A method for preparing a ceramic bond diamond abrasive compact having piezoelectric effect

Abstract

This invention relates to the field of digital light processing (DLP) technology, specifically a method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect. The method uses lead zirconate titanate-based piezoelectric powder, diamond powder, and a glassy phase as raw materials to prepare a ceramic-bonded diamond composite powder. A slurry is prepared by mixing photosensitive resin, organic solvent, and dispersant. The composite powder is then slowly added to the slurry and dispersed at high speed to prevent particle agglomeration. Vacuum degassing is then performed to obtain a uniform and stable composite slurry. A green grinding block is obtained by photopolymerization 3D printing, followed by debinding and high-temperature sintering. Finally, the sintered green block undergoes polarization treatment to achieve piezoelectric orientation of the lead zirconate titanate phase, resulting in a ceramic-bonded diamond grinding block with both high hardness and piezoelectric effect. This method offers controllable process control and high forming precision. The prepared grinding block can utilize the piezoelectric effect to achieve self-monitoring and self-excitation functions, making it suitable for precision and efficient grinding.

Description

Technical Field

[0001] This invention relates to the field of digital light processing (DLP) technology, and specifically to a method for preparing a ceramic-bonded diamond grinding block with piezoelectric effect. Background Technology

[0002] In the field of modern precision machining, ceramic-bonded diamond composite grinding blocks with piezoelectric effect have shown great application potential, especially for the processing of high-performance materials. Their core advantage lies in their ability to integrate piezoelectric sensing functions, enabling real-time monitoring and feedback control of the contact force between the grinding block and the workpiece. This provides crucial support for the intelligentization of the grinding process and is of great significance for improving machining accuracy and safety.

[0003] However, the preparation of such composite grinding blocks faces a key technical bottleneck: the preparation temperature of traditional piezoelectric ceramics is usually 1200-1300°C, which is much higher than the graphitization temperature of diamond (around 800°C). If the composite grinding blocks are prepared directly using traditional processes, the high temperature will cause the diamond to undergo graphitization, resulting in a significant degradation of its mechanical properties and preventing it from leveraging the grinding advantages of diamond. At the same time, it will also affect the piezoelectric properties of the ceramic material, making it difficult to achieve both sensing and grinding functions.

[0004] Digital light processing (DLP) technology, as a high-precision additive manufacturing technique, provides a new path for the precise fabrication of piezoelectric ceramics. However, the problem of excessively high sintering temperatures for conventional piezoelectric ceramics remains unresolved. When directly used to prepare diamond-ceramic composites, it still leads to diamond graphitization failure. Therefore, how to reduce the fabrication temperature through process optimization, while protecting the structural integrity of diamond and preserving its excellent mechanical properties, and ensuring the piezoelectric sensing performance of the composite abrasive block, has become a key research challenge that urgently needs to be addressed in this field. Summary of the Invention

[0005] To address the aforementioned technical problems, the present invention aims to provide a method for preparing a ceramic-bonded diamond grinding block with piezoelectric effect, which reduces the preparation temperature through process optimization, thereby protecting the structural integrity of the diamond and preserving its excellent mechanical properties while ensuring the piezoelectric sensing performance of the composite grinding block.

[0006] This invention provides a method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect, comprising the following steps:

[0007] S1. Prepare ceramic-bonded diamond composite powder, wherein the ceramic-bonded diamond composite powder comprises lead zirconate titanate base material, diamond powder and glass phase. S2. Prepare a slurry, wherein the slurry comprises photosensitive resin, organic solvent and dispersant; S3. The ceramic binder diamond composite powder is mixed with the slurry to form a ceramic binder diamond composite slurry. During the mixing process, the slurry is poured in slowly and stirred at high speed to prevent particle agglomeration. S4. Degassing treatment: The mixed ceramic binder diamond composite slurry is subjected to vacuum degassing treatment to remove air bubbles in the slurry and ensure the uniformity and stability of the slurry during the printing process. S5. The degassed ceramic binder diamond composite slurry is fed into a light-curing printer and printed into shape. S6. Degrease and sinter the printed abrasive blocks; S7. The grinding block is polarized to obtain a ceramic-bonded diamond grinding block with piezoelectric effect.

[0008] Preferably, the ceramic binder diamond composite powder comprises 90wt%-95wt% lead zirconate titanate base material, 2wt%-5wt% diamond powder, and 3wt%-5wt% glass phase; the slurry comprises 35wt%-45wt% photosensitive resin, 5wt%-10wt% organic solvent, and 0.5-1.5wt% dispersant.

[0009] Preferably, the lead zirconate titanate base material has a particle size of 80nm-140nm, the diamond powder has a particle size of 6μm-8μm, and the glass phase is one of lead borate glass and bismuth borate glass. Preferably, the ceramic binder diamond composite powder described in step S1 is mixed by ball milling, with the ratio of powder to grinding balls being 1:3 to 1:5, the rotation speed being 36 to 48 rpm, and the ball milling time being 2 to 4 hours.

[0010] Preferably, the organic solvent in step S2 is one of isopropanol, acetone and butanol, and the dispersant is one of Solsperse 5000, BYK-2001 and TEGO Dispers 750 W.

[0011] Preferably, the printing parameters are: laser energy density 6-10 mW / cm2, exposure time 4-6 s, and layer thickness 40-60 μm.

[0012] Preferably, in step S6, the grinding block is degreased at 300℃-400℃ for 1-2 hours and sintered at 500℃-700℃ for 2-4 hours.

[0013] Preferably, the intensity of the polarization electric field used in step S7 for polarization treatment is 1–3 kV / mm, the polarization temperature is 100–200°C, and the polarization time is 10–30 minutes.

[0014] This invention offers the following advantages: By employing innovative techniques to prepare ceramic-bonded diamond composite grinding blocks, this invention achieves several significant benefits. The introduction of boron-containing glass as a sintering aid effectively reduces the debinding and sintering temperatures during the DLP (Digital Laser Processing) process, keeping the temperature below 800℃. This fundamentally prevents graphitization of diamond at high temperatures, protecting the structural integrity of the diamond and preventing performance degradation. Simultaneously, it ensures the piezoelectric properties and mechanical strength of the composite grinding block, solving the core challenge of high-temperature preparation. Furthermore, the grinding blocks of this invention provide a feasible path for intelligent control of the grinding process. They are expected to optimize the machining process through real-time feedback of grinding force signals, significantly improving machining efficiency while enhancing workpiece machining safety, thus possessing significant practical application value. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a flowchart illustrating the preparation process of the ceramic binder diamond composite slurry of the present invention. Figure 2 is a physical image of the ceramic-bonded diamond grinding block with piezoelectric effect of the present invention; Figure 3 This is a force-electric signal response test diagram of the present invention; Figure 4 This is a schematic diagram of the force-electric signal relationship of the present invention. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example The following are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the following embodiments. All technical solutions that fall within the scope of the present invention are within the scope of protection of the present invention.

[0019] refer to Figure 1 This invention provides a method for preparing a ceramic-bonded diamond grinding block with piezoelectric effect, specifically including the following steps: S1. Prepare ceramic-bonded diamond composite powder, wherein the ceramic-bonded diamond composite powder comprises lead zirconate titanate base material, diamond powder and glass phase. S2. Prepare a slurry, wherein the slurry comprises photosensitive resin, organic solvent and dispersant; S3. The ceramic binder diamond composite powder is mixed with the slurry to form a ceramic binder diamond composite slurry. During the mixing process, the slurry is poured in slowly and stirred at high speed to prevent particle agglomeration. S4. Degassing treatment: The mixed ceramic binder diamond composite slurry is subjected to vacuum degassing treatment to remove air bubbles in the slurry and ensure the uniformity and stability of the slurry during the printing process. S5. The degassed ceramic binder diamond composite slurry is fed into a light-curing printer and printed into shape. S6. Degrease and sinter the printed abrasive blocks; S7. The grinding block is polarized to obtain a ceramic-bonded diamond grinding block with piezoelectric effect.

[0020] To prepare grinding blocks with piezoelectric effect, this invention uses lead zirconate titanate (PZT) ceramic matrix, whose main component is ferroelectric grains. The piezoelectric effect of this ceramic can convert the interfacial pressure between the grinding block and the workpiece during grinding into an electrical signal, thereby providing real-time feedback of the grinding force signal. Furthermore, since DLP technology requires two processes in the preparation of grinding blocks—debinding and sintering—the temperatures of these processes often reach 1200-1300°C. At these temperatures, diamond will completely graphitize, leading to severe performance degradation. Therefore, this invention introduces lead borate glass as a sintering aid. By lowering the debinding and sintering temperatures, the preparation temperature can be controlled below 800°C, effectively avoiding the graphitization problem of diamond. The specific powder formulation parameters are as follows: 92wt% PTZ matrix, 4wt% diamond powder, and 4wt% lead borate glass, wherein the particle size of the PZT matrix is ​​80nm-140nm, and the particle size of the diamond powder is 6μm-8μm. The ceramic-bonded diamond composite powder is mixed by ball milling, with a powder-to-grinding ball ratio of 1:3-1:5, a rotation speed of 36-48 rpm, and a milling time of 2-4 hours. A slurry is prepared, specifically comprising 40 wt% photosensitive resin, 7 wt% isopropanol (organic solvent), and 1 wt% Solsperse (dispersant). The ceramic-bonded diamond powder is mixed with the slurry, poured in slowly during mixing, and stirred at high speed to prevent particle agglomeration. The mixed ceramic-bonded diamond composite slurry is then subjected to vacuum degassing to remove air bubbles, ensuring the uniformity and stability of the slurry during printing.

[0021] The printed abrasive blocks are shown in Figures 2(a) and 2(b) of the instruction manual. The printed abrasive blocks are degreased and sintered. Degreasing is performed at 350°C for 2 hours, and sintering is performed at 600°C for 4 hours. The abrasive blocks are polarized under conditions of a polarization electric field strength of 1–3 kV / mm, a polarization temperature of 100–200°C, and a polarization time of 10–30 minutes. Finally, the force-electric signal response performance of the polarized abrasive blocks is tested, referring to the appendix of the instruction manual. Figure 3 During the test, a 5 g weight was dropped freely from heights of 5 mm, 7 mm, 9 mm, 11 mm, and 13 mm to apply different magnitudes of impact load to the polarized grinding block. The output electrical signal of the grinding block during the stress process was simultaneously acquired. To ensure the accuracy and reliability of the test results, the test was repeated five times under each height condition, and the results were compared and analyzed. The test results are shown in the attached instruction manual. Figure 4As shown, with the increase of the falling height of the weight, the impact on the grinding block intensifies, and its output voltage signal generally shows a gradually increasing trend, with good consistency in repeated test results. These results indicate that the polarized grinding block can generate a relatively obvious and stable electrical signal response under external force, achieving effective conversion of mechanical force signals into electrical signals. This verifies that the prepared grinding block possesses good electromechanical response performance and its feasibility for application in grinding force sensing.

[0022] The above description, referring to the accompanying drawings, is merely a preferred embodiment of the present invention. However, the design concept of the present invention is not limited thereto. Any non-substantial modifications made to the present invention by those skilled in the art within the scope of the technology disclosed herein using this concept constitute an infringement of the protection scope of the present invention.

Claims

1. A method for preparing a ceramic-bonded diamond grinding block with piezoelectric effect, characterized in that, Includes the following steps: S1. Prepare ceramic-bonded diamond composite powder, wherein the ceramic-bonded diamond composite powder comprises lead zirconate titanate base material, diamond powder and glass phase. S2. Prepare a slurry, wherein the slurry comprises photosensitive resin, organic solvent and dispersant; S3. The ceramic binder diamond composite powder is mixed with the slurry to form a ceramic binder diamond composite slurry. During the mixing process, the slurry is poured in slowly and stirred at high speed to prevent particle agglomeration. S4. Degassing treatment: The mixed ceramic binder diamond composite slurry is subjected to vacuum degassing treatment to remove air bubbles in the slurry and ensure the uniformity and stability of the slurry during the printing process. S5. The degassed ceramic binder diamond composite slurry is fed into a light-curing printer and printed into shape. S6. Degrease and sinter the printed abrasive blocks; S7. The grinding block is polarized to obtain a ceramic-bonded diamond grinding block with piezoelectric effect.

2. The method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect according to claim 1, characterized in that, The ceramic binder diamond composite powder comprises 90wt%-95wt% lead zirconate titanate base material, 2wt%-5wt% diamond powder, and 3wt%-5wt% glass phase; the slurry comprises 35wt%-45wt% photosensitive resin, 5wt%-10wt% organic solvent, and 0.5-1.5wt% dispersant.

3. The method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect according to claim 1, characterized in that, The lead zirconate titanate base material has a particle size of 80nm-140nm, the diamond powder has a particle size of 6μm-8μm, and the glass phase is either lead borate glass or bismuth borate glass.

4. The method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect according to claim 1, characterized in that, The ceramic binder diamond composite powder described in step S1 is mixed by ball milling, with the ratio of powder to grinding balls being 1:3-1:5, the rotation speed being 36-48 rpm, and the ball milling time being 2-4 hours.

5. The method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect according to claim 1, characterized in that, The organic solvent in step S2 is one of isopropanol, acetone and butanol, and the dispersant is one of Solsperse 5000, BYK-2001 and TEGO Dispers 750 W.

6. The method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect according to claim 1, characterized in that, The printing parameters are: laser energy density 6-10 mW / cm2, exposure time 4-6 s, and layer thickness 40-60 μm.

7. The method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect according to claim 1, characterized in that, In step S6, the grinding block is degreased at 300℃-400℃ for 1-2 hours and sintered at 500℃-700℃ for 2-4 hours.

8. The method for preparing ceramic-bonded diamond grinding blocks with piezoelectric effect according to claim 1, characterized in that, In step S7, the polarization electric field applied for polarization treatment has an intensity of 1–3 kV / mm, a polarization temperature of 100–200°C, and a polarization time of 10–30 minutes.

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