used to carry crystal ingots. The unloading docking station integrates an unloading carrier plate and an unloading drive component. The unloading drive component is used to drive the unloading carrier plate to translate along the Y direction to extend or retract within the unloading frame. The unloading frame is also equipped with an unloading transport module, which is used to realize the transfer of crystal ingots between the unloading buffer stations and the unloading carrier plate retracted within the unloading frame. The conveying mechanism includes an X-axis transport guide rail, a transport drive component, and a transport gripper. The two ends of the X-axis transport guide rail are located in front of the loading mechanism and the unloading mechanism, respectively. The middle part of the X-axis transport guide rail is used to correspond to the laser stripping equipment. The transport gripper is slidably mounted on the X-axis transport guide rail. The transport drive component is used to drive the transport gripper to move along the X-axis transport guide rail to realize the transfer of the crystal ingot between the loading handover station, the laser stripping equipment, and the unloading buffer station.

[0007] Furthermore, both the loading buffer station and the unloading buffer station are support stations formed by two support blocks. The top surface of each support block is provided with an opening slot. The opening slots of the two support blocks in the same support station are arranged opposite each other in the Y direction to jointly form a slot for supporting the crystal ingot.

[0008] Furthermore, the two support blocks between adjacent support stations are replaced by a common block, the top surface of which has two opening slots arranged opposite each other in the Y direction.

[0009] Furthermore, the rotating structure includes a rotary table and a servo motor. The servo motor is connected to the rotary table and is used to drive the rotary table to rotate. The alignment sensor is a vision sensor, which achieves circumferential positioning by detecting the notch in the crystal ingot.

[0010] Furthermore, both the loading docking station and the unloading docking station are integrated with strip-shaped platforms. The strip-shaped platforms extend along the Y direction and protrude outward from the corresponding frame. The loading carrier plate and the unloading carrier plate are slidably mounted on the corresponding strip-shaped platforms.

[0011] Furthermore, both the loading and unloading transport modules include a Y-axis linear module, a Z-axis linear module, and a first gripper. The fixed part of the Y-axis linear module is connected to the corresponding frame, the fixed part of the Z-axis linear module is connected to the output part of the Y-axis linear module, and the first gripper is mounted on the output part of the Z-axis linear module and connected to a first opening and closing drive component.

[0012] Furthermore, the transport gripper includes a mounting frame, a lifting drive component, and a second gripper. The mounting frame is slidably mounted on the X-direction transport guide rail. The transport drive component is mounted between the mounting frame and the X-direction transport guide rail and is used to drive the mounting frame to move along the X-direction transport guide rail. The fixed part of the lifting drive component is connected to the mounting frame. The second gripper is mounted on the output part of the lifting drive component and is connected to a second opening and closing drive component.

[0013] Furthermore, the transport drive component includes a rack and a drive gear. The rack is fixed to the X-direction transport guide rail and extends along the X-direction transport guide rail. The drive gear is mounted on the mounting bracket and connected to a rotary drive component.

[0014] The technical solution provided by this invention has the following advantages compared with the prior art.

[0015] 1) High-efficiency buffer and cycle time matching: The loading and unloading racks are equipped with multiple loading and unloading buffer stations, which serve as buffer zones to allow AGVs to transport or pick up a batch of crystal ingots at one time. At the same time, the laser stripping equipment can process one piece at a time, effectively solving the cycle time mismatch problem between AGV batch handling and laser stripping equipment single-piece processing, and greatly improving the overall production line efficiency.

[0016] 2) Fully Automated Precision Handling and Positioning: Through the loading and unloading handling modules, the material transfer between "loading docking station ↔ loading buffer station ↔ loading handover station" and "unloading buffer station ↔ unloading docking station" is completed automatically. The handling mechanism automatically completes the material transfer between the loading handover station and the laser stripping equipment, as well as between the laser stripping equipment and the unloading buffer station, realizing fully automated handling. The rotating structure and alignment sensor integrated in the loading handover station can perform circumferential positioning of the crystal ingot, ensuring high repeatability and positioning accuracy of the crystal ingot during each transfer and processing, improving process stability and product yield.

[0017] 3) Reliable AGV automatic interaction: The carrier plates of the loading and unloading docking stations extend out of the corresponding frames under the drive of the drive components to realize automatic handover with the AGV; the system can automatically identify the crystal ingots delivered by the AGV and allocate them to the idle buffer station. After processing, the crystal ingots are automatically sent to the carrier plate of the docking station to wait for the AGV to pick them up, realizing unmanned operation.

[0018] 4) Modular and highly scalable: The loading and unloading mechanism is connected to the laser stripping equipment via an X-axis transport rail. The laser stripping equipment can operate independently or multiple devices can be connected in series by extending the X-axis transport rail and served by the same handling mechanism, achieving linear and flexible expansion of equipment capacity. The buffering capacity provided by the loading buffer station and the unloading buffer station effectively decouples the AGV feeding and picking cycle from the equipment processing cycle, improving the overall system utilization and production efficiency. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the fully automatic loading and unloading device in an embodiment of the present invention; Figure 2 This is a schematic diagram of the feeding mechanism in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the feeding buffer station in an embodiment of the present invention; Figure 4 This is a schematic diagram of the material loading and handover station in an embodiment of the present invention. Figure 5 This is a schematic diagram of the material loading and docking station in an embodiment of the present invention; Figure 6 This is a schematic diagram of the material handling module in an embodiment of the present invention; Figure 7 This is a schematic diagram of the transport mechanism in an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the transport gripper in an embodiment of the present invention; Figure 9 This is a schematic diagram showing the appearance of the fully automatic loading and unloading device in an embodiment of the present invention; Figure 10This is a schematic diagram illustrating the application of the fully automatic loading and unloading device in an embodiment of the present invention.

[0022] In the picture: 1. Feeding mechanism; 11. Feeding frame; 12. Feeding buffer station; 121. Support block; 122. Opening slot; 123. Common block; 13. Feeding handover station; 131. Rotating structure; 132. Alignment sensor; 14. Feeding docking station; 141. Feeding carrier plate; 142. Feeding drive component; 143. Strip platform; 15. Feeding and handling module; 151. Y-axis linear module; 152. Z-axis linear module; 153, first gripper; 154, first opening and closing drive; 2, unloading mechanism; 3, conveying mechanism; 31, X-axis transport guide rail; 32, transport drive; 321, rack; 322, drive gear; 33, transport gripper; 331, mounting bracket; 332, lifting drive; 333, second gripper; 334, second opening and closing drive; 100, crystal ingot; 200, laser stripping equipment. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of the present invention, the solutions of the present invention will be further described below. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the invention, but the invention may also be practiced in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of the invention, and not all embodiments.

[0025] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0026] Reference Figure 1 This embodiment provides a fully automatic loading and unloading device for a laser peeling system, including a loading mechanism 1, an unloading mechanism 2, and a conveying mechanism 3.

[0027] Among them, reference Figures 2 to 6The feeding mechanism 1 includes a feeding frame 11, which has multiple feeding buffer stations 12 arranged along the Y direction, a feeding handover station 13 located on the Y-front side of the feeding buffer station 12, and a feeding docking station 14 located on the Y-rear side of the feeding buffer station 12. The feeding buffer station 12 is used to carry the crystal ingot 100, and the feeding handover station 13 integrates a rotating structure 131 and a positioning sensor 132 and is used to realize the circumferential movement of the crystal ingot 100. The positioning and loading docking station 14 integrates a loading carrier plate 141 and a loading drive component 142. The loading drive component 142 is used to drive the loading carrier plate 141 to translate along the Y direction to extend or retract from the loading frame 11. The loading frame 11 is also equipped with a loading and transport module 15. The loading and transport module 15 is used to realize the transfer of the crystal ingot 100 between the loading buffer station 12, the loading handover station 13 and the loading carrier plate 141 retracted in the loading frame 11.

[0028] Specifically, the number of material loading buffer stations 12 is not limited, for example... Figure 2 In this embodiment, the material loading and buffering station 12 has three stations.

[0029] Specifically, refer to Figure 3 In this embodiment, the loading buffer station 12 is a support station formed by two support blocks 121. Each support block 121 has an opening slot 122 on its top surface. The opening slots 122 of the two support blocks 121 in the same support station are arranged opposite each other in the Y direction to form a slot for supporting the crystal ingot 100. The support blocks 121 are fixed to the loading frame 11 by bolts, welding, or other means. In use, the crystal ingot 100 is placed in the slot for support and positioning. This loading buffer station 12 has a simple structural design and a small contact area with the crystal ingot 100, which reduces the probability of damage to the crystal ingot 100 and also facilitates the interaction between the handling mechanism 3 and the crystal ingot 100. In other embodiments, the loading buffer station 12 can also adopt a box structure with a slot.

[0030] As an improved structure of the aforementioned feeding buffer station 12, the two support blocks 121 between adjacent support stations are replaced by a common block 123. The top surface of the common block 123 has two opening slots 122 arranged opposite each other in the Y direction. The design of the common block 123 can further simplify the structure.

[0031] Specifically, refer to Figure 4In this embodiment, the rotating structure 131 includes a rotary table and a servo motor. The servo motor is connected to the rotary table and drives the rotary table to rotate. The alignment sensor 132 is a vision sensor, which achieves circumferential positioning by detecting the notch in the ingot 100. When the ingot 100 is placed in the loading and transfer station 13, the rotary table drives the ingot 100 to rotate. The position of the notch in the ingot 100 is detected by the vision sensor to rotate the ingot 100 to a preset processing reference angle, ensuring that the ingot 100 is always in the same orientation when picked up by the transport mechanism 3. In other embodiments, the rotating structure 131 may also be a rotary cylinder, and the alignment sensor 132 may also be an infrared through-beam sensor.

[0032] As an improved structure of the material loading and docking station 14, refer to Figure 5 In this embodiment, the loading docking station 14 also integrates a strip platform 143, which extends along the Y direction and protrudes beyond the loading frame 11. The loading carrier plate 141 is slidably mounted on the strip platform 143. The slidable connection between the loading carrier plate 141 and the strip platform 143 can improve the accuracy and stability of the movement of the loading carrier plate 141; the strip platform 143, by being fixedly connected to the loading frame 11, can improve the structural stability when the carrier plate protrudes beyond the loading frame 11.

[0033] Specifically, refer to Figure 6 The loading and handling module 15 of this embodiment includes a Y-axis linear module 151, a Z-axis linear module 152, and a first gripper 153. The fixed part of the Y-axis linear module 151 is connected to the loading frame 11, and the fixed part of the Z-axis linear module 152 is connected to the output part of the Y-axis linear module 151. The first gripper 153 is mounted on the output part of the Z-axis linear module 152 and is connected to a first opening and closing drive member 154. The first opening and closing drive member 154 can be a gripper cylinder, two independent cylinders, or other commonly used gripper drive members. During operation, the Y-axis linear module 151 drives the Z-axis linear module 152 and the first gripper 153 to move along the Y-axis as a whole, so as to realize the transfer of the crystal ingot 100 between the loading buffer station 12, the loading handover station 13 and the loading carrier plate 141 retracted in the loading frame 11; the Z-axis linear module 152 drives the first gripper 153 to move up and down in the Z-axis to move to the target height to grip or place the crystal ingot 100; the first opening and closing drive member 154 drives the first gripper 153 to open or close, so as to realize the gripping or placement of the crystal ingot 100. This loading and handling module 15 is reasonably arranged and has strong structural stability. In other embodiments, the loading and handling module 15 can also place the Y-axis linear module 151 on the output part of the Z-axis linear module 152, and then place the first gripper 153 on the output part of the Y-axis linear module 151.

[0034] Among them, reference Figure 1The unloading mechanism 2 includes an unloading frame, which has multiple unloading buffer stations arranged along the Y direction and an unloading docking station located behind the unloading buffer stations. The unloading buffer stations are used to carry the crystal ingot 100. The unloading docking station integrates an unloading carrier plate and an unloading drive component. The unloading drive component is used to drive the unloading carrier plate to translate along the Y direction to extend or retract from the unloading frame. The unloading frame is also equipped with an unloading transport module, which is used to realize the transfer of the crystal ingot 100 between the unloading buffer stations and the unloading carrier plate retracted in the unloading frame.

[0035] It should be noted that the unloading mechanism 2 is basically the same as the loading mechanism 1, the only difference being that the unloading mechanism 2 does not have a handover station, so the specific structure of the unloading mechanism 2 will not be described here.

[0036] It should be noted that since the unloading mechanism 2 does not have a handover station, the number of unloading buffer stations can be designed to be more than the number of loading buffer stations 12, provided that the overall dimensions are the same. For example... Figure 1 As shown in the figure, this embodiment has four material feeding buffer stations.

[0037] Among them, reference Figure 7 and Figure 8 The conveying mechanism 3 includes an X-axis transport guide rail 31, a transport drive component 32, and a transport gripper 33. The two ends of the X-axis transport guide rail 31 are located in front of the loading mechanism 1 and the unloading mechanism 2, respectively. The middle part of the X-axis transport guide rail 31 is used to correspond to the laser stripping device 200. The transport gripper 33 is slidably mounted on the X-axis transport guide rail 31. The transport drive component 32 is used to drive the transport gripper 33 to move along the X-axis transport guide rail 31 to realize the transfer of the ingot 100 between the loading handover station 13, the laser stripping device 200, and the unloading buffer station.

[0038] Specifically, the transport gripper 33 in this embodiment includes a mounting frame 331, a lifting drive component 332, and a second gripper 333. The mounting frame 331 is slidably mounted on the X-direction transport guide rail 31. The transport drive component 32 is mounted between the mounting frame 331 and the X-direction transport guide rail 31 and is used to drive the mounting frame 331 to move along the X-direction transport guide rail 31. The fixed part of the lifting drive component 332 is connected to the mounting frame 331. The second gripper 333 is mounted on the output part of the lifting drive component 332 and is connected to a second opening and closing drive component 334. The lifting drive component 332 can be a linear motor, a linear module, or other commonly used linear power components. The second opening and closing drive component 334 can be a gripper cylinder, two independent cylinders, or other commonly used gripper drive components. During operation, the transport drive 32 drives the transport gripper 33 to move along the X direction to realize the transfer of the crystal ingot 100 between the loading and handover station 13, the laser stripping equipment 200 and the unloading buffer station; the lifting drive 332 drives the second gripper 333 to lift to the target height to grip or place the crystal ingot 100; the second opening and closing drive 334 drives the second gripper 333 to open or close to realize the gripping or placement of the crystal ingot 100.

[0039] Specifically, the transport drive component 32 in this embodiment includes a rack 321 and a drive gear 322. The rack 321 is fixed to and extends along the X-direction transport guide rail 31, and the drive gear 322 is mounted on the mounting frame 331 and connected to a rotary drive component. The rotary drive component can be a common rotary power component such as a rotary motor and its matching structure with a reducer. The movement of the transport gripper 33 is achieved through the cooperation of the rack 321 and the drive gear 322. The structure is simple and has high motion accuracy. In other embodiments, a connecting block can also be fixed on the straight section of the synchronous belt. The connecting block is fixedly connected to the mounting frame 331, and the synchronous belt moves to drive the mounting frame 331 to move along the X-direction.

[0040] Reference Figure 9 and Figure 10 In this embodiment, the fully automatic loading and unloading device can be integrated into the laser stripping system during installation: the loading mechanism 1 and the unloading mechanism 2 are distributed on the left and right sides of the laser stripping equipment 200; the conveying mechanism 3 is set up behind all the laser stripping equipment 200, and multiple devices are arranged along the X direction. Figure 10 The image shows two laser stripping devices 200 connected in series. In practice, the number of devices can be increased or decreased according to production needs, simply by extending or shortening the X-axis transport guide rail 31 accordingly. The AGV can move automatically within the workshop, interacting with the extended loading and unloading carriers 141 and 141, respectively.

[0041] The working principle of the fully automatic loading and unloading device for the laser peeling system in this embodiment is as follows: S1. AGV loading: The AGV transports the unprocessed crystal ingot 100 to the docking position of the loading mechanism 1. The loading drive 142 drives the loading carrier plate 141 to extend out of the loading frame 11 along the Y direction. After receiving the crystal ingot 100, it drives the loading carrier plate 141 to retract into the loading frame 11. S2. Ingot 100 Buffer: The first gripper 153 of the loading and conveying module 15 descends to grip the ingot 100 on the loading carrier plate 141, lifts it up and moves it along the Y direction to the idle loading buffer station 12 and puts down the ingot 100. This process is repeated to transfer the ingots 100 one by one to the loading buffer station 12 for buffering. S3. Ingot 100 Positioning and Handover: When the laser stripping equipment 200 sends a demand signal, the loading and handling module 15 transports the ingot 100 located at the front of the loading buffer station 12 to the loading handover station 13. The rotating structure 131 starts to perform circumferential angle correction on the ingot 100, and the alignment sensor 132 confirms that the positioning is completed. After the correction is completed, the transport gripper 33 of the handling mechanism 3 moves to the top of the loading handover station 13, descends and grabs the ingot 100. S4. Cross-equipment handling: The transport gripper 33 carries the ingot 100 along the X-direction transport guide rail 31 to the loading position of the target laser stripping equipment 200, and places the ingot 100 into the processing station of the equipment; S5. Equipment processing: Laser stripping equipment 200 processes ingot 100; S6. Picking and placing the processed crystal ingot 100: After processing, the transport gripper 33 moves to the laser stripping device 200 to pick up the processed crystal ingot 100, moves along the X-direction transport guide rail 31 to the unloading mechanism 2, and places the processed crystal ingot 100 in an idle unloading buffer station for temporary storage. S7. AGV unloading: When the AGV comes to pick up the material, the unloading and handling module takes the temporarily stored processed crystal ingot 100 from the unloading buffer station and puts it into the unloading carrier plate that is retracted in the unloading frame; then the unloading drive unit drives the unloading carrier plate to extend out of the unloading frame along the Y direction, and the AGV takes away the processed crystal ingot 100 and sends it to the next process.

[0042] In the above process, multiple loading buffer stations 12 and unloading buffer stations play a crucial buffering role, allowing the AGV's transport cycle time to be less strictly synchronized with the processing cycle time of the laser stripping equipment 200, greatly improving the overall flexibility and efficiency of the system. The entire structure, through clear functional division and modular design, achieves efficient, reliable, and easily expandable automated loading and unloading.

[0043] The above are merely specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Although detailed descriptions have been provided with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments, and they should all be covered within the protection scope of the claims.

Claims

1. A fully automatic loading and unloading device for a laser peeling system, characterized in that, include: The feeding mechanism (1) includes a feeding frame (11), which is provided with a plurality of feeding buffer stations (12) arranged along the Y direction, a feeding handover station (13) located on the Y-front side of the feeding buffer station (12), and a feeding docking station (14) located on the Y-rear side of the feeding buffer station (12). The feeding buffer station (12) is used to carry the crystal ingot (100), and the feeding handover station (13) integrates a rotating structure (131) and a positioning sensor (132) and is used to realize the circumferential positioning of the crystal ingot (100). The loading docking station (14) integrates a loading carrier plate (141) and a loading drive component (142). The loading drive component (142) is used to drive the loading carrier plate (141) to translate along the Y direction to extend or retract from the loading frame (11). The loading frame (11) is also equipped with a loading transport module (15). The loading transport module (15) is used to realize the transfer of the ingot (100) between the loading buffer station (12), the loading handover station (13) and the loading carrier plate (141) retracted in the loading frame (11). The unloading mechanism (2) includes an unloading frame, which is provided with a plurality of unloading buffer stations arranged along the Y direction and an unloading docking station located behind the unloading buffer stations. The unloading buffer stations are used to carry the ingot (100). The unloading docking station integrates an unloading carrier plate and an unloading drive component. The unloading drive component is used to drive the unloading carrier plate to translate along the Y direction to extend or retract from the unloading frame. The unloading frame is also equipped with an unloading transport module. The unloading transport module is used to realize the transfer of the ingot (100) between the unloading buffer stations and the unloading carrier plate retracted in the unloading frame. The conveying mechanism (3) includes an X-axis transport guide rail (31), a transport drive (32), and a transport gripper (33). The two ends of the X-axis transport guide rail (31) are located in front of the loading mechanism (1) and the unloading mechanism (2), respectively. The middle part of the X-axis transport guide rail (31) is used to correspond to the laser stripping device (200). The transport gripper (33) is slidably mounted on the X-axis transport guide rail (31). The transport drive (32) is used to drive the transport gripper (33) to move along the X-axis transport guide rail (31) to realize the transfer of the ingot (100) between the loading handover station (13), the laser stripping device (200), and the unloading buffer station.

2. The fully automatic loading and unloading device for a laser peeling system according to claim 1, characterized in that, The loading buffer station (12) and the unloading buffer station are both support stations formed by two support blocks (121). The top surface of each support block (121) is provided with an opening slot (122). The opening slots (122) of the two support blocks (121) of the same support station are arranged opposite each other in the Y direction to jointly form a slot for carrying the crystal ingot (100).

3. The fully automatic loading and unloading device for a laser peeling system according to claim 2, characterized in that, The two support blocks (121) between adjacent support stations are replaced by a common block (123), and the top surface of the common block (123) has two opening slots (122) arranged opposite each other in the Y direction.

4. The fully automatic loading and unloading device for a laser peeling system according to claim 1, characterized in that, The rotating structure (131) includes a rotating table and a servo motor. The servo motor is connected to the rotating table and is used to drive the rotating table to rotate. The alignment sensor (132) is a vision sensor. The vision sensor achieves circumferential positioning by detecting the notch in the ingot (100).

5. The fully automatic loading and unloading device for a laser peeling system according to claim 1, characterized in that, Both the loading docking station (14) and the unloading docking station are integrated with strip-shaped platforms (143). The strip-shaped platforms (143) extend along the Y direction and extend outward from the corresponding frame. The loading carrier plate (141) and the unloading carrier plate are slidably installed on the corresponding strip-shaped platforms (143).

6. The fully automatic loading and unloading device for a laser peeling system according to claim 1, characterized in that, Both the loading and unloading transport module (15) and the unloading transport module include a Y-axis linear module (151), a Z-axis linear module (152), and a first gripper (153). The fixed part of the Y-axis linear module (151) is connected to the corresponding frame, and the fixed part of the Z-axis linear module (152) is connected to the output part of the Y-axis linear module (151). The first gripper (153) is installed on the output part of the Z-axis linear module (152) and is connected to a first opening and closing drive (154).

7. The fully automatic loading and unloading device for a laser peeling system according to claim 1, characterized in that, The transport gripper (33) includes a mounting frame (331), a lifting drive (332), and a second gripper (333). The mounting frame (331) is slidably mounted on the X-direction transport guide rail (31). The transport drive (32) is mounted between the mounting frame (331) and the X-direction transport guide rail (31) and is used to drive the mounting frame (331) to move along the X-direction transport guide rail (31). The fixed part of the lifting drive (332) is connected to the mounting frame (331). The second gripper (333) is mounted on the output part of the lifting drive (332) and is connected to a second opening and closing drive (334).

8. The fully automatic loading and unloading device for a laser peeling system according to claim 7, characterized in that, The transport drive (32) includes a rack (321) and a drive gear (322). The rack (321) is fixed to the X-direction transport guide (31) and extends along the X-direction transport guide (31). The drive gear (322) is mounted on the mounting bracket (331) and connected to a rotary drive.

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