Rack buffer of semiconductor component handling system and control method thereof

Abstract

This invention relates to a rack buffer for a semiconductor device manipulation system and a control method thereof. The rack buffer for the semiconductor device manipulation system includes: a rack processing unit for conveying a rack loaded with test boards; and a test board processing unit for conveying the test boards removed from the rack. The rack processing unit can convey both the rack and the test boards.

Description

Technical Field

[0001] This invention relates to a rack buffer for a semiconductor device handling system and a control method thereof. More specifically, it relates to a rack buffer for a semiconductor device handling system and a control method thereof that can optimize rack transport and test board transport, wherein, in rack transport, semiconductor devices are housed in the rack for transport, and in test board transport, semiconductor devices are housed in the test board for transport. Background Technology

[0002] Typically, semiconductor devices can include memory devices such as dynamic random access memory (DRAM) and static random access memory (SRAM), or non-memory devices, and can be manufactured based on wafers formed from thin, single-crystal substrates of silicon.

[0003] Specifically, semiconductor devices can be manufactured by performing a wafer manufacturing process that forms a patterned circuit pattern on a wafer, a bonding process that electrically connects each of the chips formed in the wafer manufacturing process to each of the chips in a substrate, and a molding process for protecting the chips connected to the substrate from external influences.

[0004] Semiconductor components manufactured in this way can undergo additional testing processes to check their electrical functionality. In this case, the testing process can be performed using a testing apparatus that tests the semiconductor components as objects, and a manipulating apparatus that operates multiple semiconductor components to connect them to the testing apparatus.

[0005] Traditional manipulation devices may include a manipulation module that manipulates semiconductor elements between test devices and a stacker in front of the aforementioned manipulation module that loads and waits for the semiconductor elements.

[0006] In addition, unmanned transport vehicles or monorails can be used to load semiconductor components from storage locations to stackers or unload them from stackers. Summary of the Invention

[0007] Technical issues

[0008] However, conventional manipulation modules or stackers have many problems: when loading semiconductor components into an empty test board and unloading a loaded test board, the loading and unloading paths of the test board overlap, resulting in a long waiting time from loading to unloading, which significantly reduces productivity. In addition, the continuous arrangement of manipulation modules and stackers increases the bottom area occupied by the equipment.

[0009] This invention addresses numerous problems, including those described above, and aims to provide a rack buffer and its control method for a semiconductor device handling system. This buffer optimizes the logistics of removing semiconductor devices from pallets for loading onto test boards and storing them in racks. It also significantly improves storage capacity by allowing for the temporary storage of multiple racks containing multiple test boards, and its arrangement enables cyclical transfer of both racks and test boards, thereby saving space and reducing the bottom space of the equipment. However, these issues are exemplary, and the scope of the invention is not limited thereto.

[0010] Solution

[0011] A rack buffer for a semiconductor device manipulation system according to the present invention, for solving the above-mentioned problems, includes: a rack processing unit for conveying a rack loaded with test boards; and a test board processing unit for conveying the test boards removed from the rack, wherein the rack processing unit can convey both the rack and the test boards.

[0012] Additionally, a control method for a rack buffer in a semiconductor element manipulation system according to the present invention for solving the above-mentioned problems may include: (a) the step of inserting a rack into a rack port via a rack inlet / outlet; (b) the step of receiving the rack from the rack port using a rack lifter and raising / lowering the rack; and (c) the step of receiving the rack from the rack lifter using a rack stacker and stacking at least one or more of the racks for temporary storage.

[0013] Invention Effects

[0014] According to several embodiments of the present invention as described above, the following effects are achieved: the logistics of removing semiconductor components from trays for loading onto test boards and storing them in racks can be optimized; storage capacity can be significantly improved because multiple racks that can temporarily store multiple test boards can be temporarily stored; the arrangement allows for the cyclical transfer of both racks and test boards, thereby saving space and reducing the bottom space of the equipment; and time can be significantly saved because not only the loading and unloading of semiconductor components but also the loading and unloading of test boards are performed internally. Obviously, the scope of the present invention is not limited to these effects. Attached Figure Description

[0015] Figure 1 This is a perspective view conceptually illustrating the rack port of a rack buffer in a semiconductor element manipulation system according to some embodiments of the present invention.

[0016] Figure 2 It is a conceptual representation Figure 1 A three-dimensional view of the rack elevator of the rack buffer of the semiconductor component control system.

[0017] Figure 3 and Figure 4 It is shown step by step. Figure 2 A side view of the rack conveying process of the rack lift.

[0018] Figures 5 to 7 It is shown step by step. Figure 2 A side view of the test plate transfer process of the rack lift.

[0019] Figure 8 It is a conceptual representation Figure 1 A three-dimensional view of the rack stacker of the rack buffer of the semiconductor component control system.

[0020] Figure 9 It is a conceptual representation Figure 1 A perspective view of the plate lift of the rack buffer of the semiconductor component control system.

[0021] Figure 10 It is a conceptual representation Figure 1 A three-dimensional view of the board inserter of the rack buffer of the semiconductor component control system.

[0022] Figure 11 and Figure 12 It is shown step by step. Figure 10 A side view of the test board transfer process of the board inserter.

[0023] Figure 13 This is a conceptual perspective view illustrating the appearance of a semiconductor element manipulation system according to some embodiments of the present invention.

[0024] Figure 14 It is a conceptual representation Figure 13 A side sectional view of a semiconductor device manipulation system.

[0025] Figure 15 It is shown Figure 13 A three-dimensional view of the rack buffer of a semiconductor component control system.

[0026] Figure 16 It is a conceptual representation Figure 13 A plan view of the semiconductor component control system.

[0027] Figure 17 This is a flowchart illustrating a control method for a rack buffer in a semiconductor element manipulation system according to some embodiments of the present invention.

[0028] Explanation of reference numerals in the attached figures

[0029] 1: Semiconductor components

[0030] 2: Test board

[0031] 3: Rack

[0032] 4: Container

[0033] T: Tray

[0034] 100: Rack buffer

[0035] 100A: Rack Processing Department

[0036] 10: Rack Port

[0037] 11: Rack Port Main Body

[0038] 12: Port Level 1

[0039] E1: First Entrance / Exit

[0040] 121: Port Roller

[0041] 122: Rack conveyor

[0042] 123: Stopping component

[0043] 13: Port Layer 2

[0044] E2: Second Entrance / Exit

[0045] 20: Frame Lift

[0046] 21: Main body of the frame lifting platform

[0047] P1: First Board Channel

[0048] 22: Rack Lifting Platform

[0049] 221: Main body for frame lifting

[0050] 222: Rolls corresponding to the frame

[0051] 223: Plate corresponding to roller

[0052] 224: Roller Lifting Device

[0053] 225: Rack conveyor

[0054] 226: Stopping component

[0055] 90: Control Department

[0056] 23: Frame lifting device

[0057] 30: Rack stacker

[0058] 31: Rack stacker body

[0059] 32: Stacker, Layer 1

[0060] 321: Forward / Reverse Actuator

[0061] 322: Pressure Table

[0062] 323: Stopping component

[0063] 33: Stacker Second Layer

[0064] 34: Stacker three-layer section

[0065] 100B: Test Board Processing Department

[0066] 40: Platform lift

[0067] 41: Main body of the platform lift

[0068] 42: Platform Lifting Table

[0069] 421: Platform Lifting Main Body

[0070] 422: Plate corresponding roller

[0071] 423: Plate conveying device

[0072] 424: Stop

[0073] 43: Platform lifting device

[0074] 50: Plate inserter

[0075] 51: Plate inserter body

[0076] P2: Second board channel

[0077] 52: Plate Conveyor

[0078] 521: Main body of the plate conveyor

[0079] 522: First direction roller

[0080] 523: Second direction roller

[0081] 524: Roller Lifting Device

[0082] 525: First Conveying Device

[0083] 526: Stopping component

[0084] 527: Second Conveying Device

[0085] 200: Sorter

[0086] 210: Sorter body

[0087] LP: Loading port

[0088] 220: Semiconductor Component Unloading Device

[0089] 230: Plate conveying device

[0090] A1: First position

[0091] A2: Second position

[0092] 240: Semiconductor component loading device

[0093] 1000: Semiconductor Component Control System Detailed Implementation

[0094] In the following, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

[0095] The embodiments of the present invention are provided to describe the invention more fully to those skilled in the art. These embodiments can be modified into various other forms, and the scope of the invention is not limited to these embodiments. Rather, these embodiments are provided to make this disclosure more comprehensive and complete, and to fully convey the spirit of the invention to those skilled in the art. Furthermore, in the accompanying drawings, the thickness or dimensions of the various layers are exaggerated for ease of description and clarity.

[0096] The terminology used in this specification is for describing particular embodiments and is not intended to limit the invention. As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Furthermore, where used in this specification, "comprise" and / or "comprising" specifically refers to the presence of the mentioned shapes, numbers, steps, operations, components, elements, and / or groups thereof, and does not exclude the presence or addition of more than one other shape, number, operation, component, element, and / or group thereof.

[0097] In the following description, embodiments of the invention will be illustrated with reference to the accompanying drawings, which schematically show preferred embodiments of the invention. In the drawings, for example, variations in the shape contemplated according to manufacturing techniques and / or tolerances may be shown. Therefore, embodiments of the inventive concept should not be construed as limited to the specific shapes of the areas shown in this specification, but should include, for example, variations in shape resulting from manufacturing processes.

[0098] Figure 1 This is a perspective view conceptually illustrating the rack port 10 of a rack buffer 100 of a semiconductor element manipulation system according to some embodiments of the present invention.

[0099] like Figure 1As shown, the rack buffer 100 of the semiconductor device manipulation system according to some embodiments of the present invention may include a rack processing unit 100A for conveying a rack 3 loaded with test boards 2 and a test board processing unit 100B for conveying test boards 2 removed from the rack 3 (see reference). Figure 9 The rack buffer 100 can be referred to as a rack storage unit, rack module, rack chamber, etc.

[0100] Here, at least a portion of the rack processing unit 100A is capable of both transferring the rack 3 and transferring the test board 2.

[0101] More specifically, for example, the rack handling unit 100A may include a rack port 10 with a rack inlet / outlet formed on one side for loading or unloading racks 3, and a rack lifter 20 for receiving racks 3 from the rack port 10 and lifting racks 3 (see reference). Figure 2 ) and a rack stacker 30 that receives racks 3 from rack lift 20 and stacks at least one rack 3 for temporary storage (see reference) Figure 8 ).

[0102] Furthermore, for example, the test board processing unit 100B may include a board lifter 40 (see reference) that removes test boards 2 one by one from the rack 3 temporarily stored in the rack stacker 30 and raises and lowers the test boards 2. Figure 9 ) and receive test plates 2 from the plate lift 40 and transfer them to the sorter 200 (see reference) Figure 13 Board inserter 50 (see reference) Figure 10 ).

[0103] For example, such as Figure 1 As shown, the rack port 10 of the present invention may include a rack port body 11, a first-layer port portion 12 formed on the rack port body 11 and having a first inlet / outlet E1 so that a rack 3 can be inserted or removed, and a second-layer port portion 13 formed on the rack port body 11 and having a second inlet / outlet E2 so that another rack 3 can be inserted or removed.

[0104] As an example, the first-level port section 12 can serve as a loading port for rack 3 to be loaded into the rack 3 through the first inlet / outlet E1, and the rack 3 that is transported from the first-level port section 12 through the rack elevator 20 and temporarily stored in the rack stacker 30 and then returned can be transported to the second-level port section 13 so that the second-level port section 13 can also serve as an unloading port.

[0105] Therefore, a semiconductor device 1 (referencing) is housed, which is tested by external testing equipment. Figure 3The rack 3 can be loaded onto the first-level port section 12 by an unmanned transfer vehicle or unmanned transfer robot, and the rack 3 unloaded onto the second-level port section 13 can be moved to the test equipment for testing by an unmanned transfer vehicle or unmanned transfer robot.

[0106] However, the configuration of each layer of such a port does not have to be limited to this, and rack ports of various shapes and types can be applied.

[0107] More specifically, for example, such as Figure 1 As shown, the port layer 12 may include a plurality of port rollers 121 formed on the bottom surface to reduce friction with the frame 3 when the frame 3 enters or exits, a frame conveying device 122 that engages with a portion of the frame 3 in the form of a hook and moves the frame 3 so that the frame 3 can be inserted into the interior or removed to the exterior, and a stop 123 that aligns the frame 3 conveyed by the frame conveying device 122 to the correct position.

[0108] Therefore, according to the port layer 12 of the present invention, the hook-shaped front end of the rack conveying device 122 can insert the external rack 3 into the interior, and the rack 3 inserted into the interior can be conveyed by rolling friction through the port roller 121 and then aligned to the correct position by the stop member 123.

[0109] Figure 2 It is a conceptual representation Figure 1 A perspective view of the rack buffer 100 and the rack lift 20 of the semiconductor component control system.

[0110] like Figure 2 As shown, for example, the rack lift 20 may include a rack lift body 21 with a lifting channel formed inside, a rack lift platform 22 formed to be able to lift along the lifting channel, and a rack lift device 23 for lifting the rack lift platform 22.

[0111] Here, the rack lift body 21 can form a first plate channel P1 on the side wall opposite to the sorter 200, so that the rack lift platform 22 can be used to receive the test plate 2 from the sorter 200 and put it into the empty space of the rack 3 temporarily stored in the rack stacker 30.

[0112] More specifically, for example, such as Figure 2As shown, the rack lifting platform 22 may include a rack lifting body 221, a plurality of rack-corresponding rollers 222 formed in the rack lifting body 221 and arranged in the first direction I to reduce friction with the rack 3 when it moves in the first direction, a plurality of plate-corresponding rollers 223 formed in the rack lifting body 221 and arranged in the second direction II to reduce friction with the test plate 2 when it enters in the second direction, a roller lifting device 224 that selectively lifts and lowers the plate-corresponding rollers 223, a rack conveying device 225 that is combined with a part of the rack 3 and moves the rack 3 so that the rack 3 can be inserted into the interior or removed to the exterior, and a stop 226 that aligns the rack 3 conveyed by the rack conveying device 225 to the correct position.

[0113] In addition, for example, the frame lifting platform 22 may also include a control unit 90, which applies a descent control signal to the roller lifting device 224 when the frame 3 moves in a first direction, so that the height of the plate corresponding roller 223 can become lower than the height of the frame corresponding roller 222, and applies an ascending control signal to the roller lifting device 224 when the test plate 2 enters in a second direction, so that the height of the plate corresponding roller 223 can become higher than the height of the frame corresponding roller 222.

[0114] Figure 3 and Figure 4 It is shown step by step. Figure 2 A side view of the rack conveying process of the rack lift 20, and Figures 5 to 7 It is shown step by step. Figure 2 A side view of the test plate transfer process of the rack lift 20.

[0115] Therefore, the rack lifting platform 22 of the present invention can perform both the transfer of the rack 3 and the transfer of the test board 2, for example, as Figure 3 As shown, when the height of the plate-corresponding roller 223 becomes lower than the height of the frame-corresponding roller 222, after the frame 3 introduced from the frame port 10 in the first direction I is raised and lowered in the third direction III, as... Figure 4 As shown, rack 3 is conveyed to a specific height in the first direction I for temporary storage in rack stacker 30.

[0116] Meanwhile, the frame lifting platform 22 of the present invention can, as Figure 5 In the state where the height of the plate corresponding to roller 223 becomes higher than the height of the frame corresponding to roller 222, the test plate 2, which is introduced from the sorter 200 through the first plate channel P1 in the second direction II, is received, and as shown... Figure 6 In the state where the height of the plate corresponding to roller 223 becomes lower than the height of the frame corresponding to roller 222, as shown... Figure 7As shown, the test board 2, which is raised to a specific height, is transported in the first direction I to the empty space of the rack 3, which is temporarily stored in the rack stacker 30.

[0117] Here, the first direction I, the second direction II, and the third direction III are perpendicular to each other at a 90-degree angle. For example, the first direction I can be the main conveying direction of the rack 3, the second direction II can be the direction corresponding to the sorter 200 with the rack 3 as a reference, and the third direction III can be a vertical direction perpendicular to these first directions I and second directions II. However, the first direction I, the second direction II, and the third direction III are not necessarily limited to this, and various directions can be applied.

[0118] Figure 8 It is a conceptual representation Figure 1 A perspective view of the rack buffer 100 and rack stacker 30 of the semiconductor component control system.

[0119] like Figure 8 As shown, for example, the rack stacker 30 may include a rack stacker body 31, a first stacker layer 32 formed on the rack stacker body 31 and configured for racks 3 to be inserted for temporary storage, a second stacker layer 33 formed on the rack stacker body 31 and above the first stacker layer 32 for another rack 3 to be inserted for temporary storage, and a third stacker layer 34 formed on the rack stacker body 31 and above the second stacker layer 33 for yet another rack 3 to be inserted for temporary storage.

[0120] Here, not only in the stacker layer 32, but also in each layer, a pressure table 322 can be formed to align the rack 3 by moving forward and backward via the forward and backward actuator 321, and a stop 323 can be formed to align the test plate 2 housed in the rack 3.

[0121] Therefore, for example, such as Figure 8 As shown, the rack stacker 30 according to the present invention can stack three racks 3 on top of each other for temporary storage, thereby enabling the temporary storage of a large number of racks 3.

[0122] However, this rack stacker 30 is not necessarily limited to the figures shown, and rack stackers 30 with various numbers of layers, at least one or more, can be applied.

[0123] Figure 9 It is a conceptual representation Figure 1 A perspective view of the rack buffer 100 and the plate lift 40 of the semiconductor component control system.

[0124] For example, such as Figure 9As shown, the plate lift 40 is capable of transporting the test plate 2 and may include a plate lift body 41 with a lifting channel formed inside, a plate lift platform 42 that is configured to lift along the lifting channel, and a plate lift device 43 that lifts the plate lift platform 42.

[0125] Here, for example, the plate lifting platform 42 may include a plate lifting body 421, a plurality of plate-corresponding rollers 422 formed on the plate lifting body 421 and arranged in the first direction I to reduce friction with the test plate 2 when it moves, a plate conveying device 423 that engages with a portion of the test plate 2 and moves the test plate 2 so that the test plate 2 can be inserted into the interior or removed to the exterior, and a stop 424 that aligns the test plate 2 conveyed by the plate conveying device 423 to the correct position.

[0126] Therefore, for example, such as Figure 9 As shown, the plate lifter 40 can remove test plates 2 one by one from the rack 3 temporarily stored in the rack stacker 30 in the first direction I while the plate lifter platform 42 is lifted to a specific height, and can also transfer the test plates 2 to the plate inserter 50 in the first direction I after the test plates 2 are lifted in the third direction III by using the plate lifter platform 42.

[0127] However, this type of platform lift 40 is not limited to the attached drawings, and various forms and types of lift devices can be used.

[0128] Figure 10 It is a conceptual representation Figure 1 A perspective view of the board inserter 50 of the rack buffer 100 of the semiconductor component control system.

[0129] like Figure 10 As shown, for example, the board inserter 50 may include a board inserter body 51 and a board conveyor 52 formed on the board inserter body 51 and receiving test boards 2 from the board elevator 40 and transferring them to the sorter 200.

[0130] Here, for example, such as Figure 10 As shown, the plate inserter body 51 may have a second plate channel P2 formed on one side wall opposite to the sorter 200, so that the received test plate 2 can be transferred to the sorter 200 by means of the plate conveyor 52.

[0131] More specifically, for example, such as Figure 10As shown, the plate conveying table 52 may include a plate conveying table body 521, a plurality of first direction rollers 522 formed in the plate conveying table body 521 and arranged in the first direction I to reduce friction with the test plate 2 when it moves in the first direction, a plurality of second direction rollers 523 formed in the plate conveying table body 521 and arranged in the second direction II to reduce friction with the test plate 2 when it moves in the second direction, a roller lifting device 524 for selectively raising and lowering the second direction rollers 523, a first conveying device 525 coupled to a portion of the test plate 2 and moving the test plate 2 in the first direction I so as to insert the test plate 2 into the interior or remove it from the exterior, a stop 526 for aligning the test plate 2 conveyed by the first conveying device 525 to the correct position, and a second conveying device 527 for moving the test plate 2 in the second direction II.

[0132] Furthermore, for example, the plate conveying table 52 of the present invention may also include a control unit 90, which applies a descent control signal to the roller lifting device 524 when the test plate 2 moves in the first direction, so that the height of the second direction roller 523 can become lower than the height of the first direction roller 522, and applies an ascending control signal to the roller lifting device 524 when the test plate 2 moves in the second direction, so that the height of the second direction roller 523 can become higher than the height of the first direction roller 522.

[0133] Figure 11 and Figure 12 It is shown step by step. Figure 10 A side view of the transfer process of the test board 2 of the board inserter 50.

[0134] Therefore, for example, the board conveyor 52 of the present invention can convey the test board 2, such as... Figure 11 As shown, when the height of the second direction roller 523 becomes lower than the height of the first direction roller 522, the test plate 2 can be received from the plate lifting platform 42 in the first direction I, and as... Figure 12 As shown, when the height of the second direction roller 523 becomes higher than the height of the first direction roller 522, the second conveying device 527 can convey the test plate 2 in the second direction II through the second plate channel P2 corresponding to the sorter 200.

[0135] Figure 13 This is a conceptual perspective view illustrating the external appearance of a semiconductor element manipulation system 1000 according to some embodiments of the present invention. Figure 14 It is a conceptual representation Figure 13 A cross-sectional side view of the semiconductor device manipulation system 1000. Figure 15 It is shown Figure 13 A perspective view of the rack buffer 100 of the semiconductor component control system 1000, and Figure 16It is a conceptual representation Figure 13 A plan view of the semiconductor component control system 1000.

[0136] like Figures 1 to 16 As shown, the semiconductor element manipulation system 1000 according to some embodiments of the present invention may mainly include a rack buffer 100 and a sorter 200.

[0137] For example, the rack buffer 100 is connected to the sorter 200 and can be a device that can receive test boards 2 loaded with semiconductor components 1 from the sorter 200 for loading into the rack 3 or transfer test boards 2 loaded into the rack 3 to the sorter 200.

[0138] For example, the sorter 200 is connected to the rack buffer 100 and can be a device in which a container 4 carrying a pallet T from an overhead hoist transport (OHT) is placed through the loading port LP, and the semiconductor element 1 loaded on the pallet T can be taken out from the pallet T to be stored in the test board 2, or the semiconductor element 1 that has completed testing can be taken out from the test board 2 to be stored in the pallet T, and then transferred to the rack buffer 100 again.

[0139] Therefore, for example, if the rack buffer 100 and sorter 200 of the present invention are used, a series of processes can be automatically executed, including taking out the semiconductor element 1 loaded on the tray T and storing it in the test board 2, receiving the test board 2 loaded with the semiconductor element 1 from the sorter 200 and loading it into the rack 3, and taking out the tested semiconductor element 1 from the test board 2 loaded into the rack 3 and storing it in the tray T.

[0140] More specifically, for example, the sorter 200 of the semiconductor component manipulation system 1000 according to some embodiments of the present invention may include a sorter body 210, a semiconductor component unloading device 220 formed in the sorter body 210 and unloading completed semiconductor components 1 from the test board 2 received from the rack buffer 100 to the tray T, a board conveying device 230 conveying the empty test board 2 with all semiconductor components 1 removed from the first position A1 to the second position A2, and a semiconductor component loading device 240 taking out semiconductor components 1 to be tested from another tray T to load onto the empty test board 2 and conveying it to the rack buffer 100.

[0141] More specifically, for example, the sorter body 210 may be formed with at least one loading port LP, so that a container 4 for transporting a pallet T from an overhead crane (OHT) can be placed.

[0142] Therefore, according to the sorter 200, a series of processes can be automatically executed, including taking out the completed semiconductor components 1 from the test board 2 received from the rack buffer 100 and unloading them onto the tray T, transferring the empty test board 2 with all semiconductor components 1 removed from it from the first position A1 to the second position A2, and taking out the semiconductor components 1 to be tested from another tray T and loading them onto the empty test board 2 and transferring them to the rack buffer 100.

[0143] Figure 17 This is a flowchart illustrating a control method for a rack buffer 100 of a semiconductor element manipulation system 1000 according to some embodiments of the present invention.

[0144] like Figures 1 to 17 As shown, the control method of the rack buffer 100 of the semiconductor component manipulation system 1000 according to some embodiments of the present invention may include (a) the step of inserting a rack 3 into a rack port 10 through a rack inlet / outlet, (b) the step of receiving the rack 3 from the rack port 10 using a rack lifter 20 and raising or lowering the rack 3, (c) the step of receiving the rack 3 from the rack lifter 20 using a rack stacker 30 and stacking at least one rack 3 for temporary storage, (d) the step of removing test boards 2 one by one from the rack 3 temporarily stored in the rack stacker 30 using a board lifter 40 and raising or lowering the test boards 2, and (e) the step of receiving the test boards 2 from the board lifter 40 using a board inserter 50 and transferring them to a sorter 200.

[0145] Therefore, according to the present invention, the logistics of removing semiconductor components 1 from tray T for loading onto test boards 2 and storing them in racks 3 can be optimized. Since multiple racks 3 that can temporarily store multiple test boards 2 can be temporarily stored, storage capacity can be greatly improved. Since both the transfer of racks 3 and the transfer of test boards 2 can be arranged in a cyclical manner, space can be saved and the bottom space of the equipment can be reduced. Furthermore, since not only the loading and unloading of semiconductor components 1, but also the loading and unloading of test boards 2 are all carried out internally, time can be greatly saved.

[0146] Although the invention has been described with reference to embodiments shown in the accompanying drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent embodiments are possible from the invention. Therefore, the true scope of protection of the invention should be determined by the technical concept of the appended claims.

Claims

1. A rack buffer for a semiconductor device manipulation system, comprising: Rack handling section, which transfers racks loaded with test boards; as well as The test board processing unit conveys the test boards taken from the rack. The rack processing unit transmits both the rack and the test board.

2. The rack buffer of the semiconductor device manipulation system according to claim 1, wherein, The rack processing unit includes: The rack port has a rack inlet / outlet formed on one side for loading or unloading the rack; A rack lift receives the rack from the rack port and lifts the rack; and A rack stacker receives the racks from the rack elevator and stacks at least one rack for temporary storage.

3. The rack buffer of the semiconductor device manipulation system according to claim 1, wherein, The test board processing unit includes: A plate lifting machine removes the test plate from the frame processing section and raises and lowers the test plate; and A plate inserter receives the test plate from the plate elevator and passes it to the sorter.

4. The rack buffer of the semiconductor device manipulation system according to claim 2, wherein, The rack port includes: The rack port body is formed into multiple layers, enabling the rack to be inserted or removed.

5. The rack buffer of the semiconductor device manipulation system according to claim 4, wherein, The rack port body includes: Multiple port rollers are formed on the bottom surface to reduce friction with the frame when the frame moves in and out; A rack conveying device, which engages with a portion of the rack and moves the rack, thereby enabling the rack to be inserted into or removed from the outside; and A stopper ensures that the rack being transported by the rack conveyor is aligned to the correct position.

6. The rack buffer of the semiconductor device manipulation system according to claim 2, wherein, The frame lift includes: The main body of the frame lifting platform has an internal lifting channel; A frame lifting platform, configured to move up and down along the lifting channel; and The frame lifting device raises and lowers the frame lifting platform.

7. The rack buffer of the semiconductor device manipulation system according to claim 6, wherein, The main body of the rack lift has a first plate channel formed on the side wall opposite to the sorter, so that the rack lift can receive the test plate from the sorter and put it into the empty space of the rack temporarily stored in the rack stacker.

8. The rack buffer of the semiconductor device manipulation system according to claim 7, wherein, The frame lifting platform includes: The main body for lifting the frame; Multiple frame-corresponding rollers are formed on the frame lifting body and arranged in the first direction to reduce friction with the frame when the frame moves in the first direction; Multiple plate-corresponding rollers are formed on the frame lifting body and are arranged in the second direction to reduce friction with the test plate when it enters in the second direction; A roller lifting device allows the plate to be selectively lifted and lowered on the corresponding roller. A rack conveying device, coupled to a portion of the rack, and moving the rack to allow it to be inserted into or removed from the outside; and A stopper ensures that the rack being transported by the rack conveyor is aligned to the correct position.

9. The rack buffer of the semiconductor device manipulation system according to claim 8, wherein, The lifting platform also includes: The control unit applies a descent control signal to the roller lifting device when the frame moves in the first direction, so that the height of the roller corresponding to the plate can become lower than the height of the roller corresponding to the frame. When the test plate enters in the second direction, it applies an ascending control signal to the roller lifting device, so that the height of the roller corresponding to the plate can become higher than the height of the roller corresponding to the frame.

10. The rack buffer of the semiconductor device manipulation system according to claim 2, wherein, The rack stacker includes: The rack stacker body is formed into multiple layers, allowing the racks to be deployed for temporary storage.

11. The rack buffer of the semiconductor device manipulation system according to claim 10, wherein, The rack stacker body has a pressure table that moves forward and backward by a forward and backward actuator to align the rack, and a stop that aligns the test plate housed in the rack.

12. The rack buffer of the semiconductor device manipulation system according to claim 3, wherein, The slab lift includes: The main body of the platform lift has an internal lifting channel; A lifting platform, configured to move up and down along the lifting channel; and The plate lifting device raises and lowers the plate lifting platform.

13. The rack buffer of the semiconductor device manipulation system according to claim 12, wherein, The plate lifting platform includes: Platform lifting main body; Multiple plate-corresponding rollers are formed on the plate lifting body and arranged in a first direction to reduce friction with the test plate when it moves; A plate conveying device, which engages with a portion of the test plate and moves the test plate, thereby enabling the test plate to be inserted into the interior or removed from the exterior; and A stopper ensures that the test plate, conveyed by the plate conveying device, is aligned to the correct position.

14. The rack buffer of the semiconductor device manipulation system according to claim 3, wherein, The plate inserter includes: Plate inserter body; and A board conveyor is formed in the board inserter body and receives the test board from the board elevator and transfers it to the sorter.

15. The rack buffer of the semiconductor device manipulation system according to claim 14, wherein, The plate inserter body has a second plate channel formed on one side wall opposite to the sorter, thereby enabling the received test plates to be transferred to the sorter using the plate conveyor.

16. The rack buffer of the semiconductor device manipulation system according to claim 15, wherein, The plate conveyor includes: The main body of the plate conveyor; Multiple first-direction rollers are formed in the main body of the plate conveyor and are arranged in the first direction to reduce friction with the test plate when the test plate moves in the first direction; Multiple second-direction rollers are formed in the main body of the plate conveyor and are arranged in the second direction to reduce friction with the test plate when the test plate moves in the second direction; A roller lifting device allows the second-direction roller to be selectively lifted or lowered; A first conveying device is coupled to a portion of the test board and moves the test board in the first direction, thereby enabling the test board to be inserted into the interior or removed from the exterior. A stop element aligns the test plate, conveyed by the first conveying device, into the correct position; and The second conveying device moves the test plate in the second direction.

17. The rack buffer of the semiconductor device manipulation system according to claim 16, wherein, The plate conveyor also includes: The control unit applies a descent control signal to the roller lifting device when the test plate moves in the first direction, so that the height of the second direction roller can become lower than the height of the first direction roller; and applies an ascent control signal to the roller lifting device when the test plate moves in the second direction, so that the height of the second direction roller can become higher than the height of the first direction roller.

18. A control method for a rack buffer in a semiconductor device manipulation system, comprising: (a) The step of inserting the rack into the rack port via the rack inlet / outlet; (b) The step of receiving the rack from the rack port and raising or lowering the rack using a rack lift; as well as (c) The step of receiving the racks from the rack elevator and stacking at least one rack for temporary storage.

19. The control method for the rack buffer of the semiconductor device manipulation system according to claim 18, further comprising: After step (c), (d) The step of the plate lift taking out test plates one by one from the rack temporarily stored in the rack stacker and lifting the test plates; and (e) The step of the plate inserter receiving the test plate from the plate elevator and passing it to the sorter.

20. A rack buffer for a semiconductor device manipulation system, comprising: Rack handling section, which transfers racks loaded with test boards; as well as The test board processing unit conveys the test boards taken from the rack. The rack processing unit includes: The rack port has a rack inlet / outlet formed on one side for loading or unloading the rack; A rack lift receives the rack from the rack port and lifts the rack; and A rack stacker receives the racks from the rack elevator and stacks at least one rack for temporary storage. The test board processing unit includes: A plate lifter, used to remove test plates one by one from the rack temporarily stored in the rack stacker and to raise and lower the test plates; and A plate inserter receives the test plate from the plate elevator and transfers it to the sorter. The rack port includes: The rack port body is formed into multiple layers, allowing the rack to be inserted or removed. The frame lift includes: The main body of the frame lifting platform has an internal lifting channel; A frame lifting platform, configured to move up and down along the lifting channel; and The frame lifting device enables the frame lifting platform to be raised and lowered. The rack stacker includes: The rack stacker body is formed into multiple layers, allowing the racks to be deployed for temporary storage. The slab lift includes: The main body of the platform lift has an internal lifting channel; A platform lifting stage, configured to move up and down along the lifting channel of the platform lifting machine body; and The plate lifting device raises and lowers the plate lifting platform, and The plate inserter includes: Plate inserter body; and A board conveyor is formed in the board inserter body and receives the test board from the board elevator and transfers it to the sorter.

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