Method and apparatus for separating waste photovoltaic panel glass and silicon wafer fragments

Abstract

This application relates to a method and apparatus for separating waste photovoltaic panel glass and silicon wafer fragments. The separation method includes the following steps: pre-treating the mixed glass and silicon wafer fragments by high-temperature calcination; pre-screening the pre-treated glass and silicon wafer fragments to obtain a mixture with intermediate particle size distribution within a preset range; feeding the intermediate particle size mixture into an inclined vibrating bed, adjusting the vibration frequency, amplitude, and bed tilt angle to cause the glass fragments and silicon wafer fragments in the intermediate particle size mixture to move and separate, thus completing the separation operation. This solution can achieve effective and high-precision separation of glass fragments and silicon wafer fragments, solving the problem that traditional technologies can only achieve separation by particle size, while avoiding problems such as increased acid consumption and waste liquid, and has lower implementation difficulty and cost.

Description

Technical Field

[0001] This application relates to the technical field of resource utilization of waste photovoltaic modules, and in particular to a method and device for separating waste photovoltaic panel glass and silicon wafer fragments. Background Technology

[0002] Retired photovoltaic (PV) modules contain valuable metals such as copper, aluminum, silicon, and silver, possessing considerable recycling value. Silicon solar cells (silicon wafers) and tempered glass (glass) account for approximately 3.65% and 70.00% of the PV module's mass, respectively, and approximately 56.66% and 5.78% of its value, respectively, making them the primary target components for recycling retired PV modules. In the recycling process of waste crystalline silicon PV panels, pyrolysis or mechanical methods are typically used to remove the EVA film to obtain glass and solar cells. However, during subsequent crushing and separation, due to the brittle and hard nature of silicon wafers, a large amount of fine fragments are easily generated. These fragments mix with glass fragments, forming difficult-to-handle fine materials, posing a significant challenge to subsequent high-value recycling.

[0003] In related technologies, traditional physical screening methods such as sieves and air classification can only achieve classification by particle size and cannot separate the mixed glass and silicon wafers. Hydrometallurgical processes directly process the mixed glass and silicon wafer fragments, which not only leads to increased acid consumption and reduced silicon powder purity, but also generates waste liquid treatment problems. Furthermore, the similar material properties of glass and silicon wafers result in low sorting efficiency in hydrometallurgy. Summary of the Invention

[0004] Therefore, it is necessary to provide a method and device for separating waste photovoltaic panel glass and silicon wafer fragments to address the problem of the inability to effectively separate glass fragments from silicon wafer fragments.

[0005] The first aspect of this application proposes a method for separating waste photovoltaic panel glass from silicon wafer debris, which includes the following steps:

[0006] High-temperature calcination pretreatment was performed on the mixed glass and silicon wafer debris.

[0007] Pre-screening is performed on the glass and silicon wafer mixture residue after high-temperature calcination pretreatment to obtain a mixture of intermediate particle sizes with a particle size distribution range within a preset range;

[0008] The intermediate particle size mixture is fed into an inclined vibrating bed. The vibration frequency, amplitude, and inclination angle of the bed are adjusted to cause the glass fragments and silicon wafer fragments in the intermediate particle size mixture to move and separate, thus completing the separation operation.

[0009] This method for separating waste photovoltaic panel glass and silicon wafer fragments is applied in processing scenarios where mixed glass and silicon wafer fragments obtained after dismantling, pyrolysis, and crushing waste photovoltaic panels need to be effectively separated. Specifically, the mixed glass and silicon wafer fragments are first fed into a calcining device for high-temperature calcination pretreatment. This high-temperature calcination thoroughly removes residual organic matter, eliminates static electricity in the materials, and alters the surface characteristics of the particles, further widening the difference in surface morphology between the glass fragments and silicon wafer fragments. Specifically, the glass fragments appear as thick, blocky particles, while the silicon wafer fragments appear as thin, sheet-like particles. Then, the high-temperature calcination process is repeated... The glass and silicon wafer fragments, after pre-treatment by calcination, undergo pre-screening to obtain a mixture with intermediate particle sizes within a preset range. This process removes excessively fine dust and oversized particles, preventing interference with subsequent separation processes. Finally, the intermediate particle size mixture is fed into an inclined vibrating bed. Adjusting the vibration frequency, amplitude, and bed inclination angle causes the glass and silicon wafer fragments to move and separate, completing the separation process. Specifically, the glass fragments are irregular, thick blocks with a small contact area with the vibrating bed surface, primarily point contact. Under vibration, the glass fragments easily acquire rolling kinetic energy, and the rolling friction coefficient is much smaller than the sliding friction coefficient. Combined with the component of gravity along the inclined plane, the glass fragments experience a downward net displacement, gradually sliding from the high end to the low end. The silicon wafer fragments, on the other hand, are flat, thin sheets with a large contact area with the bed surface and a high sliding friction coefficient, easily "lying flat" on the bed surface to form a stable static friction state. Under the same vibration parameters, silicon wafer fragments struggle to overcome static friction to generate downward net displacement, primarily vibrating in place or exhibiting only minor displacement, and may even exhibit a reverse movement tendency due to vibration. Therefore, by adjusting the vibration frequency, amplitude, and bed tilt angle, the motion threshold of the glass fragments is lower than that of the silicon wafer fragments, thus effectively separating the two materials. Compared to traditional processes, this solution achieves effective and high-precision separation of glass and silicon wafer fragments, solving the problem that traditional technologies can only achieve separation by particle size. Furthermore, it avoids increased acid consumption and waste liquid issues, and is less difficult and costly to implement.

[0010] The technical solution of this application will be further described below:

[0011] In one embodiment, in the step of pre-treating the glass and silicon wafer mixture by high-temperature calcination, the calcination temperature is 800℃-1000℃ and the calcination time is 5min-20min.

[0012] In one embodiment, in the step of pre-screening the glass and silicon wafer mixture fragments after high-temperature calcination pretreatment to obtain an intermediate particle size mixture with a particle size distribution range within a preset range, the particle size range of the intermediate particle size mixture is 0.5mm-10mm.

[0013] In one embodiment, the step of feeding the intermediate particle size mixture into an inclined vibrating bed and adjusting the vibration frequency, amplitude, and bed tilt angle to cause the glass fragments and silicon wafer fragments in the intermediate particle size mixture to move and separate further includes the step of:

[0014] During the process of glass fragments and silicon wafer fragments moving and separating in the intermediate particle size mixture, water flow is simultaneously applied to the intermediate particle size mixture.

[0015] A second aspect of this application also proposes a separation apparatus for implementing the method for separating waste photovoltaic panel glass and silicon wafer debris as described in any of the above embodiments, comprising:

[0016] Calcination equipment;

[0017] Feeding equipment, the feeding equipment being connected to the calcining equipment; and

[0018] A vibrating bed includes a controller, a vibrator, and a bed surface. The controller is electrically connected to the vibrator, the drive end of the vibrator is connected to the bed surface, and the bed surface is inclined. The bed surface is configured to cooperate with the feeding device.

[0019] In one embodiment, the bed surface has a high-level feeding end and a low-level discharging end arranged opposite to each other. The bed surface is provided with a first discharge port and a second discharge port. The first discharge port is provided corresponding to the high-level feeding end and is provided with an openable and closable material blocking mechanism. The second discharge port is provided corresponding to the low-level discharging end. The feeding device is configured to cooperate with the high-level feeding end.

[0020] In one embodiment, the waste photovoltaic panel glass and silicon wafer fragment separation device further includes a first collector and a second collector, wherein the first collector is disposed below the first discharge port and the second collector is disposed below the second discharge port.

[0021] In one embodiment, at least one interference plate is protruding from the bed surface, and the interference plate extends along the direction from the high-level feeding end to the low-level discharging end;

[0022] And / or, interference grooves are recessed on the bed surface, and the interference grooves extend along the direction from the high-level feed end to the low-level discharge end.

[0023] In one embodiment, the waste photovoltaic panel glass and silicon wafer fragment separation device further includes a rinsing device. The rinsing device includes a support, a water storage container, a water pump, a water valve, a rinsing pipe, and a nozzle. The water storage container is mounted on the support, the water pump is mounted on the water storage container, the water valve is connected to the water pump through a water pipe, the rinsing pipe is connected to the water valve, and the nozzle is connected to the outlet of the rinsing pipe and faces the bed surface.

[0024] In one embodiment, the waste photovoltaic panel glass and silicon wafer fragment separation device further includes an angle adjustment mechanism. The angle adjustment mechanism includes an adjustment seat, a drive motor, an adjustment gear, an arc rack, and a mounting frame. The adjustment seat is disposed on the vibrator, the drive motor is mounted on the adjustment seat, and the motor shaft of the drive motor is connected to the adjustment gear. The adjustment gear meshes with the arc rack, and the arc rack is fixed to the bottom of the bed surface by the mounting frame. Attached Figure Description

[0025] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a flowchart illustrating the steps of a method for separating waste photovoltaic panel glass and silicon wafer fragments according to one embodiment.

[0028] Figure 2 This is a schematic diagram of a waste photovoltaic panel glass and silicon wafer fragment separation device according to one embodiment.

[0029] Figure 3 for Figure 2 A top-view structural diagram.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100. Waste photovoltaic panel glass and silicon wafer slag separation device; 10. Feeding equipment; 20. Vibrating bed; 21. Vibrator; 22. Bed surface; 221. High-level feeding end; 222. Low-level discharge end; 223. First discharge port; 224. Second discharge port; 30. First collector; 40. Second collector; 50. Interference plate; 50a. Interference groove; 60. Flushing device; 70. Material blocking mechanism. Detailed Implementation

[0032] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0033] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0035] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0038] See Figure 1 This application illustrates a method for separating waste photovoltaic panel glass from silicon wafer fragments, comprising the following steps:

[0039] S10: High-temperature calcination pretreatment of glass and silicon wafer mixed slag.

[0040] S20: Pre-screen the glass and silicon wafer mixture after high-temperature calcination pretreatment to obtain a mixture of intermediate particle sizes with a particle size distribution range within a preset range.

[0041] S30: The intermediate particle size mixture is fed into the inclined vibrating bed 20. The vibration frequency, amplitude and the inclination angle of the bed surface 22 are adjusted to make the glass fragments and silicon wafer fragments in the intermediate particle size mixture move and separate, thus completing the separation operation.

[0042] In summary, implementing the technical solution of this embodiment will achieve the following beneficial effects: The method for separating waste photovoltaic panel glass and silicon wafer fragments in this solution is applied in processing scenarios where the mixed glass and silicon wafer fragments obtained after dismantling, pyrolysis, and crushing waste photovoltaic panels are effectively separated. Specifically, in implementation, the mixed glass and silicon wafer fragments are first fed into a calcination device for high-temperature calcination pretreatment. High-temperature calcination thoroughly removes residual organic matter, eliminates static electricity in the materials, and alters the surface characteristics of the particles, further widening the surface morphology difference between the glass fragments and the silicon wafer fragments. Specifically, the glass fragments exhibit a more pronounced appearance... Thick, blocky particles are separated from thin, flaky particles of silicon wafer fragments. Next, the glass and silicon wafer fragments, after high-temperature calcination pretreatment, are pre-screened to obtain a mixture with intermediate particle sizes within a preset range. This process removes excessively fine dust and oversized particles, preventing interference with subsequent separation processes. Finally, the intermediate particle size mixture is fed into an inclined vibrating bed 20. The vibration frequency, amplitude, and inclination angle of the bed surface 22 are adjusted to cause the glass and silicon wafer fragments in the intermediate particle size mixture to move and separate, completing the separation process.

[0043] Specifically, the glass fragments are irregularly shaped thick blocks with a small contact area with the bed surface 22 of the vibrating bed 20, primarily involving point contact. Under vibration, the glass fragments easily acquire rolling kinetic energy, and the rolling friction coefficient is much smaller than the sliding friction coefficient. Combined with the component of gravity along the inclined plane, this causes the glass fragments to produce a downward net displacement, gradually sliding from the high end to the low end. In contrast, the silicon wafer fragments are flat and thin, with a large contact area with the bed surface 22 and a high sliding friction coefficient, easily "lying flat" on the bed surface 22 to form a stable static friction state. Under the same vibration parameters, the silicon wafer fragments struggle to overcome static friction to produce a downward net displacement, mainly vibrating in place or exhibiting only minor displacement, and may even show a tendency to move in the opposite direction due to vibration. Therefore, by adjusting the vibration frequency, amplitude, and the tilt angle of the bed surface 22, the motion threshold of the glass fragments is made lower than that of the silicon wafer fragments, thereby effectively separating the two materials.

[0044] Compared to traditional processes, this solution can achieve effective and high-precision separation of glass fragments and silicon wafer fragments, solving the problem that traditional technologies can only achieve separation by particle size. At the same time, it does not generate problems such as increased acid consumption and waste liquid, and is less difficult and less costly to implement.

[0045] Specifically, in one embodiment, in the step of high-temperature calcination pretreatment of the glass and silicon wafer mixed slag, the calcination temperature is 800℃-1000℃ and the calcination time is 5min-20min.

[0046] For example, the calcination temperature can be, but is not limited to, 800℃, 850℃, 900℃, 950℃, 1000℃, etc.; the calcination time can be, but is not limited to, 5 min, 10 min, 15 min, 20 min, etc. The specific time can be chosen based on the specific characteristics of the mixed glass and silicon wafer fragments obtained during the dismantling, pyrolysis, and crushing of waste photovoltaic panels. The aim is to thoroughly remove residual organic matter from the mixed glass and silicon wafer fragments, eliminate static electricity in the materials, and alter the surface characteristics of the particles, further increasing the difference in surface morphology between the silicon wafer fragments and the glass fragments. Specific values ​​for calcination and calcination time are not limited here.

[0047] In other words, the "high temperature" in the "high temperature calcination pretreatment" mentioned in this application specifically refers to a calcination temperature of 800℃-1000℃.

[0048] Furthermore, in one embodiment, in the step of pre-screening the glass and silicon wafer mixture fragments after high-temperature calcination pretreatment to obtain an intermediate particle size mixture with a particle size distribution range within a preset range, the particle size range of the intermediate particle size mixture is 0.5mm-10mm.

[0049] For example, the particle size of the intermediate particle size mixture can be, but is not limited to, 0.5mm, 1.5mm, 2.5mm, 4mm, 5mm, 7.5mm, etc., and can be flexibly selected according to actual needs. The above-mentioned particle size mixtures of glass and fragments are most effective in achieving self-driven motion separation under inclined and vibrating conditions, which helps to obtain better separation accuracy between glass fragments and silicon wafer fragments.

[0050] Furthermore, based on any of the above embodiments, in the step of feeding the intermediate particle size mixture into the inclined vibrating bed 20 and adjusting the vibration frequency, amplitude, and inclination angle of the bed surface 22 to cause the glass fragments and silicon wafer fragments in the intermediate particle size mixture to move and separate, the step further includes:

[0051] During the process of glass fragments and silicon wafer fragments moving and separating in the intermediate particle size mixture, water flow is simultaneously applied to the intermediate particle size mixture.

[0052] By applying water flow to glass fragments and silicon wafer fragments under vibration conditions, on the one hand, static electricity in the materials can be eliminated, and fine powder can be suppressed from scattering. On the other hand, the material stratification effect can be enhanced, making it easier for thin silicon wafer fragments to be "lifted" by the water flow and to migrate laterally, while thick glass fragments can gain greater rolling kinetic energy under the impact of the water flow, thereby further improving the separation accuracy.

[0053] Please continue reading. Figure 2 and Figure 3In addition to the above, this application also proposes a separation device for implementing the separation method of waste photovoltaic panel glass and silicon wafer fragments as described in any of the above embodiments, which includes a calcination device (not shown in the figure), a feeding device 10, and a vibrating bed 20.

[0054] The calcination equipment can adopt structures such as calcination furnaces and calcination boxes, and is equipped with intelligent temperature sensing and control devices such as high-precision temperature sensors and temperature controllers. It can achieve precise calcination treatment of glass and silicon wafer mixed slag at the set temperature, thereby more effectively removing residual organic matter and eliminating static electricity from the mixed slag.

[0055] The feeding device 10 is connected to the calcining equipment. The feeding device 10 is a transfer mechanism between the calcining equipment and the vibrating bed 20. It is used to receive the glass and silicon wafer mixed slag after it has been processed by the calcining equipment and then transfer it to the vibrating bed 20.

[0056] For example, the feeding device 10 can be any type of conveyor, such as a belt conveyor or a vibrating conveyor, and can be flexibly selected according to actual needs. No specific limitation is made here.

[0057] The vibrating bed 20 includes a controller (not shown in the figure), a vibrator 21 and a bed surface 22. The controller is electrically connected to the vibrator 21, the drive end of the vibrator 21 is connected to the bed surface 22, and the bed surface 22 is inclined. The bed surface 22 is configured in conjunction with the feeding device 10.

[0058] During the separation process, the vibrator 21 is activated to provide vibration to the bed surface 22, which causes the inclined bed surface 22 to promote the movement and separation of glass fragments and silicon wafer fragments. During this process, the controller can adjust the vibration frequency, amplitude and other parameters of the vibrator 21 in real time to achieve the optimal working state of the vibrator 21 and thus obtain a better material separation effect.

[0059] For example, the vibrator 21 can be, but is not limited to, a vibrating motor.

[0060] Please continue reading. Figure 2 and Figure 3In one embodiment, the bed surface 22 has a high-level feeding end 221 and a low-level discharging end 222 that are arranged opposite to each other. The bed surface 22 has a first discharge port 223 and a second discharge port 224. The first discharge port 223 is arranged corresponding to the high-level feeding end 221 and is provided with an openable and closable material blocking mechanism 70. The second discharge port 224 is arranged corresponding to the low-level discharging end 222. The feeding device 10 is arranged in cooperation with the high-level feeding end 221. During the split operation, the feeding device 10 feeds the glass and silicon wafer mixed slag after high-temperature calcination pretreatment to the high-level feeding end 221. Under the vibration of the bed surface 22, the thick glass slag can quickly roll from the high-level feeding end 221 to the low-level discharge end 222, and then fall out from the second discharge port 224. However, because the thin silicon wafer slag is difficult to overcome static friction to generate downward net displacement, it can only vibrate in place or have only a small displacement. At this time, the baffle mechanism 70 is opened, which allows the silicon wafer slag to fall out from the first discharge port 223, thereby completing the continuous separation and discharge process of glass slag and silicon wafer slag.

[0061] Furthermore, based on the above embodiments, the waste photovoltaic panel glass and silicon wafer fragment separation device 100 also includes a first collector 30 and a second collector 40. The first collector 30 is located below the first discharge port 223, and the second collector 40 is located below the second discharge port 224. Therefore, the first collector 30 can collect silicon wafer fragments falling from the first discharge port 223, and the second collector 40 can collect glass fragments falling from the second discharge port 224, so that the sorted and collected silicon wafer fragments and glass fragments can be used subsequently.

[0062] For example, the first collector 30 and the second collector 40 can be any of the following, but not limited to, a collection box or a collection bucket.

[0063] Please continue reading. Figure 3 Furthermore, in another embodiment, at least one interference plate 50 is protruding from the bed surface 22, extending along the direction from the high-level feed end 221 to the low-level discharge end 222. And / or, interference grooves 50a are recessed on the bed surface 22, extending along the direction from the high-level feed end 221 to the low-level discharge end 222. The interference plates 50 and / or interference grooves 50a are used to interfere with the particle movement trajectory of glass fragments and silicon wafer fragments, thereby enhancing the separation effect of glass fragments and silicon wafer fragments.

[0064] Preferably, at least two interference plates 50 and / or interference trenches 50a can be provided, and at least two interference plates 50 and / or interference trenches 50a are arranged side by side at intervals along the line connecting the high-level feed end 221 to the low-level discharge end 222, thereby further improving and strengthening the separation effect of glass slag and silicon wafer slag.

[0065] Please continue reading. Figure 2 Furthermore, in one embodiment, the waste photovoltaic panel glass and silicon wafer fragment separation device 100 also includes a rinsing device 60. The rinsing device 60 includes a support, a water storage container, a water pump, a water valve, a rinsing pipe, and a nozzle. The water storage container is mounted on the support, the water pump is mounted on the water storage container, the water valve is connected to the water pump through a water pipe, the rinsing pipe is connected to the water valve, and the nozzle is connected to the outlet of the rinsing pipe and is positioned facing the bed surface 22.

[0066] During the vibration separation process, the water pump is started, which drives the water in the storage container to the water valve. The water valve then controls the flow rate into the rinsing pipe, and finally, the water is evenly sprayed onto the glass and silicon wafer fragments added to the bed surface 22 through the nozzle. By applying water flow to the glass and silicon wafer fragments under vibration conditions, on the one hand, static electricity of the materials can be eliminated and fine powder can be suppressed. On the other hand, the material stratification effect can be enhanced, making it easier for thin silicon wafer fragments to be "lifted" by the water flow and to migrate laterally, while thick glass fragments can gain greater rolling kinetic energy under the impact of the water flow, thereby further improving the separation accuracy and efficiency.

[0067] In practical applications, depending on the particle size of the mixed glass and silicon wafer debris, in addition to adjusting the frequency and amplitude of the vibrator 21, the separation effect of glass debris and silicon wafer debris can also be improved by changing the tilt angle of the bed surface 22. Therefore, in one embodiment of this application, the waste photovoltaic panel glass and silicon wafer debris separation device 100 further includes an angle adjustment mechanism. The angle adjustment mechanism includes an adjustment seat, a drive motor, an adjustment gear, an arc rack, and a mounting frame. The adjustment seat is disposed on the vibrator 21, the drive motor is mounted on the adjustment seat, and the motor shaft of the drive motor is connected to the adjustment gear. The adjustment gear meshes with the arc rack, and the arc rack is fixed to the bottom of the bed surface 22 by the mounting frame.

[0068] By driving the adjusting gear with a drive motor, the adjusting gear can synchronously drive the arc-shaped rack to rotate and swing clockwise or counterclockwise. This, in turn, drives the bed surface 22 to rotate and swing left and right in the vertical plane through the mounting bracket, thereby adjusting the tilt angle of the bed surface 22. On the one hand, the high driving precision of the meshing transmission between the adjusting gear and the arc-shaped rack helps to accurately control the tilt angle of the bed surface 22, thus achieving better separation of glass fragments and silicon wafer fragments. On the other hand, the meshing of the adjusting gear and the arc-shaped rack itself has a self-locking function, which can prevent the bed surface 22 from loosening and shifting under the vibration of the vibrator 21, thus affecting the tilt angle accuracy of the bed surface 22.

[0069] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for separating waste photovoltaic panel glass and silicon wafer fragments, characterized in that, Includes the following steps: High-temperature calcination pretreatment was performed on the mixed glass and silicon wafer debris. Pre-screening is performed on the glass and silicon wafer mixture residue after high-temperature calcination pretreatment to obtain a mixture of intermediate particle sizes with a particle size distribution range within a preset range; The intermediate particle size mixture is fed into an inclined vibrating bed. The vibration frequency, amplitude, and inclination angle of the bed are adjusted to cause the glass fragments and silicon wafer fragments in the intermediate particle size mixture to move and separate, thus completing the separation operation.

2. The method for separating waste photovoltaic panel glass and silicon wafer fragments according to claim 1, characterized in that, In the step of pre-treating the glass and silicon wafer mixture by high-temperature calcination, the calcination temperature is 800℃-1000℃ and the calcination time is 5min-20min.

3. The method for separating waste photovoltaic panel glass and silicon wafer fragments according to claim 1, characterized in that, In the step of pre-screening the glass and silicon wafer mixture fragments after high-temperature calcination pretreatment to obtain an intermediate particle size mixture with a particle size distribution range within a preset range, the particle size range of the intermediate particle size mixture is 0.5mm-10mm.

4. The method for separating waste photovoltaic panel glass and silicon wafer fragments according to claim 1, characterized in that, The step of feeding the intermediate particle size mixture into an inclined vibrating bed and adjusting the vibration frequency, amplitude, and inclination angle of the bed surface to cause the glass fragments and silicon wafer fragments in the intermediate particle size mixture to move and separate further includes the step of: During the process of glass fragments and silicon wafer fragments moving and separating in the intermediate particle size mixture, water flow is simultaneously applied to the intermediate particle size mixture.

5. A separation apparatus for implementing the method for separating waste photovoltaic panel glass and silicon wafer fragments as described in any one of claims 1 to 4, characterized in that, include: Calcination equipment; A feeding device, which is connected to the calcining equipment; as well as A vibrating bed includes a controller, a vibrator, and a bed surface. The controller is electrically connected to the vibrator, the drive end of the vibrator is connected to the bed surface, and the bed surface is inclined. The bed surface is configured to cooperate with the feeding device.

6. The waste photovoltaic panel glass and silicon wafer fragment separation device according to claim 5, characterized in that, The bed surface has a high-level feeding end and a low-level discharging end arranged opposite to each other. The bed surface has a first discharge port and a second discharge port. The first discharge port is set corresponding to the high-level feeding end and is equipped with an openable and closable material blocking mechanism. The second discharge port is set corresponding to the low-level discharging end. The feeding device is configured in cooperation with the high-level feeding end.

7. The waste photovoltaic panel glass and silicon wafer fragment separation device according to claim 6, characterized in that, The waste photovoltaic panel glass and silicon wafer fragment separation device further includes a first collector and a second collector, the first collector being located below the first discharge port and the second collector being located below the second discharge port.

8. The waste photovoltaic panel glass and silicon wafer fragment separation device according to claim 6, characterized in that, At least one interference plate is protruding from the bed surface, and the interference plate extends along the direction from the high-level feeding end to the low-level discharging end. And / or, interference grooves are recessed on the bed surface, and the interference grooves extend along the direction from the high-level feed end to the low-level discharge end.

9. The waste photovoltaic panel glass and silicon wafer fragment separation device according to claim 5, characterized in that, The waste photovoltaic panel glass and silicon wafer fragment separation device also includes a rinsing device. The rinsing device includes a support, a water storage container, a water pump, a water valve, a rinsing pipe, and a nozzle. The water storage container is mounted on the support, the water pump is mounted on the water storage container, the water valve is connected to the water pump through a water pipe, the rinsing pipe is connected to the water valve, and the nozzle is connected to the outlet of the rinsing pipe and faces the bed surface.

10. The waste photovoltaic panel glass and silicon wafer fragment separation device according to claim 5, characterized in that, The waste photovoltaic panel glass and silicon wafer fragment separation device also includes an angle adjustment mechanism. The angle adjustment mechanism includes an adjustment seat, a drive motor, an adjustment gear, an arc rack, and a mounting frame. The adjustment seat is disposed on the vibrator, the drive motor is mounted on the adjustment seat, and the motor shaft of the drive motor is connected to the adjustment gear. The adjustment gear meshes with the arc rack, and the arc rack is fixed to the bottom of the bed surface by the mounting frame.

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