An automated testing device for automotive-grade chips in three-temperature environments

Abstract

This application discloses an automated three-temperature environment testing device for automotive-grade chips, specifically relating to the field of automotive-grade chip testing technology. The device includes a testing machine, automotive-grade chips, and a shuttle. Through a temperature control plate, testing heads, and a gripping mechanism, a slider drives the shuttle to transport automotive-grade chips meeting the testing temperature to the testing area. An electric push rod is activated, driving the testing heads downwards via a fixed plate. Temperature is controlled by a heating element to perform high-temperature or low-temperature environment testing on the automotive-grade chips. After testing, the automotive-grade chips are transported out via the shuttle, data is recorded, and the test is complete. Multiple testing heads significantly improve testing efficiency, allowing for the testing of up to eight chips at a time. Heating or cooling is achieved through a temperature control plate, and temperature is controlled by a heating element. The device integrates three-temperature testing functions into one unit, reducing equipment replacement and environmental switching, improving testing stability, and the automated testing process effectively reduces manual intervention and statistical errors.

Description

Technical Field

[0001] This application relates to the field of automotive-grade chip testing technology, and more specifically, to an automated testing device for automotive-grade chips in a three-temperature environment. Background Technology

[0002] Currently, automotive-grade chip testing typically requires operation in various temperature environments, including room temperature, low temperature, and high temperature. Traditional testing methods rely on specialized laboratory equipment, such as high-temperature chambers and low-temperature chambers, resulting in fragmented and inefficient testing processes. With the increasing electrification of automobiles, the demand for automotive-grade chips has surged, and traditional testing methods can no longer meet the requirements for efficient and high-precision testing.

[0003] In existing technologies, the three-temperature testing of automotive-grade chips is usually carried out in the following two ways: 1. Using separate high-temperature chambers and low-temperature chambers for testing, the testers need to manually transfer the chip and record the data; 2. Using multiple devices for parallel testing, but manual intervention and data statistics are still required. The first method has a long testing cycle, high labor costs, and data statistics are prone to errors. Although the second method improves efficiency to some extent, the equipment cost is high, and there are still complexities in data synchronization and management.

[0004] Therefore, an automated three-temperature environment testing device for automotive-grade chips is proposed to address the above problems. Summary of the Invention

[0005] The purpose of this application is to provide an automated testing device for automotive-grade chips under three-temperature environments.

[0006] The automated three-temperature environment testing equipment for automotive-grade chips provided in this application adopts the following technical solution:

[0007] An automated three-temperature environment testing device for automotive-grade chips includes a testing machine, an automotive-grade chip, and a shuttle car. One end of the testing machine is provided with a temperature control plate for heating or cooling the automotive-grade chip, one side of the testing machine is provided with a gripping mechanism for gripping the automotive-grade chip, and the surface of the testing machine is provided with a moving mechanism for moving the shuttle car.

[0008] Preferably, the surface of the temperature control plate has multiple sets of first chip slots, and the inner wall of the first chip slot is slidably connected with an automotive-grade chip.

[0009] Preferably, the gripping mechanism includes a movable frame, robotic arms, and suction nozzles. The movable frame is fixedly connected to one side of the testing machine. Two sets of robotic arms are connected inside the movable frame via linear guide rails, and one end of each set of robotic arms is provided with a suction nozzle.

[0010] Preferably, the moving mechanism includes a slide groove, a drive motor, a threaded rod, and a slider. The surface of the testing machine is provided with two sets of slide grooves. The interior of the testing machine is fixedly connected with two sets of drive motors. One end of each set of drive motors is fixedly connected with a threaded rod. One end of the threaded rod is rotatably connected to the testing machine. The surfaces of both sets of threaded rods are threadedly connected with sliders.

[0011] Preferably, each of the two sets of sliders is provided with a shuttle car at its top, and the surface of the shuttle car is provided with multiple sets of second chip slots, which are matched with automotive-grade chips.

[0012] Preferably, the slide groove is provided with a guide cavity that matches the outline of the slider. The inner surface of the guide cavity and the outer surface of the slider maintain a fitting gap of 0.05 to 0.2 mm. The size of the fitting gap is configured to allow the slider to make reciprocating linear motion without jamming along the axial direction of the slide groove.

[0013] Preferably, the surface of the testing machine is provided with a testing platform, and the surface of the testing platform is provided with multiple sets of positioning rods.

[0014] Preferably, the test bench is provided with multiple sets of fixing frames inside, and the surface of the fixing frames is provided with a third chip slot, which is matched with an automotive-grade chip.

[0015] Preferably, a support frame is fixedly connected to the surface of the testing machine, an electric push rod is fixedly connected to one end of the support frame, a fixing plate is fixedly connected to one end of the electric push rod, and a test pressure head is fixedly connected to the surface of the fixing plate.

[0016] Preferably, the surface of the test head has multiple sets of positioning grooves, which cooperate with the positioning rod. The surface of the test head is provided with multiple sets of test heads, and a heating element is fixedly connected inside the test head.

[0017] The technical effects and advantages of this application are as follows:

[0018] Compared with existing technologies, this automated three-temperature environment testing equipment for automotive-grade chips utilizes a temperature control plate, a test head, and a gripping mechanism. The temperature control plate heats or cools the automotive-grade chip. A slider drives a shuttle to transport the chip, which meets the test temperature requirements, to the testing area. The gripping mechanism places the chip into the third chip slot on a fixed frame. An electric push rod moves the test head downwards via a fixed plate, inserting a positioning rod into the positioning slot and the test head into the fixed frame. Temperature is controlled by a heating element to perform high-temperature or low-temperature environment testing on the automotive-grade chip. After testing, the chip is removed by the shuttle, data is recorded, and the test is complete. Multiple test heads significantly improve testing efficiency, allowing for the testing of up to eight chips at a time. The integrated three-temperature testing function reduces equipment replacement and environmental switching, improves testing stability, and the automated testing process effectively reduces manual intervention and statistical errors. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this application;

[0020] Figure 2 This is a schematic diagram of the grasping mechanism in this application;

[0021] Figure 3 This is a schematic diagram of the mating structure of the automotive-grade chip and the suction nozzle in this application;

[0022] Figure 4 This is a schematic diagram of the structure of the moving mechanism in this application;

[0023] Figure 5 This is a schematic diagram of the structure of the shuttle car and the second chip slot in this application.

[0024] Figure 6 This is a schematic diagram of the cooperation structure between the test machine and the test bench in this application;

[0025] Figure 7 This is a schematic diagram of the mating structure between the automotive-grade chip and the third chip slot in this application;

[0026] Figure 8 This is a schematic diagram of the structure of the fixing plate and the test head in this application.

[0027] Figure 9 This is a schematic diagram of the structure of the test head and the heating element slot in this application.

[0028] The attached figures are labeled as follows: 1. Testing machine; 2. Temperature control panel; 3. First chip slot; 4. Automotive-grade chip; 5. Gripping mechanism; 501. Moving frame; 502. Robotic arm; 503. Nozzle; 6. Moving mechanism; 601. Slide; 602. Drive motor; 603. Threaded rod; 604. Slider; 7. Shuttle; 8. Second chip slot; 9. Testing table; 10. Positioning rod; 11. Fixing frame; 12. Third chip slot; 13. Support frame; 14. Electric push rod; 15. Fixing plate; 16. Test head; 17. Positioning slot; 18. Test head; 19. Heating element. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Example 1

[0031] like Figures 1 to 9 The diagram shows an automated three-temperature environment testing device for automotive-grade chips, including a testing machine 1, an automotive-grade chip 4, and a shuttle 7. One end of the testing machine 1 is equipped with a temperature control plate 2 for heating or cooling the automotive-grade chip 4 to ensure that the chip meets the test temperature. One side of the testing machine 1 is equipped with a gripping mechanism 5 for gripping the automotive-grade chip 4. The surface of the testing machine 1 is equipped with a moving mechanism 6 for moving the shuttle 7, which transports the automotive-grade chip 4 that meets the test temperature to the testing area via the shuttle 7. After the automotive-grade chip 4 has been tested, it is transported out via another set of shuttle 7.

[0032] In a preferred embodiment, the surface of the temperature control plate 2 is provided with multiple sets of first chip slots 3, and the inner wall of the first chip slot 3 is slidably connected to an automotive-grade chip 4, so that the automotive-grade chip 4 can be placed in the first chip slot 3 for heating or cooling.

[0033] In a preferred embodiment, the gripping mechanism 5 includes a movable frame 501, a robotic arm 502, and a suction nozzle 503. The movable frame 501 is fixedly connected to one side of the testing machine 1. Two sets of robotic arms 502 are connected inside the movable frame 501 through linear guide rails, so that the robotic arms 502 can move left and right on the movable frame 501. One end of each set of robotic arms 502 is provided with a suction nozzle 503, which can grip the automotive-grade chip 4 so that the automotive-grade chip 4 can be placed on the shuttle car 7 or the testing table 9.

[0034] In a preferred embodiment, the moving mechanism 6 includes a slide 601, a drive motor 602, a threaded rod 603, and a slider 604. Two sets of slides 601 are provided on the surface of the testing machine 1. Two sets of drive motors 602 are fixedly connected inside the testing machine 1. One end of each set of drive motors 602 is fixedly connected to a threaded rod 603. One end of the threaded rod 603 is rotatably connected to the testing machine 1. The surfaces of both sets of threaded rods 603 are threadedly connected to sliders 604. Starting the drive motor 602 can drive the threaded rod 603 to rotate, causing the slider 604 to move left and right on the surface of the threaded rod 603, so that the slider 604 can drive the shuttle 7 to transport the automotive-grade chip 4 that meets the test temperature to the test area.

[0035] In a preferred embodiment, each of the two sets of sliders 604 is provided with a shuttle 7 at its top. The surface of the shuttle 7 is provided with multiple sets of second chip slots 8. The second chip slots 8 cooperate with the automotive-grade chip 4 so that the automotive-grade chip 4 can be placed in the second chip slots 8 and the automotive-grade chip 4 will not fall off the shuttle 7.

[0036] In a preferred embodiment, the slide groove 601 is provided with a guide cavity that matches the outer contour of the slider 604. The inner surface of the guide cavity and the outer surface of the slider 604 maintain a fitting gap of 0.05 to 0.2 mm. The size of the fitting gap is configured to allow the slider 604 to make a reciprocating linear motion without jamming along the axial direction of the slide groove 601. When the slider 604 slides inside the slide groove 601, the slide groove 601 can limit the sliding of the slider 604 and prevent the slider 604 from shaking inside the slide groove 601.

[0037] In a preferred embodiment, the surface of the testing machine 1 is provided with a testing platform 9, and the surface of the testing platform 9 is provided with multiple sets of positioning rods 10.

[0038] In a preferred embodiment, the test bench 9 is provided with multiple sets of fixing brackets 11 inside, and the surface of the fixing brackets 11 is provided with a third chip slot 12, which is matched with the automotive-grade chip 4.

[0039] In a preferred embodiment, a support frame 13 is fixedly connected to the surface of the testing machine 1. An electric push rod 14 is fixedly connected to one end of the support frame 13. A fixing plate 15 is fixedly connected to one end of the electric push rod 14. A test pressure head 16 is fixedly connected to the surface of the fixing plate 15. When the electric push rod 14 is activated, the test pressure head 16 can be moved downward through the fixing plate 15.

[0040] In a preferred embodiment, the surface of the test head 16 is provided with multiple sets of positioning grooves 17, which cooperate with the positioning rod 10 so that the positioning rod 10 can be inserted into the positioning groove 17. The surface of the test head 16 is provided with multiple sets of test heads 18 for testing the automotive-grade chip 4. A heating element 19 is fixedly connected inside the test head 18 for controlling the temperature, so that the temperature is controlled at 140 degrees Celsius in a high-temperature test environment and at -40 degrees Celsius to -50 degrees Celsius in a low-temperature environment, so as to test the automotive-grade chip 4.

[0041] The working process of this application is as follows: The robotic arm 502 and suction nozzle 503 place the automotive-grade chip 4 into the first chip slot 3 on the temperature control plate 2. The temperature control plate 2 is activated to heat or cool the automotive-grade chip 4 for 5 minutes to reach the specified temperature (high temperature 140 degrees Celsius, low temperature -50 degrees Celsius). Then, the gripping mechanism 5 places the automotive-grade chip 4 into the second chip slot 8 on the shuttle 7. Activating the drive motor 602 rotates the threaded rod 603, causing the slider 604 to move left and right on the surface of the threaded rod 603. This allows the slider 604 to drive the shuttle 7 to deliver the chip to the specified temperature. The automotive-grade chip 4 is transported to the testing area and placed in the third chip slot 12 on the fixed frame 11 by the gripping mechanism 5. The electric push rod 14 is activated to drive the test pressure head 16 downward through the fixed plate 15, so that the positioning rod 10 is inserted into the positioning slot 17 and the test head 18 is inserted into the fixed frame 11. The temperature is controlled by the heating element 19 to conduct high-temperature or low-temperature environment tests on the automotive-grade chip 4. After the test is completed, the automotive-grade chip 4 is transported out by the shuttle 7, the data is recorded and the test is completed. The above is the working principle of this three-temperature environment automated testing equipment for automotive-grade chips.

Claims

1. A three-temperature environment automatic test equipment for automotive chip, comprising a test machine (1), an automotive chip (4) and a shuttle car (7), characterized in that: One end of the testing machine (1) is provided with a temperature control plate (2) for heating or cooling the automotive-grade chip (4), and one side of the testing machine (1) is provided with a gripping mechanism (5) for gripping the automotive-grade chip (4). The surface of the testing machine (1) is provided with a moving mechanism (6) for moving the shuttle car (7).

2. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 1, characterized in that: The surface of the temperature control plate (2) has multiple sets of first chip slots (3), and the inner wall of the first chip slots (3) is slidably connected to automotive-grade chips (4).

3. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 1, characterized in that: The gripping mechanism (5) includes a moving frame (501), a robotic arm (502) and a suction nozzle (503). The moving frame (501) is fixedly connected to one side of the testing machine (1). Two sets of robotic arms (502) are connected inside the moving frame (501) through linear guide rails. One end of each set of robotic arms (502) is provided with a suction nozzle (503).

4. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 1, characterized in that: The moving mechanism (6) includes a slide groove (601), a drive motor (602), a threaded rod (603), and a slider (604). The surface of the testing machine (1) is provided with two sets of slide grooves (601). The interior of the testing machine (1) is fixedly connected with two sets of drive motors (602). One end of each set of drive motors (602) is fixedly connected with a threaded rod (603). One end of the threaded rod (603) is rotatably connected to the testing machine (1). The surfaces of the two sets of threaded rods (603) are threadedly connected with sliders (604).

5. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 4, characterized in that: Both sets of sliders (604) are provided with a shuttle (7) at the top. The surface of the shuttle (7) is provided with multiple sets of second chip slots (8), which are matched with automotive-grade chips (4).

6. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 4, characterized in that: The slide groove (601) is provided with a guide cavity that matches the outer contour of the slider (604). The inner surface of the guide cavity and the outer surface of the slider (604) maintain a fitting gap of 0.05 to 0.2 mm. The size of the fitting gap is configured to allow the slider (604) to make a reciprocating linear motion without jamming along the axial direction of the slide groove (601).

7. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 1, characterized in that: The surface of the testing machine (1) is provided with a testing platform (9), and the surface of the testing platform (9) is provided with multiple sets of positioning rods (10).

8. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 7, characterized in that: The test bench (9) is equipped with multiple sets of fixing frames (11) inside. The surface of the fixing frame (11) is provided with a third chip slot (12), which is matched with the automotive-grade chip (4).

9. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 1, characterized in that: The surface of the testing machine (1) is fixedly connected to a support frame (13), one end of the support frame (13) is fixedly connected to an electric push rod (14), one end of the electric push rod (14) is fixedly connected to a fixing plate (15), and the surface of the fixing plate (15) is fixedly connected to a test pressure head (16).

10. The automated three-temperature environment testing equipment for automotive-grade chips according to claim 9, characterized in that: The surface of the test head (16) has multiple sets of positioning grooves (17), which cooperate with the positioning rod (10). The surface of the test head (16) is provided with multiple sets of test heads (18), and a heating element (19) is fixedly connected inside the test head (18).

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