A tri-branched alkyne resin, polymer and preparation method and application thereof

Abstract

This invention provides a tribranched alkyne resin, polymer, its preparation method, and applications, relating to the technical field of resin materials. The tribranched alkyne resin and polymer synthesized in this invention, relying on a rigid core and ring crosslinking polymerization mechanism, solves the core contradiction of the mutual constraint between the dielectric constant and the coefficient of thermal expansion of traditional resins. The branched structure increases free volume and reduces the dielectric constant, while the symmetrical rigid rings and high crosslinking density inhibit chain segment movement, significantly reducing the coefficient of thermal expansion. The numerous rigid aromatic ring structures in the molecule significantly improve the material's heat resistance and mechanical strength. The resin can be used as a single component or blended with photosensitive resins as a two-component compound, and its performance can be further optimized by adding fillers, offering high formulation flexibility. The preparation and curing processes are simple and mild, the raw materials are readily available, and it is compatible with existing industrial production, making it widely applicable in high-end material fields such as electronic packaging and insulation.

Description

Technical Field

[0001] This invention relates to the technical field of resin materials, and in particular to a tribranched acetylene resin, polymer, preparation method and application thereof. Background Technology

[0002] Driven by 5G communication, artificial intelligence, high-performance computing, and advanced packaging technologies, the integrated circuit industry is rapidly evolving towards higher density, higher frequency, and higher power. This technological trend places stringent demands on key basic materials: on the one hand, they need to significantly reduce dielectric loss and delay during signal transmission to meet the demands of high-speed data processing; on the other hand, they need to maintain excellent dimensional stability in high and low temperature cycling environments to avoid device failure due to thermal stress. Against this backdrop, resin-based composite materials with both low dielectric constant and low coefficient of thermal expansion have become a core bottleneck restricting the development of advanced integrated circuits. Among current mainstream material systems, traditional epoxy resins, while possessing good process compatibility, struggle to balance dielectric properties and thermal stability; polyimide materials, while exhibiting excellent thermomechanical properties, suffer from a relatively high dielectric constant. Therefore, developing novel resin materials that combine low dielectric properties, low coefficient of thermal expansion, and process adaptability has become a crucial path to breaking through the physical limits of integrated circuits and driving the continued evolution of Moore's Law.

[0003] Currently, mainstream resin-based composite material systems (such as epoxy resins, bismaleimide resins, and benzocyclobutene-cured systems) face a key performance bottleneck in material design: the difficulty in simultaneously achieving synergistic control of ultra-low dielectric constant (Dk) and low coefficient of thermal expansion (CTE). From a material physics perspective, reducing the dielectric constant typically relies on increasing the free volume of the material through molecular structure design (such as introducing large-volume side groups, rigid ring structures, or hollow nanounits). However, this strategy weakens intermolecular chain interactions, lowers the activation energy of chain segment movement, and leads to a decrease in the dimensional stability of the material under temperature changes, manifested as a significant increase in CTE. Conversely, reducing CTE requires increasing intermolecular hydrogen bonds, π-π stacking, or covalent crosslinking density to improve chain segment rigidity and orientation. However, such designs often involve an increase in the density of polar groups (such as ether bonds and carbonyl groups), leading to enhanced dipole polarization effects and directly causing an increase in the Dk value. This inherent contradiction between free volume, chain segment motion, and polar density constitutes the core challenge in the design of high-performance low-dielectric / low-thermal-expansion composite materials, and it is urgent to achieve a performance balance through innovative strategies of molecular engineering and microstructure regulation.

[0004] In view of this, the present invention is hereby proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a solution. This invention aims to resolve the technical contradiction that existing resin systems cannot simultaneously achieve ultra-low dielectric constant (Dk) and low coefficient of thermal expansion (CTE), making it difficult to meet the core requirements of high-frequency, high-power integrated circuits for materials with low signal transmission loss and good dimensional stability; at the same time, it also solves the problem that traditional resins cannot simultaneously achieve the desired heat resistance, mechanical properties, dielectric properties, and expansion properties.

[0006] In order to achieve the above-mentioned objectives of the present invention, the following technical solution is adopted: In a first aspect, the present invention provides a tribranched acetylene resin, the structural formula of which is shown in Formula I below:

[0007] Formula I; Wherein, R includes C, N, , , , , , Any one of them.

[0008] In a second aspect, the present invention provides a method for preparing a tribranched acetylene resin as described in the first aspect, the method comprising: Compound A reacts with halopropyne B to yield a tribranched acetylene resin as shown in Formula I; the reaction formula is as follows: ; Wherein, R includes C, N, , , , , , Any one of them; X includes halogen atoms.

[0009] Furthermore, the halogen atom includes any one of fluorine, chlorine, bromine or iodine, preferably bromine.

[0010] Furthermore, the reaction is carried out in the presence of a base and a catalyst.

[0011] Furthermore, the alkali includes any one or a combination of at least two of potassium carbonate, sodium carbonate, sodium hydroxide, potassium hydroxide, potassium phosphate, cesium carbonate, and sodium hydride.

[0012] Furthermore, the catalyst comprises any one or a combination of at least two of tetrabutylammonium bromide, tetrabutylammonium hydrogen sulfate, benzyltriethylammonium chloride, 18-crown-6, potassium iodide, sodium iodide, copper iodide, and copper bromide.

[0013] Furthermore, the molar ratio of compound A, halopropyne B, base, and catalyst is 1:(3~3.6):(2.5~3.5):(0.05~0.15).

[0014] Furthermore, the reaction is carried out in a solvent.

[0015] Furthermore, the solvent includes any one or a combination of at least two of the following: dimethyl sulfoxide, ethanol, toluene, N,N-dimethylformamide, acetonitrile, acetone, butanone, tetrahydrofuran, and dichloromethane.

[0016] Furthermore, the reaction temperature is 25~110℃, and the reaction time is 4~48 h.

[0017] Thirdly, the present invention provides a polymer of a tribranched acetylene resin, the polymer of which has the following structural formula II:

[0018] Formula II; Where m, n, and p are the number of chain segments, m≥2, n≥2, and p≥2; R includes C, N, ... , , , , , Any one of them.

[0019] Furthermore, the 10GHz dielectric constant Dk of the polymer of the tribranched acetylene resin is 1.5~3.5, preferably 1.5~3.0, and more preferably 1.5~2.5.

[0020] Furthermore, the coefficient of thermal expansion of the polymer of the tribranched acetylene resin is 30~60 ppm / ℃, preferably 30~50 ppm / ℃, and more preferably 30~45 ppm / ℃.

[0021] Fourthly, the present invention provides a method for preparing a polymer of a tribranched acetylene resin as described in the third aspect, the method comprising: The tribranched acetylene resin shown in Formula I undergoes a cyclization polymerization reaction to obtain the polymer of the tribranched acetylene resin shown in Formula II.

[0022] Furthermore, the cyclization polymerization reaction is carried out in the presence of an initiator.

[0023] Furthermore, the initiator includes peroxide initiators.

[0024] Further, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, di(2,4-dichlorobenzoyl peroxide), diacetyl peroxide, dioctyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide, tert-butyl peroxypentanoate, tert-butyl peroxide-2-ethylhexanoate, tert-pentyl peroxide-2-ethylhexanoate, tert-pentyl peroxypentanoate, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, di(p-tert-butylcyclohexyl peroxide), methyl ethyl ketone peroxide, and cyclohexanone peroxide.

[0025] Furthermore, the mass ratio of the tribranched acetylene resin and the initiator shown in Formula I is (80~100):(0.5~10).

[0026] Furthermore, the cyclization polymerization reaction is carried out at a temperature of 130~240℃ and for a time of 0.5~72 h.

[0027] Fifthly, the present invention provides a one-component thermosetting composition, wherein the one-component thermosetting composition comprises, by weight, 20-80 parts of the tribranched acetylene resin described in the first aspect, 0-80 parts of filler, 0.1-5 parts of initiator, 10-30 parts of solvent, and 0-5 parts of additives.

[0028] Further, the single-component thermosetting composition comprises, by weight, 40-50 parts of the tribranched acetylene resin described in the first aspect, 35-45 parts of filler, 0.5-1.5 parts of initiator, 20-25 parts of solvent, and 0.5-1.5 parts of additives.

[0029] Furthermore, the filler comprises any one or a combination of at least two of the following: silicon dioxide, aluminum oxide, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate, preferably silicon dioxide.

[0030] Furthermore, the silica includes any one or a combination of at least two of spherical silica, amorphous silica, molten silica, hollow silica, crystalline silica, and synthetic silica, preferably spherical silica.

[0031] Furthermore, the initiator includes peroxide initiators.

[0032] Furthermore, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, diacetyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide-2-ethylhexanoate, tert-pentyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, methyl ethyl ketone peroxide, and cyclohexanone peroxide.

[0033] Further, the solvent includes any one or a combination of at least two of the following: ethanol, isopropanol, n-butanol, diacetone alcohol, ethyl acetate, n-butyl acetate, isopropyl acetate, methyl acetate, isoamyl acetate, ethylene glycol diacetate, acetone, butanone, cyclohexanone, toluene, xylene, solvent oil, ethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, and turpentine.

[0034] Furthermore, the solvent includes butanone and propylene glycol methyl ether acetate.

[0035] Furthermore, the volume ratio of butanone to propylene glycol methyl ether acetate is (2~5):1.

[0036] Furthermore, the additives include dispersants.

[0037] In a sixth aspect, the present invention provides a photothermal curing two-component composition, wherein the photothermal curing two-component composition comprises, by weight, 10-50 parts of the tribranched acetylene resin described in the first aspect, 5-25 parts of photosensitive resin, 10-70 parts of filler, 0.1-5 parts of initiator, 0.1-5 parts of photosensitizer, 10-30 parts of solvent, and 0-5 parts of additives.

[0038] Further, the photothermal curing two-component composition comprises, by weight, 20-40 parts of the tribranched acetylene resin described in the first aspect, 10-20 parts of the photosensitive resin, 25-45 parts of the filler, 0.5-1.5 parts of the initiator, 0.5-1.5 parts of the photosensitizer, 20-25 parts of the solvent, and 0.5-1.5 parts of the additives.

[0039] Furthermore, the photosensitive resin includes photosensitive acrylic resin and / or photosensitive methacrylic resin.

[0040] Furthermore, the photosensitive acrylic resin includes any one or a combination of at least two of the following (A) to (G): (A) Hydroxyalkyl acrylates: 2-hydroxyethyl acrylate and / or 2-hydroxybutyl acrylate; (B) Mono- or diacrylates of glycols: any one or a combination of at least two of ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; (C) Acrylamide: N,N-dimethylacrylamide and / or N-hydroxymethylacrylamide; (D) Aminoalkyl acrylates: N,N-dimethylaminoethyl acrylate; (E) Polyacrylate I: Polyacrylates of any one or at least two of polyols or their adducts of ethylene oxide, propylene oxide, and ε-caprolactone; wherein the polyols include any one or at least two of trimethylolpropane, pentaerythritol, and dipentaerythritol; (F) Polyacrylate II: Any one or a combination of at least two of polyacrylates containing phenols or their adducts to ethylene oxide or propylene oxide; wherein the phenols include phenoxyacrylates and / or phenoxyethyl acrylates; (G) Epoxy acrylate: Epoxy acrylate derived from glycidyl ether; wherein the glycidyl ether includes trimethylolpropane triglycidyl ether; And / or, the photosensitive methacrylate resin includes any one or a combination of at least two of the acrylates (A) to (G) mentioned above.

[0041] Furthermore, the filler comprises any one or a combination of at least two of the following: silicon dioxide, aluminum oxide, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate, preferably silicon dioxide.

[0042] Furthermore, the silica includes any one or a combination of at least two of spherical silica, amorphous silica, molten silica, hollow silica, crystalline silica, and synthetic silica, preferably spherical silica.

[0043] Furthermore, the initiator includes peroxide initiators.

[0044] Furthermore, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, diacetyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide-2-ethylhexanoate, tert-pentyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, methyl ethyl ketone peroxide, and cyclohexanone peroxide.

[0045] Further, the photosensitizer includes phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, ethyl 2,4,6-trimethylbenzoylphosphonate, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, benzoin dimethyl ether, 2-methyl-1-(4-methylthiophenyl)-2-morpholin-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinphenyl)-1-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinphenyl)-1-butanone, methyl benzoylformate, 2, 2-Diethoxyacetophenone, 1-[4-(phenylthio)phenyl]-1,2-octanedione, 2-(O-benzoyl oxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-acetophenone, 1-(O-acetyl oxime), 2,4,6-trimethylbenzoyl-di(p-tolyl)phosphine oxide, benzophenone, 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 4,4'-bis(diethylamino)benzophenone, bis(2,6-difluoro-3-(1-hydropyrrole-1-yl)phenyl)dicenoctane, diaryliodothionium salt, triarylthionium salt, any one or a combination of at least two of these.

[0046] Further, the solvent includes any one or a combination of at least two of the following: ethanol, isopropanol, n-butanol, diacetone alcohol, ethyl acetate, n-butyl acetate, isopropyl acetate, methyl acetate, isoamyl acetate, ethylene glycol diacetate, acetone, butanone, cyclohexanone, toluene, xylene, solvent oil, ethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, and turpentine oil; Furthermore, the solvent includes butanone and propylene glycol methyl ether acetate.

[0047] Furthermore, the volume ratio of butanone to propylene glycol methyl ether acetate is (2~5):1.

[0048] Furthermore, the additives include dispersants.

[0049] In a seventh aspect, the present invention provides the use of the tribranched acetylene resin as described in the first aspect, the polymer of the tribranched acetylene resin as described in the third aspect, the single-component thermosetting composition as described in the fifth aspect, and the photothermal-curing two-component composition as described in the sixth aspect in the preparation of electronic packaging materials, insulating materials, and / or composite materials.

[0050] Compared with the prior art, the present invention has the following beneficial effects: (1) This invention is based on the synthesis of tribranched acetylene resin with a rigid core. The polymerization process relies on the cyclocrosslinking mechanism to achieve curing. The stable rigid structure formed by cyclocrosslinking improves the overall skeleton strength of the material at the molecular level, avoiding the structural looseness problem caused by the linear polymerization of traditional resins. At the same time, the cyclocrosslinking reaction mode does not generate small molecule byproducts, reducing the internal pores and defects of the material, and greatly improving the structural density and comprehensive performance stability of the cured material.

[0051] (2) The present invention utilizes the branched molecular structure to effectively increase the free volume of the resin system. The spatial steric hindrance between molecules causes more tiny free voids to be formed in the system, reducing the obstruction of molecular polarization and charge transport, and significantly reducing the dielectric constant. At the same time, the reasonable distribution of free volume will not destroy the overall connectivity of the molecular chain. While achieving ultra-low Dk, it ensures that the basic mechanical and heat resistance properties of the material are not damaged.

[0052] (3) The symmetrical structure of the resin described in this invention and the rigid ring formed by cyclization can effectively restrict the thermal motion of molecular chain segments, reduce the polarization of the system, and reduce dielectric polarization loss; while the multifunctionality brought by the branched structure significantly improves the crosslinking density, and the cyclization mechanism of the acetylene resin further strengthens the rigidity of the material. Under the dual effect, the size deformation of the material under temperature change is effectively suppressed, the coefficient of thermal expansion is greatly reduced, and the core contradiction of mutual constraint between Dk and CTE in traditional materials is solved.

[0053] (4) The resin molecules of the present invention introduce rigid cores such as triphenylmethane, triphenylbenzene, and triphenyltriazine, and contain a large number of rigid benzene rings, triazine rings, and biphenyl structures. These aromatic ring structures have high bond energy and stable conjugated systems, which can effectively improve the thermal decomposition temperature and glass transition temperature of the material and enhance its heat resistance. At the same time, the dense arrangement of rigid aromatic rings improves the tensile strength and deformation resistance of the molecular chain, and significantly improves the tensile strength, Young's modulus and other mechanical properties of the material, so as to meet the requirements of electronic materials under high temperature and stress conditions.

[0054] (5) The acetylene resin synthesized in this invention can be used alone as a single-component thermosetting composition, or it can be compounded with photosensitive resin to form a photothermal curing two-component composition. It can also be compounded and modified with fillers such as silica. The formulation design is highly flexible and adaptable to the process requirements of different application scenarios such as electronic packaging, insulating materials, and composite materials. Moreover, after compounding with fillers, the coefficient of thermal expansion can be further reduced to 15~20 ppm / ℃, further optimizing dimensional stability and expanding the application range of the material in the field of high-precision and high-requirement electronic devices.

[0055] (6) The preparation process of the acetylene resin of the present invention is simple and the reaction conditions are mild. The synthesis can be completed by adding the reactants dropwise at room temperature under nitrogen protection and then raising the temperature. There is no need for extreme high temperature and high pressure conditions. The raw materials are readily available and the separation and purification process is simple, making it easy to scale up industrial production. At the same time, the curing process of the prepared resin and composition is controllable. Both single-component thermocuring and two-component photothermal curing can achieve efficient curing, which is compatible with the existing production and processing technology of electronic materials and reduces the cost of industrial application. Detailed Implementation

[0056] Unless otherwise defined herein, the scientific and technical terms used in conjunction with this invention shall have the meanings commonly understood by one of ordinary skill in the art. The meaning and scope of terms shall be clear; however, in any case of potential ambiguity, the definitions provided herein shall prevail over any dictionary or foreign definitions. In this application, unless otherwise stated, the use of "or" means "and / or". Furthermore, the use of the term "comprising" and other forms is non-limiting.

[0057] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] In a first aspect, the present invention provides a tribranched acetylene resin, the structural formula of which is shown in Formula I below:

[0059] Formula I; Wherein, R includes C, N, , , , , , Any one of them.

[0060] It should be noted that a series of thermosetting resins containing acetylene groups are prepared by reacting tribranched rigid cores with acetylene resins of different structures, such as triphenylmethane acetylene resin, triphenylbenzyne resin, triphenylamine acetylene resin, triphenyltriazine acetylene resin, etc. The tribranched acetylene resin described in this invention uses a rigid structure as its core, combining branched molecular configuration and ring crosslinking polymerization mechanism to achieve synergistic optimization of structure and performance. The branched structure increases the free volume of molecules, and the symmetrical rigid rings inhibit the thermal motion of chain segments and reduce the polarizability of the system, which not only significantly reduces the dielectric constant, but also increases the crosslinking density and enhances the rigidity of the material through multifunctionality, solving the problem of mutual constraint between Dk and CTE. At the same time, the large number of rigid benzene rings, triazine rings and other aromatic ring structures in the molecule improves the molecular chain bond energy and conjugation stability, giving the resin both excellent heat resistance and mechanical properties, making it suitable for the stringent requirements of electronic materials.

[0061] In a second aspect, the present invention provides a method for preparing a tribranched acetylene resin as described in the first aspect, the method comprising: Compound A reacts with halopropyne B to yield a tribranched acetylene resin as shown in Formula I; the reaction formula is as follows: ; Wherein, R includes C, N, , , , , , Any one of them; X includes halogen atoms.

[0062] As an optional implementation, the halogen atom in the halopropyne B includes any one of fluorine, chlorine, bromine or iodine.

[0063] In a preferred embodiment, the halogen in the halopropyne B is bromine.

[0064] As an optional implementation, the reaction between compound A and halopropyne B is carried out in the presence of a base and a catalyst.

[0065] As an optional implementation, the alkali includes any one or a combination of at least two of potassium carbonate, sodium carbonate, sodium hydroxide, potassium hydroxide, potassium phosphate, cesium carbonate, and sodium hydride.

[0066] As an optional embodiment, the catalyst includes any one or a combination of at least two of tetrabutylammonium bromide, tetrabutylammonium hydrogen sulfate, benzyltriethylammonium chloride, 18-crown-6, potassium iodide, sodium iodide, copper iodide, and copper bromide.

[0067] As an optional implementation, the molar ratio of compound A, halopropyne B, base, and catalyst is 1:(3~3.6):(2.5~3.5):(0.05~0.15); Among them, "3~3.6" can be, for example, 3, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, etc.; Among them, "2.5~3.5" can be, for example, 2.5, 2.6, 2.8, 3, 3.2, 3.4, 3.5, etc.; Among them, "0.05~0.15" can be, for example, 0.05, 0.06, 0.08, 0.1, 0.12, 0.14, 0.15, etc.

[0068] As an optional implementation, the reaction between compound A and halopropyne B is carried out in a solvent.

[0069] As an optional implementation, the solvent includes any one or a combination of at least two of dimethyl sulfoxide (DMSO), ethanol, toluene, N,N-dimethylformamide, acetonitrile, acetone, butanone, tetrahydrofuran, and dichloromethane.

[0070] As an optional implementation, in the reaction process of compound A and halopropyne B, the reaction temperature is 25~110℃, for example, it can be 25℃, 30℃, 35℃, 40℃, 45℃, 50℃, 55℃, 60℃, 65℃, 70℃, 75℃, 80℃, 85℃, 90℃, 95℃, 100℃, 105℃, 110℃, etc., and the reaction time is 4~48 h, for example, it can be 4h, 6h, 8h, 10h, 12h, 14h, 16h, 18h, 20h, 22h, 24h, 26h, 28h, 30h, 32h, 34h, 36h, 38h, 40h, 42h, 44h, 46h, 48h, etc.

[0071] As an optional implementation, the reaction between compound A and halopropyne B is carried out under inert gas protection.

[0072] As an optional implementation, the inert gas includes nitrogen.

[0073] Thirdly, the present invention provides a polymer of a tribranched acetylene resin, the polymer of which has the following structural formula II:

[0074] Formula II; Where m, n, and p are the number of chain segments, m≥2, n≥2, and p≥2; R includes C, N, ... , , , , , Any one of them.

[0075] It should be noted that the polymer shown in Formula II, based on the tribranched acetylene resin shown in Formula I, forms a dense and stable three-dimensional network rigid structure through cyclic crosslinking polymerization. The branched configuration increases the free volume of molecules and reduces the polarizability of the system, achieving a low dielectric constant of 1.5~3.5 at 10 GHz. The rigid rings and high crosslinking density restrict the thermal motion of molecular chain segments, resulting in a low coefficient of thermal expansion of 30~60 ppm / ℃. Furthermore, it can be further reduced to 15~20 ppm / ℃ after further compounding with fillers. The large number of rigid aromatic rings and cyclic crosslinking structures in the polymer of the tribranched acetylene resin shown in Formula II endow it with excellent heat resistance and mechanical properties, with outstanding glass transition temperature and tensile strength. Its comprehensive performance is suitable for the application requirements of high-end electronic materials such as electronic packaging, electrical insulation, and high-performance composite materials.

[0076] As an optional implementation, the 10GHz dielectric constant Dk of the polymer of the tribranched acetylene resin is 1.5~3.5, for example, it can be 1.5, 1.6, 1.8, 2, 2.2, 2.4, 2.6, 2.8, 3.0, 3.2, 3.4, 3.5, etc.

[0077] In a preferred embodiment, the polymer of the tribranched acetylene resin is a triphenyltriazine acetylene resin polymer with a dielectric constant Dk of 1.5~3.0 at 10 GHz.

[0078] In a preferred embodiment, the polymer of the tribranched acetylene resin is a triphenylbenztriazine acetylene resin polymer, and its 10GHz dielectric constant Dk is 1.5~2.5.

[0079] As an optional embodiment, the polymer of the tribranched acetylene resin has a coefficient of thermal expansion of 30~60 ppm / ℃, for example, it can be 30 ppm / ℃, 32 ppm / ℃, 34 ppm / ℃, 36 ppm / ℃, 38 ppm / ℃, 40 ppm / ℃, 42 ppm / ℃, 44 ppm / ℃, 46 ppm / ℃, 48 ppm / ℃, 50 ppm / ℃, 52 ppm / ℃, 54 ppm / ℃, 56 ppm / ℃, 58 ppm / ℃, 60 ppm / ℃, etc.

[0080] In a preferred embodiment, the polymer of the tribranched acetylene resin is a triphenyltriazine acetylene resin polymer with a coefficient of thermal expansion of 30~50 ppm / ℃.

[0081] In a preferred embodiment, the polymer of the tribranched acetylene resin is triphenylbenztriazine acetylene resin, which has a coefficient of thermal expansion of 30~45 ppm / ℃.

[0082] Fourthly, the present invention provides a method for preparing a polymer of a tribranched acetylene resin as described in the third aspect, the preparation method comprising: The tribranched acetylene resin shown in Formula I undergoes a cyclization polymerization reaction to obtain the polymer of the tribranched acetylene resin shown in Formula II.

[0083] It should be noted that the polymerization mechanism of the tribranched acetylene resin is based on a cyclization reaction: .

[0084] More specifically, the cyclization principle is as follows: .

[0085] As an optional implementation, the cyclization polymerization reaction is carried out in the presence of an initiator.

[0086] As an optional implementation, the initiator includes a peroxide initiator.

[0087] As an optional implementation, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, di(2,4-dichlorobenzoyl peroxide), diacetyl peroxide, dioctyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide, tert-butyl peroxypentanoate, tert-butyl peroxide-2-ethylhexanoate, tert-pentyl peroxide-2-ethylhexanoate, tert-pentyl peroxypentanoate, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, di(p-tert-butylcyclohexyl peroxide), methyl ethyl ketone peroxide, and cyclohexanone peroxide.

[0088] As an optional implementation, the mass ratio of the tribranched acetylene resin and the initiator shown in Formula I is (80~100):(0.5~10); Among them, "80~100" can be, for example, 80, 82, 84, 86, 88, 90, 92, 94, 96, 98, 100, etc.; Among them, "0.5~10" can be, for example, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc.

[0089] As an optional implementation, the temperature of the cyclization polymerization reaction is 130~240℃, for example, it can be 130℃, 140℃, 150℃, 160℃, 170℃, 180℃, 190℃, 200℃, 210℃, 220℃, 230℃, 240℃, etc., and the time of the cyclization polymerization reaction is 0.5~72 h, for example, it can be 0.5 h, 1 h, 6 h, 12 h, 18 h, 24 h, 30 h, 36 h, 42 h, 48 h, 54 h, 60 h, 66 h, 72 h, etc.

[0090] Fifthly, the present invention provides a one-component thermosetting composition, wherein the one-component thermosetting composition comprises, by weight, 20-80 parts of the tribranched acetylene resin described in the first aspect, 0-80 parts of filler, 0.1-5 parts of initiator, 10-30 parts of solvent, and 0-5 parts of additives.

[0091] It should be noted that the single-component thermosetting composition of this invention achieves dual optimization of performance and processability by rationally proportioning tribranched acetylene resin, filler, initiator, solvent, and additives, leveraging the advantages of the cyclic crosslinking polymerization structure of the tribranched acetylene resin. The tribranched acetylene resin described in the first aspect undergoes cyclic crosslinking polymerization under the action of the initiator to form a polymer with low dielectric constant, low coefficient of thermal expansion, excellent heat resistance, and good mechanical properties. The resin, as the core film-forming substance, imparts an ultra-low dielectric constant and low coefficient of thermal expansion to the composition. The compounded filler further reduces the coefficient of thermal expansion, significantly improving dimensional stability. The initiator precisely controls the thermosetting reaction, ensuring curing efficiency and structural density. The solvent is suitable for coating processes, while the additives optimize the system's dispersibility and film-forming properties. The synergistic effect of each component gives the composition excellent heat resistance, mechanical properties, and chemical stability. After curing, it exhibits strong adhesion, making it suitable for the preparation needs of electronic packaging and insulating materials. Furthermore, the single-component system is simple to process and convenient to apply, adapting to existing industrial production processes and reducing application costs.

[0092] As an optional embodiment, in the single-component thermosetting composition, the weight of the tribranched acetylene resin described in the first aspect is 20 to 80 parts, for example, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, etc.

[0093] As an optional embodiment, the filler in the single-component thermosetting composition has a weight ratio of 0 to 80 parts, for example, 0 parts, 0.5 parts, 1 part, 2 parts, 5 parts, 10 parts, 12 parts, 15 parts, 16 parts, 18 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, etc.

[0094] As an optional embodiment, the initiator in the single-component thermosetting composition is 0.1 to 5 parts by weight, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.8, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, etc.

[0095] As an optional embodiment, the solvent in the single-component thermosetting composition is 10 to 30 parts by weight, for example, 10, 12, 14, 15, 16, 18, 20, 22, 24, 25, 26, 28, 30 parts, etc.

[0096] As an optional embodiment, the additive in the single-component thermosetting composition is 0 to 5 parts by weight, for example, 0 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0097] In a preferred embodiment, the single-component thermosetting composition comprises, by weight, 40-50 parts of the tribranched acetylene resin described in the first aspect, 35-55 parts of filler, 0.5-1.5 parts of initiator, 20-25 parts of solvent, and 0.5-1.5 parts of additives; As an optional embodiment, the filler in the single-component thermosetting composition includes any one or a combination of at least two of the following: silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate.

[0098] In a preferred embodiment, the filler in the single-component thermosetting composition is silicon dioxide.

[0099] As an optional embodiment, the silica in the single-component thermosetting composition includes any one or a combination of at least two of spherical silica, amorphous silica, fused silica, hollow silica, crystalline silica, and synthetic silica.

[0100] In a preferred embodiment, the filler in the single-component thermosetting composition is spherical silica.

[0101] As an optional embodiment, the initiator in the one-component thermosetting composition includes a peroxide initiator.

[0102] As an optional embodiment, in the single-component thermosetting composition, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, diacetyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide, tert-butyl peroxide-2-ethylhexanoate, tert-pentyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, methyl ethyl ketone peroxide, and cyclohexanone peroxide.

[0103] As an optional embodiment, the solvent in the one-component thermosetting composition includes any one or a combination of at least two of the following: ethanol, isopropanol, n-butanol, diacetone alcohol, ethyl acetate, n-butyl acetate, isopropyl acetate, methyl acetate, isoamyl acetate, ethylene glycol diacetate, acetone, butanone, cyclohexanone, toluene, xylene, solvent oil, ethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, and turpentine.

[0104] As an optional embodiment, in the single-component thermosetting composition, when the solvent is a mixed solvent of butanone and propylene glycol methyl ether acetate, the volume ratio of butanone and propylene glycol methyl ether acetate is (2~5):1, for example, it can be 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, etc.

[0105] As an optional embodiment, the additives in the one-component thermosetting composition include dispersants.

[0106] In a sixth aspect, the present invention provides a photothermal curing two-component composition, wherein the photothermal curing two-component composition comprises, by weight, 10-50 parts of the tribranched acetylene resin described in the first aspect, 5-25 parts of photosensitive resin, 10-70 parts of filler, 0.1-5 parts of initiator, 0.1-5 parts of photosensitizer, 10-30 parts of solvent, and 0-5 parts of additives.

[0107] It should be noted that the two-component photothermal curing composition of this invention achieves synergistic effects through precise proportioning of each component, relying on the cyclic cross-linking structure of the tribranched acetylene resin and the photocuring characteristics of the photosensitive resin, thus balancing curing efficiency and overall material performance. The tribranched acetylene resin described in the first aspect undergoes cyclic cross-linking polymerization under the action of an initiator to form a polymer with low dielectric constant, low coefficient of thermal expansion, heat resistance, and mechanical properties. The photosensitive resin undergoes polymerization under the action of a photosensitizer. The core tribranched acetylene resin imparts an ultra-low dielectric constant and low coefficient of thermal expansion to the composition. Combined with fillers, dimensional stability can be further optimized, reducing CTE to an even lower level. The initiator and photosensitizer respectively regulate the thermal and photocuring reactions, achieving dual photothermal curing, significantly improving the curing rate and structural density. The photosensitive resin optimizes the film-forming properties and photolithographic compatibility of the system, while the solvent and additives ensure the coating and dispersibility of the slurry. The scientifically and rationally proportioned composition of each component ensures that the cured composition possesses excellent heat resistance, mechanical properties, chemical stability, and resistance to high temperature and humidity. It also exhibits excellent bonding strength, making it suitable for the preparation of high-precision electronic packaging materials such as laminated films. Furthermore, it has strong process adaptability and can meet the requirements of electronic material processing techniques such as photolithography and development.

[0108] As an optional embodiment, in the two-component photothermal curing composition, the weight parts of the tribranched acetylene resin described in the first aspect are 10 to 50 parts, for example, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, 42 parts, 44 parts, 46 parts, 48 ​​parts, 50 parts, etc.

[0109] As an optional embodiment, the photosensitive resin in the two-component photothermal curing composition is 5 to 25 parts by weight, for example, 5, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 25, etc.

[0110] As an optional embodiment, the filler in the two-component photothermal curing composition is 10 to 70 parts by weight, for example, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 55, 60, 65, 70, etc.

[0111] As an optional embodiment, the initiator in the two-component photothermal curing composition is 0.1 to 5 parts by weight, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.8, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, etc.

[0112] As an optional embodiment, the photosensitizer in the two-component photothermal curing composition is 0.1 to 5 parts by weight, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.8, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, etc.

[0113] As an optional embodiment, the solvent in the two-component photothermal curing composition is 10 to 30 parts by weight, for example, 10, 12, 14, 15, 16, 18, 20, 22, 24, 25, 26, 28, 30 parts, etc.

[0114] As an optional implementation, the additives in the two-component photothermal curing composition are 0 to 5 parts by weight, for example, 0 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0115] As an optional embodiment, the photothermal curing two-component composition comprises, by weight, 20-40 parts of the tribranched acetylene resin described in the first aspect, 10-20 parts of photosensitive resin, 25-45 parts of filler, 0.5-1.5 parts of initiator, 0.5-1.5 parts of photosensitizer, 20-25 parts of solvent, and 0.5-1.5 parts of additives; As an optional embodiment, the photosensitive resin includes photosensitive acrylic resin and / or photosensitive methacrylic resin; As an optional embodiment, in the two-component photothermal curing composition, the photosensitive acrylic resin includes any one or a combination of at least two of the following (A) to (G): (A) Hydroxyalkyl acrylates: 2-hydroxyethyl acrylate and / or 2-hydroxybutyl acrylate; (B) Mono- or diacrylates of glycols: any one or a combination of at least two of ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; (C) Acrylamide: N,N-dimethylacrylamide and / or N-hydroxymethylacrylamide; (D) Aminoalkyl acrylates: N,N-dimethylaminoethyl acrylate; (E) Polyacrylate I: Polyacrylates of any one or at least two of polyols or their adducts of ethylene oxide, propylene oxide, and ε-caprolactone; wherein the polyols include any one or at least two of trimethylolpropane, pentaerythritol, and dipentaerythritol; (F) Polyacrylate II: Any one or a combination of at least two of polyacrylates containing phenols or their adducts to ethylene oxide or propylene oxide; wherein the phenols include phenoxyacrylates and / or phenoxyethyl acrylates; (G) Epoxy acrylate: Epoxy acrylate derived from glycidyl ether; wherein the glycidyl ether includes trimethylolpropane triglycidyl ether; And / or, the photosensitive methacrylate resin includes any one or a combination of at least two of the acrylates (A) to (G) mentioned above.

[0116] In a preferred embodiment, the photosensitive resin comprises polyacrylates and / or polymethacrylates.

[0117] As an optional embodiment, the photosensitive resin includes any one or a combination of at least two of the following: trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane EO addition tri(meth)acrylate, glycerol PO addition tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, tetrafurfuryl alcohol oligo(meth)acrylate, ethyl carbitol oligo(meth)acrylate, 1,4-butanediol oligo(meth)acrylate, 1,6-hexanediol oligo(meth)acrylate, trimethylolpropane oligo(meth)acrylate, pentaerythritol oligo(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and N,N,N',N'-tetra(β-hydroxyethyl)ethylenediamine (meth)acrylate.

[0118] In a preferred embodiment, the photosensitive resin comprises acrylates with three or more components and / or methacrylates with three or more components.

[0119] In a preferred embodiment, the photosensitive resin is triphosphate (meth)acrylate.

[0120] As an optional embodiment, the photosensitive resin includes any one or a combination of at least two of the following: tris(2-(meth)acryloyloxyethyl) phosphate, tris(2-(meth)acryloyloxypropyl) phosphate, tris(3-(meth)acryloyloxypropyl) phosphate, tris(3-(meth)acryloyl-2-hydroxyoxypropyl) phosphate, di(3-(meth)acryloyl-2-hydroxyoxypropyl)(2-(meth)acryloyloxyethyl) phosphate, and (3-(meth)acryloyl-2-hydroxyoxypropyl)di(2-(meth)acryloyloxyethyl) phosphate.

[0121] It should be noted that, in order to improve the crosslinking properties, water resistance, and heat resistance of the cured product, the photosensitive resin component is preferably a photosensitive resin with an epoxy group structure.

[0122] As an optional embodiment, the filler in the two-component photothermal curing composition includes any one or a combination of at least two of the following: silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate.

[0123] In a preferred embodiment, the filler in the two-component photothermal curing composition is silicon dioxide.

[0124] As an optional embodiment, in the two-component photothermal curing composition, the silica includes any one or a combination of at least two of spherical silica, amorphous silica, fused silica, hollow silica, crystalline silica, and synthetic silica.

[0125] In a preferred embodiment, the filler in the two-component photothermal curing composition is spherical silica.

[0126] As an optional implementation, the initiator in the two-component photothermal curing composition includes a peroxide initiator.

[0127] As an optional embodiment, in the two-component photothermal curing composition, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, diacetyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide, tert-butyl peroxy-2-ethylhexanoate, tert-pentyl peroxy, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, methyl ethyl ketone peroxide, and cyclohexanone peroxide.

[0128] As an optional embodiment, in the two-component photothermal curing composition, the photosensitizer includes phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, ethyl 2,4,6-trimethylbenzoylphosphonate, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, benzoin dimethyl ether, 2-methyl-1-(4-methylthiophenyl)-2-morpholin-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinphenyl)-1-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinphenyl)-1-butanone, Methyl benzoylformate, 2,2-diethoxyacetophenone, 1-[4-(phenylthio)phenyl]-1,2-octanedione, 2-(O-benzoyl oxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-acetophenone, 1-(O-acetyl oxime), 2,4,6-trimethylbenzoyl-di(p-tolyl)phosphine oxide, benzophenone, 2-isopropylthioxanthonone, 2,4-diethylthioxanthonone, 4,4'-bis(diethylamino)benzophenone, bis(2,6-difluoro-3-(1-hydropyrrole-1-yl)phenyl)dicyclopentadiene, diaryliodothionium salt, triarylthionium salt, any one or a combination of at least two of these.

[0129] As an optional embodiment, the solvent in the two-component photothermal curing composition includes butanone and propylene glycol methyl ether acetate.

[0130] As an optional embodiment, in the two-component photothermal curing composition, when the solvent is a mixed solvent of butanone and propylene glycol methyl ether acetate, the volume ratio of butanone to propylene glycol methyl ether acetate is (3~5):1, for example, it can be 3:1, 3.2:1, 3.4:1, 3.6:1, 3.8:1, 4:1, 4.2:1, 4.4:1, 4.6:1, 4.8:1, 5:1, etc.

[0131] As an optional embodiment, the additives in the two-component photothermal curing composition include dispersants.

[0132] In a seventh aspect, the present invention provides the use of the tribranched acetylene resin as described in the first aspect, the polymer of the tribranched acetylene resin as described in the third aspect, the single-component thermosetting composition as described in the fifth aspect, and the photothermal-curing two-component composition as described in the sixth aspect in the preparation of electronic packaging materials, insulating materials, and / or composite materials.

[0133] The present invention will be further illustrated below by way of examples. Unless otherwise specified, the materials in the examples are prepared according to existing methods or purchased directly from the market.

[0134] Example 1 This embodiment provides a triphenylmethaneyne resin (I-1), the structural formula of which is shown below:

[0135] The synthesis reaction formula of the triphenylmethane yne resin (I-1) described in this embodiment is as follows: ; The preparation method of the triphenylmethane yne resin (I-1) described in this embodiment specifically includes the following steps: Under nitrogen protection, trihydroxytrimethylbenzene (1.42 g, 5 mmol), anhydrous potassium carbonate (2.07 g, 15 mmol), and tetrabutylammonium bromide (0.16 g, 0.5 mmol) dissolved in 30 mL of anhydrous DMSO were added to a 50 mL three-necked flask. Bromopropyne (1.95 g, 16.5 mmol) was slowly added dropwise with stirring at room temperature. After the addition was complete, the temperature was raised to 70 °C, and the reaction was allowed to proceed for 24 hours. After the reaction was complete, the solution was slowly poured into 300 mL of ice water. The organic phase was extracted with dichloromethane and finally purified by column chromatography using petroleum ether / ethyl acetate (V... 石油醚 / V 乙酸乙酯 Using a 5:2 ratio as the developing solvent, column chromatography yielded a white solid, I-1.

[0136] The NMR characterization results of the triphenylmethane yne resin (I-1) described in this embodiment are shown below: 1 H NMR (400MHz, CDCl3): δ7.12 (m, J=7.5Hz, 6H), 6.84 (m, J=7.3Hz, 6H), 5.37 (s, 1H), 4.68 (d, J=3.1Hz, 6H), 3.35 (t, J=3.0Hz, 3H).

[0137] Example 2 This embodiment provides a triphenylbenzyne resin (I-2), the structural formula of which is shown below:

[0138] The synthesis reaction formula of the triphenylbenzyne resin (I-2) described in this embodiment is as follows: ; The preparation method of the triphenylbenzyne resin (I-2) described in this embodiment specifically includes the following steps: Under nitrogen protection, trihydroxytriphenylbenzene (1.77 g, 5 mmol), anhydrous potassium carbonate (2.07 g, 15 mmol), and tetrabutylammonium bromide (0.16 g, 0.5 mmol) dissolved in 30 mL of anhydrous DMSO were added to a 50 mL three-necked flask. Bromopropyne (1.95 g, 16.5 mmol) was slowly added dropwise with stirring at room temperature. After the addition was complete, the temperature was raised to 70 °C, and the reaction was allowed to proceed for 24 hours. After the reaction was complete, the solution was slowly poured into 300 mL of ice water. The organic phase was extracted with dichloromethane and finally purified by column chromatography using petroleum ether / ethyl acetate (V... 石油醚 / V 乙酸乙酯 Using a 2:1 ratio as the developing solvent, column chromatography yielded a brown solid, I-2.

[0139] The NMR characterization results of the triphenylbenzyne resin (I-2) described in this embodiment are shown below: 1 H NMR (400MHz, CDCl3): δ7.12 (m, J=7.5Hz, 6H), 6.84 (m, J=7.3Hz, 6H), 5.37 (s, 1H), 4.68 (d, J=3.1Hz, 6H), 3.35 (t, J=3.0Hz, 3H).

[0140] Example 3 This embodiment provides a triphenyltriazineyne resin (I-3), the structural formula of which is shown below:

[0141] The synthesis reaction formula of the triphenyltriazineyne resin (I-3) described in this embodiment is as follows: ; The preparation method of the triphenyltriazineyne resin (I-3) described in this embodiment specifically includes the following steps: Under nitrogen protection, trihydroxytriphenyltriazine (1.78 g, 5 mmol), anhydrous potassium carbonate (2.07 g, 15 mmol), and tetrabutylammonium bromide (0.16 g, 0.5 mmol) dissolved in 30 mL of anhydrous DMSO were added to a 50 mL three-necked flask. Bromopropyne (1.95 g, 16.5 mmol) was slowly added dropwise with stirring at room temperature. After the addition was complete, the temperature was raised to 70 °C, and the reaction was allowed to proceed for 24 hours. After the reaction was complete, the solution was slowly poured into 300 mL of ice water. The organic phase was extracted with dichloromethane and finally purified by column chromatography using petroleum ether / ethyl acetate (V... 石油醚 / V 乙酸乙酯 Using a 5:3 ratio as the developing solvent, column chromatography yielded a white solid, I-3.

[0142] The NMR characterization results of the triphenylbenzyne resin (I-3) described in this embodiment are shown below: 1 H NMR (400MHz, CDCl3): δ7.12 (m, J=7.5Hz, 6H), 6.84 (m, J=7.3Hz, 6H), 5.37 (s, 1H), 4.68 (d, J=3.1Hz, 6H), 3.35 (t, J=3.0Hz, 3H).

[0143] Example 4 This embodiment provides a one-component thermosetting composition, which comprises the following components by weight:

[0144] The thermosetting resin is the triphenylmethane yne resin (I-1) provided in Example 1. The solvent is a mixture of butanone and propylene glycol methyl ether acetate in a volume ratio of 4:1. The filler is silica, purchased from Shuntian Mining Co., Ltd., model ST6548; The initiator is a thermal initiator, di-tert-butyl peroxide; The additive is a solvent-free polymeric dispersant, purchased from Guangzhou Songwei Trading Co., Ltd., model number MHDISPER 6653.

[0145] Example 5 This embodiment provides a single-component thermosetting composition, which differs from Example 4 only in that the thermosetting resin is replaced with an equal weight proportion of the triphenylbenzyne resin (I-2) provided in Example 2, while the other settings are the same as in Example 4.

[0146] Example 6 This embodiment provides a single-component thermosetting composition, which differs from Example 4 only in that the thermosetting resin is replaced with an equal weight proportion of the triphenyltriazineyne resin (I-3) provided in Example 3, while the other settings are the same as in Example 4.

[0147] Example 7 This embodiment provides a single-component thermosetting composition, which differs from Example 4 only in that no filler is added and the content of thermosetting resin is increased to 75 parts, while other settings are the same as in Example 4.

[0148] Example 8 This embodiment provides a single-component thermosetting composition, which differs from Example 4 only in that the thermosetting resin is replaced with an equal weight of alumina, while the other settings are the same as in Example 4.

[0149] Example 9 This embodiment provides a photothermal curing two-component composition, which comprises the following components by weight:

[0150] The thermosetting resin is the triphenylmethane yne resin (I-1) provided in Example 1. The photosensitive resin is phenolic epoxy acrylic resin ETERCURE 625C-45, purchased from Shanghai Kaiyin Chemical Co., Ltd. The solvent is a mixture of butanone and propylene glycol methyl ether acetate in a volume ratio of 4:1. The filler is silica, purchased from Shuntian Mining Co., Ltd., model ST6548.

[0151] The initiator is a thermal initiator, di-tert-butyl peroxide; The photosensitizer is the photoinitiator phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; The additive is a solvent-free polymeric dispersant, purchased from Guangzhou Songwei Trading Co., Ltd., model number MHDISPER 6653.

[0152] Example 10 This embodiment provides a photothermal curing two-component composition, which differs from Example 9 only in that the thermosetting resin is replaced with an equal weight proportion of the triphenylbenzyne resin (I-2) provided in Example 2, while the other settings are the same as in Example 9.

[0153] Example 11 This embodiment provides a photothermal curing two-component composition, which differs from Example 9 only in that the thermosetting resin is replaced with an equal weight proportion of triphenyltriazineyne resin (I-3) provided in Example 3, while the other settings are the same as in Example 9.

[0154] Comparative Example 1 This comparative example provides a tris(4-hydroxyphenyl)methane triglycidyl ether (D1), the structural formula of which is shown below: .

[0155] Comparative Example 2 This comparative example provides a diphenylmethane yne resin (D2), the structural formula of which is shown below: ; The synthesis reaction formula of the diphenylmethane yne resin (D2) described in this comparative example is shown below: ; The preparation method of the diphenylmethane yne resin (D2) described in this comparative example specifically includes the following steps: Under nitrogen protection, bis(4-hydroxyphenyl)methane (1.38 g, 5 mmol), anhydrous potassium carbonate (2.07 g, 15 mmol), and tetrabutylammonium bromide (0.16 g, 0.5 mmol) dissolved in 30 mL of anhydrous DMSO were added to a 50 mL three-necked flask. Bromopropyne (1.95 g, 16.5 mmol) was slowly added dropwise with stirring at room temperature. After the addition was complete, the temperature was raised to 70 °C, and the reaction was allowed to proceed for 24 hours. After the reaction was complete, the solution was slowly poured into 300 mL of ice water. The organic phase was extracted with dichloromethane and finally purified by column chromatography using petroleum ether / ethyl acetate (V... 石油醚 / V 乙酸乙酯 Using a 5:1 ratio as the developing solvent, column chromatography yielded a yellow solid, D2.

[0156] The NMR characterization results of the diphenylmethane yne resin (D2) described in this comparative example are shown below: 1 H NMR (400MHz, CDCl3): δ7.10 (m, J=7.4Hz, 4H), 6.88 (m, J=7.3Hz, 4H), 4.66 (d, J=3.1Hz, 4H), 4.12 (s, 1H), 3.32 (t, J=3.0Hz, 2H).

[0157] Comparative Example 3 This comparative example provides a one-component thermosetting composition, which differs from Example 4 only in that the thermosetting resin is replaced with an equal weight amount of tris(4-hydroxyphenyl)methane triglycidyl ether (D1) provided in Comparative Example 1, while the other settings are the same as in Example 4.

[0158] Comparative Example 4 This comparative example provides a one-component thermosetting composition, which differs from Example 4 only in that the thermosetting resin is replaced with an equal weight amount of diphenylmethane ytylene resin (D2) provided in Comparative Example 2, while the other settings are the same as in Example 4.

[0159] Comparative Example 5 This comparative example provides a photothermal curing two-component composition, which differs from Example 9 only in that the thermosetting resin is replaced with an equal weight proportion of tris(4-hydroxyphenyl)methane triglycidyl ether (D1) provided in Comparative Example 1, while the other settings are the same as in Example 9.

[0160] Comparative Example 6 This comparative example provides a photothermal curing two-component composition, which differs from Example 9 only in that the thermosetting resin is replaced with an equal weight proportion of diphenylmethane ytylene resin (D2) provided in Comparative Example 2, while the other settings are the same as in Example 9.

[0161] Test Example 1 Test samples: single-component thermosetting compositions provided in Examples 4-8, photothermal-curing two-component compositions provided in Examples 9-11, single-component thermosetting compositions provided in Comparative Examples 3-4, and photothermal-curing two-component compositions provided in Comparative Examples 5-6.

[0162] Test method: The above-mentioned sample slurries were dispersed and coated onto a 50 μm thicker film, dried at 90°C for 30 min, and then hot-pressed onto a 0.8 mm CCL plate. Vacuum time was 30 s, followed by pressing at 100°C for 30 s. The single-component thermosetting compositions provided in Examples 4-8 and Comparative Examples 3-4 required pre-curing at 120°C for 1 hr, followed by curing at 180°C for 1 hr to test their performance. The photothermal curing two-component compositions provided in Examples 9-11 and Comparative Examples 5-6 were tested using a DI exposure machine at 1000 mJ / cm². 2 After energy exposure, it was left to stand for 0.5 hours, then heat-cured at 180°C for 1 hour. The protective film was then removed, and the product was subjected to heat treatment at 30°C and a pressure of 1.0 kg / cm². 2 Its performance was tested after development in a 1 wt% sodium carbonate solution for 60 seconds.

[0163] (1) Adhesion test: After development, the 100-grid test method is used. A grid of 0.4×0.4 mm is drawn on its surface. The adhesive tape is firmly stuck on the grid and then quickly peeled off at 180°. Repeat the same position three times and observe whether it falls off. If it does not fall off, it is considered qualified; otherwise, it is considered unqualified. The results are recorded in Table 1.

[0164] (2) Coefficient of thermal expansion (CTE) test: Thermomechanical analyzer was used, and the test was performed in accordance with standard IPC-TM-650 2.4.24 or ASTM E831. A rectangular cured film sample with a width of 5 mm and a length of 50 mm was cut and tested along the plane of the film. The film was heated at a constant heating rate (e.g., 5°C / min) within a temperature range of 25°C to 280°C, and the relationship between dimensional change and temperature was recorded. The slope of the linear portion is the average linear coefficient of thermal expansion in that direction.

[0165] (3) Dielectric constant (Dk) test: The parallel plate method / resonant cavity method is used, referring to standard IPC-TM-6502.5.5.13 or ASTM D150. The cured film sample is cut into the specified size (e.g., a square with a side length of Z mm), and its capacitance is measured at a specific frequency (e.g., 10 GHz) using an impedance analyzer / network analyzer. The dielectric constant is then calculated. The sample must be thoroughly dried before testing and the test is conducted under constant temperature and humidity conditions.

[0166] (4) Glass transition temperature (Tg) test: A dynamic thermomechanical analyzer was used, and the test was performed according to standard IPC-TM-6502.4.24.1 or ASTM E1640. The cured film sample was cut into strips 5 mm long and 30 mm wide, and tested in tensile or film tensile mode at a constant frequency (e.g., 1 Hz) and heating rate (e.g., 5 °C / min). The glass transition temperature is defined as the temperature at which a significant step drop in storage modulus occurs or the loss factor peaks.

[0167] (5) Tensile strength test: A dynamic thermomechanical analyzer was used, and the test was conducted according to the film stretching mode specified in standard ASTM D5418 or ISO 6721-4. The cured film sample was cut into strips with a length of 5 mm and a width of 30 mm. The test was conducted under the stretching or film stretching mode at a constant stretching speed (e.g., 50 mm / min) until fracture. The stress-strain curve was recorded, and the tensile strength, elongation at break, and Young's modulus were calculated accordingly.

[0168] (6) Chemical stability Alkali resistance test: After the curing reaction, place it in a 10 wt% NaOH aqueous solution at 35℃ for 10 minutes and observe whether the dry film peels off. If no peeling occurs, it is considered qualified; otherwise, it is considered unqualified. The results are recorded in Table 1.

[0169] Acid resistance test: After the curing reaction, immerse the product in a 10 wt% H2SO4 solution at 35°C for 10 minutes and observe whether the dry film peels off. If no peeling occurs, it is considered qualified; otherwise, it is considered unqualified. Record the results in Table 1.

[0170] (7) High temperature and high humidity resistance: After the curing reaction, the thickened film obtained in Examples 5-10 above was placed at 85°C and 85%RH for 596 h according to IPC-TM-650. The dry film was observed. If the dry film did not peel off or crack, it was considered qualified; otherwise, it was considered unqualified. The results were recorded in Table 1.

[0171] Table 1

[0172] Note: × represents qualified; × represents unqualified.

[0173] As shown in Table 1, the three-branched acetylene resin of this invention and the laminated films prepared from its single- and two-component compositions exhibit significantly superior overall performance compared to traditional epoxy resins and non-three-branched acetylene resins. This material demonstrates excellent adhesion to the substrate, significantly reduces the coefficient of thermal expansion and dielectric constant, resolving the technical contradiction of mutual constraints between the two in existing materials. Simultaneously, it exhibits superior glass transition temperature and tensile strength, and significantly improved heat resistance and mechanical properties. The material possesses excellent chemical stability, showing no peeling issues in acid and alkali resistance tests. Even under harsh environments of high temperature and high humidity, it maintains structural stability without peeling or cracking. In contrast, the comparative samples not only exhibit poor core thermal expansion and dielectric properties but also suffer from poor adhesion, inadequate chemical resistance and high temperature and humidity resistance, and significantly insufficient mechanical and heat resistance. Both the single- and two-component systems of the material of this invention maintain excellent overall performance, perfectly meeting the application requirements of high-end electronic materials.

[0174] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A tribranched acetylene resin, characterized in that, The structural formula of the tribranched acetylene resin is shown in Formula I below: Formula I; Wherein, R includes C, N, , , , , , Any one of them.

2. A method for preparing a tribranched acetylene resin according to claim 1, characterized in that, The preparation method includes: Compound A reacts with halopropyne B to yield a tribranched acetylene resin as shown in Formula I; the reaction formula is as follows: ； Wherein, R includes C, N, , , , , , Any one of them; X includes halogen atoms.

3. The method for preparing the tribranched acetylene resin according to claim 2, characterized in that, The halogen atom includes any one of fluorine, chlorine, bromine or iodine, preferably bromine; Preferably, the reaction is carried out in the presence of a base and a catalyst; Preferably, the alkali includes any one or a combination of at least two of potassium carbonate, sodium carbonate, sodium hydroxide, potassium hydroxide, potassium phosphate, cesium carbonate, and sodium hydride; Preferably, the catalyst comprises any one or a combination of at least two of tetrabutylammonium bromide, tetrabutylammonium hydrogen sulfate, benzyltriethylammonium chloride, 18-crown-6, potassium iodide, sodium iodide, copper iodide, and copper bromide; Preferably, the molar ratio of compound A, halopropyne B, base, and catalyst is 1:(3~3.6):(2.5~3.5):(0.05~0.15); Preferably, the reaction is carried out in a solvent; Preferably, the solvent includes any one or a combination of at least two of the following: dimethyl sulfoxide, ethanol, toluene, N,N-dimethylformamide, acetonitrile, acetone, butanone, tetrahydrofuran, and dichloromethane; Preferably, the reaction temperature is 25~110℃ and the reaction time is 4~48 h.

4. A polymer of a tribranched acetylene resin, characterized in that, The polymer of the tribranched alkyne resin has the following structural formula II: Formula II; Where m, n, and p are the number of chain segments, m≥2, n≥2, and p≥2; R includes C, N, ... , , , , , Any one of them.

5. The polymer of the tribranched acetylene resin according to claim 4, characterized in that, The polymer of the tribranched alkyne resin has a 10GHz dielectric constant Dk of 1.5~3.5, preferably 1.5~3.0, and more preferably 1.5~2.5; Preferably, the polymer of the tribranched acetylene resin has a coefficient of thermal expansion of 30~60 ppm / ℃, more preferably 30~50 ppm / ℃, and even more preferably 30~45 ppm / ℃.

6. A method for preparing a polymer of a tribranched acetylene resin according to claim 4 or 5, characterized in that, The preparation method includes: The tribranched acetylene resin shown in Formula I undergoes a cyclization polymerization reaction to obtain the polymer of the tribranched acetylene resin shown in Formula II.

7. The method for preparing the polymer of the tribranched acetylene resin according to claim 6, characterized in that, The cyclization polymerization reaction is carried out in the presence of an initiator; Preferably, the initiator includes a peroxide initiator; Preferably, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, di(2,4-dichlorobenzoyl peroxide), diacetyl peroxide, dioctyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide, tert-butyl peroxypentanoate, tert-butyl peroxy-2-ethylhexanoate, tert-pentyl peroxy-2-ethylhexanoate, tert-pentyl peroxypentanoate, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, di(p-tert-butylcyclohexyl peroxide), methyl ethyl ketone peroxide, and cyclohexanone peroxide. Preferably, the mass ratio of the tribranched acetylene resin and the initiator shown in Formula I is (80~100):(0.5~10); Preferably, the cyclization polymerization reaction is carried out at a temperature of 130~240℃ and for a time of 0.5~72h.

8. A one-component thermosetting composition, characterized in that, The single-component thermosetting composition comprises, by weight, 20-80 parts of the tribranched acetylene resin as described in claim 1, 0-80 parts of filler, 0.1-5 parts of initiator, 10-30 parts of solvent, and 0-5 parts of additives; Preferably, the single-component thermosetting composition comprises, by weight, 40-50 parts of the tribranched acetylene resin as described in claim 1, 35-55 parts of filler, 0.5-1.5 parts of initiator, 20-25 parts of solvent, and 0.5-1.5 parts of additives; Preferably, the filler comprises any one or a combination of at least two of the following: silicon dioxide, aluminum oxide, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate, preferably silicon dioxide; Preferably, the silica includes any one or a combination of at least two of spherical silica, amorphous silica, molten silica, hollow silica, crystalline silica, and synthetic silica, with spherical silica being the most preferred. Preferably, the initiator includes a peroxide initiator; Preferably, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, diacetyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide-2-ethylhexanoate, tert-pentyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, methyl ethyl ketone peroxide, and cyclohexanone peroxide. Preferably, the solvent includes any one or a combination of at least two of the following: ethanol, isopropanol, n-butanol, diacetone alcohol, ethyl acetate, n-butyl acetate, isopropyl acetate, methyl acetate, isoamyl acetate, ethylene glycol diacetate, acetone, butanone, cyclohexanone, toluene, xylene, solvent oil, ethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, and turpentine. Preferably, the solvent includes butanone and propylene glycol methyl ether acetate; Preferably, the volume ratio of butanone to propylene glycol methyl ether acetate is (2~5):1; Preferably, the additive includes a dispersant.

9. A photothermal curing two-component composition, characterized in that, The photothermal curing two-component composition comprises, by weight, 10-50 parts of the tribranched acetylene resin as described in claim 1, 5-25 parts of photosensitive resin, 10-70 parts of filler, 0.1-5 parts of initiator, 0.1-5 parts of photosensitizer, 10-30 parts of solvent, and 0-5 parts of additives. Preferably, the photothermal curing two-component composition comprises, by weight, 20-40 parts of the tribranched acetylene resin as described in claim 1, 10-20 parts of photosensitive resin, 25-45 parts of filler, 0.5-1.5 parts of initiator, 0.5-1.5 parts of photosensitizer, 20-25 parts of solvent, and 0.5-1.5 parts of additives; Preferably, the photosensitive resin includes photosensitive acrylic resin and / or photosensitive methacrylic resin; Preferably, the photosensitive acrylic resin comprises any one or a combination of at least two of the following (A) to (G): (A) Hydroxyalkyl acrylates: 2-hydroxyethyl acrylate and / or 2-hydroxybutyl acrylate; (B) Mono- or diacrylates of glycols: any one or a combination of at least two of ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; (C) Acrylamide: N,N-dimethylacrylamide and / or N-hydroxymethylacrylamide; (D) Aminoalkyl acrylates: N,N-dimethylaminoethyl acrylate; (E) Polyacrylate I: Polyacrylates of any one or at least two of polyols or their adducts of ethylene oxide, propylene oxide, and ε-caprolactone; wherein the polyols include any one or at least two of trimethylolpropane, pentaerythritol, and dipentaerythritol; (F) Polyacrylate II: Any one or a combination of at least two of polyacrylates containing phenols or their adducts to ethylene oxide or propylene oxide; wherein the phenols include phenoxyacrylates and / or phenoxyethyl acrylates; (G) Epoxy acrylate: Epoxy acrylate derived from glycidyl ether; wherein the glycidyl ether includes trimethylolpropane triglycidyl ether; And / or, the photosensitive methacrylate resin comprises any one or a combination of at least two of the acrylates (A) to (G) described above: Preferably, the filler comprises any one or a combination of at least two of the following: silicon dioxide, aluminum oxide, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate, preferably silicon dioxide; Preferably, the silica includes any one or a combination of at least two of spherical silica, amorphous silica, molten silica, hollow silica, crystalline silica, and synthetic silica, with spherical silica being the most preferred. Preferably, the initiator includes a peroxide initiator; Preferably, the peroxide initiator includes any one or a combination of at least two of the following: di-tert-butyl peroxide, benzoyl peroxide, lauroyl peroxide, diacetyl peroxide, dicumyl peroxide, di-tert-pentyl peroxide, tert-butyl peroxide-2-ethylhexanoate, tert-pentyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, diisopropyl peroxide, dicyclohexyl peroxide, methyl ethyl ketone peroxide, and cyclohexanone peroxide. Preferably, the photosensitizer comprises phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, ethyl 2,4,6-trimethylbenzoylphosphonate, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, benzoin dimethyl ether, 2-methyl-1-(4-methylthiophenyl)-2-morpholin-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinphenyl)-1-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinphenyl)-1-butanone, methyl benzoylformate, 2, 2-Diethoxyacetophenone, 1-[4-(phenylthio)phenyl]-1,2-octanedione, 2-(O-benzoyl oxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-acetophenone, 1-(O-acetyl oxime), 2,4,6-trimethylbenzoyl-di(p-tolyl)phosphine oxide, benzophenone, 2-isopropylthioxanthonone, 2,4-diethylthioxanthonone, 4,4'-bis(diethylamino)benzophenone, bis(2,6-difluoro-3-(1-hydropyrrole-1-yl)phenyl)dicyclopentadiene, diaryliodothionium salt, triarylthionium salt, any one or a combination of at least two of these; Preferably, the solvent includes any one or a combination of at least two of the following: ethanol, isopropanol, n-butanol, diacetone alcohol, ethyl acetate, n-butyl acetate, isopropyl acetate, methyl acetate, isoamyl acetate, ethylene glycol diacetate, acetone, butanone, cyclohexanone, toluene, xylene, solvent oil, ethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, and turpentine. Preferably, the solvent includes butanone and propylene glycol methyl ether acetate; Preferably, the volume ratio of butanone to propylene glycol methyl ether acetate is (2~5):1; Preferably, the additive includes a dispersant.

10. The use of a tribranched acetylene resin according to claim 1, or a polymer of a tribranched acetylene resin according to claim 4 or 5, or a single-component thermosetting composition according to claim 8, or a photothermal-curing two-component composition according to claim 9, in the preparation of electronic packaging materials, insulating materials, and / or composite materials.

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