Flexible self-rectification memory and preparation method and application thereof
By using a stacked structure of a flexible substrate, a Ti3C2Tx charge trapping layer, and a polydiallyldimethylammonium chloride buffer switch layer, the problems of untunable self-rectification characteristics and poor reliability of self-rectified memory are solved, achieving high-density storage and crosstalk suppression, which is suitable for neuromorphic computing and flexible wearable electronics.
Patent Information
- Application Number
- CN202610278481.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-09
- Publication Date
- 2026-06-26
AI Technical Summary
Existing self-rectifying memories suffer from problems such as unadjustable self-rectification characteristics, poor reliability, and insufficient flexibility and compatibility. Furthermore, existing RRAMs face challenges in high-density storage and crosstalk suppression.
A stacked structure consisting of a flexible substrate, a Ti3C2Tx charge trapping layer, and a polydiallyldimethylammonium chloride buffer switch layer is prepared by spin coating. Combining oxygen ion adsorption sites and a nanoporous structure, it achieves tunable self-rectification characteristics and high reliability.
It achieves adjustable self-rectification characteristics, significant crosstalk suppression, and high device reliability, making it suitable for neuromorphic computing and flexible wearable electronics, with excellent performance and a wide range of applications.