Temperature control device

Abstract

This application relates to the field of heating device technology, and more particularly to a temperature control device. The temperature control device includes a ceramic substrate and a temperature control layer. The ceramic substrate includes a bottom layer and a top layer. The temperature control layer is disposed between the bottom layer and the top layer, and contains multiple temperature regulating elements. Each of the multiple temperature regulating elements corresponds to a different region of the top layer, and the operating state of each temperature regulating element can be independently controlled. This application solves the problem of existing temperature control devices being unable to selectively adjust the temperature of multiple regions by setting a temperature control layer containing multiple temperature regulating elements between the bottom and top layers and allowing the operating state of each temperature regulating element to be independently controlled. During operation, because the operating state of each temperature regulating element in the temperature control layer can be independently controlled, the temperature adjustment state of each region of the controlled object can be independently controlled, thus enabling selective heating or cooling of different regions of the controlled object to different degrees.

Description

Technical Field

[0001] This invention relates to the field of heating device technology, and more particularly to temperature control devices. Background Technology

[0002] Temperature control devices are widely used in various fields to meet the temperature control requirements of different working scenarios. In some applications that require different levels of temperature control for different areas, the temperature requirements of different areas are inconsistent, the complexity of temperature control increases, and the requirements for temperature control devices become more stringent.

[0003] In the process of realizing this invention, the inventors discovered at least the following problems in the prior art:

[0004] Existing temperature control devices cannot achieve different levels of temperature control for different areas, thus limiting their application in some work scenarios that require selective temperature control for multiple areas. Summary of the Invention

[0005] This application proposes a temperature control device aimed at solving the problem that existing temperature control devices cannot selectively control temperature in multiple areas.

[0006] This application provides a temperature control device, the temperature control device comprising:

[0007] The ceramic substrate includes a bottom layer and a top layer;

[0008] A temperature control layer is disposed between the bottom layer and the top layer. The temperature control layer contains multiple temperature control elements, each of which corresponds to a different area of ​​the top layer. The operating state of each temperature control element can be controlled independently.

[0009] In some embodiments, there are multiple temperature control layers, which are stacked sequentially from the bottom layer to the top layer.

[0010] In some embodiments, an insulating layer is provided between two adjacent temperature control layers.

[0011] In some embodiments, the area of ​​the temperature control element facing the top layer is 1 mm². 2 ~100mm 2 ; and / or,

[0012] The spacing between two adjacent temperature control elements on the same temperature control layer is 0.1 mm to 1 mm.

[0013] In some embodiments, the thickness of the temperature control layer is 0.005 mm to 1 mm.

[0014] In some embodiments, the thickness of the top layer is 0.5 mm to 2 mm.

[0015] In some embodiments, the thickness of the bottom layer is 0.5 mm to 2 mm.

[0016] In some embodiments, the thermal conductivity of the ceramic matrix is ​​60 W / m·K to 500 W / m·K, and the fracture toughness of the ceramic matrix is ​​3 MPa·m. 1 / 2 ~10 MPa·m 1 / 2 .

[0017] In some embodiments, the ceramic matrix material includes at least one of silicon nitride, aluminum nitride, boron nitride, and boron carbide.

[0018] In some embodiments, at least a portion of the temperature control element is a heating element, and the material of the heating element includes at least one selected from tungsten, molybdenum, platinum, molybdenum disilicide, tungsten disilicide, tungsten carbide, and molybdenum carbide.

[0019] In some embodiments, at least a portion of the temperature control element is a heating element, and each end of the heating element is provided with a pair of leads. The bottom layer has multiple pairs of through holes for the leads to pass through, and a pair of through holes corresponds to a pair of leads.

[0020] In some embodiments, the lead wire extends from the through hole to the side opposite to the temperature control layer for a length of 1 mm to 3 mm.

[0021] In some embodiments, the temperature control device further includes a control module electrically connected to the temperature regulating element for controlling the operating state of the temperature regulating element.

[0022] Compared with the prior art, this technical solution has at least the following technical advantages:

[0023] This application's technical solution solves the problem of existing temperature control devices being unable to selectively control temperatures in multiple areas by setting a temperature control layer containing multiple temperature regulation elements between the bottom and top layers, and allowing the operating state of each temperature regulation element to be independently controlled. During application, the object to be controlled is placed on the top layer, dividing the object into multiple areas. Each area corresponds to a different temperature regulation element in the temperature control layer. Because the operating state of each temperature regulation element in the temperature control layer can be independently controlled, the temperature control state of each area of ​​the object can be independently controlled, thus enabling selective heating or cooling of specific areas of the object to different degrees. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] Figure 1 This is a simplified structural diagram of the temperature control device of this application in one embodiment;

[0026] Figure 2 This is a simplified structural diagram of the temperature control device of this application in another embodiment;

[0027] Figure 3 This is a top view of the temperature control device of this application in one embodiment;

[0028] Figure 4 for Figure 3 The main view;

[0029] Figure 5 for Figure 3 Exploded view;

[0030] Figure 6 This is a schematic diagram of the temperature control device of this application in one embodiment;

[0031] Figure 7 This is a schematic diagram of the temperature control device of this application in another embodiment;

[0032] Figure 8 This is a schematic diagram of the temperature control device of this application in yet another embodiment;

[0033] Figure 9 This is a schematic diagram of the temperature control device of this application in another embodiment.

[0034] Figure label:

[0035] 100. Temperature control device; 110. Ceramic substrate; 111. Bottom layer; 1111. Through hole; 112. Top layer; 120. Temperature control layer; 121. Temperature control element / heating element / cooling element; 122. Lead wire; 130. Insulating layer; 140. Circuit board. Detailed Implementation

[0036] To better understand the technical solution of the present invention, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0038] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0039] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0040] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0041] Existing temperature control devices cannot achieve different degrees of temperature control for different areas, which limits their application in some work scenarios that require selective temperature control for multiple areas. For example, in the field of semiconductor chip packaging and testing, such as chip welding, simulation testing, and aging testing, temperature control devices are often used to heat the chip. There are already relatively mature temperature control device products to solve these problems. However, with the current changes in chip demand, the following problems have arisen: (1) The chip mainly faces the problem of heat accumulation (local heating) during operation, which means that silicon simulation chips are needed to simulate these working conditions. However, each chip has different characteristics, and for some scenarios where the thermal characteristic test requirements are not high, each chip has to be customized, resulting in high costs; (2) In the field of chip welding and aging testing, there are application scenarios that require local heating. The temperature requirements for different positions are different, the welding area becomes more complex, and different degrees of heating are required for different areas.

[0042] This application proposes a temperature control device 100, which can solve the above-mentioned technical problems.

[0043] Please see Figures 1-9 In this embodiment of the application, the temperature control device 100 includes a ceramic substrate 110 and a temperature control layer 120; the ceramic substrate 110 includes a bottom layer 111 and a top layer 112, the temperature control layer 120 is disposed between the bottom layer 111 and the top layer 112, the temperature control layer 120 contains a plurality of temperature regulating elements 121, the plurality of temperature regulating elements 121 correspond to different regions of the top layer 112 respectively, and the working state of each temperature regulating element 121 can be independently controlled.

[0044] In this embodiment, the operating state of the temperature control element 121 includes start / stop state, heating / cooling power, heating / cooling duration, etc., which can be designed by those skilled in the art as needed.

[0045] In this embodiment, the bottom layer 111 serves as the base for the temperature control layer 120 and the top layer 112, while the top layer 112 acts as a platform for placing the temperature-controlled object. During processing, the temperature-controlled object is placed on the top layer 112, which is in contact with the object. Selectively, some or all of the temperature control elements 121 in the temperature control layer 120 can be activated, and the activated elements 121 can be adjusted to a suitable working state. This allows the temperature control elements 121 to heat or cool corresponding areas of the top layer 112, thereby achieving the purpose of heating or cooling different areas of the temperature-controlled object to different degrees.

[0046] This application's technical solution solves the problem of existing temperature control devices 100 being unable to selectively adjust temperatures in multiple areas by setting a temperature control layer 120 containing multiple temperature control elements 121 between the bottom layer 111 and the top layer 112, and by enabling independent control of the operating state of each temperature control element 121. During the application of the temperature control device 100, the object to be controlled is placed on the top layer 112, dividing the object into multiple areas. Each area corresponds to a different temperature control element 121 in the temperature control layer. Since the operating state of each temperature control element 121 in the temperature control layer 120 can be independently controlled, the temperature of each area of ​​the object to be controlled can be independently adjusted, thus enabling selective temperature adjustment of different areas of the object to different degrees.

[0047] In this embodiment, the plurality of temperature control elements 121 in the temperature control layer 120 can be independently heating elements 121 or cooling elements 121. The heating elements 121 are used to heat the corresponding area of ​​the temperature-controlled object, and the cooling elements 121 are used to cool the corresponding area of ​​the temperature-controlled object. Those skilled in the art can adjust the number and arrangement of the heating elements 121 and the cooling elements 121 in the temperature control layer 120 according to the actual application scenario.

[0048] In some embodiments, the heating element 120 is formed by bending a heat-conducting wire, and the shape of the heating element 121 can be rectangular, circular, or other regular or irregular shapes. Those skilled in the art can design it according to specific application scenarios.

[0049] In some embodiments, the material of the heating element 121 includes at least one selected from tungsten, molybdenum, platinum, molybdenum disilicide (MoSi2), tungsten disilicide (WSi2), tungsten carbide (WC), and molybdenum carbide (MoC). Specifically, the heating element 121 can be made by bending or etching a linear material composed of the above components, or it can be formed by printing and sintering a paste containing the above materials. The above-mentioned materials have stable chemical properties. The heating element 121 made of the above materials has a stable temperature coefficient of resistance. It can be heated by a given voltage, and the resistance value of the heating element 121 can be measured by collecting real-time current. The real-time temperature of the heating element can be calculated based on the temperature coefficient of resistance, thus solving the problem of multi-zone heating temperature measurement of the temperature-controlled object.

[0050] The following description uses the temperature control element 121 as an example of a heating element 121 to further illustrate the embodiments of this application.

[0051] In this embodiment of the application, the temperature control device 100 further includes a control module, which is electrically connected to the heating element 121 and is used to control the working state of the heating element 121.

[0052] More specifically, each of the heating elements 121 is provided with a pair of leads at its end, and each pair of leads includes a positive lead and a negative lead. Each of the heating elements 121 is electrically connected to the control module through each pair of leads at its end.

[0053] Please see Figure 3 , Figure 4 and Figure 5 In some embodiments, the control module includes a circuit board 140, which is disposed on the side of the bottom layer 111 facing away from the temperature control layer 120. The leads at the ends of each heating element 121 can be soldered to the circuit board 140 by means of soft soldering. The lines on the circuit board 140 correspond to the lines of each heating element 121 in the temperature control layer 120.

[0054] In the above embodiment, the bottom layer 111 has multiple pairs of through holes 1111 for the lead wires 122 to pass through, and a pair of through holes 1111 corresponds to a pair of lead wires 122.

[0055] In the above embodiments, the end of the lead wire 122 away from the temperature control layer 120 can be flush with the side of the bottom layer 111 facing away from the temperature control layer 120, or it can protrude slightly from the side of the bottom layer 111 facing away from the temperature control layer 120.

[0056] In a preferred embodiment, the end of the lead 122 away from the temperature control layer 120 protrudes from the side of the bottom layer 111 facing away from the temperature control layer 120. The length of the lead 122 extending from the through hole 1111 facing away from the temperature control layer 120 is 1mm to 3mm, specifically 1mm, 1.5mm, 2mm, 2.5mm, 3mm, or any value between them. Within this length range, it is convenient to solder the lead 122 to the circuit board 140, which helps to reduce costs and avoids the subsequent storage problems caused by the lead 122 being too long.

[0057] In other embodiments, the control module is a multi-channel controller, and the lead 122 at the end of each of the heating elements 121 is connected to the multi-channel controller, so that the working state of each heating element 121 in the temperature control layer 1200 can be independently controlled by the multi-channel controller.

[0058] In this embodiment of the application, the top layer 112 and the bottom layer 111 can be integrally formed or separately formed. When the top layer 112 and the bottom layer 111 are integrally formed, a cavity is formed between the top layer 112 and the bottom layer 111, and the temperature control layer 120 is embedded in the cavity.

[0059] To facilitate the assembly of the temperature control layer 120, in some embodiments, the top layer 112 and the bottom layer 111 are formed separately. During the assembly process, each heating element 121 can be installed on the preset installation area of ​​the bottom layer 111 according to a preset arrangement order, so that the temperature control layer 120 is formed on the bottom layer 111, and then the top layer 112 and the bottom layer 111 are assembled.

[0060] Please see Figures 6-9 In this embodiment, the top layer 112 and the bottom layer 111 can be rectangular, circular, ring-shaped, pentagonal, hexagonal or other regular / irregular shapes. Those skilled in the art can design them according to specific application scenarios, and this embodiment does not impose any special limitations on them.

[0061] Correspondingly, the shape of the temperature control layer 120 can also be set as rectangular, circular, ring, pentagonal, hexagonal or other regular or irregular shapes. That is, each heating element 121 in the temperature control layer 120 can be arranged in rectangular, circular, ring, pentagonal, hexagonal or other regular / irregular shapes. Those skilled in the art can design it according to specific application scenarios.

[0062] In this embodiment, the top layer 112 is made of an insulating material with strong thermal conductivity and high strength, such as silicon nitride, aluminum nitride, boron nitride, and other ceramic materials. Of course, those skilled in the art can also choose other insulating materials with strong thermal conductivity and high strength, and this embodiment does not make any special limitation on this.

[0063] In some embodiments, the thermal conductivity of the ceramic substrate 110 is 60 W / m·K to 500 W / m·K, specifically 60 W / m·K, 100 W / m·K, 200 W / m·K, 300 W / m·K, 400 W / m·K, 500 W / m·K, or any value between them. Within this thermal conductivity range, it is beneficial to quickly conduct the heat generated by the heating element 121 in the temperature control layer 120 to the temperature-controlled object on the top layer 112, thereby improving the heating efficiency of the temperature control device 100.

[0064] In some embodiments, the fracture toughness of the ceramic matrix 110 is 3 MPa·m. 1 / 2 ~10 MPa·m 1 / 2 Specifically, it can be 3 MPa·m 1 / 2 4 MPa·m 1 / 2 5 MPa·m 1 / 2 6 MPa·m 1 / 2 7 MPa·m 1 / 2 8 MPa·m 1 / 2 9 MPa·m 1 / 2 10 MPa·m 1 / 2 Or any value between them. Within the aforementioned toughness range, it can be ensured that the strength of the top layer 112 and the bottom layer 111 meets the application requirements.

[0065] In the above embodiments, the fracture toughness of the bottom layer 121 and the top layer 122 may be the same or different, but the fracture toughness values ​​of both are within 3 MPa·m. 1 / 2 ~10 MPa·m 1 / 2 .

[0066] In the above embodiments, the material of the bottom layer 111 may be the same as or different from that of the top layer 112. Those skilled in the art can make adjustments according to the actual situation, and this application embodiment does not make any special limitation in this regard.

[0067] Based on the above embodiments, in some embodiments, the temperature control layer 120 is composed of multiple heating elements 121 arranged on the same plane, and the thickness of the temperature control layer 120 is the same as the thickness of the heating elements 121. The plane in which the multiple heating elements 121 in the temperature control layer 120 are arranged is referred to as the first plane. When the heating element 121 is formed by bending a heat-conducting wire on the first plane, the diameter of the heat-conducting wire is the same as the thickness of the temperature control layer 120. In this case, the greater the thickness of the temperature control layer 120, the larger the diameter of the heat-conducting wire, the smaller the resistance of the heating element 121, and the stronger the heating capacity of the heating element 121 under constant voltage.

[0068] In some embodiments, the thickness of the temperature control layer 120 is 0.005 mm to 1 mm, specifically 0.005 mm, 0.01 mm, 0.05 mm, 0.1 mm, 0.5 mm, 1 mm, or any value between them. In this embodiment, the thickness of each temperature control layer 120 may be the same or different.

[0069] In some embodiments, the thickness of the top layer 112 is 0.5mm to 2mm, specifically 0.5mm, 1mm, 1.5mm, 2mm, or any value between them. When the top layer 112 is within the above thickness range, it can ensure that the heating element 121 in the temperature control layer 120 can quickly transfer heat to the temperature-controlled object through the top layer 112 while taking into account the strength performance of the top layer 112.

[0070] In some embodiments, the thickness of the bottom layer 111 is 0.5 mm to 2 mm, specifically 0.5 mm, 1 mm, 1.5 mm, 2 mm, or any value between them. Within the above thickness range, the material cost of the temperature control device 100 can be reduced as much as possible while taking into account the strength performance of the bottom layer 111.

[0071] Please see Figure 2 In some embodiments, there are multiple temperature control layers 120, which are stacked sequentially from the bottom layer 111 to the top layer 112. Compared to setting only a single temperature control layer 120, setting multiple temperature control layers 120 can improve the temperature regulation accuracy of the temperature control device 100 and make it easier to control the temperature difference in different areas of the temperature-controlled object.

[0072] In the above embodiments, the heating elements 121 in the multiple temperature control layers 120 are arranged one-to-one, and the working state of the heating element 121 in each temperature control layer 120 can be controlled independently.

[0073] In the above embodiments, multiple temperature control layers 120 are arranged at intervals to avoid mutual interference between the heating elements 121 of different temperature control layers 120.

[0074] Please continue reading. Figure 2 In some embodiments, an insulating layer 130 is provided between two adjacent temperature control layers 120. By providing an insulating layer 130 between adjacent temperature control layers 120, mutual interference between the heating elements 121 of different temperature control layers 120 can be effectively avoided.

[0075] In the above embodiment, the insulating layer 130 is also provided with a through hole 1111 so that the lead wire 122 connected to the end of the heating element 121 in the temperature control layer on the side of the insulating layer 130 facing away from the bottom layer 111 can pass through.

[0076] Similarly, multiple heating elements 121 on the same temperature control layer 120 are arranged at intervals to avoid mutual interference between the heating elements 121.

[0077] In some embodiments, the distance between two adjacent heating elements 121 on the same temperature control layer 120 is 0.1mm to 1mm, specifically 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, or any value between them. Within the above-mentioned distance range, it is convenient to separate the heating elements 121 on the same temperature control layer 120 from each other, and to minimize the gap between the heating areas corresponding to adjacent heating elements 121, thereby allowing all areas of the temperature-controlled object (which is placed at a preset placement position on the top layer 112) to be heated simultaneously.

[0078] In the embodiments of this application, the size of each heating element 121 may be the same or different. Those skilled in the art can design according to specific application scenarios, and this application does not make any special limitations in this regard.

[0079] Understandably, the area and shape of each heating zone of the temperature control object targeted by the temperature control device 100 are consistent with the area and shape of the corresponding heating element 121.

[0080] In some embodiments, the area of ​​the heating element 121 facing the top layer 112 is 1 mm. 2 ~100mm 2 Specifically, it can be 1mm. 2 10mm 2 20mm 2 30mm 2 40mm 2 50mm 2 60mm 2 70mm 2 80mm 2 90mm 2 100mm 2Or any value between them. In the embodiments of this application, the areas of each heating element 121 in the same temperature control layer 120 facing the top layer 112 can be the same or different.

[0081] In one specific embodiment, the heating element 121 is rectangular or circular, and its length or diameter is 1mm to 10mm, specifically any value between 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, and 10mm. In this embodiment, the shapes of the heating elements 121 in the same temperature control layer 120 can be the same or different.

[0082] The temperature control device 100 provided in this application embodiment can be applied to the field of semiconductor chip packaging and testing, such as chip welding, simulation testing, aging testing and other scenarios. It can meet the needs of selective heating of multiple areas of the chip and meet the different heating temperature requirements of different areas of the chip. It has high reliability, high heating efficiency, temperature measurement capability and low cost, and is suitable for mass production.

[0083] It should be noted that the temperature control device 100 provided in this application embodiment can also be applied to other working scenarios that require heating, cooling, temperature measurement, etc., besides the field of semiconductor chip packaging and testing. This application does not make any special limitations on this.

[0084] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A temperature control device, characterized in that, include: The ceramic substrate includes a bottom layer and a top layer; A temperature control layer is disposed between the bottom layer and the top layer. The temperature control layer contains multiple temperature control elements, each of which corresponds to a different area of ​​the top layer. The operating state of each temperature control element can be controlled independently.

2. The temperature control device as described in claim 1, characterized in that, The number of temperature control layers is multiple, and the multiple temperature control layers are stacked sequentially from the bottom layer to the top layer.

3. The temperature control device as described in claim 2, characterized in that, An insulating layer is provided between two adjacent temperature control layers.

4. The temperature control device as described in claim 2, characterized in that, The area of ​​the temperature control element facing the top layer is 1 mm². 2 ~100mm 2 ; and / or, The spacing between two adjacent temperature control elements on the same temperature control layer is 0.1 mm to 1 mm.

5. The temperature control device as described in claim 1, characterized in that, The thickness of the temperature control layer is 0.005mm to 1mm; and / or, The thickness of the top layer is 0.5mm to 2mm; and / or, The thickness of the bottom layer is 0.5mm to 2mm.

6. The temperature control device as described in claim 1, characterized in that, The ceramic matrix has a thermal conductivity of 60 W / m·K to 500 W / m·K, and a fracture toughness of 3 MPa·m. 1 / 2 ~10 MPa·m 1 / 2 .

7. The temperature control device as described in claim 1, characterized in that, The ceramic matrix material includes at least one of silicon nitride, aluminum nitride, boron nitride, and boron carbide; and / or, At least a portion of the temperature control element is a heating element, and the material of the heating element includes at least one of tungsten, molybdenum, platinum, molybdenum disilicide, tungsten disilicide, tungsten carbide, and molybdenum carbide.

8. The temperature control device as described in claim 1, characterized in that, At least a portion of the temperature control element is a heating element, and each end of the heating element is provided with a pair of leads. The bottom layer has multiple pairs of through holes for the leads to pass through, and a pair of through holes corresponds to a pair of leads.

9. The temperature control device as described in claim 8, characterized in that, The length of the lead wire extending from the through hole to the side facing away from the temperature control layer is 1mm to 3mm.

10. The temperature control device according to any one of claims 1-9, characterized in that, The temperature control device further includes a control module, which is electrically connected to the temperature regulating element and is used to control the working state of the temperature regulating element.

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