A testing system and method for the antistatic performance of glass floors

Abstract

This invention relates to the field of electrostatic detection technology, specifically a system and method for testing the antistatic performance of glass floors. The system includes a reference resistance distribution construction module, a thermal shock retest module, a thermal resistance difference analysis module, a high humidity immersion inspection module, a creepage risk calibration module, and a degradation assessment and intervention module. When the energy storage compartment is shut down and environmental parameters meet standards, the system collects resistance data across the entire glass floor measurement grid to construct an initial resistance reference map. A cold-heat alternating shock load is applied, and after removal, the resistance is retested across the entire area to obtain a thermal resistance distribution map. Based on the reference map, the system analyzes the differences across the entire distribution map to obtain a thermal resistance difference distribution map. Micro-charge pulses are released at resistance deviation measurement points, and resistance is inspected after high humidity immersion to obtain a high humidity resistance distribution map. A calibrated grid showing continuous resistance drops and recovery hysteresis is used to identify creepage risk points. The system collects the resistance recovery rate at these risk points, assesses the degradation trend, formulates solutions, and generates an antistatic microcrack intervention report.

Description

Technical Field

[0001] This invention relates to the field of electrostatic detection technology, and in particular to a system and method for testing the antistatic performance of glass floors. Background Technology

[0002] As electrochemical energy storage chambers develop towards higher density and higher safety, glass floors, with their characteristics of visual inspection, high load-bearing capacity and cleanliness protection, are widely used in the wiring and equipment support scenarios at the bottom of energy storage chambers. To avoid safety risks such as device breakdown and arc discharge caused by static electricity accumulation, glass floors need to achieve stable anti-static performance through surface conductive coatings or sandwich conductive structures. Whether its surface resistance distribution is uniform and how well it adapts to the environment are directly related to the reliability of electrostatic protection of the energy storage system.

[0003] Current detection methods can only obtain single-point or local resistance data under steady-state conditions at room temperature. They do not establish a global grid baseline distribution, cannot activate subsurface microcracks in the glass floor using alternating hot and cold loads, and cannot reconstruct the thermal resistance shift field. For example, the ±40°C thermal shock encountered during the start-up and shutdown of the energy storage compartment cannot be continuously analyzed for the resistance difference at all points across the entire area. It is difficult to distinguish whether the resistance anomaly is caused by natural fluctuations or damage to the glass floor structure. In addition, existing technologies do not perform dual feature overlap calibration for the two characteristics of continuous resistance drop and recovery hysteresis under high humidity immersion environments. They cannot combine thermal shift and humidity-induced attenuation for correlation analysis. For example, under high humidity conditions of 85%RH, it is impossible to accurately find the creepage risk points caused by microcrack propagation, and there is a lack of quantitative support for degradation status rating and targeted intervention schemes. Summary of the Invention

[0004] This invention provides a system and method for testing the antistatic performance of glass floors, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides a testing system for the antistatic performance of glass floors, the system comprising: The reference resistance distribution construction module performs a full-domain resistance traversal of the measurement grid of the glass floor when the energy storage compartment is shut down and the environmental parameters are within the standard range, in order to construct an initial resistance reference map of the glass floor. The thermal shock retest module applies alternating hot and cold impact loads to the glass floor and, after the load is removed, performs a full-domain resistance retest on the measurement grid to obtain the thermal resistance distribution map of the glass floor. The thermal resistance difference analysis module performs global difference analysis on the thermal resistance distribution map based on the initial resistance reference map to obtain the thermal resistance difference distribution map of the glass floor. The high humidity immersion inspection module performs micro-charge pulse discharge on the grid measurement points that show resistance value shift in the thermal resistance distribution map. After the discharge is completed, the glass floor is immersed in a high humidity atmosphere. After immersion, the surface adsorption steady state of the glass floor is inspected for the whole domain resistance to obtain the high humidity resistance distribution map of the glass floor. The creepage risk calibration module, based on the thermal resistance difference distribution map, performs dual feature overlap calibration on the measurement grid that shows the characteristics of continuous drop in resistance value and hysteresis recovery in the high humidity resistance distribution map, to obtain the creepage risk points of the glass floor. The degradation assessment and intervention module collects the dry resistance recovery rate of the glass floor corresponding to the creepage risk points, assesses the creepage degradation trend by comparing the dry resistance recovery rate with the temperature and humidity resistance decay sequence of the glass floor, and formulates intervention plans based on the assessment results to obtain an antistatic microcrack intervention report for the glass floor.

[0006] In a preferred embodiment, the process of constructing the initial resistance reference map of the glass floor is as follows: The glass floor that has been laid inside the energy storage compartment is spatially meshed to obtain the measurement grid of the glass floor; Electrode contacts are laid out on the measurement grid to obtain the detection electrode arrangement of the glass floor; With the energy storage compartment shut down and the ambient temperature and humidity maintained within the preset standard parameter range, point-based electrical parameter acquisition is performed on the array of detection electrodes to obtain the initial resistance data of the glass floor. Based on the spatial coordinate correspondence between the initial resistance data and the measurement grid, the initial resistance data is mapped to obtain the initial resistance reference map of the glass floor.

[0007] In a preferred embodiment, the process of obtaining the thermoresistivity distribution map of the glass floor is as follows: Thermal radiation pulse injection is performed on the load-bearing surface of the glass floor to obtain a transient high-temperature shaping layer for the glass floor; During the transition gap of the transient high-temperature shaping layer, the bearing surface of the glass floor is subjected to rapid cooling and quenching by a cooling medium to obtain the activated state of the thermal shock microgap of the glass floor. After the thermal shock microgap activation state is completely eliminated and the glass floor returns to a stable state at room temperature, the measurement grid is scanned in a global manner by electrode guidance based on the spatial topological position of the detector electrode arrangement to obtain the thermal resistance offset dataset of the glass floor. Two-dimensional field reconstruction was performed on the thermoresistivity offset dataset to obtain the thermoresistivity distribution map of the glass floor.

[0008] In a preferred embodiment, the process of obtaining the thermal resistance difference distribution map of the glass floor is as follows: Based on the spatial index coordinates of the measurement grid in the initial resistance reference map, the resistance values ​​at the corresponding positions in the thermoresistivity distribution map are extracted by aligning the corresponding points to obtain the reference thermoresistivity pairing array of the glass floor. The reference resistance value and the thermal resistance value in the reference thermal resistance pairing array are analyzed by difference to obtain the thermal resistance offset of the glass floor. Based on the spatial adjacency relationship of the measurement grid, the thermal resistance offset is filled in grid by grid to obtain the spatial arrangement set of thermal offset of the glass floor. The thermal resistance difference distribution map of the glass floor is obtained by continuously extending and reconstructing the offset jump variables between adjacent measurement grids in the spatial arrangement of the thermal offset.

[0009] In a preferred embodiment, the process of performing micro-charge pulse discharge on grid measurement points exhibiting resistance shifts in the thermal resistance distribution map is as follows: By comparing the resistance values ​​of the same grid in the initial resistance reference map and the thermoelectric resistance distribution map, the grid resistance offset of the glass floor is obtained. Grid points whose grid resistance offset exceeds the preset fluctuation threshold are identified and calibrated to obtain a list of grid points to be released in the glass floor. Based on the spatial position of the grid to be discharged on the glass floor surface in the list of grid points to be discharged, microsecond-level pulse discharge is performed on the grid to be discharged to obtain the charge discharge record of the glass floor; After traversing the list of grid points to be discharged and completing the microsecond-level pulse discharge, the charge discharge completion state of the glass floor is obtained.

[0010] In a preferred embodiment, the process of obtaining the high humidity resistivity distribution map of the glass floor is as follows: By subjecting a glass floor in a state of complete charge discharge to continuous environmental immersion within a preset high humidity threshold range, a steady state of surface adsorption and humidification of the glass floor is obtained. After the surface is maintained in a steady state of adsorption and humidification for a preset immersion time, the ground resistance of the glass floor grid is collected grid by grid to obtain the high humidity resistance record of the glass floor grid. According to the row and column arrangement order of the measurement grid on the glass floor surface, the high humidity resistance records of the grid are spatially repositioned and extended to obtain the high humidity resistance distribution map of the glass floor.

[0011] In a preferred embodiment, the process of obtaining the creepage risk points of the glass floor is as follows: By analyzing the deviation amplitude of the thermal resistance difference distribution map, the offset value of the thermal resistance value of the measurement grid is obtained. By performing continuous drop characteristic discrimination on the high humidity resistance distribution map, the resistance drop sequence of the measurement grid is obtained; Based on the resistance drop sequence, the hysteresis period of the measurement grid is identified to obtain the recovery hysteresis duration of the measurement grid; By performing dual feature overlay calibration on the thermal resistance offset value and recovery hysteresis duration within the same measurement grid, the creepage risk points of the measurement grid can be obtained.

[0012] In a preferred embodiment, the process of collecting the recovery rate of the dry resistance of the glass floor corresponding to the creepage risk point is as follows: Surface moisture was desorbed from the glass floor corresponding to the creepage risk points to obtain the dry baseline state of the glass floor. Resistance recovery monitoring was performed on creepage risk points under dry baseline conditions to obtain resistance recovery curves at creepage risk points. Based on the resistance recovery curve, the recovery slope of creepage risk points is evaluated to obtain the dry resistance recovery rate of the glass floor.

[0013] In a preferred embodiment, the process of obtaining the antistatic microcrack intervention report for the glass floor is as follows: Under a preset temperature and humidity change sequence, the resistance of the glass floor corresponding to the creepage risk point is tracked and collected to obtain the temperature and humidity resistance decay sequence of the glass floor. By performing attenuation recovery correlation analysis between the dry resistance recovery rate and the temperature and humidity resistance attenuation sequence, the creepage degradation status rating of the glass floor is obtained. Based on the creepage degradation status rating, the expansion status of the glass floor is determined to obtain the microcrack risk level of the glass floor. Based on the risk level of microcracks, antistatic treatment is mapped onto the glass floor, resulting in a list of intervention strategies for the glass floor. Based on the list of intervention strategies, recommendations were compiled for glass floors, resulting in an intervention report on antistatic microcracks in glass floors.

[0014] To address the above problems, the present invention also provides a method for testing the antistatic performance of glass floors, the method comprising: S1. When the energy storage compartment is shut down and the environmental parameters are within the standard range, the resistance of the glass floor is collected by a full-domain resistance traversal of the measurement grid to construct the initial resistance reference map of the glass floor. S2. Apply alternating hot and cold impact loads to the glass floor, and after the loads are removed, remeasure the resistance of the entire measurement grid to obtain the thermal resistance distribution map of the glass floor. S3. Based on the initial resistance reference map, perform global difference analysis on the thermal resistance distribution map to obtain the thermal resistance difference distribution map of the glass floor. S4. Perform micro-charge pulse discharge on the grid measurement points that show resistance shift in the thermal resistance distribution map. After the discharge is completed, immerse the glass floor in a high humidity atmosphere. After immersion, perform a full-area resistance inspection on the surface adsorption steady state of the glass floor to obtain the high humidity resistance distribution map of the glass floor. S5. Based on the thermal resistance difference distribution map, the measurement grid that shows the characteristics of continuous drop in resistance value and hysteresis recovery in the high humidity resistance distribution map is calibrated by double feature overlap to obtain the creepage risk points of the glass floor. S6. Collect the dry resistance recovery rate of the glass floor corresponding to the creepage risk points, analyze the creepage degradation trend of the dry resistance recovery rate and the temperature and humidity resistance decay sequence of the glass floor, and formulate an intervention plan based on the analysis results to obtain an antistatic microcrack intervention report for the glass floor.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The glass floor is spatially gridded and electrode contacts are deployed. Under the conditions of shutdown and static storage of the energy storage chamber and compliance with environmental parameters, global resistance data is collected to construct an initial resistance baseline map. After thermal shock retesting, a thermal resistance distribution map is constructed, and global difference analysis is completed. This achieves the establishment of a global grid baseline distribution, which overcomes the limitation of existing methods that can only obtain single-point or local resistance data. It can accurately distinguish whether the resistance anomaly is caused by natural fluctuations or damage to the glass floor structure, and achieve accurate monitoring of global resistance distribution.

[0016] 2. We first apply alternating hot and cold impact loads to the glass floor, causing a transient high-temperature shaping layer to form on its surface. This simultaneously activates internal thermal shock microcracks. After the glass floor returns to normal temperature, we re-detect the resistance value of the entire surface. By analyzing the difference, we reconstruct the thermal resistance shift field. This activates and reveals the microcracks on the subsurface of the glass floor, clearly showing the shift distribution of the thermal resistance value. This precisely compensates for the shortcomings of existing methods, which cannot capture thermal damage using alternating hot and cold loads or reconstruct the thermal resistance shift field. This modification provides reliable thermal characteristic data for determining creepage risk.

[0017] 3. For grids with resistance deviations exceeding the threshold, micro-charge pulse discharge is performed, followed by high-humidity immersion and high-humidity resistance data collection. Combined with the thermal resistance difference distribution map, the characteristics of continuous resistance drop and recovery hysteresis are double-overlapped and calibrated. At the same time, the degradation trend is assessed and intervention plans are formulated. The creepage risk points caused by microcrack propagation under high humidity environment are accurately located, and the degradation trend is quantitatively rated and targeted intervention is achieved. This solves the problems of existing technologies being unable to combine thermally induced deviation and humidity-induced attenuation assessment, lacking risk location and intervention support. Attached Figure Description

[0018] Figure 1 This is a system architecture diagram of an antistatic performance testing system for glass floors provided in an embodiment of the present invention; Figure 2 This is a flowchart illustrating a method for testing the antistatic performance of glass floors according to an embodiment of the present invention.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0021] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “the” and “the” used in the embodiments of this invention and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. “Multiple” generally includes at least two.

[0022] Depending on the context, the word "if" or "if" as used here can be interpreted as "when" or "when" or "in response to determination" or "in response to detection." Similarly, depending on the context, the phrase "if determination" or "if detection (of the stated condition or event)" can be interpreted as "when determination" or "in response to determination" or "when detection (of the stated condition or event)" or "in response to detection (of the stated condition or event)."

[0023] Furthermore, the timing of the steps in the following method embodiments is merely an example and not a strict limitation.

[0024] In practice, the server-side equipment deployed in a system for testing the antistatic performance of glass floors may consist of one or more devices. This system can be implemented as a business instance, a virtual machine, or hardware devices. For example, it can be implemented as a business instance deployed on one or more devices in a cloud node. Simply put, it can be understood as software deployed on a cloud node to provide antistatic performance testing for glass floors to various user terminals. Alternatively, it can be implemented as a virtual machine deployed on one or more devices in a cloud node, with application software installed to manage various user terminals. Or, it can also be implemented as a server composed of numerous identical or different types of hardware devices, with one or more hardware devices configured to provide antistatic performance testing for glass floors to various user terminals.

[0025] In terms of implementation, the antistatic performance testing system for glass floors and the user terminal are mutually compatible. That is, if the antistatic performance testing system for glass floors is implemented as an application installed on a cloud service platform, then the user terminal is implemented as a client that establishes a communication connection with the application; or if the antistatic performance testing system for glass floors is implemented as a website, then the user terminal is implemented as a webpage; or if the antistatic performance testing system for glass floors is implemented as a cloud service platform, then the user terminal is implemented as a mini-program in an instant messaging application.

[0026] like Figure 1 The diagram shown is a system architecture diagram of an antistatic performance testing system for glass floors provided in an embodiment of the present invention.

[0027] The antistatic performance testing system 100 for glass floors described in this invention can be set up in a cloud server. In terms of implementation, it can be used as one or more service devices, or as an application installed in the cloud (such as a mobile service operator's server, server cluster, etc.), or it can be developed into a website. Depending on the functions implemented, the antistatic performance testing system 100 for glass floors may include a reference resistance distribution construction module 101, a thermal shock retest module 102, a thermal resistance difference analysis module 103, a high humidity immersion inspection module 104, a creepage risk calibration module 105, and a degradation assessment and intervention module 106. The modules described in this invention can also be called units, which refer to a series of computer program segments that can be executed by the processor of an electronic device and can perform fixed functions, and are stored in the memory of the electronic device.

[0028] In this embodiment of the invention, in a system for testing the antistatic performance of glass floors, each of the above modules can be implemented independently and called by other modules. This calling can be understood as a module connecting to multiple modules of another type and providing corresponding services to those connected modules. In this embodiment of the invention, the applicable scope of the antistatic performance testing system architecture for glass floors can be adjusted by adding modules and directly calling them without modifying the program code, achieving cluster-based horizontal expansion. This allows for quick and flexible expansion of the antistatic performance testing system for glass floors. In practical applications, the above modules can be set in the same device or different devices, or they can be set in a virtual device, such as a service instance in a cloud server.

[0029] The following describes, with reference to specific embodiments, each component and its specific workflow of a system for testing the antistatic performance of glass floors: The reference resistance distribution construction module 101 performs a full-domain resistance traversal of the measurement grid of the glass floor when the energy storage compartment is shut down and the environmental parameters are within the standard range, in order to construct an initial resistance reference map of the glass floor. This module provides a comprehensive initial baseline for pre-diagnosis and health management, and is the foundation for status monitoring and early pre-diagnosis. In this embodiment of the invention, the process of constructing the initial resistance reference map of the glass floor is as follows: The glass floor that has been laid inside the energy storage compartment is spatially meshed to obtain the measurement grid of the glass floor; First, determine the outline of the four sides of the glass floor inside the energy storage chamber. Using the long and short sides of the glass floor as a reference, make uniform linear divisions along the horizontal and vertical directions. Maintain equal spacing between the dividing lines. After the dividing lines intersect, the entire surface of the glass floor is divided into multiple regions with the same shape and area. Each independently separated region is a measurement unit. All measurement units are combined in a way that is continuously arranged horizontally and continuously aligned vertically to form a measurement grid that is gapless, non-overlapping, and completely covers the entire surface of the glass floor.

[0030] Electrode contacts are laid out on the measurement grid to obtain the detection electrode arrangement of the glass floor; At the geometric center of each measurement unit in the measurement grid, conductive electrode contacts are installed using a bonding and fixing method to ensure that the electrode contacts are in close contact with the glass floor surface without any looseness. All electrode contacts corresponding to all measurement units are electrically connected in sequence according to the horizontal row order and vertical column order of the measurement grid. After connection, all electrode contacts form a unified electrical acquisition path. All electrode contacts and electrical connection paths are combined to form a detection electrode arrangement that completely corresponds to the spatial position of the measurement grid without any misalignment or omission.

[0031] With the energy storage compartment shut down and the ambient temperature and humidity maintained within the preset standard parameter range, point-based electrical parameter acquisition is performed on the array of detection electrodes to obtain the initial resistance data of the glass floor. All operating equipment in the energy storage compartment is shut down, keeping the entire compartment in a static state without vibration or current output. The temperature and humidity of the environment surrounding the glass floor are kept stable, with no temperature fluctuations or humidity changes. The resistance value of the corresponding position on the glass floor is collected individually by each electrode contact of the probe electrode arrangement. During the collection process, the output signal of the acquisition equipment is kept stable, and each electrode contact only collects a single resistance value of the corresponding measurement unit. The resistance values ​​collected by all electrode contacts are collected and organized sequentially according to the row and column order of the measurement grid to form initial resistance data that completely covers all measurement units.

[0032] Based on the spatial coordinate correspondence between the initial resistance data and the measurement grid, the initial resistance data is mapped to obtain the initial resistance reference map of the glass floor. Each measurement unit in the measurement grid is labeled with a unique spatial location number. The spatial location number is determined by the combination of the number of horizontal rows and the number of vertical columns to ensure that each measurement unit corresponds to a unique spatial location number. Each resistance value in the initial resistance data is bound one-to-one with the spatial location number of the corresponding measurement unit. After binding, each bound resistance value is filled into the area of ​​the corresponding spatial location number according to the spatial layout of the measurement grid in the horizontal row order and vertical column order. After all resistance values ​​are filled, an initial resistance reference map is formed that can intuitively show the distribution of the resistance of the entire surface of the glass floor.

[0033] The thermal shock retest module 102 applies alternating hot and cold impact loads to the glass floor and, after the load is removed, performs a full-domain resistance retest on the measurement grid to obtain the thermal resistance distribution map of the glass floor. This module achieves defect pre-activation through thermal shock, which is a key preliminary step in pre-diagnosis and health management. In this embodiment of the invention, the process of obtaining the thermoelectric resistance distribution map of the glass floor is as follows: Thermal radiation pulse injection is performed on the load-bearing surface of the glass floor to obtain a transient high-temperature shaping layer for the glass floor; Specialized equipment capable of directional thermal radiation output is selected, and the nozzle of the equipment is aimed at the entire bearing surface of the glass floor inside the energy storage chamber. The output state of the equipment is adjusted so that the thermal radiation acts on the surface of the glass floor continuously and evenly in the form of pulses. During the spraying process, the distance between the nozzle and the surface of the glass floor is kept constant to ensure that the thermal radiation evenly covers every area of ​​the glass floor. Under the action of continuous thermal radiation pulses, a high-temperature surface structure with uniform temperature and only existing for a short time is formed on the surface of the glass floor. This surface structure is the transient high-temperature shaping layer of the glass floor.

[0034] During the transition gap of the transient high-temperature shaping layer, the bearing surface of the glass floor is subjected to rapid cooling and quenching by a cooling medium to obtain the activated state of the thermal shock microgap of the glass floor. Observe the temperature change of the transient high-temperature shaping layer on the surface of the glass floor. When the temperature of the high-temperature surface layer begins to gradually decrease and has not dropped to room temperature, immediately start the cooling medium delivery equipment to spray the cooling medium synchronously onto the entire bearing surface of the glass floor through evenly distributed spray ports. The cooling medium comes into rapid contact with the high-temperature glass floor surface and achieves rapid heat exchange. Due to the rapid temperature rise and fall, microscopic structural gaps are generated on the surface of the glass floor. The entire glass floor is in a state in which the microscopic gaps are fully manifested. This state is the thermal shock micro-gap activation state of the glass floor.

[0035] After the thermal shock microgap activation state is completely eliminated and the glass floor returns to a stable state at room temperature, the measurement grid is scanned in a global manner by electrode guidance based on the spatial topological position of the detector electrode arrangement to obtain the thermal resistance offset dataset of the glass floor. The surface condition of the glass floor is continuously observed until the micro-gap is completely closed and the thermal shock micro-gap activation state is completely eliminated. At the same time, the overall temperature of the glass floor is brought back to room temperature and kept without any temperature fluctuation. According to the fixed spatial position of the detection electrodes in the measurement grid, each detection electrode is activated in sequence to collect the resistance value of the corresponding measurement unit. During the acquisition process, the electrodes are kept in close contact with the surface of the glass floor. The resistance values ​​collected by all measurement units are recorded one by one in the row and column order of the measurement grid. All the recorded resistance values ​​are combined to form the thermal resistance offset dataset of the glass floor.

[0036] Two-dimensional field reconstruction was performed on the thermal resistance migration dataset to obtain the thermal resistance distribution map of the glass floor. By defining the fixed spatial arrangement rules of the measurement grid in the horizontal and vertical directions, each resistance value in the thermoelectric offset dataset is accurately filled into the corresponding position of the measurement grid according to its corresponding measurement unit spatial position. The filling process strictly follows the row and column correspondence and there is no positional deviation. After all resistance values ​​are filled in space, a two-dimensional planar graph that can completely reflect the resistance distribution of the glass floor surface after thermal shock is formed. This two-dimensional planar graph is the thermoelectric resistance distribution map of the glass floor.

[0037] Thermoresistivity difference analysis module 103 performs global difference analysis on the thermoresistivity distribution map based on the initial resistance reference map to obtain the thermoresistivity difference distribution map of the glass floor. Global difference analysis is used for pre-diagnosis and health management to distinguish between normal fluctuations and structural deterioration; In this embodiment of the invention, the process of obtaining the thermal resistance difference distribution map of the glass floor is as follows: Based on the spatial index coordinates of the measurement grid in the initial resistance reference map, the resistance values ​​at the corresponding positions in the thermoresistivity distribution map are extracted by aligning the corresponding points to obtain the reference thermoresistivity pairing array of the glass floor. After spatial meshing, each measurement grid point on the glass floor is assigned a unique spatial index coordinate. This spatial index coordinate is formed by combining horizontal and vertical arrangement numbers. Each measurement grid corresponds to only one fixed combination of horizontal and vertical arrangement numbers, with no duplicate or ambiguous coordinate identifiers. The initial resistance reference map is a two-dimensional field data formed by binding the resistance value of each grid point to its corresponding spatial index coordinate after the energy storage compartment is shut down and environmental parameters are within the standard range, after completing the full-domain resistance acquisition of all measurement grid points on the glass floor. The thermal resistance distribution map is a feature of the glass floor. After applying the alternating hot and cold impact load and restoring to a stable state at room temperature, the resistance values ​​of all measurement grid points are remeasured across the entire domain. The resistance value of each grid point is then bound to the corresponding spatial index coordinate to form two-dimensional field data. According to the unique matching rule of the horizontal and vertical arrangement sequence numbers of the spatial index coordinates, the reference resistance value of a certain coordinate in the initial resistance reference map is extracted one by one. Then, the thermal resistance value of the same coordinate in the thermal resistance distribution map is extracted. The two sets of resistance values ​​are combined one by one according to the coordinate order to form a paired data set covering all measurement grids of the glass floor. This set is the reference thermal resistance value pairing array of the glass floor.

[0038] The reference resistance value and the thermal resistance value in the reference thermal resistance pairing array are analyzed by difference to obtain the thermal resistance offset of the glass floor. Each data set in the reference thermoresistivity pairing array includes the initial reference resistance value and the thermoresistivity value after thermal shock for a single measurement grid. A subtraction operation is performed on each pair of data sets, subtracting the initial reference resistance value from the thermoresistivity value obtained after thermal shock to obtain the resistance change of the measurement grid after the alternating thermal shock. This value represents the thermoresistivity offset of the glass floor; a value greater than zero indicates an increase in grid resistance after thermal shock, a value equal to zero indicates no change in grid resistance after thermal shock, and a value less than zero indicates a decrease in grid resistance after thermal shock. ΔR = R H -R B Where ΔR is the thermal resistance offset of a single grid point, R H R is the thermal resistance value of a single grid point.B This is the reference resistance value for a single grid point.

[0039] Based on the spatial adjacency relationship of the measurement grid, the thermal resistance offset is filled in grid by grid to obtain the spatial arrangement set of thermal offset of the glass floor. The spatial adjacency relationship of the measurement grid is a fixed positional association between each measurement grid point and four directly contacting grid points above, below, left, and right, with no indirect or fuzzy associations. The thermal resistance offsets corresponding to all measurement grid points are filled into the corresponding grid positions one by one according to the horizontal and vertical arrangement order of the spatial index coordinates. The filling process strictly follows the rule of one-to-one correspondence between coordinates and offsets, and there are no cases of incorrect or missing offsets. After all thermal resistance offsets are filled, an offset data set that covers all measurement grids of the glass floor and perfectly matches the spatial positions is formed. This set is the spatial arrangement set of thermal offsets of the glass floor.

[0040] By continuously extending and reconstructing the offset jump variables between adjacent measurement grids in the spatial arrangement of the thermal offset, a thermal resistance difference distribution map of the glass floor is obtained. The spatial arrangement of thermal offsets is concentrated. The definition of adjacent measurement grids follows the spatial adjacency relationship. Two directly adjacent grid points are selected in a horizontal or vertical arrangement. The thermal resistance offset of the two adjacent grid points is subtracted by the thermal resistance offset of the previous grid. The resistance offset change between the two adjacent grids is obtained by subtracting the thermal resistance offset of the previous grid from the thermal resistance offset of the latter grid. This value is the offset jump variable. ΔR J =ΔR i+1 -ΔR i ;where ΔR J ΔR is the offset jump variable between adjacent grids. i+1 The thermal resistance offset of the next grid, ΔR i The offset of the thermal resistance of the previous grid is used to connect the offset variables of all adjacent grids in spatial order. The discrete offset values ​​are smoothed to eliminate the numerical abrupt changes between adjacent grids, so that the thermal resistance offset of the entire glass floor surface forms a continuous and uninterrupted field data. This continuously changing field data fully reflects the distribution and change of the resistance difference of the entire glass floor, that is, the thermal resistance difference distribution map of the glass floor.

[0041] The high humidity immersion inspection module 104 performs micro-charge pulse discharge on the grid measurement points that show resistance shift in the thermal resistance distribution map. After the discharge is completed, the glass floor is immersed in a high humidity atmosphere. After immersion, the surface adsorption steady state of the glass floor is inspected for the whole domain resistance to obtain the high humidity resistance distribution map of the glass floor. High humidity inspections are used for pre-diagnosis and health management, simulating real working conditions to accelerate the exposure of moisture-induced degradation risks; A high humidity atmosphere is defined as one where the relative humidity is consistently maintained at 85% RH or above. In this embodiment of the invention, the process of obtaining the high humidity resistance distribution map of the glass floor is as follows: By comparing the resistance values ​​of the same grid in the initial resistance reference map and the thermoelectric resistance distribution map, the grid resistance offset of the glass floor is obtained. The initial resistance baseline map is generated by deploying probe electrodes corresponding to the measurement grid on the glass floor surface under conditions where the energy storage chamber is shut down and the ambient temperature and humidity are stable within the standard range. The resistance data is collected point-by-point using these probe electrodes, and the data is then mapped to the spatial coordinates of the measurement grid. This map completely records the initial global resistance distribution of the glass floor when there is no external interference. The thermal resistance distribution map is generated by applying alternating hot and cold impact loads to the glass floor and waiting for the loads to be completely removed and the glass floor to return to a stable room temperature. The original probe electrodes are then used to remeasure the global resistance of the measurement grid, and the remeasured data is reconstructed in a two-dimensional field. This map completely records the global resistance distribution of the glass floor after thermal shock. Resistance data at the corresponding measurement grid points with identical spatial coordinates in the initial resistance baseline map and the thermal resistance distribution map are extracted, and the two sets of resistance data are compared point-by-point. The difference in the compared values ​​is used as the grid resistance offset of the glass floor. The mathematical formula for calculating the grid resistance offset is δR = R. t -R b Where δR represents the grid resistance offset; R t R represents the resistance value of the corresponding grid within the thermal resistance distribution diagram. b This represents the resistance value of the corresponding grid within the initial resistance reference diagram; the calculation process is performed on all corresponding grid points one by one, without any omissions.

[0042] Grid points whose grid resistance offset exceeds the preset fluctuation threshold are identified and calibrated to obtain a list of grid points to be released in the glass floor. The preset fluctuation threshold is determined based on the maximum amplitude of natural resistance fluctuation of the antistatic substrate of the glass floor under normal conditions without structural damage or performance degradation. It is the sole criterion for determining whether the resistance deviation is abnormal. The resistance deviation of all measurement grids is compared with the preset fluctuation threshold point by point. All measurement grid points whose resistance deviation is strictly greater than the preset fluctuation threshold are selected. All selected measurement grid points are sorted and arranged according to their row and column coordinates on the glass floor surface. After sorting, a list of glass floor grid points to be released is formed, which records the spatial information of all abnormal points. Each point in the list has a unique and locatable spatial coordinate.

[0043] Based on the spatial position of the grid to be discharged on the glass floor surface in the list of grid points to be discharged, microsecond-level pulse discharge is performed on the grid to be discharged to obtain the charge discharge record of the glass floor; The list of grid points to be discharged fully records the spatial coordinates of all measurement grid points whose resistance deviations exceed the normal range, serving as the sole basis for executing the micro-charge pulse discharge operation. Based on the spatial coordinates of each grid point in the list, the discharge probe of the micro-charge pulse discharge device is vertically attached to the corresponding point on the glass floor surface, ensuring stable contact and uniform pressure between the probe and the surface. Instantaneous micro-charge pulses are output to the grid point on a microsecond timescale to completely release the residual charge accumulated on the surface of the point. The spatial coordinates, discharge operation execution status, and discharge completion time of each grid point are recorded simultaneously. After integrating and summarizing the discharge-related information of all points, a complete glass floor charge discharge record is formed.

[0044] After traversing the list of grid points to be discharged and completing the microsecond-level pulse discharge, the charge discharge completion state of the glass floor is obtained; According to the coordinate order of the grid points to be discharged, the discharge operation of each point is checked one by one; it is confirmed that all grid points to be discharged in the list have completed the microsecond-level pulse discharge operation, and there are no points where discharge is not performed, interrupted, or omitted; at this time, the residual charge of all abnormal points on the glass floor surface has been completely discharged, with no charge residue or accumulation; the glass floor as a whole has reached the state of complete charge discharge, which provides a stable basis for subsequent high humidity detection without charge interference.

[0045] By subjecting a glass floor in a state of complete charge discharge to continuous environmental immersion within a preset high humidity threshold range, a steady state of surface adsorption and humidification of the glass floor is obtained. The charge discharge completion state is a stable state in which all residual charges at all points on the glass floor surface to be discharged are completely cleared and there is no charge interference. The glass floor in the charge discharge completion state is placed in a fully enclosed humidity control chamber. Water vapor is continuously supplied to the chamber through humidity control equipment, and the humidity inside the chamber is monitored and stabilized in real time to keep the ambient humidity within the preset high humidity threshold range, i.e., relative humidity ≥ 85% RH without fluctuation. Water vapor is evenly surrounding the surface of the glass floor and is fully adsorbed into the surface structure of the glass floor. The amount of water vapor adsorbed on the surface of the glass floor is continuously monitored. When the amount of adsorption remains constant for a fixed period of time, the glass floor reaches the steady state of surface adsorption humidification.

[0046] After the surface is maintained in a steady state of adsorption and humidification for a preset immersion time, the ground resistance of the glass floor grid is collected grid by grid to obtain the high humidity resistance record of the glass floor grid. The surface adsorption humidification steady state is the state in which water vapor adsorption on the glass floor surface is saturated and the adsorption amount remains stable. Maintaining the surface adsorption humidification steady state of the glass floor for a preset immersion time ensures that water vapor fully penetrates the surface structure. The sampling probe of the resistance acquisition device is precisely in contact with the detection electrodes of the measurement grid, ensuring good contact without loosening. Following the pre-defined row and column order of the measurement grid, starting from the first row and first column, the resistance value to ground of each measurement grid point is collected row by row and column by column. The resistance values ​​to ground of all points are stored in real time according to the acquisition order, forming a complete record of the high humidity resistance value of the glass floor grid, with no points missed in the acquisition.

[0047] According to the row and column arrangement order of the measurement grid on the glass floor surface, the high humidity resistance record of the grid is spatially repositioned and extended to obtain the high humidity resistance distribution map of the glass floor. The measurement grid is a set of detection points across the entire glass floor area, formed by uniformly dividing the glass floor into spatial grids. Each point has unique spatial coordinates. The resistance values ​​to ground recorded in the high humidity resistance values ​​of the grid are precisely bound to the spatial coordinates of the corresponding points according to the row and column arrangement of the measurement grid, completing the spatial localization of the resistance data. For all grid points that have completed spatial localization, the extended resistance values ​​of the current grid and its adjacent grids are calculated one by one, achieving continuous integration of the resistance values ​​of adjacent points. After integration, a high humidity resistance distribution map covering the entire glass floor area is formed. The mathematical formula for the continuous extension of the resistance values ​​of adjacent measurement grid points is: R e =(R c +R n ) / 2; where R e Represents the resistance value after extension; R c Represents the current grid resistance; R n This represents the resistance value of the adjacent grids in the current grid; this extension calculation is performed on all grid points one by one to form a continuous and uninterrupted resistance distribution map.

[0048] The creepage risk calibration module 105, based on the thermal resistance difference distribution map, performs dual feature overlap calibration on the measurement grid that shows the characteristics of continuous drop in resistance value and hysteresis recovery in the high humidity resistance distribution map, and obtains the creepage risk points of the glass floor. Dual-feature identification is a crucial step in the precise risk localization process for pre-diagnosis and health management; In this embodiment of the invention, the process of obtaining the creepage risk points of the glass floor is as follows: By analyzing the deviation amplitude of the thermal resistance difference distribution map, the offset value of the thermal resistance value of the measurement grid is obtained. The thermoelectric resistance difference distribution map is a spatial distribution map of the entire measurement grid relative to the initial reference resistance value after the glass floor is subjected to alternating hot and cold shocks. Each measurement grid in this map corresponds to a unique resistance offset value. Following the spatial coordinate order of the measurement grids on the glass floor surface, the resistance offset values ​​of all measurement grids in the thermoelectric resistance difference distribution map are extracted point-by-point. The resistance offset value corresponding to a single extracted measurement grid is directly determined as the thermoelectric resistance offset value of that measurement grid. After all measurement grids in the entire area have been extracted, the thermoelectric resistance offset values ​​of all measurement grids are obtained. The thermoelectric resistance offset values ​​are directly taken from the resistance offset values ​​of the corresponding measurement grids in the thermoelectric resistance difference distribution map; the two values ​​are completely equivalent and can be directly determined without additional calculation.

[0049] By performing continuous drop characteristic discrimination on the high humidity resistance distribution map, the resistance drop sequence of the measurement grid is obtained; The high-humidity resistance distribution map is a spatial distribution map of the resistance to ground of the entire measurement grid after the glass floor has completed its charge discharge and high-humidity wetting process. This distribution is formed by collecting and spatially matching the resistance data. In a high-humidity environment, a single measurement grid continuously collects multiple resistance values ​​to ground at fixed time intervals. These values ​​are then arranged chronologically according to their collection time. The resistance values ​​at adjacent collection times are compared one by one, and continuous value segments where the value at the later time is always less than the value at the previous time are selected. These continuous value segments are then arranged chronologically to form the resistance drop sequence for that measurement grid. After all measurement grids independently complete the above value selection and arrangement operations, the resistance drop sequence for all measurement grids is obtained.

[0050] Based on the resistance drop sequence, the hysteresis period of the measurement grid is identified to obtain the recovery hysteresis duration of the measurement grid; The resistance drop sequence is an ordered set of time-series values ​​of a single measurement grid where the resistance value continuously decreases under high humidity conditions. Simultaneously with the cessation of high humidity immersion on the glass floor, real-time monitoring of the ground resistance of the measurement grid is initiated. The resistance value of the measurement grid is continuously collected until it recovers to the value of the first value in the resistance drop sequence. The time point at which high humidity immersion ceases and the time point at which the resistance value recovers are recorded. The time difference between these two time points is directly determined as the recovery hysteresis duration of the measurement grid. After all measurement grids have completed time monitoring and difference calculation, the recovery hysteresis duration of all measurement grids is obtained.

[0051] By performing dual feature overlay calibration on the thermal resistance value offset and recovery hysteresis duration within the same measurement grid, the creepage risk points of the measurement grid can be obtained. The thermally induced resistance offset value is used to characterize the degree to which the resistance of the measurement grid deviates from its initial state after thermal shock; the recovery hysteresis time is used to characterize the delay in the recovery of the resistance performance of the measurement grid after it leaves the high humidity environment; the preset offset threshold is the maximum allowable value of the resistance offset after thermal shock when the glass floor has no structural degradation or performance degradation; the preset hysteresis threshold is the maximum allowable time for the resistance to recover after leaving the high humidity environment when the glass floor has no structural degradation or performance degradation; the same measurement grid with completely consistent spatial coordinates is selected, and when the thermally induced resistance offset value of the grid is greater than the preset offset threshold and the recovery hysteresis time of the grid is greater than the preset hysteresis threshold, the measurement grid is uniquely marked; the marked measurement grid is the creepage risk point of the glass floor.

[0052] The degradation assessment and intervention module 106 collects the dry resistance recovery rate of the glass floor corresponding to the creepage risk points, assesses the creepage degradation trend based on the dry resistance recovery rate and the temperature and humidity resistance decay sequence of the glass floor, and formulates an intervention plan based on the assessment results to obtain an antistatic microcrack intervention report for the glass floor. This module is the core decision-making output unit for pre-diagnosis and health management; In this embodiment of the invention, the process of obtaining the antistatic microcrack intervention report for the glass floor is as follows: Surface moisture was desorbed from the glass floor corresponding to the creepage risk points to obtain the dry baseline state of the glass floor. The creepage risk points are determined by comparing the thermal resistance value offset from the thermal resistance difference distribution map with the resistance recovery hysteresis time from the high humidity resistance distribution map. After double feature matching calibration on the same measurement grid, the corresponding locations of the glass floor measurement grids with creepage safety hazards are identified. Surface moisture desorption is achieved by continuously supplying dried clean gas into the enclosed space where the glass floor is located. The clean gas is continuously blown at a fixed flow rate along the parallel direction of the glass floor surface. The free moisture attached to the glass floor surface is completely carried away and discharged from the enclosed space under the action of gas blowing. At the same time, humidity detection elements are used to continuously collect humidity data of the glass floor surface. When the humidity data remains unchanged for several consecutive detection cycles and no water is detected, the gas blowing operation is stopped. At this time, there is no free moisture attached to the glass floor surface, the internal moisture content remains constant, and the electrical detection is not affected by moisture. This state is the dry baseline state.

[0053] Resistance recovery monitoring was performed on creepage risk points under dry baseline conditions to obtain resistance recovery curves at creepage risk points. Under dry baseline conditions, the temperature and humidity of the space where the glass floor is located are maintained at a fixed value and remain unchanged through environmental control equipment. Detection electrodes are pre-positioned on the surface of the glass floor corresponding to the creepage risk points. A constant DC detection voltage is applied to both ends of the detection electrodes. At fixed time intervals, the resistance data of the creepage risk points are continuously collected by the resistance detection unit. Each set of resistance data is bound and recorded one-to-one with the collection time and spatial coordinates of the point. All the bound resistance data are linearly arranged according to the chronological order of collection time. The continuous data change trajectory formed after arrangement is the resistance recovery curve of the creepage risk point.

[0054] Based on the resistance recovery curve, the recovery slope of the creepage risk points is evaluated to obtain the dry resistance recovery rate of the glass floor. From the resistance recovery curve, the interval where the resistance data continuously rises without fluctuation is selected as the effective calculation interval. The start and end times of the effective calculation interval are determined. The resistance data corresponding to the start and end times are extracted, and the numerical calculation is performed using the formula V=(R2-R1) / (t2-t1), where V represents the drying resistance recovery rate; R2 represents the resistance value collected at the end of the effective calculation interval; R1 represents the resistance value collected at the start of the effective calculation interval; t2 represents the end time of the effective calculation interval; and t1 represents the start time of the effective calculation interval. The calculated value is the drying resistance recovery rate of the creepage risk point of the glass floor.

[0055] Under a preset temperature and humidity change sequence, the resistance of the glass floor corresponding to the creepage risk point is tracked and collected to obtain the temperature and humidity resistance decay sequence of the glass floor. The preset temperature and humidity changing condition sequence is a continuous combination of environmental conditions where the temperature gradually increases and then decreases according to a gradient, and the humidity simultaneously increases and then decreases according to a gradient. Each condition is maintained for a sufficient duration to allow the electrical state inside and on the surface of the glass floor to fully adapt to the current condition and reach stability. After the condition stabilizes, resistance data of creepage risk points under the current condition is collected by detection electrodes. The resistance data corresponding to each condition is recorded independently. According to the sequence of the preset temperature and humidity changing condition sequence, all resistance data are arranged sequentially. The continuous data combination formed by the arrangement is the temperature and humidity resistance decay sequence of the glass floor.

[0056] By performing attenuation recovery correlation analysis between the dry resistance recovery rate and the temperature and humidity resistance attenuation sequence, the creepage degradation status rating of the glass floor is obtained. Resistance data corresponding to two adjacent operating conditions in the temperature and humidity resistance decay sequence are extracted. The resistance data of the previous operating condition is subtracted from the resistance data of the latter operating condition to obtain the resistance decay amplitude of a single operating condition. The resistance decay amplitudes of all single operating conditions are accumulated to obtain the overall total resistance decay amplitude. The overall total resistance decay amplitude is compared with the drying resistance recovery rate. The larger the overall total resistance decay amplitude, the smaller the drying resistance recovery rate, and the higher the creepage degradation degree. Based on the comparison results, the creepage degradation degree is divided into multiple fixed levels to form a creepage degradation status indicator. This indicator is the creepage degradation status rating of the glass floor.

[0057] Based on the creepage degradation status rating, the expansion status of the glass floor is determined to obtain the microcrack risk level of the glass floor. The creepage degradation status rating is directly related to the propagation trend of microcracks inside the glass floor. The higher the creepage degradation status rating, the stronger the propagation trend of microcracks under temperature and humidity changes and thermal shock. According to the creepage degradation status rating value, the microcrack risk level is directly generated. For each increase in the creepage degradation status rating, the microcrack risk level increases by one level. The final determined level value is the microcrack risk level of the glass floor.

[0058] Based on the risk level of microcracks, antistatic treatment is mapped onto the glass floor, resulting in a list of intervention strategies for the glass floor. A one-to-one fixed correspondence is established between the microcrack risk level and the antistatic treatment method; low-level microcrack risk corresponds to the treatment method of repairing the antistatic coating on the glass floor surface, medium-level microcrack risk corresponds to the treatment method of local structural reinforcement of the glass floor, and high-level microcrack risk corresponds to the treatment method of replacing the entire glass floor. Based on the microcrack risk level of the creepage risk point, a unique corresponding treatment method is matched; the treatment methods of all creepage risk points are sorted and summarized in spatial coordinate order, and the sorted set of treatment methods is the intervention strategy list for the glass floor.

[0059] Based on the list of intervention strategies, recommendations for glass floors were compiled, resulting in an intervention report on antistatic microcracks in glass floors. All data, including the list of intervention strategies, spatial coordinates of creepage risk points, microcrack risk levels, dry resistance recovery rate, and temperature and humidity resistance decay sequence, are integrated in order of point coordinates. Specific on-site execution steps and operational requirements are added for each treatment method. The integrated data forms a complete technical document containing detection data, risk assessment, and treatment guidelines. This technical document is the antistatic microcrack intervention report for glass floors.

[0060] Reference Figure 2The diagram shown is a flowchart illustrating a method for testing the antistatic performance of glass floors according to an embodiment of the present invention. In this embodiment, the method for testing the antistatic performance of glass floors includes: S1. When the energy storage compartment is shut down and the environmental parameters are within the standard range, the resistance of the glass floor is collected by a full-domain resistance traversal of the measurement grid to construct the initial resistance reference map of the glass floor. S2. Apply alternating hot and cold impact loads to the glass floor, and after the loads are removed, remeasure the resistance of the entire measurement grid to obtain the thermal resistance distribution map of the glass floor. S3. Based on the initial resistance reference map, perform global difference analysis on the thermal resistance distribution map to obtain the thermal resistance difference distribution map of the glass floor. S4. Perform micro-charge pulse discharge on the grid measurement points that show resistance shift in the thermal resistance distribution map. After the discharge is completed, immerse the glass floor in a high humidity atmosphere. After immersion, perform a full-area resistance inspection on the surface adsorption steady state of the glass floor to obtain the high humidity resistance distribution map of the glass floor. S5. Based on the thermal resistance difference distribution map, the measurement grid that shows the characteristics of continuous drop in resistance value and hysteresis recovery in the high humidity resistance distribution map is calibrated by double feature overlap to obtain the creepage risk points of the glass floor. S6. Collect the dry resistance recovery rate of the glass floor corresponding to the creepage risk points, analyze the creepage degradation trend of the dry resistance recovery rate and the temperature and humidity resistance decay sequence of the glass floor, and formulate an intervention plan based on the analysis results to obtain an antistatic microcrack intervention report for the glass floor.

[0061] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0062] The embodiments of this application can acquire and process relevant data based on artificial intelligence technology. Artificial intelligence is the theory, method, technology, and application system that uses digital computers or machines controlled by digital computers to simulate, extend, and expand human intelligence, perceive the environment, acquire knowledge, and use that knowledge to obtain optimal results.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A system for testing the antistatic performance of a glass floor, wherein the glass floor is installed in an energy storage chamber, characterized in that, The system includes: The reference resistance distribution construction module performs a full-domain resistance traversal of the measurement grid of the glass floor when the energy storage compartment is shut down and the environmental parameters are within the standard range, in order to construct an initial resistance reference map of the glass floor. The thermal shock retest module applies alternating hot and cold impact loads to the glass floor and, after the load is removed, performs a full-domain resistance retest on the measurement grid to obtain the thermal resistance distribution map of the glass floor. The thermal resistance difference analysis module performs global difference analysis on the thermal resistance distribution map based on the initial resistance reference map to obtain the thermal resistance difference distribution map of the glass floor. The high humidity immersion inspection module performs micro-charge pulse discharge on the grid measurement points that show resistance value shift in the thermal resistance distribution map. After the discharge is completed, the glass floor is immersed in a high humidity atmosphere. After immersion, the surface adsorption steady state of the glass floor is inspected for the whole domain resistance to obtain the high humidity resistance distribution map of the glass floor. The creepage risk calibration module, based on the thermal resistance difference distribution map, performs dual feature overlap calibration on the measurement grid that shows the characteristics of continuous drop in resistance value and hysteresis recovery in the high humidity resistance distribution map, to obtain the creepage risk points of the glass floor. The degradation assessment and intervention module collects the dry resistance recovery rate of the glass floor corresponding to the creepage risk points, assesses the creepage degradation trend by comparing the dry resistance recovery rate with the temperature and humidity resistance decay sequence of the glass floor, and formulates intervention plans based on the assessment results to obtain an antistatic microcrack intervention report for the glass floor.

2. The antistatic performance testing system for glass floors as described in claim 1, characterized in that, The process of constructing the initial resistivity reference map for the glass floor is as follows: The glass floor that has been laid inside the energy storage compartment is spatially meshed to obtain the measurement grid of the glass floor; Electrode contacts are laid out on the measurement grid to obtain the detection electrode arrangement of the glass floor; With the energy storage compartment shut down and the ambient temperature and humidity maintained within the preset standard parameter range, point-based electrical parameter acquisition is performed on the array of detection electrodes to obtain the initial resistance data of the glass floor. Based on the spatial coordinate correspondence between the initial resistance data and the measurement grid, the initial resistance data is mapped to obtain the initial resistance reference map of the glass floor.

3. The antistatic performance testing system for glass floors as described in claim 1, characterized in that, The process of obtaining the thermoresistivity distribution map of the glass floor is as follows: Thermal radiation pulse injection is performed on the load-bearing surface of the glass floor to obtain a transient high-temperature shaping layer for the glass floor; During the transition gap of the transient high-temperature shaping layer, the bearing surface of the glass floor is subjected to rapid cooling and quenching by a cooling medium to obtain the activated state of the thermal shock microgap of the glass floor. After the thermal shock microgap activation state is completely eliminated and the glass floor returns to a stable state at room temperature, the measurement grid is scanned in a global manner by electrode guidance based on the spatial topological position of the detector electrode arrangement to obtain the thermal resistance offset dataset of the glass floor. Two-dimensional field reconstruction was performed on the thermoresistivity offset dataset to obtain the thermoresistivity distribution map of the glass floor.

4. The antistatic performance testing system for glass floors as described in claim 1, characterized in that, The process of obtaining the thermal resistivity difference distribution map of the glass floor is as follows: Based on the spatial index coordinates of the measurement grid in the initial resistance reference map, the resistance values ​​at the corresponding positions in the thermoresistivity distribution map are extracted by aligning the corresponding points to obtain the reference thermoresistivity pairing array of the glass floor. The reference resistance value and the thermal resistance value in the reference thermal resistance pairing array are analyzed by difference to obtain the thermal resistance offset of the glass floor. Based on the spatial adjacency relationship of the measurement grid, the thermal resistance offset is filled in grid by grid to obtain the spatial arrangement set of thermal offset of the glass floor. The thermal resistance difference distribution map of the glass floor is obtained by continuously extending and reconstructing the offset jump variables between adjacent measurement grids in the spatial arrangement of the thermal offset.

5. The antistatic performance testing system for glass floors as described in claim 1, characterized in that, The process of performing micro-charge pulse discharge on grid measurement points showing resistance shift in the thermal resistance distribution map is as follows: By comparing the resistance values ​​of the same grid in the initial resistance reference map and the thermoelectric resistance distribution map, the grid resistance offset of the glass floor is obtained. Grid points whose grid resistance offset exceeds the preset fluctuation threshold are identified and calibrated to obtain a list of grid points to be released in the glass floor. Based on the spatial position of the grid to be discharged on the glass floor surface in the list of grid points to be discharged, pulse discharge is performed on the grid to be discharged to obtain the charge discharge record of the glass floor; After traversing the list of grid points to be discharged and completing the pulse discharge, the charge discharge completion state of the glass floor is obtained.

6. The antistatic performance testing system for glass floors as described in claim 4, characterized in that, The process of obtaining the high humidity resistivity distribution map of the glass floor is as follows: By subjecting a glass floor in a state of complete charge discharge to continuous environmental immersion within a preset high humidity threshold range, a steady state of surface adsorption and humidification of the glass floor is obtained. After the surface is maintained in a steady state of adsorption and humidification for a preset immersion time, the ground resistance of the glass floor grid is collected grid by grid to obtain the high humidity resistance record of the glass floor grid. According to the row and column arrangement order of the measurement grid on the glass floor surface, the high humidity resistance records of the grid are spatially repositioned and extended to obtain the high humidity resistance distribution map of the glass floor.

7. The antistatic performance testing system for glass floors as described in claim 1, characterized in that, The process of obtaining the creepage risk points of glass flooring is as follows: By analyzing the deviation amplitude of the thermal resistance difference distribution map, the offset value of the thermal resistance value of the measurement grid is obtained. By performing continuous drop characteristic discrimination on the high humidity resistance distribution map, the resistance drop sequence of the measurement grid is obtained; Based on the resistance drop sequence, the hysteresis period of the measurement grid is identified to obtain the recovery hysteresis duration of the measurement grid; By performing dual feature overlay calibration on the thermal resistance offset value and recovery hysteresis duration within the same measurement grid, the creepage risk points of the measurement grid can be obtained.

8. The antistatic performance testing system for glass floors as described in claim 1, characterized in that, The process of collecting the recovery rate of the dry resistance of the glass floor corresponding to the creepage risk points is as follows: Surface moisture was desorbed from the glass floor corresponding to the creepage risk points to obtain the dry baseline state of the glass floor. Resistance recovery monitoring was performed on creepage risk points under dry baseline conditions to obtain resistance recovery curves at creepage risk points. Based on the resistance recovery curve, the recovery slope of creepage risk points is evaluated to obtain the dry resistance recovery rate of the glass floor.

9. The antistatic performance testing system for glass floors as described in claim 8, characterized in that, The process of obtaining the antistatic microcrack intervention report for glass flooring is as follows: Under a preset temperature and humidity change sequence, the resistance of the glass floor corresponding to the creepage risk point is collected by tracking, and the temperature and humidity resistance decay sequence of the glass floor is obtained. By performing attenuation recovery correlation analysis between the dry resistance recovery rate and the temperature and humidity resistance attenuation sequence, the creepage degradation status rating of the glass floor is obtained. Based on the creepage degradation status rating, the expansion status of the glass floor is determined to obtain the microcrack risk level of the glass floor. Based on the risk level of microcracks, antistatic treatment is mapped onto the glass floor, resulting in a list of intervention strategies for the glass floor. Based on the list of intervention strategies, recommendations were compiled for glass floors, resulting in an intervention report on antistatic microcracks in glass floors.

10. A method for testing the antistatic performance of glass floors, characterized in that, For use with the antistatic performance testing system for glass floors according to any one of claims 1-9, the method comprises: S1. When the energy storage compartment is shut down and the environmental parameters are within the standard range, the resistance of the glass floor is collected by a full-domain resistance traversal of the measurement grid to construct the initial resistance reference map of the glass floor. S2. Apply alternating hot and cold impact loads to the glass floor, and after the loads are removed, remeasure the resistance of the entire measurement grid to obtain the thermal resistance distribution map of the glass floor. S3. Based on the initial resistance reference map, perform global difference analysis on the thermal resistance distribution map to obtain the thermal resistance difference distribution map of the glass floor. S4. Perform micro-charge pulse discharge on the grid measurement points that show resistance shift in the thermal resistance distribution map. After the discharge is completed, immerse the glass floor in a high humidity atmosphere. After immersion, perform a full-area resistance inspection on the surface adsorption steady state of the glass floor to obtain the high humidity resistance distribution map of the glass floor. S5. Based on the thermal resistance difference distribution map, the measurement grid that shows the characteristics of continuous drop in resistance value and hysteresis recovery in the high humidity resistance distribution map is calibrated by double feature overlap to obtain the creepage risk points of the glass floor. S6. Collect the dry resistance recovery rate of the glass floor corresponding to the creepage risk points, analyze the creepage degradation trend of the dry resistance recovery rate and the temperature and humidity resistance decay sequence of the glass floor, and formulate an intervention plan based on the analysis results to obtain an antistatic microcrack intervention report for the glass floor.

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