Electronic device

Abstract

An electronic device includes a body, a heat-generating device, an air duct, and a fan. The body has an air inlet and an air outlet. The heat-generating device is disposed within the body. The air duct is disposed within the body, with its air inlet communicating with the air inlet and its air outlet communicating with the air outlet. The air duct is used to dissipate heat generated by the heat-generating device. The fan is disposed within the body and is used to direct airflow from the air inlet to the air outlet of the air duct. This application, by incorporating an air duct within the electronic device and generating back pressure through a fan, allows cool air from outside the electronic device to enter the duct and flow along the direction constrained by the duct. After heat exchange in the high-temperature area, the resulting hot air can be promptly discharged to the outside of the electronic device along the duct, thereby effectively improving heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more specifically to an electronic device. Background Technology

[0002] As the performance of mobile phone chips improves, the issue of chip overheating becomes increasingly prominent. If the heat generated by the chip during operation is not effectively dissipated, it will reduce chip performance and shorten its lifespan. Currently, mobile phone chips generally achieve passive heat dissipation through thermally conductive materials, meaning that heat is naturally dissipated through these materials. However, under high load conditions, this passive heat dissipation method often cannot effectively address overheating issues. Summary of the Invention

[0003] In view of this, this application provides an electronic device to solve the problem that in the prior art, mobile phone chips can only dissipate heat through thermally conductive materials, which cannot meet the heat dissipation requirements during high-load operation.

[0004] This application provides an electronic device, comprising a body, a heating element, an air duct, and a fan. The body has an air inlet and an air outlet. The heating element is disposed within the body. The air duct is disposed within the body, with its air inlet communicating with the air inlet and its air outlet communicating with the air outlet. The fan is disposed within the body and is used to blow air entering through the air inlet towards the air outlet, where it flows out.

[0005] This application improves heat dissipation efficiency by setting up an air duct in the electronic device and generating back pressure through a fan, allowing cold air from outside the electronic device to enter the duct and flow along the direction constrained by the duct. After the cold air exchanges heat in the high-temperature area, the resulting hot air can be discharged to the outside of the electronic device in a timely manner along the duct.

[0006] In one possible implementation, the body includes a mid-frame, a cover plate, and a decorative element. The cover plate is connected to the mid-frame, and the decorative element is connected to the cover plate. The decorative element protrudes from the cover plate on a side away from the mid-frame, and a receiving space is provided within the decorative element, in which the fan is disposed. The decorative element's protruding structure allows the fan to be housed within the decorative element without occupying additional internal space of the body, facilitating a thinner and lighter design for the electronic device.

[0007] In one possible implementation, the air inlet is located on the decorative element or the middle frame; and / or, the air outlet is located on the decorative element or the middle frame, thereby enabling flexible design of the air inlet and outlet positions to meet the design requirements of different electronic devices.

[0008] In one possible implementation, the fan is attached to the cover plate, which facilitates the installation of the fan without altering the original layout of the electronic device.

[0009] In one possible implementation, the electronic device further includes a bracket connected to the cover plate, and the fan is connected to the bracket. The bracket can be flexibly designed to accommodate the space within the decorative element, balancing space utilization and installation location selection, thereby enabling the fan to be installed within the decorative element while ensuring reliable fan installation.

[0010] In one possible implementation, the electronic device further includes a first circuit board, the heating device being electrically connected to the first circuit board, and the first circuit board having a through-hole through which at least a portion of the air duct passes. In this embodiment, by providing a through-hole on the first circuit board, at least a portion of the air duct can pass through the through-hole, thereby allowing at least a portion of the air duct to be located on one side of the first circuit board and at least another portion on the other side. This allows the fan to be integrated into the decorative element, enabling the fan to introduce cool air into the air duct while simultaneously dissipating heat from the vicinity of the heating device, achieving efficient heat dissipation. Furthermore, the air duct can also include two parts: a first part and a second part. The first part can be located on one side of the first circuit board, and the second part can be located on the other side. The two parts of the air duct can be connected through a through-hole on the first circuit board, facilitating the installation of the air duct on the first circuit board.

[0011] In one possible implementation, the air duct is connected to the first circuit board via a connector to ensure the stability of the air duct. Alternatively, the air duct can also be connected to the first circuit board via screws or other connectors. Compared to the welding method described above, using screws can mitigate the deformation of the first circuit board during thermal expansion and contraction, relieve stress, and extend the service life of the first circuit board. The air duct is also connected to the first circuit board via a welding process.

[0012] In one possible implementation, the electronic device further includes a shielding cover connected to the first circuit board, used to enclose the heat-generating device between the shielding cover and the first circuit board. At least a portion of the air duct is supported on the shielding cover. This shielding cover, capable of enclosing the heat-generating device and other components, isolates them from other devices that generate mutual electromagnetic interference, thus achieving electromagnetic shielding. The shielding cover also possesses sufficient structural strength to support the air duct; that is, the air duct can overlap or be fixedly connected to the shielding cover to reliably support the air duct and ensure the stability of the air duct configuration.

[0013] In one possible implementation, the fan is stacked on one side of the heat-generating device along the thickness direction of the electronic device, so that the fan is close to the heat-generating device, which is beneficial for the cool air introduced by the fan to dissipate heat fully in the high-heat area of ​​the heat-generating device and improve heat dissipation efficiency.

[0014] In one possible implementation, the air duct has a first channel located between the air inlet and the air outlet. Along the thickness direction of the electronic device, the first channel is opposite to the heat-generating device, and the fan is disposed within the first channel. The sidewall of the first channel can extend towards the heat-generating device. When the fan is disposed within the first channel, the sidewall can block the side of the fan, thus separating the fan from surrounding components such as circuit boards. Furthermore, the sidewall of the first channel can restrict airflow, allowing cool air to quickly pass through the air duct and be exhausted from the air outlet, achieving efficient heat dissipation.

[0015] In one possible implementation, a mounting cavity is provided on the air duct, the mounting cavity communicating with the air duct, and the fan is disposed within the mounting cavity. Along the thickness direction of the electronic device, the mounting cavity is opposite to the heat-generating device. The mounting cavity provides space for fan installation, ensuring reliable fan mounting. The mounting cavity is close to the heat-generating device, allowing heat generated by the device to be conducted to the mounting cavity via thermal conduction and exchanged with the cool air within the mounting cavity. The heated air, after heat exchange, enters the exhaust duct through a second through-hole and is further discharged into the atmosphere through an air outlet and an air vent.

[0016] In one possible implementation, the electronic device further includes a second circuit board and a third circuit board. Along the thickness direction of the electronic device, the heat-generating device and the third circuit board are both disposed on the same side of the second circuit board. The distance between the surface of the third circuit board away from the second circuit board and the second circuit board is greater than the distance between the surface of the heat-generating device away from the second circuit board and the second circuit board. At least a portion of the air duct is supported by the third circuit board. In this embodiment, there is a certain height difference between the heat-generating device and the surface of the third circuit board away from the second circuit board along the thickness direction of the electronic device. This height difference can absorb the thickness of the fan, thereby preventing the fan from excessively occupying thickness space and facilitating a thinner and lighter design for the electronic device.

[0017] In one possible implementation, a support member is provided on the side of the third circuit board away from the second circuit board, and at least a portion of the air duct is connected to the end of the support member away from the third circuit board. The support member protrudes from the surface of the third circuit board. Functional devices may also be provided on the third circuit board. The support member and some of the functional devices may be located on the same side of the third circuit board, and the height of the support member may be higher than the height of these functional devices. When the air duct is supported on the support member, it can prevent the air duct from pressing against the functional devices.

[0018] In one possible implementation, the electronic device further includes a first thermally conductive element that contacts the heat-generating device. At least a portion of the heat generated by the heat-generating device is transferred to the fan through the first thermally conductive element. The first thermally conductive element can be made of TIM material, or other materials with high thermal conductivity. Compared to air, the first thermally conductive element enables rapid heat conduction, which is beneficial for achieving efficient heat dissipation through the fan.

[0019] In one possible implementation, the electronic device further includes a fourth circuit board, to which the heat-generating device is electrically connected. The air duct has a second channel located between the air inlet and the air outlet, with its end face abutting against the fourth circuit board. Both the fan and the heat-generating device are disposed within the second channel. During heat dissipation, the fan can provide back pressure. Because the heat-generating device is located within the second channel, cool air does not need to exchange heat with the heat-generating device through other thermally conductive materials; instead, it can directly contact the heat-generating device and exchange heat in contact, thereby improving heat exchange efficiency and heat dissipation efficiency.

[0020] In one possible implementation, the fan is disposed on at least one side of the heat-generating device in a direction perpendicular to the thickness direction of the electronic device. The sidewall of the second channel extends a certain length along the thickness direction of the electronic device and can abut against the fourth circuit board, allowing the side of the heat-generating device to have sufficient space for arranging the fan, which improves integration.

[0021] In one possible implementation, the heating element is electrically connected to the fourth circuit board via a solder joint. The surfaces of the heating element and the solder joint are provided with a waterproof coating to prevent moisture and impurities in the air from corroding the heating element and the solder joint.

[0022] In one possible implementation, the electronic device further includes a second heat-conducting element connected to the body and / or the air duct, with at least a portion of the air duct disposed between the second heat-conducting element and the heat-generating device. The cool air in the air duct can expel most of the heat near the heat-generating device through the air outlet. A small portion of the heat that cannot be actively expelled by the cool air can be passively dissipated, i.e., conducted to the outside via heat conduction through the second heat-conducting element. Therefore, the combination of active cooling by a fan and passive cooling using a second heat-conducting element effectively improves heat dissipation efficiency, enabling the heat-generating device to perform well under high load.

[0023] In one possible implementation, the electronic device further includes a first heat spreader, which is connected to the body and / or the second heat-conducting element, and is located on the side of the second heat-conducting element away from the air duct. In this embodiment, one side of the first heat spreader can be in contact with the second heat-conducting element or maintain a small gap, and the other side of the first heat spreader can be in contact with the screen. Part of the heat generated by the heat-generating device can be discharged from the air duct after heat exchange with the cold air in the air duct, and the other part of the heat can be diffused to the atmosphere through heat conduction sequentially through the second heat-conducting element, the first heat spreader, and the screen. The first heat spreader can have a larger area than the second heat-conducting element, which can improve the efficiency of heat conduction and is beneficial for improving the heat dissipation efficiency during passive cooling.

[0024] In one possible implementation, the projection of the air duct along the thickness direction of the electronic device at least partially overlaps with the projection of the heat-generating device, thereby allowing the air duct to have a larger volume to contact the high-temperature air around the heat-generating device, improving heat exchange efficiency and thus improving heat dissipation efficiency.

[0025] In one possible implementation, the air inlet and the air outlet are located on the same side of the body, and the fan is disposed in the air duct; along a direction perpendicular to the thickness direction of the electronic device, at least a portion of the projection of the air duct coincides with at least a portion of the projection of the heat-generating device, thereby enabling at least a portion of the air duct to be close to the heat-generating device, which facilitates the rapid conduction of heat generated by the heat-generating device into the air duct, achieving rapid and efficient heat dissipation.

[0026] In one possible implementation, the electronic device further includes a third thermally conductive element, which is stacked on the heating device along the thickness direction of the electronic device and connected to the air duct. The third thermally conductive element can be the aforementioned TIM material. Some of the heat generated by the heating device can be directly transferred to the air duct, and some heat can be conducted to the air duct through the third thermally conductive element. Compared to air, the third thermally conductive element has a relatively high thermal conductivity, which is beneficial to improving heat conduction efficiency.

[0027] In one possible implementation, the electronic device further includes a second heat spreader connected to the body and / or the third heat-conducting element, with the second heat spreader located on the side of the third heat-conducting element away from the heat-generating device. The air duct is connected to the second heat spreader. Part of the heat generated by the heat-generating device can be transferred to the air duct through the side of the heat-generating device, and part of the heat can be conducted to the third heat-conducting element and the second heat spreader. Both the third heat-conducting element and the second heat spreader can contact the air duct, allowing for a large contact area between the air duct and the third heat-conducting element and the second heat spreader. This enables rapid heat transfer from the third heat-conducting element and the second heat spreader to the air duct and allows for heat exchange with the cool air within the air duct, thus improving heat dissipation efficiency.

[0028] In one possible implementation, a filter element is provided in the air inlet and / or the air outlet. For example, the filter element can be a filter screen, which includes multiple mesh openings. The smallest mesh opening diameter can be less than 100μm, which can ensure smooth airflow while blocking moisture and impurities from entering, thus achieving the effects of breathability, waterproofing, and dustproofing.

[0029] In one possible implementation, the fan is a piezoelectric fan, also known as a piezoelectric ceramic fan. A piezoelectric fan utilizes the inverse piezoelectric effect of piezoelectric ceramics. A driving circuit generates an alternating electric field, which drives the blades to bend and resonate, thereby outputting a high-speed, stable airflow forward from the blade tip. Piezoelectric fans are compact and lightweight, with a thickness of only a few millimeters. They can be easily integrated into electronic devices such as mobile phones without occupying additional thickness space, facilitating the thinner and lighter design of electronic devices. Piezoelectric fans operate with low noise, improving the user experience. Furthermore, the low energy consumption of piezoelectric fans helps extend the battery life of electronic devices, and their fast response speed allows them to adapt to heat dissipation needs in real time.

[0030] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0033] Figure 2 This is a partial cross-sectional view of an electronic device in a related art.

[0034] Figure 3 This is a partial cross-sectional view of an electronic device in another related technology;

[0035] Figure 4 A partial cross-sectional view of an electronic device provided in one embodiment of this application;

[0036] Figure 5 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0037] Figure 6 A top view of an electronic device provided in one embodiment of this application on one side of the cover plate;

[0038] Figure 7 A partial top view of the electronic device provided in an embodiment of this application on the side of the heat-generating device;

[0039] Figure 8 A partial top view of the electronic device provided in an embodiment of this application on the cover side;

[0040] Figure 9 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0041] Figure 10 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0042] Figure 11 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0043] Figure 12 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0044] Figure 13 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0045] Figure 14 A partial cross-sectional view of an electronic device provided in another embodiment of this application;

[0046] Figure 15 A partial cross-sectional view of an electronic device provided in another embodiment of this application.

[0047] Figure label:

[0048] 100 - Electronic equipment; 110 - Screen; 120 - Housing; 130 - Chip; 140 - Thermal conductive material; 150 - Mechanical fan;

[0049] 1-Main body; 11-Air inlet; 12-Air outlet; 13-Middle frame; 14-Cover plate; 15-Decorative parts;

[0050] 2-Heating element; 21-Welded component;

[0051] 3-Fan; 31-Bracket;

[0052] 4-Air duct; 41-Air inlet; 42-Air outlet; 43-Weld point; 44-Screw; 45-First part; 46-Second part; 47-First channel; 48-Mounting cavity; 49-Second channel; 4a-Air inlet channel; 4a1-First through hole; 4b-Exhaust channel; 4b1-Second through hole; 4c-First partition; 4d-Second partition;

[0053] 5-Camera module;

[0054] 6a - First circuit board; 6a1 - Via; 6b - Second circuit board; 6c - Third circuit board; 6d - Fourth circuit board; 6e - Fifth circuit board; 6f - Sixth circuit board;

[0055] 7-Shielding cover;

[0056] 8a - First heat-conducting component; 8b - Second heat-conducting component; 8c - Third heat-conducting component; 8d - First heat spreader; 8e - Second heat spreader;

[0057] Z - Thickness direction. Detailed Implementation

[0058] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0059] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0060] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0061] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0062] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0063] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application, such as... Figure 1 As shown, Figure 1 An electronic device 100 is illustrated as a mobile phone, which includes a housing 120 and a screen 110. The screen 110 is mounted on the housing 120 and is used to display content. A chip 130 is provided in the mobile phone. Figure 1 (As shown in the dashed box), chip 130 can implement many functions in a mobile phone. For ease of explanation, the electronic device can have a length direction (Y), a width direction (X), and a thickness direction (Z), and the length, width, and thickness directions can be mutually perpendicular.

[0064] With the performance improvement of the mobile phone chip 130, its processing power has been significantly enhanced, but the accompanying heat generation problem has also become increasingly prominent. If the heat generated by the high-performance chip 130 during operation is not effectively dissipated, it will cause the device to overheat, thereby affecting its performance and lifespan.

[0065] Figure 2 This is a partial cross-sectional view of an electronic device in a related art, such as... Figure 2 As shown, the electronic device includes a housing 120 and a chip 130, with the chip 130 disposed inside the housing 120. The electronic device also includes multiple layers of thermally conductive material 140, which can be disposed in multiple locations. For example, the thermally conductive material 140 can be disposed inside or outside the housing 120, or part of the thermally conductive material 140 can be disposed inside the housing 120, and another part can be disposed outside the housing 120. Currently, the mobile phone chip 130 generally achieves passive heat dissipation through the aforementioned thermally conductive material 140, meaning heat is naturally dissipated through the thermally conductive material 140. However, passive heat dissipation relies on the thermal conductivity and design layout of the material; under high load conditions, this passive heat dissipation method often cannot effectively address overheating problems.

[0066] Figure 3 This is a partial cross-sectional view of an electronic device in another related technology, such as... Figure 3As shown, to further improve heat dissipation efficiency, active cooling can also be used to reduce the temperature of chip 130. Figure 3 The related technologies shown are compared to Figure 2 The related technology incorporates a mechanical fan 150. For example, a mechanical fan 150 can be placed inside the phone to blow air onto the chip 130, thereby achieving active air cooling. However, the mechanical fan 150 is large, noisy, has low pressure, and slow response. It also occupies a significant amount of internal space, hindering the achievement of a slim and lightweight design and impacting user experience. Furthermore, the mechanical fan 150 typically blows air into a large area near the chip 130 without any airflow constraint. This can cause some of the airflow to deviate from the heat-generating area of ​​the chip 130, failing to provide effective cooling. Additionally, the dispersed hot air creates turbulent airflow that cannot be expelled from the phone in time, resulting in low cooling efficiency. The large size of the mechanical fan 150 also makes it difficult to position it close to the chip 130, further contributing to its low cooling efficiency.

[0067] In view of this, embodiments of this application provide an electronic device that can adopt an active heat dissipation method, enabling the chip to achieve efficient heat dissipation when running under high load, while also constraining the direction of fan airflow to improve heat dissipation efficiency.

[0068] The electronic device provided in this application embodiment may be... Figure 1 The mobile phone shown can also be a computer, mobile internet device (MID), wearable device, virtual reality (VR) device, augmented reality (AR) device, robotic arm, camera, robot, or smart home device (such as television, air conditioner, robot vacuum cleaner, speaker, set-top box), relay, customer premises equipment (CPE), etc. This application does not limit the type of electronic device.

[0069] Figure 4 A partial cross-sectional view of an electronic device provided in one embodiment of this application, such as... Figure 4As shown, the electronic device provided in this application embodiment includes a body 1, a heating element 2, an air duct 4, and a fan 3. The body 1 has space for arranging various structures and devices. For example, when the electronic device is a mobile phone, the body 1 of the electronic device includes a middle frame 13 and a cover plate 14. The cover plate 14 can be a battery cover on the side of the mobile phone away from the screen, and the cover plate 14 can be connected to the middle frame 13. For other devices such as tablet computers, the middle frame 13 can be the main skeleton structure of the electronic device, used to support devices such as the screen, and the cover plate 14 can be a shell structure that can be connected to the side of the middle frame 13 away from the screen, so that a space for arranging various functional devices can be formed between the cover plate 14 and the middle frame 13. For example, the heating element 2, the air duct 4, the fan 3, and the circuit board 6a can be arranged in this space.

[0070] The heat-generating device 2 may include a chip, or a device capable of generating high heat, such as a battery. Figure 4 As shown, the heating device 2 can be electrically connected to the first circuit board 6a.

[0071] Air duct 4 is disposed within the main body 1 to dissipate heat from the heat-generating device 2. Air duct 4 can be an independently manufactured structure, specifically a pipe, meaning its interior is hollow, allowing air to flow within it. The cross-sectional shape of air duct 4 can be a regular shape such as rectangle, square, trapezoid, circle, or ellipse, or it can be an irregular shape. Air duct 4 can also have different cross-sectional shapes in different locations; this embodiment does not limit the cross-sectional shape of air duct 4. The size of air duct 4 can be determined based on the heat dissipation effect of the heat-generating device 2. For example, air duct 4 has a larger area at the location corresponding to the heat-generating device 2 to improve heat dissipation, while having a smaller area at other locations to reduce space occupation.

[0072] The diameter of the air inlet in the air duct 4 for air circulation can be between 0.3mm and 0.7mm in the thickness direction Z of the electronic device, which can ensure the air flow rate and also ensure sufficient heat exchange of the air near the heat-generating device 2.

[0073] like Figure 4 As shown, the air duct 4 has an air inlet 41 and an air outlet 42, and the main body 1 is provided with an air inlet hole 11 and an air outlet hole 12. The air inlet 41 of the air duct 4 is connected to the air inlet hole 11, and the air outlet 42 of the air duct 4 is connected to the air outlet hole 12. Air from outside the electronic equipment can enter the air duct 4 through the air inlet hole 11 and the air inlet 41 in sequence, and can be discharged to the outside of the electronic equipment through the air outlet 42 and the air outlet hole 12 in sequence.

[0074] A filter element may be provided in the air inlet 11 and / or air outlet 12. For example, the filter element may be a filter screen, which includes multiple mesh holes. The smallest mesh hole diameter may be less than 100μm. This can ensure smooth airflow while blocking moisture and impurities from entering, thus achieving the effects of breathability, waterproofing, and dustproofing.

[0075] In some embodiments, the filter element may be provided with one layer or multiple layers. For example, the filter element may be provided with at least two layers, wherein one layer of the filter element can block larger dust particles to achieve the first stage of filtration, and the other layer may be a fine filter screen with a pore size of less than 100 micrometers to achieve the second stage of filtration of the incoming air, thereby effectively ensuring the cleanliness of the air.

[0076] To further enhance waterproofing, a waterproof coating, such as a hydrophobic nano-coating, can also be applied to the inner surface of the air duct 4.

[0077] like Figure 4 As shown, fan 3 is a device capable of generating back pressure, which can create back pressure in the air duct 4 or between the air inlet 41 and the air inlet 11, so that the cold air outside the electronic equipment (such as...) can be drawn in. Figure 4 (As shown by the blue arrow in the image) is introduced into the air duct 4. Since the heat generated by the heating element 2 is conducted to at least a portion of the air duct 4, the temperature of the air duct 4 is higher in this area near the heating element 2. When cold air passes through the high-temperature area within the air duct 4, the cold air can exchange heat with the heat, and the cold air passing through the high-temperature area becomes hot air (as shown by the blue arrow in the image). Figure 4 (As shown by the red arrow in the diagram), hot air can be further discharged to the outside of the electronic device through the air outlet 42 and the air outlet 12 in sequence, thereby achieving heat dissipation and cooling of the heat-generating device 2. Here, cold air refers to air with a relatively lower temperature compared to the high-temperature air near the heat-generating device 2.

[0078] It is understandable that the temperature of the air surrounding the heat-generating device 2 is relatively high. Taking the heat-generating device 2 as a chip as an example, the chip includes a top surface and a bottom surface. The bottom surface of the chip is used to mount it on the circuit board, and the top surface of the chip can face the screen. The air temperature above the top surface of the chip is significantly higher. In order to improve the heat dissipation efficiency of the heat-generating device 2, such as the chip, in this embodiment, along the thickness direction Z of the electronic device, the projection of the air duct 4 at least partially overlaps with the projection of the heat-generating device 2. This allows the air duct 4 to have a larger volume that can contact the high-temperature air surrounding the heat-generating device 2, thereby improving the heat exchange efficiency and thus improving the heat dissipation efficiency.

[0079] In this embodiment, by setting up an air duct 4 in the electronic device and generating back pressure through a fan 3, cold air from outside the electronic device can enter the duct and flow along the direction constrained by the duct. After the cold air exchanges heat in the high-temperature area, the resulting hot air can be discharged to the outside of the electronic device in a timely manner along the duct, thereby effectively improving the heat dissipation efficiency.

[0080] Among them, fan 3 can be a piezoelectric fan, also known as a piezoelectric ceramic fan. A piezoelectric fan utilizes the inverse piezoelectric effect of piezoelectric ceramics. An alternating electric field is generated by a drive circuit, driving the blades to produce bending resonance, thereby outputting a high-speed, stable airflow forward from the blade tip. Piezoelectric fans are compact and lightweight, with a thickness of only a few millimeters. They can be easily integrated into electronic devices such as mobile phones, without occupying additional thickness space, which is beneficial for achieving thinner and lighter designs. Piezoelectric fans operate with low noise, improving the user experience. Furthermore, the low energy consumption of piezoelectric fans helps extend the battery life of electronic devices, and their fast response speed allows them to adapt to heat dissipation needs in real time.

[0081] When installing the fan 3, the fan 3 can be connected to the cover plate 14. For example, the fan 3 can be connected to the cover plate 14 by screws or other connectors, or by snap-fit ​​or other means.

[0082] Figure 5 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 5 As shown, the electronic device may also include a camera module 5. The main body 1 includes a mid-frame 13, a cover plate 14, and a decorative element 15. The decorative element 15 can be a shell structure that can enclose the camera module 5, providing protection and aesthetic appeal. The decorative element 15 is connected to the cover plate 14 and protrudes from the cover plate 14 away from the mid-frame 13. The decorative element 15 has a recessed space within it, where the camera module 5 and the fan 3 can be housed. The fact that the decorative element 15 protrudes from the cover plate 14 allows the fan 3 to be housed within it without occupying additional internal space of the main body 1, facilitating a slimmer and lighter design for the electronic device.

[0083] The decorative component 15 can be manufactured independently and can be fixed to the cover plate 14 by processes such as adhesive, snap-fit, or welding. In some embodiments, the decorative component 15 can also be integrally formed with the cover plate 14, that is, the decorative component 15 can be integrally formed during the manufacturing process of the cover plate 14.

[0084] The positions of the air inlet 11 and air outlet 12 on the main body 1 can be selected from a variety of options. For example, such as Figure 5As shown, both the air inlet 11 and the air outlet 12 can be provided on the decorative part 15, and the air inlet 11 and the air outlet 12 can be distributed on opposite sides of the decorative part 15. The air inlet 41 and the air outlet 42 of the air duct 4 can be connected to the decorative part 15 or the cover plate 14, and a sealing element such as foam can be provided at the connection position between the air inlet 41 and the decorative part 15 or the cover plate 14, and a sealing element such as foam can also be provided at the connection position between the air outlet 42 and the decorative part 15 or the cover plate 14, so as to isolate moisture or impurities in the outside air through the sealing element.

[0085] The fan 3 can be positioned between the air inlet 11 and the air inlet 41 of the air duct 4. At least a portion of the fan 3 can also be located within the air inlet 41. The back pressure provided by the fan 3 allows external air to enter the duct through the air inlet 11. Opening the air inlet 11 and air outlet 12 on the decorative component 15 avoids reducing structural strength by opening holes in the middle frame 13 or cover plate 14. It also prevents dust and wastewater from frequently touching the openings during use, which could easily enter the electronic device through the air inlet 11 and air outlet 12, affecting device performance or causing damage.

[0086] In some embodiments, the air inlet 11 and the air outlet 12 may also be provided on the middle frame 13, or the air inlet 11 may be provided on the middle frame 13 and the air outlet 12 may be provided on the decorative part 15, or the air inlet 11 may be provided on the decorative part 15 and the air outlet 12 may be provided on the middle frame 13.

[0087] like Figure 5 As shown, the electronic device also includes a first circuit board 6a, which can be a printed circuit board (PCB) and serve as the motherboard of the electronic device. The motherboard has numerous circuits capable of performing different functions. Heat-generating devices 2, such as chips, can be electrically connected to the first circuit board 6a. A via 6a1 can be provided on the first circuit board 6a, extending through it along the thickness direction Z of the electronic device. At least a portion of the air duct 4 can pass through the via 6a1.

[0088] The fan 3 can be installed in the decorative component 15. The heating device 2 is usually installed on the side of the first circuit board 6a facing the screen, that is, the heating device 2 and the fan 3 are respectively located on both sides of the first circuit board 6a. At least a part of the air duct 4 is located on the same side of the first circuit board 6a as the fan 3, so as to introduce cold air into the air duct 4 through the fan 3. At the same time, at least a part of the fan 3 is located near or in contact with the heating device 2. In this embodiment, by providing a through hole 6a1 on the first circuit board 6a, at least a part of the air duct 4 can pass through the through hole 6a1, thereby realizing that at least a part of the air duct 4 is located on one side of the first circuit board 6a and at least another part is located on the other side of the first circuit board 6a. This can both accommodate the fan 3 being installed in the decorative component 15 and the ability to introduce cold air into the air duct 4 through the fan 3, and the ability to dissipate heat near the heating device 2 through the air duct 4, thus achieving efficient heat dissipation.

[0089] The air duct 4 can also include two parts, namely a first part 45 and a second part 46. The first part 45 can be set on one side of the first circuit board 6a, and the second part 46 can be set on the other side of the first circuit board 6a. The two parts of the air duct 4 can be connected through the through hole 6a1 on the first circuit board 6a, so as to facilitate the installation of the air duct 4 on the first circuit board 6a.

[0090] like Figure 5 As shown, the electronic device also includes a shielding cover 7, which can be connected to the first circuit board 6a and can be placed around the heating device 2 and other devices to isolate them from other devices that generate mutual electromagnetic interference, thereby achieving electromagnetic shielding. The shielding cover 7 also has a certain structural strength, providing support for the air duct 4. That is, the air duct 4 can overlap or be fixedly connected to the shielding cover 7 to reliably support the air duct 4 and ensure the stability of the air duct 4.

[0091] like Figure 5As shown, the electronic device includes a second heat-conducting element 8b, which is connected to the body 1 and / or the air duct 4. At least a portion of the air duct 4 is disposed between the second heat-conducting element 8b and the heat-generating device 2. The second heat-conducting element 8b can be a thermal interface material (TIM), which has a high thermal conductivity, thus improving heat transfer efficiency. In this embodiment, cold air can enter the air duct 4 from the air inlet 41. The cold air in the air duct 4 can expel most of the heat near the heat-generating device 2 from the air outlet 42 of the air duct 4. A small portion of the heat that cannot be actively expelled by the cold air can be passively dissipated, i.e., conducted to the outside through the second heat-conducting element 8b. Therefore, the combination of active heat dissipation by the fan 3 and passive heat dissipation by the second heat-conducting element 8b effectively improves heat dissipation efficiency, enabling the heat-generating device 2 to perform well under high load.

[0092] like Figure 5 As shown, the electronic device also includes a first heat exchanger 8d, which is connected to the body 1 and / or the second heat-conducting element 8b, and is located on the side of the second heat-conducting element 8b away from the air duct 4. The heat exchanger (Vapor Chamber, VC) has a high thermal conductivity and a low thickness, which can meet the heat dissipation requirements of the high-power heat-generating device 2. In this embodiment, one side of the first heat exchanger 8d can be in contact with the second heat-conducting element 8b or maintain a small gap, while the other side of the first heat exchanger 8d can be in contact with the screen. Part of the heat generated by the heat-generating device 2 can be discharged from the air duct 4 after heat exchange with the cold air in the air duct 4, while the remaining heat can be diffused to the atmosphere through heat conduction, sequentially passing through the second heat-conducting element 8b, the first heat exchanger 8d, and the screen. The first heat exchanger 8d can have a larger area than the second heat-conducting element 8b, which can improve the efficiency of heat conduction and is beneficial for improving the heat dissipation efficiency during passive cooling.

[0093] Figure 6 This is a top view of an electronic device provided in one embodiment of the present application on one side of the cover plate, as shown below. Figure 6 As shown, the electronic device also includes a bracket 31, on which the fan 3 can be connected. The bracket 31 can be connected and fixed to the cover plate 14. Exemplarily, the bracket 31 can be mounted on the cover plate 14 using screws or other connectors, or it can be mounted on the cover plate 14 using snap-fit ​​or other methods. The bracket 31 can be flexibly designed according to the space within the decorative element 15, balancing space utilization and installation location selection, thereby enabling the fan 3 to be placed within the decorative element 15 while ensuring reliable installation.

[0094] Figure 7This is a partial top view of the electronic device provided in the embodiment of this application on the side of the heat-generating device 2. Figure 7 Corresponding to Figure 5 The structure shown. (As illustrated) Figure 7 As shown, the air duct 4 can have a certain width in the length direction of the electronic device. The air duct 4 is provided with a solder point 43 on at least one side in the length direction of the electronic device, or it can be provided with a solder point 43 on at least one side in the width direction of the electronic device. The solder point 43 can be used to weld the air duct 4 to the first circuit board 6a at the position of the via 6a1, thereby ensuring the stability of the air duct 4.

[0095] Figure 8 This is a partial top view of the electronic device provided in an embodiment of this application on the side of the cover plate 14. Figure 7 Corresponding to Figure 5 The structure shown. (As illustrated) Figure 8 As shown, the air duct 4 can also be connected to the first circuit board 6a by means of screws 44 and other connectors. Compared with the above welding method, the screw 44 connection method can alleviate the deformation of the first circuit board 6a during thermal expansion and contraction, relieve stress, and extend the service life of the first circuit board 6a.

[0096] In some other embodiments, screws 44 and welding can be used simultaneously. The combination of the two can also ensure the reliability of the connection between the first circuit board 6a and the air duct 4.

[0097] Figure 9 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 9 As shown, the air inlet 41 of the air duct 4 can be set on the decorative part 15, the air outlet 42 can be set on the middle frame 13, and the air outlet 42 can be located on the side of the first circuit board 6a away from the heat-generating device 2.

[0098] Figure 10 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 10 As shown, the air inlet 41 of the air duct 4 can be set on the decorative part 15, and the air outlet 42 can be set on the middle frame 13. The air outlet 42 can be located on the side of the first circuit board 6a facing the heat-generating device 2. Therefore, the part of the first circuit board 6a near the air outlet 42 of the air duct 4 does not need to be perforated, which is beneficial to improving the structural strength of the first circuit board 6a.

[0099] Figure 11 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 11As shown, the electronic device includes a second circuit board 6b and a third circuit board 6c. The second circuit board 6b and the third circuit board 6c are electrically connected through a fifth circuit board 6e for support. The fifth circuit board 6e enables the second circuit board 6b and the third circuit board 6c to maintain a gap. Thus, the second circuit board 6b, the third circuit board 6c and the fifth circuit board 6e can form a "sandwich" structure. The space between the second circuit board 6b and the third circuit board 6c can be used to arrange devices that can be electrically connected to the second circuit board 6b or to the third circuit board 6c.

[0100] like Figure 11 As shown, the heating element 2 is electrically connected to the second circuit board 6b and is located on the same side of the second circuit board 6b as the third circuit board 6c. The heating element 2 has a relatively small thickness. Since the third circuit board 6c is stacked on the second circuit board 6b via the fifth circuit board 6e, the distance H1 between the surface of the third circuit board 6c away from the second circuit board 6b and the second circuit board 6b is greater than the distance H2 between the surface of the heating element 2 away from the second circuit board 6b and the second circuit board 6b. Therefore, the surface of the third circuit board 6c away from the second circuit board 6b limits the maximum height of the device above the second circuit board 6b. Because the distance H1 is smaller than the distance H2, there is sufficient space above the heating element 2 for arranging the fan 3, thus avoiding excessive use of thickness space and facilitating the thinner and lighter design of electronic devices.

[0101] like Figure 11 As shown, the air duct 4 and the heat-generating device 2 are both located on the same side of the first circuit board 6a. The air inlet 41 and air outlet 42 of the air duct 4 are both located on the middle frame 13. The air duct 4 can extend along the width direction of the electronic device. Since the surface of the third circuit board 6c away from the second circuit board 6b limits the maximum height of the device above the second circuit board 6b, at least a portion of the air duct 4 can be supported on the third circuit board 6c. At least a portion of the air duct 4 can be located on the side of the heat-generating device 2 away from the first circuit board 6a. There can be a certain space between the air duct 4 and the heat-generating device 2. This space can be used to install the fan 3, thereby avoiding the fan 3 from excessively occupying the thickness space of the electronic device. At the same time, the fan 3 can be close to the heat-generating device 2, which is conducive to guiding cold air to pass fully through the heat-generating device 2 and achieving efficient heat dissipation.

[0102] like Figure 11As shown, a support member is provided on the side of the third circuit board 6c away from the second circuit board 6b, and at least a portion of the air duct 4 is connected to the end of the support member away from the third circuit board 6c. The support member protrudes from the surface of the third circuit board 6c. Functional devices may also be provided on the third circuit board 6c. The support member and some of the functional devices may be located on the same side of the third circuit board 6c, and the height of the support member may be higher than the height of these functional devices. When the air duct 4 is supported on the support member, it can prevent the air duct 4 from pressing on the functional devices.

[0103] The support element can be a solder ball, which can be soldered onto the third circuit board 6c. In some other embodiments, the support element can also be made of other materials, which is not limited in this embodiment.

[0104] like Figure 11 As shown, the electronic device also includes a first heat-conducting element 8a, which is in contact with the heat-generating device 2. At least a portion of the heat generated by the heat-generating device 2 can be transferred to the fan 3 through the first heat-conducting element 8a. The first heat-conducting element 8a can be made of the same material as the aforementioned second heat-conducting element 8b, that is, the first heat-conducting element 8a can also be made of TIM material, or other materials with high thermal conductivity. Compared with air, the first heat-conducting element 8a can achieve rapid heat conduction, which is beneficial for further efficient heat dissipation through the fan 3.

[0105] The first heat-conducting element 8a can cover all surfaces of the heating device 2, so that heat from all directions of the heating device 2 can be conducted to the fan 3 through the first heat-conducting element 8a. In some other embodiments, the first heat-conducting element 8a may also be provided only on the side of the heating device 2 facing the fan 3.

[0106] like Figure 11 As shown, the air duct 4 is provided with a first channel 47, which is located between the air inlet 41 and the air outlet 42. Along the thickness direction Z of the electronic device, the first channel 47 is opposite to the heat-generating device 2, and the fan 3 is disposed in the first channel 47. The sidewall of the first channel 47 can extend towards the heat-generating device 2. When the fan 3 is disposed in the first channel 47, the sidewall of the first channel 47 can block the side of the fan 3. On the one hand, it can separate the fan 3 from surrounding devices such as circuit boards. On the other hand, the sidewall of the first channel 47 can restrict the airflow, allowing cool air to quickly pass through the air duct 4 and be discharged from the air outlet 42, achieving efficient heat dissipation.

[0107] Figure 12 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 12As shown, a mounting cavity 48 can be provided on the air duct 4, and the mounting cavity 48 is connected to the air duct 4. The fan 3 is disposed within the mounting cavity 48. Specifically, along the thickness direction Z of the electronic device, the mounting cavity 48 is opposite to the heat-generating device 2. Relative to... Figure 11 The air duct structure shown is 4. Figure 12 The air duct 4 structure shown is in Figure 11 The first channel 47 is designed as a mounting cavity 48. The mounting cavity 48 provides space for the installation of the fan 3, ensuring the reliability of the fan 3 installation. In one embodiment, the air duct 4 may include an air inlet channel 4a and an air outlet channel 4b. A first partition 4c is provided between the air inlet channel 4a and the air outlet channel 4b, which separates the air inlet channel 4a and the air outlet channel 4b, preventing the airflow in the air inlet channel 4a from directly entering the air outlet channel 4b. The air inlet channel 4a is provided with a first through hole 4a1, which connects the air inlet channel 4a to the mounting cavity 48. The air outlet channel 4b is provided with a second through hole 4b1, which connects the mounting cavity 48 to the air outlet channel 4b.

[0108] The back pressure provided by the fan 3 allows cold air to enter the air inlet channel 4a and further enter the mounting cavity 48 through the first through hole 4a1. Since the mounting cavity 48 is close to the heating device 2, the heat generated by the heating device 2 can be conducted to the mounting cavity 48 through heat conduction and exchanged with the cold air in the mounting cavity 48. The hot air in the mounting cavity 48 after heat exchange can enter the exhaust channel 4b through the second through hole 4b1 and can be further discharged to the atmosphere through the air outlet 42 and the air outlet hole 12.

[0109] Figure 13 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 13 As shown, the electronic device also includes a fourth circuit board 6d, and the heating element 2 is electrically connected to the fourth circuit board 6d. The fourth circuit board 6d can be the motherboard of the electronic device. The air duct 4 is provided with a second channel 49, located between the air inlet 41 and the air outlet 42. The end face of the second channel 49 abuts against the fourth circuit board 6d, and the fourth circuit board 6d can enclose the second channel 49. The second channel 49 has a large space, allowing both the fan 3 and the heating element 2 to be placed within it. Two or more layers of sixth circuit boards 6f can be disposed on the fourth circuit board 6d. For example, the fourth circuit board 6d and two or more layers of sixth circuit boards 6f can be stacked to form a "sandwich" structure. The stacked sixth circuit boards 6f have a certain height. The second channel 49 can be located to the side of the sixth circuit board 6f, and the dimension of the second channel 49 in the thickness direction Z of the electronic device can be smaller than the total height of the stacked sixth circuit boards 6f. This avoids the second channel 49 occupying additional thickness space, which is beneficial for the thinner and lighter design of the electronic device.

[0110] During the heat dissipation process, fan 3 can provide back pressure. Since the heat-generating device 2 is located in the second channel 49, the cold air does not need to exchange heat with the heat-generating device 2 through other heat-conducting materials, but can contact the heat-generating device 2 and exchange heat in the contact, thereby improving the efficiency of heat exchange and heat dissipation.

[0111] like Figure 13 As shown, the fan 3 is disposed on at least one side of the heat-generating device 2 along a direction perpendicular to the thickness direction Z of the electronic device. Since the sidewall of the second channel 49 extends a certain length along the thickness direction Z of the electronic device and can abut against the fourth circuit board 6d, the side of the heat-generating device 2 can have a certain space for arranging the fan 3, which is beneficial for improving integration. The piezoelectric fan 3 has a relatively small thickness and can be disposed vertically on at least one side of the heat-generating device 2. The vertical orientation of the piezoelectric fan 3 means that the thickness direction Z of the piezoelectric fan 3 is perpendicular to the thickness direction Z of the electronic device.

[0112] like Figure 13 As shown, there can be two fans 3, which can be set on opposite sides of the heat-generating device 2. This can increase the back pressure in the air duct 4, which is beneficial for introducing cold air into the air duct 4 and for expelling hot air from the air duct 4, thereby improving the heat dissipation efficiency.

[0113] The heating element 2 can be electrically connected to the fourth circuit board 6d via a solder ball 21. Since both the heating element 2 and the solder ball 21 are located within the second channel 49, the cold air entering the second channel 49 may contain moisture and impurities. To prevent these moisture and impurities from corroding the heating element 2 and the solder ball 21, a waterproof coating can be applied to their surfaces to protect them.

[0114] like Figure 13 As shown, a second heat-conducting element 8b and a first heat-spreading plate 8d can be stacked on the side of the air duct 4 away from the fourth circuit board 6d. Part of the heat generated by the heating device 2 can exchange heat with the cold air and be discharged from the air duct 4. Another part of the heat can be diffused into the atmosphere through heat conduction, passing sequentially through the side wall of the air duct 4, the second heat-conducting element 8b, and the first heat-spreading plate 8d. Thus, the heat dissipation efficiency can be improved by combining active heat dissipation by the fan 3 and passive heat dissipation by the heat-conducting material.

[0115] Figure 14 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 14As shown, the air inlet 11 and air outlet 12 can be located on the same side of the body 1, and the fan 3 is disposed in the air duct 4. At least a portion of the projection of the air duct 4 coincides with the projection of the heat-generating device 2 in a direction perpendicular to the thickness direction Z of the electronic device. The air duct 4 can be divided into two channels by a second partition 4d, one being an air inlet channel 4a and the other an air outlet channel 4b. The air inlet side of the fan 3 can communicate with the air inlet channel 4a, and the air outlet side of the fan 3 can communicate with the air outlet channel 4b. Because at least a portion of the projection of the air duct 4 coincides with at least a portion of the projection of the heat-generating device 2 in a direction perpendicular to the thickness direction Z of the electronic device, at least a portion of the air duct 4 can be close to the heat-generating device 2, thereby facilitating the rapid conduction of heat generated by the heat-generating device 2 into the air duct 4, achieving rapid and efficient heat dissipation.

[0116] like Figure 14 As shown, the electronic device also includes a third heat-conducting element 8c. The third heat-conducting element 8c is stacked on the heating device 2 along the thickness direction Z of the electronic device and is connected to the air duct 4. The third heat-conducting element 8c can be the aforementioned TIM material. Some of the heat generated by the heating device 2 can be directly transferred to the air duct 4, and some heat can be conducted to the air duct 4 through the third heat-conducting element 8c. Compared with air, the third heat-conducting element 8c has a relatively high thermal conductivity, which is beneficial to improving the heat conduction efficiency.

[0117] like Figure 14 As shown, the electronic device also includes a second heat spreader 8e, which is connected to the body 1 and / or the third heat conductor 8c. The second heat spreader 8e is located on the side of the third heat conductor 8c away from the heat-generating device 2, and the air duct 4 is connected to the second heat spreader 8e. The second heat spreader 8e and the aforementioned first heat spreader 8d can both be made of the same material and have similar functions, both of which can improve heat dissipation efficiency. Some of the heat generated by the heat-generating device 2 can be transferred to the air duct 4 through the side of the heat-generating device 2, and some heat can be conducted to the third heat conductor 8c and the second heat spreader 8e. Both the third heat conductor 8c and the second heat spreader 8e can contact the air duct 4, so that the air duct 4 can have a large contact area with the third heat conductor 8c and the second heat spreader 8e, thereby enabling the heat in the third heat conductor 8c and the second heat spreader 8e to be quickly conducted to the air duct 4 and to exchange heat with the cold air in the air duct 4, which is beneficial to improving heat dissipation efficiency.

[0118] Figure 15 A partial cross-sectional view of an electronic device provided in another embodiment of this application, such as... Figure 15As shown, a third heat-conducting element 8c and a second heat-spreading plate 8e can be sequentially stacked on the heating element 2. The air duct 4 is located to the side of the third heat-conducting element 8c and can contact it. Part of the heat generated by the heating element 2 can be conducted to the air duct 4 through the third heat-conducting element 8c. Since the air duct 4 is not located to the side of the heating element 2, part of the heat generated by the heating element 2 can be conducted to the air duct 4 through the air to the side of the heating element 2. In this embodiment, relative to... Figure 14 Regarding the structure of air duct 4 shown, Figure 15 The air duct structure shown can extend only in a direction perpendicular to the thickness direction Z of the electronic device, without having to extend along the thickness direction Z, which is beneficial for the thinner design of the electronic device.

[0119] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: The main body is provided with an air inlet and an air outlet. A heating element is disposed within the main body; An air duct is provided in the main body, wherein the air inlet of the air duct is connected to the air inlet hole, and the air outlet of the air duct is connected to the air outlet hole; A fan, disposed in the main body, is used to blow air that enters from the air inlet to the air outlet, and then flows out from the air outlet.

2. The electronic device according to claim 1, characterized in that, The body includes: Mid-frame; A cover plate, the cover plate being connected to the middle frame; The decorative element is connected to the cover plate and protrudes from the cover plate to the side away from the middle frame. The decorative element has an accommodating space, and the fan is disposed in the accommodating space.

3. The electronic device according to claim 2, characterized in that, The air inlet is disposed on the decorative element or the middle frame; and / or, the air outlet is disposed on the decorative element or the middle frame.

4. The electronic device according to claim 2, characterized in that, The fan is connected to the cover plate.

5. The electronic device according to claim 4, characterized in that, It also includes a bracket connected to the cover plate, and the fan is connected to the bracket.

6. The electronic device according to any one of claims 1-5, characterized in that, It also includes a first circuit board, the heating device being electrically connected to the first circuit board, the first circuit board having a through hole, and at least a portion of the air duct passing through the through hole.

7. The electronic device according to claim 6, characterized in that, The air duct is connected to the first circuit board via a connector; and / or, the air duct is connected to the first circuit board via a soldering process.

8. The electronic device according to claim 6 or 7, characterized in that, It also includes a shielding cover, which is connected to the first circuit board and is used to cover the heating device between the shielding cover and the first circuit board; At least a portion of the air duct is supported on the shield.

9. The electronic device according to any one of claims 1-5, characterized in that, Along the thickness direction of the electronic device, the fan is stacked on one side of the heat-generating device.

10. The electronic device according to claim 9, characterized in that, The air duct is provided with a first channel, which is located between the air inlet and the air outlet; Along the thickness direction of the electronic device, the first channel is opposite to the heat-generating device, and the fan is disposed in the first channel.

11. The electronic device according to claim 9, characterized in that, The air duct is provided with a mounting cavity, the mounting cavity is connected to the air duct, and the fan is disposed in the mounting cavity; Along the thickness direction of the electronic device, the mounting cavity is opposite to the heating device.

12. The electronic device according to claim 10 or 11, characterized in that, It also includes a second circuit board and a third circuit board. Along the thickness direction of the electronic device, the heating device and the third circuit board are both disposed on the same side of the second circuit board. The distance between the surface of the third circuit board away from the second circuit board and the second circuit board is greater than the distance between the surface of the heating device away from the second circuit board and the second circuit board. At least a portion of the air duct is supported by the third circuit board.

13. The electronic device according to claim 12, characterized in that, A support member is provided on the side of the third circuit board away from the second circuit board, and at least a portion of the air duct is connected to the end of the support member away from the third circuit board.

14. The electronic device according to any one of claims 10-13, characterized in that, It also includes a first heat-conducting element, which is in contact with the heating device, and at least part of the heat generated by the heating device is transferred to the fan through the first heat-conducting element.

15. The electronic device according to claims 1-5, characterized in that, It also includes a fourth circuit board, to which the heating device is electrically connected; The air duct is provided with a second channel, which is located between the air inlet and the air outlet, and the end face of the second channel abuts against the fourth circuit board; Both the fan and the heating element are located in the second channel.

16. The electronic device according to claim 15, characterized in that, The fan is disposed on at least one side of the heat-generating device in a direction perpendicular to the thickness direction of the electronic device.

17. The electronic device according to claim 15 or 16, characterized in that, The heating element is electrically connected to the fourth circuit board via a solder joint, and the surfaces of the heating element and the solder joint are provided with a waterproof coating.

18. The electronic device according to any one of claims 1-17, characterized in that, It also includes a second heat-conducting element, which is connected to the body and / or the air duct, at least a portion of which is disposed between the second heat-conducting element and the heating device.

19. The electronic device according to claim 18, characterized in that, It also includes a first heat spreader plate, which is connected to the body and / or the second heat-conducting component, and the first heat spreader plate is located on the side of the second heat-conducting component away from the air duct.

20. The electronic device according to any one of claims 1-19, characterized in that, Along the thickness direction of the electronic device, the projection of the air duct at least partially overlaps with the projection of the heat-generating device.

21. The electronic device according to any one of claims 1-5, characterized in that, The air inlet and the air outlet are located on the same side of the body, and the fan is disposed in the air duct; along a direction perpendicular to the thickness direction of the electronic device, at least a portion of the projection of the air duct at least partially coincides with the projection of the heat-generating device.

22. The electronic device according to claim 21, characterized in that, The electronic device further includes a third heat-conducting component, which is stacked on the heat-generating device along the thickness direction of the electronic device, and the third heat-conducting component is connected to the air duct.

23. The electronic device according to claim 22, characterized in that, It also includes a second heat spreader plate, which is connected to the body and / or the third heat-conducting component, and the second heat spreader plate is located on the side of the third heat-conducting component away from the heat-generating device; The air duct is connected to the second heat exchange plate.

24. The electronic device according to any one of claims 1-23, characterized in that, A filter element is provided in the air inlet and / or the air outlet.

25. The electronic device according to any one of claims 1-24, characterized in that, The fan is a piezoelectric fan.

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